Display device and method of manufacturing same

Abstract

According to an embodiment of the present disclosure, a display device and a method of manufacturing the same are provided. The display device includes: a base layer including a display area and a peripheral area; a light emitting element disposed in the display area and including a first electrode, a second electrode, and a light emitting part disposed between the first electrode and the second electrode; an electrode breaking member disposed in the peripheral region; and an electrode portion disposed adjacent to the electrode breaking member. The electrode breaking member includes a reverse tapering member and has a shape surrounding a region in plan view. The reverse tapered member includes an inner edge facing the region. The electrode portion includes a first electrode portion disposed in the region and a second electrode portion disposed on an upper surface of the reverse tapered member along the inner edge. The first electrode portion and the second electrode portion are physically spaced apart from each other.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0099311 filed in the Korean Intellectual Property Office on July 31, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to a display device and a method of manufacturing the display device. Background Art

[0003] Recently, as interest in information display increases, research and development of display devices are being conducted.

[0004] Meanwhile, in order to ensure device reliability of the display device, there is a necessity to prevent moisture penetration problems, etc. In order to prevent the moisture penetration problem, a method of forming a moisture penetration preventing structure may be considered. Summary of the invention

[0005] An object of the present disclosure is to provide a display device and a method of manufacturing the display device which can improve device reliability by reducing the risk of moisture penetration.

[0006] An object of the present disclosure is to provide a display device and a method of manufacturing the display device which can reduce process costs by simplifying process equipment.

[0007] According to an embodiment of the present disclosure, a display device may include: a base layer including a display area and a peripheral area surrounding at least a portion of the display area; a light-emitting element disposed on the base layer in the display area and including a first electrode, a second electrode, and a light-emitting component disposed between the first electrode and the second electrode; an electrode disconnecting member disposed on the base layer in the peripheral area; and an electrode portion disposed adjacent to the electrode disconnecting member. The electrode disconnecting member may include a reverse tapered member and may have a shape surrounding an area in a plan view. The reverse tapered member may include an inner edge facing the area. The electrode portion may include a first electrode portion disposed in the area and a second electrode portion disposed on an upper surface of the reverse tapered member along the inner edge. The first electrode portion and the second electrode portion may be physically spaced apart from each other.

[0008] According to an embodiment, the display device may further include an outer cladding layer disposed on the electrode portion. The light emitting element may further include a cladding layer disposed on the second electrode and including the same material as the outer cladding layer. At least a portion of the outer cladding layer and the second electrode portion may expose at least a portion of the upper surface of the reverse tapered member.

[0009] According to an embodiment, the display device may further include: an outer packaging layer disposed on the outer cladding layer; and an encapsulation layer disposed on the cladding layer in the display region and including the same material as the outer packaging layer. The outer packaging layer may expose at least a portion of the upper surface of the reverse tapered member and cover a side surface of the reverse tapered member facing the region.

[0010] According to an embodiment, the electrode disconnection member may include a plurality of electrode disconnection members. The plurality of electrode disconnection members may form an electrode disconnection region surrounding the display region.

[0011] According to an embodiment, the plurality of electrode disconnecting members may be sequentially arranged in a first direction and a second direction different from the first direction.

[0012] According to an embodiment of the present disclosure, a display device may include: a base layer including a display area and a peripheral area surrounding at least a portion of the display area; a light-emitting element disposed on the base layer in the display area and including a first electrode, a second electrode, and a light-emitting component disposed between the first electrode and the second electrode; and an electrode disconnection member disposed on the base layer in the peripheral area. The electrode disconnection member may include a base electrode and a protruding insulating layer disposed on the base electrode. The base electrode may include a first base electrode and a second base electrode spaced apart from each other. The protruding insulating layer may include a first protruding insulating layer disposed on the first base electrode and a second protruding insulating layer disposed on the second base electrode. In a plan view, at least a portion of the protruding insulating layer may protrude from the base electrode. A separation region having a closed loop structure may be formed between the first base electrode and the second base electrode.

[0013] According to an embodiment, the light emitting element may further include a coating layer disposed on the second electrode. The display device may further include an encapsulation layer disposed on the coating layer. The encapsulation layer may be disposed in the display region, but not in the electrode disconnection region where the electrode disconnection member is disposed.

[0014] According to an embodiment, the display device may further include a pixel circuit disposed on the base layer. The base electrode may include the same material as any one of a plurality of electrodes forming the pixel circuit.

[0015] According to an embodiment, the base electrode may be disposed between the protruding insulating layer and the base layer. The base electrode may include a conductive material, the protruding insulating layer may include an insulating material, and an etching rate of the base electrode and an etching rate of the protruding insulating layer may be different from each other.

[0016] According to an embodiment, the display device may further include: an external electrode portion disposed on the protruding insulating layer; and an outer coating portion disposed on the external electrode portion. At least a portion of the external electrode portion may be disposed on an inclined side surface of the protruding insulating layer, and the outer coating portion may cover at least a portion of the external electrode portion disposed on the inclined side surface.

[0017] According to an embodiment of the present disclosure, a method for manufacturing a display device may be provided, the display device including a display area and a peripheral area surrounding at least a portion of the display area. The method may include: forming a pixel circuit; and forming a light-emitting element layer disposed on the pixel circuit and including a light-emitting element electrically connected to the pixel circuit. The forming of the light-emitting element layer may include: forming a pixel defining layer on a substrate layer in the display area, and forming a reverse tapered member on the substrate layer in the peripheral area; forming a light-emitting component in the display area in an area surrounded by the pixel defining layer; and forming an electrode layer in the display area and the peripheral area. The reverse tapered member may surround an area and include an inner edge facing the area. The electrode layer may include an electrode portion disposed in the peripheral area. The electrode portion may include: a first electrode portion disposed in the area; and a second electrode portion disposed on an upper surface of the reverse tapered member.

[0018] According to an embodiment, the forming the light emitting member may include discharging an organic material for forming the light emitting member by using an inkjet printing method.

[0019] According to an embodiment, the forming of the pixel defining layer and the forming of the reverse tapering member may be performed in the same process.

[0020] According to an embodiment, the forming the electrode layer may include separating the first electrode portion and the second electrode portion without using a mask.

[0021] According to an embodiment, the method may further include removing at least a portion of the second electrode portion disposed on the upper surface of the reverse tapered member.

[0022] According to an embodiment of the present disclosure, a method for manufacturing a display device may be provided, the display device comprising a display area and a peripheral area surrounding at least a portion of the display area. The method may include: forming a pre-etched base electrode on a base layer in the peripheral area; forming a protruding insulating layer on the pre-etched base electrode in the peripheral area; and removing at least a portion of the pre-etched base electrode disposed under the protruding insulating layer.

[0023] According to an embodiment, the removing the at least a portion of the pre-etched base electrode may include a wet etching process.

[0024] According to an embodiment, the forming of the pre-etched base electrode may be performed simultaneously with forming an electrode in the display area. The forming of the protruding insulating layer may be performed simultaneously with forming an insulating layer in the display area.

[0025] According to an embodiment, the method may further include: forming a light-emitting element layer in the display area, the light-emitting element layer including a first electrode, a second electrode, and a light-emitting component disposed between the first electrode and the second electrode; and when forming the second electrode, forming an outer electrode portion in the peripheral area on the protruding insulating layer. The pre-etched base electrode may include a first pre-etched base electrode and a second pre-etched base electrode spaced apart from each other, with the pre-separated region interposed therebetween. The outer electrode portion may include a first outer electrode portion and a second outer electrode portion physically spaced apart from each other, with the protruding insulating layer interposed between the first outer electrode portion and the second outer electrode portion.

[0026] According to an embodiment, the method may further include: forming an outer coating portion on the outer electrode portion; forming an outer packaging layer on the outer coating portion; and exposing the outer coating portion by removing the outer packaging layer disposed on the outer coating portion.

[0027] According to an embodiment of the present disclosure, a display device and a method of manufacturing the display device that can improve device reliability by reducing the risk of moisture penetration can be provided.

[0028] According to the embodiments of the present disclosure, a display device and a method of manufacturing the display device that can reduce process costs by simplifying process equipment can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other features of the present disclosure will become more apparent by describing the embodiments of the present disclosure in more detail with reference to the accompanying drawings, in which:

[0030] Figure 1 is a schematic plan view showing a display device according to an embodiment;

[0031] Figure 2 is a schematic cross-sectional view showing a display device according to an embodiment;

[0032] Figure 3 and Figure 4 is a schematic cross-sectional view showing a pixel circuit layer and a light emitting element layer according to an embodiment;

[0033] Figure 5is a schematic enlarged plan view showing an electrode disconnection region provided with an electrode disconnection member according to an embodiment;

[0034] Figure 6 yes Figure 5 A schematic enlarged plan view of a region EA1 as a view showing an electrode disconnecting member according to an embodiment;

[0035] Figure 7 It is along Figure 1 A schematic cross-sectional view taken along line A to A′ of FIG. 1 , as a view showing a display device including an electrode disconnecting member according to an embodiment;

[0036] Figure 8 It is along Figure 6 A schematic cross-sectional view taken along line B to B';

[0037] Fig. 9 yes Figure 5 A schematic enlarged plan view of a region EA1 as a view showing an electrode disconnecting member according to another embodiment;

[0038] Fig.10 It is along Figure 1 A schematic cross-sectional view taken along line A to A' of FIG. 1 as a view showing a display device including an electrode disconnecting member according to another embodiment;

[0039] Fig.11 and Fig.12 It is along Fig. 9 A schematic cross-sectional view of line C to C';

[0040] Fig.13 is a flowchart showing a method of manufacturing a display device according to an embodiment;

[0041] Fig.14 , Fig.15 , Fig.16 , Fig.17 , Fig.18 , Fig.19 and Fig. 20 is a schematic cross-sectional view for each process step showing a method of manufacturing a display device according to an embodiment;

[0042] Fig.21 is a flow chart showing a method of manufacturing a display device according to another embodiment;

[0043] Fig. 22 , Fig.23 , Fig.24 and Fig.25 2 is a schematic cross-sectional view for each process step showing a method of manufacturing a display device according to another embodiment. DETAILED DESCRIPTION

[0044] The present disclosure can be modified in various ways and have various forms. Therefore, specific embodiments will be shown in the drawings and will be described in detail in the specification. However, it should be understood that the present disclosure is not intended to be limited to the specific forms disclosed, and the present disclosure includes all modifications, equivalents and replacements within the spirit and technical scope of the present disclosure.

[0045] Terms such as "first" and "second" may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present disclosure, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. Unless the context clearly indicates otherwise, in the following description, a singular expression includes a plural expression.

[0046] It should be understood that, in the present application, terms such as "including" or "having" are used to illustrate the existence of features, numbers, steps, operations, components, parts or combinations thereof described in the specification, but do not exclude the possibility of the pre-existence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof. In addition, when a part such as a layer, a region or a plate is referred to as "on" another part, it includes not only the case where the part is "directly on" another part, but also the case where there is another part between the part and the other part. In addition, in the present specification, when a part such as a layer, a region or a plate is formed on another part, the formation direction is not limited to the upper direction, but includes forming the part on the side surface or in the lower direction. On the contrary, when a part such as a layer, a region or a plate is formed "below" another part, this includes not only the case where the part is "directly below" another part, but also the case where there is another part between the part and the other part.

[0047] The present disclosure relates to a display device and a method for manufacturing the display device. Hereinafter, a display device and a method for manufacturing the display device according to an embodiment are described with reference to the accompanying drawings.

[0048] Figure 1 is a schematic plan view showing a display device according to an embodiment.

[0049] refer to Figure 1 , the display device DD may include a base layer BSL and a pixel PXL disposed on the base layer BSL. According to an embodiment, the display device DD may further include an electrode disconnecting member EDS. The display device DD may further include a pad PD.

[0050] The display device DD may further include a driving circuit unit (eg, a driving chip including a scan driver and / or a data driver, a circuit board, etc.) and signal lines for driving the pixels PXL.

[0051] The display device DD (or the base layer BSL) may include a display area DA and a peripheral area PA. The peripheral area PA may mean an area other than the display area DA. The peripheral area PA may surround at least a portion of the display area DA. The peripheral area PA may include a dead space.

[0052] The base layer BSL may form a base surface of the display device DD. The base layer BSL may be a rigid substrate or a flexible substrate or a rigid film or a flexible film. For example, the base layer BSL may be a rigid substrate formed of glass (e.g., tempered glass), a flexible substrate formed of a plastic material or a metal material, or at least one insulating layer. The material and / or physical properties of the base layer BSL are not particularly limited.

[0053] The display area DA may mean an area where the pixels PXL are disposed. The peripheral area PA may mean an area where the pixels PXL are not disposed. A driving circuit and a signal line connected to the pixels PXL in the display area DA may be disposed in the peripheral area PA.

[0054] According to an embodiment, the peripheral area PA may include an electrode disconnection area EDA where the electrode disconnection member EDS is provided. The peripheral area PA may include a pad area PDA where the pad PD is provided.

[0055] According to an embodiment, the pixel PXL (or the sub-pixel SPX) may be arranged in a stripe structure or The present disclosure is arranged in an arrangement structure, but is not limited thereto, and various embodiments can be applied to the present disclosure.

[0056] According to an embodiment, the pixel PXL (or sub-pixel SPX) may include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. Each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may be a sub-pixel. At least one of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may form a pixel unit configured to emit light of various colors.

[0057] For example, each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may emit light of one color. For example, the first sub-pixel SPX1 may be a red pixel that emits red (e.g., the first color) light, the second sub-pixel SPX2 may be a green pixel that emits green (e.g., the second color) light, and the third sub-pixel SPX3 may be a blue pixel that emits blue (e.g., the third color) light. According to an embodiment, the number of the second sub-pixels SPX2 may be greater than the number of the first sub-pixels SPX1 and the number of the third sub-pixels SPX3. However, the colors, types, and / or numbers, etc., of the first sub-pixels SPX1, the second sub-pixels SPX2, and the third sub-pixels SPX3 that form each pixel unit are not limited to specific examples.

[0058] The pad PD may be disposed in the pad area PDA. The pad PD may include a conductive layer and may form an electrical connection structure. For example, the pad PD may include a first pad layer PD1 (refer to Figure 7 ) and a second pad layer PD2 (reference Figure 7 ).

[0059] According to an embodiment, each layer of the pad PD may be connected to the pixel circuit layer PCL (refer to Figure 7 ) (eg, a back plate) or another conductive layer or other conductive layers are disposed on the same layer. According to an embodiment, each layer of the pad PD may be connected to a portion of the electrode disconnecting member EDS (eg, a base electrode BE (refer to Fig.10 )) are set on the same layer.

[0060] The pad area PDA may be formed on one side of the display area DA. The pad PD may be electrically connected to the driving circuit unit. For example, a circuit board and a driving chip forming the driving circuit unit may be disposed on the rear surface of the base layer BSL, the pad PD may be electrically connected to the circuit board and the driving chip, and the pad PD may be electrically connected to other lines on the base layer BSL. Therefore, an electrical signal (e.g., a driving signal, etc.) provided by the driving circuit unit may be provided to the pixel circuit PXC (reference Figure 3 ).

[0061] The electrode disconnection member EDS may be disposed in the electrode disconnection area EDA. The electrode disconnection area EDA may be formed around the display area DA. The electrode disconnection area EDA may surround at least a portion of the display area DA. The electrode disconnection area EDA may be formed in a ring shape. The electrode disconnection area EDA may have a closed-loop structure that completely surrounds the edge of the display area DA. However, the present disclosure is not limited thereto. The electrode disconnection area EDA may have an open-loop structure. According to an embodiment, at least a portion of the electrode disconnection area EDA may be disposed between the pad area PDA and the display area DA.

[0062] The electrode disconnection member EDS may include a structure that can disconnect electrode layers that are adjacent to the electrode disconnection member EDS and are formed (e.g., deposited) on the electrode disconnection member EDS from each other. For example, the electrode disconnection member EDS may include a reverse tapered structure. In this case, since the process of forming the electrode layer having the disconnected portion is performed without requiring a separate mask (e.g., an open mask), the electrode layer deposited in the electrode disconnection area EDA may be disconnected. For example, in the electrode disconnection area EDA, the electrode layer that is formed with the light emitting element LD (reference Figure 3 ) of the second electrode ELT2 (reference Figure 3 )The electrode layers deposited simultaneously can be disconnected.

[0063] According to an embodiment, when the electrode layer is disconnected in the peripheral area PA, the risk of moisture penetration from the outside can be reduced. In addition, the disconnection of these electrode layers can be performed without the need for a separate mask (e.g., an opening mask). Therefore, the process steps can be simplified, the process cost can be reduced, and the moisture penetration problem can be prevented. The relevant details are described later.

[0064] Figure 2 is a schematic cross-sectional view showing a display device according to an embodiment.

[0065] refer to Figure 2 , the display device DD may include a pixel circuit layer PCL (eg, a backplane layer) and a light emitting element layer LEL. According to an embodiment, the display device DD may further include a color filter layer CFL, an overcoat layer OCL, and a functional film layer FL.

[0066] The pixel circuit layer PCL may include a circuit for driving the pixel PXL (refer to Figure 1 ) pixel circuit PXC (reference Figure 3 ) layer, the pixel PXL includes a light emitting element LD (reference Figure 3 ). The pixel circuit layer PCL may include a base layer BSL, a conductive layer for forming a pixel circuit, and an insulating layer disposed between adjacent conductive layers.

[0067] The light emitting element layer LEL may be disposed on the pixel circuit layer PCL. According to an embodiment, the light emitting element layer LEL may include a light emitting element LD. According to an embodiment, the light emitting element LD may include an organic light emitting diode (OLED).

[0068] The color filter layer CFL may be disposed on the light emitting element layer LEL. The color filter layer CFL may include a color filter material (eg, a dye or a pigment) that selectively transmits light of one color. For example, the color filter layer CFL may include a first sub-pixel SPX1 (refer to Figure 1) in the first color filter, included in the second sub-pixel SPX2 (reference Figure 1 ) and the second color filter contained in the third sub-pixel SPX3 (reference Figure 1 ) in the third color filter.

[0069] The overcoat OCL may be disposed on the color filter layer CFL. The overcoat OCL may be a planarization layer, and may be a protective layer that protects a structure disposed under the protective layer from external influences. The overcoat OCL may include an organic material. However, the present disclosure is not limited thereto.

[0070] The functional film layer FL may be disposed on the outer coating layer OCL. The functional film layer FL may include one or more of the group consisting of a polyethylene terephthalate (PET) film, a low reflection film, a polarizing film, and a controllable transmittance film. However, the present disclosure is not limited thereto.

[0071] Figure 3 and Figure 4 is a schematic cross-sectional view showing a pixel circuit layer and a light emitting element layer according to an embodiment.

[0072] refer to Figure 3 and Figure 4 , the pixel circuit layer PCL may include a pixel circuit PXC disposed (e.g., patterned) on the base layer BSL. The pixel circuit PXC may include a driving transistor, a switching transistor, and a storage capacitor, and may also include various other circuit elements. The driving transistor and the switching transistor may be thin film transistors, and may supply an electrical signal to the light emitting element LD to emit light.

[0073] According to an embodiment, the light emitting element layer LEL may include a pixel defining layer PDL, a light emitting element LD, and an encapsulation layer TFE.

[0074] The pixel defining layer PDL may be disposed on the pixel circuit layer PCL to define a position where the light emitting part EL is disposed. For example, the pixel defining layer PDL may be directly adjacent to the light emitting part EL.

[0075] According to an embodiment, the pixel defining layer PDL may include a liquid repellent material. Therefore, the pixel defining layer PDL can properly accommodate liquid material discharged into an area (e.g., an opening) surrounded by the pixel defining layer PDL. For example, when a material for forming the light emitting part EL is formed by an inkjet printing method, the discharged ink can be prevented from being formed on the pixel defining layer PDL.

[0076] According to an embodiment, the pixel defining layer PDL may include an organic material. According to an embodiment, the pixel defining layer PDL may include one or more of the group of acrylic resin, epoxy resin, phenolic resin, polyamide resin and polyimide resin. However, the present disclosure is not limited thereto. According to an embodiment, the pixel defining layer PDL may include an inorganic material.

[0077] The light emitting element LD may be disposed on the pixel circuit layer PCL. The light emitting element LD may include a first electrode ELT1, a light emitting part EL, a second electrode ELT2, and a cladding layer CPL.

[0078] The first electrode ELT1 may be a lower electrode of the light emitting element LD. The second electrode ELT2 may be an upper electrode of the light emitting element LD. For example, the first electrode ELT1 may be disposed between the base layer BSL and the second electrode ELT2.

[0079] According to an embodiment, the first electrode ELT1 and the second electrode ELT2 may include a single layer or a multi-layer metal layer. The first electrode ELT1 and the second electrode ELT2 may include at least one of various metal materials including gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), platinum (Pt), etc., or an alloy thereof. According to an embodiment, the first electrode ELT1 and the second electrode ELT2 may include a metal layer including silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO 2 ), at least one of various transparent conductive materials of carbon nanotubes and graphene.

[0080] The light emitting part EL may be disposed in a region defined by the pixel defining layer PDL. One surface of the light emitting part EL may be electrically connected to the first electrode ELT1, and the other surface of the light emitting part EL may be electrically connected to the second electrode ELT2.

[0081] The light-emitting component EL may include a multilayer thin film structure and may include typical materials for manufacturing an organic light-emitting diode. For example, the light-emitting component EL may include a hole injection layer HIL that injects holes, a hole transport layer HTL that has excellent hole transport capability and suppresses the movement of uncombined electrons in the light-generating layer to increase the chance of recombination of holes and electrons, a light-emitting layer EML that contains a host and a dopant and emits light through the recombination of injected electrons and holes (e.g., the formation of excitons), an electron transport layer ETL for smoothly transporting electrons to the light-generating layer, and an electron injection layer EIL that injects electrons. According to an embodiment, the light-emitting layer EML may be a quantum dot light-emitting layer. However, the material used to form the light-emitting component EL is not limited to the specific example.

[0082] The light emitting part EL may emit light based on an electrical signal supplied from the first electrode ELT1 and the second electrode ELT2 .

[0083] According to the embodiment (reference Figure 3 ), the first electrode ELT1 may be an anode electrode ANO, and the second electrode ELT2 may be a cathode electrode CAT. Therefore, a hole injection layer HIL, a hole transport layer HTL, an emission layer EML, an electron transport layer ETL, and an electron injection layer EIL may be sequentially disposed on the first electrode ELT1. According to an embodiment, the first electrode ELT1 may be electrically connected to the pixel circuit PXC.

[0084] According to the embodiment (reference Figure 4 ), the first electrode ELT1 may be a cathode electrode CAT, and the second electrode ELT2 may be an anode electrode ANO. Therefore, the electron injection layer EIL, the electron transport layer ETL, the light emitting layer EML, the hole transport layer HTL, and the hole injection layer HIL may be sequentially disposed on the first electrode ELT1. According to an embodiment, the first electrode ELT1 may be electrically connected to the pixel circuit PXC.

[0085] According to the embodiment, each of the plurality of layers forming the light emitting part EL may be formed by various processes. For example, each of the plurality of layers forming the light emitting part EL may be formed by a solution process (e.g., an inkjet printing method). According to the embodiment, the inkjet printing method may be used to manufacture the light emitting part EL, and thus the process efficiency may be improved.

[0086] The cladding layer CPL may be disposed on the second electrode ELT2. The cladding layer CPL may contact the second electrode ELT2. The cladding layer CPL may passivate other portions of the light emitting element LD (eg, the second electrode ELT2).

[0087] The coating layer CPL may include an inorganic material. For example, the coating layer CPL may include one or more of a metal and a metal compound. For example, the metal may include one or more of aluminum (Al), silver (Ag), magnesium (Mg), chromium (Cr), titanium (Ti), nickel (Ni), gold (Au), tantalum (Ta), copper (Cu), calcium (Ca), cobalt (Co), iron (Fe), molybdenum (Mo), tungsten (W), platinum (Pt), bismuth (Bi), and ytterbium (Yb). The metal compound may include silicon oxide (SiO x ), titanium oxide (TiO x )、ZrO x ), Tantalum Oxide (Ta x O y ), hafnium oxide (HfO x ), aluminum oxide (Al x O y ), zinc oxide (ZnO x ), yttrium oxide (Y x O y ), beryllium oxide (BeO x ), magnesium oxide (MgO x ), lead oxide (PbO x ), tungsten oxide (WO x ), bismuth oxide (BiO x ), Silicon Nitride (SiN x ), lithium fluoride (LiF x ), calcium fluoride (CaF x ), magnesium fluoride (MgF x ) and cadmium sulfide (CdS x ) in the group of one or more.

[0088] The encapsulation layer TFE may be disposed on the capping layer CPL. The encapsulation layer TFE may flatten the step difference generated by the light emitting element LD, the capping layer CPL, and the pixel defining layer PDL. The encapsulation layer TFE may include a plurality of insulating layers covering the light emitting element LD. According to an embodiment, the encapsulation layer TFE may have a structure in which inorganic layers and organic layers are alternately stacked. According to an embodiment, the encapsulation layer TFE may be an encapsulation layer having a structure in which a first inorganic layer TFE1, an organic layer TFE2, and a second inorganic layer TFE3 are sequentially stacked. According to an embodiment, the encapsulation layer TFE may be a thin film encapsulation layer. However, the present disclosure is not limited thereto. According to an embodiment, the encapsulation layer TFE may include a single layer.

[0089] refer to Figure 5 , describing the planar structure of the electrode disconnect member EDS. Figure 5 is a schematic enlarged plan view showing an electrode disconnection region provided with an electrode disconnection member according to the embodiment.

[0090] refer to Figure 1 and Figure 5 , the electrode disconnection area EDA may be formed in the peripheral area PA.

[0091] Figure 5 A partial area of ​​the peripheral area PA according to an embodiment is schematically shown. For example, the peripheral area PA may include an electrode disconnection area EDA provided with an electrode disconnection member EDS.

[0092] According to an embodiment, a plurality of electrode disconnection members EDS may be provided in the electrode disconnection area EDA. For example, the electrode disconnection member EDS may include a plurality of electrode disconnection members EDS spaced apart from each other. According to an embodiment, the electrode disconnection members EDS may be spaced apart in the first direction DR1 or may be spaced apart in the second direction DR2. For example, the electrode disconnection members EDS may be arranged in a matrix structure based on the first direction DR1 and the second direction DR2. However, the present disclosure is not limited thereto.

[0093] According to an embodiment, 10 or more electrode disconnect members EDS may be sequentially and repeatedly disposed along the first direction DR1 or the second direction DR2. However, the present disclosure is not limited thereto.

[0094] The electrode disconnecting members EDS may have sizes equal to each other in a plan view.

[0095] A plane in this specification may be a direction extending in the first direction DR1 and the second direction DR2, and the base layer BSL may be disposed in the plane.

[0096] According to an embodiment, the electrode disconnecting member EDS may be provided at least on one side of the display area DA to reduce the risk of moisture penetration to the display device DD. According to an embodiment, since the number of electrode disconnecting members EDS along the first direction DR1 and the second direction DR2 is appropriately adjusted, the risk of excessive expansion of the peripheral area PA can be prevented while appropriately preventing the risk of moisture penetration.

[0097] According to an embodiment, in a plan view, the electrode disconnect member EDS may have a polygonal shape including more than three sides. However, the present disclosure is not limited thereto. For example, the electrode disconnect member EDS may have a circular shape or an elliptical shape. The electrode disconnect member EDS may have rounded corners.

[0098] Each of the plurality of electrode disconnecting members EDS may have a closed loop structure. For example, in a plan view, the electrode disconnecting member EDS may have a shape surrounding an edge of one region.

[0099] As described above, the electrode disconnecting member EDS may have a reverse tapered structure in which electrodes are disconnected from each other without requiring a separate mask step for disconnecting electrodes. The electrodes surrounded by the electrode disconnecting member EDS and the electrodes disposed on the electrode disconnecting member EDS may be physically separated.

[0100] refer to Figures 6 to 8 , an electrode disconnecting member EDS according to an embodiment is described. For the convenience of description, contents that may overlap with the above contents are briefly described or not repeated.

[0101] Figure 6 yes Figure 5 1 is a schematic enlarged plan view of an area EA1 as a view showing an electrode disconnecting member according to the embodiment.

[0102] Figure 7 It is along Figure 1 A schematic cross-sectional view taken along line A to A′ of FIG. 1 is a view showing a display device including an electrode disconnecting member according to an embodiment. Figure 7 It may be a cross-sectional view showing the display area DA and the peripheral area PA together.

[0103] Figure 8 It is along Figure 6 A schematic cross-sectional view taken along line B to B'. Figure 8 may be a schematic enlarged cross-sectional view illustrating an electrode disconnecting member EDS according to an embodiment.

[0104] refer to Figures 6 to 8 The electrode disconnect member EDS may include a reverse-taper member RTS. The reverse-taper member RTS may have a closed loop shape surrounding the area.

[0105] The display device DD according to the embodiment may include an electrode portion E. The electrode portion E may be adjacent to the reverse tapering member RTS.

[0106] The electrode portion E may include a first electrode portion E1 surrounded by the reverse tapered member RTS and a second electrode portion E2 spaced apart from the first electrode portion E1 and disposed on the reverse tapered member RTS.

[0107] The first electrode portion E1 may be disposed in a region surrounded by the reverse tapered member RTS. The first electrode portion E1 may be disposed in a region surrounded by the second electrode portion E2. In a plan view, the shape of the first electrode portion E1 may be determined by the shape of the reverse tapered member RTS.

[0108] For example, in a plan view, the shape of the edge of the first electrode portion E1 may substantially have the same shape as the shape of the inner edge IEDG of the reverse tapered member RTS. In a plan view, the edge of the first electrode portion E1 may face the inner edge IEDG of the reverse tapered member RTS. For example, the first electrode portion E1 may have a quadrilateral shape, and the inner edge IEDG of the reverse tapered member RTS may have a quadrilateral shape that is the same as (e.g., has a similar relationship to) the quadrilateral shape of the first electrode portion E1. However, the present disclosure is not limited thereto.

[0109] In a plan view, the second electrode portion E2 may be disposed on the reverse tapered member RTS to overlap with the reverse tapered member RTS. For example, in a plan view, the second electrode portion E2 may be disposed on the reverse tapered member RTS along an inner edge IEDG of the reverse tapered member RTS. The inner edge IEDG of the reverse tapered member RTS may face the side wall of the first electrode portion E1 surrounded by the reverse tapered member RTS.

[0110] In a plan view, the second electrode portion E2 may not substantially overlap the first electrode portion E1. The second electrode portion E2 may be disposed between an outer edge OEDG of the reverse tapered member RTS and the first electrode portion E1.

[0111] The shape of the second electrode portion E2 may correspond to the shape of the reverse tapered member RTS.

[0112] For example, in a plan view, the shape of the inner edge of the second electrode portion E2 may correspond to (e.g., be substantially the same as) the shape of the inner edge IEDG of the reverse tapered member RTS. In a plan view, the outer edge of the second electrode portion E2 may face the inner edge IEDG of the reverse tapered member RTS. For example, in a plan view, the second electrode portion E2 may have a quadrilateral shape and include an opening surrounded by the second electrode portion E2, and the reverse tapered member RTS may have a quadrilateral shape that is the same as (e.g., has a similar relationship to) the quadrilateral shape of the second electrode portion E2 and include an opening surrounded by the second electrode portion E2. However, the present disclosure is not limited thereto.

[0113] The second electrode portion E2 may completely surround the first electrode portion E1.

[0114] For example, in a plan view, the shape of the edge of the second electrode portion E2 may be substantially the same as the shape of the edge of the first electrode portion E1. In a plan view, the inner edge of the second electrode portion E2 may face the edge of the first electrode portion E1. For example, in a plan view, the second electrode portion E2 may have a quadrilateral shape having an opening, and the first electrode portion E1 may have a quadrilateral shape surrounded by the second electrode portion E2. However, the present disclosure is not limited thereto.

[0115] Meanwhile, the display device DD according to the embodiment may include a conductive layer and an insulating layer for forming a pixel circuit layer PCL.

[0116] According to an embodiment, the display device DD may include a first lower auxiliary electrode layer BML1, a second lower auxiliary electrode layer BML2, a buffer layer BFL, a transistor TR, a gate insulating layer GI, an interlayer insulating layer ILD, a first conductive layer CL1, a second conductive layer CL2, a pad PD, a via layer VIA, and a dam DAM.

[0117] The first lower auxiliary electrode layer BML1 and the second lower auxiliary electrode layer BML2 may be disposed on the base layer BSL. The first lower auxiliary electrode layer BML1 may be electrically connected to the second transistor electrode TE2. The second lower auxiliary electrode layer BML2 may be electrically connected to the first transistor electrode TE1.

[0118] The buffer layer BFL may be disposed on the base layer BSL and may cover the first lower auxiliary electrode layer BML1, the second lower auxiliary electrode layer BML2, the (1-1)th conductive layer CL1-1, the (2-1)th conductive layer CL2-1, and the first pad layer PD1. The buffer layer BFL may prevent diffusion of impurities or penetration of moisture into the active layer ACT. According to an embodiment, the buffer layer BFL may include an inorganic material.

[0119] The transistor TR may include an active layer ACT, a gate electrode GAT, a first transistor electrode TE1 , and a second transistor electrode TE2 .

[0120] The active layer ACT may include a semiconductor. For example, the active layer ACT may include one or more of the group consisting of polysilicon, low temperature polysilicon (LTPS), amorphous silicon, and an oxide semiconductor. According to an embodiment, the active layer ACT may form a channel region.

[0121] The gate electrode GAT may overlap the active layer ACT, and the gate insulating layer GI is interposed between the gate electrode GAT and the active layer ACT. Each of the first transistor electrode TE1 and the second transistor electrode TE2 may be electrically connected to the active layer ACT. One of the first transistor electrode TE1 and the second transistor electrode TE2 may be a source electrode, and the other may be a drain electrode. According to an embodiment, the gate electrode, the first transistor electrode TE1, and the second transistor electrode TE2 may be disposed on the same layer. However, the present disclosure is not limited thereto.

[0122] According to an embodiment, the gate electrode GAT may include various conductive materials and may have a single-layer structure or a multi-layer structure. According to an embodiment, the gate electrode GAT may include at least one of various metal materials including gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and platinum (Pt), etc., or an alloy thereof. For example, the gate electrode GAT may have a structure in which Ti / Al / Ti is sequentially stacked or a structure in which Ti / Cu is sequentially stacked. However, the present disclosure is not limited thereto.

[0123] The transistor TR may be a thin film transistor. According to an embodiment, the transistor may include a driving transistor, and may further include a switching transistor.

[0124] At least a portion of the gate insulating layer GI may be disposed between the gate electrode GAT and the active layer ACT. According to an embodiment, the gate insulating layer GI may be disposed under each of the first transistor electrode TE1, the second transistor electrode TE2, the (1-2)th conductive layer CL1-2, the (2-2)th conductive layer CL2-2, and the second pad layer PD2.

[0125] The interlayer insulating layer ILD may cover the gate electrode GAT, the first transistor electrode TE1, the second transistor electrode TE2, the (1-2)th conductive layer CL1-2, the (2-2)th conductive layer CL2-2, and the second pad layer PD2. The interlayer insulating layer ILD may include an inorganic material. For example, the interlayer insulating layer ILD may include silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiO x N y ) and aluminum oxide (Al x O y ) in the group of one or more. However, the present disclosure is not necessarily limited to the above examples.

[0126] The first conductive layer CL1 may include a (1-1)th conductive layer CL1-1 and a (1-2)th conductive layer CL1-2. The second conductive layer CL2 may include a (2-1)th conductive layer CL2-1 and a (2-2)th conductive layer CL2-2. The (1-1)th conductive layer CL1-1 and the (2-1)th conductive layer CL2-1 may be disposed on the same layer as the first lower auxiliary electrode layer BML1 and the second lower auxiliary electrode layer BML2. The (1-2)th conductive layer CL1-2 and the (2-2)th conductive layer CL2-2 may be disposed on the same layer as the gate electrode GAT.

[0127] According to an embodiment, the first and second conductive layers CL1 and CL2 may be disposed under the dam DAM to overlap the dam DAM in a plan view to ensure a sufficient height of the dam DAM formed on the first and second conductive layers CL1 and CL2 .

[0128] The via layer VIA may be disposed on the interlayer insulating layer ILD. The via layer VIA may be a planarization layer. According to an embodiment, the via layer VIA may be disposed in the display area DA, and may not be disposed in at least a portion of the peripheral area PA.

[0129] The through hole layer VIA may include an organic material. For example, the organic material may include one or more of the group consisting of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, polyester resin, polyphenylene sulfide resin, and benzocyclobutene (BCB). However, the present disclosure is not necessarily limited to the above examples.

[0130] According to an embodiment, the first electrode ELT1 may be electrically connected to the second transistor electrode TE2 through a contact portion formed through the via layer VIA. Therefore, the transistor TR may be electrically connected to the light emitting part EL through the first electrode ELT1.

[0131] According to an embodiment, the pixel defining layer PDL may expose a portion of the first electrode ELT1 to form a region where the light emitting part EL may be disposed.

[0132] According to an embodiment, the dam DAM may be disposed adjacent to the peripheral area PA. The dam DAM may be disposed between a region where the light emitting element LD is disposed and the electrode disconnection area EDA.

[0133] The dam DAM may protrude in the thickness direction (eg, third direction DR3) of the base layer BSL. The dam DAM may include a first dam DAM1 and a second dam DAM2 spaced apart from each other in the plane direction of the base layer BSL. The dam DAM may reduce the risk of fluid overflowing to the outside when forming the light emitting part EL or the encapsulation layer TFE.

[0134] The first dam DAM1 may include a (1-1)th dam DAM1-1 and a (1-2)th dam DAM1-2 disposed on the (1-1)th dam DAM1-1. The second dam DAM2 may include a (2-1)th dam DAM2-1 and a (2-2)th dam DAM2-2 disposed on the (2-1)th dam DAM2-1.

[0135] The (1-1)th dam DAM1-1 and the (2-1)th dam DAM2-1 may be formed in the same process and may include the same material as the through hole layer VIA. The (1-2)th dam DAM1-2 and the (2-2)th dam DAM2-2 may be formed in the same process and may include the same material as the pixel defining layer PDL. According to an embodiment, the (1-2)th dam DAM1-2 and the (2-2)th dam DAM2-2 may be formed in the same process and may include the same material as the reverse tapered member RTS.

[0136] According to an embodiment, the second electrode ELT2 and the cover layer CPL may be sequentially disposed on the light emitting part EL, and the encapsulation layer TFE may cover other layers in the display area DA. A portion of the encapsulation layer TFE may be disposed between the first dam DAM1 and the second dam DAM2.

[0137] According to an embodiment, the electrode disconnection area EDA where the electrode disconnection member EDS is disposed may be disposed adjacent to the edge of the display area DA.

[0138] According to an embodiment, the electrode disconnecting member EDS may be disposed between the display area DA and the pad area PDA. The electrode disconnecting member EDS may be disposed adjacent to the pad PD. For example, the reverse tapered member RTS forming the electrode disconnecting member EDS may include a first portion P1 and a second portion P2. The first portion P1 may face the display area DA, and the second portion P2 may face the pad area PDA.

[0139] According to an embodiment, the outer cover layer OCP may be disposed on the electrode portion E disposed adjacent to the reverse tapered member RTS.

[0140] The outer cover layer OCP may cover the electrode portion E. The outer cover layer OCP may include a first outer cover layer OCP1 disposed on the first electrode portion E1 and a second outer cover layer OCP2 disposed on the second electrode portion E2.

[0141] According to an embodiment, the outer encapsulation layer OTFE may be disposed on the outer cladding layer OCP.

[0142] The outer encapsulation layer OTFE may cover the outer cladding layer OCP. For example, the outer encapsulation layer OTFE may cover the first outer cladding layer OCP1 and the second outer cladding layer OCP2, and may also cover the inner surface of the reverse tapered member RTS.

[0143] According to an embodiment, the electrode disconnect member EDS may be formed in at least part of the same process as other layers of the light emitting element layer LEL provided in the display area DA.

[0144] For example, the reverse tapered member RTS may be formed in the same process as the pixel defining layer PDL disposed in the light emitting element layer LEL. The reverse tapered member RTS and the pixel defining layer PDL may include the same material. The reverse tapered member RTS and the pixel defining layer PDL may include materials of the same composition. The reverse tapered member RTS and the pixel defining layer PDL may be disposed on the same layer.

[0145] For example, the electrode portion E may be formed in the same process as the second electrode ELT2 disposed in the light emitting element layer LEL. The electrode portion E and the second electrode ELT2 may include the same material. The electrode portion E and the second electrode ELT2 may include materials of the same composition. The electrode portion E and the second electrode ELT2 may be disposed on the same layer.

[0146] For example, the outer cladding layer OCP may be formed in the same process as the cladding layer CPL disposed in the light emitting element layer LEL. The outer cladding layer OCP and the cladding layer CPL may include the same material. The outer cladding layer OCP and the cladding layer CPL may include materials of the same composition. The outer cladding layer OCP and the cladding layer CPL may be disposed on the same layer.

[0147] For example, the outer encapsulation layer OTFE can be formed in the same process as the encapsulation layer TFE disposed in the light emitting element layer LEL. The outer encapsulation layer OTFE and the encapsulation layer TFE can include the same material. The outer encapsulation layer OTFE and the encapsulation layer TFE can include materials of the same composition. The outer encapsulation layer OTFE and the encapsulation layer TFE can be disposed on the same layer.

[0148] According to an embodiment, the first outer clad layer OCP1 may cover the upper surface of the first electrode portion E1. The second outer clad layer OCP2 may cover the upper surface of the second electrode portion E2. The outer encapsulation layer OTFE may cover the upper surfaces of the first outer clad layer OCP1 and the second outer clad layer OCP2. The outer encapsulation layer OTFE may cover the side surface of each of the first outer clad layer OCP1, the second outer clad layer OCP2, the first electrode portion E1, and the second electrode portion E2.

[0149] According to an embodiment, the outer encapsulation layer OTFE may cover one side surface (eg, inner edge IEDG) of the reverse tapered member RTS, and the outer encapsulation layer OTFE may expose the other side surface (eg, outer edge OEDG) of the reverse tapered member RTS.

[0150] According to an embodiment, at least a portion of the upper surface of the reverse tapered member RTS may be exposed. According to an embodiment, the second electrode portion E2, the second outer cladding layer OCP2, and the outer packaging layer OTFE may partially cover the upper surface of the reverse tapered member RTS disposed adjacent to the first electrode portion E1. According to an embodiment, each side of the second electrode portion E2, the second outer cladding layer OCP2, and the outer packaging layer OTFE disposed on the upper surface of the reverse tapered member RTS may be exposed. According to an embodiment, the second electrode portion E2 may cover the edge of the upper surface of the reverse tapered member RTS disposed adjacent to the inner edge IEDG.

[0151] According to an embodiment, the second electrode portion E2, the second outer cladding layer OCP2 and the outer encapsulation layer OTFE may be patterned in the same etching process. For example, after sequentially depositing the layers for forming each of the second electrode portion E2, the second outer cladding layer OCP2 and the outer encapsulation layer OTFE, the respective layers may be etched (e.g., dry-etched) together (e.g., simultaneously) using the same mask. In this case, the second electrode portion E2 may have an island structure that is not electrically connected to another conductive structure. Therefore, the risk of moisture penetrating into the display area DA may be more thoroughly prevented.

[0152] According to an embodiment, the first electrode portion E1 and the second electrode portion E2 may be spaced apart from each other. For example, each of the first electrode portion E1 and the second electrode portion E2 may include edges (eg, ends) facing each other in a plan view.

[0153] According to an embodiment, the first outer clad layer OCP1 and the second outer clad layer OCP2 may be spaced apart from each other. For example, each of the first outer clad layer OCP1 and the second outer clad layer OCP2 may include edges (eg, ends) facing each other in a plan view.

[0154] Experimentally, when a conductive path is formed in the peripheral area PA, a moisture penetration problem in which moisture penetrates into the display device DD may occur through the conductive path.

[0155] According to the embodiment, the conductive path can be disconnected by forming the electrode disconnecting member EDS, and thus the moisture penetration problem can be substantially prevented. For example, because the first electrode portion E1 and the second electrode portion E2 are spaced apart from each other, and the first outer cladding layer OCP1 and the second outer cladding layer OCP2 are spaced apart from each other, the moisture penetration risk can be reduced.

[0156] Experimentally, when the second electrode ELT2 is deposited without a mask, a conductive path may be formed in at least a partial region of the display device DD, and thus a risk of moisture penetration may occur. Alternatively, when the second electrode ELT2 is patterned using a mask (e.g., an open mask), the number of masks may increase, and thus the process cost may increase.

[0157] However, according to the embodiment, when the electrode disconnection member EDS is formed and a conductive layer for forming the second electrode ELT2 is deposited on the electrode disconnection member EDS, the first electrode portion E1 and the second electrode portion E2 can be disconnected due to the reverse tapered member RTS without using a separate mask. Therefore, since a disconnection structure can be formed without a mask for patterning the first electrode portion E1 and the second electrode portion E2, the process cost can be reduced.

[0158] refer to Figures 9 to 12 , an electrode disconnecting member EDS according to another embodiment is described. For the convenience of description, contents that may overlap with the above contents are briefly described or not repeated.

[0159] Fig. 9 yes Figure 5 1 is a schematic enlarged plan view of an area EA1 as a view showing an electrode disconnecting member according to another embodiment.

[0160] Fig.10 It is along Figure 1 A schematic cross-sectional view taken along line A to A′ of FIG. 1 is a view showing a display device including an electrode disconnecting member according to another embodiment. Fig.10 It may be a cross-sectional view showing the display area DA and the peripheral area PA together.

[0161] Fig.11 and Fig.12 It is along Fig. 9 Schematic cross-sectional view along line C to C'. Fig.11 and Fig.12 may be a schematic enlarged cross-sectional view illustrating an electrode disconnecting member EDS according to another embodiment.

[0162] The display device DD according to this embodiment is different from the display device DD according to the previous embodiment (refer to Figure 7 ) is different in that the electrode disconnecting member EDS includes a base electrode BE and a protruding insulating layer TIL.

[0163] According to an embodiment, the base electrode BE may have a shape surrounding a region (eg, a closed loop shape).

[0164] The base electrode BE may include a first base electrode BE1 and a second base electrode BE2 which are spaced apart from each other.

[0165] The first base electrode BE1 may be disposed in a region surrounded by the second base electrode BE2. The shapes of the first base electrode BE1 and the second base electrode BE2 may be substantially the same.

[0166] The first base electrode BE1 and the second base electrode BE2 may face each other with the separation area SPA interposed therebetween. The first base electrode BE1 and the second base electrode BE2 may not overlap each other in a plan view.

[0167] According to an embodiment, the first base electrode BE1 may have an inner closed loop structure in the electrode disconnecting member EDS. The second base electrode BE2 may have an outer closed loop structure in the electrode disconnecting member EDS. Therefore, in a plan view, the separation area SPA may be completely surrounded by the base electrode BE.

[0168] According to an embodiment, the first base electrode BE1 and the second base electrode BE2 may be disposed on the base layer BSL. For example, the first base electrode BE1 and the second base electrode BE2 may be disposed on the buffer layer BFL.

[0169] According to an embodiment, the first base electrode BE1 and the second base electrode BE2 may be electrodes provided in the pixel circuit layer PCL, and may be connected to a substrate for forming the pixel circuit PXC (refer to Figure 4 ) is formed in the same process. For example, the first base electrode BE1 and the second base electrode BE2 may be formed in the same process as the gate electrode GAT (or the first transistor electrode TE1 and the second transistor electrode TE2) provided in the pixel circuit layer PCL. The base electrode BE and the gate electrode GAT (or the first transistor electrode TE1 and the second transistor electrode TE2) may include the same material. The base electrode BE and the gate electrode GAT (or the first transistor electrode TE1 and the second transistor electrode TE2) may include materials of the same composition. The base electrode BE and the gate electrode GAT (or the first transistor electrode TE1 and the second transistor electrode TE2) may be provided on the same layer.

[0170] For example, the base electrode BE may include various conductive materials and may have a single-layer or multi-layer structure. According to an embodiment, the base electrode BE may include at least one of various metal materials including gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and platinum (Pt), etc., or an alloy thereof. For example, the base electrode BE may have a structure in which Ti / Al / Ti is sequentially stacked or a structure in which Ti / Cu is sequentially stacked. However, the present disclosure is not limited thereto.

[0171] The protruding insulating layer TIL may be disposed on the base electrode BE. The protruding insulating layer TIL may have a structure protruding from the upper surface of the base electrode BE. For example, the protruding insulating layer TIL may have a tip portion protruding from the edge of the base electrode BE. That is, the base electrode BE may have an undercut portion disposed below the tip portion of the protruding insulating layer TIL.

[0172] The protruding insulating layer TIL may completely cover the upper surface of the base electrode BE. The protruding insulating layer TIL may cover one side surface of the base electrode BE and may expose the other side surface of the base electrode BE. For example, at least a portion of the lower surface of the protruding insulating layer TIL may not contact the base electrode BE in the undercut portion.

[0173] According to an embodiment, the protruding insulating layer TIL may be formed in the same process as the interlayer insulating layer ILD provided in the pixel circuit layer PCL. The protruding insulating layer TIL and the interlayer insulating layer ILD may include the same material. The protruding insulating layer TIL and the interlayer insulating layer ILD may include materials of the same composition. The protruding insulating layer TIL and the interlayer insulating layer ILD may be provided on the same layer.

[0174] However, the present disclosure is not limited thereto. For example, the protruding insulating layer TIL may be formed in the same process as the via layer VIA. Hereinafter, for ease of description, the present disclosure is described based on an embodiment in which the protruding insulating layer TIL and the interlayer insulating layer ILD are formed in the same process.

[0175] According to an embodiment, the separation area SPA may be defined between the first base electrode BE1 and the second base electrode BE2, and thus electrodes that may cause moisture penetration problems may be spaced apart. In particular, since the separation area SPA may form a closed loop structure, the electrodes may be more thoroughly spaced apart.

[0176] Meanwhile, the outer electrode portion OE and the outer cladding portion OCAL may be disposed adjacent to the electrode disconnecting member EDS including the protruding insulating layer TIL and the base electrode BE.

[0177] The external electrode portion OE may be formed in the same process as the second electrode ELT2 disposed in the light emitting element layer LEL. The external electrode portion OE and the second electrode ELT2 may include the same material. The external electrode portion OE and the second electrode ELT2 may include materials of the same composition. The external electrode portion OE and the second electrode ELT2 may be disposed on the same layer.

[0178] The external electrode portion OE may include a first external electrode portion OE1, a second external electrode portion OE2, and a third external electrode portion OE3 that are spaced apart from each other.

[0179] According to an embodiment, the first outer electrode portion OE1 may be disposed between the first base electrodes BE1. For example, the first base electrode BE1 may include a (1-1)th base portion 120 and a (1-2)th base portion 140, a portion of the first outer electrode portion OE1 may be disposed between the (1-1)th base portion 120 and the (1-2)th base portion 140, and another portion of the first outer electrode portion OE1 may be disposed on each of the (1-1)th base portion 120 and the (1-2)th base portion 140. Another portion of the first outer electrode portion OE1 may be disposed on the first protruding insulating layer TIL1. Another portion of the first outer electrode portion OE1 may cover a side surface of the first protruding insulating layer TIL1.

[0180] According to an embodiment, the second outer electrode portion OE2 may be disposed between the first base electrode BE1 and the second base electrode BE2. For example, the second base electrode BE2 may include a (2-1)th base portion 220 and a (2-2)th base portion 240, a portion of the second outer electrode portion OE2 may be disposed between the (1-1)th base portion 120 and the (2-1)th base portion 220, and another portion of the second outer electrode portion OE2 may be disposed between the (1-2)th base portion 140 and the (2-2)th base portion 240. According to an embodiment, in a plan view, the second outer electrode portion OE2 may be disposed between the first protruding insulating layer TIL1 and the second protruding insulating layer TIL2.

[0181] According to an embodiment, the third external electrode portion OE3 may be disposed on the second base electrode BE2. The third external electrode portion OE3 may be disposed on the second protruding insulating layer TIL2. A portion of the third external electrode portion OE3 may be disposed outside the second protruding insulating layer TIL2.

[0182] The outer cladding portion OCAL may be formed in the same process as the cladding layer CPL disposed in the light emitting element layer LEL. The outer cladding portion OCAL and the cladding layer CPL may include the same material. The outer cladding portion OCAL and the cladding layer CPL may include materials of the same composition. The outer cladding portion OCAL and the cladding layer CPL may be disposed on the same layer.

[0183] The outer cover part OCAL may include a first outer cover part OCAL1, a second outer cover part OCAL2 and a third outer cover part OCAL3.

[0184] According to an embodiment, the first outer cladding portion OCAL1 may be disposed on the first outer electrode portion OE1. The first outer cladding portion OCAL1 may completely cover an upper surface of the first outer electrode portion OE1. According to an embodiment, the first outer cladding portion OCAL1 may completely cover the first outer electrode portion OE1 disposed on an inclined side surface of the first protruding insulating layer TIL1.

[0185] According to an embodiment, the second outer clad portion OCAL2 may be disposed on the second outer electrode portion OE2. The second outer clad portion OCAL2 may completely cover an upper surface of the second outer electrode portion OE2. According to an embodiment, a portion of the second outer clad portion OCAL2 may contact a side surface of each of the exposed first and second base electrodes BE1 and BE2.

[0186] According to an embodiment, the third outer cladding portion OCAL3 may be disposed on the third outer electrode portion OE3. The third outer cladding portion OCAL3 may completely cover the upper surface of the third outer electrode portion OE3. According to an embodiment, the third outer cladding portion OCAL3 may completely cover the third outer electrode portion OE3 disposed on the inclined side surface of the second protruding insulating layer TIL2.

[0187] According to the embodiment, the outer cladding portion OCAL may completely cover the upper surface of the outer electrode portion OE, and thus the moisture penetration problem may be more thoroughly prevented.

[0188] According to the embodiment, similar to the previous embodiment, even in the case where the deposition process for forming the second electrode ELT2 is performed without a mask, the electrode disconnection member EDS including the base electrode BE and the protruding insulating layer TIL can be formed, and thus the conductive layer for forming the second electrode ELT2 can be disconnected in the peripheral area PA. Therefore, the risk of moisture penetration can be prevented while achieving fewer masks.

[0189] Meanwhile, according to an embodiment, a layer formed in the same process as the encapsulation layer TFE may not be disposed in the electrode disconnection area EDA.

[0190] For example, in forming the base encapsulation layer TFE_B (reference Fig.19 ) After being formed in the display area DA and the electrode disconnection area EDA, when an etching process (eg, dry etching) for patterning the encapsulation layer TFE is performed, a portion of the base encapsulation layer TFE_B formed in the electrode disconnection area EDA may be removed.

[0191] Therefore, a portion of the base encapsulation layer TFE_B may be used as a sacrificial layer, and the outer coating portion OCAL may be exposed in the electrode disconnection area EDA. According to an embodiment, in order to use the base encapsulation layer TFE_B as a sacrificial layer, the thickness of the base encapsulation layer TFE_B may be 200 Å. However, the present disclosure is not limited thereto.

[0192] refer to Figures 13 to 20 , describes the manufacture of a display device DD including an electrode disconnecting member EDS according to an embodiment (refer to Figure 7 For the convenience of description, the contents that may be repeated with the above contents are briefly described or not repeated.

[0193] Figures 14 to 16 Shown above reference Figure 3 At least a portion of the light emitting element layer LEL is described.

[0194] Figures 17 to 20 Shown including according to the above reference Figures 6 to 8 The electrode disconnecting member EDS of the described embodiment is at least a part of the display device DD.

[0195] Fig.13 is a flowchart illustrating a method of manufacturing a display device according to an embodiment.

[0196] Figures 14 to 20 2 is a schematic cross-sectional view for each process step showing a method of manufacturing a display device according to an embodiment. Figures 14 to 16 1 may be a schematic cross-sectional view for each process step showing the method of manufacturing the light emitting element LD according to the embodiment. Figures 17 to 20 Schematic cross-sectional views for each process step illustrating a method of manufacturing an electrode disconnecting member EDS according to an embodiment.

[0197] refer to Fig.13 , according to the manufacturing display device DD of the embodiment (refer to Figure 7 ) may include manufacturing a pixel circuit layer (S100) and manufacturing a light emitting element layer and an electrode disconnecting member (S200).

[0198] refer to Fig.13 , Fig.14 and Fig.17 In manufacturing the pixel circuit layer ( S100 ), the pixel circuit layer PCL may be formed on the base layer BSL.

[0199] In manufacturing the pixel circuit layer (S100), the pixel circuit PXC may be formed on the base layer BSL. A conductive layer or an insulating layer may be formed on the base layer BSL using a typical process for manufacturing a semiconductor device. For example, after a conductive material layer and an insulating material layer are formed on the base layer BSL by various methods (sputtering and chemical vapor deposition, etc.), a conductive layer or an insulating layer may be formed by a photolithography process. The present disclosure is not necessarily limited to a specific example.

[0200] refer to Fig.13 and Figures 14 to 20 In manufacturing the light emitting element layer and the electrode disconnecting member (S200), the electrode disconnecting member EDS may be formed in the electrode disconnecting area EDA, and the light emitting element LD may be formed in the display area DA.

[0201] refer to Fig.14 and Fig.17 , the first electrode ELT1 and the pixel defining layer PDL may be formed on the pixel circuit layer PCL in the display area DA, and the reverse tapering member RTS may be formed in the electrode disconnection area EDA in the peripheral area PA.

[0202] refer to Fig.14 , a first electrode ELT1 for forming the anode electrode ANO may be formed on the pixel circuit layer PCL in the display area DA, and the pixel defining layer PDL may be patterned such that at least a portion of the first electrode ELT1 is exposed.

[0203] refer to Fig.17 , a layer (eg, a liquid repellent material layer) for manufacturing a reverse tapered member RTS may be formed (eg, deposited) in the electrode disconnection area EDA, and the reverse tapered member RTS may be formed by further etching a lower portion of the formed layer.

[0204] Refer to the above description Figure 6 , the reverse tapered member RTS may be patterned to have a closed loop shape to surround one region. Therefore, the reverse tapered member RTS may be provided to include a first portion P1 and a second portion P2.

[0205] refer to Fig.15 , a solution process for manufacturing the light emitting part EL in the display area DA may be performed. For example, an inkjet printer PRI including an ink nozzle may discharge ink including an organic material for forming the light emitting part EL. The discharged ink may be supplied to an area surrounded by the pixel defining layer PDL, and layers for forming the light emitting part EL may be sequentially formed.

[0206] According to the embodiment, since the light emitting part EL may be formed using an inkjet printing method, the number of masks may not be further required.

[0207] refer to Fig.16 and Fig.18 , the second electrode ELT2 may be formed in the display area DA, and the electrode portion E may be formed in the electrode disconnection area EDA.

[0208] According to an embodiment, the second electrode ELT2 and the electrode portion E may be formed by a deposition process without a mask. For example, the second electrode ELT2 and the electrode portion E may be formed by depositing an electrode layer in the display area DA and the peripheral area PA without a mask.

[0209] In this step, the second electrode ELT2 deposited in the display area DA may form an upper electrode of the light emitting element LD and may contact an upper surface of the light emitting part EL.

[0210] In this step, a portion of the electrode portion E deposited in the electrode disconnection area EDA may be formed between the first portion P1 and the second portion P2 of the reverse tapered member RTS to form a first electrode portion E1. Another portion of the electrode portion E deposited in the electrode disconnection area EDA may be formed on the upper surface of the reverse tapered member RTS to form a second pre-etched electrode portion E2_B. Yet another portion of the electrode portion E deposited in the electrode disconnection area EDA may be formed outside the reverse tapered member RTS to form a third electrode portion E3.

[0211] According to an embodiment, due to the cross-sectional shape of the reverse tapered member RTS, the second pre-etched electrode portion E2_B may be physically separated from the first electrode portion E1 and the third electrode portion E3 when depositing the electrode portion E. As described above, since a plurality of portions of the electrode portion E (e.g., the second pre-etched electrode portion E2_B, the first electrode portion E1, and the third electrode portion E3) are not in physical contact with each other, a moisture permeation prevention structure may be formed.

[0212] refer to Fig.19 , an outer coating layer OCP and a base encapsulation layer TFE_B can be formed.

[0213] According to an embodiment, the outer cladding layer OCP and the base encapsulation layer TFE_B may be formed in the electrode disconnection area EDA to cover the electrode portion E and the reverse tapered member RTS.

[0214] At the same time, the outer coating layer OCP can be in the display area DA (reference Figure 7 ) is formed in the same process as the cover layer CPL. The base encapsulation layer TFE_B can be formed in the display area DA with the encapsulation layer TFE (refer to Figure 7 ) are formed in the same process.

[0215] According to an embodiment, a portion of the outer clad layer OCP may be formed on the first electrode portion E1 to form a first outer clad layer OCP1. Another portion of the outer clad layer OCP may be formed on the reverse tapered member RTS to form a second pre-etched outer clad layer OCP2_B. Yet another portion of the outer clad layer OCP may be formed outside the reverse tapered member RTS to form a third outer clad layer OCP3.

[0216] In this step, the base encapsulation layer TFE_B may cover the first outer clad layer OCP1 , the second pre-etched outer clad layer OCP2_B, and the third outer clad layer OCP3 , and may cover the side surface of the reverse tapered member RTS.

[0217] refer to Fig. 20 , combined with Fig.19 , at least a portion of each of the base encapsulation layer TFE_B, the outer cladding layer OCP, and the electrode portion E may be etched (eg, dry etched).

[0218] For example, in the electrode disconnection area EDA, the base encapsulation layer TFE_B, the outer cladding layer OCP, and the electrode portion E disposed outside the reverse tapered member RTS may be removed. In addition, in the electrode disconnection area EDA, at least a portion of each of the base encapsulation layer TFE_B, the outer cladding layer OCP, and the electrode portion E disposed on the upper surface of the reverse tapered member RTS may be removed.

[0219] At the same time, in this step, a display area DA (reference Figure 7 ) may not be etched, and may be provided as an encapsulation layer TFE covering the light emitting element LD (refer to Figure 7 ).

[0220] Thereafter, additional layers may be provided on the light emitting element layer LEL, and the above referenced Figures 6 to 8 A display device DD of the described embodiment.

[0221] and Figures 14 to 16 Reference together Figure 21 to Figure 25 , describes the manufacture of a display device DD including an electrode disconnecting member EDS according to another embodiment (refer to Fig.10 For the convenience of description, the contents that may be repeated with the above contents are briefly described or not repeated.

[0222] Figure 21 to Figure 25 Shown including according to the above reference Figures 9 to 12 The display device DD of the electrode disconnecting member EDS of the embodiment is described.

[0223] Fig.21 is a flowchart illustrating a method of manufacturing a display device according to another embodiment.

[0224] Figure 22 to Figure 25 2 is a schematic cross-sectional view for each process step showing a method of manufacturing a display device according to another embodiment. Figure 22 to Figure 25 may be schematic cross-sectional views for each process step showing a method of manufacturing an electrode disconnecting member EDS according to another embodiment.

[0225] The method of manufacturing a display device DD according to another embodiment may include manufacturing a pixel circuit layer and an electrode disconnecting member ( S100 ′) and manufacturing a light emitting element layer ( S200 ′).

[0226] The manufacturing of the pixel circuit layer and the electrode disconnecting member ( S100 ′) is different from the manufacturing of the pixel circuit layer ( S100 ) described above in that forming an electrode disconnecting member EDS is further performed.

[0227] For example, refer to Figure 22 to Figure 25 , when the pixel circuit layer PCL is formed by patterning the conductive layer and the insulating layer (reference Fig.10 ), an electrode disconnecting member EDS can be formed.

[0228] refer to Fig. 22 In this step, the pre-etched base electrode BE may be patterned on the base layer BSL (eg, the buffer layer BFL). According to an embodiment, the pre-etched base electrode BE may be patterned with the gate electrode GAT (refer to Fig.10 ) is formed in the same process. In addition, a protruding insulating layer TIL may be formed on the pre-etched base electrode BE. According to an embodiment, at least a portion of the upper surface of the pre-etched base electrode BE may be exposed through the protruding insulating layer TIL. For example, in a plan view, a portion of the pre-etched base electrode BE may protrude from the protruding insulating layer TIL.

[0229] According to an embodiment, the pre-etching of the base electrode BE may include a method for manufacturing the first base electrode BE1 (refer to Fig.23 ) of the first pre-etched base electrode BE1_B and for manufacturing the second base electrode BE2 (reference Fig.23 ). The first pre-etched base electrode BE1_B and the second pre-etched base electrode BE2_B are spaced apart from each other, and the pre-separated region is between the first pre-etched base electrode BE1_B and the second pre-etched base electrode BE2_B. The first protruding insulating layer TIL1 may cover a portion of an upper surface of the first pre-etched base electrode BE1_B, and the second protruding insulating layer TIL2 may cover a portion of an upper surface of the second pre-etched base electrode BE2_B.

[0230] refer to Fig.23 , the pre-etched substrate electrode BE can be etched (reference Fig. 22 ) at least a portion of.

[0231] According to an embodiment, at least a portion of the pre-etched base electrode BE may be etched by a wet etching process. According to an embodiment, due to the difference in etching rate between the pre-etched base electrode BE and the protruding insulating layer TIL, substantially only the pre-etched base electrode BE may be etched. Therefore, after performing the present etching process, a protruding insulating layer TIL protruding from the base electrode BE in one direction may be provided.

[0232] In this step, a portion of the first pre-etched base electrode BE1_B may be etched. Thus, a portion of the lower surface of the first protruding insulating layer TIL1 may be exposed, and the first base electrode BE1 may be provided. The first protruding insulating layer TIL1 may protrude in one direction relative to the first base electrode BE1.

[0233] In this step, a portion of the second pre-etched base electrode BE2_B may be etched. Thus, a portion of the lower surface of the second protruding insulating layer TIL2 may be exposed, and the second base electrode BE2 may be provided. The second protruding insulating layer TIL2 may protrude in one direction relative to the second base electrode BE2.

[0234] Next, manufacturing a light emitting element layer (S200') may be performed. The manufacturing of the light emitting element layer (S200') is different from the manufacturing of the light emitting element layer and the electrode disconnecting member (S200) in that forming the electrode disconnecting member EDS is not performed.

[0235] refer to Fig.24 , an outer electrode portion OE, an outer cladding portion OCAL and a base encapsulation layer TFE_B can be formed.

[0236] Further references Fig.16 In this step, the second electrode ELT2 may be formed in the display area DA, and the electrode disconnection area EDA (reference Fig.24 ) to form an outer electrode portion OE (reference Fig.24 ).

[0237] Similar to the previous embodiment, the light emitting part EL may be manufactured in the display area DA by a solution process, and then the second electrode ELT2 and the outer electrode portion OE may be deposited without a mask. Therefore, the outer electrode portion OE may have an electrode structure disconnected by an electrode disconnecting member EDS including a base electrode BE and a protruding insulating layer TIL.

[0238] In this step, a portion of the external electrode portion OE deposited in the electrode disconnection area EDA may be formed between adjacent first base electrodes BE1 to form a first external electrode portion OE1. Another portion of the external electrode portion OE deposited in the electrode disconnection area EDA may be formed between the first base electrode BE1 and the second base electrode BE2 to form a second external electrode portion OE2. Still another portion of the external electrode portion OE deposited in the electrode disconnection area EDA may be formed outside the second base electrode BE2 to form a third external electrode portion OE3.

[0239] According to an embodiment, the outer cladding portion OCAL may be aligned with the cladding layer CPL (refer to Fig.10 ) are formed in the same process.

[0240] According to an embodiment, a portion of the outer clad portion OCAL may be formed on the first outer electrode portion OE1 to form the first outer clad portion OCAL1. Another portion of the outer clad portion OCAL may be patterned on the second outer electrode portion OE2 to form the second outer clad portion OCAL2. Still another portion of the outer clad portion OCAL may be formed outside the second base electrode BE2 to form the third outer clad portion OCAL3.

[0241] In this step, the base encapsulation layer TFE_B may cover the first outer coating portion OCAL1 , the second outer coating portion OCAL2 , and the third outer coating portion OCAL3 , and may cover the side surface of the base electrode BE.

[0242] refer to Fig.25 , the substrate encapsulation layer TFE_B in the electrode disconnection area EDA can be removed (refer to Fig.24 ).

[0243] In this step, the base encapsulation layer TFE_B disposed in the electrode disconnection area EDA may be removed, and the outer cladding portion OCAL in the electrode disconnection area EDA may be exposed.

[0244] Thereafter, the light emitting element layer LEL (refer to Fig.10 ) and can be manufactured according to the above reference Figures 9 to 12 A display device DD according to another embodiment is described.

[0245] As described above, although the present disclosure has been described with reference to the above preferred embodiments, those skilled in the art or ordinary technicians in the field will understand that various modifications and changes can be made to the present disclosure without departing from the spirit and technical field of the present disclosure described in the appended claims.

[0246] Therefore, the technical scope of the present disclosure should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims

1. A display device, wherein: The display device comprises: a substrate layer including a display area and a peripheral area surrounding at least a portion of the display area; a light emitting element, disposed on the base layer in the display region, and comprising a first electrode, a second electrode, and a light emitting component disposed between the first electrode and the second electrode; an electrode disconnecting member provided on the base layer in the peripheral region; and an electrode portion disposed adjacent to the electrode disconnecting member, wherein the electrode disconnecting member comprises a reverse tapered member and has a shape of a surrounding area in a plan view, wherein the reverse tapered member includes an inner edge facing the region; wherein the electrode portion comprises a first electrode portion disposed in the region and a second electrode portion disposed on an upper surface of the reverse tapered member along the inner edge, and Wherein, the first electrode portion and the second electrode portion are physically separated from each other.

2. The display device according to claim 1, wherein: The display device further includes: an outer coating layer, disposed on the electrode portion, The light emitting element further comprises a coating layer disposed on the second electrode and comprising the same material as the outer coating layer, and Wherein, at least a portion of the outer coating layer and the second electrode portion expose at least a portion of the upper surface of the reverse tapered member.

3. The display device according to claim 2, wherein: The display device further includes: an outer packaging layer, disposed on the outer cladding layer; and an encapsulation layer, disposed on the cladding layer in the display region and comprising the same material as the outer encapsulation layer, The outer packaging layer exposes at least a portion of the upper surface of the reverse tapered member and covers a side surface of the reverse tapered member facing the region.

4. The display device according to claim 1, wherein: The electrode disconnecting member includes a plurality of electrode disconnecting members, and The plurality of electrode disconnecting members form an electrode disconnecting area surrounding the display area.

5. The display device according to claim 4, wherein: The plurality of electrode disconnecting members are sequentially arranged in a first direction and a second direction different from the first direction.

6. A display device, wherein: The display device comprises: a substrate layer including a display area and a peripheral area surrounding at least a portion of the display area; a light emitting element disposed on the base layer in the display region and comprising a first electrode, a second electrode, and a light emitting component disposed between the first electrode and the second electrode; and an electrode disconnecting member provided on the base layer in the peripheral region, wherein the electrode disconnecting member comprises a base electrode and a protruding insulating layer disposed on the base electrode, The substrate electrode comprises a first substrate electrode and a second substrate electrode which are spaced apart from each other. The protruding insulating layer includes a first protruding insulating layer disposed on the first base electrode and a second protruding insulating layer disposed on the second base electrode. wherein, in a plan view, at least a portion of the protruding insulating layer protrudes from the base electrode, and Wherein, a separation region having a closed loop structure is formed between the first base electrode and the second base electrode.

7. The display device according to claim 6, wherein: The light emitting element further includes a coating layer disposed on the second electrode, Wherein, the display device further comprises an encapsulation layer arranged on the cladding layer, and The encapsulation layer is disposed in the display region, but not in an electrode disconnection region where the electrode disconnection member is disposed.

8. The display device according to claim 6, wherein: The display device further includes: A pixel circuit is arranged on the substrate layer. The substrate electrode and any one of the plurality of electrodes forming the pixel circuit include the same material.

9. The display device according to claim 8, wherein: The base electrode is disposed between the protruding insulating layer and the base layer, and The base electrode comprises a conductive material, the protruding insulating layer comprises an insulating material, and an etching rate of the base electrode and an etching rate of the protruding insulating layer are different from each other.

10. The display device according to claim 6, wherein: The display device further includes: an outer electrode portion disposed on the protruding insulating layer; and An outer covering portion is provided on the outer electrode portion, Herein, at least a portion of the external electrode portion is disposed on an inclined side surface of the protruding insulating layer, and the outer covering portion covers at least a portion of the external electrode portion disposed on the inclined side surface.

11. A method for manufacturing a display device, the display device comprising a display area and a peripheral area surrounding at least a portion of the display area, wherein: The method comprises: forming a pixel circuit; and forming a light emitting element layer provided on the pixel circuit and including a light emitting element electrically connected to the pixel circuit, Wherein, forming the light emitting element layer comprises: forming a pixel defining layer on a base layer in the display region, and forming a reverse tapered member on the base layer in the peripheral region; forming a light emitting member in a region surrounded by the pixel defining layer in the display region; and forming an electrode layer in the display area and the peripheral area, wherein the reverse tapering member surrounds a region and includes an inner edge facing the region, wherein the electrode layer includes an electrode portion disposed in the peripheral region, and Wherein, the electrode part comprises: a first electrode portion disposed in the region; and The second electrode portion is disposed on the upper surface of the reverse tapered member.

12. The method according to claim 11, wherein: The forming of the light emitting member includes discharging an organic material for forming the light emitting member by using an inkjet printing method.

13. The method according to claim 11, wherein: The forming of the pixel defining layer and the forming of the reverse tapering member are performed in the same process.

14. The method according to claim 11, wherein: The forming the electrode layer includes separating the first electrode portion and the second electrode portion without using a mask.

15. The method according to claim 11, wherein: The method further comprises: At least a portion of the second electrode portion disposed on the upper surface of the reverse tapered member is removed.

16. A method for manufacturing a display device, the display device comprising a display area and a peripheral area surrounding at least a portion of the display area, the method comprising: forming a pre-etched substrate electrode on the substrate layer in the peripheral region; forming a protruding insulating layer on the pre-etched base electrode in the peripheral region; as well as At least a portion of the pre-etched base electrode disposed below the protruding insulating layer is removed.

17. The method according to claim 16, wherein: The removing the at least a portion of the pre-etched base electrode comprises a wet etching process.

18. The method according to claim 16, wherein: The forming of the pre-etched base electrode is performed simultaneously with forming an electrode in the display area, and Wherein, the forming of the protruding insulating layer is performed simultaneously with the forming of the insulating layer in the display area.

19. The method according to claim 16, wherein: The method further comprises: forming a light emitting element layer in the display region, the light emitting element layer including a first electrode, a second electrode, and a light emitting component disposed between the first electrode and the second electrode, and When forming the second electrode, an outer electrode portion is formed on the protruding insulating layer in the peripheral region, The pre-etched substrate electrode comprises a first pre-etched substrate electrode and a second pre-etched substrate electrode which are spaced apart from each other, and the pre-separated region is between the first pre-etched substrate electrode and the second pre-etched substrate electrode, and The external electrode portion includes a first external electrode portion and a second external electrode portion that are physically spaced apart from each other, and the protruding insulating layer is interposed between the first external electrode portion and the second external electrode portion.

20. The method according to claim 19, wherein: The method further comprises: forming an outer coating portion on the outer electrode portion; forming an outer packaging layer on the outer covering portion; and The outer coating portion is exposed by removing the outer packaging layer disposed on the outer coating portion.

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