A molecular beam epitaxy sampling device and method

Abstract

The present invention belongs to the technical field of molecular beam epitaxy, and discloses a molecular beam epitaxy loading and sampling device, comprising a delivery chamber and a substrate tray; the number of substrate trays is at least two, at least any one substrate tray is stored in a vacuum environment, and at least any one substrate tray is used to enter a sampling chamber to load and unload wafers; a plurality of first circular through holes are opened on the substrate trays, and a supporting member is fixed to the inner peripheral wall of the first circular through holes, and the upper end of the supporting member is used to place the wafer; a tray rack for horizontally placing the substrate tray is provided in the delivery chamber; a lifting plate is provided in the delivery chamber and is located directly below the tray rack, and a plurality of delivery racks are provided on the upper surface of the lifting plate, and the number of the delivery racks is equal to and one-to-one corresponding to the first circular through holes on any substrate tray, and the delivery racks all include a bottom rack fixed on the lifting plate; the problem in the prior art that the tray is easily exposed to the air for a long time when sampling wafers, and thus affects the growth effect of subsequent wafers in the growth chamber is solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of molecular beam epitaxy, and in particular relates to a molecular beam epitaxy sampling device and method. Background Art

[0002] Traditional molecular beam epitaxy sampling usually includes the following operation process: the tray needs to be loaded with the wafer in the sampling chamber first, and then enter the growth chamber for crystal growth after baking and other processing steps; however, during the wafer sampling process, the tray is exposed to the air for a long time, and the tray is easy to absorb impurities in the air, and the operator is easy to touch the tray by mistake during the sampling process, causing the tray to be affected by external pollution; although the tray will undergo pre-treatment steps such as baking in the sampling chamber before entering the growth chamber, since these pre-treatments can usually only be performed at medium and low temperatures, it is impossible to completely eliminate impurities on the surface of the tray. A large amount of impurities are adsorbed on the tray carrying the wafer. When the tray and the wafer are directly sent into the growth chamber for growth, the impurities are released from the tray during high-temperature growth, thereby affecting the growth quality of the wafer; therefore, there is a problem in the prior art that the tray is easily exposed to the air for a long time when sampling the wafer, which affects the subsequent growth effect of the wafer in the growth chamber. Summary of the invention

[0003] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a molecular beam epitaxy sampling device and method, which solves the problem in the prior art that when the tray is used for wafer sampling, it is easy to absorb impurities due to long-term exposure to air, thereby affecting the growth effect of subsequent wafers in the growth chamber.

[0004] The purpose of this disclosure can be achieved through the following technical solutions:

[0005] A molecular beam epitaxy sampling device comprises a handover chamber and a substrate tray;

[0006] The number of substrate trays is at least two, at least one substrate tray is stored in a vacuum environment, and at least one substrate tray is used to enter the sample loading chamber to load and unload wafers;

[0007] A plurality of first round through holes are provided on the substrate tray, and a supporting member is fixed to the inner peripheral wall of the first round through hole, and the upper end of the supporting member is used for placing the wafer;

[0008] A tray rack for horizontally placing substrate trays is provided in the handover chamber;

[0009] A lifting plate is provided in the handover chamber directly below the tray rack, and a plurality of handover racks are provided on the upper surface of the lifting plate. The number of the handover racks is equal to and one-to-one corresponds to the first round through holes on any substrate tray. The handover racks all include a bottom rack fixed on the lifting plate, and a detachably connected top rack is placed on the upper end of the bottom rack;

[0010] A lifting unit is provided at the bottom of the handover chamber, which is connected to the bottom of the lifting plate and is used to drive the lifting plate to move up and down. When the lifting unit drives the lifting plate to move up, the handover rack can pass through the first round through hole at the corresponding position and push the wafer on the supporting member to move up.

[0011] A support is provided in the handover chamber, the lower end surface of the support is higher than the upper end surface of the substrate tray on the tray rack, and a driving unit for driving the support to move horizontally is provided on the side wall of the handover chamber, the driving unit is connected to the support, and the driving unit can drive the support to extend into each top rack at the same time;

[0012] A first valve is provided on any side wall of the handover chamber, and when the first valve is opened, the substrate tray can pass through the first valve to enter and exit the handover chamber;

[0013] The top frame includes a pair of fixed plates symmetrically placed up and down, the central axes of the fixed plates are placed vertically, the support member can extend between the two fixed plates, the outer sides of the two fixed plates are provided with fixed rods evenly distributed in a ring shape around the central axes of the fixed plates, the peripheral walls of the two fixed plates are fixed to the fixed rods, the top frame also includes a top supporting member, the top supporting member is located directly above the two fixed plates, and the upper ends of the fixed rods are fixed to the lower ends of the top supporting member;

[0014] The bottom frame includes a support plate for placing a fixed plate located below, and the support plate is fixed to the lifting plate through a support rod;

[0015] The fixing disk is provided with a second round through hole, the upper end of the supporting disk is fixed with a first convex block adapted to the second round through hole, and the first convex block is slidably connected with the second round through hole of the fixing disk below;

[0016] A plurality of second protrusions are fixed on the upper end surface of the support member, the second protrusions have the same specifications as the first protrusions, and the number of the second protrusions is equal to that of the crossover frame and corresponds one to one;

[0017] There are orientation marks on the substrate trays, and an orientation probe for detecting the position of the orientation marks is provided in the handover room;

[0018] A rotating unit is provided on the top of the delivery chamber for driving the tray rack to rotate in a horizontal plane;

[0019] A vacuum pump is installed outside the handover chamber, and the vacuum pump's exhaust pipe is connected to the inside of the handover chamber;

[0020] The supporting member and the top supporting member are both in the shape of a coaxially placed annular ring, and the supporting member and the corresponding first circular through hole are coaxially placed, and the outer diameter of the top supporting member is smaller than the inner diameter of the supporting member;

[0021] The supporting member is in the shape of a ring coaxially placed with the corresponding first circular through hole, and the supporting member includes a plurality of top sheets, which are evenly distributed in a ring shape around the central axis of the fixed disk, and the number of the top sheets is equal to and one-to-one corresponding to the fixed rods in the corresponding crossover frame, and each top sheet is respectively fixed to the upper end of each fixed rod, and each top sheet can pass through the inner side of the corresponding supporting member;

[0022] The supporting member is in a circular ring shape, and is provided with a plurality of notches evenly distributed in a circular shape, and the number of the notches is equal to the number of the fixing rods and corresponds one to one;

[0023] The top supporting member includes a plurality of top sheets, the number of the top sheets is equal to and corresponds to the notches, the top sheets are all fixed on the corresponding fixing rods, and the top sheets can pass through the corresponding notches;

[0024] The supporting parts include a plurality of supporting plates evenly distributed in a ring shape around the central axis of the corresponding first circular through hole, and the supporting plates are fixed on the inner circumferential wall of the first circular through hole; the top supporting parts include a plurality of top plates evenly distributed in a ring shape, the top plates correspond to the fixing rods one by one, the top plates are fixed on the upper ends of the corresponding fixing rods, and the top plates and supporting plates are placed in an alternating manner.

[0025] Beneficial effects of the present disclosure:

[0026] Wafers are loaded and unloaded in the sample chamber through a sample tray. When loading and unloading wafers, the sample tray is directly exposed to the air, and the sample tray absorbs impurities in the air. Then, the wafers on the sample tray are transferred to the growth tray in the transfer chamber, so that the substrate tray carrying the wafers is replaced, and the wafers are transferred from the sample tray with adsorbed impurities to the clean growth tray, which effectively ensures the cleanliness of the substrate tray carrying the wafers in the growth chamber and improves the growth quality of the wafers.

[0027] When the sample tray and the wafers on the growth tray are handed over, multiple wafers can be handed over at the same time, the wafer handover work efficiency is high, and the handover process is carried out in the handover room, which can reduce the possibility of the growth tray being contaminated during the handover process, thereby further improving the growth quality of subsequent wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 It is a partial structural schematic diagram of the support member of the present invention;

[0031] Figure 3 It is a partial structural schematic diagram of the fixed disk of the present invention;

[0032] Figure 4 It is a partial structural schematic diagram of the substrate tray of the present invention;

[0033] Figure 5 It is a schematic diagram of the structure of the supporting member and the top supporting member in the first embodiment of the present invention;

[0034] Figure 6 It is a schematic diagram of the structure of the supporting member and the top supporting member in the second embodiment of the present invention;

[0035] Figure 7 It is a schematic diagram of the structure of the supporting member and the top supporting member in the third embodiment of the present invention;

[0036] Figure 8 It is a schematic diagram of the structure of the supporting member and the top supporting member in the fourth embodiment of the present invention. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0038] like Figures 1 to 8 As shown, a molecular beam epitaxy sampling device includes a transfer chamber 13 and a substrate tray 51;

[0039] The number of substrate trays 51 is at least two, at least one substrate tray 51 is stored in a vacuum environment, and at least one substrate tray 51 is used to enter the sample loading chamber to load and unload the wafer 61;

[0040] A plurality of first round through holes 54 are formed on the substrate tray 51. A supporting member 55 is fixed to the inner peripheral wall of the first round through hole 54. The upper end of the supporting member 55 is used to place the wafer 61.

[0041] A tray rack 21 for horizontally placing the substrate tray 51 is provided in the transfer chamber 13;

[0042] The delivery chamber 13 is provided with a lifting plate 22 located directly below the tray rack 21. A plurality of delivery racks are provided on the upper end surface of the lifting plate 22. The number of the delivery racks is equal to and one-to-one corresponds to the first round through holes 54 on any substrate tray 51. The delivery racks all include a bottom rack fixed on the lifting plate 22. A detachably connected top rack is placed on the upper end of the bottom rack.

[0043] A lifting unit 34 is provided at the bottom of the transfer chamber 13. The lifting unit 34 is connected to the bottom of the lifting plate 22 and is used to drive the lifting plate 22 to move up and down. When the lifting unit 34 drives the lifting plate 22 to move up, the transfer rack can pass through the first round through hole 54 at the corresponding position and push the wafer 61 on the supporting member 55 to move up.

[0044] A support member 48 is provided in the delivery chamber 13, the lower end surface of the support member 48 is higher than the upper end surface of the substrate tray 51 on the tray rack 21, and a driving unit 47 for driving the support member 48 to move horizontally is provided on the side wall of the delivery chamber 13, and the driving unit 47 is connected to the support member 48, and the driving unit 47 can drive the support member 48 to extend into each top rack at the same time;

[0045] A first valve 63 is provided on any side wall of the delivery chamber 13. When the first valve 63 is opened, the substrate tray 51 can pass through the first valve 63 to enter and exit the delivery chamber 13.

[0046] It should be noted that the delivery chamber 13 is connected to the injection chamber. When the first valve is opened, the delivery chamber 13 and the injection chamber are connected. The other side of the delivery chamber 13 is connected to the growth chamber. A second valve is provided between the delivery chamber 13 and the growth chamber. When the second valve is opened, the substrate tray 51 can pass through the second valve and enter the growth chamber.

[0047] For the convenience of description of this embodiment, the substrate tray 51 used to enter the sample loading chamber to load and unload the wafer 61 is named as the sample loading tray, and the substrate tray 51 used to enter the growth chamber is named as the growth tray;

[0048] The substrate tray 51 includes at least one sample loading tray and one growth tray. The sample loading tray can enter the sample loading chamber and be exposed to the air to load and unload the wafer 61. The growth tray is stored in a vacuum environment when not in use.

[0049] When in use, the sample loading tray is sent into the sample loading chamber, the sample loading tray is exposed to the air and the wafer 61 is loaded and unloaded, and the wafer 61 is placed on the supporting member 55 inside each first round through hole 54 of the sample loading tray. After the wafer 61 is loaded, the sample loading chamber is evacuated and low-temperature baked according to the conventional steps in the prior art, and medium-temperature baking is also required in the pretreatment chamber if necessary. After the baking is completed, the first valve 63 of the handover chamber 13 is opened, and the sample loading tray is placed on the tray rack 21, and the first round through holes 54 on the sample loading tray are kept corresponding to the positions of the handover racks, and then the first valve 63 is closed;

[0050] Then, the lifting unit 34 drives the lifting plate 22 and the transfer rack to move upward, and the upper end of the transfer rack passes through the corresponding first round hole 54. During this process, each wafer 61 on the sample tray falls into the upper end of the transfer rack, and then the lifting unit 34 continues to drive the lifting plate 22 to move upward;

[0051] When the top frame of the transfer rack is completely moved up to above the sample tray, the driving unit 47 drives the supporting member 48 to extend horizontally into each top frame, and then the lifting unit 34 drives the lifting plate 22 and the bottom frame to move down. During this process, the top frame is separated from the bottom frame, and the top frame falls on the supporting member 48. The top frame is supported by the supporting member 48, and finally the bottom frame moves to below the sample tray, while the top frame continues to remain above the sample tray.

[0052] When the bottom rack moves down to below the sample tray, open the first valve 63 to take out the sample tray on the tray rack 21, take out the growth tray and place it on the tray rack 21, and ensure that the first round through hole 54 on the growth tray corresponds to the position of the transfer rack, and then close the first valve 63;

[0053] Then, the lifting unit 34 is used to drive the lifting plate 22 and the bottom frame to move upward. After the upper end of the bottom frame passes through the first round through hole 54 of the growth tray and contacts the bottom of the top frame, the lifting plate 22 is driven to move upward for a certain distance to separate the top frame from the support member 48. Then, the driving unit 47 is used to drive the support member 48 to be withdrawn from each top frame. At this time, the top frame is placed on the corresponding bottom frame. After the support member 48 is completely withdrawn, the lifting unit 34 drives the lifting plate 22 and the transfer frame to move downward until the upper end of the transfer frame moves to the bottom of the growth tray. During this process, each wafer 61 on the transfer frame falls onto the supporting member 55 in each first round through hole 54 of the growth tray.

[0054] In the above process, the chip 61 is loaded and unloaded in the sample loading chamber through the sample loading tray. The sample loading tray will be directly exposed to the air when loading and unloading the chip 61. At this time, the sample loading tray will absorb impurities in the air, and then the chip 61 on the sample loading tray is transferred to the growth tray in the transfer chamber 13, so as to realize the replacement of the substrate tray 51 carrying the chip 61, and transfer the chip 61 from the sample loading tray adsorbed with impurities to the clean growth tray, thereby effectively ensuring the cleanliness of the substrate tray 51 carrying the chip 61 in the growth chamber, and improving the growth quality of the chip 61; and multiple chips 61 can be transferred at the same time each time, and the chip 61 transfer work efficiency is high, and the transfer process is in the transfer chamber 13, which can reduce the possibility of the growth tray being contaminated during the transfer process, thereby further improving the subsequent growth quality of the chip 61.

[0055] The top frame includes a pair of fixed plates 43 symmetrically placed up and down, the central axis of the fixed plates 43 is placed vertically, the support member 48 can extend between the two fixed plates 43, the outer sides of the two fixed plates 43 are provided with fixed rods 42 evenly distributed in a ring shape around the central axis of the fixed plates 43, the peripheral walls of the two fixed plates 43 are fixed to the fixed rods 42, the top frame also includes a top support member 41, the top support member 41 is located directly above the two fixed plates 43, and the upper end of each fixed rod 42 is fixed to the lower end of the top support member 41;

[0056] The bottom frame includes a support plate 44 for placing a fixed plate 43 located below, and the support plate 44 is fixed to the lifting plate 22 through a support rod;

[0057] The top supporting member 41 is used to pass through the inner side of the supporting member 55 in the first round through hole 54, and the supporting plate 44 is matched with the lower fixing plate 43 to facilitate the top frame to be placed on the bottom frame.

[0058] In order to improve the placement stability of the bottom frame and the top frame, a second round through hole 45 is opened on the fixing plate 43, and a first protrusion 46 adapted to the second round through hole 45 is fixed to the upper end of the supporting plate 44, and the first protrusion 46 is slidably connected to the second round through hole 45 of the fixing plate 43 below; when the top frame falls onto the bottom frame, the placement stability between the top frame and the bottom frame can be improved through the cooperation between the first protrusion 46 and the second round through hole 45.

[0059] A plurality of second protrusions 49 are fixed to the upper end surface of the support member 48. The second protrusions 49 have the same specifications as the first protrusions 46, and the number of the second protrusions 49 and the cross-connection frame is equal and corresponds one to one. When the driving unit 47 drives the support member 48 to extend between the two fixed disks 43, each second protrusion 49 is located below the second round through hole 45 of the upper fixed disk 43. Then, when the lifting unit 34 drives the lifting plate 22 and the bottom frame to move downward, the upper fixed disk 43 falls on the support member 48, and the second protrusions 49 cooperate with the second round through holes 45 to improve the stability of the support member 48 in supporting the top frame.

[0060] In order to ensure the correspondence between the first circular through hole 54 on the sample loading tray or the growth tray and the position of the handover rack, an orientation mark 56 is provided on the substrate tray 51, and an orientation probe 25 for detecting the position of the orientation mark 56 is provided in the handover chamber 13; when the sample loading tray or the growth tray is placed on the tray rack 21, the position of the orientation mark 56 can be detected by the orientation probe 25 to facilitate the adjustment of the position of the sample loading tray or the growth tray, thereby ensuring the correspondence between the first circular through hole 54 and the position of the handover rack.

[0061] In order to facilitate the angular placement adjustment of the substrate tray 51 on the tray rack 21 according to the positional relationship between the orientation probe 25 and the orientation mark 56, a rotating unit 24 for driving the tray rack 21 to rotate in a horizontal plane is provided on the top of the delivery chamber 13; preferably, the rotating unit 24 includes a rotating motor fixedly mounted on the delivery chamber 13, the output shaft of the rotating motor is vertically placed and fixed to the tray rack 21, and the output shaft of the rotating motor is rotatably connected to the top wall of the delivery chamber 13. By turning on the rotating motor, the tray rack 21 and the substrate tray 51 placed thereon are driven to rotate and adjust, thereby facilitating the control of the mutual correspondence between the first circular through hole 54 and the position of the delivery rack. The rotating motor is only one of the preferred methods of this embodiment. In this application, a servo motor can also be used to drive the delivery rack to rotate.

[0062] A vacuum pump 62 is installed outside the delivery chamber 13, and an exhaust pipe of the vacuum pump 62 is connected to the inside of the delivery chamber 13; during the whole process, the vacuum pump 62 continuously evacuates the delivery chamber 13 to ensure good cleanliness in the delivery chamber 13.

[0063] Preferably, a baking unit may be provided in the handover chamber 13, and the baking unit may be used to bake the handover chamber 13 before and after the wafer 61 is handed over, thereby improving the cleanliness inside the handover chamber 13 and further reducing contamination during the handover process.

[0064] In order to facilitate the driving of the lifting plate 22 to move, the lifting unit 34 includes a first telescopic cylinder vertically installed on the outer side of the bottom of the delivery chamber 13, and the piston rod of the first telescopic cylinder slides through the bottom of the delivery chamber 13 and is fixed to the lifting plate 22; the lifting plate 22 is driven to move up and down by the first telescopic cylinder. The first telescopic cylinder is one of the preferred methods of this embodiment. In this application, an electric telescopic rod, an electric cylinder, etc. can also be used to drive the lifting plate 22 to move up and down.

[0065] In order to facilitate the driving of the support member 48 to move horizontally, the driving unit 47 includes a second telescopic cylinder horizontally installed on the outer wall of the interface chamber 13, and the piston rod of the second telescopic cylinder slides through the side wall of the interface chamber 13 and is fixed to the support member 48; the support member 48 is driven to move horizontally by the second telescopic cylinder. The second telescopic cylinder is one of the preferred methods of this embodiment. In this application, an electric telescopic rod, an electric cylinder, etc. can also be used to drive the support member 48 to move horizontally.

[0066] It should be noted that in the present application, the vacuum pump 62, the rotary motor, the first telescopic cylinder and the second telescopic cylinder are all fixedly mounted on the transfer chamber 13 through corresponding mounting seats, which are not shown in the figure.

[0067] Four embodiments of the supporting member 55 and the top supporting member 41 are provided in this application:

[0068] Embodiment 1: The supporting member 55 and the supporting member 41 are both coaxially placed in annular shapes, and the supporting member 55 is coaxially placed with the corresponding first circular through hole 54, and the outer diameter of the supporting member 41 is smaller than the inner diameter of the supporting member 55, such as Figure 5 shown.

[0069] Embodiment 2: The supporting member 55 is in the shape of a ring and is coaxially arranged with the corresponding first circular through hole 54.

[0070] The top support member 41 includes a plurality of top sheets, which are evenly distributed in a ring shape around the central axis of the fixed plate 43. The number of top sheets is equal to and one-to-one corresponds to the fixed rods 42 in the corresponding crossover frame. Each top sheet is fixed to the upper end of each fixed rod 42, and each top sheet can pass through the inner side of the corresponding support member 55. Figure 6 shown.

[0071] Embodiment 3: The supporting member 55 is annular, and is provided with a plurality of notches evenly distributed in an annular shape, and the number of the notches is equal to and corresponds to the number of the fixing rods 42;

[0072] The top supporting member 41 includes a plurality of top sheets, the number of the top sheets is equal to and corresponds to the number of the notches, and the top sheets are all fixed on the corresponding fixing rods 42, and the top sheets can pass through the corresponding notches. Figure 7 shown.

[0073] Embodiment 4: The supporting members 55 each include a plurality of supporting sheets evenly distributed in an annular manner around the central axis of the corresponding first round through hole 54, and the supporting sheets are all fixed to the inner peripheral wall of the first round through hole 54; the top supporting member 41 includes a plurality of top sheets evenly distributed in an annular manner, and the top sheets correspond to the fixing rods 42 one by one, and the top sheets are all fixed to the upper ends of the corresponding fixing rods 42, and the top sheets and the supporting sheets are staggered. Figure 8 shown.

[0074] A molecular beam epitaxy sampling method, as follows:

[0075] Step 1: Open the first valve 63, place the sample tray with the wafer 61 on the tray rack 21, and then close the first valve 63;

[0076] Step 2: Detect the position of the orientation mark 56 through the orientation probe 25, and drive the tray rack 21 and the sample loading tray to rotate and adjust through the rotation unit 24, so that each first through hole corresponds to each transfer rack one by one;

[0077] Step 3: The lifting plate 22 is driven upward by the lifting unit 34 until the lower end of the top frame moves to above the sample tray. At this time, the wafer 61 is transferred from the sample tray to the upper end of the top frame;

[0078] Step 4: Drive the support member 48 through the driving unit 47 to extend between the two fixed plates 43 of each top frame;

[0079] Step 5: The lifting plate 22 and the transfer rack are driven downward by the lifting unit 34 until the second round through hole 45 of the upper fixed plate 43 of each top rack falls on the corresponding second protrusion 49 of the support member 48, and then the lifting plate 22 is driven downward, and the bottom rack is moved downward to below the sample loading tray;

[0080] Step 6: Open the first valve 63 to remove the sample tray and replace the growth tray;

[0081] Step 7: Detect the orientation mark 56 through the orientation probe 25 and adjust the placement angle of the growth tray in cooperation with the rotation unit 24;

[0082] Step 8: The lifting plate 22 and the bottom frame are driven upward by the lifting unit 34, and the lower fixed plate 43 of the top frame is pushed upward by the support plate 44, so that the top frame is separated from the support member 48;

[0083] Step nine: The driving unit 47 drives the supporting member 48 to be pulled out from between the two layers of the fixing plates 43 of each top frame;

[0084] Step 10: The lifting plate 22 and the transfer rack are driven downward by the lifting unit 34 until the upper end of the transfer rack moves downward to below the growth tray. During this process, the wafer 61 is transferred to the growth tray.

[0085] Step 11: Open the first valve 63, take out the growth tray and place it in the growth chamber for growth.

[0086] It should be noted that before the wafer is handed over, the second valve is always in a closed state. When the wafer is handed over to the growth tray, the second valve is opened and the growth tray is sent into the growth chamber, thereby effectively ensuring the cleanliness of the substrate tray 51 carrying the wafer entering the growth chamber. During the subsequent removal of the wafer 61, the wafer 61 on the growth tray needs to be handed back to the loading tray in the handover chamber 13 to avoid the growth tray being exposed to the air during the entire growth and loading process.

[0087] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0088] The above shows and describes the basic principles, main features and advantages of the present disclosure. Those skilled in the art should understand that the present disclosure is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present disclosure. Without departing from the spirit and scope of the present disclosure, the present disclosure may have various changes and improvements, and these changes and improvements fall within the scope of the present disclosure to be protected.

Claims

1. A molecular beam epitaxy sampling device, comprising a transfer chamber (13) and a substrate tray (51), characterized in that: The number of substrate trays (51) is at least two, at least one substrate tray (51) is stored in a vacuum environment, and at least one substrate tray (51) is used to enter the sample injection chamber to load and unload the wafer (61); A plurality of first round through holes (54) are provided on the substrate tray (51), a supporting member (55) is fixed to the inner peripheral wall of the first round through hole (54), and the upper end of the supporting member (55) is used for placing a wafer (61); A tray rack (21) for horizontally placing a substrate tray (51) is provided in the handover chamber (13); A lifting plate (22) is provided in the handover chamber (13) and is located directly below the tray rack (21). A plurality of handover racks are provided on the upper end surface of the lifting plate (22). The number of handover racks is equal to and one-to-one corresponds to the number of first round through holes (54) on any substrate tray (51). The handover racks all include a bottom rack fixed on the lifting plate (22), and a detachably connected top rack is placed on the upper end of the bottom rack. A lifting unit (34) is provided at the bottom of the handover chamber (13). The lifting unit (34) is connected to the bottom of the lifting plate (22) and is used to drive the lifting plate (22) to move up and down. When the lifting unit (34) drives the lifting plate (22) to move up, the handover rack can pass through the first round through hole (54) at the corresponding position and push the wafer (61) on the supporting member (55) to move up. A support member (48) is provided in the delivery chamber (13), the lower end surface of the support member (48) is higher than the upper end surface of the substrate tray (51) on the tray rack (21), and a driving unit (47) for driving the support member (48) to move horizontally is provided on the side wall of the delivery chamber (13), the driving unit (47) is connected to the support member (48), and the driving unit (47) can drive the support member (48) to extend into each top rack at the same time; the driving unit (47) comprises a second telescopic cylinder horizontally mounted on the outer side wall of the delivery chamber (13), and the piston rod of the second telescopic cylinder slides through the side wall of the delivery chamber (13) and is fixed to the support member (48); A first valve (63) is provided on any side wall of the handover chamber (13). When the first valve (63) is opened, the substrate tray (51) can pass through the first valve (63) to enter and exit the handover chamber (13).

2. The molecular beam epitaxy sampling device according to claim 1, characterized in that: The top frame includes a pair of fixed plates (43) symmetrically arranged in an upper and lower direction, the central axes of the fixed plates (43) are arranged vertically, the support member (48) can extend between the two fixed plates (43), the outer sides of the two fixed plates (43) are provided with fixed rods (42) evenly distributed in an annular shape around the central axes of the fixed plates (43), the peripheral walls of the two fixed plates (43) are fixed to the fixed rods (42), the top frame also includes a top supporting member (41), the top supporting member (41) is located directly above the two fixed plates (43), and the upper ends of the fixed rods (42) are fixed to the lower ends of the top supporting member (41); The bottom frame includes a support plate (44) for placing a fixed plate (43) located below, and the support plate (44) is fixed on the lifting plate (22) via a support rod.

3. The molecular beam epitaxy sampling device according to claim 2, characterized in that: The fixing disk (43) is provided with a second round through hole (45), the upper end of the supporting disk (44) is fixed with a first protrusion (46) matched with the second round through hole (45), and the first protrusion (46) is slidably connected to the second round through hole (45) of the fixing disk (43) below.

4. The molecular beam epitaxy sampling device according to claim 3, characterized in that: A plurality of second protrusions (49) are fixed to the upper end surface of the support member (48); the second protrusions (49) have the same specifications as the first protrusions (46); and the number of the second protrusions (49) and the crossover frame are equal and correspond one to one.

5. The molecular beam epitaxy sampling device according to claim 4, characterized in that: An orientation mark (56) is provided on each substrate tray (51), an orientation probe (25) for detecting the position of the orientation mark (56) is provided in the handover chamber (13), and a rotating unit (24) for driving the tray rack (21) to rotate in a horizontal plane is provided on the top of the handover chamber (13).

6. The molecular beam epitaxy sampling device according to claim 5, characterized in that: A vacuum pump (62) is installed outside the transfer chamber (13), and an air extraction pipe of the vacuum pump (62) is connected to the inside of the transfer chamber (13).

7. The molecular beam epitaxy sampling device according to claim 2, characterized in that: The supporting member (55) and the supporting member (41) are both coaxially placed in annular shapes, and the supporting member (55) and the corresponding first circular through hole (54) are coaxially placed, and the outer diameter of the supporting member (41) is smaller than the inner diameter of the supporting member (55).

8. The molecular beam epitaxy sampling device according to claim 2, characterized in that: The supporting member (55) is in the shape of a ring and is coaxially arranged with the corresponding first circular through hole (54). The supporting member (41) comprises a plurality of top sheets, which are evenly distributed in a ring shape around the central axis of the fixed disk (43). The number of top sheets is equal to and corresponds to the number of fixed rods (42) in the corresponding crossover frame. Each top sheet is fixed to the upper end of each fixed rod (42), and each top sheet can pass through the inner side of the corresponding supporting member (55).

9. The molecular beam epitaxy sampling device according to claim 2, characterized in that: The supporting member (55) is in the shape of a ring, and is provided with a plurality of notches evenly distributed in a ring shape, wherein the number of the notches is equal to the number of the fixing rods (42) and corresponds one to one; The top supporting member (41) comprises a plurality of top sheets, the number of the top sheets is equal to and corresponds to the number of the notches, the top sheets are all fixed on the corresponding fixing rods (42), and the top sheets can pass through the corresponding notches.

10. The molecular beam epitaxy sampling device according to claim 2, characterized in that: The supporting members (55) each include a plurality of supporting sheets evenly distributed in an annular shape around the central axis of the corresponding first circular through hole (54), and the supporting sheets are all fixed to the inner peripheral wall of the first circular through hole (54); the top supporting member (41) includes a plurality of top sheets evenly distributed in an annular shape, the top sheets correspond to the fixing rods (42) one by one, the top sheets are all fixed to the upper ends of the corresponding fixing rods (42), and the top sheets and the supporting sheets are in a staggered arrangement.

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