Nail oil seal layer adhesive composition, nail oil seal layer adhesive and preparation method and curing method of nail oil seal layer adhesive

Abstract

The invention relates to the field of nail oil adhesives, in particular to a nail oil seal adhesive composition, a nail oil seal adhesive and a preparation method and a curing method of the nail oil seal adhesive. According to the nail oil seal adhesive provided by the invention, the heat release influence is reduced by utilizing the steric effect of methyl of methacrylic acid-2-hydroxyethyl ester, and the bifunctional resin CR90631 is selected to replace a part of trifunctional resin CR91517, so that the heat release is reduced, and the adhesive is free of pain in the curing process. The thiol modified polyester acrylate resin CR92509 is selected, so that the problems of strong pungent smell, poor storage stability and the like caused by the fact that a common sealing layer is added with thiol to reduce the influence of oxygen inhibition are solved, and not only is the pungent smell avoided, but also the storage stability is good. The trifunctional resin CR91517 is also selected as a main body substance, so that the compactness of a formed film can be fully improved, and the coating has obvious advantages in alcohol scrubbing resistance and scratch resistance.

Description

Technical Field

[0001] The invention relates to the field of nail polish glue, in particular to a nail polish sealant glue composition and a nail polish sealant glue and a preparation method and a curing method thereof. Background Art

[0002] Traditional nail polish contains a lot of organic solvents, which pollute the environment and are harmful to the human body. UV-LED curing nail polish has no VOC emissions, excellent performance and broad market prospects. Nail polish can be divided into base glue, color glue and sealant, among which the sealant performance requirements are high. The early sealant of UV nail polish commonly used by people needs to be scrubbed with alcohol after curing; followed by the wash-free sealant, which does not need to be scrubbed after curing. UV-LED nail polish sealant appeared as people's requirements for sealants are increasing, and currently occupies a mainstream position in the market. With the growth of the national economy, people's requirements for nail polish sealants are getting higher and higher, and solving the problem of nail polish sealants is also becoming increasingly important. The problems of existing sealants are mainly: large heat release during curing, unstable storage, strong odor, poor alcohol resistance and scratch resistance of the coating. Summary of the invention

[0003] In view of this, the technical problem to be solved by the present invention is to provide a nail polish sealant composition and a nail polish sealant and a preparation method and a curing method thereof. The nail polish sealant obtained by the nail polish sealant composition provided by the present invention has stable storage, small odor, small heat release during curing, and good alcohol resistance and scratch resistance after curing.

[0004] The present invention provides a nail polish sealant composition, which comprises, by weight:

[0005] Trifunctional aliphatic urethane acrylate resin: 50-70 parts; the trifunctional aliphatic urethane acrylate resin is selected from at least one of CR91517 and CR91540;

[0006] Difunctional aliphatic urethane acrylate resin: 10-20 parts; the difunctional aliphatic urethane acrylate resin is selected from at least one of CR90631 and HP6220;

[0007] Thiol-modified polyester acrylate resin: 10-30 parts; the thiol-modified polyester acrylate resin is selected from at least one of CR92509 and HU9310;

[0008] 2-Hydroxyethyl methacrylate: 5-15 parts;

[0009] Photoinitiator: 4~10 parts.

[0010] The invention aims at solving the existing problems, studies the influence of resin, photoinitiator, monomer and nail polish sealant formula on the sealant performance and heat release performance during curing, optimizes the formula to prepare a nail polish sealant with excellent performance, and optimizes heat release, storage stability, alcohol scrubbing resistance, odor and the like.

[0011] The nail polish sealant composition of the present invention comprises 50 to 70 parts of a trifunctional aliphatic urethane acrylate resin, preferably 55 to 65 parts. The trifunctional aliphatic urethane acrylate resin of the present invention, as the main film-forming substance, has advantages over other 100% UV resins, has excellent reactivity, good gloss retention after curing, low yellowing after curing, and good thiol stability, thereby providing excellent performance and storage stability in the seal film formation. The trifunctional aliphatic urethane acrylate resin of the present invention is selected from at least one of CR91517 and CR91540, preferably selected from CR91517 of Guangdong Haohui Company.

[0012] The nail polish sealant composition of the present invention comprises 10 to 20 parts of a difunctional aliphatic urethane acrylate resin, preferably 15 to 20 parts. The difunctional aliphatic urethane acrylate resin of the present invention has good yellowing resistance, extremely fast curing, and good flexibility. As a secondary film-forming substance, it provides film flexibility and yellowing resistance, and as a difunctional resin, it can also reduce heat release energy. The difunctional aliphatic urethane acrylate resin of the present invention is selected from at least one of CR90631 and HP6220, preferably selected from CR90631 of Guangdong Haohui Company.

[0013] The nail polish sealant composition of the present invention comprises 10 to 30 parts of a thiol-modified polyester acrylate resin, preferably 15 to 25 parts. The thiol-modified polyester acrylate resin of the present invention is a thiol-modified polyester acrylate resin, which has a lower odor, good compatibility and storage stability. The thiol resin can inhibit oxygen inhibition, thereby significantly improving the curing speed of the system, improving the compactness of the film, and thus improving the chemical resistance of the paint film. The thiol-modified polyester acrylate resin of the present invention is selected from at least one of CR92509 and HU9310, preferably selected from CR92509 of Guangdong Haohui Company.

[0014] The nail polish sealant composition of the present invention comprises 5 to 15 parts of 2-hydroxyethyl methacrylate, preferably 7 to 13 parts. The 2-hydroxyethyl methacrylate of the present invention is a monofunctional monomer with low viscosity and can be used as an active diluent. Moreover, the 2-hydroxyethyl methacrylate contains a methyl group. Due to the steric effect of the methyl group, the monomer with a methyl group usually has a lower curing exothermic characteristic than the monomer without a methyl group during the curing process, so the exothermic effect can be reduced. In certain embodiments of the present invention, the 2-hydroxyethyl methacrylate is selected from HEMA of Guangdong Haohui Company.

[0015] The nail polish sealant composition of the present invention comprises 4 to 10 parts of a photoinitiator, preferably 4 to 8 parts. The photoinitiator of the present invention is selected from 2 to 5 parts of 1-hydroxy-cyclohexyl-benzyl ketone and 2 to 5 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, preferably selected from 2 to 4 parts of 1-hydroxy-cyclohexyl-benzyl ketone and 2 to 4 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide. The 1-hydroxy-cyclohexyl-benzyl ketone of the present invention is a highly efficient free radical initiator; the 2,4,6-trimethylbenzoyl-diphenylphosphine oxide is a highly efficient free radical initiator, which plays a role in deep curing in the UV system. In certain embodiments of the present invention, the 1-hydroxy-cyclohexyl-benzyl ketone is selected from the photoinitiator C184; the 2,4,6-trimethylbenzoyl-diphenylphosphine oxide is selected from the photoinitiator TPO.

[0016] The nail polish sealant composition of the present invention further comprises: 0.5-1 part of a leveling agent; 0.2-0.5 part of a defoaming agent. In certain embodiments of the present invention, the leveling agent is selected from at least one of BYK333 and TEGO450; and the defoaming agent is selected from at least one of TEGO920 and EFKA-2770.

[0017] In one embodiment of the present invention, the nail polish sealant composition comprises:

[0018] CR91517: 50~70 copies;

[0019] CR90631: 10~20 copies;

[0020] CR92509: 10~30 copies;

[0021] 2-Hydroxyethyl methacrylate: 5-15 parts;

[0022] C184 photoinitiator 2-5 parts;

[0023] TPO photoinitiator 2~5 parts;

[0024] BYK333 leveling agent: 0.5~1 part;

[0025] TEGO920 defoamer: 0.2~0.5 parts.

[0026] The present invention also provides a nail polish sealant prepared from the nail polish sealant composition described in any of the above technical solutions. The present invention also provides a method for preparing the nail polish sealant, comprising the following steps: dissolving and dispersing the nail polish sealant composition described in any of the above technical solutions, removing bubbles, filtering, and obtaining a nail polish sealant. Specifically, the present invention first heats 2-hydroxyethyl methacrylate and a photoinitiator at 45-55°C to dissolve, then adds a trifunctional aliphatic urethane acrylate resin, a difunctional aliphatic urethane acrylate resin, a thiol-modified polyester acrylate resin, a leveling agent, and a defoaming agent to the resulting mixture, and disperses it at a speed of 800-1000 rpm for 15-25 minutes to fully disperse the components; the dispersed mixture is allowed to stand at 45-55°C to remove bubbles or vacuum remove bubbles, and then filtered at 250-350 mesh to obtain a nail polish sealant.

[0027] The present invention also provides a method for curing the above-mentioned nail polish sealant, comprising the following steps:

[0028] The substrate coated with the nail polish sealant is irradiated with ultraviolet light; the substrate includes a nail or a nail plate; the power of the ultraviolet light is 24 W to 48 W, preferably 48 W; the irradiation time is 0.8 to 1.2 min, preferably 1 min. In some embodiments of the present invention, the light source of the ultraviolet light is an ultraviolet LED light source.

[0029] The present invention provides a nail polish sealant composition and a nail polish sealant and a preparation method and a curing method thereof. The nail polish sealant provided by the present invention is optimized based on the problems existing in traditional nail polish sealants. Specifically, the nail polish sealant provided by the present invention aims at the main problems existing in the existing sealants, namely, large heat release during curing, unstable storage, large odor, and poor alcohol resistance of the coating film. The heat release effect is reduced by utilizing the steric hindrance effect of the methyl group of 2-hydroxyethyl methacrylate, and the difunctional resin CR90631 is selected to replace a part of the trifunctional resin CR01517, which also reduces heat release, so that the glue is painless during the curing process. The present invention selects the mercaptan-modified polyester acrylate resin CR92509 to overcome the problems of the commonly used sealants, such as large irritating odor and poor storage stability, which are caused by adding mercaptan to reduce the effect of oxygen inhibition. It not only has no irritating odor, but also has good storage stability. The present invention also selects trifunctional resin CR91517 as the main material, which can fully improve the compactness of the film, thereby having obvious advantages in alcohol scrubbing resistance and scratch resistance.

[0030] It can be seen that the traditional nail polish sealant not only contains a large amount of organic solvents, pollutes the environment, is harmful to the human body, but also has poor performance. The nail polish sealant provided by the present invention has advantages that the traditional nail polish sealant cannot match, not only has low odor, good storage stability, can withstand alcohol scrubbing without losing gloss, low curing heat release, good scratch resistance, etc., but also can be cured by UV-LED, has no VOC emissions, and has broad market prospects. DETAILED DESCRIPTION

[0031] The present invention discloses a nail polish sealant composition and a nail polish sealant and a preparation method and a curing method thereof. A person skilled in the art can refer to the content of this article and appropriately improve the process parameters to achieve the above. It should be particularly noted that all similar substitutions and modifications are obvious to a person skilled in the art and are considered to be included in the present invention. The method and application of the present invention have been described through preferred embodiments, and relevant personnel can obviously modify or appropriately change and combine the method and application of this article without departing from the content, spirit and scope of the present invention to achieve and apply the technology of the present invention.

[0032] The nail polish sealant according to the specific embodiment of the present invention has the following raw material weight ratio:

[0033] Trifunctional aliphatic urethane acrylate resin (CR91517 of Guangdong Haohui Company): 50~70;

[0034] Difunctional aliphatic urethane acrylate resin (CR90631 of Guangdong Haohui Company): 10~20;

[0035] Mercaptan-modified polyester acrylate resin (CR92509 from Guangdong Haohui Company): 10~30;

[0036] 2-Hydroxyethyl methacrylate (HEMA from Guangdong Haohui Company): 5~15;

[0037] 1-Hydroxy-cyclohexyl-phenyl ketone (photoinitiator C184): 2~5;

[0038] 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide (photoinitiated TPO): 2~5;

[0039] Leveling agent (BYK333 from BYK): 0.5~1;

[0040] Defoaming agent (TEGO920 from Digo Company): 0.2~0.5.

[0041] The present invention will be further described below in conjunction with embodiments:

[0042] Embodiment 1~5

[0043] According to the weight ratio of the raw materials in Table 1, the nail polish sealant of Examples 1 to 5 was prepared.

[0044] Table 1

[0045]

[0046] The preparation method of the nail polish sealant of embodiments 1 to 5 of the present invention specifically comprises the following steps:

[0047] Step 1: Mix 2-hydroxyethyl methacrylate, photoinitiator C184 and TPO, and dissolve them in a 50°C oven;

[0048] Step 2: Add trifunctional aliphatic urethane acrylate resin, difunctional aliphatic urethane acrylate resin, thiol-modified polyester acrylate resin, leveling agent BYK333, and defoamer TEGO920 to the mixture obtained in step 1, and disperse at a speed of 1000 rpm for 20 minutes to fully disperse the components;

[0049] Step 3: Place the mixture obtained in step 2 in a 50° C. oven to remove air bubbles or place it in a vacuum box to remove air bubbles, and then filter it with a 300-mesh filter cloth to obtain a UV-LED nail polish sealant.

[0050] The nail polish sealant of the present invention is used for coating and curing according to the following conditions:

[0051] Material: Nail / Nail

[0052] UV radiation curing conditions: Nail lamp type: UV-LED; Nail lamp output power: ≤48W; Curing time: 1 minute;

[0053] Coating and curing process: nail piece → polishing and cleaning → applying primer → UV-LED lamp curing → applying color glue → UV-LED lamp curing → applying sealing layer → UV-LED lamp curing.

[0054] Specifically, when polishing the nail surface, it is sufficient to polish until no gloss is visible on the nail surface. After cleaning the grease and dust on the nail with clean water, apply the primer, cure it with UV-LED light for 60 seconds, apply the color glue, cure it with UV-LED light for 60 seconds, and finally apply the high-performance sealing glue of the present invention, and cure it with UV-LED light for 60 seconds.

[0055] The nail polish sealant of Examples 1 to 5 was prepared under the above process conditions and cured by coating, and tested. The results are shown in Table 2:

[0056] Table 2

[0057]

[0058] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A nail polish sealant composition, characterized in that: In parts by weight, it includes: Trifunctional aliphatic urethane acrylate resin: 50-70 parts; the trifunctional aliphatic urethane acrylate resin is selected from at least one of CR91517 and CR91540; Difunctional aliphatic urethane acrylate resin: 10-20 parts; the difunctional aliphatic urethane acrylate resin is selected from at least one of CR90631 and HP6220; Thiol-modified polyester acrylate resin: 10-30 parts; the thiol-modified polyester acrylate resin is selected from at least one of CR92509 and HU9310; 2-Hydroxyethyl methacrylate: 5-15 parts; Photoinitiator: 4~10 parts.

2. The nail polish sealant composition according to claim 1, characterized in that: include: Trifunctional aliphatic urethane acrylate resin: 50-70 parts; Difunctional aliphatic urethane acrylate resin: 10-20 parts; Mercaptan-modified polyester acrylate resin: 10-30 parts; 2-Hydroxyethyl methacrylate: 5-15 parts; 1-Hydroxy-cyclohexyl-phenyl ketone: 2-5 parts; 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide: 2-5 parts.

3. The nail polish sealant composition according to claim 2, characterized in that: include: Trifunctional aliphatic urethane acrylate resin: 55-65 parts; Difunctional aliphatic urethane acrylate resin: 15-20 parts; Mercaptan-modified polyester acrylate resin: 15-25 parts; 2-Hydroxyethyl methacrylate: 7-13 parts; 1-Hydroxy-cyclohexyl-phenyl ketone: 2-4 parts; 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide: 2-4 parts.

4. The nail polish sealant composition according to claim 1, characterized in that: Also includes: Leveling agent: 0.5~1 part; Defoaming agent: 0.2~0.5 parts.

5. The nail polish sealant composition according to claim 4, characterized in that: The leveling agent is selected from at least one of BYK333 and TEGO450.

6. The nail polish sealant composition according to claim 4, characterized in that: The defoaming agent is selected from at least one of TEGO920 and EFKA-2770.

7. The nail polish sealant composition according to claim 1, characterized in that: include: CR91517: 50~70 copies; CR90631: 10~20 copies; CR92509: 10~30 copies; 2-Hydroxyethyl methacrylate: 5-15 parts; C184 photoinitiator 2-5 parts; TPO photoinitiator 2~5 parts; BYK333 leveling agent: 0.5~1 part; TEGO920 defoamer: 0.2~0.5 parts.

8. A nail polish sealant prepared from the nail polish sealant composition according to any one of claims 1 to 7.

9. The method for preparing the nail polish sealant according to claim 8, characterized in that: The following steps are involved: After dissolving and dispersing the nail polish sealant composition according to any one of claims 1 to 7, removing bubbles and filtering, a nail polish sealant is obtained.

10. The method for curing nail polish sealant according to claim 8, characterized in that: The following steps are involved: The substrate coated with the nail polish sealant is subjected to ultraviolet irradiation treatment; The power of the ultraviolet light is 24 W to 48 W; The irradiation treatment time is 0.8-1.2 min.

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