Insulation withstand voltage detection circuit, insulation withstand voltage measurement system and measurement equipment

Abstract

The present application discloses an insulation withstand voltage detection circuit, an insulation withstand voltage measurement system and a measurement device. A plurality of test loops are formed by controlling a measurement circuit, a multi-way switch circuit and a plurality of test probe groups. Each test probe group is connected to two ends of the measurement circuit via at least two switch circuits. The measurement circuit can detect the electrical parameters of each test loop. Finally, the main control circuit determines the state of the test loop according to the electrical parameters of the test loop, so as to detect whether each test loop has an abnormal state such as poor contact. In addition, when a plurality of test probe groups are connected to a product to be tested, the insulation withstand voltage detection can be performed on the product to be tested by setting a corresponding test loop, thereby achieving the purpose of insulation withstand voltage detection and circuit self-test based on the same insulation withstand voltage detection circuit, thereby improving the self-test efficiency and detection accuracy of the insulation withstand voltage detection circuit.

Description

Technical Field

[0001] The present application relates to the field of circuit technology, and in particular to an insulation withstand voltage detection circuit, an insulation withstand voltage measurement system and a measurement device. Background Art

[0002] In the insulation and withstand voltage measurement system, the voltage measurement circuit is considered normal when the data collected by the voltmeter and voltage acquisition board is between 3-5V, and the withstand voltage circuit is considered normal when the high voltage value collected by the withstand voltage instrument is within the calibration range. After the relevant insulation and withstand voltage measurement system passes the external calibration of the instrument, the measurement system is used to test the product, and the test value of the product is detected to determine whether the circuit is connected.

[0003] However, in the related art, the reliability of the measurement system itself is only confirmed through measurement system analysis (MSA). If there is no reliable method to detect equipment failure or instrument distortion in the production process, there may be problems with detection anomalies. Summary of the invention

[0004] In view of the above problems, the present application provides an insulation withstand voltage detection circuit, an insulation withstand voltage measurement system and a measuring device, aiming to solve the problem of low fault detection efficiency when problems occur in related measurement systems.

[0005] A first aspect of an embodiment of the present application provides an insulation withstand voltage detection circuit, the insulation withstand voltage detection circuit comprising: a measurement circuit, a multi-way switch circuit, a plurality of test probe groups and a main control circuit;

[0006] The measuring circuit and the multiple switch circuits are controlled by the main control circuit, and each of the test probe groups is connected to two ends of the measuring circuit via at least two switch circuits;

[0007] The test probe group and the switch circuit form a test loop, and the measurement circuit is used to measure electrical parameters of the test loop;

[0008] The main control circuit is used to determine the state of the test loop according to the electrical parameters of the test loop.

[0009] In the technical scheme of the embodiment of the present application, multiple test loops are formed by controlling a measurement circuit, a multi-way switch circuit, and multiple test probe groups. Each test probe group is connected to the two ends of the measurement circuit via at least two switch circuits. The measurement circuit can detect the electrical parameters of each test loop. The electrical parameters may include the impedance value of the test loop or the voltage value between the two probe test groups. Finally, the main control circuit determines the state of the test loop according to the electrical parameters of the test loop, so as to detect whether each test loop has abnormal conditions such as poor contact. In addition, when a product to be tested is connected between the two probe test groups, the insulation withstand voltage test can be performed on the product to be tested by setting a corresponding test loop, thereby achieving the purpose of insulation withstand voltage test and circuit self-test based on the same insulation withstand voltage detection circuit.

[0010] In some embodiments, the plurality of test probe groups include a first test probe group and a second test probe group; and the plurality of switch circuits include:

[0011] a first switch circuit, wherein the first end of the measuring circuit is connected to a first test probe set via the first switch circuit;

[0012] a first acquisition loop, through which the second end of the measurement circuit is connected to the first test probe group;

[0013] a second switch circuit, wherein the second end of the measuring circuit is connected to a second test probe set via the second switch circuit;

[0014] a second acquisition loop, wherein the first end of the measurement circuit is connected to the second test probe group via the second acquisition loop;

[0015] The switch states of the first switch circuit, the second switch circuit, the first acquisition loop and the second acquisition loop are controlled by the main control circuit to form a corresponding test loop.

[0016] In the technical solution of the embodiment of the present application, the first switch circuit, the first acquisition loop and the measurement circuit can be controlled by the main control circuit to form a test loop, and the detection of the first switch circuit, the first acquisition loop and the first test probe group is realized. When the loop impedance value detected by the measurement circuit is abnormal, it indicates that the first switch circuit, the second acquisition loop and the first test probe group have a poor contact or other fault. The second switch circuit, the second acquisition loop and the measurement circuit are controlled by the main control circuit to form another test loop. When the corresponding loop impedance value detected by the measurement circuit is abnormal, it indicates that the second switch circuit, the second acquisition loop and the second test probe group have a poor contact or other fault. By controlling the states of the first switch circuit, the second switch circuit, the first acquisition loop and the second acquisition loop through the main control circuit, and combining the working mode of the measurement circuit, the fault detection of the test loop can be realized, and the insulation withstand voltage test of the product to be tested can also be realized.

[0017] In some embodiments, the insulation withstand voltage detection circuit further includes:

[0018] A voltage acquisition board is connected to the test loop and the main control circuit, and is used to detect the voltage between the two test probe groups to obtain an acquisition board voltage; the main control circuit determines the state of the test loop based on the voltage value measured by the measurement circuit and the acquisition board voltage measured by the voltage acquisition board.

[0019] In the technical solution of the embodiment of the present application, when the measurement circuit works in the voltage measurement mode, the voltage between the two test probe groups can be detected by the voltage acquisition board and the measurement circuit at the same time, and the two groups of voltage detection values ​​can be compared. In this way, the main control circuit can determine the state of the test loop according to the voltage value measured by the measurement circuit and the acquisition board voltage measured by the voltage acquisition board, so that the reliability of the self-test system can be detected in real time and the system feedback results can be obtained.

[0020] In some embodiments, a voltage acquisition board is connected between the first acquisition loop and the second acquisition loop, the second end of the voltage acquisition board is connected to the first test probe group via the first acquisition loop, and the first end of the voltage acquisition board is connected to the second test probe group via the second acquisition loop.

[0021] In the technical solution of the embodiment of the present application, the first end of the voltage acquisition board is connected to the second test probe group via the second acquisition loop, and the second end of the voltage acquisition board is connected to the first test probe group via the first acquisition loop. When the first test probe group and the second test probe group are connected to the product to be tested, the first end and the second end of the voltage acquisition board can detect the voltage of the product to be tested via the corresponding acquisition loop, and obtain the corresponding acquisition board voltage and upload it to the main control circuit. In this embodiment, an independent voltage acquisition board is added, so that there are two independent and unconnected test loops in the corresponding loop channel. Since the voltage test loop of the measurement circuit and the voltage test loop of the voltage acquisition board are independent, they can not interfere with each other in the process of realizing dual voltage sampling, thereby increasing the accuracy of self-test.

[0022] In some embodiments, the first acquisition circuit includes a first main board relay and a second main board relay;

[0023] The second end of the voltage collection board is connected to the second end of the measurement circuit via the first main board relay, and the second end of the voltage collection board is connected to the first test probe group via the second main board relay.

[0024] In the technical solution of the embodiment of the present application, the second end of the measuring circuit is connected to the first test probe group via the first main board relay and the second main board relay, and the first end of the measuring circuit is connected to the first test probe group via the first switch circuit. In this way, a test loop can be formed by the first switch circuit, the first main board relay, the second main board relay and the first test probe group, and the contact state between the probes in the first test probe group is detected by the measuring circuit. In addition, when the first test probe group and the second test probe group are connected to the product to be tested, the first end and the second end of the voltage acquisition board can detect the voltage of the product to be tested via the corresponding acquisition loop, and the corresponding acquisition board voltage is obtained and uploaded to the main control circuit. By adding an independent voltage acquisition board, two independent and unconnected test loops exist in the corresponding loop channel. Since the voltage test loop of the measuring circuit and the voltage test loop of the voltage acquisition board are independent, they can not interfere with each other in the process of realizing dual voltage sampling, thereby increasing the accuracy of self-test.

[0025] In some embodiments, the first acquisition loop further includes a first sub-board relay, and the sub-board relay is connected between the first test probe group and the second main board relay.

[0026] In the technical solution of the embodiment of the present application, by adding a first sub-board relay on the sub-board, corresponding control switches can be set on the main board and the sub-board, and the conduction and shutdown of the test circuit can be controlled by the main board and the sub-board respectively, and multiple sub-board relays and multiple test probe groups can be set on the sub-board, which facilitates the expansion of the test system and helps to improve the reliability of the test system.

[0027] In some embodiments, the second acquisition circuit includes a third main board relay and a fourth main board relay;

[0028] The first end of the voltage collection board is connected to the first end of the measurement circuit via the third main board relay, and the first end of the voltage collection board is connected to the second test probe group via the fourth main board relay.

[0029] In the technical solution of the embodiment of the present application, the first end of the measuring circuit is connected to the second test probe group via the third main board relay and the fourth main board relay, and the second end of the measuring circuit is connected to the first test probe group via the second switch circuit. In this way, a test loop can be formed by the second switch circuit, the third main board relay, the fourth main board relay and the second test probe group, and the contact state between the probes in the second test probe group is detected by the measuring circuit. In addition, when the first test probe group and the second test probe group are connected to the product to be tested, the first end and the second end of the voltage acquisition board can detect the voltage of the product to be tested via the corresponding acquisition loop, and the corresponding acquisition board voltage is obtained and uploaded to the main control circuit. By adding an independent voltage acquisition board, two independent and unconnected test loops exist in the corresponding loop channel. Since the voltage test loop of the measuring circuit and the voltage test loop of the voltage acquisition board are independent, they can not interfere with each other in the process of realizing dual voltage sampling, thereby increasing the accuracy of self-test.

[0030] In some embodiments, the second acquisition loop further includes a second sub-board relay, and the second sub-board relay is connected between the fourth main board relay and the second test probe group.

[0031] In the technical solution of the embodiment of the present application, by adding a second sub-board relay on the sub-board, corresponding control switches can be set on the main board and the sub-board, and the conduction and shutdown of the test circuit can be controlled by the main board and the sub-board respectively, and multiple sub-board relays and multiple test probe groups can be set on the sub-board, which facilitates the expansion of the test system and helps to improve the reliability of the test system.

[0032] In some embodiments, the first switch circuit includes a fifth mainboard relay connected between the first end of the measurement circuit and the first test probe set.

[0033] In the technical solution of the embodiment of the present application, the first end of the measuring circuit is connected to the first test probe group via the fifth main board relay, and the second end of the measuring circuit is connected to the first test probe group via the second switch circuit. In this way, a test loop can be formed by the second switch circuit, the fifth main board relay, the first test probe group and the second test probe group. The voltage of the product to be tested connected between the first test probe group and the second test probe group is detected by the measuring circuit to determine the insulation withstand voltage state of the product to be tested. In addition, when the first test probe group and the second test probe group are connected to the product to be tested, the first end and the second end of the voltage acquisition board can detect the voltage of the product to be tested via the corresponding acquisition loop, and the corresponding acquisition board voltage is obtained and uploaded to the main control circuit. By adding an independent voltage acquisition board, two independent and unconnected test loops exist in the corresponding loop channel. Since the voltage test loop of the measuring circuit and the voltage test loop of the voltage acquisition board are independent, they can not interfere with each other in the process of realizing dual voltage sampling, thereby increasing the accuracy of self-test.

[0034] In some embodiments, the first switch circuit further includes a third sub-board relay, and the third sub-board relay is connected between the fifth main board relay and the first test probe group.

[0035] In the technical solution of the embodiment of the present application, by adding a third sub-board relay on the sub-board, corresponding control switches can be set on the main board and the sub-board, and the conduction and shutdown of the test circuit can be controlled by the main board and the sub-board respectively, and multiple sub-board relays and multiple test probe groups can be set on the sub-board, which facilitates the expansion of the test system and helps to improve the reliability of the test system.

[0036] In some embodiments, the second switch circuit includes a sixth main board relay connected between the second end of the measurement circuit and the second test probe set.

[0037] In the technical solution of the embodiment of the present application, the second end of the measuring circuit is connected to the second test probe group via the sixth main board relay, and the first end of the measuring circuit is connected to the first test probe group via the first switch circuit. In this way, a test loop can be formed by the first switch circuit, the sixth main board relay, the first test probe group and the second test probe group. The voltage of the product to be tested connected between the first test probe group and the second test probe group is detected by the measuring circuit to determine the insulation withstand voltage state of the product to be tested. In addition, when the first test probe group and the second test probe group are connected to the product to be tested, the first end and the second end of the voltage acquisition board can detect the voltage of the product to be tested via the corresponding acquisition loop, and the corresponding acquisition board voltage is obtained and uploaded to the main control circuit. By adding an independent voltage acquisition board, two independent and unconnected test loops exist in the corresponding loop channel. Since the voltage test loop of the measuring circuit and the voltage test loop of the voltage acquisition board are independent, they can not interfere with each other in the process of realizing dual voltage sampling, thereby increasing the accuracy of self-test.

[0038] In some embodiments, the second switch circuit further includes a fourth sub-board relay connected between the sixth main board relay and the second test probe set.

[0039] In the technical solution of the embodiment of the present application, by adding a fourth sub-board relay on the sub-board, corresponding control switches can be set on the main board and the sub-board, and the conduction and shutdown of the test circuit can be controlled by the main board and the sub-board respectively, and multiple sub-board relays and multiple test probe groups can be set on the sub-board, which facilitates the expansion of the test system and helps to improve the reliability of the test system.

[0040] In some embodiments, when the main control circuit operates in the self-test mode, the main control circuit controls the switch state of the multi-way switch circuit to form a multi-way test loop, and controls the measurement circuit to detect the loop impedance value of each of the test loops.

[0041] In the technical scheme of the embodiment of the present application, each test probe group is connected to the two ends of the measurement circuit via at least two switching circuits, the switching state of the switching circuit is controlled by the main control circuit, and the main control circuit enters the self-test mode after the insulation withstand voltage detection circuit is started. In this way, multiple test loops are formed by controlling the switching state of the multi-way switching circuit, and the loop impedance value of each test loop is detected by the measurement circuit to achieve the purpose of self-testing the function of each switching circuit. For example, the multiple test probe groups include a first test probe group and a second test probe group. Since the first test probe group and the second test probe group are respectively connected to the corresponding test loops, the multiple test probes in the first test probe group and the second test probe group are connected to the corresponding metal contacts in common. The first test probe group can be connected to the two ends of the measurement circuit via two switching circuits to form a test loop, and the second test probe group can be connected to the two ends of the measurement circuit via another two switching circuits to form a test loop. By testing the loop impedance value of the corresponding test loop, it can be determined whether the test probes in the test probe group have contact failures.

[0042] In some embodiments, the main control circuit is used to determine that the test loop fails when the loop impedance value exceeds a first preset threshold range.

[0043] In the technical solution of the embodiment of the present application, the switch circuit can be equivalent to a wire when it is turned on. Therefore, when the multi-way switch circuit is controlled by the main control circuit and the test probe group to form a test loop, the impedance value of the test loop is low. If the loop impedance value in the corresponding test loop exceeds the first preset threshold range, it means that there are faults such as abnormal components or poor contact in the test loop. For example, the first switch circuit and the second switch circuit can be equivalent to a wire when the switches inside them are turned on. The first acquisition loop and the second acquisition loop can be equivalent to a wire when the switches inside them are turned on. Therefore, when the first switch circuit, the second switch circuit, the first acquisition loop, and the second acquisition loop are controlled by the main control circuit to form a corresponding test loop, if the loop impedance value in the corresponding test loop exceeds the first preset threshold range, it means that there are faults such as poor switch contact in the first switch circuit, the second switch circuit, the first acquisition loop, and the second acquisition loop.

[0044] In some embodiments, the main control circuit is also used to control the switching states of the first switching circuit, the second switching circuit, the first acquisition loop, and the second acquisition loop to form a multi-path test loop, and control the measurement circuit and the voltage acquisition board to detect the voltage value of each of the test loops.

[0045] In the technical solution of the embodiment of the present application, when the main control circuit works in the dual voltage detection mode, two independent and unconnected test loops can be formed by the measurement circuit and the voltage acquisition board respectively. Since the voltage test loop of the measurement circuit and the voltage test loop of the voltage acquisition board are independent, they can implement dual voltage sampling without interfering with each other, thereby increasing the accuracy of self-test.

[0046] In some embodiments, the main control circuit is used to determine that the test loop has a fault when the difference between the voltage values ​​of each test loop detected by the measurement circuit and the voltage acquisition board exceeds a second preset threshold range.

[0047] In the technical solution of the embodiment of the present application, the measurement circuit and the voltage acquisition board respectively form two independent and unconnected test circuits. Since the voltage test circuit of the measurement circuit and the voltage test circuit of the voltage acquisition board are independent, they can not interfere with each other in the process of realizing dual voltage sampling. When the difference between the real-time voltage values ​​collected by the measurement circuit and the voltage acquisition board exceeds the second preset threshold range, it also indicates that the test circuit in the insulation withstand voltage detection circuit has an abnormal fault during the self-test process, reminding the user to perform self-test troubleshooting to increase the accuracy of self-test.

[0048] A second aspect of the embodiments of the present application further provides an insulation withstand voltage measurement system, the insulation withstand voltage measurement system comprising an insulation withstand voltage detection circuit as described in any of the above embodiments.

[0049] A third aspect of the embodiments of the present application further provides a measuring device, comprising the insulation withstand voltage detection circuit as described in any of the above embodiments.

[0050] In the technical scheme of the embodiment of the present application, the insulation withstand voltage detection circuit is connected between the first test probe group and the second test probe group, and multiple test loops are formed by controlling the measurement circuit, the multi-way switch circuit, and multiple test probe groups. Each test probe group is connected to the two ends of the measurement circuit through at least two switch circuits. The measurement circuit can detect the electrical parameters of each test loop, and finally the main control circuit determines the state of the test loop according to the electrical parameters of the test loop, so as to detect whether each test loop has abnormal conditions such as poor contact, and when multiple test probe groups are connected to the product to be tested, the insulation withstand voltage detection can be performed on the product to be tested by setting the corresponding test loop, thereby achieving the purpose of insulation withstand voltage detection and circuit self-test based on the same insulation withstand voltage detection circuit, thereby improving the self-test efficiency and detection accuracy of the insulation withstand voltage detection circuit.

[0051] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0053] Figure 1 A first structural schematic diagram of an insulation withstand voltage detection circuit provided in an embodiment of the present application;

[0054] Figure 2 A second structural schematic diagram of the insulation withstand voltage detection circuit provided in an embodiment of the present application;

[0055] Figure 3 A third structural schematic diagram of the insulation withstand voltage detection circuit provided in an embodiment of the present application;

[0056] Figure 4 A fourth structural schematic diagram of the insulation withstand voltage detection circuit provided in an embodiment of the present application;

[0057] Figure 5 A fifth structural schematic diagram of the insulation withstand voltage detection circuit provided in the embodiment of the present application;

[0058] Figure 6 A sixth structural schematic diagram of the insulation withstand voltage detection circuit provided in an embodiment of the present application;

[0059] Figure 7 A seventh structural schematic diagram of the insulation withstand voltage detection circuit provided in an embodiment of the present application. DETAILED DESCRIPTION

[0060] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0061] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0062] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0063] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The phrase "second connection port" at various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0064] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0065] In the description of the embodiments of the present application, the term "multi-frame" refers to more than two (including two).

[0066] During normal production, on-site personnel have insufficient understanding of the test circuit product circuits of the test equipment and are unable to identify how to use the reliability circuit self-test of the measurement system. Design and development personnel only use it according to on-site process function requirements and do not consider how to use the equipment circuit's own characteristics to perform self-test confirmation after a failure in the process. As a result, after the equipment fails in the process, personnel are required to troubleshoot the entire process of the equipment in order to locate the problem.

[0067] At present, the insulation and voltage withstand test system mainly relies on the annual external calibration of the instrument and a measurement system analysis (MSA) after the calibration to ensure that the reliability of the voltage test system after installation meets the process requirements. The insulation and voltage withstand test is only calibrated externally. When the relevant insulation and voltage withstand test system encounters equipment failure or the instrument itself is distorted during the production process, there is a problem of low efficiency in fault detection and location troubleshooting.

[0068] In order to solve the above technical problems, the present application embodiment provides an insulation withstand voltage detection circuit, see Figure 1 As shown, the insulation withstand voltage detection circuit in this embodiment includes: a measurement circuit 100, a multi-way switch circuit 200, a plurality of test probe groups 300 and a main control circuit 500; wherein, each test probe group 300 is connected to two ends of the measurement circuit 100 via at least two switch circuits 200, the measurement circuit 100 and the multi-way switch circuit 200 are controlled by the main control circuit 500 and the plurality of test probe groups 300 can form a plurality of test loops, the measurement circuit 100 is controlled by the main control circuit 500 to measure the electrical parameters of the test loop; the main control circuit 500 is used to determine the state of the test loop according to the electrical parameters of the test loop.

[0069] In this embodiment, each test probe group 300 is connected to both ends of the measurement circuit 100 via at least two switch circuits 200. The main control circuit 500 can determine the state of the test loop according to the electrical parameters of the test loop. The state of the test loop includes the insulation withstand voltage state of the product to be tested connected between the two test probe groups 300. The state of the test loop can also include the connection state of the test loop formed by each test probe group and the measurement circuit 100. In some embodiments, it can be detected whether the test loop where each test probe group is located has an abnormal state such as poor contact, so as to achieve the purpose of self-testing each test loop. And in the case where two test probe groups 300 are connected to the product to be tested, a test loop can be formed by setting a corresponding switch circuit 200 and the measurement circuit 100, and the voltage between the two test probe groups 300 is detected by the measurement circuit 100, so as to achieve the effect of performing insulation withstand voltage test on the product to be tested, thereby achieving the purpose of insulation withstand voltage test and circuit self-test based on the same insulation withstand voltage detection circuit.

[0070] In some embodiments, the electrical parameters of the test loop include the impedance value of the test loop, and may also include the voltage between the two test probe groups 300. The measurement circuit 100 may detect the voltage value at both ends thereof, or may work in the impedance mode to detect the impedance value at both ends thereof. When the test probe group 300 is connected to both ends of the measurement circuit 100 via at least two switch circuits 200, the corresponding switch circuit 200 may be controlled to be turned on so that the measurement circuit 100 and the test probe group 300 form a test loop, and the impedance value of the test loop connected at both ends thereof is measured by the measurement circuit 100. The main control circuit 500 determines the state of the test loop based on the impedance value of the test loop, or the two test probe groups 300 are connected to both ends of the measurement circuit 100 by controlling the corresponding switch circuit 200. When the two test probe groups 300 are connected to the product to be tested, the voltage between the two test probe groups 300 may be detected by the measurement circuit 100, so as to achieve the purpose of performing insulation withstand voltage detection on the product to be tested.

[0071] In some embodiments, see Figure 2 As shown, multiple test probe groups 300 include at least a first test probe group 310 and a second test probe group 320. The first test probe group 310 and the second test probe group 320 are used to connect to the product to be tested. Multiple test loops are formed by controlling the measurement circuit 100, the multi-way switch circuit 200, the first test probe group 310 and the second test probe group 320. The measurement circuit 100 can detect the electrical parameters of each test loop. The electrical parameters of the test loop include the impedance value of the test loop or the voltage between the first test probe group 310 and the second test probe group 320. Finally, the main control circuit 500 determines the state of the test loop according to the electrical parameters of the test loop, so as to detect whether each test loop has abnormal conditions such as poor contact. In addition, when the first test probe group 310 and the second test probe group 320 are connected to the product to be tested, the insulation withstand voltage test can be performed on the product to be tested by setting a corresponding test loop, thereby achieving the purpose of insulation withstand voltage test and circuit self-test based on the same insulation withstand voltage detection circuit.

[0072] In some embodiments, see Figure 2As shown, the multiple switch circuits 200 include: a first switch circuit 210, a second switch circuit 220, a first acquisition loop 211, and a second acquisition loop 221, wherein the first end of the measurement circuit 100 is connected to the first test probe group 310 via the first switch circuit 210, the second end of the measurement circuit 100 is connected to the first test probe group 310 via the first acquisition loop 211, the second end of the measurement circuit 100 is connected to the second test probe group 320 via the second switch circuit 220, and the first end of the measurement circuit 100 is connected to the second test probe group 320 via the second acquisition loop 221. The switch states of the first switch circuit 210, the second switch circuit 220, the first acquisition loop 211, and the second acquisition loop 221 are controlled by the main control circuit 500 to form a corresponding test loop.

[0073] In this embodiment, the first switch circuit 210, the first acquisition loop 211 and the measurement circuit 100 can be controlled by the main control circuit 500 to form a test loop, so as to detect the first switch circuit 210, the first acquisition loop 211 and the first test probe group 310. When the loop impedance value detected by the measurement circuit 100 is abnormal, it indicates that the first switch circuit 210, the second acquisition loop 221 and the first test probe group 310 have a poor contact or other fault. The second switch circuit 220, the second acquisition loop 221 and the measurement circuit 100 are controlled by the main control circuit 500 to form another test loop. When the corresponding loop impedance value detected by the measurement circuit 100 is abnormal, it indicates that the second switch circuit 220, the second acquisition loop 221 and the second test probe group 320 have a poor contact or other fault. By controlling the states of the first switch circuit 210, the second switch circuit 220, the first acquisition circuit 211 and the second acquisition circuit 221 through the main control circuit 500 and combining with the working mode of the measurement circuit 100, fault detection of the test circuit can be achieved, and insulation withstand voltage test of the product to be tested can also be achieved.

[0074] In some embodiments, the first switch circuit 210 may be multi-channel, and the multi-channel first switch circuit 210 may be connected between the positive electrode of the measurement circuit 100 and the corresponding test probe group.

[0075] In some embodiments, the second switch circuit 220 may be multi-channel, and the multi-channel second switch circuit 220 may be connected between the positive electrode of the measurement circuit 100 and the corresponding test probe group.

[0076] In some embodiments, the first acquisition loop 211 may be multi-channel, and the multi-channel first acquisition loop 211 may be connected between the negative electrode of the measurement circuit 100 and the corresponding test probe group.

[0077] In some embodiments, the second acquisition loop 221 may be multi-channel, and the multi-channel second acquisition loop 221 may be connected between the negative electrode of the measurement circuit 100 and the corresponding test probe group.

[0078] In some embodiments, multiple switching circuits 200 can be controlled by the main control circuit 500 to form multiple self-test test loops in sequence. In the self-test test loop, the test probe group 300 is connected to the two ends of the measurement circuit 100 via at least two switching circuits 200. The measurement circuit 100 detects the impedance value of each self-test test loop in turn. The main control circuit 500 determines the state of the test loop based on the impedance value of the test loop. For example, the main control circuit 500 determines that a fault has occurred in the test loop if the loop impedance value detected at the two ends of the measurement circuit 100 exceeds a first preset threshold range. The fault in the test loop includes poor contact between components in the test loop.

[0079] In some embodiments, see Figure 3 As shown, the insulation withstand voltage detection circuit in this embodiment also includes a voltage acquisition board 400, which is connected to the test circuit and the main control circuit 500. The voltage acquisition board 400 is used to detect the voltage in the test circuit to obtain the acquisition board voltage; the main control circuit 500 determines whether the test circuit is normal based on the voltage value measured by the measurement circuit 100 and the acquisition board voltage measured by the voltage acquisition board 400.

[0080] In this embodiment, when the measuring circuit 100 works in the voltage measurement mode, the voltage acquisition board 400 and the measuring circuit 100 can simultaneously detect the voltage between the first test probe group 310 and the second test probe group 320, and compare the two groups of voltage detection values. In this way, the main control circuit 500 can determine the state of the test loop according to the voltage value measured by the measuring circuit 100 and the acquisition board voltage measured by the voltage acquisition board 400. The state of the test loop may include the working state of the measuring circuit 100 and the voltage acquisition board 400, that is, the measuring circuit 100 and the voltage acquisition board 400 are determined according to the voltage value measured by the measuring circuit 100 and the acquisition board voltage measured by the voltage acquisition board 400. Whether there is any abnormality in the detection. If the detection value deviates greatly, for example, the deviation of the voltage detection result between the measuring circuit 100 and the voltage acquisition board 400 for the same two test probes 300 is greater than 1V, it means that the measuring circuit 100 and the voltage acquisition board 400 may be faulty and need to be replaced. If the voltage detection results between the measuring circuit 100 and the voltage acquisition board 400 for the same two test probes 300 are the same, it means that the measuring circuit 100 and the voltage acquisition board 400 are normal, so that the reliability of the self-test system can be detected in real time, and the system feedback result can be obtained, which is convenient for timely locating the fault location and replacing the faulty instrument.

[0081] In some embodiments, if the voltage between the first test probe group 310 and the second test probe group 320 measured by the measurement circuit 100 and the voltage acquisition board 400 is within the threshold voltage range, it means that the insulation withstand voltage of the product to be tested connected to the first test probe group 310 and the second test probe group 320 is normal. If the voltage between the first test probe group 310 and the second test probe group 320 measured by the measurement circuit 100 and the voltage acquisition board 400 exceeds the threshold voltage range, it means that the insulation withstand voltage of the product to be tested connected to the first test probe group 310 and the second test probe group 320 does not meet the requirements. If the voltage difference between the voltage value measured by the measurement circuit 100 and the acquisition board voltage measured by the voltage acquisition board 400 is too large, it may also indicate that the measurement circuit 100 and the voltage acquisition board 400 may fail, so that the reliability of the self-test system can be detected in real time, and the system feedback results can be obtained, which is convenient for timely positioning of the fault location and replacement of the faulty instrument.

[0082] In some embodiments, the voltage collection board 400 may include a voltage sampling circuit disposed on a printed circuit board. The voltage sampling circuit may detect the voltage at both ends thereof to obtain a corresponding voltage value. The main control circuit 500 determines the insulation withstand voltage characteristics of the product to be tested connected to both ends thereof according to the sampled voltage value. The voltage collection board 400 may also include an operational amplifier chip disposed on the printed circuit board.

[0083] In some embodiments, the voltage acquisition board 400 is connected between the first acquisition loop 211 and the second acquisition loop 221, the second end of the voltage acquisition board 400 is connected to the first test probe group 310 via the first acquisition loop 211, and the first end of the voltage acquisition board 400 is connected to the second test probe group 320 via the second acquisition loop 221.

[0084] In this embodiment, the first end of the voltage acquisition board 400 is connected to the second test probe group 320 via the second acquisition loop 221, and the second end of the voltage acquisition board 400 is connected to the first test probe group 310 via the first acquisition loop 211. When the first test probe group 310 and the second test probe group 320 are connected to the product to be tested, the first end and the second end of the voltage acquisition board 400 can detect the voltage of the product to be tested via the corresponding acquisition loop, and the corresponding acquisition board voltage is obtained and uploaded to the main control circuit 500. In this embodiment, an independent voltage acquisition board 400 is added, so that there are two independent and unconnected test loops in the corresponding loop channel. Since the voltage test loop of the measurement circuit 100 and the voltage test loop of the voltage acquisition board 400 are independent, they can not interfere with each other in the process of realizing dual voltage sampling. The measurement circuit 100 and the voltage acquisition board 400 can both measure the voltage between the first test probe group 310 and the second test probe group 320. If the voltages detected by the measurement circuit 100 and the voltage acquisition board 400 are the same, it means that the measurement circuit 100 and the voltage acquisition board 400 are working normally. If the voltages detected by the measurement circuit 100 and the voltage acquisition board 400 are inconsistent, or the difference between the voltages detected by the measurement circuit 100 and the voltage acquisition board 400 is greater than the second threshold voltage, it means that at least one of the measurement circuit 100 and the voltage acquisition board 400 is faulty, thereby increasing the accuracy of self-test.

[0085] In some embodiments, if the voltages detected by the measurement circuit 100 and the voltage collection board 400 are inconsistent, or the difference between the voltages detected by the measurement circuit 100 and the voltage collection board 400 is greater than the second threshold voltage, the measurement circuit 100 can be replaced to perform circuit self-check again. If the voltages detected by the replaced measurement circuit 100 and the voltage collection board 400 are still inconsistent, it can be determined that the voltage collection board 400 is faulty.

[0086] In some embodiments, the lower limit value of the second preset threshold range may be 0V, and the upper limit value of the second preset threshold range may be the second threshold voltage.

[0087] In some embodiments, see Figure 4 As shown, the first acquisition circuit 211 includes a first main board relay 2111 and a second main board relay 2112; the second end of the voltage acquisition board 400 is connected to the second end of the measurement circuit 100 via the first main board relay 2111, and the second end of the voltage acquisition board 400 is connected to the first test probe group 310 via the second main board relay 2112.

[0088] In this embodiment, the second end of the measuring circuit 100 is connected to the first test probe group 310 via the first main board relay 2111 and the second main board relay 2112, and the first end of the measuring circuit 100 is connected to the first test probe group 310 via the first switch circuit 210. In this way, a test loop can be formed by the first switch circuit 210, the first main board relay 2111, the second main board relay 2112 and the first test probe group 310, and the contact state between the probes in the first test probe group 310 is detected by the measuring circuit 100. In addition, when the first test probe group 310 and the second test probe group 320 are connected to the product to be tested, the first end and the second end of the voltage acquisition board 400 can detect the voltage of the product to be tested via the corresponding acquisition loop, and the corresponding acquisition board voltage is obtained and uploaded to the main control circuit 500. By adding an independent voltage acquisition board 400, two independent and unconnected test loops exist in the corresponding loop channel. Since the voltage test loop of the measuring circuit 100 and the voltage test loop of the voltage acquisition board 400 are independent, they can not interfere with each other in the process of realizing dual voltage sampling, thereby increasing the accuracy of self-test.

[0089] In some embodiments, see Figure 5 As shown, the first acquisition loop 211 further includes a first sub-board relay 2113 , and the first sub-board relay 2113 is connected between the first test probe group 310 and the second main board relay 2112 .

[0090] In this embodiment, by adding a first sub-board relay 2113 on the sub-board, corresponding control switches can be set on the main board and the sub-board, and the conduction and shutdown of the test circuit can be controlled by the main board and the sub-board respectively, and multiple sub-board relays and multiple test probe groups can be set on the sub-board, which facilitates the expansion of the test system and helps to improve the reliability of the test system.

[0091] In some embodiments, see Figure 4 As shown, the second acquisition loop 221 includes a third main board relay 2211 and a fourth main board relay 2212; the first end of the voltage acquisition board 400 is connected to the first end of the measurement circuit 100 via the third main board relay 2211, and the first end of the voltage acquisition board 400 is connected to the second test probe group 320 via the fourth main board relay 2212.

[0092] In this embodiment, the first end of the measuring circuit 100 is connected to the second test probe group 320 via the third main board relay 2211 and the fourth main board relay 2212, and the second end of the measuring circuit 100 is connected to the first test probe group 310 via the second switch circuit 220. In this way, the second switch circuit 220, the third main board relay 2211, the fourth main board relay 2212 and the second test probe group 320 can form a test loop, and the contact state between the probes in the second test probe group 320 can be detected by the measuring circuit 100. In addition, when the first test probe group 310 and the second test probe group 320 are connected to the product to be tested, the first end and the second end of the voltage acquisition board 400 can detect the voltage of the product to be tested via the corresponding acquisition loop, and the corresponding acquisition board voltage is obtained and uploaded to the main control circuit 500. By adding an independent voltage acquisition board 400, two independent and unconnected test loops exist in the corresponding loop channel. Since the voltage test loop of the measuring circuit 100 and the voltage test loop of the voltage acquisition board 400 are independent, they can not interfere with each other in the process of realizing dual voltage sampling. During the dual voltage sampling process, the first main board relay 2111 is turned off, the third main board relay 2211 is turned off, the measurement circuit 100 detects the voltage between the first test probe group 310 and the second test probe group 320 via the first switch circuit 210 and the second switch circuit 220, and the voltage acquisition board 400 detects the voltage between the first test probe group 310 and the second test probe group 320 via the second main board relay 2112 and the fourth main board relay 2212. If the voltages detected by the measurement circuit 100 and the voltage acquisition board 400 are the same, it means that the measurement circuit 100 and the voltage acquisition board 400 are working normally. If the voltages detected by the measurement circuit 100 and the voltage acquisition board 400 are inconsistent, or the difference between the voltages detected by the measurement circuit 100 and the voltage acquisition board 400 is greater than the second threshold voltage, it means that at least one of the measurement circuit 100 and the voltage acquisition board 400 is faulty, thereby increasing the accuracy of self-test.

[0093] In some embodiments, see Figure 5 As shown, the second acquisition loop 221 further includes a second sub-board relay 2213 , and the second sub-board relay 2213 is connected between the fourth main board relay 2212 and the second test probe group 320 .

[0094] In this embodiment, by adding a second sub-board relay 2213 on the sub-board, corresponding control switches can be set on the main board and the sub-board, and the main board and the sub-board can control the conduction and shutdown of the test circuit respectively, and multiple sub-board relays and multiple test probe groups can be set on the sub-board, which facilitates the expansion of the test system and helps to improve the reliability of the test system.

[0095] In some embodiments, the second acquisition loop 221 may include multiple second branch board relays 2213, one end of the multiple second branch board relays 2213 is commonly connected to the fourth main board relay 2212, and the other end of each second branch board relay 2213 can be connected to a corresponding second test probe group 320. The multiple second test probe groups 320 correspond one-to-one to the multiple second branch board relays 2213, and multi-channel test probes can be self-checked or test loops can be added.

[0096] In some embodiments, see Figure 6 As shown, the first switch circuit 210 includes a fifth main board relay 2101 , and the fifth main board relay 2101 is connected between the first end of the measurement circuit 100 and the first test probe group 310 .

[0097] In this embodiment, the first end of the measuring circuit 100 is connected to the first test probe group 310 via the fifth main board relay 2101, and the second end of the measuring circuit 100 is connected to the first test probe group 310 via the second switch circuit 220. In this way, a test loop can be composed of the second switch circuit 220, the fifth main board relay 2101, the first test probe group 310 and the second test probe group 320. The voltage of the product to be tested connected between the first test probe group 310 and the second test probe group 320 is detected by the measuring circuit 100 to determine the insulation withstand voltage state of the product to be tested. Moreover, when the first test probe group 310 and the second test probe group 320 are connected to the product to be tested, the first end and the second end of the voltage acquisition board 400 can detect the voltage of the product to be tested via the corresponding acquisition circuit, and the corresponding acquisition board voltage is obtained and uploaded to the main control circuit 500. By adding an independent voltage acquisition board 400, two independent and unconnected test circuits exist in the corresponding loop channel. Since the voltage test circuit of the measurement circuit 100 and the voltage test circuit of the voltage acquisition board 400 are independent, they can not interfere with each other during the dual voltage sampling process, thereby increasing the accuracy of self-test.

[0098] In some embodiments, see Figure 6 As shown, the first switch circuit 210 further includes a third sub-board relay 2102 , and the third sub-board relay 2102 is connected between the fifth main board relay 2101 and the first test probe set 310 .

[0099] In this embodiment, by adding a third sub-board relay 2102 on the sub-board, corresponding control switches can be set on the main board and the sub-board, and the conduction and shutdown of the test circuit can be controlled by the main board and the sub-board respectively, and multiple sub-board relays and multiple test probe groups can be set on the sub-board, which facilitates the expansion of the test system and helps to improve the reliability of the test system.

[0100] In some embodiments, the first switch circuit 210 may include multiple third branch board relays 2102, one end of the multiple third branch board relays 2102 is commonly connected to the fifth main board relay 2101, and the other end of each third branch board relay 2102 can be connected to a corresponding first test probe group 310. The multiple first test probe groups 310 correspond one-to-one to the multiple third branch board relays 2102, and multi-channel test probes can be self-tested or test loops can be added.

[0101] In some embodiments, see Figure 6 As shown, the second switch circuit 220 includes a sixth main board relay 2201 , and the sixth main board relay 2201 is connected between the second end of the measurement circuit 100 and the second test probe group 320 .

[0102] In this embodiment, the second end of the measurement circuit 100 is connected to the second test probe group 320 via the sixth main board relay 2201, and the first end of the measurement circuit 100 is connected to the first test probe group 310 via the first switch circuit 210. In this way, a test loop can be composed of the first switch circuit 210, the sixth main board relay 2201, the first test probe group 310 and the second test probe group 320. The voltage of the product to be tested connected between the first test probe group 310 and the second test probe group 320 is detected by the measurement circuit 100 to determine the insulation withstand voltage state of the product to be tested. Moreover, when the first test probe group 310 and the second test probe group 320 are connected to the product to be tested, the first end and the second end of the voltage acquisition board 400 can detect the voltage of the product to be tested via the corresponding acquisition circuit, and the corresponding acquisition board voltage is obtained and uploaded to the main control circuit 500. By adding an independent voltage acquisition board 400, two independent and unconnected test circuits exist in the corresponding loop channel. Since the voltage test circuit of the measurement circuit 100 and the voltage test circuit of the voltage acquisition board 400 are independent, they can not interfere with each other during the dual voltage sampling process, thereby increasing the accuracy of self-test.

[0103] In some embodiments, see Figure 6 As shown, the second switch circuit 220 further includes a fourth sub-board relay 2202 , and the fourth sub-board relay 2202 is connected between the sixth main board relay 2201 and the second test probe group 320 .

[0104] In this embodiment, by adding a fourth sub-board relay 2202 on the sub-board, corresponding control switches can be set on the main board and the sub-board, and the conduction and shutdown of the test circuit can be controlled by the main board and the sub-board respectively, and multiple sub-board relays and multiple test probe groups can be set on the sub-board, which facilitates the expansion of the test system and helps to improve the reliability of the test system.

[0105] In some embodiments, the second switch circuit 220 may include multiple fourth branch board relays 2202, one ends of the multiple fourth branch board relays 2202 are commonly connected to the sixth main board relay 2201, and the other end of each fourth branch board relay 2202 can be connected to a corresponding second test probe group 320. The multiple second test probe groups 320 correspond one-to-one to the multiple fourth branch board relays 2202, and multi-channel test probes can be self-tested or test loops can be added.

[0106] In some embodiments, in combination Figure 1 As shown, when the main control circuit 500 works in the self-test mode, it controls the switch state of the multi-way switch circuit 200 to form a multi-way test loop, and controls the measurement circuit 100 to detect the loop impedance value of each test loop.

[0107] In an embodiment of the present application, each test probe group 300 is connected to two ends of the measurement circuit 100 via at least two switch circuits 200. The switch state of the switch circuit 200 is controlled by the main control circuit 500. After the insulation withstand voltage detection circuit is started, the main control circuit 500 enters the self-test mode. In this way, multiple test loops are formed by controlling the switch states of the multiple switch circuits 200, and the measurement circuit 100 detects the loop impedance value of each test loop, thereby achieving the purpose of self-testing the function of each switch circuit 200.

[0108] In some embodiments, in combination Figure 3 As shown, when the main control circuit 500 works in the self-test mode, it controls the switching states of the first switch circuit 210, the second switch circuit 220, the first acquisition loop 211, and the second acquisition loop 221 to form a multi-path test loop, and controls the measurement circuit 100 to detect the loop impedance value of each test loop.

[0109] In this embodiment, after the insulation withstand voltage detection circuit is started, the main control circuit 500 enters the self-test mode. In this way, multiple test loops are formed by controlling the switch states of the first switch circuit 210, the second switch circuit 220, the first acquisition loop 211, and the second acquisition loop 221, and the measurement circuit 100 detects the loop impedance value of each test loop, so as to achieve the purpose of self-testing the functions of the first switch circuit 210, the second switch circuit 220, the first acquisition loop 211, and the second acquisition loop 221. In addition, since the first test probe group 310 and the second test probe group 320 are respectively connected to the corresponding test loops, multiple test probes in the first test probe group 310 and the second test probe group 320 are connected to the corresponding metal contacts in common. By testing the loop impedance value of the corresponding test loop, it can be determined whether the test probes in the test probe group have contact faults.

[0110] In some embodiments, the main control circuit 500 is configured to determine that a fault occurs in the test loop when the loop impedance value exceeds a first preset threshold range.

[0111] In this embodiment, the first switch circuit 210 and the second switch circuit 220 can be equivalent to a wire when the switches inside them are turned on. The first acquisition loop 211 and the second acquisition loop 221 can be equivalent to a wire when the switches inside them are turned on. Therefore, when the first switch circuit 210, the second switch circuit 220, the first acquisition loop 211, and the second acquisition loop 221 are controlled by the main control circuit 500 to form a corresponding test loop, if the loop impedance value in the corresponding test loop exceeds the first preset threshold range, it means that there is a fault such as poor switch contact in the first switch circuit 210, the second switch circuit 220, the first acquisition loop 211, and the second acquisition loop 221, and the main control circuit 500 outputs a corresponding first abnormal fault detection signal to remind the user to detect the connection between the components in the test loop.

[0112] In some embodiments, the first preset threshold value may range from 0 to 50 ohms.

[0113] In some embodiments, when the main control circuit 500 operates in the dual voltage detection mode, it forms a multi-path test loop by controlling the switch states of the first switch circuit 210, the second switch circuit 220, the first acquisition loop 211, and the second acquisition loop 221, and controls the measurement circuit 100 and the voltage acquisition board 400 to detect the voltage value of each test loop.

[0114] In this embodiment, when the main control circuit 500 works in the dual voltage detection mode, two independent and unconnected test loops can be formed by the measurement circuit 100 and the voltage acquisition board 400 respectively. Since the voltage test loop of the measurement circuit 100 and the voltage test loop of the voltage acquisition board 400 are independent, they can implement dual voltage sampling without interfering with each other, thereby increasing the accuracy of self-test.

[0115] In some embodiments, the main control circuit 500 is used to determine that a fault occurs in the test loop when the difference between the voltage values ​​of each test loop detected by the measurement circuit 100 and the voltage collection board 400 exceeds a second preset threshold range.

[0116] In this embodiment, the measurement circuit 100 and the voltage acquisition board 400 respectively form two independent test circuits that are not connected to each other. Since the voltage test circuit of the measurement circuit 100 and the voltage test circuit of the voltage acquisition board 400 are independent, they can not interfere with each other in the process of realizing dual voltage sampling. When the difference between the real-time voltage values ​​collected by the measurement circuit 100 and the voltage acquisition board 400 exceeds the second preset threshold range, it also indicates that the test circuit in the insulation withstand voltage detection circuit has an abnormal fault during the self-test process, reminding the user to perform self-test troubleshooting to increase the accuracy of self-test.

[0117] In some embodiments, the second preset threshold range may be -5V-5V.

[0118] In some embodiments, the measurement circuit 100 can be a voltmeter, which enters an impedance mode when the insulation withstand voltage detection circuit operates in a first-piece self-test mode, and can measure the loop impedance value of the test loop connected at both ends thereof, and upload the loop impedance value to the main control circuit 500.

[0119] In some embodiments, the switch circuit 200 may be multi-channel, and each test probe group may include at least two test probes, and the two test probes may be connected to two ends of the measurement circuit 100 via one switch circuit 200 respectively.

[0120] In some embodiments, the first end of the measurement circuit 100 is its positive sampling end, the second end of the measurement circuit 100 is its negative sampling end, the first end of the voltage collection board 400 is its positive sampling end, and the second end of the voltage collection board 400 is its negative sampling end.

[0121] In some embodiments, see Figure 7 As shown, the measuring circuit 100 can be a voltmeter, and the positive sampling terminal of the voltmeter is connected to the multi-way switch circuit 200 via the main board relay 5, and is connected to one of the test probes in the corresponding test probe group via the corresponding multi-way switch circuit 200. The negative sampling terminal of the voltmeter is connected to the multi-way switch circuit 200 via the main board relay 6, and is connected to another test probe in the corresponding test probe group via the multi-way switch circuit 200.

[0122] Combination Figure 7As shown, the first switch circuit 200 includes a main board relay 1 and a sub-board relay 1, and the second switch circuit 200 includes a main board relay 2 and a sub-board relay 2. The positive sampling end of the voltmeter is connected to the test probe 1 via the main board relay 5, the main board relay 1, and the sub-board relay 1, and the negative sampling end of the voltmeter is connected to the test probe 2 via the main board relay 6, the main board relay 2, and the sub-board relay 2. Since the test probe 1 and the test probe 2 are connected to a metal contact, the voltmeter, the main board relay 5, the main board relay 1, the sub-board relay 1, the test probe 1, the main board relay 6, the main board relay 2, the sub-board relay 2 and the test probe 2 can form a test loop. When the voltmeter works in the impedance mode, the measurement circuit 100 can measure the loop impedance value of the test loop connected at both ends thereof, and upload the loop impedance value to the main control circuit 500, so as to realize the self-test of the main board relay 5, the main board relay 1, the sub-board relay 1, the test probe 1, the main board relay 6, the main board relay 2, the sub-board relay 2 and the test probe 2. By analogy, the third switch circuit 200 includes a main board relay 3 and a sub-board relay 3, the fourth switch circuit 200 includes a main board relay 4 and a sub-board relay 4, the positive sampling end of the voltmeter is connected to the test probe 3 via the third switch circuit 200, and the negative sampling end of the voltmeter is connected to the test probe 4 via the fourth switch circuit 200. The x-th switch circuit 200 includes a main board relay x and a sub-board relay x, the y-th switch circuit 200 includes a main board relay y and a sub-board relay y, the positive sampling end of the voltmeter is connected to the test probe x via the main board relay 5 and the x-th switch circuit 200, and the negative sampling end of the voltmeter is connected to the test probe y via the main board relay 6 and the y-th switch circuit 200. The zth switch circuit 200 includes a main board relay z and a sub-board relay z, the wth switch circuit 200 includes a main board relay w and a sub-board relay w, the positive sampling end of the voltmeter is connected to the test probe z via the main board relay 5 and the zth switch circuit 200, and the negative sampling end of the voltmeter is connected to the test probe w via the main board relay 6 and the wth switch circuit 200.

[0123] An embodiment of the present application further provides an insulation withstand voltage measurement system, which includes an insulation withstand voltage detection circuit as described in any of the above embodiments.

[0124] An embodiment of the present application also provides a measuring device, comprising the insulation withstand voltage detection circuit described in any one of the above embodiments.

[0125] In this embodiment, in the measuring device, multiple test loops are formed by controlling the measuring circuit, the multi-way switching circuit, and the multiple test probe groups. Each test probe group is connected to the two ends of the measuring circuit through at least two switching circuits. The measuring circuit can detect the electrical parameters of each test loop. The electrical parameters may include the impedance value of the test loop or the voltage value between the two probe test groups. Finally, the main control circuit determines the state of the test loop according to the electrical parameters of the test loop, so as to detect whether each test loop has abnormal conditions such as poor contact. In addition, when a product to be tested is connected between the two probe test groups, the insulation withstand voltage test can be performed on the product to be tested by setting a corresponding test loop, thereby achieving the purpose of insulation withstand voltage test and circuit self-test based on the same insulation withstand voltage detection circuit.

[0126] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into a processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0127] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0128] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the electronic device embodiments described above are merely schematic. For example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0129] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0130] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0131] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. An insulation withstand voltage detection circuit, characterized in that: The insulation withstand voltage detection circuit comprises: a measurement circuit, a multi-way switch circuit, a plurality of test probe groups and a main control circuit; The measuring circuit and the multiple switch circuits are controlled by the main control circuit, and each of the test probe groups is respectively connected to two ends of the measuring circuit via at least two switch circuits; The test probe group and the switch circuit form a test loop, and the measurement circuit is used to measure electrical parameters of the test loop; The main control circuit is used to determine the state of the test loop according to the electrical parameters of the test loop; the state of the test loop includes the connection state of the test loop formed by each of the test probe groups and the measurement circuit; When the main control circuit works in the self-test mode, it controls the switch state of the multi-way switch circuit to form a multi-way test loop, and controls the measurement circuit to detect the loop impedance value of each of the test loops.

2. The insulation withstand voltage detection circuit according to claim 1, characterized in that: The plurality of test probe groups include a first test probe group and a second test probe group; the multi-way switch circuit includes: a first switch circuit, wherein the first end of the measuring circuit is connected to a first test probe set via the first switch circuit; a first acquisition loop, through which the second end of the measurement circuit is connected to the first test probe group; a second switch circuit, wherein the second end of the measuring circuit is connected to the second test probe set via the second switch circuit; a second acquisition loop, wherein the first end of the measurement circuit is connected to the second test probe group via the second acquisition loop; The switch states of the first switch circuit, the second switch circuit, the first acquisition loop and the second acquisition loop are controlled by the main control circuit to form a corresponding test loop.

3. The insulation withstand voltage detection circuit according to claim 2, characterized in that: The insulation withstand voltage detection circuit also includes: A voltage acquisition board is connected to the test loop and the main control circuit, and is used to detect the voltage between the two test probe groups to obtain an acquisition board voltage; the main control circuit determines the state of the test loop based on the voltage value measured by the measurement circuit and the acquisition board voltage measured by the voltage acquisition board.

4. The insulation withstand voltage detection circuit according to claim 3, characterized in that: The voltage acquisition board is connected between the first acquisition loop and the second acquisition loop, the second end of the voltage acquisition board is connected to the first test probe group via the first acquisition loop, and the first end of the voltage acquisition board is connected to the second test probe group via the second acquisition loop.

5. The insulation withstand voltage detection circuit according to claim 4, characterized in that: The first acquisition circuit includes a first main board relay and a second main board relay; The second end of the voltage collection board is connected to the second end of the measurement circuit via the first main board relay, and the second end of the voltage collection board is connected to the first test probe group via the second main board relay.

6. The insulation withstand voltage detection circuit according to claim 5, characterized in that: The first acquisition loop also includes a first sub-board relay, which is connected between the first test probe group and the second main board relay; the first sub-board relay is controlled by the main control circuit to control the connection state between the first test probe group and the second main board relay.

7. The insulation withstand voltage detection circuit according to claim 3, characterized in that: The second acquisition circuit includes a third main board relay and a fourth main board relay; The first end of the voltage collection board is connected to the first end of the measurement circuit via the third main board relay, and the first end of the voltage collection board is connected to the second test probe group via the fourth main board relay.

8. The insulation withstand voltage detection circuit according to claim 7, characterized in that: The second acquisition loop also includes a second sub-board relay, and the second sub-board relay is connected between the fourth main board relay and the second test probe group.

9. The insulation withstand voltage detection circuit according to any one of claims 3 to 8, characterized in that: The first switch circuit includes a fifth mainboard relay connected between the first end of the measurement circuit and the first test probe group.

10. The insulation withstand voltage detection circuit according to claim 9, characterized in that: The first switch circuit further includes a third sub-board relay, and the third sub-board relay is connected between the fifth main board relay and the first test probe group.

11. The insulation withstand voltage detection circuit according to claim 3, characterized in that: The second switch circuit includes a sixth main board relay connected between the second end of the measurement circuit and the second test probe group.

12. The insulation withstand voltage detection circuit according to claim 11, characterized in that: The second switch circuit further includes a fourth sub-board relay connected between the sixth main board relay and the second test probe group.

13. The insulation withstand voltage detection circuit according to claim 1, characterized in that: The main control circuit is used for determining that a fault occurs in the test loop when the loop impedance value exceeds a first preset threshold range.

14. The insulation withstand voltage detection circuit according to claim 3, characterized in that: The main control circuit is also used to control the switch states of the first switch circuit, the second switch circuit, the first acquisition loop, and the second acquisition loop to form a multi-path test loop, and control the measurement circuit and the voltage acquisition board to detect the voltage value of each of the test loops.

15. The insulation withstand voltage detection circuit according to claim 14, characterized in that: The main control circuit is used to determine that the test circuit has a fault when the difference between the voltage values ​​of each test circuit detected by the measurement circuit and the voltage acquisition board exceeds a second preset threshold range.

16. An insulation withstand voltage measurement system, characterized in that: It comprises the insulation withstand voltage detection circuit as described in any one of claims 1 to 15.

17. A measuring device, characterized in that It comprises the insulation withstand voltage detection circuit as described in any one of claims 1 to 15.

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