Monitoring type flaw detection sensor, preparation method and monitoring type flaw detection alarm

Abstract

The invention provides a monitoring type flaw detection sensor, a preparation method and a monitoring type flaw detection alarm, and belongs to the field of flaw detection, and the method comprises the following steps: for two cut first-size PI films, after a substrate is cleaned and dried, spraying gold powder to two sides of the two PI films by using a metal spraying instrument; the non-substrate PI thin film obtained after spraying treatment is tightly attached to a substrate through a coating technology; the first ends of the two wires are correspondingly attached to the outer surfaces of the two PI films respectively, the two cut copper foils with the second size are attached to the outer surfaces of the two PI films while covering the first ends of the wires respectively, and parts of the copper foils coincide with the PI films; the two pieces of copper foil are pasted and fixed through the two pieces of first PU pasting films which are slightly larger than the copper foil. The sensor obtained by the method is thin and small in size, and has enough mechanical strength and chemical stability; the working mechanism is simple and easy to realize, the preparation process is highly simplified, and the overall reliability is high; the method is not easily influenced by environmental noise, and has higher accuracy.

Description

Technical Field

[0001] The present invention relates to the field of flaw detection, and in particular to a monitoring type flaw detection sensor and a preparation method thereof, and a monitoring type flaw detection alarm. Background Art

[0002] As the world's urbanization process continues to develop, the construction of pipeline networks in various cities is extensive and continues to expand, including water supply, gas supply and other pipeline networks. Due to a large number of pipeline leaks, a large amount of water, gas, oil and other media are leaked in the world. Therefore, long-term monitoring of important pipeline transportation routes and urban pipeline systems, and real-time monitoring of high-intensity operating components for damage, not only help eliminate dangers and save resources, but also protect the lives and property of the majority of residents.

[0003] At present, the more effective leakage detection of urban pipeline systems mainly relies on the maintenance of professional workers. The leak detectors used are large and complicated to operate, making them difficult for ordinary people to use. In addition, high-intensity components such as connecting rods and flywheels are easily damaged, and maintenance and repairs are not timely. Repairs are often carried out after an accident occurs, resulting in a waste of resources and even causing production accidents.

[0004] Some current nondestructive testing methods are extremely complex to implement. For example, some neural network-based testing methods collect data that is easily disturbed by the environment, resulting in inaccurate test results. In addition, these testing methods can only detect results after damage has occurred. Summary of the invention

[0005] In view of the problems existing in the prior art, the present invention provides a monitoring type flaw detection sensor and a preparation method thereof, and a monitoring type flaw detection alarm.

[0006] In a first aspect, the present invention provides a method for manufacturing a listening flaw detection sensor, comprising: for two pieces of cut first-size PI films, one of which is a substrate, after the substrate is cleaned and dried, using a gold sprayer to spray gold powder on both sides of each PI film; the non-substrate PI film after the spraying process is tightly bonded to the substrate through a coating process; the first ends of two wires are respectively attached to the outer surfaces of the two PI films, and two pieces of cut second-size copper foils are respectively covered with the first ends of the wires and also attached to the outer surfaces of the two PI films, and partially overlap with the PI films; the two copper foils are respectively bonded and fixed by two first PU films that are slightly larger than the copper foil.

[0007] According to a method for manufacturing a listening flaw detection sensor provided by the present invention, after the two copper foils are respectively pasted and fixed by two first PU films that are slightly larger than the copper foil, the method further includes: using two rectangular second PU films to respectively fix the wires adjacent to the ends of the two copper foils, and making the wires parallel to the long sides of the second PU films.

[0008] According to a method for manufacturing a listening flaw detection sensor provided by the present invention, after the two copper foils are respectively adhered and fixed by two first PU films slightly larger than the copper foils, the method further includes: starting from the side of the substrate to which the copper foil is not attached, the sensor is completely encapsulated with a third PU film.

[0009] In a second aspect, the present invention provides a monitoring type flaw detection sensor, comprising: two pieces of first-size PI films stacked in sequence from the inside to the outside, two wires for outputting flaw detection signals, two pieces of second-size copper foils and a first PU film; each piece of PI film is sprayed with gold powder on both sides, and the inner surfaces of the two PI films are tightly fitted; the first ends of the two wires are respectively attached to the outer surfaces of the two PI films; the two pieces of copper foil respectively cover one end of the wire and are also correspondingly attached to the outer surfaces of the two PI films, and partially overlap with the PI films; the two pieces of copper foil are respectively fixed by sticking with a first PU film slightly larger than the copper foil.

[0010] According to a monitoring flaw detection sensor provided by the present invention, the first size is a rectangle with a surface area greater than 500 square millimeters, the second size is a rectangle with a length and width smaller than the first size, and the two copper foils are separated by a preset distance so that there is no overlapping area between the copper foils.

[0011] A monitoring flaw detection sensor provided by the present invention further includes a second PU film for fixing the wire adjacent to the copper foil end, the second PU film is rectangular, and the wire is parallel to the long side of the second PU film.

[0012] A monitoring flaw detection sensor provided by the present invention further includes a third PU film that completely encapsulates the sensor, and the third PU film is a rectangle with an area larger than the area of ​​the area to be encapsulated.

[0013] In the third aspect, the present invention provides a monitoring type flaw detection alarm, comprising: a relay control circuit, an audible and visual alarm circuit, and the monitoring type flaw detection sensor described in any one of the second aspects; the second ends of the two wires of the monitoring type flaw detection sensor are connected to the input end of the relay control circuit; the relay control circuit controls the switching signal of the working state of the audible and visual alarm circuit through the connected relay output according to the signal strength of the monitoring type flaw detection sensor.

[0014] According to a monitoring type flaw detection alarm provided by the present invention, the relay control circuit includes a first single-phase full-wave rectifier bridge, a filter capacitor, multiple resistors, a first operational amplifier, a relay and a sliding rheostat; the second ends of the two wires input the monitoring signal to the first single-phase full-wave rectifier bridge; the output end of the single-phase full-wave rectifier bridge is connected in parallel with the filter capacitor, and the first output end is connected to the positive input end of the first operational amplifier through a first resistor; the negative input end of the first operational amplifier is connected to the second resistor and then to ground, the output end of the first operational amplifier is connected to the third resistor and then connected back to the negative input end, and the output end is then connected to the relay, the sliding rheostat and the first protection resistor in sequence until the second output end of the single-phase full-wave rectifier bridge.

[0015] According to a monitoring flaw detection alarm provided by the present invention, the sound and light alarm circuit includes a transformer for stepping down the power supply voltage, and the alternating current output by the transformer is connected to a second single-phase full-wave rectifier bridge to output direct current; the first output end of the second single-phase full-wave rectifier bridge is connected in sequence to a relay normally open switch and a protection resistor to separate into two branches; one branch is connected to the positive input end of the second operational amplifier, and the negative input end of the second operational amplifier is grounded; the output end of the second operational amplifier is connected back to the negative input end through a fourth resistor, and then connected in parallel to an LED alarm light, and the LED is connected to the B pole of the transistor; the other branch is connected to the C pole of the transistor, the E pole of the transistor is connected to a buzzer, and is connected in series with a second protection resistor before returning to the second output end of the second single-phase full-wave rectifier bridge.

[0016] The listening flaw detection sensor and preparation method, and the listening flaw detection alarm provided by the present invention, the obtained listening flaw detection sensor or alarm is used for pipeline leakage detection, and does not require personnel to perform regular maintenance, which is more efficient and reduces labor costs. The peak voltage output by the sensor has a good linear relationship with the sound pressure, and can only generate a sufficiently large output voltage under sufficient sound pressure, with high accuracy. The sensor collects sound pressure signals through triboelectric materials. Compared with other methods of detecting by collecting sound signals, it is not easily affected by environmental noise, has a lower possibility of false alarms, and has higher accuracy. The overall structure of the sensor is thin and light, and the volume is small. It is easier to be semi-permanently installed on the walls of various pipelines for monitoring, and completes the work with less impact. The PI film is used as a base for spraying metal electrodes, which has excellent plasticity, and at the same time has sufficient mechanical strength and chemical stability, which is conducive to extending the service life. The working mechanism of the sensor is simple and easy to implement, the preparation process is highly simplified, and the overall reliability is strong. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic flow chart of a method for manufacturing a monitoring type flaw detection sensor provided by the present invention;

[0019] Figure 2 It is a structural schematic diagram of the monitoring type flaw detection sensor provided by the present invention;

[0020] Figure 3 It is a schematic diagram of the relay control circuit of the monitoring type flaw detection alarm provided by the present invention;

[0021] Figure 4 It is a schematic diagram of the sound and light alarm circuit of the monitoring type flaw detection alarm provided by the present invention;

[0022] Explanation of the reference numerals: 1. PI film; 2. Copper foil; 3. Wire; 41. First PU film; 42. Second PU film; 43. Third PU film. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] It should be noted that the terms "first", "second", etc. in the specification, claims and drawings of this application are used to distinguish similar objects, rather than to limit a specific order or sequence. It should be understood that the above terms can be interchangeable under appropriate circumstances, so that the embodiments described in this application can be implemented in an order other than that described in this application.

[0025] Combine the following Figure 1-Figure 4 The present invention describes the listening type flaw detection sensor and device. Figure 1 FIG. 1 is a flow chart of a method for manufacturing a monitoring flaw detection sensor provided by the present invention, such as Figure 1 As shown, the present invention provides a method for manufacturing a listening type flaw detection sensor, comprising:

[0026] S101. For two PI films cut to a first size, one of which is a substrate, after the substrate is cleaned and dried, use a gold spraying device to spray gold powder onto both sides of each PI film.

[0027] The first size may be 20 mm×30 mm, and two PI films of 20 mm×30 mm may be pre-cut for use. Before S101, a PI film used as a flexible packaging substrate may be cleaned to remove surface impurities and oxides, and then dried at room temperature for 30 minutes.

[0028] The present invention uses gold spraying technology on the PI film, sprays gold powder onto the surface of the PI film, and then uses two cut PI films for bonding. The chemical stability of the PI film and gold is conducive to the application of triboelectricity, and a flexible metal electrode is obtained. The electrode releases free electrons to form a current to achieve flaw detection of pipelines, etc. In the present invention, the PI film itself is used as a flexible substrate, and gold is sprayed on both sides.

[0029] S102, closely attaching the non-substrate PI film after the spraying process to the substrate through a coating process.

[0030] The prepared non-substrate PI film and the flexible packaging substrate PI film are tightly bonded together through a coating process. The coating process needs to ensure that the film is uniform, free of bubbles, and tightly bonded to the substrate surface. The coating allows the gold-sprayed PI film surface, which serves as a friction pair, to be combined, enabling better contact and friction. The gold layers on the two surfaces of the bonded surface constitute a friction pair, and the other two sides act as electrodes.

[0031] S103, attaching the first ends of the two wires to the outer surfaces of the two PI films respectively, and attaching the two cut copper foils of the second size to the outer surfaces of the two PI films while covering one end of the wires respectively, and partially overlapping with the PI films.

[0032] The outer surface is relative to the inner surface. The second size can be 5mm×5mm. Cut two pieces of copper foil of this size. After the first ends of the two wires are respectively attached to the outer surfaces of the two PI films, they are respectively attached to the two sides of the prepared film to cover and fix the wires, and keep the PI film overlapped with about half of the copper foil.

[0033] S104, using two first PU films slightly larger than the copper foils to adhere and fix the two copper foils respectively.

[0034] After the wire is attached to the PI film and the copper foil covered wire is attached to the copper foil, it is fixed with a first PU film slightly larger than the copper foil. Based on this, a preliminary listening flaw detection sensor is obtained. The listening flaw detection sensor prepared by this method can be attached and installed on the pipeline to be detected. For example, the listening flaw detection sensor is installed on the outer wall of the structure and fixed with electrical insulating tape. The listening flaw detection sensor collects the acoustic signal when the pipeline is damaged or leaking, and converts it into an electrical signal for alarm.

[0035] Specifically, since the damage of components will generate noise, when the sound wave propagates through the outer wall to the sensor, the film will vibrate under pressure. Based on the principle of triboelectricity, the film undergoes elastic deformation to change the original electric field. Metal materials tend to produce more free electrons, which move in a directional manner under the action of the electric field force. The sensor generates an AC voltage and outputs it through two wires.

[0036] The method for manufacturing a listening type flaw detection sensor of the present invention can obtain a listening type flaw detection sensor for pipeline leakage detection, which does not require personnel to perform regular maintenance, is more efficient, and reduces labor costs. The peak voltage output by the sensor has a good linear relationship with the sound pressure, and can only generate a sufficiently large output voltage under sufficient sound pressure, with high accuracy. The sensor collects sound pressure signals through triboelectric materials. Compared with other methods for detection by collecting sound signals, it is not easily affected by environmental noise, has a lower possibility of false alarms, and has higher accuracy. The overall structure of the sensor is thin and light, and the volume is small. It is easier to be semi-permanently installed on the walls of various pipelines for monitoring, and complete the work with less impact. The PI film is used as a base for spraying metal electrodes, which has excellent plasticity, and at the same time has sufficient mechanical strength and chemical stability, which is conducive to extending the service life. The working mechanism of the sensor is simple and easy to implement, the preparation process is highly simplified, and the overall reliability is strong.

[0037] In some embodiments, after the two copper foils are respectively fixed by two first PU films slightly larger than the copper foils, the method further includes: fixing the wires near the ends of the two copper foils with two rectangular second PU films, and making the wires parallel to the long sides of the second PU films. A second PU film with a size of 20 mm × 10 mm can be used to fix a section of the wire near the end of the copper foil, thereby preventing the wire from being worn out due to a loose connection with the copper foil and reducing its service life, and making the wire parallel to the 20 mm long side of the PU film.

[0038] In some embodiments, after the two copper foils are respectively adhered and fixed by two first PU films slightly larger than the copper foils, the method further includes: starting from the side of the substrate to which the copper foil is not attached, completely encapsulating the sensor with a third PU film.

[0039] The third PU film can be a 30m×50mm PU film, which is larger than the area to be packaged, to completely package the sensor. It should start from the side where the copper foil is not attached to prevent bubbles from being generated during the packaging process. A small amount of unoverlapped film is left at the edge, and the folded seal makes the sensor packaging more rigorous.

[0040] Figure 2 Schematic diagram of the structure of the monitoring flaw detection sensor provided by the present invention. Figure 2 As shown, the monitoring flaw detection sensor provided by the present invention includes: two pieces of first-size PI films 1, two wires 3 for outputting flaw detection signals, two pieces of second-size copper foils 2 and a first PU film 41, which are stacked and distributed in sequence from the inside to the outside; each piece of PI film 1 is sprayed with gold powder on both sides, and the inner surfaces of the two pieces of PI films 1 are tightly fitted; the first ends of the two wires 3 are respectively attached to the outer surfaces of the two pieces of PI films 1; the two pieces of copper foil 2 respectively cover the first ends of the wires 3 and are also correspondingly attached to the outer surfaces of the two pieces of PI films 1, and partially overlap with the PI films 1; the two pieces of copper foil 2 are respectively fixed by sticking through a first PU film 41 which is slightly larger than the copper foil.

[0041] In some embodiments, the first size is a rectangle with a surface area greater than 500 square millimeters. To provide sufficient voltage, the surface area of ​​the PI film of the embodiment of the present invention is not less than 500 square millimeters. For ease of packaging, it is generally made into a rectangle with a length slightly greater than the width.

[0042] In some embodiments, the second size is a rectangle whose length and width are smaller than the first size. The length and width of the copper foil are smaller than the PI film and can be made into a square with a side length of about one sixth of the long side of the PI film.

[0043] In some embodiments, the two copper foils are spaced apart by a preset distance so that there is no overlap between the copper foils. To prevent short circuits caused by conductor contact, the copper foils should be spaced apart by a corresponding distance, such as the 5mm×5mm copper foil mentioned above, which should be spaced apart by more than 5mm.

[0044] In some embodiments, a second PU film 42 for fixing the wires near the copper foil ends is further included. The second PU film 42 is rectangular, and the wires 3 are parallel to the long sides of the second PU film 42 .

[0045] A 20mm×10mm PU film can be used to fix a section of wire to prevent the loose connection between the wire 3 and the copper foil 2 from causing wear and reducing the service life. The wire 3 is made parallel to the 20mm long side of the film 42 to better fix the wire.

[0046] In some embodiments, a third PU film 43 is further included to completely encapsulate the sensor. The PU film used for encapsulation only needs to be larger than the encapsulated part, and the outermost PU film needs to reserve 10 to 20 mm for easy installation. Therefore, for the PI film of the above size, the sensor can be completely encapsulated with a third PU film 43 of 30m×50mm. The sensor embodiment provided by the embodiment of the present invention is obtained through the above method embodiments. Please refer to the above method embodiments for specific processes and details, which will not be repeated here.

[0047] The implementation principle and technical effects of the listening type flaw detection sensor provided in the embodiment of the present invention are the same as those in the aforementioned embodiment of the listening type flaw detection sensor manufacturing method. For the sake of brief description, for matters not mentioned in the embodiment of the listening type flaw detection sensor, reference may be made to the corresponding contents in the aforementioned embodiment of the listening type flaw detection sensor manufacturing method.

[0048] In addition, the present invention also provides a monitoring type flaw detection alarm, comprising: a relay control circuit, an audible and visual alarm circuit, and a monitoring type flaw detection sensor of any of the above-mentioned embodiments; the second ends of the two wires of the monitoring type flaw detection sensor are connected to the input end of the relay control circuit; the relay control circuit controls the switching signal of the working state of the audible and visual alarm circuit through the connected relay output according to the signal strength of the monitoring type flaw detection sensor.

[0049] The monitoring flaw detection sensor uses the above-mentioned triboelectric acoustic-electric sensor to attach the flexible structure to the surface of the structure to be monitored. When the structure fails due to cracks, corrosion, etc., the sensor will generate voltage under the action of noise. The relay control circuit then processes the voltage signal, activates the electromagnetic relay, and closes the alarm circuit. Finally, the buzzer and LED lights are triggered to emit an audible and visual alarm. The alarm can be used in fields such as ocean-going ships, urban pipelines, and non-destructive flaw detection.

[0050] When the structure is cracked or pre-cracked, the acoustic sensor converts the acoustic signal into an electrical signal to activate the relay, closing the sound and light alarm circuit to complete the alarm. When monitoring high-speed running machinery such as engines and machine tools, the acoustic sensor is attached near the valve or on the surface of the box component, and the buzzer and LED light are installed on the console.

[0051] In some embodiments, the relay control circuit includes a first single-phase full-wave rectifier bridge, a filter capacitor, multiple resistors, a first operational amplifier, a relay and a sliding rheostat; the second ends of the two wires input the monitoring signal to the first single-phase full-wave rectifier bridge; the output end of the single-phase full-wave rectifier bridge is connected in parallel with the filter capacitor, and the first output end is connected to the positive input end of the first operational amplifier through a first resistor; the negative input end of the first operational amplifier is connected to the second resistor and then to ground, the output end of the first operational amplifier is connected to the third resistor and then connected back to the negative input end, and the output end is then connected to the relay, the sliding rheostat and the protection resistor in sequence until the second output end of the single-phase full-wave rectifier bridge.

[0052] Figure 3 Schematic diagram of the relay control circuit of the monitoring flaw detection alarm provided by the present invention. Figure 3 As shown, the monitoring flaw detection sensor (TENG in the figure, which is based on the principle of friction nanogenerator) is connected to the first single-phase full-wave rectifier bridge (bridge), and the output end of the rectifier bridge can be connected to a filter capacitor (C1) with a capacitance of 10 volts and 2200 microfarads, and a very stable direct current is output after filtering. One output end (which can be the positive output end) of the first single-phase full-wave rectifier bridge is connected to the first resistor (R1) with a resistance of 20Ω, and then connected to the positive input end of the first operational amplifier (U1). The negative input end of the first operational amplifier is connected to the second resistor (R8, see here for reference) with a resistance of 10Ω Figure 4 ) and then grounded. The output of the op amp is connected to a third resistor (R3) with a resistance of 40Ω and then connected back to the negative input terminal. The output of the op amp is also connected to a protection resistor (R2) with a resistance of 20Ω after passing through a relay, and then connected to a sliding variable resistor (Rx1) with a maximum resistance of 20 ohms. The relay includes two switches. Under normal conditions, the switch connected to the relay is not connected to the loop. Under working conditions, the electromagnetic coil excites a magnetic field to attract the armature, control the switch of the sound and light alarm circuit to be turned on, and the sound and light alarm circuit works.

[0053] Since there is a certain pressure in the pipeline, a large sound pressure will be generated when the pipeline leaks. The peak value of the AC voltage output by the acoustic sensor is generally 5V. After the acoustic sensor sends out an electrical signal, a DC voltage is output through a single-phase full-wave rectifier bridge, and then a capacitor with a specification of 10V 2200uF filters and outputs a very stable DC voltage. The voltage remains stable after the rectifier bridge starts to output for about 0.5s. The output DC voltage is about 60% of the peak value of the AC voltage before rectification. The fixed value resistor connected in the circuit plays a role in protecting the circuit. The sliding rheostat can adjust the current size according to different leakage standards of pipelines of different specifications, thereby adjusting the closing condition of the relay.

[0054] This monitoring flaw detection alarm can output a relatively stable DC power by rectifying the AC power output by the sensor through a single-phase full-wave rectifier bridge, and then connecting a capacitor in parallel to stabilize the current. The signal is amplified by an operational amplifier and finally connected to an electromagnetic relay. The electromagnetic relay absorbs the armature to close the sound and light alarm circuit. The relay controls the main circuit of the alarm circuit and is disconnected under normal conditions.

[0055] In some embodiments, the sound and light alarm circuit includes a transformer for stepping down the power supply voltage, and the alternating current output by the transformer is connected to a second single-phase full-wave rectifier bridge to output direct current; the positive pole of the second single-phase full-wave rectifier bridge is connected in sequence to a relay normally open switch and a protection resistor to separate into two branches; one branch is connected to the positive input terminal of the second operational amplifier, and the negative input terminal of the second operational amplifier is grounded; the output terminal of the second operational amplifier is connected back to the negative input terminal through a fourth resistor, and then connected in parallel to an LED alarm light, and the LED is connected to the B pole of the transistor; the other branch is connected to the C pole of the transistor, the E pole of the transistor is connected to a buzzer, and is connected in series with a second protection resistor before returning to the negative pole of the rectifier bridge.

[0056] Figure 4 Schematic diagram of the sound and light alarm circuit of the monitoring flaw detection alarm provided by the present invention. Figure 4 As shown, the buzzer and LED alarm light can be installed in the duty room of the security personnel. A transformer can be used to step down the 220V power supply to a 9V power supply, and the DC power is rectified and output by the second single-phase full-wave rectifier bridge (bridge2). One of the outputs (the first output end, which can be the positive pole) is connected to the normally open switch of the relay, and then connected to a protection resistor with a resistance of 100Ω to separate into two branches, one of which is connected to the positive input end of the second operational amplifier (U2), the negative input end of the second operational amplifier is grounded, and the output end is connected back to the negative input end through a fourth resistor (R5) with a resistance of 40Ω, and then connected in parallel with an LED alarm light, and the LED is connected to the B pole of the transistor (Q1). The other branch is connected to the C pole of the transistor, the E pole of the transistor is connected to the buzzer, and the second protection resistor (R7) with a resistance of 500Ω is connected in series and then returns to the second output end (negative pole) of the rectifier bridge.

[0057] In summary, in this monitoring type flaw detection alarm, the transformer steps down the civilian 220V voltage, and then rectifies it into direct current through the rectifier bridge. The LED lamp is turned on to emit light, the operational amplifier amplifies the electrical signal, the transistor is turned on, and the buzzer sounds to serve as a warning. Among them, the current output by the rectifier bridge flows to the C pole of the transistor through another branch, and the current is amplified by the transistor to drive the buzzer to send out an audible alarm signal. In addition, the resistance of the main circuit protection resistor is not less than 1000Ω, and the wire connecting the sensor to the electromagnetic relay control circuit is preferably protected by a cable conduit, and the sound and light alarm circuit is grounded.

[0058] In summary, the device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0059] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a monitoring flaw detection sensor, characterized in that: include: For two pieces of cut PI films of the first size, one of which is a substrate, after the substrate is cleaned and dried, a gold spraying apparatus is used to spray gold powder onto both sides of each piece of PI film; The non-substrate PI film after spraying is closely attached to the substrate through a coating process; The first ends of the two wires are respectively attached to the outer surfaces of the two PI films, and the two cut copper foils of the second size are respectively attached to the outer surfaces of the two PI films while covering the first ends of the wires, and partially overlap with the PI films; The two copper foils are respectively adhered and fixed by two first PU films which are slightly larger than the copper foils.

2. The method for manufacturing a listening flaw detection sensor according to claim 1, characterized in that: After the two copper foils are respectively fixed by two first PU films slightly larger than the copper foils, the method further includes: Two rectangular second PU films are used to fix the wires adjacent to the two ends of the copper foils respectively, and the wires are parallel to the long sides of the second PU films.

3. The method for manufacturing a listening flaw detection sensor according to claim 1, characterized in that: After the two copper foils are respectively fixed by two first PU films slightly larger than the copper foils, the method further includes: Starting from the side of the substrate where no copper foil is attached, the sensor is completely encapsulated with a third PU film.

4. A monitoring flaw detection sensor, characterized in that: include: Two pieces of first-size PI films, two wires for outputting flaw detection signals, two pieces of second-size copper foils, and a first PU film are stacked in sequence from the inside to the outside; Each PI film has gold powder sprayed on both sides, and the inner surfaces of the two PI films are tightly fitted; The first ends of the two wires are respectively attached to the outer surfaces of the two PI films; The two copper foils respectively cover the first ends of the wires and are also correspondingly attached to the outer surfaces of the two PI films, and partially overlap with the PI films; The two copper foils are respectively fixed by bonding through a first PU film which is slightly larger than the copper foil.

5. The listening flaw detection sensor according to claim 4, characterized in that: The first size is a rectangle with a surface area greater than 500 square millimeters, the second size is a rectangle with a length and width smaller than the first size, and the two copper foils are spaced at a preset distance so that there is no overlapping area between the copper foils.

6. The listening flaw detection sensor according to claim 4, characterized in that: It also includes a second PU film for fixing the wires adjacent to the copper foil ends. The second PU film is rectangular, and the wires are parallel to the long sides of the second PU film.

7. The listening flaw detection sensor according to claim 4, characterized in that: It also includes a third PU film that completely encapsulates the sensor, and the third PU film is a rectangle with an area larger than the area of ​​the to-be-encapsulated area.

8. A monitoring flaw detection alarm, characterized in that: include: A relay control circuit, an audible and visual alarm circuit, and a monitoring flaw detection sensor as claimed in any one of claims 4 to 7; The second ends of the two wires of the monitoring flaw detection sensor are connected to the input end of the relay control circuit; The relay control circuit outputs a switch signal for controlling the working state of the sound and light alarm circuit through a connected relay according to the signal strength of the monitoring flaw detection sensor.

9. The listening flaw detection alarm according to claim 8, characterized in that: The relay control circuit includes a first single-phase full-wave rectifier bridge, a filter capacitor, a plurality of resistors, a first operational amplifier, a relay and a sliding rheostat; The second ends of the two wires input the monitoring signal to the first single-phase full-wave rectifier bridge; The output end of the single-phase full-wave rectifier bridge is connected in parallel with a filter capacitor, and the first output end is connected to the positive input end of the first operational amplifier through a first resistor; The negative input terminal of the first operational amplifier is connected to the second resistor and then to ground, the output terminal of the first operational amplifier is connected to the third resistor and then back to the negative input terminal, and the output terminal is then connected to the relay, the sliding rheostat and the first protection resistor in sequence until the second output terminal of the single-phase full-wave rectifier bridge.

10. The listening flaw detection alarm according to claim 8, characterized in that: The sound and light alarm circuit includes a transformer for stepping down the supply voltage, and the alternating current output by the transformer is connected to a second single-phase full-wave rectifier bridge to output direct current; The first output end of the second single-phase full-wave rectifier bridge is connected to a normally open switch of a relay and a protection resistor in sequence to separate into two branches; One branch is connected to the positive input terminal of the second operational amplifier, and the negative input terminal of the second operational amplifier is grounded; The output end of the second operational amplifier is connected back to the negative input end through the fourth resistor, and then connected in parallel to the LED alarm light, and the LED is connected to the B pole of the transistor; The other branch is connected to the C pole of the transistor, the E pole of the transistor is connected to the buzzer, and is connected in series with the second protection resistor before returning to the second output end of the second single-phase full-wave rectifier bridge.

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