Plastic packaging rib cutting control method for chip packaging, production line and storage medium

Abstract

The invention discloses a plastic packaging rib cutting control method for chip packaging, a production line and a storage medium, and relates to the technical field of semiconductor packaging, and the plastic packaging rib cutting control method comprises the following steps: obtaining a cavity structure and an injection molding demand of an injection molding cavity; according to the cavity structure and the injection molding requirement, an injection molding simulation model is constructed, and parameters of the injection molding simulation model are optimized; the metal plate is placed between the first template and the second template, so that the workpieces to be plastically packaged on the metal plate are located in the corresponding injection molding cavities one by one; according to the optimized injection molding simulation model, an injection molding device is controlled to carry out pouring on the interior of each injection molding cavity, so that a plastic package block wrapping the crystal grains and the frame is formed on the workpiece; and placing the metal plate subjected to plastic package in a rib cutting device, controlling the rib cutting device to cut and separate each workpiece on the metal plate, and bending the outer pin of each workpiece to form a chip body. According to the invention, injection molding defects can be reduced, and the consistency and stability of plastic packaging quality are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a plastic packaging cutting control method, a production line and a storage medium for chip packaging. Background Art

[0002] In the field of chip packaging technology, with the rapid development of the semiconductor industry, the requirements for chip packaging accuracy, efficiency and reliability are increasing. The traditional chip packaging plastic sealing cutting process often relies on trial and error and repeated adjustments, which not only leads to low production efficiency, but also makes it difficult to ensure the stability and consistency of plastic sealing quality. Specifically, the injection molding process in the chip packaging process is one of the key technologies, which directly affects the chip protection effect, heat dissipation performance and the reliability of the final product.

[0003] However, in actual operation, the injection molding process is affected by many factors, such as the fluidity of the injection molding material, injection pressure, temperature control, injection speed, and the geometry of the injection molding cavity. The complex interaction between these factors makes it extremely difficult to predict and control the injection molding results. Traditional methods usually use repeated trials and corrections to find the best injection molding conditions. This method is not only time-consuming and laborious, but also difficult to cope with the differences in material properties of different batches and slight changes in the injection molding cavity design. As a result, it is difficult to accurately predict and control various parameters in the injection molding process, resulting in unstable plastic packaging quality and affecting chip performance and reliability. Summary of the invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a chip encapsulation plastic encapsulation cutting rib control method, production line and storage medium, which can reduce injection molding defects and improve the consistency and stability of plastic encapsulation quality.

[0005] In a first aspect, the present application provides a chip encapsulation plastic encapsulation rib cutting control method, which is applied to a chip encapsulation production line, the production line comprising: an injection molding device and a rib cutting device, the injection molding device comprising a first template and a second template, a plurality of injection molding cavities are formed between the first template and the second template;

[0006] The plastic sealing rib cutting control method comprises:

[0007] Obtaining the cavity structure and injection molding requirements of the injection molding cavity;

[0008] According to the chamber structure and the injection molding requirements, an injection molding simulation model is constructed, and parameters of the injection molding simulation model are optimized;

[0009] Placing a metal plate between the first template and the second template so that the workpieces to be encapsulated on the metal plate are located in corresponding injection molding cavities one by one; wherein the workpieces are assemblies formed by the die and the frame after the lead welding is completed;

[0010] According to the optimized injection simulation model, the injection molding device is controlled to perform casting in each of the injection molding cavities, so that a plastic encapsulation block wrapped around the crystal grain and the frame is formed on the workpiece; wherein the outer pins of the frame are exposed from the plastic encapsulation block;

[0011] The metal plate that has been plastic-sealed is placed in the rib cutting device, and the rib cutting device is controlled to cut and separate each of the workpieces on the metal plate, and the outer pins of each of the workpieces are bent to form a chip body.

[0012] According to the plastic sealing cutting rib control method of chip packaging of the first aspect embodiment of the present application, there are at least the following beneficial effects: the chamber structure is obtained by obtaining the precise size and shape of the injection molding cavity, and the injection molding requirements of the chip are obtained. Subsequently, an injection molding simulation model is constructed according to the chamber structure and the injection molding requirements. Subsequently, a metal plate with a grain and a frame with completed lead welding is placed between the first template and the second template to ensure that each workpiece is accurately aligned. According to the optimized injection molding simulation model parameters, the injection molding device is controlled to inject molten plastic sealing material into the injection molding cavity. After the plastic sealing material is cooled and solidified in the injection molding cavity, a plastic sealing block that wraps the grain and the frame is formed, and at the same time, the outer pins of the frame are ensured to be exposed from the plastic sealing block. Finally, the metal plate that has completed plastic sealing is transferred to the rib cutting device. The rib cutting device accurately cuts off the connecting part between each workpiece according to the preset program to achieve the separation of the workpieces. At the same time, the outer pins of each workpiece are bent to meet the needs of subsequent assembly or use. In this application, by constructing an injection molding simulation model and performing parameter optimization, various changes in the injection molding process can be accurately predicted, thereby effectively reducing injection molding defects and improving the consistency and stability of plastic packaging quality.

[0013] According to some embodiments of the first aspect of the present application, constructing an injection molding simulation model according to the chamber structure and the injection molding requirements, and optimizing parameters of the injection molding simulation model include:

[0014] Constructing an injection molding simulation model according to the chamber structure and the injection molding requirements;

[0015] Acquire historical injection molding data of the workpiece corresponding to the injection molding device;

[0016] Extracting the historical injection molding data as parameters of the injection molding simulation model, performing simulated pouring according to the injection molding simulation model, and obtaining a simulated injection molded part;

[0017] Acquiring simulation monitoring data of the simulated injection molded part during the simulated pouring process;

[0018] According to the simulation monitoring data and the injection molding requirements, the parameters of the injection molding simulation model are optimized until the simulation monitoring data meets the preset conditions.

[0019] According to some embodiments of the first aspect of the present application, the simulation monitoring data includes temperature distribution information, pressure change information, flow state information, structural simulation strength, structural simulation profile and quality defect information of the simulated injection molded part; the injection molding requirement includes structural requirement strength and structural requirement profile;

[0020] The step of optimizing the parameters of the injection molding simulation model according to the simulation monitoring data and the injection molding requirements includes:

[0021] Generate a first optimization factor according to the temperature distribution information and the quality defect information; wherein the first optimization factor is used to optimize the temperature parameters in the injection molding simulation model;

[0022] Generate a second optimization factor according to the pressure change information, the structure simulation profile, the structure requirement profile and the quality defect information; wherein the second optimization factor is used to optimize the parameters related to pressure in the injection simulation model;

[0023] Generate a third optimization factor according to the flow rate state information, the structural simulation strength, the structural requirement strength and the quality defect information; wherein the third optimization factor is used to optimize the parameters related to the injection molding melt flow rate in the injection molding simulation model;

[0024] Parameters of the injection molding simulation model are optimized according to the first optimization factor, the second optimization factor and the third optimization factor.

[0025] According to some embodiments of the first aspect of the present application, optimizing the parameters of the injection molding simulation model according to the first optimization factor, the second optimization factor, and the third optimization factor includes:

[0026] Obtaining constraints among the first optimization factor, the second optimization factor, and the third optimization factor;

[0027] Determining the model adjustment factor according to the first optimization factor, the second optimization factor, the third optimization factor and the constraint condition by using a preset first formula;

[0028] Among them, the first formula is:

[0029] M=w1·F1+w2·F2+w3·F3+wC C(F1,F2,F3);

[0030] Wherein, M represents the model adjustment factor, F1 represents the first optimization factor, F2 represents the second optimization factor, F3 represents the third optimization factor, C(F1, F2, F3) represents the constraint condition, w1 represents the weight of the first optimization factor, w2 represents the weight of the second optimization factor, w3 represents the weight of the third optimization factor, and w c represents the weight of the constraint condition;

[0031] The parameters of the injection molding simulation model are optimized according to the adjustment factor.

[0032] According to some embodiments of the first aspect of the present application, an injection channel is provided in the first template, and the injection channel includes a main channel and a plurality of branch channels, and an electric control valve and a flow rate detector are provided at the inlet end of each branch channel, and the branch channel is connected to the main channel, and a plurality of injection holes are provided in each branch channel, and each injection hole is one of the injection cavities;

[0033] According to the optimized injection simulation model, controlling the injection device to perform pouring in each injection cavity comprises:

[0034] Determining a standard flow rate according to the optimized injection molding simulation model;

[0035] Controlling the injection molding device to perform pouring in each of the injection molding cavities;

[0036] Acquiring the current flow velocity detected by the flow velocity detector from each of the branch flow channels;

[0037] The opening size of the electric control valve in each branch flow channel is adjusted according to the current flow rate and the standard flow rate.

[0038] According to some embodiments of the first aspect of the present application, before the step of controlling the injection molding device to perform pouring in each of the injection molding cavities according to the optimized injection molding simulation model, the step further includes:

[0039] Close all the injection holes and the one-way valves;

[0040] The injection molding device is controlled to pour into the main channel, and the one-way valves in the branch channels are opened in sequence according to a preset time interval and in the order of arrangement of the main channel inlet ends from far to near, so that all the branch channels are filled with injection molding melt before pouring; wherein the time interval is the time it takes for one branch channel to be filled with injection molding melt.

[0041] According to some embodiments of the first aspect of the present application, the rib cutting device includes a third template and a fourth template, the fourth template is provided with a plurality of rib cutting modules, the rib cutting module includes a first positioning column, a positioning chuck and a cutting piece, two of each of the first positioning column and the cutting piece are provided, the two cut pieces are arranged between the two first positioning columns, the positioning chuck is arranged between the two cutting pieces, a molding portion is provided on a side of the lower end of the cutting piece away from the positioning chuck, a blade portion is provided on a side of the lower end of the cutting piece close to the positioning chuck, a positioning groove in the positioning chuck matches the shape of the plastic sealing block, the third template is provided with a placement groove at a corresponding position of the rib cutting module, guide channels and second positioning columns corresponding to the first positioning columns are provided on both sides of the placement groove, and the guide channel is located between the second positioning columns;

[0042] Placing the metal plate after plastic encapsulation in the rib cutting device, controlling the rib cutting device to cut and separate each of the workpieces on the metal plate, and bending the outer pins of each of the workpieces to form a chip body, includes:

[0043] Placing the metal plate that has been plastic-sealed on the third template, with the plastic-sealed block of the workpiece on the metal plate located in the placement groove;

[0044] Controlling the first positioning column to approach the corresponding second positioning column until the first positioning column and the second positioning column clamp the outer side of the outer pin of the frame in the workpiece;

[0045] Controlling the positioning chuck to move toward the plastic encapsulation block until the positioning groove of the positioning chuck is inserted into the top of the plastic encapsulation block;

[0046] The cutting piece is controlled to move toward the plastic encapsulation block so that the blade of the cutting piece cuts off the outer pins along the position where the first positioning column and the second positioning column are clamped, and the shaping portion of the cutting piece drives the remaining outer pins on the workpiece to be pressed down and bent along the guide channel to form a chip body.

[0047] According to some embodiments of the first aspect of the present application, the packaging production line further includes a baking device;

[0048] After the step of controlling the injection molding device to perform pouring in each of the injection molding cavities according to the optimized injection molding simulation model so as to form a plastic encapsulation block wrapped around the grain and the frame on the workpiece, the method further includes:

[0049] Transferring the metal plate into the heating chamber of the baking device;

[0050] Controlling the baking device to heat the heating chamber at a preset first rate until the temperature in the heating chamber reaches a preset temperature;

[0051] Controlling the baking device to maintain the preset temperature for a preset first time period;

[0052] The baking device is controlled to cool the heating chamber at a preset second rate until the temperature in the heating chamber returns to an initial temperature; wherein the first rate is greater than the second rate.

[0053] In a second aspect, the present application also provides a chip packaging production line, comprising: at least one memory; at least one processor; at least one program; the program is stored in the memory, and the processor executes at least one program to implement the chip packaging plastic sealing cutting rib control method as described in any embodiment of the first aspect.

[0054] In a third aspect, the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer-executable signal, and the computer-executable signal is used to execute the plastic sealing rib cutting control method for chip packaging as described in any embodiment of the first aspect.

[0055] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0057] Figure 1 A flow chart of a method for controlling plastic encapsulation rib cutting of chip packaging provided in one embodiment of the present application;

[0058] Figure 2 A schematic structural diagram of a metal plate including a workpiece to be plastic-encapsulated provided in one embodiment of the present application;

[0059] Figure 3 A schematic diagram of the structure of a metal plate after plastic sealing provided in one embodiment of the present application;

[0060] Figure 4 A schematic diagram of the structure of an injection molding flow channel inside an injection molding device provided in one embodiment of the present application;

[0061] Figure 5 A schematic diagram of the structure of a tendon cutting device provided by an embodiment of the present application in a first state;

[0062] Figure 6A schematic structural diagram of a tendon cutting device provided in an embodiment of the present application in a second state.

[0063] The figures are as follows:

[0064] Metal plate 100; crystal grain 110; frame 120; plastic package block 130; main channel 210; branch channel 220; electric control valve 221; flow rate detector 222; injection hole 223; first positioning column 310, positioning chuck 320; cutting piece 330; second positioning column 340; placement groove 350; guide channel 351. DETAILED DESCRIPTION

[0065] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0066] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0067] In the description of this application, if there is a description of first or second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0068] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0069] In the field of chip packaging technology, with the rapid development of the semiconductor industry, the requirements for chip packaging accuracy, efficiency and reliability are increasing. The traditional chip packaging plastic sealing cutting process often relies on trial and error and repeated adjustments, which not only leads to low production efficiency, but also makes it difficult to ensure the stability and consistency of plastic sealing quality. Specifically, the injection molding process in the chip packaging process is one of the key technologies, which directly affects the chip protection effect, heat dissipation performance and the reliability of the final product.

[0070] However, in actual operation, the injection molding process is affected by many factors, such as the fluidity of the injection molding material, injection pressure, temperature control, injection speed, and the geometry of the injection molding cavity. The complex interaction between these factors makes it extremely difficult to predict and control the injection molding results. Traditional methods usually use repeated trials and corrections to find the best injection molding conditions. This method is not only time-consuming and laborious, but also difficult to cope with the differences in material properties of different batches and slight changes in the injection molding cavity design. As a result, it is difficult to accurately predict and control various parameters in the injection molding process, resulting in unstable plastic packaging quality and affecting chip performance and reliability.

[0071] Based on this, the present application provides a chip packaging plastic encapsulation cutting control method, production line and storage medium to solve the above-mentioned technical problems. The technical solutions provided by the present application are described in detail one by one below.

[0072] First, refer to Figures 1 to 3 The present application provides a plastic encapsulation rib cutting control method for chip packaging, which is applied to a chip packaging production line, the production line includes: an injection molding device and a rib cutting device, the injection molding device includes a first template and a second template, and a plurality of injection molding cavities are formed between the first template and the second template. The plastic encapsulation rib cutting control method includes but is not limited to the following steps:

[0073] Step S110: obtaining the cavity structure and injection molding requirements of the injection molding cavity;

[0074] Step S120: constructing an injection molding simulation model according to the chamber structure and injection molding requirements, and optimizing the parameters of the injection molding simulation model;

[0075] Step S130: placing a metal plate between the first template and the second template, so that the workpieces to be encapsulated on the metal plate are located in corresponding injection molding cavities one by one; wherein the workpieces are assemblies formed by the die and the frame after the lead welding is completed;

[0076] Step S140: According to the optimized injection molding simulation model, the injection molding device is controlled to perform casting in each injection molding cavity, so that a plastic encapsulation block wrapping the crystal grain and the frame is formed on the workpiece; wherein the outer pins of the frame are exposed from the plastic encapsulation block;

[0077] Step S150: placing the metal plate after plastic encapsulation in a rib cutting device, and controlling the rib cutting device to cut and separate each workpiece on the metal plate, and bend the outer pins of each workpiece to form a chip body.

[0078] In step S110 , the cavity structure of the injection cavity can be obtained by obtaining the precise size and shape of the injection cavity through CAD design files or actual measurements.

[0079] In step S120, the injection molding simulation model is a virtual model that uses computer technology and numerical methods to simulate the injection molding process. It can accurately simulate the entire injection molding process, such as the flow, cooling, solidification and demolding of the plastic melt in the mold, and provide important support for mold design, process optimization and product quality control. Specifically, by inputting different process parameters (such as injection speed, pressure, temperature, etc.) and mold design parameters, the injection molding simulation model can highly simulate various physical and chemical changes in the actual injection molding process, including the flow behavior, heat conduction, pressure distribution, cooling rate, etc. of the plastic melt. The simulation model can predict the molding quality of the product, such as defects such as warping, shrinkage marks, and weld marks. Further, the injection molding simulation model can display the injection molding process in the form of a three-dimensional animation, so that the user can intuitively observe the flow and molding process of the plastic melt in the mold. Through the simulation model, potential product defects, such as flash, flow marks, bubbles, etc., can be predicted and avoided in the mold design stage, thereby optimizing the mold structure and improving the mold quality and service life. Conducting simulation before actual production can avoid mold trial failure and rework caused by improper mold design or process parameters, thereby saving time and cost and reducing production risks.

[0080] In step S110 to step S150, the chamber structure is obtained by obtaining the precise size and shape of the injection molding cavity, and the injection molding requirements of the chip are obtained. Subsequently, an injection molding simulation model is constructed according to the chamber structure and the injection molding requirements. Subsequently, a metal plate with a grain and a frame with completed lead welding is placed between the first template and the second template to ensure that each workpiece is accurately aligned. According to the optimized injection molding simulation model parameters, the injection molding device is controlled to inject molten plastic encapsulation material into the injection molding cavity. After the plastic encapsulation material is cooled and solidified in the injection molding cavity, a plastic encapsulation block that wraps the grain and the frame is formed, and at the same time, the outer pins of the frame are ensured to be exposed from the plastic encapsulation block. Finally, the metal plate that has completed the plastic encapsulation is transferred to the rib cutting device. The rib cutting device accurately cuts off the connecting part between each workpiece according to a preset program to achieve the separation of the workpieces. At the same time, the outer pins of each workpiece are bent to meet the needs of subsequent assembly or use. In the present application, by constructing an injection molding simulation model and performing parameter optimization, various changes in the injection molding process can be accurately predicted, thereby effectively reducing injection molding defects and improving the consistency and stability of plastic encapsulation quality.

[0081] It is understandable that step S120 may include but is not limited to the following steps:

[0082] Step S210: constructing an injection molding simulation model according to the chamber structure and injection molding requirements;

[0083] Step S220: Acquire historical injection molding data of the corresponding workpiece cast by the injection molding device;

[0084] Step S230: extracting historical injection molding data as parameters of an injection molding simulation model, performing simulated pouring according to the injection molding simulation model, and obtaining a simulated injection molded part;

[0085] Step S240: obtaining simulation monitoring data of the simulated injection molded part during the simulated pouring process;

[0086] Step S250: Optimizing the parameters of the injection molding simulation model according to the simulation monitoring data and the injection molding requirements until the simulation monitoring data meets the preset conditions.

[0087] In step S210 to step S250, by constructing an injection molding simulation model and combining historical injection molding data as initial parameters, various physical and chemical changes in the actual injection molding process can be simulated more realistically. In the simulation process, by continuously acquiring monitoring data of simulated injection molding parts and comparing and analyzing with injection molding requirements, the parameters of the injection molding simulation model can be discovered and adjusted in time. In the process of iterative optimization, the aim is to find the best combination of process parameters so that the simulation monitoring data can meet the preset conditions, thereby ensuring the quality and stability of the injection molding parts. By combining historical data to optimize the injection molding process parameters, the process parameters can be simulated and adjusted multiple times without actually producing injection molding parts until the best solution is found. This method greatly reduces the number and cost of mold trials, improves production efficiency and economic benefits, and can ensure that the quality and performance of different batches of injection molding parts have better consistency and stability.

[0088] It is understood that the simulation monitoring data includes temperature distribution information, pressure change information, flow state information, structural simulation strength of the simulated injection molded part, structural simulation profile and quality defect information; the injection molding requirements include structural requirement strength and structural requirement profile. In step S250, the following steps may be included but not limited to:

[0089] Step S310: generating a first optimization factor according to the temperature distribution information and the quality defect information; wherein the first optimization factor is used to optimize the temperature parameters in the injection molding simulation model;

[0090] Step S320: generating a second optimization factor according to the pressure change information, the structure simulation profile, the structure requirement profile and the quality defect information; wherein the second optimization factor is used to optimize the parameters related to the pressure in the injection simulation model;

[0091] Step S330: generating a third optimization factor according to the flow rate state information, the structure simulation strength, the structure requirement strength and the quality defect information; wherein the third optimization factor is used to optimize the parameters related to the injection molding melt flow rate in the injection molding simulation model;

[0092] Step S340: Optimizing the parameters of the injection simulation model according to the first optimization factor, the second optimization factor and the third optimization factor.

[0093] Among them, in the injection molding simulation model, the temperature distribution of the plastic melt in the mold during the injection molding process is calculated through the simulation model to obtain the temperature distribution information. By recording the changes in the injection pressure during the injection molding process, including injection pressure, holding pressure, etc., pressure change information is generated. By simulating the flow speed, direction and other states of the plastic melt in the mold, the flow state information is obtained. By predicting the structural strength of the injection molded parts, such as tensile strength and compressive strength, the structural simulation strength is obtained. By simulating the outer contour of the injection molded parts, which also includes detailed information such as the size and size of the simulated parts, the structural simulation contour is obtained. Identify and record quality defects that may occur during the simulation process, such as shrinkage marks, bubbles, weld marks, etc., and obtain quality defect information.

[0094] In step S310 to step S340, the influence of temperature on the quality of the injection molded part is evaluated according to the temperature distribution information and the quality defect information. For example, uneven temperature may cause shrinkage marks or warping, thereby generating a first optimization factor for the temperature parameter. The pressure change information, the structural simulation profile, the structural requirement profile and the quality defect information are comprehensively considered to evaluate the influence of pressure on the outer contour and quality of the injection molded part. By adjusting the pressure parameters using the second optimization factor, the contour accuracy of the injection molded part can be optimized and the quality defects can be reduced. Based on the flow rate state information, the structural simulation strength and the structural requirement strength, the influence of the injection melt flow rate on the structural strength of the injection molded part is evaluated. Optimizing the flow rate parameters by the third optimization factor can ensure that the injection molded part has sufficient structural strength while reducing internal defects. According to the first optimization factor, the second optimization factor and the third optimization factor, the temperature, pressure and flow rate parameters in the injection simulation model are comprehensively adjusted. Through the iterative optimization process, the parameter values ​​are continuously adjusted until the simulation monitoring data meets the preset conditions. In this step, through multi-factor comprehensive optimization, it is ensured that the injection molded part reaches the optimal state in all aspects, the quality and consistency of the injection molded part are improved, and the defective rate is reduced.

[0095] It is understandable that step S340 may include but is not limited to the following steps:

[0096] Step S410: Obtaining constraints among the first optimization factor, the second optimization factor, and the third optimization factor;

[0097] Step S420: determining a model adjustment factor according to the first optimization factor, the second optimization factor, the third optimization factor and the constraint condition by using a preset first formula;

[0098] Among them, the first formula is:

[0099] M=w1·F1+w2·F2+w3·F3+w C C(F1,F2,F3);

[0100] Where M represents the model adjustment factor, F1 represents the first optimization factor, F2 represents the second optimization factor, F3 represents the third optimization factor, C(F1, F2, F3) represents the constraint condition, w1 represents the weight of the first optimization factor, w2 represents the weight of the second optimization factor, w3 represents the weight of the third optimization factor, and w c represents the weight of the constraint;

[0101] Step S430: Optimizing the parameters of the injection molding simulation model according to the adjustment factors.

[0102] In step S410 to step S430, during the injection molding process, there is indeed a mutual constraint and influence relationship between the three factors of temperature, pressure and flow, for example:

[0103] Between temperature and pressure, when the temperature is set higher, the viscosity of the plastic melt will decrease and the fluidity will increase, which will help the plastic melt fill the mold cavity more easily. However, this also means that more plastic melt will be injected into the mold in the same amount of time, so higher pressure is required to drive the melt flow and ensure that it fully fills the mold. Therefore, the higher the set temperature, the greater the required injection pressure. Conversely, if the temperature is set too low, the viscosity of the melt will increase and the fluidity will deteriorate. At this time, even if the pressure is increased, it will be difficult for the melt to fill the mold smoothly, which may lead to problems such as insufficient product molding and poor surface quality.

[0104] Between temperature and flow, as the temperature rises, the viscosity of the plastic decreases and the fluidity increases, which is conducive to the flow and filling of the melt in the mold. However, too high a temperature may also cause problems such as overheating and degradation of the melt, the generation of bubbles, or overheating of the mold. Therefore, when controlling the temperature, it is necessary to find a balance point to ensure that the melt has good fluidity while avoiding the adverse effects of excessive temperature.

[0105] Between pressure and flow, the injection pressure directly affects the flow speed and filling effect of the melt in the mold. The greater the pressure, the greater the shear effect on the melt and the better the fluidity, which helps the melt fill the mold cavity faster and reduce the filling time. However, too high pressure may also cause the melt to produce excessive internal stress, reduce melt viscosity and form defects such as flash. Therefore, when setting the pressure, it is necessary to make reasonable adjustments based on the mold structure, material properties and product requirements.

[0106] Therefore, there should also be certain constraints between the first optimization factor, the second optimization factor and the third optimization factor. This kind of relationship reflects the interrelationship and mutual influence of the three factors of temperature, pressure and flow in the injection molding process. In the optimization process, these constraints need to be fully considered to achieve efficient, stable and high-quality injection molding production. In this step, the model adjustment factor generated by the first formula should be able to reflect the specific direction and degree of adjustment of the injection molding simulation model parameters. It may be a combination of one or more parameters to guide the subsequent parameter optimization process. Considering the constraint relationship between different optimization factors during the optimization process improves the efficiency of model training.

[0107] Reference Figure 4 It can be understood that the first template is provided with an injection channel, the injection channel includes a main channel and a plurality of branch channels, each branch channel is provided with an electric control valve and a flow rate detector at the inlet end, and is connected to the main channel, each branch channel is provided with a plurality of injection holes, and each injection hole is an injection cavity. In step S140, the following steps may be included but not limited to:

[0108] Step S510: determining a standard flow rate according to the optimized injection molding simulation model;

[0109] Step S520: controlling the injection molding device to perform pouring in each injection molding cavity;

[0110] Step S530: obtaining the current flow velocity detected by the flow velocity detector from each branch channel;

[0111] Step S540: adjusting the opening of the electric control valve in each branch flow channel according to the current flow rate and the standard flow rate.

[0112] In step S510 to step S520, according to the optimized injection simulation model, the system first calculates or sets a standard flow rate. This standard flow rate is the optimal flow rate obtained based on the simulation results, which ensures that the material can be evenly and quickly filled into each injection cavity during the injection molding process, while avoiding quality problems caused by too fast or too slow. Then the injection molding device is started, and the injection molding material begins to be transported to each branch flow channel through the main channel. During the injection molding process, the current flow rate data is obtained from the flow rate detector on each branch flow channel in real time. These data reflect the actual flow rate of the current injection molding material in each branch flow channel. The system compares the current flow rate obtained with the standard flow rate. If the current flow rate is higher than the standard flow rate, it means that the material in the branch flow channel flows too fast, and it may be necessary to reduce the opening of the electric control valve to slow down the flow rate; conversely, if the current flow rate is lower than the standard flow rate, the opening of the electric control valve is increased to speed up the flow rate. Through such adjustments, the flow rate in each branch flow channel is as close to the standard flow rate as possible, thereby achieving uniform injection molding. By real-time monitoring and adjusting the flow rate of each branch channel, it is ensured that the injection material can be evenly and stably filled into each injection cavity, thus avoiding quality problems caused by uneven flow rate, such as bubbles, shrinkage, uneven filling, etc. At the same time, the automated flow rate adjustment mechanism can reduce manual intervention and improve the automation level of the production line.

[0113] Continue to refer to Figure 4 It is understandable that before step S140, the following steps are also included but not limited to:

[0114] Step S610: closing all injection holes and one-way valves;

[0115] Step S620: Control the injection molding device to pour into the main channel, and open the one-way valves in the branch channels in sequence according to the preset time interval and in the order of arrangement from far to near of the main channel inlet end, so that all the branch channels are filled with injection molding melt before pouring; wherein the time interval is the time for a branch channel to be filled with injection molding melt.

[0116] In step S610 to step S620, before starting to pour, the injection holes and one-way valves on all branch channels are first closed. This is to ensure that when filling the main channel and the branch channel, the injection molding melt will not enter the injection cavity in advance, thereby affecting the filling effect and product quality. The injection molding device is controlled to start working and pour the injection molding melt into the main channel. At this time, since the one-way valves of all branch channels are in a closed state, the injection molding melt will first fill the main channel. According to the preset time interval and the arrangement order of the main channel inlet end from far to near, the one-way valves on each branch channel are opened in sequence. The time interval here is set according to the time required for a branch channel to be filled with injection molding melt, so as to ensure that the previous branch channel has been completely filled before opening the next one-way valve. When the one-way valve is opened, the injection molding melt in the main channel will flow into the branch channel and continue to flow forward until the entire branch channel is filled. Due to the presence of the one-way valve, the injection molding melt will not flow back to the main channel. By opening the one-way valves in sequence, it can be ensured that each branch channel is evenly filled with the injection melt before pouring. When all the branch channels are filled with the injection melt, the injection hole is opened for pouring, which can ensure that the injection melt can enter the injection cavity more smoothly and quickly, thereby improving the injection efficiency and product quality. By optimizing the initial stage of the injection molding process, a more stable and reliable operating environment is provided for the entire injection molding system, which helps to reduce production interruptions and quality problems caused by system fluctuations or failures.

[0117] Reference Figure 5 and Figure 6 It can be understood that the rib cutting device includes a third template and a fourth template, and the fourth template is provided with a plurality of rib cutting modules, and the rib cutting module includes a first positioning column, a positioning chuck and a cutting piece, and the first positioning column and the cutting piece are provided with two, and the two cutting pieces are arranged between the two first positioning columns, and the positioning chuck is arranged between the two cutting pieces, and the lower end of the cutting piece is provided with a molding part on the side away from the positioning chuck, and the lower end of the cutting piece is provided with a blade part on the side close to the positioning chuck, and the positioning groove in the positioning chuck matches the shape of the plastic sealing block, and the third template is provided with a placement groove at the corresponding position of the rib cutting module, and the two sides of the placement groove are provided with a guide channel and a second positioning column corresponding to the first positioning column, and the guide channel is located between the second positioning columns. In step S150, it can include but not be limited to the following steps:

[0118] Step S710: placing the metal plate that has been plastic-sealed on the third template, with the plastic-sealed block of the workpiece on the metal plate located in the placement groove;

[0119] Step S720: Control the first positioning column to approach the corresponding second positioning column until the first positioning column and the second positioning column clamp the outer side of the outer pin of the frame in the workpiece;

[0120] Step S730: Control the positioning chuck to move toward the plastic encapsulation block until the positioning groove of the positioning chuck is inserted into the top of the plastic encapsulation block;

[0121] Step S740: Control the cutting piece to move toward the plastic encapsulation block so that the blade of the cutting piece cuts off the external pins along the clamping position of the first positioning column and the second positioning column, and the shaping part of the cutting piece drives the remaining external pins on the workpiece to be pressed down and bent along the guide channel to form the chip body.

[0122] In step S710 to step S740, first, the metal plate that has been plastic-sealed is placed on the third template to ensure that the plastic-sealed block of each workpiece is accurately aligned and placed in the placement groove to locate the initial position of the workpiece. Then, the first positioning column is controlled to move in the direction of the corresponding second positioning column until the two tightly clamp the outer side of the outer pin in the workpiece to ensure the stability and accuracy during cutting and prevent the outer pin from moving or deforming during the cutting process. Then, the positioning chuck is controlled to move in the direction of the plastic-sealed block until its positioning groove is completely stuck in the top of the plastic-sealed block to ensure the stability of the plastic-sealed block during cutting and prevent unnecessary damage to the chip inside the plastic-sealed block. Finally, the cutting piece is controlled to move in the direction of the plastic-sealed block. The blade of the cutting piece will cut off the outer pin along the position where the first positioning column and the second positioning column are clamped, and the shaping part of the cutting piece will press down the remaining outer pin along the guide channel to achieve the bending of the outer pin. This step simultaneously completes the cutting and bending of the outer pin to form the final chip body. Through the guide channel, the outer pins can be pressed into seagull-shaped pins, straight-insert pins, J-shaped pins, etc., which are not specifically limited in this application. In the above steps, the precise positioning and clamping mechanism ensures the accuracy of cutting and bending, reduces product defects, and improves product consistency and quality.

[0123] It is understandable that the injection molding material in the present application is epoxy resin, and the production line also includes a baking device; after the step of pouring and molding is completed in step S140, the following steps may also be included but not limited to:

[0124] Step S810: moving the metal plate into the heating chamber of the baking device;

[0125] Step S820: controlling the baking device to heat the heating chamber at a preset first rate until the temperature in the heating chamber reaches a preset temperature;

[0126] Step S830: Control the baking device to maintain a preset temperature for a preset first time period;

[0127] Step S840: Control the baking device to cool down the heating chamber at a preset second rate until the temperature in the heating chamber returns to the initial temperature; wherein the first rate is greater than the second rate.

[0128] In step S810 to step S840, after the epoxy resin is injected and initially cured, it is heated and cured again to make it more completely cured. Among them, in the first rate of heating, it can be controlled at about 2-3°C per minute. After completing the baking for a preset time, the baking device is controlled to cool the heating chamber at a preset second rate, such as about 1-2°C per minute. Unlike the heating process, the cooling process needs to be slower and more stable to avoid problems such as thermal stress or cracks caused by rapid cooling. When the temperature in the heating chamber returns to the initial temperature, the cooling process ends and the baking process is completed. After post-curing treatment, the molecular chains inside the epoxy resin are arranged more closely, reducing gaps and defects, thereby improving the strength, hardness, heat resistance and other properties of the overall structure.

[0129] In a second aspect, the present application also provides a chip packaging production line, comprising: at least one memory, at least one processor and at least one program, the program is stored in the memory, and the processor executes one or more programs to implement the above-mentioned chip packaging lead welding control method.

[0130] The chamber structure is obtained by obtaining the precise size and shape of the injection molding cavity, and the injection molding requirements of the chip are obtained. Subsequently, an injection molding simulation model is constructed according to the chamber structure and the injection molding requirements. Subsequently, a metal plate with a grain and a frame with completed lead welding is placed between the first template and the second template to ensure that each workpiece is accurately aligned. According to the optimized injection molding simulation model parameters, the injection molding device is controlled to inject molten plastic encapsulation material into the injection molding cavity. After the plastic encapsulation material is cooled and solidified in the injection molding cavity, a plastic encapsulation block that wraps the grain and the frame is formed, while ensuring that the outer pins of the frame are exposed from the plastic encapsulation block. Finally, the metal plate that has completed the plastic encapsulation is transferred to the rib cutting device. The rib cutting device accurately cuts off the connecting part between each workpiece according to the preset program to achieve the separation of the workpieces. At the same time, the outer pins of each workpiece are bent to meet the needs of subsequent assembly or use. In this application, by constructing an injection molding simulation model and performing parameter optimization, various changes in the injection molding process can be accurately predicted, thereby effectively reducing injection molding defects and improving the consistency and stability of plastic encapsulation quality.

[0131] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs, non-transient computer executable programs and signals, such as program instructions / signals corresponding to the processing module in the embodiment of the present application. The processor executes various functional applications and data processing by running the non-transient software programs, instructions and signals stored in the memory, that is, the lead welding control method of the chip package of the above method embodiment is realized.

[0132] The memory may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required by at least one function; the data storage area may store relevant data of the lead welding control method of the above-mentioned chip package, etc. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processing module via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0133] One or more signals are stored in the memory, and when executed by one or more processors, the wire bonding control method for chip packaging in any of the above method embodiments is executed.

[0134] In a third aspect, an embodiment of the present application provides a computer-readable storage medium, which stores a computer program. The computer program is executed by one or more processors, and can enable the one or more processors to execute the lead welding control method of the chip package in the above method embodiment.

[0135] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, i.e., may be located in one place, or may be distributed over multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0136] Through the description of the above embodiments, it will be appreciated by those skilled in the art that all or some of the steps and systems in the disclosed methods above can be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, and the computer-readable medium can include a computer storage medium (or a non-transitory medium) and a communication medium (or a temporary medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as a computer-readable signal, a data structure, a program module or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassette, magnetic tape, disk storage or other magnetic storage device, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media generally embodies computer readable signals, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0137] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0138] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0139] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0140] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0141] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including multiple instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store programs.

[0142] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present application.

Claims

1. A chip packaging plastic sealing cutting rib control method, characterized in that: A production line applied to chip packaging, the production line comprising: an injection molding device and a rib cutting device, the injection molding device comprising a first template and a second template, a plurality of injection molding cavities being formed between the first template and the second template; The plastic sealing rib cutting control method comprises: Obtaining the cavity structure and injection molding requirements of the injection molding cavity; According to the chamber structure and the injection molding requirements, an injection molding simulation model is constructed, and parameters of the injection molding simulation model are optimized; Placing a metal plate between the first template and the second template so that the workpieces to be encapsulated on the metal plate are located in corresponding injection cavities one by one; wherein the workpieces are assemblies formed by the die and the frame after the lead welding is completed; According to the optimized injection simulation model, the injection molding device is controlled to perform casting in each of the injection molding cavities, so that a plastic encapsulation block wrapped around the grain and the frame is formed on the workpiece; wherein the outer pins of the frame are exposed from the plastic encapsulation block; The metal plate that has been plastic-sealed is placed in the rib cutting device, and the rib cutting device is controlled to cut and separate each of the workpieces on the metal plate, and the outer pins of each of the workpieces are bent to form a chip body.

2. The chip packaging plastic sealing cutting rib control method according to claim 1, characterized in that: The step of constructing an injection molding simulation model according to the chamber structure and the injection molding requirements, and optimizing parameters of the injection molding simulation model, includes: Constructing an injection molding simulation model according to the chamber structure and the injection molding requirements; Acquire historical injection molding data of the workpiece corresponding to the injection molding device; Extracting the historical injection molding data as parameters of the injection molding simulation model, performing simulated pouring according to the injection molding simulation model, and obtaining a simulated injection molded part; Acquiring simulation monitoring data of the simulated injection molded part during the simulated pouring process; According to the simulation monitoring data and the injection molding requirements, the parameters of the injection molding simulation model are optimized until the simulation monitoring data meets the preset conditions.

3. The chip encapsulation plastic sealing cutting rib control method according to claim 2, characterized in that: The simulation monitoring data includes temperature distribution information, pressure change information, flow state information, structural simulation strength, structural simulation profile and quality defect information of the simulated injection molded part; The injection molding requirements include structural strength requirements and structural profile requirements; The step of optimizing the parameters of the injection molding simulation model according to the simulation monitoring data and the injection molding requirements includes: Generate a first optimization factor according to the temperature distribution information and the quality defect information; wherein the first optimization factor is used to optimize the temperature parameters in the injection molding simulation model; Generate a second optimization factor according to the pressure change information, the structure simulation profile, the structure requirement profile and the quality defect information; wherein the second optimization factor is used to optimize the parameters related to pressure in the injection simulation model; Generate a third optimization factor according to the flow rate state information, the structural simulation strength, the structural requirement strength and the quality defect information; wherein the third optimization factor is used to optimize the parameters related to the injection melt flow rate in the injection simulation model; Parameters of the injection molding simulation model are optimized according to the first optimization factor, the second optimization factor and the third optimization factor.

4. The chip encapsulation plastic sealing cutting rib control method according to claim 3, characterized in that: Optimizing the parameters of the injection simulation model according to the first optimization factor, the second optimization factor and the third optimization factor includes: Obtaining constraints among the first optimization factor, the second optimization factor, and the third optimization factor; Determining the model adjustment factor according to the first optimization factor, the second optimization factor, the third optimization factor and the constraint condition by using a preset first formula; Among them, the first formula is: <h2 style=";text-align:left;direction:ltr">M = w1 F1 + w2 F2 + w3 F3 + w<h2 style=";text-align:left;direction:ltr"> C <h2 style=";text-align:left;direction:ltr"> C(F1,F2,F3); Wherein, M represents the model adjustment factor, F1 represents the first optimization factor, F2 represents the second optimization factor, F3 represents the third optimization factor, C(F1, F2, F3) represents the constraint condition, w1 represents the weight of the first optimization factor, w2 represents the weight of the second optimization factor, w3 represents the weight of the third optimization factor, and w c represents the weight of the constraint condition; The parameters of the injection molding simulation model are optimized according to the adjustment factor.

5. The chip packaging plastic encapsulation cutting rib control method according to claim 1, characterized in that: An injection molding channel is provided in the first template, and the injection molding channel includes a main molding channel and a plurality of branch molding channels. An electric control valve and a flow rate detector are provided at the inlet end of each branch molding channel, and the branch molding channel is connected to the main molding channel. A plurality of injection molding holes are provided in each branch molding channel, and each injection molding hole is one injection molding cavity. According to the optimized injection simulation model, controlling the injection device to perform pouring in each injection cavity comprises: Determining a standard flow rate according to the optimized injection molding simulation model; Controlling the injection molding device to perform pouring in each of the injection molding cavities; Acquiring the current flow velocity detected by the flow velocity detector from each of the branch flow channels; The opening size of the electric control valve in each branch flow channel is adjusted according to the current flow rate and the standard flow rate.

6. The chip packaging plastic encapsulation cutting rib control method according to claim 5, characterized in that: Before the step of controlling the injection molding device to perform pouring in each of the injection molding cavities according to the optimized injection molding simulation model, the method further includes: Close all the injection holes and the one-way valves; The injection molding device is controlled to pour into the main channel, and the one-way valves in the branch channels are opened in sequence according to a preset time interval and in the order of arrangement of the main channel inlet ends from far to near, so that all the branch channels are filled with injection molding melt before pouring; wherein the time interval is the time it takes for one branch channel to be filled with injection molding melt.

7. The chip packaging plastic encapsulation cutting rib control method according to claim 1, characterized in that: The rib cutting device comprises a third template and a fourth template, the fourth template is provided with a plurality of rib cutting modules, the rib cutting module comprises a first positioning column, a positioning chuck and a cutting piece, two of each of the first positioning column and the cutting piece are provided, the two cutting pieces are provided between the two first positioning columns, the positioning chuck is provided between the two cutting pieces, a molding portion is provided on a side of the lower end of the cutting piece away from the positioning chuck, a blade portion is provided on a side of the lower end of the cutting piece close to the positioning chuck, a positioning groove in the positioning chuck matches the shape of the plastic sealing block, the third template is provided with a placement groove at a corresponding position of the rib cutting module, guide channels and second positioning columns corresponding to the first positioning columns are provided on both sides of the placement groove, and the guide channel is located between the second positioning columns; Placing the metal plate after plastic encapsulation in the rib cutting device, controlling the rib cutting device to cut and separate each of the workpieces on the metal plate, and bending the outer pins of each of the workpieces to form a chip body, includes: Placing the metal plate that has been plastic-sealed on the third template, with the plastic-sealed block of the workpiece on the metal plate located in the placement groove; Controlling the first positioning column to approach the corresponding second positioning column until the first positioning column and the second positioning column clamp the outer side of the outer pin of the frame in the workpiece; Controlling the positioning chuck to move toward the plastic encapsulation block until the positioning groove of the positioning chuck is inserted into the top of the plastic encapsulation block; The cutting piece is controlled to move toward the plastic encapsulation block so that the blade of the cutting piece cuts off the outer pins along the position where the first positioning column and the second positioning column are clamped, and the shaping portion of the cutting piece drives the remaining outer pins on the workpiece to be pressed down and bent along the guide channel to form a chip body.

8. The chip packaging plastic encapsulation cutting rib control method according to claim 1, characterized in that: The production line also includes a baking device; After the step of controlling the injection molding device to perform pouring in each of the injection molding cavities according to the optimized injection molding simulation model so as to form a plastic encapsulation block wrapped around the grain and the frame on the workpiece, the method further includes: Transferring the metal plate into the heating chamber of the baking device; Controlling the baking device to heat the heating chamber at a preset first rate until the temperature in the heating chamber reaches a preset temperature; Controlling the baking device to maintain the preset temperature for a preset first time period; The baking device is controlled to cool the heating chamber at a preset second rate until the temperature in the heating chamber returns to an initial temperature; wherein the first rate is greater than the second rate.

9. A chip packaging production line, characterized in that: include: at least one memory; at least one processor; at least one program; The programs are stored in the memory, and the processor executes at least one of the programs to implement the plastic encapsulation rib cutting control method for chip packaging according to any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer-executable signal, and the computer-executable signal is used to execute the plastic encapsulation rib cutting control method for chip packaging according to any one of claims 1 to 8.

Images