Forming process and mold of battery pack bottom guard plate
By using molds and adhesives in the forming process of the battery pack bottom guard plate, multiple connecting layers are integrated into molding, the problem of poor connection stability of the existing battery pack bottom guard plate is solved, and a higher Strength and protection.
Patent Information
- Application Number
- CN202510074062.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2025-02-18
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The connection mode of the existing battery pack bottom guard plate is poor, and it is easy to loosen due to vibration, affecting the electrical performance of the battery pack.
By adopting a molding process of a battery-pack bottom guard plate, a plurality of connecting layers are integrated with adhesive as medium in the mold, and the pressure and heating of the mold are used to cure the adhesive, thereby forming an integrated battery. Bottom guard plate.
It significantly improves the overall strength and stability of the battery pack bottom guard plate, avoids gaps and weaknesses in traditional splicing methods, and enhances waterproof and corrosion resistance.
Smart Images

Figure CN119458929A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of battery technology, and in particular to a molding process and mold for a battery pack bottom guard plate. Background Art
[0002] The battery pack is one of the core components of an electric vehicle. The battery pack is usually installed at the bottom of the vehicle body and is directly exposed in the chassis area of the vehicle body. However, such a design causes the heat inside the battery pack to be easily transferred to the external environment through the bottom guard plate of the battery pack, thereby affecting the electrical performance of the battery pack. Therefore, it is necessary to install a bottom guard plate in the lower box of the battery pack to protect it.
[0003] The existing battery pack bottom guard plate is generally composed of a multi-layer structure, on the one hand to improve the strength and durability of the guard plate, and on the other hand to reduce the weight problem caused by the traditional aluminum alloy guard plate. The connection between the internal layers of the existing guard plate is generally bolted or glued, which has certain limitations in actual use and its stability is not good enough; for example, the bolt connection is easy to loosen due to vibration. Therefore, this application proposes a molding process and mold for the battery pack bottom guard plate to solve the above technical problems. Summary of the invention
[0004] One of the purposes of the present application is to provide a molding process for a battery pack bottom guard plate.
[0005] Another object of the present application is to provide a molding die for a battery pack bottom guard plate.
[0006] To achieve the above objectives, the technical solution adopted in the present application is: a molding process for a battery pack bottom guard plate, comprising the following steps: S100: stacking multiple connecting layers from bottom to top to obtain a preform of the battery pack bottom guard plate; S200: spraying an adhesive evenly on the top surface of the preform, and then placing the preform into a molding mold cavity; S300: closing the mold and applying a set pressure so that the adhesive fills the entire cavity and penetrates into the preform for curing; S400: opening the mold to obtain an integrated molded battery pack bottom guard plate.
[0007] Preferably, in step S100, the preform includes an upper continuous fiber cloth, a middle polyurethane sandwich panel and a lower continuous fiber cloth which are arranged in sequence from top to bottom.
[0008] Preferably, in step S200, the adhesive includes epoxy resin and a curing agent.
[0009] Preferably, in step S300, after the mold is closed, the following steps are also included: vacuuming the mold cavity to remove bubbles in the cavity; heating the mold cavity to quickly solidify the adhesive.
[0010] Preferably, step S400 also includes the following step: blowing air into the mold cavity so that the formed battery pack bottom guard plate is separated from the cavity by blow molding.
[0011] A forming die for a battery pack bottom guard plate, used to realize the forming process of the above-mentioned battery pack bottom guard plate, comprises an upper die, a lower die, a blowing mechanism, a vacuum mechanism and a heating mechanism, wherein the blowing mechanism, the vacuum mechanism and the heating mechanism are all installed on the lower die and cooperate with the cavity of the die.
[0012] Preferably, a convex portion is provided at the bottom end of the upper mold, and a groove is provided at the top end of the lower mold, and the convex portion cooperates with the groove to form the cavity; the convex portion and the groove form a mating surface at the mating point, and the angle between the mating surface and the horizontal plane is α, where 75°≤α≤90°.
[0013] Preferably, a glue overflow groove is provided at the top of the lower mold, the glue overflow groove is a closed structure and covers the periphery of the groove, and the glue overflow groove is located between the groove and the vacuum suction port of the vacuum mechanism; when the mold is closed, the glue overflow groove is suitable for collecting the extruded adhesive.
[0014] Preferably, the blowing mechanism includes a barrel, a column, and a driving device. The barrel is installed in the mold and the top end is connected to and flush with the cavity. The column is inserted into the barrel. The driving device is installed in the mold and the output end is connected to the column. The bottom end of the barrel is connected and cooperated with the driving device and is in a closed state. The interior of the barrel is divided into a first cavity and a second cavity from top to bottom. The caliber of the first cavity is adapted to the caliber of the column, the caliber of the second cavity is larger than the caliber of the column, an air cavity is formed between the second cavity and the column, and an air source connected to the air cavity is provided on the outside of the barrel; when the mold is closed, the column is suitable for cooperating with the first cavity, and the first cavity is in a closed state at this time; when the mold is opened for blowing, the column is suitable for moving downward under the drive of the driving device and entering the second cavity, and then the air source is suitable for conveying the airflow to the cavity through the air cavity, the second cavity and the first cavity.
[0015] Preferably, a plurality of sealing rings are sleeved on the outer upper end of the column; when the mold is closed, the sealing rings are abutted against the interior of the first cavity; a baffle is installed at the outer lower end of the upper mold, and a sealing ring is provided at the outer upper end of the lower mold; when the mold is closed, the sealing ring abuts against the baffle, and at this time the baffle covers the connection between the upper mold and the lower mold.
[0016] Compared with the prior art, the beneficial effects of this application are: The present invention integrates multiple connection layers of the battery pack bottom guard plate through the mold and adhesive, thereby significantly improving the overall strength and stability of the battery pack bottom guard plate. At the same time, since the adhesive can be evenly distributed during the molding process, the gaps and weaknesses that may occur in the traditional splicing method are effectively avoided, further enhancing the waterproof and anti-corrosion properties of the bottom guard plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the product structure of the molded battery pack bottom guard plate of the present invention.
[0018] Figure 2 It is a schematic diagram of the specific structure of the "sandwich" of the battery pack bottom guard plate of the present invention.
[0019] Figure 3 It is an overall schematic diagram of the molding die of the present invention.
[0020] Figure 4 It is a schematic diagram of the structure after the upper mold and the lower mold are separated according to the present invention.
[0021] Figure 5 It is a schematic diagram of the lower mold structure of the present invention.
[0022] Figure 6 It is a schematic diagram of the enlarged structure of point A of the present invention.
[0023] Figure 7 It is a schematic diagram of the cross-sectional structure of the present invention.
[0024] Figure 8 It is a schematic diagram of the enlarged structure of point B of the present invention.
[0025] Fig. 9 This is a schematic diagram of the adhesive flow principle when the matching surface angle α is too small.
[0026] Fig.10 It is a schematic diagram of the enlarged structure of point C of the present invention.
[0027] Fig.11 It is a schematic structural diagram of the air outlet mechanism of the present invention when it is working.
[0028] Fig.12 It is a schematic diagram of the enclosure and the sealing ring of the present invention when they are matched.
[0029] Fig.13 It is a schematic diagram of the three-dimensional structure of the enclosure and the sealing ring of the present invention.
[0030] Fig.14 It is a schematic diagram of the specific structure of the blowing mechanism of the present invention.
[0031] Fig.15 It is a schematic diagram of the specific distribution structure of the blowing mechanism of the present invention.
[0032] In the figure: 1. battery pack bottom guard plate; 101. upper continuous fiber cloth; 102. middle polyurethane sandwich panel; 103. lower continuous fiber cloth; 2. upper mold; 201. convex part; 3. lower mold; 301. groove; 4. cavity; 5. overflow groove; 6. suction port; 7. blowing mechanism; 701. cylinder; 7011. first cavity; 7012. second cavity; 702. column; 703. driving device; 8. matching surface; 9. air cavity; 10. sealing ring; 11. enclosure; 12. sealing ring; 13. connecting hole. DETAILED DESCRIPTION
[0033] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0034] In the description of the present application, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of narrating the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific scope of protection of the present application.
[0035] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.
[0036] One of the preferred embodiments of the present application is as follows: Figures 1 to 15 As shown, a molding process of a battery pack bottom guard plate includes the following steps: S100: First, multiple connection layers constituting the battery pack bottom guard plate 1 are stacked, that is, stacked together layer by layer from bottom to top, which we call a preform of the battery pack bottom guard plate 1.
[0037] S200: The top surface of the obtained preform (ie the uppermost connecting layer) is uniformly sprayed with adhesive, and then the preform is placed into the cavity 4 of the molding mold.
[0038] S300: The mold is closed and a certain pressure is applied, so that the adhesive will be compressed under the action of the mold closing force, and the adhesive will fill the entire cavity 4. Of course, the adhesive will also flow and penetrate into the preform to solidify, so that the multi-layer preform will be fused into one under the action of the adhesive.
[0039] S400: The mold is opened, and at this time, the "integrated molded" battery pack bottom guard plate 1 can be obtained.
[0040] It can be seen that by adopting the above-mentioned process method and through the action of the mold and the adhesive, multiple connection layers can be integrated together, thereby significantly improving the overall strength and stability of the battery pack bottom guard plate 1. This integrated molding technology not only simplifies the production process, but also reduces material waste and improves production efficiency. In addition, since the adhesive can be evenly distributed during the molding process, it effectively avoids the gaps and weaknesses that may appear in the traditional splicing method, and further enhances the waterproof and anti-corrosion properties of the bottom guard plate. Through this process, the battery pack bottom guard plate 1 can maintain excellent mechanical properties and durability during long-term use, meeting high quality standards.
[0041] like Figure 2 As shown, the battery pack bottom guard plate 1 preferably adopts three groups, which are respectively from top to bottom: upper continuous fiber cloth 101, middle polyurethane sandwich panel 102 and lower continuous fiber cloth 103. These three layers of materials are tightly combined through the adhesive molding and curing process to form an integral structure. The upper continuous fiber cloth 101 mainly provides high strength and impact resistance to ensure that the bottom guard plate is not easily damaged when subjected to external force impact. The middle polyurethane sandwich panel 102 plays a good role in heat insulation and shock absorption, effectively improving the overall protection performance of the battery pack. The lower continuous fiber cloth 103 further enhances the bending strength and durability of the bottom guard plate. Through this layered design, the battery pack bottom guard plate 1 not only has excellent mechanical properties, but also can effectively reduce weight and improve the vehicle's endurance. In addition, the uniform distribution of the adhesive between the layers of material during the curing process further improves the overall stability and service life of the bottom guard plate.
[0042] Furthermore, in S200, the adhesive is preferably epoxy resin glue, which is a two-component structural adhesive prepared from epoxy resin and curing agent. During the curing process, the epoxy groups in the epoxy resin react chemically with the curing agent to form a cross-linked network structure, thereby achieving a firm bond to the adherend. Of course, in order to facilitate the demoulding process of the battery pack bottom guard plate 1 after molding, a small amount of demoulding agent can also be added to the epoxy resin glue.
[0043] Furthermore, in S300, in order to improve the curing speed and effect of the epoxy resin glue, the following steps are also included after the mold is closed: vacuuming is performed in the mold cavity 4, the purpose of which is: 1. The epoxy resin glue and the preform material may contain gases such as air and water vapor, which will form bubbles and affect the glue filling effect. Vacuuming can remove these gases, so that the colloid is more tightly filled in the cavity 4 and the material, avoiding the generation of bubbles, and thus improving the quality of subsequent products. 2. Vacuuming can also improve the permeability of epoxy resin, allowing it to better penetrate into the tiny cracks and holes inside the module, ensuring the integrity and uniformity of the glue filling.
[0044] On the other hand, it should be known that the curing speed of epoxy resin glue at room temperature is slow, that is, it takes a long time to cure; therefore, the cavity 4 of the mold can also be heated after the mold is closed. Heating can significantly accelerate the curing reaction of the epoxy resin glue, shorten the overall production cycle, and thus improve production efficiency.
[0045] After opening the mold in step S400, we need to take the formed battery pack bottom guard plate 1 out of the cavity 4; it should be noted that since the battery pack bottom guard plate 1 has a large overall area and a small thickness, the contact area with the cavity 4 is large, which may make demolding difficult, or forced demolding may easily cause damage to the battery pack bottom guard plate 1.
[0046] Therefore, in order to solve the above technical problems, step S400 also includes the following steps: blowing air into the mold cavity 4, and through the action of gas pressure, the battery pack bottom guard plate 1 and the cavity 4 are blow-molded and separated, thereby effectively reducing the adhesion between the two, so that the battery pack bottom guard plate 1 can be smoothly removed from the cavity 4, avoiding damage caused by forced demolding.
[0047] Another aspect of the present application also provides a molding mold for a battery pack bottom guard plate, which is used to realize the molding process of the above-mentioned battery pack bottom guard plate 1, including an upper mold 2, a lower mold 3, a blowing mechanism 7, a vacuum mechanism and a heating mechanism, wherein the blowing mechanism 7, the vacuum mechanism and the heating mechanism are all installed on the lower mold 3 and cooperate with the mold cavity 4.
[0048] It is understandable that, when the mold is closed, the vacuum mechanism can evacuate the cavity 4. Specifically: Figure 5 and Figure 6 As shown, a plurality of suction ports 6 can be evenly distributed along the outer circumference of the cavity 4 at the top of the lower mold 3. Of course, the plurality of suction ports 6 can be connected through pipelines. When vacuuming, the pipeline is connected to an external vacuum pump, and the air in the cavity 4 can be extracted through the negative pressure of the vacuum pump.
[0049] It should be known that the heating mechanism (not shown) can heat the cavity 4. Specifically, evenly distributed heating pipes can be passed through the lower mold 3, and heat-conducting liquid (gas), such as steam, water, and heat-conducting oil, etc., can be introduced into the heating pipes. Heat-conducting oil is preferably used here because it has high thermal stability and good heat transfer performance, which can ensure that the temperature in the cavity 4 is evenly distributed, thereby improving the molding quality.
[0050] In one of the embodiments of the present application, Figure 8 As shown, a convex portion 201 is provided at the bottom end of the upper mold 2, and a groove 301 is provided at the top end of the lower mold 3. The convex portion 201 cooperates with the groove 301 (i.e., the convex portion 201 is inserted into the groove 301) to form a cavity 4; a mating surface 8 is formed at the mating point between the convex portion 201 and the groove 301, and the angle between the mating surface 8 and the horizontal plane is α, wherein 75°≤α≤90°.
[0051] First of all, it should be noted that the mold of the present application is different from the traditional injection mold. The traditional injection mold has two mold bodies, the upper and lower mold bodies, which are closed to form the mold cavity of the mold, and then the injection liquid is injected into the mold cavity. However, the mold of the present design is to put the preform of the product into the mold cavity 4, and then mainly perform the molding process through the extrusion of the mold, specifically: put the preform into the groove 301, and then insert the convex part 201 into the groove 301 to realize the extrusion step of the preform.
[0052] It should be known that during the above-mentioned extrusion process, the excess epoxy resin glue in the cavity 4 will also overflow during extrusion, so the overflow amount of the colloid is crucial, because excessive overflow will cause insufficient filling of the cavity 4, affecting the structural strength of the product, and further deteriorating the molding quality of the subsequent battery pack bottom guard plate 1.
[0053] The angle α of the mating surface 8 has a crucial influence on the overflow of the colloid. Specifically, the mating surface 8 can be regarded as the inner side of the groove 301. We know that the groove 301 is composed of a bottom surface and multiple inner side surfaces, and the angle between the inner side surface away from the bottom surface and the horizontal plane is the angle α of the mating surface 8. When the colloid is squeezed and overflowed, the colloid overflows from the inner side surface of the groove 301. The larger the inclination of the angle α, the greater the resistance to the colloid overflowing; conversely, the smaller the inclination, the smaller the resistance to the colloid overflowing.
[0054] Specifically, the maximum angle of the angle α is 90°, that is, the inner side surface of the groove 301 is perpendicular to the bottom surface; because if it is greater than 90°, it means that the inner side surface of the groove 301 is inclined toward the bottom surface, which will interfere with the extrusion of the protrusion 201 into the groove 301. If 90° is directly used, the resistance encountered by the colloid at this time is the greatest during extrusion, and the reaction force will cause certain obstacles to the mold closing. Therefore, the inclination angle of the inner side surface can be close to vertical, for example, between 75° and 90°, preferably 88°, so that when the mold is closed and extruded, the colloid in the cavity 4 will preferentially penetrate into the preform material under the action of the mold closing force until it fills the entire cavity 4, and then seep out through the mating surface 8.
[0055] like Fig. 9 As shown, assuming that the angle α is 35° (i.e., the angle α is small), then the outflow resistance of the colloid in the groove 301 is small, that is, after the protrusion 201 enters the groove 301 to squeeze the colloid, before the colloid fully fills the entire cavity 4, it will easily seep out from the mating surface 8 ( Fig. 9 In this case, the angle α is 0.040mm / s and 0.080mm / s, which is 0.080mm / s. The angle α is 0.040mm / s and ...
[0056] Based on the above embodiments, in one embodiment of the present application, if Figure 6 and Figure 8 As shown, the top of the lower mold 3 is provided with a glue overflow groove 5, which is a closed structure and covers the periphery of the groove 301. It is understandable that when the mold is closed, the colloid seeping from the mating surface 8 will enter the glue overflow groove 5 and be collected, thereby preventing the colloid from flowing out of the mold and keeping the working environment clean. Figure 6 As shown, the overflowing glue groove 5 is located between the vacuum adsorption port 6 and the groove 301, which can also prevent the overflowing colloid from clogging the adsorption port 6; Figure 8 As shown, during vacuum adsorption, the overflowing glue groove 5 provides a storage space for the overflowing colloid, so that the colloid will not interfere with the overflowing of the gas in the cavity 4, thereby ensuring the smooth progress of the vacuum adsorption process.
[0057] Further, such as Figure 4 , Fig.12 and Fig.13As shown, in order to improve the sealing performance when the upper mold 2 and the lower mold 3 are closed, a baffle 11 is installed at the lower end of the outer periphery of the upper mold 2, and a rubber sealing ring 12 is provided at the upper end of the outer periphery of the lower mold 3. Both are rectangular structures according to the shape of the mold.
[0058] It is understandable that when the mold is closed, the enclosure 11 will be sleeved on the lower mold 3, and at this time the sealing ring 12 will be against the enclosure 11, that is, the enclosure 11 covers the connection between the upper mold 2 and the lower mold 3, thereby improving the sealing performance of the mold. After the mold is closed, the cooperation of the enclosure 11 and the sealing ring 12 can effectively ensure the vacuum degree in the cavity 4, ensuring the stability and controllability of the molding process.
[0059] In this embodiment, Fig.14 and Fig.15 As shown, the blowing mechanism 7 includes a barrel 701, a column 702, and a driving device 703. The barrel 701 is installed in the lower mold 3 and the top end is connected to and flush with the bottom end of the cavity 4 (i.e., the groove 301). The column 702 is inserted into the barrel 701. The driving device 703 is installed in the lower mold 3 and the output end is connected to the column 702. The bottom end of the barrel 701 is connected and matched with the driving device 703 and is in a closed state. The interior of the barrel 701 is divided into a first cavity 7011 and a second cavity 7012 from top to bottom. The caliber of the first cavity 7011 is compatible with the caliber of the column 702, and the caliber of the second cavity 7012 is larger than the caliber of the column 702. An air cavity 9 is formed between the second cavity 7012 and the column 702, and an air source connected to the air cavity 9 is provided on the outside of the barrel 701.
[0060] It is understandable that when the mold is closed, Fig.10 As shown, at this time, the column 702 and the first cavity 7011 cooperate, and then the first cavity 7011 is in a closed state, that is, the top of the cylinder 701 is closed, thereby providing a stable closed environment for the molding of the battery pack bottom guard plate 1. When the mold is opened and blown, the driving device 703 will drive the column 702 to move downward, as shown in FIG. Fig.11 As shown, until the column 702 moves down into the second cavity 7012, the gas source then delivers the gas from the connecting hole 13 to the gas cavity 9 in the cylinder 701 through the gas pipeline, and then blows the gas from the first cavity 7011 (i.e., the top of the cylinder 701) into the cavity 4 through the second cavity 7012, as shown in FIG. Fig.11 As shown by the arrow in the figure, the battery pack bottom guard plate 1 and the cavity 4 are separated by blow molding to realize the demoulding of the product. Of course, only using gas demoulding may make the demoulding of the product not thorough enough. Finally, the ejector mechanism in the existing mold can be used to completely eject the product.
[0061] It should be noted that the specific structure and working principle of the driving device 703 are well-known technologies to those skilled in the art, so they will not be elaborated in detail here; common driving devices 703 include hydraulic cylinders, pneumatic cylinders, and linear motors, etc., and hydraulic cylinders are preferably used here; and the air source can be, for example, an air pump.
[0062] It should be further explained that before the mold is opened, the formed battery pack bottom guard plate 1 product will also be bonded to the convex portion 201 of the upper mold 2, so a uniformly distributed blowing mechanism 7 can also be provided in the upper mold 2, such as Fig.15 shown.
[0063] Furthermore, in order to prevent the colloid in the cavity 4 from flowing into the air cavity 9 from the gap between the column 702 and the barrel 701 and causing blockage when the mold is closed, a plurality of rubber sealing rings 10 can be sleeved on the outer upper end of the column 702, and two sealing rings 10 are preferably used, that is, both sealing rings 10 are sleeved on the outer upper end of the column 702 near the top end. When the column 702 moves up to the first cavity 7011, the two sealing rings 10 can fit against the inner wall of the first cavity 7011 to achieve a sealing effect.
[0064] The workflow of the present invention is: S100: First, stack multiple connecting layers, place the lower continuous fiber cloth 103 at the bottom, then stack the middle polyurethane sandwich panel 102 on the lower continuous fiber cloth 103, and then stack the upper continuous fiber cloth 101 on the middle polyurethane sandwich panel 102, and you can get the preform of the battery pack bottom guard plate 1.
[0065] S200 : spraying epoxy resin glue evenly on the upper continuous fiber cloth 101 , and then placing the preform in the groove 301 of the lower mold 3 .
[0066] S300: The mold is closed, that is, the convex part 201 of the upper mold 2 moves downward to cooperate with the concave part 301 of the lower mold 3, such as Fig.12 As shown, when the enclosure 11 and the sealing ring 12 are initially matched, the vacuum mechanism can be started, and then the cavity 4 is evacuated through the suction port 6; when the upper mold 2 and the lower mold 3 are fully matched, a certain pressure is applied to the upper mold 2, and the pressure is maintained for a suitable time under the action of the vacuum mechanism, so that the epoxy resin glue fills the entire cavity 4 and penetrates into the preform, and the excess glue will enter the overflow glue groove 5 for collection; at the same time, the heating mechanism heats the cavity 4 to solidify the epoxy resin glue, and then integrates the multiple connection layers into the preform to obtain the formed battery pack bottom guard plate 1.
[0067] S400: Open the mold. Before or at the moment of opening the upper mold 2, the blowing mechanism 7 in the upper mold 2 is started to separate the battery pack bottom guard plate 1 from the protrusion 201. Then, the blowing mechanism 7 in the lower mold 3 is started to separate the product in the groove 301 by blow molding, and the ejector mechanism in the lower mold 3 is used to eject the product to obtain the final "sandwich" structure battery pack bottom guard plate 1.
[0068] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and the specification only describe the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application, and these changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the attached claims and their equivalents.
Claims
1. A molding process for a battery pack bottom guard plate, characterized in that: The steps include: S100: stacking a plurality of connection layers from bottom to top to obtain a preform of a battery pack bottom guard plate; S200: spraying the top surface of the preform with a binder evenly, and then placing the preform into a molding die cavity; S300: closing the mold and applying a set pressure so that the adhesive fills the entire cavity and penetrates into the preform to be cured; S400: Open the mold to obtain an integrated molded battery pack bottom guard plate.
2. The molding process of the battery pack bottom guard plate according to claim 1, characterized in that: In step S100, the preform includes an upper continuous fiber cloth, a middle polyurethane sandwich panel and a lower continuous fiber cloth which are arranged in sequence from top to bottom.
3. The molding process of the battery pack bottom guard plate according to claim 2, characterized in that: In step S200 , the adhesive includes epoxy resin and a curing agent.
4. The molding process of the battery pack bottom guard plate according to claim 3, characterized in that: In step S300, after the mold is closed, the following steps are also included: vacuuming the mold cavity to remove bubbles in the cavity; heating the mold cavity to quickly solidify the adhesive.
5. The molding process of the battery pack bottom guard plate according to any one of claims 1 to 4, characterized in that: In step S400, the following step is also included: blowing air into the mold cavity to separate the formed battery pack bottom guard plate from the cavity by blow molding.
6. A molding die for a battery pack bottom guard plate, used to implement the molding process of the battery pack bottom guard plate according to any one of claims 1 to 5, characterized in that: It comprises an upper mold, a lower mold, a blowing mechanism, a vacuum mechanism and a heating mechanism. The blowing mechanism, the vacuum mechanism and the heating mechanism are all installed on the lower mold and cooperate with the cavity of the mold.
7. The molding die for the battery pack bottom guard plate according to claim 6, characterized in that: A convex portion is provided at the bottom end of the upper mold, and a concave portion is provided at the top end of the lower mold, and the convex portion cooperates with the concave portion to form the cavity; a mating surface is formed at the mating point between the convex portion and the concave portion, and an angle α is formed between the mating surface and the horizontal plane, wherein 75°≤α≤90°.
8. The molding die for the battery pack bottom guard plate according to claim 7, characterized in that: The top of the lower mold is provided with a glue overflow groove, which is a closed structure and covers the periphery of the groove, and is located between the groove and the vacuum suction port of the vacuum mechanism; when the mold is closed, the glue overflow groove is suitable for collecting the extruded adhesive.
9. The molding die for the battery pack bottom guard plate according to claim 8, characterized in that: The blowing mechanism comprises a barrel, a column, and a driving device. The barrel is installed in the mold and the top end is connected to and flush with the cavity. The column is inserted into the barrel. The driving device is installed in the mold and the output end is connected to the column. The bottom end of the barrel is connected and matched with the driving device and is in a closed state. The interior of the barrel is divided into a first cavity and a second cavity from top to bottom. The caliber of the first cavity is matched with the caliber of the column, and the caliber of the second cavity is larger than the caliber of the column. An air cavity is formed between the second cavity and the column, and an air source connected to the air cavity is arranged on the outside of the barrel. When the mold is closed, the column is suitable for matching with the first cavity, and the first cavity is in a closed state; When the mold is opened and air is blown, the column is suitable for moving downward under the drive of the driving device and entering the second cavity, and then the air source is suitable for conveying the air flow into the mold cavity through the air cavity, the second cavity and the first cavity.
10. The molding die for the battery pack bottom guard plate according to claim 9, characterized in that: The outer upper end of the column is sleeved with a plurality of sealing rings; when the mold is closed, the sealing rings are abutted against the inside of the first cavity; A baffle is installed at the lower end of the upper mold, and a sealing ring is arranged at the upper end of the lower mold; when the molds are closed, the sealing ring abuts against the inside of the baffle, and at this time the baffle covers the connection between the upper mold and the lower mold.
Citation Information
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