Wafer baking apparatus

Abstract

The application discloses a wafer baking device, which comprises a first shell, a heating mechanism, a flow guide disc and a shunt plate arranged in the first shell in sequence along the height direction, the flow guide disc is provided with a ventilation opening penetrating along the height direction, the wafer baking device comprises a heating space between the heating mechanism and the flow guide disc, a shunt space between the flow guide disc and the shunt plate and a liquid-gas separation pipeline connected with the shunt space, and the ventilation opening is connected with the heating space and the shunt space; the gaseous solvent can be discharged in time, and liquid-gas separation and collection can be carried out, so that the post-processing cost of the factory is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a wafer baking device. BACKGROUND

[0002] In the wafer baking process, since the wafer surface is coated with a film, the film melts into a gaseous solvent during high-temperature baking, and a large amount of gaseous solvent needs to be discharged in time. If the gaseous solvent cannot be discharged uniformly and in time, it will condense and liquefy during upward flow, thereby dripping down to the wafer surface, polluting the wafer and affecting product yield; a large amount of gaseous solvent discharged in the prior art also brings great cost to the factory end for later processing. SUMMARY

[0003] One of the purposes of the present application is to provide a wafer baking device to solve the technical problem of how to handle the discharge of gaseous solvent in the prior art.

[0004] To achieve one of the above purposes, an embodiment of the present application provides a wafer baking device, comprising a first shell, a heating mechanism, a flow guide disc and a flow distribution plate arranged in the height direction of the first shell in sequence, the flow guide disc having a ventilation opening penetrating in the height direction, the wafer baking device comprising a heating space between the heating mechanism and the flow guide disc, a flow distribution space between the flow guide disc and the flow distribution plate, and a liquid-gas separation pipeline communicating with the flow distribution space, the ventilation opening communicating the heating space and the flow distribution space.

[0005] As a further improvement of the embodiment of the present application, the outer periphery of the flow distribution plate abuts against the inner wall surface of the first shell, and the middle of the flow distribution plate is higher than the outer periphery.

[0006] As a further improvement of the embodiment of the present application, the center of the flow distribution plate forms an included angle with the plane where the outer periphery is located, and the included angle ranges from 15° to 20°.

[0007] As a further improvement of the embodiment of the present application, the flow distribution plate comprises four inclined plates, each of which is triangular or fan-shaped.

[0008] As a further improvement of the embodiment of the present application, the flow distribution plate is made of metal, and the thickness of the flow distribution plate is between 3-5mm.

[0009] As a further improvement of the embodiment of the present application, the wafer baking device comprises a first air duct uniform disc between the flow guide disc and the flow distribution plate in the height direction, and / or a second air duct uniform disc between the heating mechanism and the flow guide disc.

[0010] As a further improvement of the embodiment of the present application, the liquid-gas separation pipeline comprises a first air inlet, the flow guide disc comprises a avoiding gap arranged on the outer periphery thereof, and the first air inlet communicates with the avoiding gap so as to communicate with the separation space.

[0011] As a further improvement of the embodiment of the present application, the first air inlet is arranged in the avoiding gap, and the shape of the first air inlet is adapted to the shape of the avoiding gap, and the first air inlet does not exceed the surface of the flow guide disc upwardly.

[0012] As a further improvement of the embodiment of the present application, the flow guide disc comprises a plurality of avoiding gaps arranged at intervals, and the liquid-gas separation pipeline comprises a plurality of first air inlets arranged in one-to-one correspondence with the avoiding gaps.

[0013] As a further improvement of the embodiment of the present application, the first shell comprises a bottom wall arranged opposite to the top wall, the liquid-gas separation pipeline comprises a first flow guide pipe arranged between the bottom wall and the flow guide disc, the first flow guide pipe comprises the first air inlet, and the first flow guide pipe is opposite to the avoiding gap.

[0014] As a further improvement of the embodiment of the present application, the first flow guide pipe is provided with a first air outlet at one end thereof away from the first air inlet, and the first air outlet comprises an inclined flow guide channel.

[0015] As a further improvement of the embodiment of the present application, the liquid-gas separation pipeline comprises a collection tank arranged at the bottom thereof, an intermediate pipeline communicating with the collection tank and the first air inlet, and an air extraction pipeline communicating with the intermediate pipeline.

[0016] Compared with the prior art, the present application provides a wafer baking device, which comprises a flow guide disc, a separation plate and a liquid-gas separation pipeline. The flow guide disc is used for guiding gaseous solvent to flow into a separation space in an orderly manner. The separation plate is used for further guiding the flow of the gaseous solvent in the separation space so as to make the gaseous solvent enter the liquid-gas separation pipeline, prevent the gaseous solvent from dropping onto the surface of the wafer, and timely perform liquid-gas separation, thereby reducing the processing cost of later factory work. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 FIG. 1 is a perspective view of a wafer baking device according to an embodiment of the present application.

[0018] Figure 2 FIG. 2 is a sectional view of the wafer baking device according to the embodiment of the present application.

[0019] Figure 3 FIG. 3 is a schematic view of the wafer baking device according to the embodiment of the present application, which exposes the internal structure thereof.

[0020] Figure 4Figure 1 is a partial exploded view of a wafer baking device according to an embodiment of the present application.

[0021] Figure 5 Figure 2 is a front view of a flow guide plate according to an embodiment of the present application.

[0022] Figure 6 Figure 3 is a schematic view of a flow distribution plate according to an embodiment of the present application.

[0023] Figure 7 Figure 4 is a schematic view of a flow distribution plate according to another embodiment of the present application.

[0024] Figure 8 Figure 5 is a schematic view of a wafer baking device according to another embodiment of the present application.

[0025] Figure 9 Figure 6 is a schematic view of a wafer baking device according to another embodiment of the present application.

[0026] Figure 10 Figure 7 is a schematic view of a wafer baking device according to another embodiment of the present application.

[0027] Figure 11 Figure 8 is a partial exploded view of a wafer baking device according to another embodiment of the present application.

[0028] Figure 12 Figure 9 is a top view of a sun-type air duct uniformity plate according to another embodiment of the present application.

[0029] Figure 13 Figure 10 is a top view of a matrix-type air duct uniformity plate according to another embodiment of the present application. DETAILED DESCRIPTION

[0030] The present application will be described in detail below with reference to the attached drawings. However, the present application is not limited to the embodiments described below, and modifications of structure, method, or function made by those skilled in the art based on the embodiments are included in the scope of the present application.

[0031] It should be noted that the term "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that processes, methods, articles, or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or inherent to such processes, methods, articles, or devices. In addition, the terms "first", "second", "third", "fourth" and the like are used only for descriptive purposes, and should not be construed as indicating or implying relative importance.

[0032] The term "connect", "connected to" or any other variant is intended to cover various relative positions of connection, so as to include direct connection or indirect connection. Among them, the direct connection can be formed by the air path pipeline, the indirect connection can be the connection relationship formed by devices such as valve body, sensor, etc., can be the connection relationship formed by air path components such as brake control unit, and can be the connection relationship formed by any other medium such as air.

[0033] Please refer to Figure 1 A structure schematic diagram of a wafer baking device 100 provided by an embodiment of the present application includes a plurality of heating cavities arranged in a stack, and in a preferred embodiment, a single heating cavity can also be arranged. The following will take a single heating cavity as an example to describe the present application in detail.

[0034] In a preferred embodiment, the wafer baking device 100 includes a first shell 10 and a heating mechanism 20 arranged in the first shell 10. The wafer is placed in the heating mechanism 20 and is heated and baked by the heating mechanism 20. The colloid coated on the surface of the wafer is volatilized into the air to form a gaseous solvent, and the gaseous solvent flows in the first shell 10 and needs to be discharged in time.

[0035] The first shell 10 can be optionally arranged in a rectangular structure or a circular structure.

[0036] In combination with Figure 2 As shown, the first shell 10 includes opposite top and bottom walls 11 and 12, a side wall 13 located between the top and bottom walls 11 and 12 and connecting the top and bottom walls 11 and 12. One side of the first shell 10 forms an opening for mounting a door body 14, and the door body 14 is used to open or close the internal receiving space of the first shell 10.

[0037] In a preferred embodiment, the wafer baking device 100 includes a flow guide disc 30 and a flow distribution plate 40 arranged in sequence along the height direction thereof, and the flow guide disc 30 and the flow distribution plate 40 are located between the heating mechanism 20 and the top wall 11. The flow guide disc 30 has a ventilation opening 301 penetrating along the height direction, and the wafer baking device 100 includes a heating space 101 located between the heating mechanism 20 and the flow guide disc 30, and a flow distribution space 102 located between the flow guide disc 30 and the flow distribution plate 40. The ventilation opening 301 communicates the heating space and the flow distribution space. The gaseous solvent on the surface of the wafer flows from the heating space 101 to the flow distribution space 102 through the ventilation opening 301, and does not accumulate around the wafer.

[0038] In combination with Figures 3-4As shown, the outer periphery of the flow guide disc 30 abuts against the inner wall surface of the first shell 10. It can be understood that when the first shell 10 is arranged in a rectangular structure, the flow guide disc 30 is arranged in a rectangular shape, and when the first shell 10 is arranged in a circular structure, the flow guide disc 30 is arranged in a circular shape. The key point is that the outer periphery contour of the flow guide disc 30 is the same as the inner wall surface contour of the first shell 10, and the abutment is achieved. In this way, if the gaseous solvent is condensed and liquefied in the distribution space 102, it will also drop on the surface of the flow guide disc 30, and will not drop on the surface of the wafer.

[0039] In combination Figure 5 As shown, the surface of the flow guide disc 30 is preferably a smooth surface, which is beneficial for the liquid solvent on the surface to slide down.

[0040] The vent 301 of the flow guide disc 30 is arranged at the center thereof, and the flow guide disc 50 includes a flow guide slope 31 between the vent 301 and the outer periphery thereof, and the vent 301 of the flow guide disc is higher than the outer periphery thereof. The flow guide disc 30 is in a shape with a high center and a low outer periphery, which is beneficial for the liquid solvent to slide down to the outer periphery of the flow guide disc 30.

[0041] The flow guide disc 30 can also be considered as a center-symmetric structure obtained by rotating an arc-shaped line, and the flow guide slope 31 has an inclined plane.

[0042] The flow guide slope 31 has an arc-shaped longitudinal section, and the center of the arc-shaped longitudinal section corresponds to a position above the flow guide disc 30. The arc-shaped longitudinal section is a downward concave arc, and if the center of the arc-shaped longitudinal section corresponds to a position below the flow guide disc 30, the arc-shaped longitudinal section is an upward convex arc, which is not conducive to the sliding down of the liquid solvent. The central angle of the arc-shaped longitudinal section of the flow guide slope 31 corresponds to an angle of 20-30 degrees.

[0043] In a preferred embodiment, the outer periphery of the distribution plate 40 abuts against the inner wall surface of the first shell 10, and in combination Figure 6 As shown, it can be understood that when the first shell 10 is arranged in a rectangular structure, the distribution plate 40 is arranged in a rectangular shape, and when the first shell 10 is arranged in a circular structure, the distribution plate 40 is arranged in a circular shape. The key point is that the outer periphery contour of the distribution plate 40 is the same as the inner wall surface contour of the first shell 10, and the abutment is achieved.

[0044] The distribution plate 40 is high in the middle and low in the outer periphery, so that the gaseous solvent is distributed to the outside, and the liquid solvent is guided to flow down along the wall surface of the distribution plate 40. Specifically, the gaseous solvent entering the distribution space 102 from the vent 301 will flow to the lower wall surface of the distribution plate 40. Since the distribution plate 40 does not have a vent and has a shape with a high middle and a low outer periphery, the gaseous solvent flowing at the outer periphery of the distribution plate 40 is relatively dense.

[0045] The shunt plate 40 is made of metal material, which can realize the function of heat storage and prevent the gaseous solvent from being liquefied due to cold. It can be understood that the first shell 10 has a relatively high temperature, and the gaseous solvent also has a relatively high temperature. The metal shunt plate 40 can quickly absorb a large amount of heat and form a heat storage plate to keep the gaseous solvent warm and prevent it from being liquefied in the shunt space 102.

[0046] The thickness of the shunt plate 40 is between 3-5mm. In an ideal state, the thicker the shunt plate 40, the better the heat storage and heat preservation effect. However, the thicker the shunt plate 40, the heavier it will be. Considering the bearing capacity of the first shell 10 and the overall weight of the wafer baking device 100, the shunt plate thickness is preferably 3-5mm.

[0047] The center of the shunt plate 40 forms an angle with the plane where the outer periphery is located, and the angle is in the range of 15° to 20°. It has a certain shunt function and does not occupy too much space in the height direction.

[0048] In another embodiment, the shunt plate 40 can be a smooth inclined arc surface, for example, similar to the structure of the guide disc 30, except that the center is not open.

[0049] In a specific embodiment, referring to Figure 6 The shunt plate 40 includes four inclined plates 41, each of which is a triangle or a sector. When the shunt plate 40 has a rectangular outer periphery, the inclined plate 41 is a triangle, and when the shunt plate 40 has a circular outer periphery, the inclined plate 41 is a sector.

[0050] In another embodiment, referring to Figure 7 The shunt plate 40 can also be set as two symmetrical inclined plates according to actual needs.

[0051] In a preferred embodiment, the wafer baking device 100 includes a liquid-gas separation pipeline 50 that communicates with the shunt space 102, so that liquid-gas separation is performed in time to reduce the processing cost of later factory work.

[0052] The liquid-gas separation pipeline 50 includes a first gas inlet 501, the guide disc 30 includes an avoidance notch 302 arranged on the outer periphery thereof, and the first gas inlet 501 communicates with the avoidance notch 302 to thereby communicate with the shunt space 102.

[0053] In combination with Figures 2-3As shown, it can be understood that, on the premise that the first shell 10 is a regular rectangular structure or a circular structure, since the outer periphery of the flow guide disc 30 and the outer periphery of the flow distribution plate 40 are both abutted to the inner wall surface of the first shell 10, it can be obtained that the outer periphery of the flow guide disc 30 and the outer periphery of the flow distribution plate 40 should be parallel and aligned along the height direction. It can be known that the avoidance gap 302 should be directly opposite the outer periphery of the flow distribution plate 40, since the outer periphery of the flow distribution plate 40 is relatively low, which causes the gaseous solvent flowing outside the flow distribution space 102 to be relatively dense, and the first gas inlet 501 is connected to the avoidance gap 302, so that the relatively dense gaseous solvent can be discharged first.

[0054] In a preferred embodiment, the first gas inlet 501 is arranged in the avoidance gap 302, the shape of the first gas inlet 501 is adapted to the shape of the avoidance gap 302, and the first gas inlet 501 does not exceed the surface of the flow guide disc 30 upwardly.

[0055] The first gas inlet 501 is directly arranged in the avoidance gap 302 to communicate with the flow distribution space 102, and the avoidance gap 302 can be circular or rectangular, and the first gas inlet 501 is also circular or rectangular, so that the two are more closely connected seamlessly.

[0056] The surface of the flow guide disc 30 can prevent liquid solvent from dropping onto the wafer surface, because the liquid solvent falls on the surface of the flow guide disc 30, and since the flow guide disc 30 is also arranged with a low outer periphery, the outer periphery of the flow guide disc 30 will accumulate liquid solvent, and arranging the first gas inlet 501 lower than or flush with the surface of the flow guide disc 30 is also helpful for the liquid solvent on the surface of the flow guide disc 30 to be discharged in time.

[0057] In a preferred embodiment, the flow guide disc 30 includes a plurality of avoidance gaps 302 arranged at intervals, and the liquid-gas distribution pipeline 50 includes a plurality of first gas inlets 501 arranged one by one corresponding to the avoidance gaps 302.

[0058] Specifically, in combination with Figures 3-4 When the first shell 10 is rectangular, the flow guide disc 30 is also rectangular, and the avoidance gap 302 is arranged at each of the four corners of the flow guide disc 30, and the liquid-gas distribution pipeline 50 includes four first gas inlets 501 arranged one by one corresponding to the avoidance gaps 302; when the first shell 10 is circular, the flow guide disc 30 is also circular, and the outer periphery of the flow guide disc 30 can also be uniformly provided with four or more avoidance gaps 302.

[0059] In a preferred embodiment, the liquid-gas distribution pipeline 50 includes a first flow guide pipe 51 arranged between the bottom wall 12 and the flow guide disc 30, the first flow guide pipe 51 includes the first gas inlet 501, and the first flow guide pipe 51 is directly opposite the avoidance gap 302.

[0060] Specifically, the first flow guide pipe 51 can be arranged at the corner of the first shell 10, and the first flow guide pipe 51 is formed as one end of the first air inlet 501 connected to the avoiding gap 302 of the flow guide disc 30. The first flow guide pipe 51 can be a square tube or a circular tube, and the specific selection is subject to the shape of the avoiding gap 302. The other end of the first flow guide pipe 51 away from the first air inlet 501 is connected to the bottom wall 12.

[0061] When the first shell 10 is rectangular, the first flow guide pipe 51 is also a square tube, and the flow guide disc 30 is also a rectangular structure. The first flow guide pipe 51 is fixed by covering the four corners of the first shell 10, thereby saving space.

[0062] The side surface of the first flow guide pipe 51 is provided with a first air outlet 502, which is used to further communicate to the intermediate pipeline 52 described below, so as to discharge the gaseous solvent out of the first shell 10. The side wall 13 of the first shell is correspondingly provided with a through groove 130 for the intermediate pipeline 52 to pass through.

[0063] The liquid-gas separation pipeline 50 includes a collection tank 53 at the bottom thereof, an intermediate pipeline 52 communicating the collection tank 53 and the first air inlet 501, and an air extraction pipeline 54 communicating the intermediate pipeline 52.

[0064] The intermediate pipeline 52 communicates the first flow guide pipe 51 and the collection tank 53. The intermediate pipeline 52 communicates the first air outlet 502 and in turn communicates to the first air inlet 501. The end of the intermediate pipeline 52 is connected to the collection tank 53. The collection tank 53 is located at the bottom of the liquid-gas separation pipeline 50. The gaseous solvent gradually condenses and liquefies in the intermediate pipeline 52 and flows downward due to gravity, and gathers in the collection tank 53.

[0065] The intermediate pipeline 52 is made of metal material and has good heat conductivity. In actual scenarios, the gaseous solvent in the first shell 10 has a temperature difference of 100° or more with the outside. The gaseous solvent entering the intermediate pipeline 52 is rapidly cooled and liquefied, and finally flows into the collection tank 53.

[0066] The gaseous solvent in the first shell 10 is naturally discharged due to thermal expansion, and is further assisted by the air extraction pipeline 54, which helps the gaseous solvent to be discharged more timely and efficiently.

[0067] Since the liquid-gas treatment system at the plant end is located at the bottom of the plant in actual scenarios, the collection tank 53 and the air extraction pipeline 54 are arranged at the bottom of the first shell 10. In actual application scenarios, the bottom wall of the first shell 10 is fixed to an external fixed frame, and the collection tank 53 is in a suspended state, which is convenient for installation and disassembly.

[0068] The intermediate pipeline 52 includes horizontal section pipes 520 connected to the first flow guide pipe 51, and vertical section pipes 521 connected to the horizontal section pipes 520.

[0069] The first air outlet 502 includes an inclined arc-shaped flow guide channel connected to the horizontal section pipes 520, which helps the liquid solvent smoothly slide when turning from the horizontal section pipes 520 to the first air outlet 502, preventing accumulation in the corner.

[0070] Arc-shaped inclined flow guide channels are also provided between the vertical section pipes 521 of the horizontal section pipes 520, which help the liquid solvent smoothly slide when turning from the horizontal section pipes 520 to the vertical section pipes 521, preventing accumulation in the corner.

[0071] In one embodiment, when the wafer baking device 100 is a single heating cavity, the first flow guide pipe 51 is connected to the intermediate pipeline 52, and the intermediate pipeline 52 is connected to the collection tank 53. Figure 8 As shown in the lowermost heating cavity, the end of the vertical section pipe 521 is directly connected to the collection tank 53. The first flow guide pipe 51 is located in the first housing 10, and the intermediate pipeline 52 is located outside the first housing 10. The horizontal section pipes 520 and / or the vertical section pipes 521 can also be extended in distance to prolong the condensation time of the gaseous solvent.

[0072] When the wafer baking device 100 is a plurality of heating cavities, as shown in the lowermost heating cavity, Figure 8 only need to stack the single heating cavities, connect several vertical section pipes 521 to each other, and connect them to a collection tank 53.

[0073] In another embodiment, when the wafer baking device 100 is a single heating cavity, as shown in the lowermost heating cavity, Figure 3 the first flow guide pipe 51 penetrates downward and is connected to an extension pipe 523, the extension pipe 523 passes through the bottom of the first housing 10, and the bottom of the extension pipe 523 is provided with a collection tank 53.

[0074] In another embodiment, when the wafer baking device 100 includes a plurality of heating cavities stacked, as shown in the lowermost heating cavity, Figures 2-3 the above two single heating cavities can be stacked to form. The vertical section pipes 521 of the upper heating cavities are connected to each other and further connected to the extension pipe 523 of the bottom heating cavity, thereby being connected to the collection tank 53 at the bottom.

[0075] When the wafer baking device 100 includes a plurality of heating cavities stacked, as shown in the lowermost heating cavity, Figure 2 , 8As shown, the first flow guide pipe 51 in the lowest heating cavity is connected to the upstream intermediate pipeline 52 on one side and to the downstream collection tank 53 on the other side. Therefore, the exhaust pipeline 54 is arranged in the bottom vertical section pipeline 521 or the extended pipeline 523 to avoid the gaseous solvent from flowing reversely from the first gas outlet 502 to the upstream horizontal section pipeline 520. Even if there is a small amount of reverse flow, the presence of the upstream vertical section pipeline 521 will not affect the liquid-gas separation and collection.

[0076] The cooperation of the flow guide disc 30, the flow distribution plate 40, and the liquid-gas distribution pipeline 50 is designed to further prevent the liquefaction and dripping of the gaseous solvent and to reduce the cost of the factory end.

[0077] In the preferred embodiment, in order to further improve the temperature uniformity of the first shell 10, the wafer baking device 100 includes a first air duct uniform disc 60 located between the flow guide disc 30 and the flow distribution plate 40 along the height direction thereof. In combination with Figures 9-11 As shown, since the first gas inlet 501 of the liquid-gas separation pipeline 50 is directly connected to the flow distribution space 102, in order to prevent the gas in the flow distribution space 102 from being directly sucked to cause airflow turbulence and result in uneven temperature inside the first shell 10, the first air duct uniform disc 60 is arranged in the flow distribution space 102 to ensure the temperature uniformity of the flow distribution space 102.

[0078] In other embodiments, in order to ensure better temperature uniformity around the wafer, a second air duct uniform disc can also be arranged between the heating space 101, i.e., between the heating mechanism 20 and the flow guide disc 30. The first air duct uniform disc 60 can have the same structure as the second air duct uniform disc.

[0079] In combination with 12-13, the first air duct uniform disc 60 includes a matrix type uniform disc 61 and a sun type uniform disc 62. The second air duct uniform disc can also include a matrix type uniform disc 61 and a sun type uniform disc 62.

[0080] The outer periphery of the matrix type uniform disc 61 abuts against the inner wall surface of the first shell, and the diameters of the air duct holes of the matrix type uniform disc 61 are equal and arranged in an array.

[0081] The outer periphery of the sun type uniform disc 62 abuts against the inner wall surface of the first shell, and the sun type uniform disc 62 has a reference position O located at the center. In the direction diverging outward from the reference position O, the diameters of the air duct holes of the sun type uniform disc 62 have a trend of increasing. The air duct holes of the sun type uniform disc 62 are arranged in a linear diverging manner outward from the reference position O.

[0082] The diameter of the air duct holes in the same annular ring of the sun-shaped uniform disc 62 is equal, and the diameter of the air duct holes in different annular rings from inside to outside is sequentially increased and then kept equal. The number of the air duct holes in different annular rings from inside to outside is consistent, and the arrangement density of the air duct holes from inside to outside is reduced.

[0083] The present application has the advantages that the shunt plate 40 is arranged to shunt the gaseous solvent to the outside and guide the liquid solvent to flow along the wall surface of the shunt plate 40; the shunt plate 40 is made of metal material and serves as a heat storage plate to heat the gaseous solvent and prevent it from liquefying; the flow guide plate 30 is arranged, the outer periphery of which is provided with an avoiding gap 302, the avoiding gap 302 is connected with the liquid-gas separation pipeline 50, and the gaseous solvent outside the shunt space 102 can be discharged in time; the first gas outlet 501 is directly connected with the avoiding gap 302 and does not exceed the surface of the flow guide plate 30, which is beneficial to the discharge of the liquid solvent through the first gas outlet 501.

[0084] Any of the technical solutions provided in the foregoing can be formed, and details are not repeated here.

[0085] It should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be combined appropriately to form other embodiments that those skilled in the art can understand.

[0086] The series of detailed descriptions listed above are only specific descriptions of the feasible embodiments of the present application, and are not used to limit the protection scope of the present application, and equivalent embodiments or changes made without departing from the spirit of the present application should be included in the protection scope of the present application.

Claims

1.A wafer baking device, comprising a first housing, a heating mechanism, a flow guide plate and a flow distribution plate arranged in sequence along a height direction of the wafer baking device, the flow guide plate having a ventilation opening penetrating along the height direction, the wafer baking device comprising a heating space between the heating mechanism and the flow guide plate, a flow distribution space between the flow guide plate and the flow distribution plate, and a liquid-gas separation pipeline communicating with the flow distribution space, the ventilation opening communicating the heating space and the flow distribution space; the ventilation opening of the flow guide plate is arranged at a center of the flow guide plate, the flow guide plate comprising a flow guide slope between the ventilation opening and an outer periphery of the flow guide plate, the ventilation opening of the flow guide plate being higher than the outer periphery of the flow guide plate; an outer periphery of the flow distribution plate abuts against an inner wall surface of the housing, the flow distribution plate having a middle portion higher than an outer periphery; the liquid-gas separation pipeline comprising a first air inlet, the flow guide plate comprising an avoiding notch arranged at the outer periphery of the flow guide plate, the first air inlet communicating with the avoiding notch so as to communicate with the flow distribution space; a center of the flow distribution plate and an outer periphery of the flow distribution plate form an included angle, the included angle being in a range of 15° to 20°; the flow distribution plate comprising four inclined plates, each of the inclined plates being triangular or sector-shaped; the flow distribution plate being made of metal, the thickness of the flow distribution plate being in a range of 3-5mm; the wafer baking device comprising a first air duct uniform plate between the flow guide plate and the flow distribution plate along the height direction, and / or a second air duct uniform plate between the heating mechanism and the flow guide plate; the first air inlet being arranged at the avoiding notch, the shape of the first air inlet being adapted to the shape of the avoiding notch, the first air inlet not exceeding a surface of the flow guide plate upwardly; the flow guide plate comprising a plurality of avoiding notches arranged at intervals, the liquid-gas separation pipeline comprising a plurality of first air inlets corresponding to the avoiding notches; the first housing comprising a bottom wall arranged opposite to a top wall, the liquid-gas separation pipeline comprising a first flow guide pipe arranged between the bottom wall and the flow guide plate, the first flow guide pipe comprising the first air inlet, the first flow guide pipe being opposite to the avoiding notch; an end of the first flow guide pipe away from the first air inlet being provided with a first air outlet, the first air outlet comprising an inclined flow guide channel; the liquid-gas separation pipeline comprising a collection tank at a bottom portion of the liquid-gas separation pipeline, an intermediate pipeline communicating the collection tank and the first air inlet, and an air extraction pipeline communicating the intermediate pipeline. ​ ​ ​ 2. The wafer baking apparatus according to claim 1, wherein ​ 3. The wafer baking apparatus of claim 1, wherein ​ 4. The wafer baking apparatus of claim 1, wherein ​ 5. The wafer baking apparatus of claim 1, wherein ​ 6. The wafer baking apparatus of claim 1, wherein ​ 7. The wafer baking apparatus of claim 1, wherein ​ 8. The wafer baking apparatus of claim 1, wherein ​ 9. The wafer baking apparatus of claim 8, wherein ​ 10. The wafer baking apparatus of claim 1, wherein ​

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