Wafer grinding reference quartz plate feeding system

Abstract

The invention relates to the technical field of semiconductor equipment, and discloses a wafer grinding reference quartz plate feeding system which comprises a quartz plate feeding device, a transfer checking device, a mechanical arm and a control system. The transfer inspection device is arranged at the end part of the mechanical arm; the transfer inspection device comprises a pickup part; the quartz plate feeding device is used for providing a reference quartz plate; the pick-up part is used for picking up a reference quartz plate in the quartz plate feeding device; the mechanical arm is used for adjusting the position of the transfer inspection device; and the control system is used for controlling the pose of the tail end of the mechanical arm, controlling the pickup part to pick up the reference quartz plate and transferring the reference quartz plate to the wafer grinding device, the automatic feeding device can replace manual work to feed the quartz plate, and the efficiency of placing the reference quartz plate can be greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor equipment, and in particular to a wafer grinding reference quartz sheet feeding system. Background Art

[0002] Wafer refers to the silicon wafer used for the production of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. In the production process of wafers, there is a process to grind both sides of the wafer. There are many technologies for wafer grinding. The commonly used grinding method in the modern semiconductor industry is Chemical Mechanical Polish (CMP). During the grinding process, the thickness of the wafer is determined by measuring the thickness of the reference quartz sheet that is ground together. Therefore, the wafer grinding reference quartz sheet feeding system is an important part of the semiconductor processing technology, that is, when grinding the wafer, the reference quartz sheet (used to define the thickness of the wafer) needs to be placed in the corresponding groove.

[0003] At present, this process is mainly completed manually, with low production efficiency, high labor intensity for operators, and low precision. There is a risk of taking the wrong reference quartz plate, which can easily affect the quality of the wafer. Summary of the invention

[0004] In view of this, the present invention provides a wafer grinding reference quartz plate feeding system to solve the problem of low efficiency in placing the reference quartz plate.

[0005] In a first aspect, the present invention provides a wafer grinding reference quartz sheet feeding system, comprising: a quartz sheet feeding device, a transfer inspection device, a mechanical arm and a control system; the transfer inspection device is arranged at the end of the mechanical arm; the transfer inspection device comprises a picking part; The quartz plate feeding device is used to provide a reference quartz plate; The picking-up portion is used to pick up the reference quartz plate in the quartz plate feeding device; The mechanical arm is used to adjust the position of the transfer inspection device; The control system is used to control the posture of the end of the robot arm, adjust the transfer inspection device to the corresponding position of the quartz wafer feeding device, and when there is a reference quartz wafer in the quartz wafer feeding device, control the picking part to pick up the reference quartz wafer, and transfer the reference quartz wafer picked up by the picking part to the wafer grinding device by controlling the posture of the end of the robot arm.

[0006] In some optional embodiments, the quartz sheet feeding device includes a tray in-position sensor, a first tray, a second tray, a first detection sensor, and a second detection sensor; the first tray and the second tray are both detachable structures; The tray in-position sensor is used to detect whether the first tray and / or the second tray are in position; The first tray is used to place a first reference quartz plate of a first thickness, and the second tray is used to place a second reference quartz plate of a second thickness; the first thickness is different from the second thickness; The first detection sensor is used to detect whether the first tray is placed correctly; The second detection sensor is used to detect whether the second tray is placed correctly; The control system is also used for: When the first tray is in place and the first tray is placed in a correct position, determining whether the first reference quartz plate is present on the first tray; When the second tray is in place and the second tray is placed in a correct position, it is determined whether the second reference quartz plate is present on the second tray.

[0007] In some optional embodiments, the quartz sheet feeding device further includes: a feeding support and a feeding cover plate; the feeding cover plate is arranged on the feeding support; The feed cover plate is provided with a first acupoint for placing the first tray, and a second acupoint for placing the second tray; The first acupuncture point and the second acupuncture point are both provided with tray positioning pins; the first tray and the second tray are provided with positioning holes corresponding to the positions of the tray positioning pins.

[0008] In some optional embodiments, the first tray is provided with a first automatic detection hole, and the surface of the first tray is provided with a first manual mark corresponding to the first thickness; The second tray is provided with a second automatic detection hole, and a second manual mark corresponding to the second thickness is provided on the surface of the second tray; the relative position of the first automatic detection hole in the first tray is different from the relative position of the second automatic detection hole in the second tray; The first detection sensor is arranged at a position in the first acupuncture point corresponding to the first automatic detection hole; The second detection sensor is arranged at a position in the second acupuncture point corresponding to the second automatic detection hole; Wherein, when there is a tray in the first acupuncture point and the upper part of the first detection sensor is not blocked, it is determined that the first tray is in place and the first tray is placed in a correct position; When there is a tray in the second acupuncture point and the upper part of the second detection sensor is not blocked, it is determined that the second tray is in place and the second tray is placed in a correct position.

[0009] In some optional embodiments, the first tray and the second tray are both provided with a plurality of first grooves for placing reference quartz plates, and second grooves are provided beside the first grooves; The first groove and the second groove are integrally a stepped groove structure, and the depth of the first groove is smaller than the depth of the second groove; A partial area of ​​the reference quartz plate placed in the first groove is located above the second groove, and the center of gravity of the reference quartz plate is located above the first groove.

[0010] In some optional embodiments, the feeding system further comprises: a secondary positioning mechanism; the secondary positioning mechanism comprises a positioning push plate, a positioning cylinder, a positioning seat and a quartz plate sensor; the positioning seat is provided with a positioning groove for secondary positioning of the reference quartz plate; The positioning push plate is provided with a positioning end for pushing the reference quartz plate, and the positioning end faces the positioning groove; The positioning cylinder is connected to the positioning push plate and is used to push the positioning push plate to move; The quartz plate sensor is used to detect whether there is a reference quartz plate in the positioning groove; The control system transfers the reference quartz plate picked up by the picking unit to the wafer grinding device, including: Transferring the reference quartz plate picked up by the picking-up unit to the positioning groove of the secondary positioning mechanism; When the reference quartz plate is detected in the positioning groove, the positioning end of the positioning push plate is moved to a preset position by controlling the positioning cylinder to perform secondary positioning on the reference quartz plate in the positioning groove; The pickup unit is controlled to pick up the reference quartz plate after the secondary positioning, and the reference quartz plate after the secondary positioning is transferred to the wafer grinding device.

[0011] In some optional embodiments, the positioning end is provided with a positioning surface facing the positioning groove; The positioning surface is symmetrical with respect to the moving direction of the positioning push plate, and is used for abutting against the reference quartz plate in the positioning groove.

[0012] In some optional embodiments, the feeding system further comprises: a discarded quartz sheet box; The discarded quartz film box includes: a discarded film box in-place sensor for detecting whether the discarded quartz film box is in place; The control system is also used for: When the discarded quartz plate box is in place, after the wafer is ground, the discarded reference quartz plate at the wafer grinding device is transferred into the discarded quartz plate box.

[0013] In some optional embodiments, the transfer inspection device further includes: at least two thickness detection sensors; One of the thickness detection sensors is used to detect a first thickness corresponding to a position in the quartz sheet feeding device for placing a reference quartz sheet; Another thickness detection sensor is used to detect a second thickness corresponding to a position in the quartz sheet feeding device that is not used to place the reference quartz sheet; The control system is also used for: According to the difference between the first thickness and the second thickness, it is judged whether the thickness of the reference quartz plate placed in the quartz plate feeding device is correct.

[0014] In some optional embodiments, the picking portion includes: a picking suction cup, a picking cylinder, a slide plate and a suction cup support plate; The transfer inspection device further comprises a visual unit; the visual unit comprises: a visual camera and a lens; The pickup suction cup is connected to the slide plate through the suction cup support plate and is used to absorb the reference quartz plate; The pickup cylinder is connected to the slide plate and is used to push the slide plate to move; The lens is arranged at the lower end of the visual camera; the visual part is used to collect images below the transfer inspection device.

[0015] The wafer grinding reference quartz plate feeding system provided by the present invention provides a reference quartz plate by a quartz plate feeding device, and controls the posture of the end of a mechanical arm based on a control system, so that the position and posture of a transfer and inspection device located at the end of the mechanical arm can be adjusted, and then the reference quartz plate of the quartz plate feeding device can be picked up by a picking portion of the transfer and inspection device, and then the reference quartz plate can be automatically placed on the wafer grinding device by controlling the mechanical arm, basically without the need for human intervention, instead of manually loading the quartz plate, which can greatly improve the efficiency of placing the reference quartz plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of a wafer grinding reference quartz plate feeding system according to an embodiment of the present invention; Figure 2 It is a structural schematic diagram of a quartz sheet feeding device according to an embodiment of the present invention; Figure 3 An exploded view of a quartz sheet feeding device according to an embodiment of the present invention; Figure 4 A schematic diagram of the structure of two trays according to an embodiment of the present invention; Figure 5 It is a structural schematic diagram of a secondary positioning mechanism according to an embodiment of the present invention; Figure 6 A schematic diagram of the structure of a robotic arm according to an embodiment of the present invention; Figure 7 It is a structural schematic diagram of a transfer inspection device according to an embodiment of the present invention; Figure 8 The figure is a schematic diagram of an automatic loading process according to an embodiment of the present invention.

[0018] Description of reference numerals: 1. Quartz sheet feeding device; 101. Feeding bracket; 102. Feeding cover plate; 103. Tray in-position sensor; 104. First tray; 105. First reference quartz sheet; 106. Second tray; 107. Second reference quartz sheet; 108. First detection sensor; 109. Second detection sensor; 111. Maintenance cover plate; 112. Tray positioning pin; 113. Positioning hole; 114. First groove; 115. Second groove; 1041. First automatic detection hole; 1042. First manual mark; 1061. Second automatic detection hole; 1062. Second manual mark; 2. Secondary positioning mechanism; 201. Positioning push plate; 202. Positioning cylinder; 203. Push plate mounting plate; 204. Push plate pressure plate; 205. Positioning seat; 206. Quartz plate sensor; 207. Sensor support plate; 3. Abandoned quartz film box; 301. Abandoned film box in-place sensor; 4. Transfer inspection device; 401. Pick-up suction cup; 402. Pick-up cylinder; 403. Slide plate; 404. Suction cup support plate; 405. Thickness detection sensor; 406. Sensor support plate; 407. Mounting plate; 408. Visual camera; 409. Lens; 410. Visual communication power supply network cable; 411. Visual support plate; 412. Arm connector; 413. Vacuum solenoid valve; 414. Pick-up solenoid valve; 5. Robotic arm; 6. Visual industrial computer; 7. Control system; 8. Remote communication component; 801. Remote communication module; 802. Positioning solenoid valve. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0022] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] According to an embodiment of the present invention, a wafer grinding reference quartz plate feeding system (hereinafter referred to as a feeding system) is provided. Figure 1 FIG. 1 shows a schematic diagram of the structure of the wafer grinding reference quartz sheet feeding system. Figure 1 As shown, the wafer grinding reference quartz sheet feeding system includes: a quartz sheet feeding device 1 , a transfer and inspection device 4 , a mechanical arm 5 and a control system 7 ; the transfer and inspection device 4 is arranged at the end of the mechanical arm 5 .

[0024] The quartz plate feeding device 1 is used to provide a reference quartz plate.

[0025] The transfer inspection device 4 includes a picking-up portion, which is used to pick up the reference quartz plate in the quartz plate feeding device 1 .

[0026] The robot arm 5 is used to adjust the position of the transfer inspection device 4 .

[0027] The control system 7 is used to control the posture of the end of the robot arm 5, adjust the transfer inspection device 4 to the corresponding position of the quartz wafer feeding device 1, and when there is a reference quartz wafer in the quartz wafer feeding device 1, control the picking part to pick up the reference quartz wafer, and transfer the reference quartz wafer picked up by the picking part to the wafer grinding device by controlling the posture of the end of the robot arm 5.

[0028] In this embodiment, when wafer grinding needs to be performed based on a reference quartz plate, the quartz plate feeding device 1 can provide one or more reference quartz plates; generally, multiple reference quartz plates can be placed on the quartz plate feeding device 1.

[0029] A mechanical arm 5 is provided within a certain distance of the quartz sheet feeding device 1, and a transfer inspection device 4 capable of transferring the reference quartz sheet is provided at the end of the mechanical arm 5. Specifically, the transfer inspection device 4 includes a picking portion, based on which the reference quartz sheet can be picked up, for example, the picking portion can pick up the reference quartz sheet in the quartz sheet feeding device 1.

[0030] In this embodiment, the wafer grinding reference quartz plate feeding system is provided with a control system 7, which realizes automatic placement of the reference quartz plate, thereby improving efficiency; wherein the control system may be, for example, a PLC (Programmable Logic Controller) control system.

[0031] Specifically, the control system 7 can control the posture of the end of the robot arm 5, that is, the control system 7 can control the position and posture of the transfer inspection device 4, so that the transfer inspection device 4 can be adjusted to the corresponding position of the quartz sheet feeding device 1, for example, the transfer inspection device 4 is adjusted to be directly above the quartz sheet feeding device 1. The transfer inspection device 4 can check whether there is a reference quartz sheet on the quartz sheet feeding device 1. If there is a reference quartz sheet on the quartz sheet feeding device 1, the control system 7 can control the picking part to pick up the reference quartz sheet on the quartz sheet feeding device 1; after the transfer inspection device 4 picks up the reference quartz sheet, the control system 7 can adjust the position of the transfer inspection device 4 by controlling the posture of the end of the robot arm 5 again, and move it to the wafer grinding device, and then transfer the reference quartz sheet picked up by the picking part to the wafer grinding device for use by the wafer grinding device.

[0032] The reference quartz plate is a quartz plate with a certain thickness. After the reference quartz plate is transferred to the wafer grinding device, the wafer grinding device can grind the wafer loaded therein so that the thickness of the wafer after grinding matches the thickness of the reference quartz plate, so that the thickness of the wafer after grinding meets the requirements. The wafer grinding device includes a grinding jig planetary wheel, and the reference quartz plate can be transferred to the grinding jig planetary wheel, which is not described in detail in this embodiment.

[0033] The wafer grinding reference quartz plate feeding system provided in the present embodiment provides a reference quartz plate by a quartz plate feeding device 1, and controls the posture of the end of the robot arm 5 based on the control system 7, so that the position and posture of the transfer and inspection device 4 located at the end of the robot arm 5 can be adjusted, and then the picking part of the transfer and inspection device 4 can pick up the reference quartz plate of the quartz plate feeding device 1, and then the reference quartz plate can be automatically placed on the wafer grinding device by controlling the robot arm 5, which basically does not require human intervention, replaces manual loading of the quartz plate, and can greatly improve the efficiency of placing the reference quartz plate.

[0034] In some optional embodiments, the quartz plate feeding device 1 can be equipped with different reference quartz plates. Figure 2 and Figure 3 As shown, the quartz sheet feeding device 1 includes a tray in-position sensor 103, a first tray 104, a second tray 106, a first detection sensor 108 and a second detection sensor 109; wherein, the first tray 104 and the second tray 106 are both detachable structures. When it is necessary to place a reference quartz sheet in the tray (the first tray 104, the second tray 106), the tray can be removed first, and then the reference quartz sheet is placed in the tray, and finally the tray is installed to the corresponding position of the quartz sheet feeding device 1.

[0035] The tray in-position sensor 103 is used to detect whether the first tray 104 and / or the second tray 106 are in position. The tray in-position sensor 103 may be one or more to detect whether the two trays are in position respectively. In addition, the tray in-position sensor 103 may send corresponding in-position information to the control system 7, and the in-position information is used to indicate whether the first tray 104 and / or the second tray 106 are in position.

[0036] The first tray 104 is used to place a first reference quartz plate 105 of a first thickness, and the second tray 106 is used to place a second reference quartz plate 107 of a second thickness; the first thickness is different from the second thickness.

[0037] The first detection sensor 108 is used to detect whether the first tray 104 is correctly placed; the second detection sensor 109 is used to detect whether the second tray 106 is correctly placed. Similarly, the first detection sensor 108 can send information indicating whether the first tray 104 is correctly placed to the control system 7, and the second detection sensor 109 can send information indicating whether the second tray 106 is correctly placed to the control system 7.

[0038] Furthermore, the control system 7 is also used for: When the first tray 104 is in place and the first tray 104 is placed in the correct position, it is determined whether the first tray 104 has the first reference quartz plate 105; when the second tray 106 is in place and the second tray 106 is placed in the correct position, it is determined whether the second tray 106 has the second reference quartz plate 107.

[0039] In this embodiment, the control system 7 can determine whether each tray is in place and whether the placement position is correct based on the information sent by the tray in-place sensor 103, the first detection sensor 108 and the second detection sensor 109. If the first tray 104 is in place and the first tray 104 is placed in the correct position, it can be further determined whether the first tray 104 has a first reference quartz plate 105. If the first reference quartz plate 105 exists, the quartz plate feeding device 1 has a reference quartz plate, so the control system 7 can control the transfer inspection device 4 to pick up the first reference quartz plate 105. Similarly, if the second tray 106 is in place, the second tray 106 is placed in the correct position, and the second tray 106 has a second reference quartz plate 107, it can also be said that the quartz plate feeding device 1 has a reference quartz plate, so the control system 7 can control the transfer inspection device 4 to pick up the second reference quartz plate 107.

[0040] In this embodiment, the quartz sheet feeding device 1 adopts a double tray design, and the two trays are used to provide reference quartz sheets of different thicknesses, so as to meet various requirements. In addition, the two trays can be one main and one standby, that is, one tray can be used and the other tray is in a standby state, or the two trays can be used at the same time to provide two kinds of reference quartz sheet feeding of thicknesses. The tray in-position sensor 103 is used to detect whether the two trays are in position, and the first detection sensor 108 and the second detection sensor 109 can detect the positions of the trays respectively to avoid misplacing.

[0041] Alternatively, see Figures 2 to 4 As shown, the quartz sheet feeding device 1 further includes: a feeding support 101 and a feeding cover plate 102 ; the feeding cover plate 102 is arranged on the feeding support 101 .

[0042] The feed cover 102 is provided with a first acupoint for placing the first tray 104 and a second acupoint for placing the second tray 106; the first acupoint and the second acupoint are both provided with tray positioning pins 112; the first tray 104 and the second tray 106 are provided with positioning holes 113 corresponding to the positions of the tray positioning pins 112.

[0043] In this embodiment, the two acupuncture points in the feeding cover plate 102 are used to place the first tray 104 and the second tray 106 respectively. The corresponding tray positioning pins 112 and positioning holes 113 can guide the rapid and accurate positioning when the trays are placed manually, which is conducive to rapid manual filling.

[0044] Alternatively, if Figure 4 As shown, the first tray 104 is provided with a first automatic detection hole 1041, and the surface of the first tray 104 is provided with a first manual mark 1042 corresponding to the first thickness. The second tray 106 is provided with a second automatic detection hole 1061, and the surface of the second tray 106 is provided with a second manual mark 1062 corresponding to the second thickness; the relative position of the first automatic detection hole 1041 in the first tray 104 is different from the relative position of the second automatic detection hole 1061 in the second tray 106.

[0045] Furthermore, the first detection sensor 108 is disposed at a position in the first acupuncture point corresponding to the first automatic detection hole 1041 ; and the second detection sensor 109 is disposed at a position in the second acupuncture point corresponding to the second automatic detection hole 1061 .

[0046] Among them, when there is a tray in the first acupuncture point and the top of the first detection sensor 108 is not blocked, it is determined that the first tray 104 is in place and the first tray 104 is placed in the correct position; when there is a tray in the second acupuncture point and the top of the second detection sensor 109 is not blocked, it is determined that the second tray 106 is in place and the second tray 106 is placed in the correct position.

[0047] In this embodiment, the first tray 104 is provided with a first automatic detection hole 1041, and the number of the first automatic detection hole 1041 can be multiple. Figure 4 Take the example of including two first automatic detection holes 1041. Figure 3 As shown, the first detection sensor 108 is arranged in the first acupuncture point and corresponds to the position of the first automatic detection hole 1041. When the first tray 104 is placed in the first acupuncture point, the first automatic detection hole 1041 is located above the first detection sensor 108 and will not block the first detection sensor 108, so that it can be determined that the first tray 104 is in place and the first tray 104 is placed in the correct position.

[0048] On the contrary, since the second automatic detection hole 1061 is located at a different position from the first automatic detection hole 1041, as shown in FIG. Figure 4 As shown, the first automatic detection hole 1041 is located in the middle of the first tray 104, and the second automatic detection hole 1061 is located at the edge of the second tray 106. If the user mistakenly places the second tray 106 at the first acupoint, the top of the first detection sensor 108 will not be a detection hole (that is, not the second automatic detection hole 1061), so the first detection sensor 108 will be blocked by the second tray 106. If the tray in-position sensor 103 detects that there is a tray in the first acupoint at this time, but the top of the first detection sensor 108 is blocked, it can be determined that the tray in the first acupoint is not the first tray 104, but the second tray 106, that is, the tray is placed in the wrong position at this time.

[0049] Similarly, when there is a tray in the second acupuncture point, the second detection sensor 109 can detect whether the top is blocked, so as to determine whether the second tray 106 is placed in the correct position, which will not be repeated here.

[0050] In addition, a first artificial mark 1042 corresponding to the first thickness is provided on the surface of the first tray 104, and the first artificial mark 1042 can intuitively show what thickness of the reference quartz sheet should be placed on the first tray 104, that is, the first artificial mark 1042 can represent the first thickness. Figure 4 As shown, if the thickness of the first reference quartz plate 105 (ie, the first thickness) is 900 microns, the first manual mark 1042 may be “900”, and the user may determine which reference quartz plates need to be placed on the first tray 104 based on the first manual mark 1042 .

[0051] Similarly, the surface of the second tray 106 is provided with a second artificial mark 1062 corresponding to the second thickness. Figure 4 As shown, if the thickness of the second reference quartz plate 107 (ie, the second thickness) is 880 micrometers, the first artificial mark 1042 may be "880".

[0052] In this embodiment, the combination of the pallet in-position sensor 103, the first detection sensor 108 and the second detection sensor 109 can simply and accurately determine whether each pallet is in place and whether the placement position is correct, realize self-checking of the pallet, and timely discover the problem of incorrect placement of the pallet. In addition, the surface of the pallet is provided with an artificial mark of corresponding thickness, which can guide manual loading and avoid manual loading errors to a certain extent.

[0053] Alternatively, if Figure 4 As shown, the first tray 104 and the second tray 106 are both provided with a plurality of first grooves 114 for placing reference quartz plates, and second grooves 115 are provided beside the first grooves 114 .

[0054] Among them, the first groove 114 and the second groove 115 are a stepped groove structure as a whole, and the depth of the first groove 114 is less than the depth of the second groove 115; a partial area of ​​the reference quartz plate placed in the first groove 114 is located above the second groove 115, and the center of gravity of the reference quartz plate is located above the first groove 114.

[0055] In this embodiment, Figure 4 The second reference quartz plate 107 is placed on the second tray 106 above. Figure 4 The first tray 104 below does not hold the first reference quartz plate 105. Figure 4 The first tray 104 shown can be provided with a plurality of first reference quartz plates 105, and each first reference quartz plate 105 has a corresponding first groove 114; Figure 4 In the embodiment, the first tray 104 can be provided with 40 first reference quartz plates 105 .

[0056] Furthermore, a deeper second groove 115 is provided beside each first groove 114. When the reference quartz plate is placed in the first groove 114, a part of it can be located above the deeper second groove 115, so that the user can conveniently enter the second groove 115 with his fingers and take and place the reference quartz plate. In addition, the center of gravity of the reference quartz plate is located above the first groove 114, so that the reference quartz plate will not be placed in the second groove 115, and the picking unit will not be affected in picking up the reference quartz plate in the first groove 114. For example, the width of the second groove 115 does not exceed the diameter of the reference quartz plate.

[0057] In this embodiment, the reference quartz plate can be stably placed in the first groove 114 by utilizing the stepped groove structure, which can prevent the reference quartz plate in the groove from tipping over; and it is also convenient for the user to take and place the reference quartz plate.

[0058] In some optional embodiments, such as Figure 1 As shown, the wafer grinding reference quartz plate feeding system also includes: a secondary positioning mechanism 2; the secondary positioning mechanism 2 is used to perform more accurate secondary positioning on the reference quartz plate.

[0059] Figure 5 FIG. 2 shows a schematic diagram of the structure of the secondary positioning mechanism 2. Figure 5 As shown, the secondary positioning mechanism 2 includes a positioning push plate 201, a positioning cylinder 202, a positioning seat 205 and a quartz plate sensor 206; the positioning seat 205 is provided with a positioning groove for secondary positioning of the reference quartz plate.

[0060] The positioning push plate 201 is provided with a positioning end for pushing the reference quartz plate, and the positioning end faces the positioning groove; the positioning cylinder 202 is connected to the positioning push plate 201 and is used to push the positioning push plate 201 to move; the quartz plate sensor 206 is used to detect whether there is a reference quartz plate in the positioning groove.

[0061] The control system 7 transfers the reference quartz plate picked up by the picking-up unit to the wafer grinding device, including: The reference quartz plate picked up by the picking part is transferred to the positioning groove of the secondary positioning mechanism 2; when the presence of the reference quartz plate in the positioning groove is detected, the positioning end of the positioning push plate 201 is moved to a preset position by controlling the positioning cylinder 202 to perform secondary positioning on the reference quartz plate in the positioning groove; the picking part is controlled to pick up the reference quartz plate after the secondary positioning, and the reference quartz plate after the secondary positioning is transferred to the wafer grinding device.

[0062] In this embodiment, Figure 5 As shown, the positioning push plate 201 is arranged on the push plate mounting plate 203 and fixed by the push plate pressure plate 204; the power output end of the positioning cylinder 202 is connected to the push plate mounting plate 203, thereby realizing an indirect connection with the positioning push plate 201. While pushing the push plate mounting plate 203, the positioning push plate 201 can be driven to move, so that the positioning push plate 201 is close to or away from the positioning groove of the positioning seat 205.

[0063] Furthermore, a sensor support plate 207 is provided below the positioning groove, and a quartz plate sensor 206 is provided on the sensor support plate 207 to detect whether there is a reference quartz plate in the positioning groove. Specifically, the control system 7 can transfer the reference quartz plate in the tray to the positioning groove of the positioning seat 205 by operating the picking portion of the transfer inspection device 4; if the quartz plate sensor 206 detects that there is a reference quartz plate (the first reference quartz plate 105, or the second reference quartz plate 107) in the positioning groove, the control system 7 can push the cylinder piston to move through the compressed air source, so that the positioning end of the positioning push plate 201 can be moved to a preset position, so that the reference quartz plate pushed by the positioning end moves to a corresponding position, and the reference quartz plate is accurately positioned.

[0064] Among them, Figure 1 As shown, the control system 7 can control the on-off of the positioning solenoid valve 802 through the remote communication module 801 in the remote communication component 8, and the positioning solenoid valve 802 is used to control the operation of the positioning cylinder 202.

[0065] After the reference quartz plate is secondary positioned based on the secondary positioning mechanism 2, the control system 7 can control the picking part again to pick up the secondary positioned reference quartz plate in the positioning groove, and transfer the secondary positioned reference quartz plate to the wafer grinding device; after the secondary positioning, the transfer and inspection device 4 can accurately transfer the reference quartz plate to the groove of the planetary wheel, effectively avoiding the problem of placement position offset.

[0066] Optionally, the positioning end is provided with a positioning surface facing the positioning groove; the positioning surface is symmetrical with respect to the moving direction of the positioning push plate 201 and is used for abutting against a reference quartz plate in the positioning groove.

[0067] In this embodiment, the positioning push plate 201 has a certain moving direction. Figure 5 For example, the moving direction is from the upper right to the lower left, or in other words, the moving direction is the length direction of the positioning push plate 201; the positioning surface at the end of the positioning push plate 201 is symmetrical about the moving direction, so when the circular reference quartz plate is pushed to move based on the positioning surface, the reference quartz plate can be aligned with the center line of the positioning push plate 201, which is conducive to precise positioning.

[0068] Alternatively, see Figures 1 to 3 As shown, the feeding system further includes: a discarded quartz sheet box 3. The discarded quartz sheet box 3 includes: a discarded sheet box in-position sensor 301 for detecting whether the discarded quartz sheet box 3 is in position.

[0069] Furthermore, the control system 7 is further configured to: when the discarded quartz plate box 3 is in place, after the wafer is ground, transfer the discarded reference quartz plate at the wafer grinding device into the discarded quartz plate box 3 .

[0070] In this embodiment, in addition to the secondary positioning mechanism 2, the feed support 101 may also be provided with a discarded quartz sheet box 3. Moreover, the discarded quartz sheet box 3 is detachable, and a discarded sheet box in-place sensor 301 is also provided in the hole for installing the discarded quartz sheet box 3 to detect whether the discarded quartz sheet box 3 is installed in place. If the discarded quartz sheet box 3 is in place, after the wafer grinding device completes the wafer grinding based on the reference quartz sheet, the control system 7 can also control the transfer inspection device 4 to transfer the discarded reference quartz sheet at the wafer grinding device to the discarded quartz sheet box 3 to achieve waste recovery.

[0071] In addition, a maintenance cover 111 may be provided on the feed support 101 to facilitate maintenance by the user.

[0072] Alternatively, if Figure 6 and Figure 7 As shown, the transfer inspection device 4 is connected to the mechanical arm 5 via an arm connector 412. In addition to the picking part, the transfer inspection device 4 is also provided with a visual part for image acquisition.

[0073] The picking part includes: a picking suction cup 401 , a picking cylinder 402 , a slide plate 403 and a suction cup support plate 404 . The visual part includes: a visual camera 408 and a lens 409 .

[0074] The picking suction cup 401 is connected to the slide plate 403 through the suction cup support plate 404, and is used to absorb the reference quartz plate; the picking cylinder 402 is connected to the slide plate 403, and is used to push the slide plate 403 to move; the lens 409 is set at the lower end of the visual camera 408; the visual part is used to collect images below the transfer inspection device 4.

[0075] like Figure 7 As shown, the transfer inspection device 4 is provided with a mounting plate 407, on which a pick-up cylinder 402 and a slide plate 403 are provided, and the slide plate 403 is connected to the pick-up cylinder 402 and can move along the power direction of the pick-up cylinder 402. In addition, a suction cup support plate 404 is provided on the outer side of the slide plate 403, and a pick-up suction cup 401 is provided on the suction cup support plate 404, and the pick-up suction cup 401 can suck the reference quartz plate.

[0076] In addition, the transfer inspection device 4 is also provided with a visual support plate 411, on which a visual camera 408 is provided, and a lens 409 is provided at the lower end of the visual camera 408, so as to collect images below the transfer inspection device 4. The visual camera 408 is provided with a visual communication power supply network cable 410, which can be connected to the visual industrial computer 6 to realize image transmission.

[0077] In this embodiment, when the picking part needs to pick up a reference quartz plate, such as picking up a reference quartz plate on a tray or a secondary positioning mechanism 2, the picking part can control the on and off of the picking solenoid valve 414 to control the picking cylinder 402 to drive the picking suction cup 401 to move downward; after the picking suction cup 401 abuts against the reference quartz plate to be picked up, the control system 7 controls the picking suction cup 401 to be in a negative pressure state through the vacuum solenoid valve 413, so that the abutted reference quartz plate can be sucked.

[0078] Alternatively, if Figure 7 As shown, the transfer inspection device 4 further includes: at least two thickness detection sensors 405, which are arranged on the sensor support plate 406. One thickness detection sensor 405 is used to detect a first thickness corresponding to a position in the quartz sheet feeding device 1 for placing a reference quartz sheet; the other thickness detection sensor 405 is used to detect a second thickness corresponding to a position in the quartz sheet feeding device 1 not for placing a reference quartz sheet.

[0079] The control system 7 is also used to determine whether the thickness of the reference quartz sheet placed in the quartz sheet feeding device 1 is correct based on the difference between the first thickness and the second thickness.

[0080] In this embodiment, the transfer inspection device 4 is provided with two thickness detection sensors 405, which detect the thickness at different positions respectively. Based on the difference between the two thicknesses, it can be determined whether the thickness of the reference quartz plate placed in the quartz plate feeding device 1 is correct, so as to avoid problems such as size error or stacking when the reference quartz plate is manually placed on the tray.

[0081] Specifically, both thickness detection sensors 405 are micrometer-level thickness detection sensors, and the two thickness detection sensors 405 are spaced a certain distance apart and arranged side by side, so that when one thickness detection sensor 405 detects a first thickness corresponding to a position for placing a reference quartz plate in the quartz plate feeding device 1, the other thickness detection sensor 405 can detect a second thickness corresponding to a position not for placing a reference quartz plate in the quartz plate feeding device 1. The difference between the first thickness and the second thickness can represent the thickness of the reference quartz plate being measured.

[0082] For example, if a reference quartz plate with a thickness of 900 microns (i.e., the first reference quartz plate 105) should be placed in the first tray 104, but after detection by the thickness detection sensor 405, the thickness of the reference quartz plate in the first tray 104 is not 900 microns, it can be determined that the thickness of the reference quartz plate in the first tray 104 is incorrect, and a reference quartz plate of the correct thickness needs to be replaced.

[0083] In this embodiment, the process of automatically loading the wafer by using the wafer grinding reference quartz sheet feeding system can be seen in Figure 8 shown.

[0084] Step S801, manually loading the quartz plate tray and transferring it to the feeding system.

[0085] For example, a first reference quartz plate 105 with a thickness of 900 microns is manually loaded into each first groove 114 of the first tray 104, and a second reference quartz plate 107 with a thickness of 880 microns is manually loaded into each first groove 114 of the second tray 106. Then, the two trays are respectively installed at the corresponding positions using the tray positioning pins 112 and the positioning holes 113 on the tray.

[0086] Step S802: tray in-place detection, tray position detection.

[0087] For example, the tray in-position sensor 103 is used to detect whether there is a tray in the first acupoint and the second acupoint, so as to detect whether the first tray 104 and the second tray 106 are in position. In addition, the first detection sensor 108 is used to detect whether the installation position of the first tray 104 is correct, and the second detection sensor 109 is used to detect whether the installation position of the second tray 106 is correct.

[0088] Step S803, determine whether the tray is in place and in the correct position. If the tray is in place and in the correct position, proceed to step S804, otherwise, re-execute step S802.

[0089] The control system 7 may receive the detection results of each sensor, and based on this, determine whether the first tray 104 and the second tray 106 are in place, and whether the positions are correct.

[0090] Step S804: the transfer inspection device measures the thickness of the reference quartz plate.

[0091] Specifically, the transfer inspection device 4 detects the thickness of the reference quartz plates in the first tray 104 and the second tray 106 based on the two thickness detection sensors 405 .

[0092] Step S805, determine whether the thickness of the reference quartz plate is correct, if it is correct, proceed to step S806, otherwise proceed to step S802, or alarm.

[0093] Step S806: The transfer inspection device picks up the waste quartz pieces and puts them into the waste quartz piece box.

[0094] Step S807 , the transfer inspection device picks up the reference quartz plate in the tray to the secondary positioning mechanism, specifically, places it in the positioning groove of the secondary positioning mechanism 2 .

[0095] Step S808: The secondary positioning mechanism performs secondary positioning on the reference quartz plate.

[0096] Step S809: The transfer inspection device visually precisely positions the reference quartz plate.

[0097] Step S810: The transfer inspection device picks up the reference quartz plate for the second time.

[0098] In step S811, the transfer inspection device transfers the reference quartz plate to the wafer grinding device to complete the material feeding.

[0099] In this embodiment, the reference quartz plate is quickly filled into the tray manually, the tray in-position sensor and the tray inspection sensor detect whether the two trays are correctly in position, the transfer inspection device measures whether the thickness of the reference quartz plate on the tray is correct, picks up the discarded quartz plate into the recycling box, picks up the new quartz plate for secondary precision positioning, and precisely positions the reference quartz plate again based on vision, and finally the transfer inspection device picks up the reference quartz plate for transfer and feeding; this feeding system can replace manual loading of the reference quartz plate, thereby improving loading efficiency and accuracy.

[0100] In addition, the control system 7 can number the reference quartz plates in the tray, record and manage them, and cooperate with the upper management system to issue wafer grinding equipment work orders and manage the supply of reference quartz plates. The supply system can quickly and accurately supply the wafer grinding equipment, thereby improving the utilization rate of the grinding equipment.

[0101] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A wafer grinding reference quartz sheet feeding system, characterized in that: include: A quartz sheet feeding device (1), a transfer inspection device (4), a mechanical arm (5) and a control system (7); the transfer inspection device (4) is arranged at the end of the mechanical arm (5); the transfer inspection device (4) comprises a picking portion; The quartz plate feeding device (1) is used to provide a reference quartz plate; The picking-up portion is used to pick up the reference quartz plate in the quartz plate feeding device (1); The mechanical arm (5) is used to adjust the position of the transfer inspection device (4); The control system (7) is used to control the posture of the end of the robot arm (5), adjust the transfer inspection device (4) to the corresponding position of the quartz plate feeding device (1), and control the picking-up unit to pick up the reference quartz plate when there is a reference quartz plate in the quartz plate feeding device (1), and transfer the reference quartz plate picked up by the picking-up unit to the wafer grinding device by controlling the posture of the end of the robot arm (5).

2. The feeding system according to claim 1, characterized in that: The quartz sheet feeding device (1) comprises a tray in-position sensor (103), a first tray (104), a second tray (106), a first detection sensor (108) and a second detection sensor (109); the first tray (104) and the second tray (106) are both detachable structures; The tray in-position sensor (103) is used to detect whether the first tray (104) and / or the second tray (106) are in position; The first tray (104) is used to place a first reference quartz plate (105) of a first thickness, and the second tray (106) is used to place a second reference quartz plate (107) of a second thickness; the first thickness is different from the second thickness; The first detection sensor (108) is used to detect whether the first tray (104) is placed in a correct position; The second detection sensor (109) is used to detect whether the second tray (106) is placed in a correct position; The control system (7) is also used for: When the first tray (104) is in place and the first tray (104) is placed in a correct position, determining whether the first reference quartz plate (105) is present on the first tray (104); When the second tray (106) is in place and the second tray (106) is placed in a correct position, it is determined whether the second reference quartz plate (107) is present on the second tray (106).

3. The feeding system according to claim 2, characterized in that: The quartz sheet feeding device (1) further comprises: a feeding support (101) and a feeding cover plate (102); the feeding cover plate (102) is arranged on the feeding support (101); The feed cover plate (102) is provided with a first acupoint for placing the first tray (104), and a second acupoint for placing the second tray (106); The first acupuncture point and the second acupuncture point are both provided with a tray positioning pin (112); the first tray (104) and the second tray (106) are provided with positioning holes corresponding to the positions of the tray positioning pins (112).

4. The feeding system according to claim 3, characterized in that: The first tray (104) is provided with a first automatic detection hole (1041), and the surface of the first tray (104) is provided with a first manual mark (1042) corresponding to the first thickness; The second tray (106) is provided with a second automatic detection hole (1061), and a second manual mark (1062) corresponding to the second thickness is provided on the surface of the second tray (106); the relative position of the first automatic detection hole (1041) in the first tray (104) is different from the relative position of the second automatic detection hole (1061) in the second tray (106); The first detection sensor (108) is arranged at a position in the first acupuncture point corresponding to the first automatic detection hole (1041); The second detection sensor (109) is arranged at a position in the second acupuncture point corresponding to the second automatic detection hole (1061); Wherein, when there is a tray in the first acupuncture point and the top of the first detection sensor (108) is not blocked, it is determined that the first tray (104) is in place and the first tray (104) is placed in a correct position; When there is a tray in the second acupuncture point and the upper part of the second detection sensor (109) is not blocked, it is determined that the second tray (106) is in place and the second tray (106) is placed in the correct position.

5. The feeding system according to claim 2, characterized in that: The first tray (104) and the second tray (106) are both provided with a plurality of first grooves (114) for placing reference quartz plates, and second grooves (115) are provided next to the first grooves (114); The first groove (114) and the second groove (115) are integrally a stepped groove structure, and the depth of the first groove (114) is smaller than the depth of the second groove (115); A partial area of ​​the reference quartz plate placed in the first groove (114) is located above the second groove (115), and the center of gravity of the reference quartz plate is located above the first groove (114).

6. The feeding system according to claim 1, characterized in that: Also includes: A secondary positioning mechanism (2); the secondary positioning mechanism (2) comprises a positioning push plate (201), a positioning cylinder (202), a positioning seat (205) and a quartz plate sensor (206); the positioning seat (205) is provided with a positioning groove for performing secondary positioning on the reference quartz plate; The positioning push plate (201) is provided with a positioning end for pushing the reference quartz plate, and the positioning end faces the positioning groove; The positioning cylinder (202) is connected to the positioning push plate (201) and is used to push the positioning push plate (201) to move; The quartz plate sensor (206) is used to detect whether there is a reference quartz plate in the positioning groove; The control system (7) transfers the reference quartz plate picked up by the picking unit to the wafer grinding device, comprising: Transferring the reference quartz plate picked up by the picking-up unit to the positioning groove of the secondary positioning mechanism (2); When the presence of a reference quartz plate in the positioning groove is detected, the positioning end of the positioning push plate (201) is moved to a preset position by controlling the positioning cylinder (202) to perform secondary positioning on the reference quartz plate in the positioning groove; The pickup unit is controlled to pick up the reference quartz plate after the secondary positioning, and the reference quartz plate after the secondary positioning is transferred to the wafer grinding device.

7. The feeding system according to claim 6, characterized in that: The positioning end is provided with a positioning surface facing the positioning groove; The positioning surface is symmetrical with respect to the moving direction of the positioning push plate (201), and is used for abutting against the reference quartz plate in the positioning groove.

8. The feeding system according to claim 1, characterized in that: Also includes: Discarded quartz crystal box (3); The discarded quartz sheet box (3) comprises: a discarded sheet box in-place sensor (301) for detecting whether the discarded quartz sheet box (3) is in place; The control system (7) is also used for: When the discarded quartz plate box (3) is in place, after the wafer is ground, the discarded reference quartz plate at the wafer grinding device is transferred into the discarded quartz plate box (3).

9. The feeding system according to claim 1, characterized in that: The transfer inspection device (4) further comprises: at least two thickness detection sensors (405); One of the thickness detection sensors (405) is used to detect a first thickness corresponding to a position in the quartz sheet feeding device (1) for placing a reference quartz sheet; Another thickness detection sensor (405) is used to detect a second thickness corresponding to a position in the quartz plate feeding device (1) that is not used to place a reference quartz plate; The control system (7) is also used for: According to the difference between the first thickness and the second thickness, it is judged whether the thickness of the reference quartz plate placed in the quartz plate feeding device (1) is correct.

10. The feeding system according to claim 9, characterized in that: The picking-up portion comprises: a picking-up suction cup (401), a picking-up cylinder (402), a slide plate (403) and a suction cup support plate (404); The transfer inspection device (4) further comprises a visual unit; the visual unit comprises: a visual camera (408) and a lens (409); The pickup suction cup (401) is connected to the slide plate (403) via the suction cup support plate (404) and is used to absorb the reference quartz plate; The picking cylinder (402) is connected to the slide plate (403) and is used to push the slide plate (403) to move; The lens (409) is arranged at the lower end of the visual camera (408); the visual part is used to collect images below the transfer inspection device (4).

Images