A surface plating device for a copper-free zinc collector and a manufacturing method thereof

Abstract

The present invention discloses a surface plating device and a manufacturing method for a copper-zinc-free collector, and specifically relates to the technical field of material plating. The device includes a plating tank, a plating drive assembly, and a workpiece fixing assembly. The plating drive assembly includes a lifting frame, and the workpiece fixing assembly includes a plurality of groups of workpiece fixtures. The workpiece fixture is connected to the lifting frame through a lower extension frame, and the lower extension frame is fixedly connected to the lifting frame. The workpiece fixture is rotatably mounted on one side of the bottom end of the lower extension frame. The lifting frame is provided with a rotating drive structure for driving each group of workpiece fixtures to rotate synchronously. A workpiece slot is provided on one side of the workpiece fixture, and the shape of the workpiece slot and the collector plate are adapted to each other. The present invention drives the workpiece fixture to rotate to adjust the upper and lower positions of the collector plate, so that the posture of the collector plate can be continuously adjusted, thereby improving the uniformity of the plating layer on the surface of the collector plate and reducing the influence of uneven bubbles on the plating solution.

Description

Technical Field

[0001] The present invention relates to the technical field of material plating, and more specifically, to a surface plating device for a copper-free zinc collector and a manufacturing method thereof. Background Art

[0002] Lithium battery is a high-performance rechargeable battery. With its high energy density, long life, no memory effect and low self-discharge rate, it has become the preferred energy solution for portable electronic devices, electric vehicles and energy storage systems. During the production process of lithium batteries, a large amount of dust will be generated, including positive and negative electrode material dust, electrolyte dust, etc. Therefore, dust removal equipment is required in the production process of lithium batteries. The dust is collected by the dust collector and filtered by the filter structure, so that the dust remains in the collector for storage.

[0003] Compared with other industrial production, lithium battery production has extremely strict control over the quality of equipment. For example, based on the consideration of the hazards and impacts of metallic copper and zinc on lithium batteries, the copper and zinc content must be strictly controlled throughout the entire lithium battery industry chain, and the processing and production process of the collector must be subject to a full copper and zinc ban. In order to ensure the corrosion resistance of the collector, reduce damage to the inner wall of the collector during the collection process, and avoid affecting the filtered dust, the inner wall of the collector needs to have sufficient corrosion resistance and wear resistance. Since nickel plating has the advantages of enhanced corrosion resistance, increased hardness, reduced wear, and improved gloss, the internal structure of the collector is preferably nickel-plated. Taking into account the special shapes of some structures (such as flat plates) and the fact that most collector structures are made of stainless steel, the surface conductivity is relatively poor and is not suitable for electroplating. Therefore, chemical nickel plating is preferred for such components.

[0004] Chemical nickel plating refers to the process in which metal ions in an aqueous solution are reduced by a reducing agent and precipitated onto the surface of a solid substrate under certain conditions. The nickel plating solution of chemical nickel plating generally uses nickel sulfate, nickel acetate and other salts as the main salts, hypophosphite, sodium borohydride, borane, hydrazine and other reducing agents, and then adds various additives. The operation is carried out in a high-temperature acidic solution. The coating shows superiority in uniformity, corrosion resistance, hardness and weldability.

[0005] For ordinary workpieces, their volume is small and the quantity of a single batch of products is small, so the conventional method of immersing them in nickel plating solution can be adopted. However, for the above-mentioned collector, the main working surface is the inner surface of the collector plate (corresponding to the inner surface of the collector after splicing to form the collector), and for large collectors, their main structure is composed of multiple groups of collector plates spliced ​​together. In order to ensure the splicing accuracy, it is only necessary to nickel-plate the inner surface of the collector plate. Therefore, when nickel-plating the collector plate, it is necessary to avoid contact between other surfaces of the collector plate and the nickel plating solution (if a plating layer is formed at the docking part of the collector plate, it will change the actual size of the collector plate. During the later assembly and docking, it is difficult to ensure that the installation accuracy meets the design requirements. Therefore, especially the docking surface, there should be no plating layer). For collector plates with a small product volume and a small single area, they can be placed flat in the nickel plating solution to make the depth of the surface to be plated in the nickel plating solution uniform, so as to maintain uniform plating.

[0006] However, for products with large quantities (such as the production of large quantities of collectors, and a single collector requires a large number of collector plates, so the overall production volume is large), in order to improve production efficiency, it is necessary to process multiple collector plates at one time, and for the convenience of processing, multiple groups of collector plates need to be immersed in the nickel plating solution in a vertical manner at the same time to make full use of the internal space of the plating tank and improve processing efficiency.

[0007] Among them, for the collector plate with a larger monomer area, since it is vertically arranged in the nickel plating solution, the larger the monomer area, the larger the height span in the nickel plating solution. During the chemical nickel plating process, the reducing agent (such as sodium hypophosphite) reduces nickel ions to metallic nickel and also produces hydrogen. Therefore, a large number of bubbles will be generated during the actual nickel plating process. According to the above-mentioned nickel plating method, the bubbles are mainly formed on one side of the collector plate, and the bubbles gradually increase from bottom to top, which leads to uneven distribution of bubble density in the height direction of the nickel plating solution. The flow and amount of bubbles will affect the contact effect and contact amount between the nickel plating solution and the collector plate, which will lead to different relative concentrations and deposition effects of ions. Therefore, the coating on the surface of the collector plate is unevenly distributed in the height direction, affecting the actual plating quality. Summary of the invention

[0008] The present invention provides a surface plating device and a manufacturing method for a copper-free zinc collector, and aims to solve the problem that, in the existing plating process of a vertically arranged workpiece, bubbles gradually increase from bottom to top, thereby causing uneven distribution of bubble density in the height direction of the nickel plating solution, resulting in uneven distribution of the plating layer on the surface of the collector plate in the height direction, affecting the actual plating quality.

[0009] To achieve the above-mentioned object, the present invention provides the following technical solutions: a surface plating device for a copper-free zinc collector, comprising a plating tank, a plating drive assembly and a workpiece fixing assembly, wherein the plating tank is provided with plating liquid, the workpiece fixing assembly is used to fix the collector plate, and the plating drive assembly is used to drive the workpiece fixing assembly to move;

[0010] The plating drive assembly includes a lifting frame, which is used to drive the workpiece fixing assembly to move vertically above the plating tank and drive the collector plate to immerse in or leave the plating solution. The workpiece fixing assembly includes a plurality of groups of workpiece fixtures, which are vertically arranged, and each group of workpiece fixtures is evenly distributed along the length direction of the lifting frame;

[0011] The workpiece holder is connected to the lifting frame through the lower extension frame, the lower extension frame is fixedly connected to the lifting frame, the workpiece holder is rotatably mounted on one side of the bottom end of the lower extension frame, and the workpiece holder rotates along a horizontal axis, and a rotation driving structure for driving each group of workpiece holders to rotate synchronously is provided on the lifting frame;

[0012] A workpiece slot is provided on one side of the workpiece fixture, and the shapes of the workpiece slot and the collector plate are adapted to each other. During installation, the collector plate is engaged with the inside of the workpiece slot, and the edge of the collector plate is fitted with the edge of the workpiece slot.

[0013] In a preferred embodiment, the plating drive assembly also includes a conveying guide rail and a traveling frame. The traveling frame is fixed relatively to the plating trough. The traveling frame is laterally slidably arranged on the conveying guide rail. The lifting frame is vertically slidably arranged on the traveling frame. A traveling mechanism is arranged between the traveling frame and the conveying guide rail. A lifting drive structure is arranged between the lifting frame and the traveling frame.

[0014] In a preferred embodiment, a rotating shaft portion is provided on one side of the workpiece holder corresponding to the lower extension frame, and the rotating shaft portion is rotatably installed in the lower extension frame. A driving shaft is provided at the bottom of the lifting frame, and the driving shaft is driven to rotate by a rotating driver. Each rotating shaft portion is respectively coordinated with the driving shaft through a belt assembly. A protective cover is fixedly installed on the outside of the lower extension frame, and the protective cover covers the belt assembly and the outside of the rotating shaft portion.

[0015] In a preferred embodiment, a plurality of groups of vacuum adsorption holes are provided in the workpiece slot, an air duct is provided inside the workpiece fixture, each vacuum adsorption hole is connected to the air duct, the air duct is connected to a vacuum assembly, and the vacuum assembly is used to extract air from the air duct to form a negative pressure at the vacuum adsorption hole, and elastic pads are provided at the positions of the workpiece fixture corresponding to the workpiece slot, and the elastic pads are embedded in the workpiece fixture.

[0016] In a preferred embodiment, the air extraction component includes an air extraction adapter, which is rotatably mounted on the end of the rotating shaft portion, and a hollow cavity connected to the airway is provided in the rotating shaft portion, and the hollow cavity is connected to the inner cavity of the air extraction adapter. The air extraction adapter is fixedly installed in the protective cover, and a seal is provided between the air extraction adapter and the rotating shaft portion. An air pipe is fixedly installed on the air extraction adapter, and the air pipe extends upward in the protective cover and extends out of the protective cover, and then is connected to the air extraction pump structure through a pipeline.

[0017] In a preferred embodiment, a clearance fit is adopted between the collector plate and the workpiece slot, a heating structure is arranged inside the workpiece slot, the heating structure is arranged on the side of the collector plate facing away from the coating surface, the heating structure is arranged in close contact with the collector plate, and the heating structure is evenly distributed along the surface of the collector plate.

[0018] In a preferred embodiment, the heating structure is an electric heating structure, and a conductive brush ring assembly is fixedly installed in the protective cover. The conductive brush ring assembly is rotatably arranged on the outside of the rotating shaft. The conductive wires of the heating structure extend through the airway and are connected to the conductive brush ring assembly to form an electrical connection with the conductive brush ring assembly. The conductive wires of the conductive brush ring assembly extend upward in the protective cover and extend out of the protective cover to be connected to the power supply equipment.

[0019] In a preferred embodiment, a limiting edge structure is also provided on the workpiece fixture, and the limiting edge structure and the workpiece fixture are detachably installed. A groove structure that is compatible with the limiting edge structure is provided on the side of the workpiece fixture corresponding to the limiting edge structure, and a vacuum adsorption hole is also provided at the position of the workpiece fixture corresponding to the limiting edge structure. The limiting edge structure is compatible with the edge of the collector plate. When the collector plate is installed in the workpiece slot, the edge of the collector plate is compatible with the inner side wall of the limiting edge structure, and at normal temperature, the plated surface of the collector plate is located inside the outer wall of the limiting edge structure, and the limiting edge structure is an elastic structure.

[0020] In a preferred embodiment, a cooling assembly is also provided on the lower extension frame, and the cooling assembly includes a plurality of groups of heat dissipation air holes vertically arranged on the surface of the lower extension frame, and the heat dissipation air holes are arranged corresponding to the edges of the workpiece fixture, and an air guide cavity is arranged inside the lower extension frame, and the air guide cavity is connected to a low-temperature gas source through a pipeline, and the low-temperature gas source is used to provide low-temperature gas to the air guide cavity, and a plurality of groups of heat dissipation fins are arranged on the edge of the workpiece fixture, and the heat dissipation fins extend from a side of the workpiece fixture close to the lower extension frame to the edge limiting structure.

[0021] A method for manufacturing a copper-free zinc collector comprises the following steps:

[0022] Step 1: Install each group of pre-treated collector plates in the corresponding workpiece holder, start the vacuum pump structure to adsorb and fix the collector plates, and start the heating structure to pre-heat the collector plates;

[0023] Step 2: driving the workpiece holder to the top of the plating tank, and driving the lifting frame to descend so that each collector plate is immersed in the plating solution in the plating tank;

[0024] Step 3: driving each workpiece holder to rotate to adjust the up and down posture of the collector plate and stir the plating solution;

[0025] Step 4: After the plating is completed, the lifting frame is driven to rise, so that the workpiece holder and the collector plate are separated from the plating solution, and at the same time, the workpiece holder is driven to rotate to accelerate the separation of the plating solution on the surface of the collector plate;

[0026] Step 5: further heating the collector plate by means of a heating structure to make its temperature higher than the temperature during plating;

[0027] Step 6: turn off the heating structure, wait for the temperature of the collector plate to drop to room temperature, and then drive the lifting frame to drive the collector plate to the subsequent processing station for subsequent processing.

[0028] The beneficial effects of the present invention are as follows: the present invention can simultaneously install a plurality of collector plates on a group of lifting frames, and sequentially perform various pretreatments before plating and plating operations, thereby greatly improving processing efficiency; during the plating reaction, the workpiece holder is driven to rotate to adjust the upper and lower positions of the collector plate, so that the posture of the collector plate can be continuously adjusted, and even if the bubbles in the plating solution are unevenly distributed in the upper and lower directions, the upper and lower postures of the collector plate can be adjusted so that the side of the collector plate bears the solution more evenly, thereby improving the uniformity of the plating layer on the surface of the collector plate, reducing the influence of uneven bubbles on the plating solution, and thereby reducing the influence of the bubble distribution on the plating layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0030] Figure 2 It is a schematic diagram of the plating drive assembly of the present invention bringing the collector plate workpiece holder to above the plating tank.

[0031] Figure 3 This is a diagram showing the distribution status of workpiece fixtures on a single lifting frame of the present invention.

[0032] Figure 4 It is a schematic diagram of the plating state of the present invention.

[0033] Figure 5 This is a bubble distribution diagram when the collector plate is plated in a vertically fixed manner in the prior art.

[0034] Figure 6This is a state diagram of a single workpiece fixture of the present invention fixing a collector plate and then placing the plate into a plating solution for plating.

[0035] Figure 7 This is a state diagram of the workpiece holder driving the collector plate to rotate to adjust the position during the plating process of the present invention.

[0036] Figure 8 This is a schematic diagram of the structure of the improved workpiece fixing assembly of the present invention.

[0037] Fig. 9 This is a distribution diagram of the vacuum adsorption holes and the heating structure on the improved workpiece fixture of the present invention.

[0038] Fig.10 This is a state diagram after the improved workpiece holder of the present invention fixes the collector plate.

[0039] Fig.11 For the present invention Figure 8 A-section structure enlarged view.

[0040] Fig.12 For the present invention Figure 8 Enlarged view of the structure of part B.

[0041] Fig.13 This is a diagram showing the state in which the collector plate is preheated before plating to expand it and bring it into close contact with the edge limiting structure.

[0042] Fig.14 This is a schematic diagram of further heating the collector plate and cooling the edge limiting structure after plating is completed in the present invention to produce a deformation difference and shear separation of the plating layer therebetween.

[0043] Fig.15 It is a schematic diagram of the influence of the expansion of the collector plate and the contraction of the edge limiting structure on the coating on the collector plate and the edge limiting structure of the present invention.

[0044] Fig.16 The present invention is a flow chart of the method for manufacturing the copper-free zinc collector.

[0045] The accompanying drawings are marked as follows: 1. plating tank; 2. plating drive assembly; 21. lifting frame; 211. drive shaft; 212. rotating driver; 213. belt assembly; 22. conveying guide rail; 23. walking frame; 3. workpiece fixing assembly; 31. workpiece holder; 311. workpiece clamping slot; 312. rotating shaft; 313. vacuum adsorption hole; 314. air duct; 315. heat dissipation fin; 316. elastic pad; 32. lower extension frame; 321. heat dissipation blowing hole; 322. air guide cavity; 33. protective cover; 34. edge limiting structure; 35. heating structure; 4. collector plate; 5. exhaust adapter; 6. conductive brush ring assembly. DETAILED DESCRIPTION

[0046] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0047] Refer to the instruction manual Figures 1 to 15 A surface plating device for a copper-zinc-free collector includes a plating tank 1, a plating drive assembly 2 and a workpiece fixing assembly 3. A plating solution is provided in the plating tank 1. The plating solution in this embodiment is a nickel plating solution. A heater for providing a reaction temperature is also provided in the plating tank 1 to heat the plating solution to keep it within the reaction temperature range. The nickel plating solution and related reaction operations are all common technologies and will not be explained in detail in this embodiment. The workpiece fixing assembly 3 is used to fix the collector plate 4, and the plating drive assembly 2 is used to drive the workpiece fixing assembly 3 to move, thereby realizing the station conversion of the collector plate 4 and the movement of immersing or leaving the plating solution and other operations.

[0048] The plating drive assembly 2 includes a lifting frame 21, which is used to drive the workpiece fixing assembly 3 to move vertically above the plating tank 1 and drive the collector plate 4 to immerse in or leave the plating solution. The workpiece fixing assembly 3 includes multiple groups of workpiece fixtures 31, which are vertically arranged, and each group of workpiece fixtures 31 is evenly distributed along the length direction of the lifting frame 21, so that multiple collector plates 4 can be plated at the same time, which greatly improves the production efficiency of the collector. The workpiece fixture 31 is connected to the lifting frame 21 through a lower extension frame 32, and the lower extension frame 32 is fixedly connected to the lifting frame 21. The workpiece fixture 31 is rotatably installed on one side of the bottom end of the lower extension frame 32, and the workpiece fixture 31 rotates along a horizontal axis, that is, along an axis perpendicular to the plating surface of the collector plate 4. The lifting frame 21 is provided with a rotating drive structure for driving each group of workpiece fixtures 31 to rotate synchronously.

[0049] A workpiece slot 311 is provided on one side of the workpiece fixture 31 , and the shapes of the workpiece slot 311 and the collector plate 4 are adapted to each other. During installation, the collector plate 4 is engaged with the inside of the workpiece slot 311 , and the edge of the collector plate 4 is fitted with the edge of the workpiece slot 311 .

[0050] In the above embodiment, multiple collector plates 4 can be installed on a set of lifting frames 21 at the same time, and various pretreatments before plating and plating operations can be performed in sequence. Multiple collector plates 4 can be processed at the same time. During the plating operation, refer to the attached manual. Figure 4The workpiece holder 31 is driven downward by the lifting frame 21 to immerse into the plating solution in the plating tank 1, and is heated to the reaction temperature by the heater in the plating tank 1 to make the plating solution react, and then gradually form a plating layer on the exposed surface of the collector plate 4 to complete the plating operation. In the reaction process, the workpiece holder 31 is driven to rotate to adjust the upper and lower positions of the collector plate 4, so that the posture of the collector plate 4 can be continuously adjusted, and even if the bubbles in the plating solution are unevenly distributed in the upper and lower directions, the upper and lower postures of the collector plate 4 can be adjusted to make the side of the collector plate 4 bear the solution more evenly, thereby improving the uniformity of the plating layer on the surface of the collector plate 4, reducing the influence of uneven bubbles on the plating solution, and thereby reducing the influence of bubble distribution on the plating layer.

[0051] It should be noted that while driving the workpiece holder 31 to drive the collector plate 4 to rotate to adjust the posture, the movement of the workpiece holder 31 and the collector plate 4 can also effectively stir the plating solution, thereby making the concentration of the plating solution more uniform and further improving the quality of the plated layer.

[0052] Further, in the above-mentioned embodiments, refer to the attached Figure 1 and Figure 2 The plating drive assembly 2 also includes a conveying guide rail 22 and a traveling frame 23. The traveling frame 23 is built on the processing production line of the collector plate 4 and is relatively fixed to the plating tank 1. In addition to the plating tank 1, processing equipment such as degreasing, cleaning, and activation are also provided on the production line. This embodiment mainly explains the plating operation, so it is not mentioned in detail. The traveling frame 23 is laterally slidably arranged on the conveying guide rail 22, and the lifting frame 21 is vertically slidably arranged on the traveling frame 23. A traveling mechanism, such as a traveling wheel, is arranged between the traveling frame 23 and the conveying guide rail 22. A lifting drive structure, such as a linear motor, a cylinder, a hydraulic cylinder, and a motor screw mechanism, is arranged between the lifting frame 21 and the traveling frame 23, thereby being able to simultaneously drive multiple groups of collector plates 4 to perform station conversion and drive the collector plates 4 to lift and lower for various operations.

[0053] For further information, please refer to the attached manual. Figure 3 and Figure 6A rotating shaft portion 312 is provided on one side of the workpiece holder 31 corresponding to the lower extension frame 32, and the rotating shaft portion 312 is rotatably installed in the lower extension frame 32. A driving shaft 211 is provided at the bottom of the lifting frame 21, and the driving shaft 211 is driven to rotate by a rotating driver 212. For example, a motor is selected as the rotating driver 212 and is installed at one end of the lifting frame 21 to rotate the driving shaft 211. Each rotating shaft portion 312 is respectively transmitted and cooperated with the driving shaft 211 through a belt assembly 213. A protective cover 33 is fixedly installed on the outside of the lower extension frame 32, and the protective cover 33 covers the outside of the belt assembly 213 and the rotating shaft portion 312 to shield and protect them, so as to prevent the plating solution from affecting the rotating shaft portion 312 and the belt assembly 213.

[0054] In the above embodiment, in order to improve the fixing stability of the collector plate 4, the present embodiment further improves the workpiece fixing assembly 3. For details, refer to the attached manual. Figure 8 , Fig. 9 and Fig.12 A plurality of vacuum adsorption holes 313 are provided in the workpiece slot 311, and an air passage 314 is provided inside the workpiece fixture 31. Each vacuum adsorption hole 313 is connected to the air passage 314, and the air passage 314 is connected to a vacuum pump component for extracting air from the air passage 314, thereby forming a negative pressure at the vacuum adsorption hole 313, thereby stably adsorbing the collector plate 4.

[0055] For further information, please refer to the attached manual. Fig.12 The vacuum assembly includes a vacuum adapter 5, which is rotatably mounted on the end of the shaft portion 312. The shaft portion 312 is provided with a hollow cavity connected to the airway 314, and the hollow cavity is connected to the inner cavity of the vacuum adapter 5. The vacuum adapter 5 is fixedly installed in the protective cover 33. A seal is provided between the vacuum adapter 5 and the shaft portion 312. An air pipe is fixedly installed on the vacuum adapter 5, which extends upward in the protective cover 33 and extends out of the protective cover 33, and is then connected to the vacuum pump structure through a pipeline, thereby ensuring that the workpiece holder 31 can rotate effectively while also effectively providing adsorption negative pressure to the vacuum adsorption hole 313.

[0056] In the above embodiment, the collector plate 4 is mounted in the workpiece slot 311, so that the workpiece fixing assembly 3 can effectively cover the other parts of the collector plate 4. However, in order to ensure that the collector plate 4 can be installed quickly, the fit between the collector plate 4 and the workpiece slot 311 is also a clearance fit, that is, the gap is very small. When the collector plate 4 is stationary, the plating solution is not easy to enter the above-mentioned tiny gap. However, during the plating process of this embodiment, the collector plate 4 needs to be rotated, which makes it easier for the air originally existing in the gap to overflow, and then causes the plating solution to penetrate into the above-mentioned gap, so that the edge of the collector plate 4 will also be affected. For this reason, this embodiment further improves the workpiece fixing assembly 3. For details, refer to the attached manual. Figure 8 , Fig. 9 and Fig.11 A clearance fit is adopted between the collector plate 4 and the workpiece slot 311, and a heating structure 35 is arranged inside the workpiece slot 311. The heating structure 35 is arranged corresponding to the side of the collector plate 4 away from the plated surface. The heating structure 35 is arranged in close contact with the collector plate 4, and the heating structure 35 is evenly distributed along the surface of the collector plate 4. After the collector plate 4 is installed in the workpiece slot 311, the collector plate 4 can be evenly heated by the heating structure 35, so that the collector plate 4 generates thermal expansion, thereby reducing the contact gap with the surface of the workpiece slot 311, and further improving the shielding effect.

[0057] It should be noted that the heating of the collector plate 4 by the heating structure 35, in addition to reducing the gap and increasing the tightness of fit, can also preheat the collector plate 4. When the collector plate 4 is immersed in the plating solution, the temperature of the plating solution will not be reduced, nor will it cause uneven hot and cold and form an uneven concentration distribution of the plating solution, thereby further improving the plating accuracy. In addition, in order to prevent the collector plate 4 from expanding too much and exceeding the workpiece slot 311 during the plating process, it is necessary to ensure that at room temperature, the depth of the workpiece slot 311 is greater than the thickness of the collector plate 4.

[0058] For further information, please refer to the attached manual. Fig.11 and Fig.12 The heating structure 35 is an electric heating structure. A conductive brush ring assembly 6 is fixedly installed in the protective cover 33. The conductive brush ring assembly 6 is rotatably arranged on the outside of the rotating shaft portion 312. The conductive wire of the heating structure 35 extends through the air duct 314 and is connected to the conductive brush ring assembly 6, thereby forming an electrical connection with the conductive brush ring assembly 6. The conductive wire of the conductive brush ring assembly 6 extends upward in the protective cover 33, extends out of the protective cover 33, and is then connected to the power supply device, thereby supplying power to the heating structure 35. At the same time, it will not affect the rotation of the workpiece holder 31. The conductive brush ring assembly 6 is a common technical solution for providing an electrical connection for the rotating structure, and this embodiment will not be explained in detail.

[0059] In the above embodiment, if the thermal expansion coefficient of the collector plate 4 itself is relatively high, it is easy to be squeezed with the inner wall of the workpiece slot 311 after it is heated and expanded, causing damage. For this reason, the present embodiment also provides the following technical solutions. Specifically, a limiting edge structure 34 is also provided on the workpiece fixture 31, and the limiting edge structure 34 and the workpiece fixture 31 are detachably installed. The limiting edge structure 34 and the edge of the collector plate 4 are mutually adapted. When the collector plate 4 is installed in the workpiece slot 311, the edge of the collector plate 4 and the inner side wall of the limiting edge structure 34 are mutually adapted, that is, the inner side wall of the limiting edge structure 34 and the inner side wall of the workpiece slot 311 are mutually adapted, and at room temperature, the plated surface of the collector plate 4 is located inside the outer wall of the limiting edge structure 34, that is, the surface to be plated of the collector plate 4 does not extend out of the limiting edge structure 34, and the limiting edge structure 34 is an elastic structure.

[0060] By adopting the above embodiment, the gap error between the collector plate 4 and the workpiece slot 311 can be increased. The collector plate 4 is heated before plating. Fig.13 The expansion of the collector plate 4 will squeeze the edge limiting structure 34, and then the edge of the collector plate 4 will be effectively sealed with the help of the edge limiting structure 34 to prevent the subsequent plating solution from penetrating. At the same time, it will not cause damage to the collector plate 4. Among them, the collector plate 4 is preferably a plastic structure, which can reduce the amount of plating layer formed on its surface, and secondly, it has a low cost and can be used as a disposable structure, that is, a new edge limiting structure 34 is used for each plating, which will not cause the workpiece fixture 31 The side of the plated surface of the collector plate 4 will not increase in thickness due to repeated plating, affecting subsequent processing, thereby effectively ensuring the plating quality.

[0061] For further information, please refer to the attached manual. Fig. 9 and Fig.11 A groove structure is provided on one side of the workpiece fixture 31 corresponding to the edge limiting structure 34. During installation, the edge limiting structure 34 is engaged in the groove, and a vacuum adsorption hole 313 is also provided at the position of the workpiece fixture 31 corresponding to the edge limiting structure 34, so that the edge limiting structure 34 can be positioned and adsorbed and fixed.

[0062] It should be noted that this embodiment uses vacuum adsorption to fix the collector plate 4 and the edge limiting structure 34, and does not use pure mechanical fixation. Therefore, when it is deformed by temperature, it can produce relative slight movement, and will not cause damage to the collector plate 4 or inhibit the expansion of the collector plate 4 due to the limitation of the fixed structure.

[0063] Furthermore, elastic pads 316 are provided at positions of the workpiece holder 31 corresponding to the workpiece slots 311. The elastic pads 316 are made of plastic or high-temperature resistant rubber structures. The elastic pads 316 are embedded and installed in the workpiece holder 31, so that a certain seal can be formed at positions of the workpiece slots 311 corresponding to the collector plate 4 or the edge limiting structure 34, thereby improving the vacuum adsorption effect.

[0064] In the above embodiment, due to the reaction of the plating solution, a plating layer will be formed on the surface of the edge limiting structure 34 and the surface of the collector plate 4. Although the plating layer is very thin, after the plating is completed and the collector plate 4 is driven to move out of the plating solution, since the collector plate 4 has a large surface area and is made of metal, the heat dissipation is fast. Therefore, the cooling speed of the collector plate 4 is relatively fast, and it produces shrinkage deformation before the edge limiting structure 34. The shrinkage deformation includes deformation in the thickness of the collector plate 4, that is, the surface of the collector plate 4 produces a slight inward movement toward the surface of the edge limiting structure 34, which in turn causes the plating layer at the connection between the two to be pulled. The pulling is outward away from the surface of the collector plate 4, so it will cause the plating layer at the edge of the collector plate 4 to produce tiny outward burrs, thereby affecting the edge quality of the plating layer of the collector plate 4. Therefore, after the actual plating is completed, when the collector plate 4 leaves the plating solution, the collector plate 4 can be further heated with the help of the heating structure 35, refer to the attached manual. Fig.14 At this time, the collector plate 4 further expands. Compared with the relative position of the collector plate 4 and the edge limiting structure 34 during the plating process, the plated surface of the collector plate 4 further expands outward, so that the plating layer material between it and the edge limiting structure 34 produces inward pulling and shearing compared to the plating surface of the collector plate 4, so that no outward fine burrs are formed on the edge of the collector plate 4, further improving the quality of the edge of the plating layer of the collector plate 4.

[0065] For further information, please refer to the attached manual. Figures 8 to 14 A cooling assembly is also provided on the lower extension frame 32, and the cooling assembly includes a plurality of heat dissipation air holes 321 vertically arranged on the surface of the lower extension frame 32, and the heat dissipation air holes 321 are arranged corresponding to the edges of the workpiece fixture 31, and an air guide cavity 322 is provided inside the lower extension frame 32, and the air guide cavity 322 is connected to a low-temperature air source through a pipeline, and the low-temperature air source is used to provide low-temperature gas to the air guide cavity 322. For example, a combination of an air pump and a cooling device is used to cool the air through the cooling device to keep the air at a low temperature, and then the air pump is used to transport the air to the air guide cavity 322, so that the heat dissipation air hole 321 can blow out the low-temperature gas.

[0066] Specifically, after the plating is completed, the collector plate 4 is further heated by the edge limiting structure 34 to make it continue to expand. At the same time, the workpiece holder 31 is controlled to rotate so that the edge of the workpiece holder 31 gradually cooperates with the heat dissipation blowing hole 321, so that the heat dissipation blowing hole 321 causes the edge of the workpiece holder 31 to cool down, thereby causing the edge limiting structure 34 to cool down and shrink. For details, refer to the attached manual. Fig.15 , which can further improve the separation effect of the coating layer between the edge limiting structure 34 and the collector plate 4, and because the coating layer is made of metal, the above-mentioned deformation does not need to be very large, and the whole process is very fast. After ensuring that the coating layer is broken and separated, the heating of the heating structure 35 can be turned off, and the heat dissipation blowing hole 321 can continue to blow out low-temperature air to cool the collector plate 4 and the workpiece fixture 31 as a whole, so that the collector plate 4 can be quickly cooled to room temperature for subsequent operations.

[0067] In order to give priority to cooling the edge limiting structure 34, refer to the attached manual. Fig. 9 and Fig.11 A plurality of heat dissipation fins 315 are disposed at the edge of the workpiece fixture 31 . The heat dissipation fins 315 extend from a side of the workpiece fixture 31 close to the lower extension frame 32 to the edge limiting structure 34 , thereby preferentially cooling the edge limiting structure 34 .

[0068] Refer to the instruction manual Fig.16 Based on the above-mentioned scheme of the plating device, the present invention also provides a method for manufacturing a copper-free zinc collector, and performs plating processing on the surface of the collector plate 4. Specifically, the method includes the following steps.

[0069] Step 1: install each group of pre-treated collector plates 4 in the corresponding workpiece holder 31, start the vacuum pump structure to adsorb and fix the collector plates 4, and start the heating structure 35 to pre-heat the collector plates 4;

[0070] Step 2: drive the workpiece holder 31 to the top of the plating tank 1, and drive the lifting frame 21 to descend so that each collector plate 4 is immersed in the plating solution in the plating tank 1;

[0071] Step 3: driving each workpiece holder 31 to rotate to adjust the up and down posture of the collector plate 4 and stir the plating solution;

[0072] Step 4: After the plating is completed, the lifting frame 21 is driven to rise, so that the workpiece holder 31 and the collector plate 4 are separated from the plating solution. At the same time, the workpiece holder 31 is driven to rotate to accelerate the separation of the plating solution on the surface of the collector plate 4;

[0073] Step 5: further heating the collector plate 4 by the heating structure 35 to make its temperature higher than the temperature during plating;

[0074] Step six, turn off the heating structure 35, wait for the temperature of the collector plate 4 to drop to room temperature, drive the lifting frame 21 to drive the collector plate 4 to the subsequent processing station for subsequent processing (such as subsequent cleaning), wait for all processes to be completed, turn off the vacuum pump structure, and remove the collector plate 4.

[0075] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A surface plating device for a copper-free zinc collector, characterized in that: The invention comprises a plating tank (1), a plating drive component (2) and a workpiece fixing component (3), wherein the plating tank (1) is provided with plating liquid, the workpiece fixing component (3) is used to fix a collector plate (4), and the plating drive component (2) is used to drive the workpiece fixing component (3) to move; The plating drive assembly (2) comprises a lifting frame (21), the lifting frame (21) is used to drive the workpiece fixing assembly (3) to move vertically above the plating tank (1), and drive the collector plate (4) to immerse in or leave the plating solution, the workpiece fixing assembly (3) comprises a plurality of groups of workpiece fixers (31), the workpiece fixers (31) are arranged vertically, and each group of workpiece fixers (31) is evenly distributed along the length direction of the lifting frame (21); The workpiece holder (31) is connected to the lifting frame (21) via a lower extension frame (32), the lower extension frame (32) is fixedly connected to the lifting frame (21), the workpiece holder (31) is rotatably mounted on one side of the bottom end of the lower extension frame (32), and the workpiece holder (31) rotates along a horizontal axis, and a rotation driving structure for driving each group of workpiece holders (31) to rotate synchronously is provided on the lifting frame (21); A workpiece clamping groove (311) is provided on one side of the workpiece holder (31), and the shapes of the workpiece clamping groove (311) and the collector plate (4) are adapted to each other; during installation, the collector plate (4) is clamped into the interior of the workpiece clamping groove (311), and the edge of the collector plate (4) is arranged to fit the edge of the workpiece clamping groove (311); A rotating shaft portion (312) is provided on one side of the workpiece holder (31) corresponding to the lower extension frame (32), and the rotating shaft portion (312) is rotatably mounted in the lower extension frame (32). A driving shaft (211) is provided at the bottom of the lifting frame (21), and the driving shaft (211) is driven to rotate by a rotating driver (212). Each of the rotating shaft portions (312) is respectively coupled to the driving shaft (211) through a belt assembly (213). A protective cover (33) is fixedly mounted on the outside of the lower extension frame (32), and the protective cover (33) covers the belt assembly (213) and the outside of the rotating shaft portion (312); The collector plate (4) and the workpiece slot (311) are clearance-matched, a heating structure (35) is provided inside the workpiece slot (311), the heating structure (35) is provided corresponding to the side of the collector plate (4) away from the plated surface, the heating structure (35) is arranged in close contact with the collector plate (4), and the heating structure (35) is evenly distributed along the surface of the collector plate (4); The heating structure (35) is an electric heating structure, a conductive brush ring assembly (6) is fixedly installed in the protective cover (33), and the conductive brush ring assembly (6) is rotatably arranged outside the rotating shaft portion (312). The conductive wire of the heating structure (35) extends through the air passage (314) and is connected to the conductive brush ring assembly (6), thereby forming an electrical connection with the conductive brush ring assembly (6). The conductive wire of the conductive brush ring assembly (6) extends upward in the protective cover (33), extends out of the protective cover (33), and is then connected to a power supply device. A limiting edge structure (34) is also provided on the workpiece holder (31); the limiting edge structure (34) and the workpiece holder (31) are detachably mounted; a groove structure that matches the limiting edge structure (34) is provided on one side of the workpiece holder (31) corresponding to the limiting edge structure (34); a vacuum adsorption hole (313) is provided at a position of the workpiece holder (31) corresponding to the limiting edge structure (34); the limiting edge structure (34) matches the edge of the collector plate (4); when the collector plate (4) is installed in the workpiece slot (311), the edge of the collector plate (4) matches the inner side wall of the limiting edge structure (34); and under normal temperature, the plated surface of the collector plate (4) is located inside the outer wall of the limiting edge structure (34); the limiting edge structure (34) is an elastic structure.

2. A copper-free zinc collector surface plating device according to claim 1, characterized in that: The plating drive assembly (2) further comprises a conveying guide rail (22) and a traveling frame (23); the traveling frame (23) is relatively fixed to the plating tank (1); the traveling frame (23) is laterally slidably arranged on the conveying guide rail (22); the lifting frame (21) is vertically slidably arranged on the traveling frame (23); a traveling mechanism is arranged between the traveling frame (23) and the conveying guide rail (22); and a lifting drive structure is arranged between the lifting frame (21) and the traveling frame (23).

3. A copper-free zinc collector surface plating device according to claim 2, characterized in that: A plurality of groups of vacuum adsorption holes (313) are arranged in the workpiece clamping slot (311); an air channel (314) is arranged inside the workpiece fixture (31); each of the vacuum adsorption holes (313) is in communication with the air channel (314); the air channel (314) is connected to an air extraction component, which is used to extract air from the air channel (314) so ​​as to form a negative pressure at the vacuum adsorption holes (313); elastic pads (316) are arranged at positions of the workpiece fixture (31) corresponding to the workpiece clamping slot (311); and the elastic pads (316) are embedded and installed in the workpiece fixture (31).

4. A copper-free zinc collector surface plating device according to claim 3, characterized in that: The air extraction component comprises an air extraction adapter (5), the air extraction adapter (5) is rotatably mounted on the end of a rotating shaft portion (312), a hollow cavity in communication with an airway (314) is provided in the rotating shaft portion (312), the hollow cavity is in communication with an inner cavity of the air extraction adapter (5), the air extraction adapter (5) is fixedly mounted in a protective cover (33), a sealing member is provided between the air extraction adapter (5) and the rotating shaft portion (312), an air pipe is fixedly mounted on the air extraction adapter (5), the air pipe extends upwards in the protective cover (33), extends out of the protective cover (33), and is then connected to an air extraction pump structure via a pipeline.

5. A copper-free zinc collector surface plating device according to claim 4, characterized in that: The lower frame (32) is also provided with a cooling assembly, the cooling assembly comprising a plurality of groups of heat dissipation air holes (321) vertically arranged on the surface of the lower frame (32), the heat dissipation air holes (321) being arranged corresponding to the edge of the workpiece holder (31), an air guide cavity (322) being arranged inside the lower frame (32), the air guide cavity (322) being connected to a low-temperature gas source via a pipeline, the low-temperature gas source being used to provide low-temperature gas to the air guide cavity (322), a plurality of groups of heat dissipation fins (315) being arranged on the edge of the workpiece holder (31), the heat dissipation fins (315) extending from a side of the workpiece holder (31) close to the lower frame (32) to the edge limiting structure (34).

6. A method for manufacturing a copper-free zinc collector, using the surface plating device as claimed in claim 5 for surface plating, characterized in that: The following steps are involved: Step 1: installing each group of pre-treated collector plates (4) in a corresponding workpiece holder (31), starting the vacuum pump structure to adsorb and fix the collector plates (4), and starting the heating structure (35) to pre-heat the collector plates (4); Step 2: driving the workpiece holder (31) to reach the top of the plating tank (1), and driving the lifting frame (21) to descend so that each collector plate (4) is immersed in the plating solution in the plating tank (1); Step 3: driving each workpiece holder (31) to rotate so as to adjust the vertical posture of the collector plate (4) and stir the plating solution; Step 4: After the plating is completed, the lifting frame (21) is driven to rise, so that the workpiece holder (31) and the collector plate (4) are separated from the plating solution, and at the same time, the workpiece holder (31) is driven to rotate to accelerate the separation of the plating solution on the surface of the collector plate (4); Step 5: further heating the collector plate (4) by means of a heating structure (35) so that its temperature is higher than the temperature during plating; Step six: turn off the heating structure (35), wait for the temperature of the collector plate (4) to drop to room temperature, and then drive the lifting frame (21) to drive the collector plate (4) to a subsequent processing station for subsequent processing.

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