Thin glass edge processing method

Abstract

The invention discloses a thin glass edge processing method, and belongs to the technical field of glass processing. According to the scheme, a plurality of focuses are generated through the optical splitter, the chamfer contour line is processed on the thin glass subsurface in parallel by the plurality of focuses, and then the chamfer is displayed through chemical liquid polishing and splitting treatment, so that the problem of stress concentration caused by direct edge treatment of the traditional chamfer is avoided, the risk of fracture is effectively reduced, and the production efficiency is improved. The processing efficiency is improved, and the processing cost is reduced; meanwhile, surface scratches and burrs possibly generated in a traditional method are avoided, the completeness of the surface of the glass can be kept, the edge strength of the glass is improved, the glass has higher toughness when being impacted or pressed, and the possibility of breakage is reduced; in the machining process, the chamfer is hidden on the subsurface, the risk that the edge chamfer is broken due to collision in the transportation process is reduced, waste does not fall off in the liquid polishing process, splitting treatment is independently carried out in the post-machining procedure, and the defects such as shelf marks caused to a glass product body in the liquid polishing process are prevented.

Description

Technical Field

[0001] The invention relates to the technical field of glass processing, and in particular to a method for processing the edge of thin glass. Background Art

[0002] At present, many cover materials choose thin glass with a thickness of less than 1mm as the main material. Because of its scratch resistance, excellent light transmittance, outstanding aesthetics, chemical stability and easy cleaning, it has been widely used in smartphones, wearable devices and other electronic products.

[0003] In thin glass processing, edge processing requires cutting large pieces into the required size and then using mechanical grinding to form chamfers to reduce the problem of edge stress concentration. The processing details are crucial to ensure the quality and performance of the final product.

[0004] Common processes for thin glass edge processing include traditional mechanical processing methods and advanced laser cutting technology. Among them, traditional mechanical processing methods include CNC (Computer Numerical Control) processing and side wall polishing. CNC processing method refers to the use of computer-controlled cutting machines to accurately cut and chamfer thin glass edges. Diamond tools or other tools made of high-hardness materials are used to improve cutting accuracy and durability, and the cutting speed, feed rate and cutting depth are adjusted according to the thickness and type of glass to avoid glass breakage. At the same time, coolant is used during the cutting process to reduce the heat generated by cutting and prevent the glass from breaking due to thermal stress.

[0005] However, the CNC machining method has the following disadvantages:

[0006] Uneven cutting stress distribution: During CNC machining, the cutting process of the tool may cause uneven stress distribution in the cutting area of ​​the glass. This stress concentration may make the edge fragile, especially in thin glass, and tiny defects may cause cracks in subsequent use.

[0007] Tool wear and cutting quality: As processing progresses, tool wear will lead to reduced cutting accuracy, resulting in uneven edges or burrs. These burrs and uneven edges are likely to become stress concentration points in subsequent use, increasing the risk of fragmentation.

[0008] Surface defects: After CNC machining, tiny surface defects such as scratches and pits may appear, which may develop into cracks under subsequent use or impact, resulting in fragmentation.

[0009] Thermal stress: During CNC processing, if the processing speed is too fast or the cooling is insufficient, the glass may produce thermal stress in the cutting area. This thermal stress may also cause the glass to break during later use.

[0010] The sidewall polishing method refers to the post-processing of the cut using special polishing equipment to improve the edge finish. It uses abrasives of different particle sizes for gradual polishing to achieve the best finish and transparency. The polishing pressure and speed are controlled to prevent excessive wear and heat accumulation. The polishing time is reasonably arranged according to the thickness and type of the glass to ensure a uniform polishing effect.

[0011] However, the sidewall polishing method also has the following disadvantages:

[0012] Uneven polishing: Improper control of polishing force and time during the sidewall polishing process may result in uneven polishing of the glass edge, which can lead to lower strength in some areas and increase the risk of fragmentation.

[0013] Thermal effects: Frictional heat that may be generated during the polishing process can cause local overheating of the glass, thereby causing internal stress changes and increasing the possibility of cracking.

[0014] Inadequate surface preparation: If polishing is not followed by adequate cleaning, residual abrasives or chemicals may affect the physical properties of the glass, resulting in breakage during subsequent use.

[0015] Formation of microcracks: Failure to completely remove micro scratches or defects during the polishing process may cause these micro cracks to propagate during subsequent use, resulting in glass breakage.

[0016] Laser cutting technology refers to the use of high-power laser beams to directly cut thin glass. It has high precision and flexibility. Laser cutting technology is only responsible for the process of cutting large pieces into small pieces, and does not process the edge shape of the material in place. By selecting the appropriate laser type to adapt to different thicknesses and types of glass; optimizing the cutting path through software to reduce material waste and improve cutting efficiency; using oxygen or nitrogen as auxiliary gas to improve cutting quality and edge smoothness.

[0017] Laser cutting technology also has the following disadvantages:

[0018] Heat-affected zone: The high temperature generated during the laser cutting process will cause the formation of a heat-affected zone. The strength of this area decreases, increasing the risk of rupture during subsequent use.

[0019] Uneven cutting edge: The accuracy of laser cutting is affected by many factors, including laser power and focal position. Uneven cutting edges can easily become stress concentration points, leading to fragmentation.

[0020] Residual stress: After laser cutting, residual stress may form inside the glass, which may cause cracks during subsequent processing or use.

[0021] Surface cracks: After most of the existing laser cutting, the edges are not processed later (such as chamfering or polishing), which will leave many tiny surface cracks. These cracks are easy to expand during use or post-processing, and eventually lead to the occurrence of fragments, reducing the production yield.

[0022] In summary, existing CNC processing, sidewall polishing and laser cutting have defects at both the processing level and the post-processing level that cause the thin glass edge to break easily, affecting the production yield and material utilization value at the production level. Moreover, if the processed product is not well protected by the system structure, it will also affect the strength and safety of the final product. Specifically:

[0023] If the product lacks proper protection in the system structure, the unrepaired cracks and stress concentration caused by such traditional processing will weaken the product strength, increase the risk of breakage during use, and affect the safety and reliability of the product.

[0024] The above processing methods will expose the formed chamfers to the outside, and bumps during transportation operations will cause the edge chamfers to collapse, resulting in defects.

[0025] The exposed edge chamfer will come into contact with the support rod of the chemical polishing rack during the chemical etching process, causing defects such as rack marks. Summary of the invention

[0026] The technical problem to be solved by the present invention is: to provide a thin glass edge processing method in view of the above-mentioned defects of the prior art.

[0027] To achieve the above object, the present invention provides a method for processing a thin glass edge, the method comprising the following steps:

[0028] Step S1, making a chamfer design file, and obtaining a phase drawing according to the design file, wherein the design file includes processing path information, and the phase drawing includes chamfer line information;

[0029] Step S2, machining a chamfered contour line in a sub-surface of the thin glass according to the design file and the phase drawing;

[0030] Step S3, performing other processing steps on the thin glass before the chemical strengthening process according to the processing drawing requirements;

[0031] Step S4, chemical liquid polishing is performed on the thin glass;

[0032] Step S5, performing cracking processing on the edge of the thin glass.

[0033] The specific method of step S2 is: according to the design file and the phase drawing, use a beam splitter to divide the laser beam into multiple branches, adjust the position of each branch focus through a dynamic focusing system, so that each focus is processed according to a predetermined path, and set laser parameters according to the type and thickness of the thin glass to process the chamfered contour line in the sub-surface of the thin glass; the laser parameters include laser power, laser energy, speed, frequency, focusing depth, and point spacing.

[0034] Preferably, in step S2, the parameter settings of laser energy and speed need to meet the following conditions: the heat generated by the laser on the sub-surface is sufficient to melt the thin glass without damaging the surface of the thin glass.

[0035] Preferably, after step S4, the method further includes:

[0036] The thin glass product is cleaned and dried.

[0037] Preferably, the chamfer includes a right-angle chamfer, an oblique-angle chamfer, and a curved chamfer.

[0038] Preferably, the chamfering includes double-sided chamfering and single-sided chamfering.

[0039] Preferably, the chemical liquid used in the chemical liquid polishing is an acidic solution or an alkaline solution, and the liquid polishing parameters include concentration, temperature and time.

[0040] Preferably, before step S1, the method further includes:

[0041] Large sheets of thin glass are cut into small sheets of thin glass.

[0042] The present invention has the following beneficial effects: the embodiment of the present invention generates multiple focal points through a beam splitter, and the chamfer contour line is processed on the sub-surface of thin glass in parallel with the multiple focal points, and the chamfer is then revealed through chemical liquid polishing and cracking treatment, thereby avoiding the stress concentration problem caused by the traditional chamfer directly being processed on the edge. Since the stress distribution is more uniform, the risk of cracking is effectively reduced, the processing efficiency is improved, and the processing cost is reduced; at the same time, surface scratches and burrs that may be generated in traditional methods are avoided, which helps to maintain the integrity of the glass surface, and improves the edge strength of the glass, making it more resilient when subjected to impact or pressure, and reducing the possibility of cracking; during the processing process, the chamfer is hidden in the sub-surface, reducing the risk of edge chamfer collapse caused by bumps during transportation, and waste does not fall off during the liquid polishing process. The cracking process is performed separately in the post-processing process to prevent shelf marks and other defects on the glass product body during liquid polishing. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0044] Figure 1 A schematic diagram of the steps of a thin glass edge processing method provided in an embodiment of the present invention.

[0045] Figure 2 A process flow comparison diagram of a conventional CNC chamfering method and a thin glass edge processing method provided by an embodiment of the present invention.

[0046] Figure 3 This is the V-chamfer phase diagram simulated by Matlab.

[0047] Figure 4 This is the V-shaped chamfer effect in the cross section of a thin glass product observed under a metallographic microscope.

[0048] Figure 5 This is the U-shaped chamfer phase diagram simulated by Matlab.

[0049] Figure 6 This is the U-shaped chamfer effect in the cross section of a thin glass product observed under a metallographic microscope.

[0050] Figure 7 It is a comparison diagram of the chamfering forming principles of a traditional CNC chamfering method and a thin glass edge processing method provided by an embodiment of the present invention.

[0051] Figure 8 It is a schematic diagram comparing the traditional liquid polishing method and the liquid polishing method frame printing provided by the embodiment of the present invention. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0053] Thin glass is widely used in electronic products, architectural decoration and household products due to its excellent light transmittance and aesthetics. However, traditional processing methods such as CNC cutting and sidewall polishing often lead to stress concentration, surface defects and thermal effects when processing glass edges, which in turn cause fragmentation and safety hazards. Therefore, a new technology is needed to improve the processing quality of thin glass edge processing.

[0054] The core technology of the solution of the present invention is the laser chamfering process, which uses high-precision laser equipment to process thin glass and design the chamfer profile on the sub-surface of the thin glass. The sub-surface refers to a thin layer area below the surface of the thin glass. The innovation of this method is that traditional chamfering usually acts directly on the outer edge of the glass, while this technology hides the chamfering effect in the inner layer of the sub-surface of the glass, greatly reducing the physical stress and cracking risk at the edge.

[0055] The general idea of ​​the present invention is to process the chamfer on the sub-surface of the thin glass by laser equipment, then perform white sheet process, and then perform liquid polishing and cracking process on the thin glass to reveal the chamfer.

[0056] The embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings of the specification. It should be understood that the embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0057] The invention is applicable to edge chamfering of thin glass, wherein the thin glass is glass with a thickness of less than 1 mm. In addition, the solution of the invention is also applicable to edge processing of other transparent and brittle materials other than thin glass.

[0058] like Figure 1 , Figure 2 As shown, an embodiment of the present invention provides a method for processing a thin glass edge, the method comprising the following steps:

[0059] Step S0, cutting the large piece of thin glass into small pieces of thin glass.

[0060] like Figure 2 As shown, the traditional CNC chamfering method and the thin glass edge processing method described in the embodiment of the present invention, after the glass is received, usually need to go through the material cutting process, cut the large piece of glass into small pieces, and then perform edge processing based on the small piece of glass. The process flow of the traditional CNC chamfering method is relatively simple. After cutting, the edge processing and chamfering are directly performed on the edge of the small piece of glass. In the embodiment of the present invention, after cutting, a chamfer is first formed on the sub-surface of the glass by 3D laser cutting. After the chamfering process is completed, the size of the small piece of glass remains unchanged; then it is treated with liquid polishing. After liquid polishing, the size of the small piece of glass remains unchanged; then the waste material on the edge of the small piece of glass product is fallen off by cracking, revealing the edge and chamfered part.

[0061] Step S1, making a chamfer design file, and obtaining a phase drawing according to the design file, wherein the design file includes processing path information, and the phase drawing includes chamfer line information.

[0062] In an embodiment of the present invention, the design file is uploaded to a control system of a laser device, and the phase drawing is exported from the control system.

[0063] In an embodiment of the present invention, a chamfered geometric model is designed by CAD (Computer-Aided Design) software to generate a CAD design file, and then based on the CAD design file, a CAM (Computer-Aided Manufacturing) software is used to generate a CAM design file including processing path information.

[0064] In the embodiment of the present invention, a high-power laser is used to precisely control the glass, and the sub-surface of the glass is chamfered by adjusting the focal position, energy distribution control, shape and angle of the laser beam. The angle and depth of the chamfer are precisely adjusted to ensure a smooth transition on the sub-surface, thereby achieving personalized chamfering of glass of different thicknesses and types. The core of this method is to hide the chamfer profile in the sub-surface so that it is not directly exposed at the edge of the glass. Compared with the ordinary laser chamfering process, this solution can achieve more chamfer shape changes and higher yield process control.

[0065] In an embodiment of the present invention, the chamfer includes a right-angle chamfer, an oblique chamfer, and a curved chamfer. Specifically, the chamfer can be a single-sided chamfer or a double-sided chamfer. The right-angle chamfer is often used for simple edge processing and is suitable for most industrial applications; the oblique chamfer can be designed with different angles as needed, such as 30 degrees, 45 degrees, etc., which are usually used to enhance the aesthetics or functionality of the product; the curved chamfer has a softer shape and is suitable for products that require high aesthetics and low sharpness. CAD software can be used to accurately draw curves during design.

[0066] In an embodiment of the present invention, the selected laser equipment is an ultrafast laser suitable for thin glass materials, such as an infrared femtosecond laser and an infrared picosecond laser, to ensure that high-efficiency chamfering processing can be achieved. In addition, in order to improve processing efficiency, it is preferred to use a laser with a spatial light modulator or a diffractive optical element. The laser is equipped with necessary auxiliary equipment, such as an automatic loading and unloading system, a cooling system and a safety protection device. Use CAD / CAM and other software for product design and processing path planning to ensure the compatibility of the laser system with the design software. Configure the control system of the laser equipment to ensure that it can receive processing instructions generated by the software. Before processing, check all parts of the laser equipment, including the laser head, optical path system, power supply and cooling system, to ensure that the equipment is in good condition, confirm that the safety protection device of the laser equipment is working properly, and fix the thin glass to be processed on the workbench to ensure that it is stable and does not move. Vacuum adsorption or mechanical clamps can be used to fix the thin glass product.

[0067] In the embodiment of the present invention, when there is no special requirement for the chamfer shape, a special chamfer design is used to evenly distribute stress, reduce the possibility of cracking due to local stress concentration, and enhance the overall strength of the glass edge. Figure 3 The V-shaped chamfer phase diagram simulated by Matlab is shown as follows: Figure 4 The following is a V-shaped chamfer effect diagram of a thin glass product cross section observed by a metallographic microscope. Figure 5 The following is the U-shaped chamfer phase diagram simulated by Matlab: Figure 6 The figure shows the U-shaped chamfer effect in the cross section of a thin glass product observed under a metallographic microscope. Figure 4 and Figure 6 In the figure, the thickness of the thin glass is about 75um, and the final chamfer height is about 30um. The numbers in the figure indicate the size of the chamfer shape. Figure 4 and Figure 6 The chamfer profile in the sub-surface can be clearly seen. The chamfer profile is symmetrical about the central plane in the vertical direction of the thin glass. The chamfer profile is completely located inside the thin glass product and is not connected to the outer surface of the thin glass product.

[0068] Step S2, processing a chamfered contour line in the sub-surface of the thin glass according to the design file and the phase drawing.

[0069] In the embodiment of the present invention, the specific method of step S2 is: according to the design file and the phase drawing, use a beam splitter to divide the laser beam into multiple branches, adjust the position of each branch focus through a dynamic focusing system, so that each focus is processed according to a predetermined path, and set laser parameters according to the type and thickness of the thin glass to process the chamfered contour line in the sub-surface of the thin glass; the laser parameters include laser power, laser energy, speed, frequency, focus depth, and point spacing. In the embodiment of the present invention, the beam splitter can select a spatial light modulator or a diffractive optical element, and by using a multi-focus parallel processing strategy, the purpose of one-time processing and forming is achieved, the processing efficiency is improved, and the heat-affected zone is reduced.

[0070] In the embodiment of the present invention, it is necessary to comprehensively consider the thickness of the thin glass, the post-processing technology, the chamfer shape and the depth, and adjust the specific position of the chamfer in the sub-surface of the thin glass so that the chamfer profile is completely hidden in the sub-surface of the thin glass. For example, if the chamfer is symmetrical about the center plane of the thin glass in the vertical direction, the center of the chamfer profile is usually positioned on the center plane of the vertical center of the thin glass. For example, if the thickness of the thin glass is 0.8mm, the center of the chamfer profile is positioned on a plane 0.4mm away from the surface of the thin glass. If a single-sided chamfer needs to be processed, the starting and ending positions of each focus are determined according to the depth requirement of the chamfer and the thickness value of the thin glass.

[0071] In the embodiment of the present invention, in step S2, the parameter settings of the laser energy and speed need to meet the following conditions: the heat generated by the laser on the sub-surface is sufficient to melt the thin glass without damaging the surface of the thin glass. By using appropriate laser energy and cutting speed, the heat generated by the laser on the sub-surface is sufficient to melt the material and form the desired chamfer shape while avoiding excessive heat damage to the surface.

[0072] In actual implementation, multiple trial cuts are required to determine the best parameter combination. During the laser chamfering process, the real-time monitoring system of the processing equipment is used to observe possible problems during the processing, such as laser focus offset, material deformation, etc. If necessary, the processing is immediately suspended for adjustment. After the chamfering process is completed, the production samples are taken, and the sub-surface chamfer shape and edge quality of the product are observed through slicing and microscopy to observe whether there are burrs, uneven cutting, incorrect chamfering position, and microcracks, and the laser parameters are adjusted according to specific problems. By repeatedly adjusting the laser parameters, the best chamfering effect and minimal thermal impact can be achieved. In addition, after processing, strict quality inspections are required, including surface finish, edge strength and microcrack inspections to ensure that the processed glass meets quality standards.

[0073] In the embodiments of the present invention, in practical applications, by optimizing the processing steps, the equipment operation time and energy consumption are reduced, thereby reducing the overall production cost; by optimizing the cutting path and strategy, the raw materials are utilized to the maximum extent and the waste generation is reduced.

[0074] In the embodiment of the present invention, since the laser chamfer is formed inside the edge of the thin glass, the size of the thin glass does not change after the laser chamfer is completed.

[0075] Figure 7 The figure shows the chamfering forming principle comparison diagram of the traditional CNC chamfering method and the thin glass edge processing method of the embodiment of the present invention. In the CNC chamfering method, the chamfering is performed by a CNC profiling grinding wheel to remove excess waste so that the formed chamfer is directly exposed to the outside. In the embodiment of the present invention, the chamfer is formed inside the thin glass by 3D laser cutting. After the chamfering is formed, the size of the glass remains unchanged.

[0076] Laser equipment generally requires only one operator to monitor, while CNC equipment may require more manual intervention for setting and debugging. Therefore, the thin glass edge processing method of the embodiment of the present invention can significantly reduce labor costs compared to traditional CNC processing. In addition, during the chamfering process using laser equipment, an automatic loading and unloading system can be equipped to reduce the need for manual handling.

[0077] In the embodiment of the present invention, the size of the verified thin glass material is: 300mm long, 270mm wide, and 0.8mm thick; the number of laser focal points is preferably 60, the number of upper and lower chamfer focal points is about 20 each, the spacing between the focal points is about 5 microns, the number of standing focal points is about 20, and the spacing between the focal points is about 17 microns. A larger number of laser focal points can better control the chamfer shape of the material appearance and form an edge chamfer contour line that is closer to the drawing. During the processing, the laser pulse width used is 3 picoseconds, the pulse train is 4 to 10, the single pulse energy is 20 to 40uJ, the cutting speed is 20 to 50mm / s, the point spacing is 1um, and the frequency is 100 to 150Khz; the laser beam follows the size of the glass in the drawing and goes around the processing path in the design file to complete the chamfering process.

[0078] Step S3, performing other processing steps before the chemical strengthening process on the thin glass according to the processing drawing requirements.

[0079] In step S3, the other processes usually refer to the white sheet process in the drawing processing technology, that is, various processing technologies before chemical strengthening, such as polishing, grinding, drilling, etc. These traditional processing technologies are all based on physical processing, which are extremely easy to produce destructive effects due to fragile positions. If the traditional edge processing method is used to process the chamfer on the edge of the thin glass, the chamfer profile is directly exposed to the edge of the glass. In the white sheet process, the edge of the thin glass is very easy to break, affecting the yield and material utilization value at the production level. In the transportation operation between the processes, bumps are also prone to occur, resulting in poor edge chamfering and edge collapse. In the embodiment of the present invention, during the white sheet process, the chamfer is hidden in the sub-surface of the edge of the thin glass and is not exposed to the outer surface of the glass, which improves the edge strength of the thin glass and reduces the risks of breakage and edge collapse.

[0080] Step S4, chemical liquid polishing is performed on the thin glass.

[0081] In the embodiment of the present invention, the chemical liquid used in the chemical liquid polishing is an acid solution or an alkaline solution. The specific chemical liquid to be selected depends on the specific processing requirements and the chemical composition of the glass.

[0082] In an embodiment of the present invention, the components of the acidic solution include: hydrofluoric acid with a concentration of 3-5%, sulfuric acid with a concentration of 1-2%, ammonium fluoride with a concentration of 1-3%, and a surfactant with a concentration of 0.1-0.3%. Among them, hydrofluoric acid is used for glass etching, sulfuric acid is used to enhance the etching effect of hydrofluoric acid, ammonium fluoride is used as a buffer to control the etching rate, and the surfactant is used to ensure uniform etching and control the pore structure. The acidic solution is suitable for glass with a high silicon content, such as liquid polishing of quartz glass, and scenes that require detailed polishing and removal of the oxide layer.

[0083] In the embodiment of the present invention, the components of the alkaline solution include: sodium hydroxide with a concentration of 30-70%, and a temperature maintained at 120-150° C. The alkaline solution is suitable for liquid polishing of aluminosilicate glass, as well as scenes requiring rough polishing or low cost and high safety requirements.

[0084] During the liquid polishing process, the chemical liquid reacts with the glass surface to remove tiny scratches, burrs and surface dirt, thereby improving the surface finish. At the same time, the chemical liquid reacts with the glass surface. After the surface is removed by the liquid, the liquid further expands and deepens to the chamfered contour area of ​​the sub-surface layer, reacts with the chamfered position, effectively dissolves the micro-cracks after laser chamfering, and at the same time smoothes and repairs the cracks on the edges, reduces stress concentration, and improves surface roughness.

[0085] In the embodiment of the present invention, the liquid polishing parameters include concentration, temperature, and time. The best polishing effect is to control the liquid polishing rate through the liquid polishing parameters such as concentration, temperature, and time, so that the thin glass does not fall off in the liquid polishing tank. After leaving the liquid polishing tank, it can be manually split or split by a fixture, and no new defects will be generated during the splitting due to incomplete liquid polishing. It can be understood that the closer the end point of the chamfer profile close to the thin glass surface is to the vertical distance from the thin glass surface, the shorter the required liquid polishing time. In practical applications, according to the final chamfer shape and angle, the position of the end point of the chamfer profile formed by laser cutting is adjusted according to the design requirements, and the adjustment of the liquid polishing parameters is coordinated to form the expected chamfer shape.

[0086] like Figure 8 As shown, during the chemical liquid polishing process, the glass is placed in the liquid polishing rack, and multiple edges of the glass are in contact with the liquid polishing rack. When the traditional edge chamfering treatment method is used, during liquid polishing, the edge chamfer of the glass is in contact with the liquid polishing rack. After the liquid polishing is completed, the contact point usually has a shelf mark of the liquid polishing rack. In the embodiment of the present invention, by controlling the liquid polishing parameters, no cracking occurs in the liquid polishing tank, and the part in contact with the liquid polishing rack is a waste part, which will be removed in the subsequent cracking process, and the edge of the glass product body formed after cracking will not have a shelf mark.

[0087] In the embodiment of the present invention, after step S4, the following steps are further included:

[0088] The thin glass product is cleaned and dried. Specifically, in the embodiment of the present invention, after polishing, the thin glass is thoroughly cleaned with deionized water to remove residual chemical liquid. After cleaning, the thin glass is placed in a drying device and dried until there is no water stain on the surface and it remains bright.

[0089] Step S5, performing a cracking process on the edge of the thin glass to expose the edge and chamfer of the thin glass.

[0090] In the embodiment of the present invention, the splitting and liquid polishing are performed separately, which can prevent the liquid polishing rack marks from being left on the edge of the thin glass product, and can also prevent the glass in the waste area from floating in the liquid polishing tank and scratching the surface of the thin glass. In actual applications, the optimal chemical liquid polishing parameters are selected through repeated tests, so that the subsequent splitting can be easily performed without generating new defects in the splitting.

[0091] In the embodiment of the present invention, the chamfer of the thin glass product is exposed after the cracking process, which avoids the problem of edge chamfer collapse caused by bumps during the transportation of the product in the previous process. After the cracking, during the transportation of the product, even if there is no structural protection for the chamfer, the edge strength of the product made by the process of the embodiment of the present invention is more stable than that of the traditional process, and the possibility of edge chamfer collapse during transportation is also smaller.

[0092] In the traditional laser edge chamfering process, the glass edge is ablated by laser, and the excess waste falls off due to the ablation effect, forming a chamfer directly on the glass edge. This method has the disadvantages of long processing time, large heat-affected zone, and high energy consumption. In the embodiment of the present invention, the contour line of the chamfer is formed in the sub-surface of the edge of the thin glass by laser, and the chamfer is revealed by liquid polishing and splitting. Compared with the laser ablation solution, it has the advantages of one-time forming, small heat-affected zone, high processing accuracy, low energy consumption, and reduced stress concentration.

[0093] The dimensions of the thin glass material verified in the embodiment of the present invention are: 300 mm in length, 270 mm in width, and 0.8 mm in thickness. The processing time for edge chamfering according to step S2 is 10 s / piece. The combined processing method of traditional CNC edge cutting and chamfering and polishing by a polishing machine takes 500 s to 800 s / piece. It can be seen that the solution of the embodiment of the present invention has a significant improvement in processing efficiency.

[0094] The edge processing method of the embodiment of the present invention avoids the contact between the material and the mechanical processing tool, thereby avoiding the appearance problems such as edge chipping, sand edge, and broken pieces in traditional hole processing. Compared with the traditional CNC edge chamfering plus polishing machine polishing combined processing method, the edge appearance yield is improved by 15% to 30%.

[0095] After the traditional CNC edge processing chamfering and polishing combined processing method, the surface roughness of the glass edge is 100-200nm. The edge processing method of the embodiment of the present invention does not have a polishing step, and the surface roughness of the glass edge is 500-800nm, which is slightly worse than the traditional processing method. However, the solution of the embodiment of the present invention does not use a mechanical processing step that is in direct contact with the material, thereby avoiding the problem of internal damage to the material edge caused by mechanical processing, and the edge strength is improved by 30% to 50% compared with the traditional processing method.

[0096] The embodiment of the present invention generates multiple focal points through a beam splitter, and the chamfer contour lines are processed on the sub-surface of thin glass in parallel with the multiple focal points, and the chamfer is revealed through chemical liquid polishing and fragmentation treatment, thereby avoiding the stress concentration problem caused by traditional chamfering directly on the edge. Since the stress distribution is more uniform, the risk of breakage is effectively reduced, the processing efficiency is improved, and the processing cost is reduced; by precisely controlling the laser power, focus and scanning speed, the heat generated during the processing is minimized, the heat-affected zone is reduced, and the possibility of glass breakage due to thermal stress is reduced; the laser chamfering technology of the embodiment of the present invention can achieve micron-level processing accuracy, ensure that the chamfered edge is smooth and neat, reduce the polishing steps required for subsequent processing, and reduce the risk of fragmentation caused by uneven processing; since the chamfering process is carried out on the sub-surface, surface scratches and burrs that may be generated in traditional methods are avoided, which helps to maintain the integrity of the glass surface and reduce the risk of microcracks; sub-surface chamfering can improve the edge strength of the glass, making it more resilient when subjected to impact or pressure, and reducing the possibility of breakage. In summary, through the new laser chamfering process, the chamfer profile is hidden in the sub-surface, which can effectively solve the problem of easy edge breakage in traditional thin glass processing from multiple aspects, improve the strength and durability of the edge, and improve the surface quality, providing better protection for the safety and aesthetics of thin glass products.

[0097] In addition, during the processing, the chamfers are hidden in the sub-surface, reducing the risk of edge chamfers breaking due to bumps during transportation. Waste does not fall off during the liquid polishing process, and the fragments are handled separately in the post-processing process to prevent defects such as shelf marks on the glass product body during liquid polishing.

[0098] The above are only specific implementations of the present invention, which cannot be used to limit the scope of the present invention. Equivalent changes made by ordinary technicians in this technical field based on this creation, as well as changes known to technicians in this field, should still fall within the scope of the present invention.

Claims

1. A method for processing the edge of thin glass, characterized in that: The method comprises the following steps: Step S1, making a chamfer design file, and obtaining a phase drawing according to the design file, wherein the design file includes processing path information, and the phase drawing includes chamfer line information; Step S2, machining a chamfered contour line in a sub-surface of the thin glass according to the design file and the phase drawing; Step S3, performing other processing steps on the thin glass before the chemical strengthening process according to the processing drawing requirements; Step S4, chemical liquid polishing is performed on the thin glass; Step S5, performing cracking treatment on the edge of the thin glass; The specific method of step S2 is: according to the design file and the phase drawing, use a beam splitter to divide the laser beam into multiple branches, adjust the position of each branch focus through a dynamic focusing system, so that each focus is processed according to a predetermined path, and set laser parameters according to the type and thickness of the thin glass to process the chamfered contour line in the sub-surface of the thin glass; the laser parameters include laser power, laser energy, speed, frequency, focusing depth, and point spacing.

2. The thin glass edge processing method according to claim 1, characterized in that: In step S2, the parameter settings of laser energy and speed need to meet the following conditions: the heat generated by the laser on the sub-surface is sufficient to melt the thin glass without damaging the surface of the thin glass.

3. The thin glass edge processing method according to claim 1, characterized in that: After step S4, the method further includes: The thin glass product is cleaned and dried.

4. The thin glass edge processing method according to claim 1, characterized in that: The chamfers include right-angle chamfers, oblique-angle chamfers, and curved chamfers.

5. The thin glass edge processing method according to claim 1, characterized in that: The chamfering includes double-sided chamfering and single-sided chamfering.

6. The thin glass edge processing method according to claim 1, characterized in that: The chemical liquid used in the chemical liquid blasting is an acidic solution or an alkaline solution, and the liquid blasting parameters include concentration, temperature, and time.

7. The thin glass edge processing method according to claim 1, characterized in that: Before step S1, the method further includes: Large sheets of thin glass are cut into small sheets of thin glass.

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