Laser welding equipment capable of adjusting welding target

Abstract

The invention discloses welding equipment capable of adjusting a welding target. The welding equipment comprises a workbench, a pickup head and a welding device, the workbench is used for bearing a circuit substrate. The circuit substrate comprises a plurality of pixels arranged at intervals. The pick-up head is arranged on the workbench, can move relative to the workbench, and is used for transposing a plurality of photoelectric elements to relative positions of the circuit substrate. The welding device is arranged on the workbench and comprises a laser source, a light modulator and a processor. The laser source is used for generating a main laser beam. The light modulator is connected with the processor to modulate the main laser beam. The processor controls the light modulator to project a plurality of welding beams to the circuit substrate within a target range according to a product pattern so as to weld the welding positions of the plurality of pixels and the plurality of photoelectric elements. The product pattern includes welding positions corresponding to a plurality of pixels of the circuit substrate.

Description

Technical Field

[0001] The invention relates to welding equipment, in particular to laser welding equipment capable of adjusting welding targets. Background Art

[0002] During the production process, the display screen composed of micro optoelectronic components needs to repeat the steps of picking up, transposing and welding to achieve mass or batch transfer. In this production process, each repeated operation takes a period of time, resulting in poor production efficiency.

[0003] Among them, the current laser welding technology after mass or batch transfer can only be fixed-focus and weld one at a time. Fixed focus means that the laser focus is fixed. Therefore, during welding, the display circuit substrate (product) can only be moved continuously by the platform to make the welded pixel be located at the laser focus position. Furthermore, when the circuit substrate is replaced, personnel need to go through multiple settings to complete the pixel configuration of the replaced circuit substrate, which is not conducive to mass production.

[0004] In addition, for the circuit substrate that needs to be repaired, the pixel positions that need to be repaired are relatively scattered. Therefore, the current laser welding can only repair them one by one, and cannot repair multiple positions at a time, which will also consume more repair time. Summary of the invention

[0005] In view of the above shortcomings, the laser welding device with adjustable welding target of the present invention can be adjusted according to the pixel configuration relationship of the circuit substrate to perform welding operations. In addition, during the repair operation, the laser welding device can adjust the projection position of the welding beam according to the position distribution of the pixels to perform a single multi-point repair operation.

[0006] In order to achieve the above-mentioned purpose, the laser welding equipment with adjustable welding target of the present invention includes a workbench, a pickup head and a welding device. The workbench is used to carry a circuit substrate. The circuit substrate includes a plurality of pixels arranged at intervals. Each of the plurality of pixels includes a welding position. The pickup head is arranged on the workbench and can move relative to the workbench, and has a pickup range. The pickup range is used to transpose a plurality of photoelectric components to relative positions of the circuit substrate. The plurality of photoelectric components correspond to welding positions of a plurality of pixels. The welding device is arranged on the workbench and includes a laser source, a light modulator and a processor. The laser source is used to generate a main laser beam. The light modulator is connected to the processor and is used to receive the main laser beam. The processor is used to control the light modulator to project multiple welding beams to the corresponding range of the circuit substrate within a target range according to a product pattern, so that the welding positions of the plurality of pixels and the plurality of photoelectric components that act on the multi-welding beams form welding. The product pattern includes welding positions of the plurality of pixels corresponding to the circuit substrate.

[0007] Thus, the processor of the laser welding device with adjustable welding target of the present invention can plan the multiple welding beams projected by the light modulator according to the product pattern to correctly act on the welding position of the target pixel to meet the needs of replacing the circuit substrate and repairing operations.

[0008] The detailed structure or features of the laser welding device with adjustable welding target provided by the present invention will be described in the detailed description of the following embodiments. However, those skilled in the art should understand that the detailed description and the specific embodiments listed for implementing the present invention are only applicable to the description of the present invention and are not intended to limit the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the composition of the laser welding device with adjustable welding target of the present invention;

[0010] Figure 2 yes Figure 1 A schematic diagram of the composition of the welding device 15 and an embodiment of projecting a welding beam onto a circuit substrate;

[0011] Figure 3 yes Figure 1 A schematic diagram of another embodiment of the composition of the welding device 15 and the projection of the welding beam onto the circuit substrate;

[0012] Figure 4 yes Figure 1 A schematic diagram of the pickup head transferring the photoelectric component to the circuit substrate for welding;

[0013] Figure 5 yes Figure 1 Another schematic diagram of the pick-up head transposing the photoelectric component on the circuit substrate for welding;

[0014] Wherein, the reference numerals are:

[0015] 10: Laser welding equipment

[0016] 11: Workbench

[0017] 13: Pickup head

[0018] 131: Pickup range

[0019] 15: Welding device

[0020] 151: Laser Source

[0021] 1511: Light source unit

[0022] 1513: Shaping unit

[0023] 1515: Reflector

[0024] 153: Optical Modulator

[0025] 155: Processor

[0026] 17: Machine Vision Device

[0027] 30: Circuit board

[0028] 31: Pixels

[0029] 33,35,37: welding position

[0030] 50: Wafer

[0031] 51: Photoelectric components

[0032] 15a: Welding device

[0033] 151a: Laser source

[0034] 1511a: Light source unit

[0035] 1513a: Stabilizer

[0036] 1515a: Beam Expander

[0037] 1517a: Reflector

[0038] 153a: Optical Modulator

[0039] 155a: Processor

[0040] 157a: Slingshot

[0041] 1571a: Relay

[0042] 1573a: Output unit. DETAILED DESCRIPTION

[0043] The applicant first explains that in the entire specification, including the embodiments described below and the claims of the patent application scope, the terms related to directions are based on the directions in the drawings. Secondly, in the embodiments and drawings to be described below, the same element numbers represent the same or similar elements or their structural features.

[0044] like Figure 1 As shown, the laser welding equipment 10 with adjustable welding targets of the present invention includes a workbench 11 , a pickup head 13 , a welding device 15 and a machine vision device 17 .

[0045] The workbench 11 is used to carry a circuit substrate 30 and a wafer 50. The circuit substrate 30 includes a supporting substrate and a plurality of pixels 31 formed on the supporting substrate. The supporting substrate can be glass or a soft board, etc. The plurality of pixels 31 are conductive circuits arranged at intervals. Each of the plurality of pixels 31 includes three welding positions 33, 35, and 37, and the three welding positions 33, 35, and 37 are respectively used to weld photoelectric elements of corresponding colors (such as red, blue and green). In other embodiments, the number of welding positions can be less or more, such as one less, and more than three, to provide welding positions for repair. The wafer 50 includes a plurality of photoelectric elements 51.

[0046] The pick-up head 13 is disposed on the workbench 11 and can move relative to the workbench 11, and has a pick-up range 131. The pick-up range 131 is used to transpose multiple photoelectric components to relative positions of the circuit substrate 30. The pick-up head 13 can pick up a specific number of photoelectric components 51 from the wafer 50, and the number depends on the ability of the pick-up head 13. The picked-up photoelectric components 51 can correspond to multiple pixels 31, so that the pick-up head 13 can transpose the photoelectric components 51 to the relative position or target position of the circuit substrate 30.

[0047] The welding device 15 is disposed on the workbench 11 and can move relative to the workbench 11, and is used to weld the photoelectric element 51 transferred to the circuit substrate 30 through a welding beam. The welding device 15 can be moved relative to the workbench 11 by a gantry, a slide rail, or a robotic arm, so that the welding device 15 can be moved to the target position.

[0048] The machine vision device 17 is disposed on the workbench 11 and connected to the welding device 15, and is used to form a product pattern according to the spatial distribution of the plurality of pixels 31 of the circuit substrate 30. In other words, the product pattern includes welding positions corresponding to the plurality of pixels 31. The welding device 15 plans a target range according to the distribution of welding positions 33, 35, 37 of the pixels 31 in the product pattern. The target range may include a plurality of pixels 31 arranged in a matrix (such as Figure 4 ) or a plurality of scattered pixels 31 (as shown Figure 5 shown).

[0049] In other embodiments, when the pixel distribution information of the circuit substrate 30 is known, that is, the product pattern is known, the machine vision device 17 can be omitted, and the welding device 15 can directly use the product pattern to plan the target range.

[0050] like Figure 2As shown, the welding device 15 includes a laser source 151, a light modulator 153 and a processor 155. The laser source 151 is used to generate a main laser beam. In this embodiment, the laser source 151 includes a light source unit 1511, a shaping unit 1513 and a reflector 1515. The light source unit 1511 is used to generate a laser beam. The shaping unit 1513 is used to receive the laser beam and shape it into the main laser beam. The shaping unit 1513 is, for example, a beam shaper. The reflector 1515 is used to reflect the main laser beam to the light modulator 153. The light modulator 153 is connected to the processor 155 and is used to receive and modulate the main laser beam. The light modulator 153 is, for example, a digital microlens device (DMD). The processor 155 is used to obtain the distribution of welding positions 33, 35, and 37 of the pixels 31 of the circuit substrate 30 according to the product pattern, and control the light modulator 153 to project multiple welding beams within a target range to the corresponding range of the circuit substrate 30, so that the welding positions of the pixels acted upon by the multiple welding beams and the photoelectric components form welding. Figure 2 The circuit board 30 is used to indicate that it can receive multiple welding beams, and the circuit board 30 is omitted. Figure 1 The interaction between the pickup head and the circuit substrate 30 and the pixels of the circuit substrate 30.

[0051] In this embodiment, the beam shaper shapes the Gaussian distributed laser beam into a main laser beam with a flat-top distribution, so that the lenses of the digital micromirror device receive lasers with the same energy density. The same digital micromirror device controls or drives the deflection of the micromirrors arranged in a matrix through the output signal of the processor 155, so that the main laser beam generates multiple welding beams that are projected onto the corresponding range of the circuit substrate 30.

[0052] In this way, the processor 155 can dynamically adjust the number and projection position of the welding beams according to the product pattern, thereby achieving the purpose of not having to replace hardware parts.

[0053] like Figure 3As shown, the welding device 15a includes a laser source 151a, a light modulator 153a, a processor 155a and a projector 157a. The laser source 151a includes a light source unit 1511a, a stabilizer (ATT) 1513a, a beam expander 1515a and a reflector 1517a. The light source unit 1511a is used to generate a laser beam. The stabilizer 1513a receives the laser beam to ensure better laser stability at low energy. The beam expander 1515a receives the laser beam projected from the stabilizer 1513a to make the laser beam conform to the main laser beam of the spot size required by the light modulator 153a. The reflector 1517a is used to reflect the main laser beam to the light modulator 153a. The light modulator 153a is, for example, a spatial light modulator (SLM), which is a component for receiving the main laser beam and modulating the phase, amplitude, polarization, etc. of the main laser beam. The processor 155a is connected to the light modulator 153a and is used to obtain the welding position distribution of the pixels of the circuit substrate according to the product pattern and control the spatial light modulator.

[0054] In this embodiment, the processor 155a is used to control the light modulator 153 to project multiple welding beams within the target range to the corresponding range of the circuit substrate 30 according to the product pattern, so that the welding positions of the pixels and the photoelectric elements that are acted upon by the multiple welding beams are welded. The generation of the multiple welding beams is achieved by the processor controlling the liquid crystal deflection of the spatial light modulator to reflect the multiple welding beams.

[0055] The projector 157a includes a relay 1571a and an output unit 1573a. The relay 1571a is used to receive the reflected welding beams and transmit them to the output unit 1573a. The output unit 1573a is used to project the welding beams to the corresponding range of the circuit substrate 30. Figure 3 The circuit board 30 is used to indicate that it can receive multiple welding beams, and the circuit board 30 is omitted. Figure 1 The interaction between the pickup head and the circuit substrate 30 and the pixels of the circuit substrate 30.

[0056] In this way, the processor 155a can control the spatial light modulator through electrical signals or optical signals according to the product pattern, thereby achieving the purpose of dynamically adjusting the number and projection position of the welding light beam without replacing hardware parts.

[0057] The target range is related to the picking range. In order to efficiently weld a batch of optoelectronic components, the optoelectronic components that need to be welded within the target range can be completed in a single pass, eliminating the time spent on repeated picking, alignment, and transposition.

[0058] It can be seen from the above description that the laser welding device of the present invention can realize dynamic or flexible generation of multiple welding beams, and then the projection state of the multiple welding beams within the target range is described.

[0059] like Figure 4 As shown, the pickup range 131 of the pickup head 13 can pick up 2*2 photoelectric components 51. When transferred to the circuit substrate 30, the photoelectric components 51 are connected to the welding positions 33 of the four pixels 31. The processor defines the target range A according to the product pattern of the circuit substrate 30 and the pickup range of the pickup head 13. Therefore, the processor can control the light modulator to generate four welding beams to allow the welding positions 33 and the photoelectric components 51 to be welded together.

[0060] like Figure 5 As shown, compared to Figure 4 , the processor 155 can control the scattered laser beams of the optical modulator to meet the scattered welding needs, such as repair. The pickup range 131 of the pickup head 13 can pick up 3*3 photoelectric elements 51. When transferred to the circuit substrate 30, the photoelectric element 51 is connected to the welding position 35 of the pixel 31. In order to clearly show the repair position in the figure, the photoelectric element 51 that does not need to be repaired is omitted. This embodiment takes repair as an example. The position of the photoelectric element 51 in the figure represents the target to be repaired, and it can be found that the welding position 35 is scattered. After the processor knows the target, it can plan the target range A through the product pattern of the circuit substrate 30 so that the welding beam can correctly act on the target welding position 35. In this way, the processor controls the optical modulator to generate a corresponding welding beam to allow the welding position 35 to be welded together with the photoelectric element 51.

[0061] The laser welding equipment with adjustable welding targets of the present invention can process the information of the product pattern, image or photo of the target substrate through the processor of the welding device to identify the welding position of the pixel, and thereby control the light modulator to modulate the main laser beam into the required multi-welding beam to correctly act on the welding position of the target pixel, thereby achieving the purpose of adjustable target welding.

[0062] Finally, the constituent elements disclosed in the aforementioned embodiments of the present invention are only for illustration and are not intended to limit the scope of the present invention. Replacements or changes of other equivalent elements should be covered by the patent application scope of the present invention.

Claims

1. A laser welding device with adjustable welding target, characterized in that: include: A workbench for carrying a circuit substrate, the circuit substrate comprising a plurality of pixels arranged at intervals, each of the plurality of pixels comprising a welding position; a pickup head, disposed on the workbench and movable relative to the workbench, and having a pickup range, the pickup range being used to transpose a plurality of photoelectric components to relative positions of the circuit substrate, the plurality of photoelectric components corresponding to welding positions of the plurality of pixels; and A welding device is arranged on the workbench and includes a laser source, a light modulator and a processor. The laser source is used to generate a main laser beam. The light modulator is connected to the processor and is used to receive the main laser beam. The processor is used to control the light modulator to project multiple welding beams to the corresponding range of the circuit substrate within a target range according to a product pattern, so that the welding positions of the multiple pixels acted by the multiple welding beams and the multiple photoelectric elements form welding. The product pattern includes the welding positions of the multiple pixels corresponding to the circuit substrate.

2. The laser welding device with adjustable welding target according to claim 1, characterized in that: in, The processor obtains the welding position distribution of the plurality of pixels through the product pattern.

3. The laser welding device with adjustable welding target according to claim 1, characterized in that: in, The target range is related to the pickup range of the pickup head.

4. The laser welding device with adjustable welding target according to claim 1 or 2, characterized in that: The invention also comprises a machine vision device which is arranged on the working table and connected to the processor and is used for forming the product pattern according to a plurality of pixels of the circuit substrate.

5. The laser welding device with adjustable welding target according to claim 1, characterized in that: in, The light modulator includes a spatial light modulator or a digital micromirror device.

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