Heat dissipation module and display equipment

Abstract

The invention discloses a heat dissipation module and display equipment, the heat dissipation module comprises a plurality of radiators, a plurality of heat conduction pipes, a heat dissipation main body and a first support, a first cavity is formed in the heat dissipation main body, a second cavity is formed in each heat conduction pipe, and a valve is arranged at the joint of the heat dissipation main body and each heat conduction pipe; the first cavity and the second cavity are communicated or disconnected through a valve; the first cavity is filled with cooling liquid; a controller is arranged in the heat dissipation main body, a sensor is arranged in each heat conduction pipe, the sensors are electrically connected with the controller, the controller is electrically connected with each valve, and when the sensors detect that the heat conduction pipes reach a first preset state, the controller controls the valves in the corresponding heat conduction pipes to be opened; and when the sensor detects that the heat conduction pipe reaches a second preset state, the controller controls the valve in the corresponding heat conduction pipe to be closed. In this way, targeted cooling is formed on the local high-temperature area of the heat dissipation module, so that the heat dissipation stability of the heat dissipation module is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of display devices, and in particular to a heat dissipation module and a display device. Background Art

[0002] Current display devices usually use a cooling module that combines a fan with an aluminum fin welded heat sink for heat dissipation, and the heat dissipation capacity of the cooling module often depends on the heat dissipation performance of the cooling module itself.

[0003] In the process of the heat dissipation module actually dissipating heat for the display device, the temperature of each part of the heat dissipation module is not balanced. Local high temperature may appear in some positions of the heat dissipation module, and the local high temperature position will reduce the overall heat dissipation performance of the heat dissipation module, directly affecting the heat dissipation effect of the heat dissipation module on the display device. If the entire heat dissipation module is cooled, the position with low temperature will also be cooled, resulting in energy waste, cost increase and other problems.

[0004] Therefore, how to achieve targeted cooling of the local high temperature area of ​​the heat dissipation module to ensure the heat dissipation stability of the heat dissipation module and improve the overall heat dissipation performance of the heat dissipation module has become an urgent problem to be solved in this field. Summary of the invention

[0005] The present application discloses a heat dissipation module and a display device, the purpose of which is to provide targeted cooling for a local high-temperature area of ​​the heat dissipation module, so as to ensure the heat dissipation stability of the heat dissipation module and improve the overall heat dissipation performance of the heat dissipation module.

[0006] The present application discloses a heat dissipation module, which includes a plurality of heat sinks, a plurality of heat-conducting pipes, a heat dissipation body and a first bracket, wherein the first bracket is used to connect with an electronic component, and at least one of the heat-conducting pipes is connected between the first bracket and the heat dissipation body; at least one of the heat sinks is arranged on a side adjacent to a connection side between the heat dissipation body and the first bracket; at least one of the heat-conducting pipes is connected between the heat dissipation body and the heat dissipation body; a first cavity is formed inside the heat dissipation body, a second cavity is formed inside the heat-conducting pipe, a valve is arranged at the connection between the heat dissipation body and the heat-conducting pipe, and the first cavity The first cavity and the second cavity are connected or disconnected by the valve; the first cavity is filled with coolant; a controller is arranged in the heat dissipation body, and a sensor is arranged in each of the heat-conducting tubes, the sensor is electrically connected to the controller, and the controller is electrically connected to each of the valves respectively, and the sensor is used to detect the state in each of the heat-conducting tubes respectively; when the sensor detects that the heat-conducting tube reaches a first preset state, the controller controls the valve in the corresponding heat-conducting tube to open; when the sensor detects that the heat-conducting tube reaches a second preset state, the controller controls the valve in the corresponding heat-conducting tube to close.

[0007] Optionally, the sensor includes a temperature sensor, the first preset state includes a first preset temperature, the second preset state includes a second preset temperature, and the first preset temperature is greater than the second preset temperature; the controller includes an electromagnetic controller, and the valve includes an electromagnetic valve. When the temperature sensor detects that the temperature of the heat pipe reaches the first preset temperature, the temperature sensor feeds back a detection signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnetic valve to open; when the temperature sensor detects that the temperature of the heat pipe reaches the second preset temperature, the temperature sensor feeds back a detection signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnetic valve to close.

[0008] Optionally, the sensor includes an air pressure sensor, the first preset state includes a first preset pressure, the second preset state includes a second preset pressure, and the first preset pressure is greater than the second preset pressure; the controller includes an electromagnetic controller, and the valve includes an electromagnetic valve. When the air pressure sensor detects that the pressure in the heat pipe reaches the first preset pressure, the air pressure sensor feeds back the detection signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnetic valve to open; when the air pressure sensor detects that the air pressure in the heat pipe reaches the second preset pressure, the air pressure sensor feeds back the detection signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnetic valve to close.

[0009] Optionally, a liquid level detector is also provided on the inner wall of the heat conduction tube, and the liquid level detector is connected to the controller. When the liquid level detector detects that the liquid level of the coolant in the heat conduction tube is equal to two-thirds of the diameter of the heat conduction tube, the controller controls the valve to close.

[0010] Optionally, a flow guide tube is further provided between each of the heat conduction tubes and the heat dissipation body, one end of the flow guide tube is connected to the upper part of the first cavity, and the other end is connected to the upper part of the second cavity, and a condenser is provided in the flow guide tube.

[0011] Optionally, the heat dissipation body is of an elongated shape, and the heat-conducting pipe includes a first heat-conducting pipe and a second heat-conducting pipe, one end of the first heat-conducting pipe is connected to the first bracket, and the other end is connected to a side of the heat dissipation body close to the first bracket, and the extension direction of the first heat-conducting pipe is the same as the extension direction of the heat dissipation body; the second heat-conducting pipe is perpendicular to the heat dissipation body in the horizontal direction, one end of the second heat-conducting pipe is connected to the radiator, and the other end is connected to the heat dissipation body; the diameter of the first heat-conducting pipe is larger than the diameter of the second heat-conducting pipe.

[0012] Optionally, the diameter of the first heat-conducting pipe ranges from 6 mm to 10 mm, and the diameter of the second heat-conducting pipe ranges from 4 mm to 8 mm.

[0013] Optionally, the radiator further includes a first radiator and a second radiator, the first radiator and the second radiator are respectively arranged on two sides adjacent to a connection side of the first bracket and the first heat pipe, the heat pipe includes a third heat pipe, the third heat pipe includes a first end, a second end and a heat pipe body, the first end and the second end are respectively located on two sides of the heat pipe body; the first end is connected to the first radiator, the second end is connected to the second radiator, the heat pipe body is connected to the top of the first bracket, the middle part of the heat pipe body is connected to the first heat pipe, the valve is provided at the connection between the heat pipe body and the first heat pipe, the sensor is provided in the middle part of the heat pipe body, and when the sensor detects that the heat pipe body reaches the first preset state, the controller controls the valve between the first heat pipe and the heat pipe body to open.

[0014] Optionally, outer surfaces of the first heat-conducting pipe, the second heat-conducting pipe, the third heat-conducting pipe and the heat dissipation body are all wrapped with a waterproof layer.

[0015] The present application also discloses a display device, including a housing and a display panel, wherein the display panel is connected to the housing, and the display device also includes the above-mentioned heat dissipation module, wherein the heat dissipation module is arranged in the housing.

[0016] The present application has made improvements to the heat dissipation module, connecting the first bracket and the heat dissipation body through a heat pipe. When the heat generated during the operation of the electronic component is transferred to the first bracket, the first bracket will transfer the heat to the heat dissipation body through the heat pipe, and use the heat dissipation body as the heat conduction center to quickly take the heat away from the heat source, avoiding the accumulation of heat near the electronic component, resulting in the occurrence of excessive temperature of the electronic component; at the same time, the heat dissipation body will disperse the heat and transfer it to the radiator through the heat pipe, and use the radiator to dissipate the heat to the external environment; and when the heat dissipation module is in the continuous operation, the temperature of the corresponding heat pipe will rise, and the sensor will detect that one or more When the state of each heat pipe reaches the first preset state, the sensor feeds back a signal to the controller in the heat dissipation body, and the controller receives the feedback signal from the sensor and controls the valve at the connection between the heat dissipation body and the corresponding heat pipe to open; at this time, the coolant in the heat dissipation body will flow into the corresponding heat pipe, and the coolant will continue to absorb heat, effectively reducing the temperature of the corresponding heat pipe. When the heat pipe reaches the second preset state, the temperature of the corresponding local position will also drop accordingly, and the valve is closed to allow the coolant to maintain stable heat dissipation in the heat pipe, thereby forming targeted heat dissipation of the local position of the heat dissipation module to ensure the overall heat dissipation stability of the heat dissipation module and improve the overall heat dissipation performance of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0018] Figure 1 A schematic diagram of a first embodiment of the heat dissipation module of the present application;

[0019] Figure 2 This is a schematic diagram of the connection between the heat dissipation body and the heat pipe in the first embodiment of the heat dissipation module of the present application;

[0020] Figure 3 This is a schematic diagram of the connection between the heat dissipation body and the heat pipe in the second embodiment of the heat dissipation module of the present application;

[0021] Figure 4 A schematic diagram of a third embodiment of the heat dissipation module of the present application;

[0022] Figure 5 A schematic diagram of a fourth embodiment of the heat dissipation module of the present application;

[0023] Figure 6A schematic diagram of a fifth embodiment of the heat dissipation module of the present application;

[0024] Figure 7 A schematic diagram of a sixth embodiment of the heat dissipation module of the present application;

[0025] Figure 8 A schematic diagram of a seventh embodiment of the heat dissipation module of the present application;

[0026] Fig. 9 A schematic diagram of an eighth embodiment of the heat dissipation module of the present application;

[0027] Fig.10 It is a schematic diagram of an embodiment of a display device of the present application.

[0028] Among them, 10, display device; 100, heat dissipation module; 200, housing; 300, electronic component; 110, radiator; 111, heat dissipation fins; 112, fin holes; 113, first radiator; 114, second radiator; 120, heat pipe; 121, first heat pipe; 122, second heat pipe; 123, third heat pipe; 124, first end; 125, second end; 126, heat pipe body; 130, heat dissipation body; 1 31. controller; 132. electromagnetic controller; 140. first bracket; 150. first cavity; 151. coolant; 152. valve; 153. temperature sensor; 154. liquid level detector; 155. condenser; 156. electromagnetic valve; 160. heat sink; 161. opening; 170. waterproof layer; 180. sensor; 181. air pressure sensor; 190. second cavity; 400. display panel; 500. flow guide tube. DETAILED DESCRIPTION

[0029] The present application is described in detail below with reference to the accompanying drawings and optional embodiments. It should be noted that, under the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0030] Figure 1 is a schematic diagram of a first embodiment of the heat dissipation module of the present application, Figure 2 This is a schematic diagram of the connection between the heat dissipation body and the heat pipe in the first embodiment of the heat dissipation module of the present application; Figure 1 and Figure 2As shown, the present application discloses a heat dissipation module 100, which includes a plurality of heat sinks 110, a plurality of heat pipes 120, a heat dissipation body 130 and a first bracket 140. The first bracket 140 is used to connect with the electronic component 300, and at least one heat pipe 120 is connected between the first bracket 140 and the heat dissipation body 130; at least one heat sink 110 is arranged on a side adjacent to the connection side of the heat dissipation body 130 and the first bracket 140; at least one heat pipe 120 is connected between the heat dissipation body 130 and the heat dissipation body 110; a first cavity 150 is formed inside the heat dissipation body 130, a second cavity 190 is formed inside the heat pipe 120, and a connection between the heat dissipation body 130 and the heat pipe 120 is provided. A valve 152 is provided, and the first cavity 150 and the second cavity 190 are connected or disconnected through the valve 152; the first cavity 150 is filled with coolant 151; a controller 131 is provided in the heat dissipation body 130, and a sensor 180 is provided in each heat pipe 120, the sensor 180 is electrically connected to the controller 131, and the controller 131 is electrically connected to each valve 152 respectively, and the sensor 180 is used to detect the state in each heat pipe 120 respectively; when the sensor 180 detects that the heat pipe 120 reaches a first preset state, the controller 131 controls the corresponding valve 152 to open; when the sensor 180 detects that the heat pipe 120 reaches a second preset state, the controller 131 controls the corresponding valve 152 to close.

[0031] The present application makes improvements to the heat dissipation module 100, and connects the first bracket 140 and the heat dissipation body 130 through the heat pipe 120. When the heat generated during the operation of the electronic component 300 is transferred to the first bracket 140, the first bracket 140 will transfer the heat to the heat dissipation body 130 through the heat pipe 120, and use the heat dissipation body 130 as the heat conduction center to quickly take the heat away from the heat source, so as to avoid the accumulation of heat near the electronic component 300, resulting in the occurrence of excessive temperature of the electronic component 300; at the same time, the heat dissipation body 130 will disperse the heat and transfer it to the radiator 110 through the heat pipe 120, and use the radiator 110 to dissipate the heat to the external environment; and when the heat dissipation module 100 has a local high temperature during continuous operation, the temperature of the corresponding heat pipe 120 will rise, and the sensor 180 detects that one or several heat conduction pipes 120 are hot. When the state of the tube 120 reaches the first preset state, the sensor 180 feeds back a signal to the controller 131 in the heat dissipation body 130. The controller 131 receives the feedback signal from the sensor 180 and controls the valve 152 at the connection between the heat dissipation body 130 and the corresponding heat conduction pipe 120 to open; at this time, the coolant 151 in the heat dissipation body 130 will flow into the corresponding heat conduction pipe 120, and the coolant 151 will continue to absorb heat, effectively reducing the temperature of the corresponding heat conduction pipe 120. When the heat conduction pipe 120 reaches the second preset state, the temperature of the corresponding local position will also decrease accordingly. The valve 152 is closed so that the coolant 151 maintains stable heat dissipation in the heat conduction pipe 120, thereby forming targeted heat dissipation of the local position of the heat dissipation module 100, so as to ensure the overall heat dissipation stability of the heat dissipation module 100 and improve the overall heat dissipation performance of the heat dissipation module 100.

[0032] It should be noted that, since the temperature change in the heat pipe 120 can be reflected in a direct temperature increase or decrease, it can also be reflected in an increase or decrease in the air pressure in the heat pipe 120. For example, when the temperature increases, the air pressure in the heat pipe 120 increases, and when the temperature decreases, the air pressure in the heat pipe 120 decreases; therefore, when detecting the temperature change in the heat pipe 120, the first preset state of the heat pipe 120 in the present application may be a first preset temperature, and the second preset state may be a second preset temperature, wherein the first preset temperature range may be between 50 degrees Celsius and 60 degrees Celsius; and when detecting the air pressure change in the heat pipe 120, the first preset state of the heat pipe 120 in the present application may be a first preset pressure, and the second preset state may be a second preset pressure, and the first preset pressure is greater than the second preset pressure.

[0033] Specifically, when the detection state is the temperature change of the heat pipe 120, the sensor 180 includes a temperature sensor 153, the first preset state includes a first preset temperature, the second preset state includes a second preset temperature, and the first preset temperature is greater than the second preset temperature; the controller 131 includes an electromagnetic controller 132, and the valve 152 includes an electromagnetic valve 156. When the temperature sensor 153 detects that the temperature of the heat pipe 120 reaches the first preset temperature, the temperature sensor 153 feeds back the detection signal to the electromagnetic controller 132, and the electromagnetic controller 132 controls the electromagnetic valve 156 to open; when the temperature sensor 153 detects that the temperature of the heat pipe 120 reaches the second preset temperature, the temperature sensor 153 feeds back the detection signal to the electromagnetic controller 132, and the electromagnetic controller 132 controls the electromagnetic valve 156 to close.

[0034] When the heat dissipation module 100 is in continuous operation and a high temperature occurs locally, the temperature of the corresponding heat pipe 120 will rise. When the temperature sensor 153 detects that the temperature of one or several heat pipes 120 reaches the first preset temperature, the temperature sensor 153 feeds back a signal to the electromagnetic controller 132 in the heat dissipation body 130. The electromagnetic controller 132 receives the feedback signal from the temperature sensor 153 and controls the electromagnetic valve 156 at the connection between the heat dissipation body 130 and the corresponding heat pipe 120 to open. At this time, the coolant 151 in the heat dissipation body 130 will flow into the corresponding heat pipe 120. 0, the coolant 151 continues to absorb heat to effectively reduce the temperature of the corresponding heat pipe 120. When the temperature sensor 153 detects that the temperature in the heat pipe 120 reaches the second preset temperature, the temperature sensor 153 feeds back the detection signal to the electromagnetic controller 132, and the electromagnetic controller 132 controls the electromagnetic valve 156 to close, so that the coolant 151 maintains stable heat dissipation in the heat pipe 120, thereby forming targeted heat dissipation for a local position of the heat dissipation module 100, so as to ensure the overall heat dissipation stability of the heat dissipation module 100 and improve the overall heat dissipation performance of the heat dissipation module 100.

[0035] In addition, when the detection state is the change of the air pressure inside the heat pipe 120, the sensor 180 includes an air pressure sensor 181, the first preset state includes a first preset pressure, the second preset state includes a second preset pressure, and the first preset pressure is greater than the second preset pressure; the controller 110 includes an electromagnetic controller 132, and the valve 152 includes an electromagnetic valve 156. When the air pressure sensor 181 detects that the pressure inside the heat pipe 120 reaches the first preset pressure, the air pressure sensor 181 feeds back the detection signal to the electromagnetic controller 132, and the electromagnetic controller 132 controls the electromagnetic valve 156 to open; when the air pressure sensor 181 detects that the air pressure inside the heat pipe 120 reaches the second preset pressure, the air pressure sensor 181 feeds back the detection signal to the electromagnetic controller 132, and the electromagnetic controller 132 controls the electromagnetic valve 156 to close.

[0036] When the heat dissipation module 100 locally experiences high temperature during continuous operation, the temperature of the corresponding heat pipe 120 will rise, and the air pressure in the heat pipe 120 will rise accordingly. When the air pressure sensor 181 detects that the air pressure in one or several heat pipes 120 reaches the first preset pressure, the air pressure sensor 181 feeds back a signal to the electromagnetic controller 132 in the heat dissipation body 130. The electromagnetic controller 132 receives the feedback signal from the air pressure sensor 181 and controls the electromagnetic valve 156 at the connection between the heat dissipation body 130 and the corresponding heat pipe 120 to open; at this time, the coolant 151 in the heat dissipation body 130 will flow into In the corresponding heat pipe 120, the coolant 151 continues to absorb heat, effectively reducing the temperature of the corresponding heat pipe 120. When the air pressure sensor 181 detects that the pressure in the heat pipe 120 reaches the second preset pressure, the air pressure sensor 181 feeds back the detection signal to the electromagnetic controller 132, and the electromagnetic controller 132 controls the electromagnetic valve 156 to close, so that the coolant 151 maintains stable heat dissipation in the heat pipe 120, thereby forming targeted heat dissipation of the local position of the heat dissipation module 100, so as to ensure the overall heat dissipation stability of the heat dissipation module 100 and improve the overall heat dissipation performance of the heat dissipation module 100.

[0037] Of course, the valve 152 and the controller 131 in the present application may also be other types of valves or controllers, as long as the controller 131 can be used to control the valve 152 to open or close after obtaining the detection signal. The present application only takes the valve 152 as an electromagnetic valve 156 and the controller 131 as an electromagnetic controller 132 as an example.

[0038] In addition, in order to prevent the heat dissipation body 130 from excessively delivering the cooling liquid 151 to the heat pipe 120 when the heat pipe 120 reaches the first preset temperature, resulting in excessive weight in the heat pipe 120, affecting the weight balance of the heat dissipation module 100; at the same time, in order to ensure that the cooling liquid 151 has enough space in the heat pipe 120 to absorb heat and vaporize, and to ensure that the air pressure in the heat pipe 120 is stable, the present application also improves the heat pipe 120:

[0039] Figure 3 FIG. 1 is a schematic diagram of a second embodiment of the heat dissipation module of the present application in which the heat dissipation body is connected to the heat pipe. Figure 3 As shown, Figure 3 The illustrated embodiment is based on Figure 1 In the improvement, a liquid level detector 154 is further provided on the inner wall of the heat pipe 120, and the liquid level detector 154 is connected to the controller 131. When the liquid level detector 154 detects that the liquid level of the coolant 151 in the heat pipe 120 is equal to two-thirds of the diameter of the heat pipe 120, the controller 131 controls the valve 152 to close.

[0040] Different from the previous embodiment, in this embodiment, a liquid level detector 154 is further provided on the inner wall of the heat pipe 120. When the temperature change inside the heat pipe 120 is detected, the temperature sensor 153 is used to detect that the temperature of the heat pipe 120 reaches the first preset temperature, and the signal is fed back to the controller 131. The controller 131 controls the valve 152 to open, and the coolant 151 in the heat dissipation body 130 flows into the second cavity 190 of the heat pipe 120. The coolant 151 continues to absorb heat in the heat pipe 120 to reduce the temperature of the heat pipe 120 and the heat dissipation module 100 near the heat pipe 120, thereby forming targeted heat dissipation. When the coolant 151 of the heat dissipation body 130 continues to flow into the heat pipe 120, the heat dissipation module 100 is cooled and cooled. The liquid level of the coolant 151 in the heat pipe 120 gradually rises. When the liquid level detector 154 detects that the liquid level of the coolant 151 in the heat pipe 120 is equal to two-thirds of the diameter of the heat pipe 120, the signal of the liquid level detector 154 will be fed back to the controller 131. The controller 131 controls the valve 152 to close, so that the coolant 151 in the heat dissipation body 130 stops being transported. In this way, it can be ensured that there is enough coolant 151 in the heat pipe 120 to absorb heat and cool down, and the coolant 151 can have enough space to absorb heat and vaporize, allowing the gas to circulate; the weight of each position of the heat dissipation module 100 is effectively controlled, and the installation stability of the heat dissipation module 100 is maintained while ensuring the overall heat dissipation effect of the heat dissipation module 100.

[0041] Furthermore, in order to realize the recycling of the coolant 151 in the heat dissipation body 130 and realize the closed-loop heat dissipation cycle of the heat dissipation module 100, the present application also improves the heat dissipation module 100:

[0042] Figure 4 Schematic diagram of the third embodiment of the heat dissipation module of the present application, as shown Figure 4 As shown, Figure 4 The illustrated embodiment is based on Figure 3 In an improvement, a flow guide pipe 500 is further arranged between each heat pipe 120 and the heat dissipation body 130, one end of the flow guide pipe 500 is connected to the upper part of the first cavity 150, and the other end is connected to the upper part of the second cavity 190, and a condenser 155 is arranged in the flow guide pipe 500.

[0043] In this embodiment, a flow guide tube 500 is further provided between the heat conducting tube 120 and the heat dissipation body 130. One end of the flow guide tube 500 is communicated with the upper portion of the first cavity 150 and does not contact the coolant 151 in the first cavity 150. The other end is communicated with the upper portion of the second cavity 190 and does not contact the coolant 151 in the second cavity 190. In addition, a condenser 155 is further provided in the flow guide tube 500. When the coolant 151 in the heat conducting tube 120 continues to absorb heat, the coolant 151 will be vaporized to form a coolant Steam, the formed coolant steam is mainly concentrated in the upper part of the second cavity 190, and enters the guide tube 500 through the upper part of the second cavity 190; and when the coolant steam passes through the guide tube 500, it will be re-liquefied to form cooling droplets under the action of the condenser 155, and the formed cooling droplets will gradually converge into coolant and flow back to the heat dissipation body 130 for recovery, so as to be used for the next heat dissipation, thus forming a heat dissipation cycle of the heat dissipation module 100, so that the coolant 151 can be recycled to reduce costs.

[0044] Figure 5 Schematic diagram of a fourth embodiment of the heat dissipation module of the present application, such as Figure 5 As shown, the heat dissipation body 130 is long and strip-shaped, and the heat-conducting pipe 120 includes a first heat-conducting pipe 121 and a second heat-conducting pipe 122. One end of the first heat-conducting pipe 121 is connected to the first bracket 140, and the other end is communicated with a side of the heat dissipation body 130 close to the first bracket 140, and the extension direction of the first heat-conducting pipe 121 is the same as the extension direction of the heat dissipation body 130; the second heat-conducting pipe 122 is perpendicular to the heat dissipation body 130 in the horizontal direction, one end of the second heat-conducting pipe 122 is connected to the radiator 110, and the other end is communicated with the heat dissipation body 130; the diameter of the first heat-conducting pipe 121 is larger than the diameter of the second heat-conducting pipe 122.

[0045] When the heat generated during the operation of the electronic component 300 is transferred to the first bracket 140, the first bracket 140 will transfer the heat to the heat dissipation body 130 through the first heat pipe 121, and at the same time transfer the heat to the second heat pipe 122, and then the heat dissipation body 130 and the second heat pipe 122 are used to disperse the heat and transfer it to the radiator 110, and the radiator 110 is used to dissipate the heat to the external environment, thereby further improving the heat transfer rate in the heat dissipation module 100; and when the temperature of the electronic component 300 rises sharply in a short period of time, the conventional heat dissipation capacity of the radiator 110 reaches the upper limit, and the temperature detectors in the first heat pipe 121 and the second heat pipe 122 detect that the first heat pipe 121 and the second heat pipe 122 have reached the upper limit. The temperatures of the heat pipe 121 and the second heat pipe 122 both reach the first preset temperature, and the signals are fed back to the controller 131 in the heat dissipation body 130 respectively. The controller 131 controls the valves 152 at the connection between the first heat pipe 121 and the second heat pipe 122 and the heat dissipation body 130 to be opened at the same time, and the coolant 151 in the heat dissipation body 130 flows into the first heat pipe 121 and the second heat pipe 122 respectively, while the coolant 151 in the first heat pipe 121 and the second heat pipe 122 continues to absorb heat at the same time, effectively dissipating the heat when the heat of the display device 10 rapidly surges in a short time and the heat dissipation module 100 locally becomes high temperature, thereby improving the overall heat dissipation capacity of the heat dissipation module 100.

[0046] In addition, since the diameter of the first heat pipe 121 is relatively large, the first heat pipe 121 can accommodate more coolant 151; when the temperature of the electronic component 300 rises sharply in a short period of time, the coolant 151 in the first heat pipe 121 continues to absorb heat. When the coolant 151 absorbs heat and reaches a certain temperature, more coolant 151 is vaporized into coolant steam, further taking away heat, effectively reducing the thermal load and heat dissipation pressure of the first heat pipe 121. When the heat generated by the electronic component 300 in a short period of time is transferred to the heat dissipation body 130, the combination of heat pipes 120 of different specifications can be used to adapt to the module structure with different heat dissipation requirements in the heat dissipation module 100, so as to achieve the overall heat dissipation uniformity of the heat dissipation module 100 and improve the overall heat dissipation efficiency of the heat dissipation module 100.

[0047] Since the heat pipe 120 is a key component that affects heat transfer, the thicker and more numerous the heat pipe 120 is, the better the heat transfer and heat dissipation effect will be. As the heat transfer center, the heat dissipation body 130 has relatively concentrated heat and relatively large heat dissipation requirements. The radiator 110 mainly dissipates heat through the heat dissipation fins 111, and the heat pipe 120 is mainly used to transfer heat between the heat dissipation body 130 and the radiator 110; therefore, two different specifications of heat pipe 120 designs are used in this embodiment:

[0048] The diameter of the first heat conducting pipe 121 is in a range of 6 mm to 10 mm, and the diameter of the second heat conducting pipe 122 is in a range of 4 mm to 8 mm.

[0049] The first heat conducting pipe 121 with a larger diameter is connected between the first bracket 140 and the heat dissipation body 130 , and the second heat conducting pipe 122 with a smaller diameter is connected between the heat dissipation body 130 and the radiator 110 .

[0050] Specifically, two first heat pipes 121 with a diameter of 8 mm can be used to connect between the first bracket 140 and the heat dissipation body 130. When the heat generated by the electronic component 300 is transferred to the first bracket 140, the first heat pipe 121 can quickly transfer the heat of the first bracket 140 to the heat dissipation body 130, so that the heat can quickly move away from the heat source to avoid accumulation near the electronic component 300 to form a high temperature. Then, multiple second heat pipes 122 with a diameter of 6 mm are evenly arranged on the heat dissipation body 130 and connected to the radiator 110. The heat on the heat dissipation body 130 is evenly transferred to the radiator 110 through the multiple second heat pipes 122, and finally dissipated to the external environment through the radiator 110.

[0051] Figure 6 Schematic diagram of the fifth embodiment of the heat dissipation module of the present application, as shown Figure 6 As shown, the radiator 110 includes a plurality of cooling fins 111, the plurality of cooling fins 111 are arranged at intervals, each cooling fin 111 is provided with a fin hole 112, and the fin holes 112 on two adjacent cooling fins 111 are arranged opposite to each other; the second heat pipe 122 passes through the plurality of fin holes 112 in sequence and is connected to the plurality of cooling fins 111.

[0052] In this embodiment, the second heat pipe 122 is used to pass through the fin holes 112 on the multiple heat dissipation fins 111 in sequence, so that the second heat pipe 122 is connected to the multiple heat dissipation fins 111, and is in direct contact with the heat dissipation fins 111 in the heat dissipation module 100 that mainly play a heat dissipation effect. When the second heat pipe 122 conducts the heat on the heat dissipation body 130 to the radiator 110, the heat of the second heat pipe 122 is directly conducted to the heat dissipation fins 111, and the heat is dissipated through the heat dissipation fins 111, thereby further improving the heat dissipation effect.

[0053] In addition, since the second heat pipe 122 is in direct contact with the heat dissipation fins 111, when the heat dissipation capacity of the heat dissipation fins 111 reaches the upper limit, the temperature sensor 153 in the second heat pipe 122 can more accurately sense the temperature change of the heat dissipation fins 111. When the heat dissipation fins 111 reach the upper limit of heat dissipation and the temperature thereof rises suddenly in a short time, the temperature sensor 153 in the second heat pipe 122 detects that the temperature of the second heat pipe 122 reaches the first preset temperature, and feeds back the signal to the controller 131. The controller 131 controls the second heat pipe 122 to increase the temperature of the second heat pipe 122. When the valve 152 at the connection between the heat dissipation module 100 and the heat dissipation body 130 is opened, the coolant 151 in the heat dissipation body 130 enters the second cavity 190 of the second heat pipe 122, and continues to absorb heat to dissipate the heat from the second heat pipe 122, while also effectively dissipating the heat from the heat dissipation fins 111, thereby forming targeted heat dissipation for each radiator 110 in the heat dissipation module 100, effectively reducing the temperature of individual radiators 110 in the heat dissipation module 100 that have significantly high temperatures, thereby achieving local targeted heat dissipation of the heat dissipation module 100.

[0054] Figure 7 Schematic diagram of the sixth embodiment of the heat dissipation module of the present application, as shown Figure 7 As shown, Figure 7 The illustrated embodiment is based on Figure 6 The improvement is that a heat spreader 160 is arranged below the heat dissipation body 130, and the heat spreader 160 is connected to the bottom surface of the heat dissipation body 130; the heat spreader 160 is long and hollow inside, and the extension direction of the heat spreader 160 is the same as the extension direction of the heat dissipation body 130. The heat spreader 160 has openings 161 at both ends of the extension direction of the heat dissipation body 130; the length and width of the heat spreader 160 are the same as the length and width of the heat dissipation body 130.

[0055] The coolant 151 stored in the heat sink 130 will always be in close contact with the bottom of the heat sink 130 under the influence of gravity. Therefore, in this embodiment, a heat spreader 160 is further provided below the heat sink 130. The high thermal conductivity of the heat spreader 160 is utilized to further improve the thermal conductivity rate of the heat sink 130. Moreover, the length and width of the heat spreader 160 are the same as those of the heat sink 130. When the heat spreader 160 is installed below the heat sink 130, the heat spreader 160 forms a full-surface coverage of the heat sink 130, further improving the uniformity of thermal conductivity of the heat sink 130. The heat spreader 160 is utilized to effectively reduce the temperature of the heat sink 130, so as to further reduce The temperature of the coolant 151 inside the heat dissipation body 130 is controlled to ensure the sustainable use of the coolant 151; and, in the present embodiment, the structure of the heat spreader 160 is also improved, and the heat spreader 160 is designed to be a hollow cylindrical structure with openings 161 at both ends, so that air can circulate through the middle of the heat spreader 160, forming convection with the air at other positions of the heat spreader 160, increasing the flow rate of the air near the heat spreader 160, so that the heat near the heat spreader 160 can be quickly taken away by the air, avoiding the accumulation of heat at the heat spreader 160, effectively improving the heat dissipation efficiency of the heat spreader 160, and further improving the heat dissipation effect on the heat dissipation body 130.

[0056] Since the first bracket 140 of the present application is directly mounted above the electronic component 300, a relatively large amount of heat will be generated near the first bracket 140 when the electronic component 300 is running. In order to avoid the accumulation of heat near the first bracket 140, which may cause the temperature of the electronic component 300 to be too high, the present application further improves the heat dissipation module 100, as follows:

[0057] Figure 8 Schematic diagram of the seventh embodiment of the heat dissipation module of the present application, as shown Figure 8As shown, the radiator 110 further includes a first radiator 113 and a second radiator 114, the first radiator 113 and the second radiator 114 are respectively arranged on two sides adjacent to the connection side of the first bracket 140 and the first heat pipe 121, the heat pipe 120 further includes a third heat pipe 123, the third heat pipe 123 includes a first end 124, a second end 125 and a heat pipe body 126, the first end 124 and the second end 125 are respectively located on two sides of the heat pipe body 126; the first end 124 is connected to the first radiator 113, The second end 125 is connected to the second radiator 114, the heat pipe body 126 is connected to the top of the first bracket 140, the middle of the heat pipe body 126 is connected to the first heat pipe 121, a valve 152 is provided at the connection between the heat pipe body 126 and the first heat pipe 121, and a sensor 180 is provided in the middle of the heat pipe body 126. When the sensor 180 detects that the state of the heat pipe body 126 reaches the first preset state, the controller 131 controls the valve 152 between the first heat pipe 121 and the heat pipe body 126 to open. The sensor 180 may be a temperature sensor 153.

[0058] The present embodiment is different from the previous embodiment in that, in the present embodiment, a first radiator 113 and a second radiator 114 are further provided on both sides of the first bracket 140, and the first end 124 and the second end 125 of the third heat pipe 123 are respectively connected to the first radiator 113 and the second radiator 114 at the same time, and the heat pipe body 126 of the third heat pipe 123 is connected to the first bracket 140; when the heat generated by the electronic component 300 during operation is transferred to the first bracket 140, the first bracket 140 will transfer the heat to the first radiator 113 and the second radiator 114 at the same time through the third heat pipe 123, and the first radiator 113 and the second radiator 114 are used to dissipate the heat to the external environment, which can effectively reduce the heat near the electronic component 300, and avoid the accumulation of heat near the electronic component 300, which causes the electronic component 300 to be overheated and burnt.

[0059] Since the third heat pipe 123 is directly connected to the top of the first bracket 140 and is closer to the heat source, the temperature of the third heat pipe 123 will be higher than the temperature of other heat pipes 120 when the electronic component 300 is in normal operation. However, this does not mean that a local high temperature that can affect the overall heat dissipation effect of the heat dissipation module 100 occurs at the location of the third heat pipe 123. Therefore, when the temperature sensor 153 in the first heat pipe 121 detects that the temperature of the first heat pipe 121 reaches the first preset temperature, the temperature sensor 153 feeds back a signal to the controller 131. The controller 131 first controls the valve 152 at the connection between the first heat pipe 121 and the heat dissipation body 130 to open, so that the coolant 151 in the heat dissipation body 130 can flow into the second cavity 190 of the first heat pipe 121, and then the coolant 151 further absorbs heat in the first heat pipe 121 to reduce the temperature of the first heat pipe 121, thereby reducing the heat dissipation effect of the heat dissipation module 100. 0 is the local temperature of the position near the first heat pipe 121; and when the temperature sensor 153 in the heat pipe body 126 of the third heat pipe 123 detects that the temperature of the third heat pipe 123 is greater than the first preset temperature (for example, the first preset temperature is 60°, and the actual temperature is detected to be 80°), it means that a local high temperature has appeared near the third heat pipe 123, and the temperature has reached a level that requires cooling. Therefore, the temperature sensor 153 in the heat pipe body 126 feeds back a signal to the controller 131, and the controller 131 controls the valve 152 at the connection between the first heat pipe 121 and the heat pipe body 126 of the third heat pipe 123 to open, so that the coolant 151 of the first heat pipe 121 further flows into the third heat pipe 123, and continues to absorb heat and cool the third heat pipe 123 to reduce the temperature of the third heat pipe 123, so that a graded step-by-step flow of the coolant 151 is formed between the first heat pipe 121 and the third heat pipe 123.

[0060] That is, two gates for the circulation of the cooling liquid 151 are formed between the heat dissipation body 130, the first heat pipe 121, and the third heat pipe 123 through the valve 152. According to the different heat dissipation temperature requirements of the first heat pipe 121 and the third heat pipe 123, and the heat dissipation module 100 corresponding to the positions near the first heat pipe 121 and the third heat pipe 123, the cooling liquid 151 is transported in a graded manner to form a stepped heat dissipation between the first heat pipe 121 and the third heat pipe 123; and the cooling liquid 151 can be transported to positions in different directions of the heat dissipation module 100 through the combination of the first heat pipe 121 and the third heat pipe 123 for heat dissipation, so as to form targeted heat dissipation of the local position of the heat dissipation module 100, further improving the accuracy of the zoned heat dissipation of the heat dissipation module 100, so as to ensure the overall heat dissipation stability of the heat dissipation module 100 and improve the overall heat dissipation performance of the heat dissipation module 100.

[0061] Fig. 9 Schematic diagram of the eighth embodiment of the heat dissipation module of the present application, as shown Fig. 9 As shown, the outer surfaces of the first heat conducting pipe 121 , the second heat conducting pipe 122 , the third heat conducting pipe 123 and the heat dissipation body 130 are all wrapped with a waterproof layer 170 .

[0062] Since the first heat pipe 121, the second heat pipe 122, the third heat pipe 123 and the heat dissipation body 130 in the present application all adopt an internal hollow structure, the material selection for the hollow heat pipe 120 and the heat dissipation body 130 needs to be specifically considered based on the welding performance of the selected heat pipe 120, the density of the material (poor density will cause leakage), processing ductility and thermal conductivity, etc. Therefore, copper or aluminum can be used to make the heat pipe 120 and the heat dissipation body 130.

[0063] In addition, in order to further prevent the coolant 151 inside the heat pipe 120 and the heat dissipation body 130 from leaking out, the present application also improves the structure of the heat pipe 120 and the heat dissipation body 130, and the outer side surfaces of the first heat pipe 121, the second heat pipe 122, the third heat pipe 123 and the heat dissipation body 130 are wrapped with a waterproof layer 170. The waterproof layer 170 effectively prevents the coolant 151 inside the heat pipe 120 and the heat dissipation body 130 from leaking out, ensures the storage of the coolant 151 inside the heat pipe 120 and the heat dissipation body 130, and avoids the loss of the coolant 151, which leads to a decrease in the local targeted heat dissipation performance of the heat dissipation body 130 formed by the heat pipe 120.

[0064] Fig.10 is a schematic diagram of an embodiment of a display device of the present application, such as Fig.10 As shown, the present application also discloses a display device 10, including a housing 200 and a display panel 400, wherein the display panel 400 is connected to the housing 200, and the display device 10 also includes the above-mentioned heat dissipation module 100, which is arranged in the housing 200. The housing 200 is used to protect the heat dissipation module 100 and the display panel 400 from being easily invaded by external water vapor, and to prevent water vapor from corroding the heat dissipation module 100, resulting in a decrease in the heat dissipation performance of the heat dissipation module 100; at the same time, when the display device 10 is being carried or moved, it can also effectively prevent the heat dissipation module 100 and the display panel 400 from being collided with by the outside world, resulting in damage to the heat dissipation module 100 or the display panel 400.

[0065] It should be noted that the display device 10 in the present application can be a device with display function such as a computer, a television, etc., and can mainly include a large-size screen display device, etc. The present application does not make any specific restrictions on the type of the display device 10.

[0066] Since the temperatures of various parts of the heat dissipation module 100 in the display device 10 are actually uneven during operation, local high temperatures may occur, affecting the overall heat dissipation performance of the heat dissipation module 100 , thereby causing the display device 10 to be overheated and damaged.

[0067] In view of the above problems, the present application improves the heat dissipation module 100, connects the first bracket 140 and the heat dissipation body 130 through the heat pipe 120, and when the heat generated during the operation of the electronic component 300 is transferred to the first bracket 140, the first bracket 140 will transfer the heat to the heat dissipation body 130 through the heat pipe 120, and use the heat dissipation body 130 as the heat conduction center to quickly take the heat away from the heat source, so as to avoid the accumulation of heat near the electronic component 300, resulting in the occurrence of excessive temperature of the electronic component 300; at the same time, the heat dissipation body 130 will disperse the heat and transfer it to the radiator 110 through the heat pipe 120, and use the radiator 110 to dissipate the heat to the external environment; and when the heat dissipation module 100 has a local high temperature during continuous operation, the temperature of the corresponding heat pipe 120 will rise, and the temperature sensor 1 When it is detected that the temperature of one or several heat pipes 120 reaches the first preset temperature, the temperature sensor 153 feeds back a signal to the controller 131 in the heat dissipation body 130. The controller 131 receives the feedback signal of the temperature sensor and controls the valve 152 at the connection between the heat dissipation body 130 and the corresponding heat pipe 120 to open. At this time, the coolant 151 in the heat dissipation body 130 will flow into the corresponding heat pipe 120, and the coolant 151 will continue to absorb heat, thereby effectively reducing the temperature of the corresponding heat pipe 120. When the temperature of the heat pipe 120 drops, the temperature of the corresponding local position will also drop accordingly, thereby forming targeted heat dissipation of the local position of the heat dissipation module 100, so as to ensure the overall heat dissipation stability of the heat dissipation module 100, improve the overall heat dissipation performance of the heat dissipation module 100, and further improve the life of the display device 10.

[0068] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0069] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A heat dissipation module, characterized in that: The heat dissipation module comprises a plurality of heat sinks, a plurality of heat pipes, a heat dissipation body and a first bracket, wherein the first bracket is used to connect with the electronic component, and at least one of the heat pipes is connected between the first bracket and the heat dissipation body; at least one of the heat sinks is arranged on a side adjacent to a connection side between the heat dissipation body and the first bracket; At least one heat-conducting pipe is connected between the heat-dissipating body and the radiator; a first cavity is formed inside the heat-dissipating body, a second cavity is formed inside the heat-conducting pipe, a valve is provided at the connection between the heat-dissipating body and the heat-conducting pipe, and the first cavity and the second cavity are connected or disconnected through the valve; the first cavity is filled with coolant; A controller is provided in the heat dissipation body, and a sensor is provided in each of the heat conduction tubes. The sensor is electrically connected to the controller, and the controller is electrically connected to each of the valves respectively. The sensor is used to detect the state in each of the heat conduction tubes respectively. When the sensor detects that the heat pipe reaches a first preset state, the controller controls the corresponding valve in the heat pipe to open; when the sensor detects that the heat pipe reaches a second preset state, the controller controls the corresponding valve in the heat pipe to close.

2. The heat dissipation module according to claim 1, characterized in that: The sensor comprises a temperature sensor, the first preset state comprises a first preset temperature, the second preset state comprises a second preset temperature, and the first preset temperature is greater than the second preset temperature; The controller comprises an electromagnetic controller, and the valve comprises an electromagnetic valve; When the temperature sensor detects that the temperature of the heat pipe reaches a first preset temperature, the temperature sensor feeds back a detection signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnetic valve to open; when the temperature sensor detects that the temperature of the heat pipe reaches a second preset temperature, the temperature sensor feeds back a detection signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnetic valve to close.

3. The heat dissipation module according to claim 1, characterized in that: The sensor comprises an air pressure sensor, the first preset state comprises a first preset pressure, the second preset state comprises a second preset pressure, and the first preset pressure is greater than the second preset pressure; the controller comprises an electromagnetic controller, and the valve comprises an electromagnetic valve; When the air pressure sensor detects that the pressure in the heat pipe reaches a first preset pressure, the air pressure sensor feeds back a detection signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnetic valve to open; when the air pressure sensor detects that the air pressure in the heat pipe reaches a second preset pressure, the air pressure sensor feeds back a detection signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnetic valve to close.

4. The heat dissipation module according to any one of claims 2 or 3, characterized in that: A liquid level detector is also provided on the inner wall of the heat conduction tube, and the liquid level detector is connected to the controller. When the liquid level detector detects that the liquid level of the coolant in the heat conduction tube is equal to two-thirds of the diameter of the heat conduction tube, the controller controls the valve to close.

5. The heat dissipation module according to claim 4, characterized in that: A flow guide tube is further arranged between each of the heat conduction tubes and the heat dissipation body, one end of the flow guide tube is communicated with the upper part of the first cavity, and the other end is communicated with the upper part of the second cavity, and a condenser is arranged in the flow guide tube.

6. The heat dissipation module according to claim 4, characterized in that: The heat dissipation body is long and narrow, and the heat conduction pipe includes a first heat conduction pipe and a second heat conduction pipe, one end of the first heat conduction pipe is connected to the first bracket, and the other end is connected to a side of the heat dissipation body close to the first bracket; The second heat-conducting pipe is perpendicular to the heat-dissipating body in the horizontal direction, one end of the second heat-conducting pipe is connected to the radiator, and the other end is connected to the heat-dissipating body; the diameter of the first heat-conducting pipe is larger than the diameter of the second heat-conducting pipe.

7. The heat dissipation module according to claim 6, characterized in that: The diameter of the first heat-conducting pipe ranges from 6 mm to 10 mm, and the diameter of the second heat-conducting pipe ranges from 4 mm to 8 mm.

8. The heat dissipation module according to claim 7, characterized in that: The radiator further includes a first radiator and a second radiator, the first radiator and the second radiator are respectively arranged on two sides adjacent to the connection side of the first bracket and the first heat pipe, the heat pipe further includes a third heat pipe, the third heat pipe includes a first end, a second end and a heat pipe body, the first end and the second end are respectively located on two sides of the heat pipe body; The first end is connected to the first radiator, the second end is connected to the second radiator, and the heat pipe body is connected to the top of the first bracket. The middle part of the heat pipe body is connected to the first heat pipe, the valve is provided at the connection between the heat pipe body and the first heat pipe, the sensor is provided at the middle part of the heat pipe body, and when the sensor detects that the heat pipe body reaches the first preset state, the controller controls the valve between the first heat pipe and the heat pipe body to open.

9. The heat dissipation module according to claim 8, characterized in that: The outer surfaces of the first heat-conducting pipe, the second heat-conducting pipe, the third heat-conducting pipe and the heat-dissipating body are all wrapped with a waterproof layer.

10. A display device, comprising a housing and a display panel, wherein the display panel is connected to the housing, characterized in that: The display device further comprises a heat dissipation module as claimed in any one of claims 1 to 9, wherein the heat dissipation module is arranged in the housing.

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