Two-component organic silicon pouring sealant as well as preparation method and application thereof

Abstract

The invention provides a two-component organic silicon pouring sealant and a preparation method and application thereof, the two-component organic silicon pouring sealant comprises a component A and a component B, the component A comprises modified vinyl silicone oil A, end hydrogen-containing silicone oil, cross-linked hydrogen silicone oil, a heat-conducting filler A and an inhibitor, and the component B comprises modified vinyl silicone oil B, a heat-conducting filler B and a platinum catalyst; both the modified vinyl silicone oil A and the modified vinyl silicone oil B are obtained by reacting unmodified vinyl silicone oil with trimethylchlorosilane; by adding the modified vinyl silicone oil, the obtained two-component organic silicon pouring sealant has low viscosity and high heat conductivity coefficient, also has the characteristics of moderate hardness, good sedimentation resistance and good insulativity, and meets the pouring requirements of small-size and high-power electronic modules.

Description

Technical Field

[0001] The invention belongs to the technical field of potting adhesives, and in particular relates to a two-component organic silicon potting adhesive and a preparation method and application thereof. Background Art

[0002] Silicone potting compound is mainly composed of vinyl silicone oil, hydrogenated silicone oil, catalysts, inhibitors, thermal conductive fillers and other ingredients. It has the characteristics of silicone such as high and low temperature resistance and insulation performance, and also has excellent thermal conductivity. It is very suitable for the potting of electronic products and plays a role in heat dissipation, sealing, and shock absorption.

[0003] The thermal conductivity of conventional silicone potting compounds is generally below 2W / (m·K), which can meet the use requirements of most electronic products. However, with the continuous development of technology, the demand for some high-power electronic modules, such as electronic modules with a power of more than 2000W, in some special application scenarios is gradually increasing. Therefore, the requirements for the heat dissipation of potting compounds are getting higher and higher, and the thermal conductivity of potting compounds is required to reach above 5W / (m·K).

[0004] CN117384584A discloses a high thermal conductivity potting glue with a thermal conductivity coefficient of 4 to 6 W / (m·K). This solution uses aramid fiber, boron nitride and aluminum oxide as micro-thermal conductive fillers, and the anti-settling performance can reach 6 months. However, the viscosity of the potting glue provided by this solution is relatively high, all above 30000 mPa·s.

[0005] CN112812740A discloses a low-viscosity, self-leveling potting glue obtained by using spherical alumina as a micro-filler, and its thermal conductivity reaches 4W / (m·K). However, the lowest viscosity of the potting glue is above 24000mPa·s. For small-sized and high-power electronic modules, the gaps inside are very small, and a lower-viscosity, high-thermal-conductivity potting glue is required.

[0006] Therefore, in view of the above technical problems, it is urgent to develop a two-component silicone potting adhesive with both low viscosity and high thermal conductivity. Summary of the invention

[0007] In view of the deficiencies in the prior art, the object of the present invention is to provide a two-component silicone potting adhesive and a preparation method and application thereof. The two-component silicone potting adhesive has both low viscosity and high thermal conductivity, which meets the potting requirements of small-sized and high-power electronic modules, and also has the characteristics of moderate hardness, good anti-settling performance and good insulation.

[0008] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions:

[0009] In a first aspect, the present invention provides a two-component silicone potting adhesive, wherein the two-component silicone potting adhesive comprises a component A and a component B:

[0010] The component A comprises modified vinyl silicone oil A, terminal hydrogen silicone oil, cross-linked hydrogen silicone oil, thermal conductive filler A and inhibitor;

[0011] The B component includes modified vinyl silicone oil B, thermal conductive filler B and platinum catalyst;

[0012] The modified vinyl silicone oil A and the modified vinyl silicone oil B are both obtained by reacting unmodified vinyl silicone oil with trimethylchlorosilane.

[0013] Increasing the amount of thermally conductive filler added to increase the thermal conductivity of the potting compound can easily lead to a sharp increase in the viscosity of the potting compound, or even turn it into a solid and lose fluidity. On the one hand, the proportion of the base glue will decrease after the proportion of the thermally conductive filler powder increases, so the viscosity of the entire system will increase. On the other hand, the main component of the base glue of the addition-type potting compound is vinyl silicone oil. During the synthesis of the vinyl silicone oil, a small amount of silanol will exist in the synthesized vinyl silicone oil due to the presence of a small amount of water in the raw materials. When the amount of thermally conductive filler powder added reaches a certain proportion, the small amount of silanol will quickly produce hydrogen bonds with the residual silanol on the surface of the powder, causing the viscosity of the system to suddenly change or even turn into a solid.

[0014] Based on the above content, the inventors of the present invention creatively discovered during the research process that: by treating the unmodified vinyl silicone oil with trimethylchlorosilane, the trace amount of silanol in the unmodified vinyl silicone oil can be effectively eliminated. Compared with the unmodified vinyl silicone oil, the potting adhesive prepared from the modified vinyl silicone oil after the modification has a lower viscosity, and is then combined with terminal hydrogen silicone oil and cross-linked hydrogen silicone oil as a base glue, so that the obtained potting adhesive can still have a lower viscosity when the amount of thermal conductive filler added is high, thereby being able to meet the potting requirements of small-sized and high-power electronic modules; in addition, the two-component silicone potting adhesive provided by the present invention is combined by the above-mentioned specific component A and component B, and also has the characteristics of moderate hardness, good anti-settling performance and good insulation.

[0015] Preferably, the component A comprises the following components in parts by weight:

[0016]

[0017] Wherein, the amount of the modified vinyl silicone oil A can be 0.5 parts by weight, 0.7 parts by weight, 0.9 parts by weight, 1 part by weight, 1.2 parts by weight, 1.4 parts by weight, 1.6 parts by weight, 1.8 parts by weight or 2 parts by weight, etc.

[0018] The amount of the terminal hydrogen-containing silicone oil can be 3 parts by weight, 3.2 parts by weight, 3.4 parts by weight, 3.6 parts by weight, 3.8 parts by weight, 4 parts by weight, 4.2 parts by weight, 4.4 parts by weight, 4.6 parts by weight, 4.8 parts by weight or 5 parts by weight, etc.

[0019] The amount of the cross-linked hydrogen silicone oil can be 0.01 parts by weight, 0.02 parts by weight, 0.04 parts by weight, 0.06 parts by weight, 0.08 parts by weight, 0.1 parts by weight, 0.12 parts by weight, 0.14 parts by weight, 0.16 parts by weight, 0.18 parts by weight or 0.2 parts by weight, etc.

[0020] The amount of the thermally conductive filler A may be 94.5 parts by weight, 94.7 parts by weight, 94.9 parts by weight, 95.1 parts by weight, 95.3 parts by weight or 95.5 parts by weight.

[0021] The inhibitor may be used in an amount of 0.001 parts by weight, 0.005 parts by weight, 0.01 parts by weight, 0.02 parts by weight, 0.04 parts by weight, 0.06 parts by weight, 0.08 parts by weight or 0.1 parts by weight, etc.

[0022] Preferably, the B component comprises the following components in parts by weight:

[0023] Modified vinyl silicone oil B 4.5-5.5 parts by weight;

[0024] Thermally conductive filler B 94.5-95.5 parts by weight;

[0025] 0.01 to 0.5 parts by weight of platinum catalyst.

[0026] Wherein, the amount of the modified vinyl silicone oil B can be 4.4 parts by weight, 4.7 parts by weight, 4.9 parts by weight, 5.1 parts by weight, 5.3 parts by weight or 5.5 parts by weight, etc.

[0027] The amount of the thermally conductive filler B may be 94.5 parts by weight, 94.7 parts by weight, 94.9 parts by weight, 95.1 parts by weight, 95.3 parts by weight or 95.5 parts by weight.

[0028] The amount of the platinum catalyst can be 0.01 parts by weight, 0.02 parts by weight, 0.04 parts by weight, 0.06 parts by weight, 0.08 parts by weight, 0.1 parts by weight, 0.2 parts by weight, 0.3 parts by weight, 0.4 parts by weight or 0.5 parts by weight, etc.

[0029] Preferably, the mass ratio of the unmodified vinyl silicone oil to trimethylchlorosilane is (99-101):1, for example, 99:1, 99.5:1, 100:1, 100.5:1 or 101:1.

[0030] Preferably, the reaction temperature is 60-70°C, for example, 60°C, 62°C, 64°C, 66°C, 68°C or 70°C.

[0031] Preferably, the reaction time is 3 to 5 h, for example, 3 h, 3.2 h, 3.4 h, 3.6 h, 3.8 h, 4 h, 4.2 h, 4.4 h, 4.6 h, 4.8 h or 5 h.

[0032] Preferably, the viscosity of the unmodified vinyl silicone oil is 10 to 50 mPa·s, for example, 10 mPa·s, 15 mPa·s, 20 mPa·s, 25 mPa·s, 30 mPa·s, 35 mPa·s, 40 mPa·s, 45 mPa·s or 50 mPa·s.

[0033] Preferably, the unmodified vinyl silicone oil has a vinyl content of 0.7 to 1.8 mmol / g, for example, 0.7 mmol / g, 0.8 mmol / g, 0.9 mmol / g, 1 mmol / g, 1.2 mmol / g, 1.4 mmol / g, 1.6 mmol / g or 1.8 mmol / g.

[0034] Preferably, the viscosity of the terminal hydrogen-containing silicone oil is 5 to 15 mPa·s, for example, 5 mPa·s, 6 mPa·s, 7 mPa·s, 8 mPa·s, 9 mPa·s, 10 mPa·s, 11 mPa·s, 12 mPa·s, 13 mPa·s, 14 mPa·s or 15 mPa·s, etc.

[0035] Preferably, the hydrogen content of the terminal hydrogen-containing silicone oil is 1.3 to 2.6 mmol / g, for example, 1.3 mmol / g, 1.5 mmol / g, 1.7 mmol / g, 1.9 mmol / g, 2.1 mmol / g, 2.2 mmol / g, 2.4 mmol / g or 2.6 mmol / g.

[0036] Preferably, the viscosity of the cross-linked hydrogen silicone oil is ≤100 mPa·s, for example, 100 mPa·s, 90 mPa·s, 80 mPa·s, 70 mPa·s, 60 mPa·s or 50 mPa·s.

[0037] Preferably, the hydrogen content of the cross-linked hydrogen silicone oil is 5 to 16 mmol / g, for example, 5 mmol / g, 7 mmol / g, 9 mmol / g, 11 mmol / g, 13 mmol / g, 15 mmol / g or 16 mmol / g.

[0038] Preferably, the molar ratio of Si—H to vinyl in the cross-linked hydrogen silicone oil is (0.05-0.15):1, for example, 0.05:1, 0.07:1, 0.09:1, 0.11:1, 0.13:1 or 0.15:1.

[0039] Preferably, the thermally conductive filler A and the thermally conductive filler B both include spherical aluminum oxide and silicon carbide.

[0040] As a preferred technical solution of the present invention, the above-mentioned spherical alumina and silicon carbide are selected for combination. Since the thermal conductivity of the silicon carbide is stronger than that of the spherical alumina, by compounding it with the spherical alumina in a suitable proportion, the obtained potting compound can have a higher thermal conductivity and a lower density at the same addition amount.

[0041] Preferably, the mass ratio of the spherical alumina to silicon carbide is (55-115):(10-20), for example, 55:10, 65:12, 70:14, 75:16, 80:18, 90:19, 110:20, etc.

[0042] Preferably, the D of the spherical alumina 50 The particle size is 2 to 90 μm, for example, 2 μm, 10 μm, 15 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm or 90 μm.

[0043] Further preferably, the D of the spherical alumina 50 The particle sizes are 2 μm, 10 μm and 90 μm respectively, and the mass ratio of the three is (5-15):(40-70):(10-20), for example 5:40:10, 7:50:12, 9:55:14, 11:60:16, 13:65:18 or 15:70:20, etc.

[0044] Preferably, the D of the silicon carbide 50 The particle size is 15 to 25 μm, for example, 15 μm, 17 μm, 19 μm, 21 μm, 23 μm or 25 μm.

[0045] Preferably, the inhibitor comprises any one of 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, 3-methyl-1-butyn-3-ol, 1-ethynylcyclohexanol, 3-phenyl-1-butyn-3-ol, 3-propyl-1-butyn-3-ol or 3-octyl-1-butyn-3-ol, or a combination of at least two thereof.

[0046] Preferably, the platinum catalyst comprises any one of an alcohol solution of chloroplatinic acid, a platinum catalyst coordinated with tetrahydrofuran, or a platinum catalyst coordinated with divinyltetramethylsiloxane, or a combination of at least two thereof.

[0047] Preferably, the B component also includes a color paste including any one of red paste, black paste or blue paste, or a combination of at least two of them.

[0048] In a second aspect, the present invention provides a method for preparing the two-component silicone potting adhesive as described in the first aspect, wherein the preparation method comprises the preparation of component A and the preparation of component B;

[0049] The preparation method of the component A comprises: mixing modified vinyl silicone oil A, terminal hydrogen silicone oil, cross-linked hydrogen silicone oil, thermal conductive filler A and inhibitor to obtain the component A;

[0050] The preparation method of the B component comprises: mixing modified vinyl silicone oil B, thermal conductive filler B, platinum catalyst and optionally color paste to obtain the B component.

[0051] The above-mentioned component A and component B can be mixed in a mass ratio of 1:1 when used.

[0052] In a third aspect, the present invention provides a use of the two-component silicone potting adhesive as described in the first aspect in an electronic product.

[0053] The numerical range described in the present invention not only includes the point values ​​listed above, but also includes any point values ​​between the above numerical ranges that are not listed. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0054] Compared with the prior art, the present invention has the following beneficial effects:

[0055] The two-component organosilicon potting adhesive provided by the present invention comprises an A component and a B component, wherein the A component comprises a modified vinyl silicone oil A, a terminal hydrogen-containing silicone oil, a cross-linked hydrogen silicone oil, a thermally conductive filler A and an inhibitor, and the B component comprises a modified vinyl silicone oil B, a thermally conductive filler B and a platinum catalyst; the modified vinyl silicone oil A and the modified vinyl silicone oil B are both obtained by reacting an unmodified vinyl silicone oil and trimethylchlorosilane; by adding the modified vinyl silicone oil, the obtained two-component organosilicon potting adhesive has both low viscosity and high thermal conductivity, the thermal conductivity can reach above 5 W / (m·K), the viscosity is below 20000 mPa·s, and the two-component organosilicon potting adhesive has the characteristics of moderate hardness, good anti-settling performance and good insulation, thereby meeting the potting requirements of small-size and high-power electronic modules. DETAILED DESCRIPTION

[0056] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0057] Unless otherwise specified, the raw materials involved in the following examples and comparative examples are conventional materials in the art and can be purchased from commercial products. In particular, the information of some of the raw materials involved is as follows:

[0058] (1) Vinyl silicone oil

[0059] Unmodified vinyl silicone oil A: viscosity 10 mPa·s (25°C), vinyl content 1.48 mmol / g, purchased from Anbi Ya, brand name Andisil VS10;

[0060] Unmodified vinyl silicone oil B: viscosity 20 mPa·s (25°C), vinyl content 1.4 mmol / g, purchased from Anbiya, brand name Andisil VS20;

[0061] Unmodified vinyl silicone oil B: viscosity is 45 mPa·s (25° C.), vinyl content is 0.71 mmol / g, purchased from Anbiya, brand name Andisil VS 50.

[0062] (2) Hydrogenated silicone oil

[0063] End-hydrogenated silicone oil A: viscosity 9 mPa·s (25°C), hydrogen content 1.8 mmol / g, purchased from Shanghai Jingri, brand DH018N;

[0064] End-hydrogenated silicone oil B: viscosity is 17 mPa·s (25°C), hydrogen content is 1.3 mmol / g, purchased from Runhe, brand RH-H45.

[0065] (3) Cross-linked hydrogen silicone oil

[0066] Cross-linked hydrogen silicone oil: viscosity is 50 mPa·s (25° C.), hydrogen content is 8.6 mmol / g, purchased from Anbiya, brand number XL1342.

[0067] (4) Thermally conductive filler

[0068] Spherical Alumina A:D 50 The particle size is 2 μm and is commonly available in the market;

[0069] Spherical Alumina B:D 50 The particle size is 10 μm and is commonly available in the market;

[0070] Spherical Alumina C:D 50 The particle size is 90 μm and is commonly available in the market;

[0071] Silicon carbide: D 50 The particle size is 20 μm and is commonly available in the market.

[0072] (5) Platinum catalyst

[0073] Divinyltetramethylsiloxane coordinated platinum catalyst: the platinum content is 1%, purchased from Ambier, the brand is Amdisil Pt 10000.

[0074] (6) Color paste

[0075] Black paste: commonly available in the market.

[0076] Preparation Example 1

[0077] A modified vinyl silicone oil A, the preparation method of which comprises: adding 250g of unmodified vinyl silicone oil A and 2.5g of trimethylchlorosilane into a three-necked flask, stirring and reacting at 60°C for 4h, then heating to 100°C, performing reduced pressure distillation at a vacuum degree not less than -0.08MPa, removing excess trimethylchlorosilane, and obtaining the modified vinyl silicone oil A.

[0078] Preparation Example 2

[0079] A modified vinyl silicone oil B, the preparation method of which comprises: adding 250g of unmodified vinyl silicone oil B and 2.5g of trimethylchlorosilane into a three-necked flask, stirring and reacting at 60°C for 4h, then heating to 100°C, performing reduced pressure distillation at a vacuum degree of not less than -0.08MPa, removing excess trimethylchlorosilane, and obtaining the modified vinyl silicone oil B.

[0080] Preparation Example 3

[0081] A modified vinyl silicone oil C, the preparation method of which comprises: adding 250g of unmodified vinyl silicone oil C and 2.5g of trimethylchlorosilane into a three-necked flask, stirring and reacting at 70°C for 3h, then heating to 100°C, performing reduced pressure distillation at a vacuum degree not less than -0.08MPa, removing excess trimethylchlorosilane, and obtaining the modified vinyl silicone oil C.

[0082] Examples 1 to 9

[0083] Examples 1 to 9 respectively provide a two-component silicone potting adhesive, each comprising a component A and a component B, the components and amounts of the component A and the component B are shown in Table 1;

[0084] And in Table 1, the dosage units of each component are "parts by weight";

[0085] Table 1

[0086]

[0087]

[0088] The preparation method of the two-component silicone potting adhesive provided in Examples 1 to 9 is characterized in that the preparation method includes the preparation of component A and the preparation of component B;

[0089] The preparation method of the component A comprises: mixing modified vinyl silicone oil A, terminal hydrogen silicone oil, cross-linked hydrogen silicone oil, thermal conductive filler A and inhibitor to obtain the component A;

[0090] The preparation method of the B component comprises: mixing modified vinyl silicone oil B, thermal conductive filler B, platinum catalyst and optional color paste to obtain the B component

[0091] Comparative Example 1

[0092] A two-component silicone potting adhesive, which differs from Example 1 in that unmodified vinyl silicone oil B is used to replace the modified vinyl silicone oil provided in Preparation Example 2 in component A, and other components, amounts and preparation methods are the same as those in Example 1.

[0093] Comparative Example 2

[0094] A two-component silicone potting adhesive is disclosed. The difference between the two-component silicone potting adhesive and Example 1 is that the unmodified vinyl silicone oil B is used to replace the modified vinyl silicone oil provided in Preparation Example 2 in the B component, and the other components, amounts and preparation methods are the same as those in Example 1.

[0095] Performance Testing

[0096] (1) Viscosity: Tested in accordance with the single cylinder rotation viscometer method of GB / T 2794 for the determination of adhesive viscosity.

[0097] (2) Thermal conductivity: Tested in accordance with ISO 22007-2 Plastics. Determination of thermal conductivity and thermal diffusivity. Part 2: Transient planar heat source (hot disk) method.

[0098] The two-component silicone potting adhesives provided in Examples 1 to 9 and Comparative Examples 1 to 2 were tested according to the above test method. The test results are shown in Table 2:

[0099] Table 2

[0100]

[0101]

[0102] (1) The viscosity of component A and component B of the two-component silicone potting adhesive provided in Examples 1 to 5 are both low, and the thermal conductivity is high; while the component A of the two-component silicone potting adhesive provided in Comparative Example 1 is solid, and the component B of the two-component silicone potting adhesive provided in Comparative Example 2 is solid, both of which do not meet the requirements.

[0103] (2) Compared with Example 1, no silicon carbide is added to component A of the two-component silicone potting glue provided in Example 6, no silicon carbide is added to component B of the two-component silicone potting glue provided in Example 7, the amount of thermally conductive filler in component A of the two-component silicone potting glue provided in Example 8 is relatively low, and the amount of thermally conductive filler in component B of the two-component silicone potting glue provided in Example 9 is relatively low, which will also lead to a decrease in the thermal conductivity of the obtained two-component silicone potting glue.

[0104] The applicant declares that the above is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention shall fall within the protection scope and disclosure scope of the present invention.

Claims

1. A two-component silicone potting adhesive, characterized in that: The two-component silicone potting adhesive comprises component A and component B; The component A comprises modified vinyl silicone oil A, terminal hydrogen silicone oil, cross-linked hydrogen silicone oil, thermal conductive filler A and inhibitor; The B component includes modified vinyl silicone oil B, thermal conductive filler B and platinum catalyst; The modified vinyl silicone oil A and the modified vinyl silicone oil B are both obtained by reacting unmodified vinyl silicone oil with trimethylchlorosilane.

2. The two-component silicone potting adhesive according to claim 1, characterized in that: The A component comprises the following components in parts by weight: Preferably, the B component comprises the following components in parts by weight: Modified vinyl silicone oil B 4.5-5.5 parts by weight; Thermally conductive filler B 94.5-95.5 parts by weight; 0.01 to 0.5 parts by weight of platinum catalyst.

3. The two-component silicone potting adhesive according to claim 1 or 2, characterized in that: The mass ratio of the unmodified vinyl silicone oil to trimethylchlorosilane is (99-101):1; Preferably, the reaction temperature is 60-70°C and the reaction time is 3-5h; Preferably, the viscosity of the unmodified vinyl silicone oil is 10 to 50 mPa·s; Preferably, the vinyl content of the unmodified vinyl silicone oil is independently 0.7 to 1.8 mmol / g.

4. The two-component silicone potting adhesive according to claim 1 or 2, characterized in that: The viscosity of the hydrogen-terminated silicone oil is 5 to 15 mPa·s; Preferably, the hydrogen content of the terminal hydrogen-containing silicone oil is 1.3 to 2.6 mmol / g; Preferably, the viscosity of the cross-linked hydrogen silicone oil is ≤100 mPa·s; Preferably, the hydrogen content of the cross-linked hydrogen silicone oil is 5 to 16 mmol / g; Preferably, the molar ratio of Si—H to vinyl in the cross-linked hydrogen silicone oil is (0.05-0.15):

1.

5. The two-component silicone potting adhesive according to any one of claims 1 to 4, characterized in that: The thermal conductive filler A and the thermal conductive filler B both include spherical aluminum oxide and silicon carbide; Preferably, the mass ratio of the spherical aluminum oxide to silicon carbide is (55-115):(10-20); Preferably, the D of the spherical alumina 50 Particle size is 2 to 90 μm; Preferably, the D of the silicon carbide 50 The particle size is 15~25μm.

6. The two-component silicone potting adhesive according to any one of claims 1 to 5, characterized in that: The inhibitor includes any one of 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane, 3-methyl-1-butyn-3-ol, 1-ethynylcyclohexanol, 3-phenyl-1-butyn-3-ol, 3-propyl-1-butyn-3-ol or 3-octyl-1-butyn-3-ol or a combination of at least two thereof.

7. The two-component silicone potting adhesive according to any one of claims 1 to 6, characterized in that: The platinum catalyst includes any one of an alcohol solution of chloroplatinic acid, a platinum catalyst coordinated with tetrahydrofuran, or a platinum catalyst coordinated with divinyltetramethylsiloxane, or a combination of at least two thereof.

8. The two-component silicone potting adhesive according to any one of claims 1 to 7, characterized in that: The B component also includes a color paste; Preferably, the content of the color paste in the B component is 0.01 to 0.1 parts by weight; Preferably, the color paste includes any one of red paste, black paste or blue paste, or a combination of at least two of them.

9. A method for preparing the two-component silicone potting adhesive according to any one of claims 1 to 8, characterized in that: The preparation method includes the preparation of component A and the preparation of component B; The preparation method of the component A comprises: mixing modified vinyl silicone oil A, terminal hydrogen silicone oil, cross-linked hydrogen silicone oil, thermal conductive filler A and inhibitor to obtain the component A; The preparation method of the B component comprises: mixing modified vinyl silicone oil B, thermal conductive filler B, platinum catalyst and optionally color paste to obtain the B component.

10. Use of the two-component silicone potting adhesive as claimed in any one of claims 1 to 8 in electronic products.

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