Transparent ultrasonic probe module and optical device provided with same

Abstract

Provided is an ultrasonic probe module provided inside a housing of an optical device. A transparent ultrasonic probe module provided inside a housing of an optical device according to one aspect of the present invention may comprise: a lens provided on one side inside the housing, formed of a transparent material, and provided so that one side surface thereof is exposed to the outside of the housing; the first matching layer is made of a transparent material and is arranged on the other side surface of the lens; the piezoelectric element layer is arranged on the first matching layer and comprises a plurality of transparent piezoelectric elements capable of mutually converting electric signals and mechanical signals; a first electrode layer and a second electrode layer which are made of a transparent material, are respectively arranged on one side surface and the other side surface of the piezoelectric element layer, and are used for transmitting electric signals; a circuit board which is connected to the first electrode layer and the second electrode layer, is formed of a bendable material, and can exchange electrical signals with the piezoelectric element; and a block layer which is provided on the second electrode layer, is formed of a transparent material, and is for eliminating ultrasonic noise.

Description

Technical Field

[0001] The invention relates to a transparent ultrasonic wave probe module and an optical device for arranging the module. Background Art

[0002] Ultrasonic sensor (Ultrasonic Sensor or Ultrasonic Transducer) is a sensor that uses the characteristics of piezoelectric materials to convert electrical energy into sound energy, transmits the energy to the target object, and converts the reflected sound energy into an electrical signal again, so as to measure the physical distance between the object and the object and obtain the image of the object.

[0003] Compared with magnetic resonance imaging (MRI), X-ray, and computed tomography (CT), imaging technology based on optics and ultrasound has the advantages of being safe, accessible, and able to confirm images in real time, and therefore has been used in medical diagnosis.

[0004] Therefore, studies have been conducted in the past, for example, combining an ultrasonic imaging system with an optical imaging system, or combining an ultrasonic imaging system with an optical interference tomography imaging system, or combining an ultrasonic imaging system with a fluorescence imaging system.

[0005] Figure 1 2 is a schematic diagram illustrating a state of scanning an object by a conventional opaque ultrasonic sensor and an optical device. The conventional ultrasonic sensor 20 is used in an opaque state, so when the ultrasonic sensor 20 and the optical device 30 are used together, as shown in FIG. Figure 1 As shown, the optical device 30 cannot project the non-transparent ultrasonic sensor 20 and is therefore arranged out of the axis of the ultrasonic sensor (un-axis insertion).

[0006] This off-axis setup has disadvantages in capturing images for a variety of reasons, such as poor system alignment, increased complexity, increased system size, reduced signal-to-noise ratio (SNR), and limited viewing angle.

[0007] In addition, optical scan data does not match ultrasound scan data, making it difficult to make an accurate diagnosis.

[0008] For example, refer to Figure 1 Among the first substance 501, the second substance 502, the third substance 503, and the fourth substance 504 existing in the sample 500, a portion of the first substance 501 and the fourth substance 504 are detected by the ultrasonic beam 21. However, there is a problem that the first substance 501 located vertically below the ultrasonic sensor 20 cannot be detected by the beam 31.

[0009] In the case of an optical device that uses a conventional opaque ultrasonic sensor and optical equipment to scan an object, the light source cannot penetrate the ultrasonic sensor. Therefore, in order to separate the optical path and the ultrasonic signal path, it is inevitable to set up incidental factors such as a prism and silicone oil. Therefore, there is also a problem that the system size becomes very large.

[0010] In addition, in order to solve the problem of opaque ultrasonic sensors, in U.S. Patent No. 8784321, an optical path is formed by perforating a portion of the cross section of the opaque ultrasonic sensor, so that the optical path and the ultrasonic path are located on the same axis. However, in this case, since light can only be transmitted through a portion of the cross section of the ultrasonic sensor, the problem caused by the non-transparency of the ultrasonic sensor cannot be fully solved.

[0011] In addition, transparent ultrasonic sensors have been developed in recent years to solve the imaging problems caused by opaque ultrasonic sensors. However, some transparent ultrasonic sensors still have limitations in obtaining high SNR and high-resolution photoacoustic images due to low transparency, low sensitivity, or wide focus.

[0012] The inventor proposed a single-crystal transparent ultrasonic sensor structure and a manufacturing method thereof based on lithium niobate (LNO) in Korean Patent Publication No. 10-2021-0034466 (“Transparent ultrasonic sensor and its manufacturing method”), etc. Based on this, an optical composite imaging system of a transparent ultrasonic sensor in the form of a single element was proposed in Korean Patent Publication No. 10-2022-0029003 (“Ultrasonic optical composite imaging system based on transparent ultrasonic sensor”), etc.

[0013] However, the ultrasonic sensor structure is composed of a single element, so the amount of data that can be processed per hour by each element is limited. Therefore, there is an increasing need for an optical device that can provide a wider viewing angle by using a transparent ultrasonic sensor with a multi-element structure to increase the amount of data and improve image quality while maintaining the advantages of a transparent ultrasonic sensor that can be processed in real time.

[0014] Prior art literature

[0015] Patent Literature

[0016] Patent Document 0001: Korean Publication Patent No. 10-2021-0034466

[0017] Patent document 0002: Korean Patent Publication No. 10-2022-0029003. Summary of the invention

[0018] Technical issues

[0019] An object of the present invention is to provide an optical device that improves SNR and enables miniaturization of the device by using a transparent ultrasonic sensor that can realize coaxialization of an ultrasonic path and an optical path.

[0020] Still another object of the present invention is to provide an optical device provided with an ultrasonic sensor having high transparency and sensitivity.

[0021] Another object of the present invention is to provide an optical device that improves image quality and provides a wide viewing angle by using multiple piezoelectric elements.

[0022] The subject matter of the present invention is not limited to the above-mentioned subject matter, and other subjects not mentioned can be clearly understood by a person skilled in the art to which the present invention belongs from the following description.

[0023] Solutions to the problem

[0024] According to one aspect of the present invention, a transparent ultrasonic wave probe module is provided, which is a transparent ultrasonic wave probe module arranged inside a shell of an optical device and includes: a lens, which is arranged on one side inside the shell, is formed of a transparent material and is arranged in a manner that one side is exposed to the outside of the shell; a first matching layer, which is formed of a transparent material and is arranged on the other side of the lens; a piezoelectric element layer, which is arranged on the first matching layer and includes a plurality of transparent piezoelectric elements that can convert electrical signals and mechanical signals into each other; a first electrode layer and a second electrode layer, which are formed of a transparent material, are respectively arranged on one side and the other side of the piezoelectric element layer and transmit electrical signals; a circuit substrate, which is connected to the first electrode layer and the second electrode layer, is formed of a bendable material, and can exchange electrical signals with the piezoelectric element; and a block layer, which is arranged on the second electrode layer, is formed of a transparent material and is used to eliminate ultrasonic noise.

[0025] At this time, a second matching layer formed of a transparent material may be further disposed between the first matching layer and the lens.

[0026] At this time, the circuit substrate may be formed of a transparent material.

[0027] At this time, the circuit substrate may be composed of a ground substrate (ground fpcb) and a signal substrate (signal fpcb).

[0028] At this time, the ground substrate may be connected to the first electrode layer between the first electrode layer and the first matching layer, and the signal substrate may be connected to the second electrode layer between the second electrode layer and the block layer.

[0029] At this time, the circuit substrate may be composed of a gold foil board responsible for a grounding function and a signal substrate (signal fpcb).

[0030] At this time, the gold foil plate may be connected to the first electrode layer between the first electrode layer and the first matching layer, and the signal substrate may be connected to the second electrode layer between the second electrode layer and the block layer.

[0031] At this time, the block layer can be formed to have a surface wider than the piezoelectric element layer and the second electrode layer, and the signal substrate can be arranged on a portion of the upper surface of the block layer protruding from the piezoelectric element layer and the second electrode layer, and can be connected through the second electrode layer and the conductive material.

[0032] At this time, a plurality of piezoelectric elements constituting the piezoelectric element layer may be arranged in a row.

[0033] At this time, the plurality of piezoelectric elements may be arranged in a row and may be arranged in an upwardly convex arch shape.

[0034] At this time, the plurality of piezoelectric elements may be arranged in a row and may be arranged in an upwardly concave "U" shape.

[0035] In this case, the plurality of piezoelectric elements constituting the piezoelectric element layer may be arranged in a lattice pattern in the horizontal and vertical directions.

[0036] At this time, the plurality of piezoelectric elements constituting the piezoelectric element layer may be arranged in a circular shape.

[0037] At this time, the plurality of piezoelectric elements may be formed into rings with different diameters and arranged in concentric circles.

[0038] At this time, the plurality of piezoelectric elements may be disposed in a hemispherical shape having a predetermined curvature.

[0039] At this time, the matching layer and the block layer may be formed of at least one material selected from the group consisting of plastic, silicon, glass, and epoxy resin, or may be formed of a composite material in which powder having a diameter of several nanometers to hundreds of micrometers is mixed into the material.

[0040] At this time, the lens may have any shape of a concave lens, a convex lens, or a flat lens.

[0041] According to another aspect of the present invention, there is provided an optical ultrasonic device, which includes: a housing; a transparent ultrasonic wave probe module as described above, which is arranged on one side inside the housing; and an optical device, which is arranged on the other side inside the housing, at the other end of the transparent ultrasonic wave probe module, and is coaxially arranged with the transparent ultrasonic wave probe module along the length direction of the housing.

[0042] At this time, the optical ultrasonic wave optical device may further include an optical lens, which is arranged inside the housing and between the optical device and the transparent ultrasonic wave probe module.

[0043] In this case, the optical device may be a camera.

[0044] At this time, the optical device may be a light source.

[0045] Effects of the Invention

[0046] According to the above structure, the optical device according to one aspect of the present invention adopts a structure in which the transparent ultrasonic wave probe module is coaxially arranged with the optical device, thereby improving the signal-to-noise ratio (SNR) and miniaturizing the device.

[0047] In addition, the optical device according to another aspect of the present invention can provide an ultrasonic wave probe module with high transparency by using transparent materials such as lithium niobate.

[0048] In addition, an optical device according to another aspect of the present invention can improve image quality and provide a wide viewing angle by applying a multi-piezoelectric element.

[0049] In addition, an optical device according to still another aspect of the present invention provides an optical device according to a purpose by diversifying the arrangement of multiple piezoelectric elements.

[0050] The effects of the present invention are not limited to the above-mentioned effects, and should be understood to include all effects that can be inferred from the inventive constitution described in the detailed description of the present invention or the scope of the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 A schematic diagram illustrating the state of scanning a sample using a conventional opaque ultrasonic transducer and optical equipment.

[0052] Figure 2 Schematic diagram showing photoacoustic tomographic images and ultrasonic tomographic images that can be obtained when the ultrasonic transducer and the optical device are coaxially arranged and non-coaxially arranged.

[0053] Figure 3 FIG. 1 is a perspective view showing an optical device according to an embodiment of the present invention.

[0054] Figure 4 is a cross-sectional view showing a cross section of an optical device according to an embodiment of the present invention.

[0055] Figure 5 FIG. 1 is a schematic diagram showing a state where an optical device scans an object according to an embodiment of the present invention.

[0056] Figure 6FIG. 1 is a schematic diagram showing an ultrasonic wave probe module provided in an optical device according to a first embodiment of the present invention.

[0057] Figure 7 To show the observation from the direction I-I' Figure 6 The cross section of the ultrasonic probe module and an enlarged schematic diagram of part of the corresponding cross section are shown.

[0058] Figure 8 To show the observation from II-II' direction Figure 6 The cross section of the ultrasonic probe module and an enlarged schematic diagram of part of the corresponding cross section are shown.

[0059] Fig. 9 FIG. 1 is a schematic diagram showing an ultrasonic wave probe module of an optical device according to a second embodiment of the present invention.

[0060] Fig.10 For observation from III-III' direction Fig. 9 The diagram shows a cross section of the second embodiment of the ultrasonic probe module and an enlarged schematic diagram of a portion of the corresponding cross section.

[0061] Fig.11 To show the IV-IV' direction observation Fig. 9 The diagram shows a cross section of the second embodiment of the ultrasonic probe module and an enlarged schematic diagram of a portion of the corresponding cross section.

[0062] Fig.12 To show that from Fig.10 A schematic diagram showing a cross section of an ultrasonic wave probe module of an optical device according to a third embodiment of the present invention and an enlarged schematic diagram of a part of the corresponding cross section when viewed in the same direction.

[0063] Fig.13 FIG. 1 is a schematic diagram of an ultrasonic wave probe module of an optical device showing a first modified example of arrangement of a piezoelectric element of the optical device according to the present invention.

[0064] Fig.14 FIG. 1 is a schematic diagram of an ultrasonic wave probe module of an optical device showing a second modified example of arrangement of a piezoelectric element of the optical device according to the present invention.

[0065] Fig.15 It is a schematic diagram of an ultrasonic wave probe module of an optical device showing a third modified example of the arrangement of the piezoelectric element of the optical device according to the present invention.

[0066] Fig.16 Schematic diagram of an ultrasonic wave probe module of an optical device showing a fourth modified example of arrangement of a piezoelectric element of the optical device according to the present invention.

[0067] Fig.17FIG. 1 is a schematic diagram of an ultrasonic wave probe module of an optical device showing a fifth modified example of the arrangement of the piezoelectric element of the optical device according to the present invention.

[0068] Description of Reference Numerals

[0069] 20: Conventional ultrasonic sensor 21: Ultrasonic beam

[0070] 30: Conventional optical equipment 31: Light beam

[0071] 100: Optical device 200: Transparent ultrasonic wave probe module

[0072] 201: Ultrasonic beam 210: Lens

[0073] 220: matching layer 222: first matching layer

[0074] 224: Second matching layer 230: Piezoelectric element layer

[0075] 240: Block layer 251: Ground substrate

[0076] 252: signal substrate 261: first electrode layer

[0077] 262: Second electrode layer 300: Optical device

[0078] 301: beam 400: housing

[0079] 500: Sample DETAILED DESCRIPTION

[0080] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. The present invention can be implemented in various different ways and is not limited to the embodiments described herein. Parts not related to the description of the five features are omitted in the drawings to clearly describe the present invention. The same reference symbols are attached to the same or similar components throughout the specification.

[0081] The words and terms used in this specification and the scope of protection of the invention are not limited to the conventional or dictionary meanings, but should be interpreted as meanings and concepts that are consistent with the technical ideas of the present invention based on the principle that inventors can define terms and concepts to best describe their inventions.

[0082] In this specification, it should be understood that terms such as "including" or "having" are intended to describe the existence of features, numbers, steps, tasks, components, parts or combinations thereof recorded in the specification, without excluding in advance the existence or additional possibilities of one or more other features or numbers, steps, tasks, components, parts or combinations thereof.

[0083] Unless otherwise specified, a component being located “in front of,” “behind,” “above,” or “below” another component includes not only the case where it is disposed “in front of,” “behind,” “above,” or “below” another component in contact with the other component, but also the case where other components are disposed therebetween. In addition, unless otherwise specified, a component being “connected to” another component includes not only the case where they are directly connected to each other, but also the case where they are indirectly connected to each other.

[0084] An optical device according to an embodiment of the present invention is an optical device for scanning a diagnosis object in a state where a transparently formed ultrasonic wave probe module and an optical device are coaxially arranged.

[0085] Figure 1 A schematic diagram illustrating the state of scanning a sample using a conventional opaque ultrasonic transducer and optical equipment. Figure 2 Schematic diagram showing photoacoustic scanning data and ultrasonic scanning data that can be obtained when the ultrasonic transducer and the optical device are coaxially arranged and non-coaxially arranged. Figure 3 FIG. 1 is a perspective view showing an optical device according to an embodiment of the present invention. Figure 4 is a cross-sectional view showing a cross section of an optical device according to an embodiment of the present invention. Figure 5 Schematic diagram showing a state of scanning a sample by an optical device according to an embodiment of the present invention. Any sample 500 can be any object that can be detected by an optical ultrasonic transducer. For example, the sample 500 can be human tissue or biological tissue of other living organisms.

[0086] Hereinafter, the optical device 100 according to an embodiment of the present invention will be described first, and then the structures of the ultrasonic wave probe module 200 and the optical device 300 constituting the optical device 100 will be described.

[0087] exist Figure 5 , a transparent ultrasonic wave probe module, an optical device and a sample 500 according to an embodiment of the present invention are shown. Figure 5 The sample 500 shown is illustrated as a core of the sample 500 in Figure 5 When viewed in the negative direction of the z-axis, the outer surface of the sample is Figure 5 When viewed from the center, it is in the positive direction of the z-axis.

[0088] Reference Figures 3 to 5 The optical device 100 according to an embodiment of the present invention may coaxially combine the ultrasonic wave probe module 200 and the optical apparatus 300 inside the housing 400 .

[0089] The housing 400 may be formed in a curved shape with the side surface curved in the height direction so that the user can easily hold it during use.

[0090] In addition, an opening is formed at one side of the housing 400 so that the beam emitted from the ultrasonic wave probe module 200 and the optical device 300 provided inside can escape to the outside.

[0091] like Figure 3 As shown, the optical device 100 according to an embodiment of the present invention can be provided in the form of a wireless device, but is not limited thereto and can also be provided in the form of a wired device.

[0092] When the optical device 100 is provided as a wireless device, the other side of the housing 400 can be formed in a sealed manner. Unlike this, when the optical device 100 is provided as a wired device, an opening portion for connecting a cable and a separate support portion can be formed to stably support the cable.

[0093] In addition, refer to Figure 4 A coupling bracket 420 may be provided inside the housing 400 so that the optical device 300 can be stably fixed inside the housing when coupled with the ultrasonic wave probe module 200 .

[0094] The coupling bracket 420 is formed as a part of the housing body 410 and is formed in a manner of surrounding the optical device 300 . The coupling bracket 420 protrudes further than the optical device 300 to one side so as to support the other side of the ultrasonic wave probe module 200 .

[0095] The ultrasonic probe module 200 is located at one side of the housing 400 , and one side of the ultrasonic probe module 200 may be exposed to the outside through an opening portion provided at one side of the housing 400 .

[0096] The lens 210 may be located at a side portion of the ultrasonic wave probe module 200 that can be exposed to the outside.

[0097] like Figure 3 As shown, one side of the lens 210 of the ultrasonic wave probe module 200 is exposed to the outside through the opening of the housing 400 , and the lens 210 and the rest of the ultrasonic wave probe module 200 may be formed to be located inside the housing 400 .

[0098] Reference Figure 4 , an optical device 300 may be provided on the other side of the ultrasonic wave probe module 200. At this time, the ultrasonic wave probe module 200 may be formed of a transparent material that does not interfere with the optical path, so that the ultrasonic wave probe module 200 and the optical device 300 are coaxially combined.

[0099] At this time, the optical device 300 may be provided in the form of a camera for photographing light entering the inside of the housing 400 from the outside, or may be provided in the form of a light source for emitting light from the inside of the housing 400 to the outside.

[0100] However, the optical device 300 is not limited thereto, and may be a device having both camera and light source functions, or may be a combination of a plurality of devices.

[0101] In addition, although not shown in the figure, an optical system may be provided between the ultrasonic probe module 200 and the optical device 300 for setting an optical path suitable for the purpose.

[0102] At this time, the optical system may include a convex lens, a concave lens, a cylindrical lens, a spherical lens, a beam shaper, a beam diffuser, etc., which can change the traveling path of light.

[0103] According to the above-described configuration, in one embodiment of the present invention, the ultrasonic wave probe module 200 and the optical device 300 are coaxially arranged in the housing 400, so that the ultrasonic wave probe module 200 irradiates the sample 500 for scanning and the optical device 300 irradiates the sample 500 for scanning advances in parallel directions, and is different from Figure 1 .

[0104] Therefore, unlike Figure 1 In the case where the images formed by the ultrasonic beam 21 and the beam 31 irradiated from the conventional ultrasonic sensor 20 and the optical device 30 respectively arrive at different positions on the outer surface of the sample 500, when the optical device 100 according to an embodiment of the present invention is used, the image formed by the ultrasonic beam 201 and the image formed by the beam 301 can reach the same position on the outer surface of the sample 500.

[0105] Therefore, when the conventional optical device 100 is used, unlike the region where the light beam 31 fails to reach the ultrasonic beam 21 from the outer surface of the sample 500 to within the predetermined depth L1, as shown in FIG. Figure 5 As shown, when an optical device according to an embodiment of the present invention is used, both ultrasonic image information and optical image information can be obtained along the entire area L3 in the depth direction of the sample 500.

[0106] In addition, the problem of low signal-to-noise ratio caused by the different travel paths of the ultrasonic beam 21 and the light beam 31 in the conventional device can also be solved.

[0107] Photoacoustic scanning data ( Figure 2 (a) of the ) and ultrasound scan data ( Figure 2 The above-mentioned effect can also be confirmed in part (b) of .

[0108] Figure 2Part (a) is the photoacoustic scanning data obtained when the ultrasonic transducer and the optical device are coaxially arranged. Figure 2 Part (b) is ultrasonic scanning data obtained when the ultrasonic transducer and the optical device are coaxially arranged. Figure 2 Part (c) is the photoacoustic scanning data obtained when the ultrasonic transducer and the optical device are not coaxially arranged. Figure 2 Part (d) is ultrasonic scanning data obtained when the ultrasonic transducer and the optical device are not coaxially arranged.

[0109] When compared Figure 2 In the case of parts (a) and (c) of FIG. 1 , as the scanning data obtained in a state where the ultrasonic transducer and the optical device are not coaxially arranged, Figure 2 In part (c), it can be confirmed that the data at the shallower depth is omitted.

[0110] in addition, Figure 2 It can be confirmed from the scan data shown in part (c) that a lot of noise is generated in the deeper portion.

[0111] As described above, there is a problem that when the ultrasonic transducer and the optical device are coaxially combined, the photoacoustic scanning data ( Figure 2 (a) of the ) and ultrasound scan data ( Figure 2 (b) of the same), whereas when the non-coaxial combination of ultrasonic transducer and optical device is used, the photoacoustic scanning data ( Figure 2 (c) of the study) and ultrasound scan data ( Figure 2 (d) of the .

[0112] Hereinafter, the structure of the ultrasonic wave probe module 200 included in the optical device 100 according to the present invention will be described with reference to different drawings.

[0113] Figure 6 FIG. 1 is a schematic diagram showing an ultrasonic wave probe module provided in an optical device according to a first embodiment of the present invention. Figure 7 To show the observation from the direction I-I' Figure 6 The cross section of the ultrasonic probe module and an enlarged schematic diagram of part of the corresponding cross section are shown. Figure 8 To show the observation from II-II' direction Figure 6 The cross section of the ultrasonic probe module and an enlarged schematic diagram of part of the corresponding cross section are shown.

[0114] Reference Figure 3 and Figure 6The ultrasonic probe module 200 that can be set in the optical device according to an embodiment of the present invention is located at a side portion of an opening portion formed with a shell 400, and the lens 210 is set on one side of the ultrasonic probe module 200 so that one side of the lens 210 is exposed to the outside through the opening portion of the shell 400.

[0115] At this time, the lens 210 may be formed in any shape of a concave lens, a convex lens, or a flat lens according to the purpose.

[0116] According to an embodiment of the present invention, the lens 210 of the ultrasonic probe module 200 may be formed of silicon material, or may be formed of gel or plastic or epoxy resin mainly composed of water.

[0117] According to an embodiment of the present invention, a matching layer 220 may be disposed on the other side of the lens of the ultrasonic wave probe module 200 , and a piezoelectric element layer 230 formed of more than one piezoelectric element may be disposed on the other side of the matching layer 220 .

[0118] The matching layer 220 is a medium for irradiating an ultrasonic wave signal generated by the piezoelectric element constituting the piezoelectric element layer 230 , that is, for reducing a difference in acoustic impedance with the sample 500 .

[0119] That is, when an ultrasonic signal is generated for the operation of a piezoelectric element, in order to effectively transmit the ultrasonic signal in water, biological tissue or other media other than air, the acoustic impedance of the corresponding medium can only be adjusted to the maximum extent to minimize the loss of ultrasonic energy.

[0120] The matching layer 220 of this example may be a focused type having an acoustic lens capable of adjusting the focus of light and ultrasonic signals.

[0121] In this case, through the focus adjustment function of the matching layer 220 , the ultrasonic signal reflected by the sample 500 and incident on the transparent ultrasonic wave probe module 200 can be accurately condensed at a desired position of the piezoelectric element.

[0122] Therefore, through the focus adjustment function of the matching layer 220, the focus adjustment of the ultrasonic image obtained by the ultrasonic signal output from the piezoelectric element layer 230 can be achieved, so that a clear ultrasonic image can be obtained.

[0123] Therefore, since the clarity of the image obtained by the operation of the transparent ultrasonic wave probe module 200 is improved, a clear image can be obtained at a desired portion of the sample 500 irradiated with the ultrasonic signal.

[0124] In addition, when the matching layer 220 uses an acoustic lens, the curvature of the surface is constant and the transparency of the surface is improved, so that the loss amount of the ultrasonic signal can be reduced when transmitting and receiving the ultrasonic signal irradiated to the sample 500 or reflected from the sample 500.

[0125] In addition, an additional transmission film or blocking film may be formed on the matching layer 220 as needed, so that only signals of a desired wavelength band can be transmitted or blocked.

[0126] In the case of the matching layer 220 according to one embodiment of the present invention, in order to achieve the above-mentioned purpose, it may be formed into two layers of a first matching layer 222 and a second matching layer 224 .

[0127] The acoustic lens provided in the matching layer 220 may be formed of a material taking acoustic impedance into consideration so as to enable efficient transmission of ultrasonic waves, that is, without reflection between layers.

[0128] For example, the matching layer 220 may be formed of transparent plastic, silicon, glass, epoxy resin, or a composite material in which powder having a diameter of several nanometers to hundreds of micrometers is mixed into the above materials.

[0129] The piezoelectric element layer 230 disposed on the other side of the matching layer 220 may be formed of more than one type of piezoelectric elements.

[0130] A piezoelectric element can generate a piezoelectric effect in which polarization is induced to generate electricity when a mechanical force is applied to the element, and a converse piezoelectric effect in which mechanical movement of contraction and relaxation is induced when a voltage is applied to the element.

[0131] The ultrasonic wave probe module 200 according to one embodiment of the present invention may transmit ultrasonic waves to the sample 500 side and receive ultrasonic waves reflected from the sample 500 to generate corresponding electrical signals by using piezoelectric effect and inverse piezoelectric effect.

[0132] The number of piezoelectric elements constituting the piezoelectric element layer 230 may vary depending on the size of the ultrasonic wave probe module 200. For example, the piezoelectric element layer 230 may be composed of 64 piezoelectric elements, or may be composed of 1024 piezoelectric elements.

[0133] In this case, the plurality of piezoelectric elements may be manufactured by a process of mechanically cutting piezoelectric elements of a relatively large size using a cutter or laser cutting.

[0134] At this time, the piezoelectric element can be formed of lithium niobate (LNO), and can contain not only lithium niobate (LNO) but also transparent piezoelectric materials exhibiting piezoelectric properties such as lead magnesium niobate-lead titanate (PMN-PT), polyvinylidene fluoride (PVDF) and polyvinylidene fluoride-trifluoroethylene (PVDF-TrFE).

[0135] Reference Figure 7 and Figure 8 An electrode layer 260 for transmitting an electrical signal may be formed on one side and the other side of the piezoelectric element layer 230 .

[0136] The electrode layer 260 may include a first electrode layer 261 disposed between one side of the piezoelectric element layer 230 and the other side of the first matching layer 222 , and a second electrode layer 262 disposed between the other side of the piezoelectric element layer 230 and the block layer 240 .

[0137] The first electrode layer 261 and the second electrode layer 262 may be formed by being deposited on the upper and lower surfaces of each piezoelectric element constituting the piezoelectric element layer 230. In addition, the first electrode layer 261 and the second electrode layer 262 may be insulated to prevent electrical short circuits therebetween.

[0138] Like other components of the ultrasonic probe module 200 according to an embodiment of the present invention, the first electrode layer 261 and the second electrode layer 262 may be formed of a transparent material.

[0139] More specifically, the first electrode layer 261 and the second electrode layer 262 can be formed of transparent and conductive materials such as silver nanowire (AgNW), copper nanowire (CuNW), gold nanowire (AuNW), indium-tin-oxide (ITO), carbon nanotubes, and graphene.

[0140] In addition, the first electrode layer 261 and the second electrode layer 262 can be formed to have a thickness of, for example, less than 100 nm.

[0141] In addition, refer to Figures 6 to 8 According to an embodiment of the present invention, a block layer 240 may be disposed on the other side of the second electrode layer 262 of the ultrasonic probe module 200 .

[0142] The block layer 240 may play a damping role to eliminate the ultrasonic noise generated by the ultrasonic wave probe module 200 according to an embodiment of the present invention.

[0143] The ultrasonic beam 201 generated in the piezoelectric element layer 230 travels forward in front of the optical device 100 where the sample 500 is located, but also travels backward in the opposite direction.

[0144] At this time, unlike the ultrasonic beam 201 traveling forward, the ultrasonic beam traveling backward may cause noise to the ultrasonic probe module 200 scanning the sample 500 .

[0145] Furthermore, when the ultrasonic beam 201 traveling forward of the optical device 100 turns over through the sample 500 and returns to the ultrasonic probe module 200 again, it may be re-reflected by the matching layer 220 and the piezoelectric element layer 230. This may cause unnecessary signal interference.

[0146] The block layer 240 may prevent such unnecessary signal interference and attenuate the ultrasonic wave signal toward the other side of the piezoelectric element layer 230 , ie, the rear of the optical device 100 .

[0147] At this time, since the light beam must be allowed to pass through the other side of the block layer 240 , the block layer 240 may also be formed of a transparent material.

[0148] More specifically, the block layer 240 may be formed of plastic, silicon, glass, epoxy resin, and in order to improve the attenuation performance, may also be formed of a composite in which powder having a diameter of several nanometers to hundreds of micrometers is partially doped into the above materials.

[0149] Reference Figures 6 to 8 According to an embodiment of the present invention, the first electrode layer 261 and the second electrode layer 262 of the ultrasonic probe module 200 may be connected to the circuit substrates 251 and 252 respectively.

[0150] The circuit substrate needs to enter the narrow space in the housing 400 of the optical device 100 , and thus can be generally formed of a thin and flexible flexible printed circuit board.

[0151] In the case of the ultrasonic wave probe module 200 according to an embodiment of the present invention, the circuit substrate may be composed of a ground substrate (Ground fpcb) 251 responsible for grounding and a signal substrate (Signal fpcb) 252 responsible for signal transmission.

[0152] The signal substrate 252 may have wires and pads corresponding to each piezoelectric element so as to exchange signals with each piezoelectric element, and each wire and pad may correspond to each piezoelectric element one-to-one.

[0153] At this time, the ground substrate 251 is connected to one side of the first electrode layer 261, and the connection portion can be located between the first electrode layer 261 and the first matching layer 222, and the signal substrate 252 is connected to the other side of the second electrode layer 262, and the connection portion can be located between the second electrode layer 262 and the block layer 240.

[0154] The ground substrate 251 and the signal substrate 252 may also be formed of an opaque material.

[0155] When the ground substrate 251 and the signal substrate 252 are formed of opaque materials, the portion corresponding to the center portion of the piezoelectric element layer 230 through which the ultrasonic beam 201 or the light beam 301 passes is formed in a state in which the ground substrate 251 and the signal substrate 252 remain penetrating, and can be formed to attach the ground substrate 251 and the signal substrate 252 to the edge of the piezoelectric element layer 230.

[0156] When the ground substrate 251 and the signal substrate 252 are formed of a transparent material, they can also be formed in a state of not penetrating a portion corresponding to the center portion of the piezoelectric element layer 230 .

[0157] At this time, refer to Figure 7 and Figure 8 The portion where the ground substrate 251 is connected to the first electrode layer 261 and the portion where the signal substrate 252 is connected to the second electrode layer 262 can be formed in a state where the gold foil 255 of the circuit substrate is exposed.

[0158] Except for the portion where the ground substrate 251 is connected to the first electrode layer 261 and the portion where the signal substrate 252 is connected to the second electrode layer 262, the remaining portions of the ground substrate 251 and the signal substrate 252 can be insulated except for the connection portion between the connector portion of the optical device 100 connected to each circuit substrate.

[0159] At this time, the thickness of the ground substrate 251 and the signal substrate 252 may be less than 50 μm, and the thickness of the gold foil 255 may be less than 100 nm.

[0160] The stacked structure described above may be applied to each piezoelectric element constituting each piezoelectric element layer 230. Figure 6 and Figure 8 , when a plurality of piezoelectric elements are arranged in a row, each piezoelectric element and the stacked structure can be arranged at a predetermined interval, as shown in the figure.

[0161] Fig. 9 FIG. 1 is a schematic diagram showing an ultrasonic wave probe module of an optical device according to a second embodiment of the present invention. Fig.10 To show the observation from the III-III' direction Fig. 9 The diagram shows a cross section of the second embodiment of the ultrasonic probe module and an enlarged schematic diagram of a portion of the corresponding cross section. Fig.11 To show the observation from IV-IV' direction Fig. 9 The cross section of the second embodiment of the ultrasonic probe module and the enlarged schematic diagram of part of the corresponding cross section are shown. When describing other embodiments of the present invention below, the detailed description of the same structure as the above embodiment will be omitted, and the various embodiments of the present invention will be described with the structure different from the above embodiment as the center.

[0162] Refer to Figures 9 to 11The ultrasonic wave probe module 200 according to the second embodiment of the present invention is shown in FIG. 1 , in which a matching layer 220, a piezoelectric element layer 230 and a block layer 240 are sequentially arranged from the lens 210 to the other side. Figures 6 to 8 The ultrasonic wave probe module 200 shown in the first embodiment is the same.

[0163] However, unlike Figures 6 to 8 The ultrasonic wave probe module 200 shown in FIG. Figures 9 to 11 In the illustrated variation of the ultrasonic wave probe module 200 , the circuit substrate may be formed of only the signal substrate 252 , without requiring a ground substrate.

[0164] At this time, refer to Fig.10 In a modified example of the ultrasonic wave probe module 200 according to an embodiment of the present invention, a grounding gold foil 253 may be provided to replace the grounding substrate with the gold foil.

[0165] One end of the grounding gold foil 253 may be connected to the first electrode layer 261 , and the other end may be connected to the signal substrate 252 .

[0166] At this time, refer to Fig.10 In order to prevent short circuit between the grounding gold foil 253 and other components, an insulating member 254 may be provided in the space between the piezoelectric element layer 230 , the second electrode layer 262 , and the gold foil 255 of the signal substrate 252 and the grounding gold foil 253 .

[0167] According to an embodiment of the present invention, the ultrasonic probe module 200 can apply pressure after applying an adhesive member such as epoxy resin to the circuit substrate or gold foil, thereby bonding the circuit substrate or gold foil to the piezoelectric element layer 230 .

[0168] At this time, the thickness of the adhesive layer formed by the adhesive member used for bonding is the same as the thickness of the circuit board or gold foil to be bonded.

[0169] At this time, the adhesive member may affect the ultrasonic scanning data detected by the ultrasonic wave probe module 200, so the thinner the adhesive layer is, the more ultrasonic scanning data without noise or distortion can be obtained.

[0170] Unlike the case where the circuit substrate can be formed to a thickness of 50 μm, the thickness of the gold foil can be formed to a thickness of less than 100 nm. Figures 9 to 11 When the ultrasonic probe module 200 shown in the figure is constructed in the same manner as the Figures 6 to 8 Compared with the structure of the ultrasonic probe module 200 shown in the figure, a thinner adhesive layer can be formed.

[0171] Therefore, there is an advantage that more accurate ultrasonic scan data can be obtained when the structure according to the corresponding modification example is adopted.

[0172] Fig.12 To show that from Fig.10 A schematic diagram showing a cross section of an ultrasonic wave probe module of an optical device according to a third embodiment of the present invention and an enlarged schematic diagram of a part of the corresponding cross section when viewed in the same direction.

[0173] Reference Fig.12 In the case of the third embodiment, the block layer 240 disposed on the other side of the piezoelectric element layer 230 has a wider width than the piezoelectric element layer 230 , the matching layer 220 , and the lens 210 .

[0174] Therefore, unlike Figures 6 to 11 In the ultrasonic probe module 200 shown, the signal substrate 252 does not interfere with the piezoelectric element layer 230 and the block layer 240 , and the piezoelectric element layer 230 and the signal substrate 252 can be connected at the side of the piezoelectric element layer 230 .

[0175] In this case, for electrical connection between the piezoelectric element layer 230 and the signal substrate 252 , a gold foil 255 protruding from the signal substrate 252 may be provided between the piezoelectric element layer 230 and the block layer 240 .

[0176] In this case, unlike the case where the signal substrate can be formed to a thickness of 50μm, the thickness of the gold foil can be less than 100nm, so in this modification, the signal substrate 252 can interfere between the piezoelectric element layer 230 and the block layer 240 to minimize the impact on the transmission and reception of ultrasonic waves.

[0177] In addition, in this modification, Figures 9 to 11 The same as the ultrasonic probe module 200 shown in FIG. 1 is adopted in that the grounding gold foil 253 is used instead of the grounding substrate. Figures 6 to 8 Compared with the structure of the ultrasonic probe module 200 shown in the figure, a thinner adhesive layer can be formed.

[0178] The stacked structure of the ultrasonic probe module 200 described above is also applicable to additional modified examples in which the arrangement of the piezoelectric elements constituting the piezoelectric element layer 230 is changed.

[0179] Fig.13 FIG. 1 is a schematic diagram of an ultrasonic wave probe module of an optical device showing a first modified example of arrangement of a piezoelectric element of the optical device according to the present invention. Fig.14 FIG. 1 is a schematic diagram of an ultrasonic wave probe module of an optical device showing a second modified example of arrangement of a piezoelectric element of the optical device according to the present invention. Fig.15 A schematic diagram of an ultrasonic wave probe module of an optical device according to a third modified example of the arrangement of the piezoelectric element of the optical device of the present invention. Fig.16Schematic diagram of an ultrasonic wave probe module of an optical device showing a fourth modified example of arrangement of a piezoelectric element of the optical device according to the present invention. Fig.17 FIG. 1 is a schematic diagram of an ultrasonic wave probe module of an optical device showing a fifth modified example of the arrangement of the piezoelectric element of the optical device according to the present invention.

[0180] Reference Fig.13 The piezoelectric elements constituting the piezoelectric element layer 230 may be arranged in a convex shape.

[0181] When the piezoelectric element layer 230 is convex, the lens 210, the matching layer 220, and the block layer 240 are also convex.

[0182] In this case, there is an advantage that the ultrasonic wave probe module 200 can irradiate a wider area.

[0183] As described above, when the piezoelectric element layer 230 and the lens 210, the matching layer 220 and the block layer 240 of the ultrasonic probe module 200 are convex in shape, the stacking order and transparency of the ultrasonic probe module 200 and the positional relationship between the optical device 300 in the housing 400 can also be the same as the case where the piezoelectric element layer 230 is set without deformation.

[0184] Therefore, if Fig.13 As shown, in the case of the first modification of the piezoelectric element layer 230 of the ultrasonic wave probe module 200 according to one embodiment of the present invention, light can also pass through the ultrasonic wave probe module 200 from the optical device 300 in the housing to travel to the outside of the housing.

[0185] Reference Fig.14 The piezoelectric elements constituting the piezoelectric element layer 230 may be arranged in a concave shape.

[0186] When the piezoelectric element layer 230 is concave, the lens 210, the matching layer 220, and the block layer 240 may also be concave.

[0187] In this case, there is an advantage that the ultrasonic probe module 200 can focus on irradiating a narrower area.

[0188] As described above, when the piezoelectric element layer 230, the lens 210, the matching layer 220 and the block layer 240 of the ultrasonic probe module 200 are convex, Fig.13 The stacking order and transparency of the ultrasonic probe module 200 and the positional relationship between the optical device 300 in the housing 400 may also be the same as the case where the piezoelectric element layer 230 is not deformed.

[0189] Therefore, if Fig.14As shown, in the case of the second modification of the piezoelectric element layer 230 of the ultrasonic wave probe module 200 according to one embodiment of the present invention, light can pass through the ultrasonic wave probe module 200 from the optical device 300 in the housing to proceed to the outside of the housing.

[0190] As mentioned above, Figures 15 to 17 The third to fifth modified examples in which the arrangement of the piezoelectric element layer 230 is modified are also the same, and light can pass through the ultrasonic wave probe module 200 from the optical device 300 in the housing to travel to the outside of the housing.

[0191] Reference Fig.15 The piezoelectric elements constituting the piezoelectric element layer 230 may be arranged in a shape of a horizontally and vertically two-dimensional plane (2D Matrix).

[0192] In this case, as described above, the stacked structure of the ultrasonic wave probe modules 200 arranged in one direction may be arranged in two-dimensional directions, horizontally and vertically.

[0193] In this case, there is an advantage that the ultrasonic probe module 200 can more easily obtain a three-dimensional image.

[0194] Reference Fig.16 The piezoelectric elements constituting the piezoelectric element layer 230 may be formed into rings with different radii and arranged in a concentric circle (Annular) shape.

[0195] In this case, according to each of the piezoelectric elements being in a ring shape, the lens 210 , the matching layer 220 , and the block layer 240 may also be in a ring shape.

[0196] Reference Fig.17 The piezoelectric elements constituting the piezoelectric element layer 230 may be arranged in a hemisphere shape.

[0197] In this case, as described above, the stacked structure of the ultrasonic wave probe modules 200 arranged in one direction may dispose each piezoelectric element in an arrangement.

[0198] In this case, with Fig.14 Compared with the modified example shown, the ultrasonic probe module 200 has the advantage of being able to irradiate a narrower position more intensely and concentratedly.

[0199] By adopting the structure as described above, unlike a conventional optical device that non-coaxially combines an ultrasonic transducer and an optical device, the optical device 100 according to one embodiment of the present invention can improve a signal-to-noise ratio and can miniaturize the device.

[0200] In addition, the optical device 100 according to one embodiment of the present invention can obtain ultrasonic image information and optical image information that are consistent with each other along the entire area L3 in the depth direction of the sample 500.

[0201] Therefore, images with various information can be obtained simultaneously, thereby improving the accuracy of lesion diagnosis.

[0202] At the same time, the optical device 100 according to an embodiment of the present invention can work in a wider area, for example, using characteristics such as light absorption and light scattering to target specific tissues through optical marking to generate image information, or using the degree of light absorption to measure oxygen saturation, etc.

[0203] In addition, the optical device 100 according to an aspect of the present invention can improve image quality and provide a wide viewing angle by applying a multi-piezoelectric element.

[0204] In addition, the optical device 100 according to another aspect of the present invention can achieve provision of an optical device according to a purpose by diversifying the arrangement of the multiple piezoelectric elements.

[0205] An embodiment of the present invention is described above, but the spirit of the present invention is not limited to the embodiment presented in this specification. Ordinary technicians in the field who understand the spirit of the present invention can easily propose other embodiments within the same scope of the idea by adding, changing, deleting, and appending components, but this also falls within the scope of the idea of ​​the present invention.

Claims

1. A transparent ultrasonic wave probe module arranged inside a housing of an optical device, wherein: include: A lens is disposed at one side of the housing, is formed of a transparent material and is disposed in a manner of exposing one side to the outside of the housing; A first matching layer, formed of a transparent material and disposed on the other side of the lens; A piezoelectric element layer, disposed on the first matching layer, comprising a plurality of transparent piezoelectric elements capable of mutually converting electrical signals and mechanical signals; A first electrode layer and a second electrode layer, formed of a transparent material, are respectively disposed on one side and the other side of the piezoelectric element layer and transmit electrical signals; A circuit substrate connected to the first electrode layer and the second electrode layer, formed of a bendable material, and capable of exchanging electrical signals with the piezoelectric element; as well as The block layer is disposed on the second electrode layer, is formed of a transparent material and is used to eliminate ultrasonic noise.

2. The transparent ultrasonic wave probe module according to claim 1, wherein: A second matching layer formed of a transparent material is further arranged between the first matching layer and the lens.

3. The transparent ultrasonic wave probe module according to claim 1, wherein: The circuit substrate is formed of a transparent material.

4. The transparent ultrasonic wave probe module according to claim 1, wherein: The circuit substrate is composed of a ground substrate and a signal substrate.

5. The transparent ultrasonic wave probe module according to claim 4, wherein: The ground substrate is connected to the first electrode layer between the first electrode layer and the first matching layer. The signal substrate is connected to the second electrode layer between the second electrode layer and the block layer.

6. The transparent ultrasonic wave probe module according to claim 1, wherein: The circuit substrate is composed of a gold foil plate responsible for the grounding function and a signal substrate.

7. The transparent ultrasonic wave probe module according to claim 6, wherein: The gold foil plate is connected to the first electrode layer between the first electrode layer and the first matching layer. The signal substrate is connected to the second electrode layer between the second electrode layer and the block layer.

8. The transparent ultrasonic wave probe module according to claim 7, wherein: The block layer is formed to have a wider surface than the piezoelectric element layer and the second electrode layer, The signal substrate is provided on a portion of the upper surface of the block layer that protrudes from the piezoelectric element layer and the second electrode layer, and is connected via the second electrode layer and a conductive material.

9. The transparent ultrasonic wave probe module according to claim 1, wherein: A plurality of piezoelectric elements constituting the piezoelectric element layer are arranged in a row.

10. The transparent ultrasonic wave probe module according to claim 9, wherein: The plurality of piezoelectric elements are arranged in a row and in an upwardly convex arch shape.

11. The transparent ultrasonic wave probe module according to claim 9, wherein: The plurality of piezoelectric elements are arranged in a row and in an upwardly concave "U" shape.

12. The transparent ultrasonic wave probe module according to claim 1, wherein: The plurality of piezoelectric elements constituting the piezoelectric element layer are arranged in a lattice pattern in the horizontal and vertical directions.

13. The transparent ultrasonic wave probe module according to claim 1, wherein: A plurality of piezoelectric elements constituting the piezoelectric element layer are arranged in a circle.

14. The transparent ultrasonic wave probe module according to claim 13, wherein: The plurality of piezoelectric elements are respectively formed into rings with different diameters and are arranged in concentric circles.

15. The transparent ultrasonic wave probe module according to claim 13, wherein: The plurality of piezoelectric elements are arranged in a hemispherical shape having a predetermined curvature.

16. The transparent ultrasonic wave probe module according to claim 1, wherein: The matching layer and the block layer are formed of at least one material selected from the group consisting of plastic, silicon, glass, and epoxy resin, or a composite material in which powder having a diameter of several nanometers to hundreds of micrometers is mixed into the material.

17. The transparent ultrasonic wave probe module according to claim 1, wherein: The lens has any one of a concave lens, a convex lens, and a flat lens.

18. A photo-ultrasonic optical device, wherein: include: shell; The transparent ultrasonic wave probe module according to any one of claims 1 to 7, arranged on one side inside the housing; as well as The optical device is arranged at the other side of the interior of the shell and is coaxially arranged with the transparent ultrasonic wave probe module along the length direction of the shell.

19. The photo-ultrasonic wave optical device according to claim 18, wherein: The device also includes an optical lens, which is arranged inside the shell and between the optical device and the transparent ultrasonic wave probe module.

20. The photo-ultrasonic wave optical device according to claim 18, wherein: The optical device is a camera.

21. The photo-ultrasonic wave optical device according to claim 18, wherein: The optical device is a light source that irradiates light.

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