Chip testing device

Abstract

The present invention discloses a chip testing device, comprising: a housing, a coaxial spring pin module, a high-frequency board and SMP connectors. The high-frequency board is disposed within the housing. The coaxial spring pin module includes a plurality of groups of coaxial pins. Each coaxial pin includes a pin body, a pin head and a pin tail. The pin head is used for vertically contacting the pins of the chip, and the pin tail contacts the high-frequency board. A plurality of SMP connectors are provided. Each SMP connector includes a connector. The connector is welded to the high-frequency board and is conductively connected to the coaxial pins one by one. This chip testing device simplifies the manufacturing process, reduces the line length and complexity, and greatly reduces the assembly and operation time, thereby improving the production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component testing, and particularly to a chip testing device. Background Art

[0002] Driven by the mobile communication industry, especially 5G millimeter waves, the testing of antenna chips has gradually received attention and development.

[0003] In the prior art, the structure of a chip testing device generally includes a test socket and a radio frequency probe. Among them, there are generally two schemes for the structure of the test socket. One is a design including a socket and a high-frequency board with a control circuit, and the other is a design including a socket with a radio frequency connector and a control circuit. The defect of the former is that the high-frequency board with a control circuit has a complex design, a slow update and iteration speed, and higher requirements for material selection and manufacturing process, resulting in a long manufacturing cycle. The defect of the latter is that the socket and the control circuit are connected through a J30J rectangular connector, which will make the entire link longer, thus causing interference between low-frequency lines and high-frequency lines, as well as problems such as unstable voltage and voltage drop, which have a certain impact on the stability and accuracy of the test. The radio frequency probe needs to be manually adjusted through a probe station, and the probe station includes a microscope and adjusting rods in three-axis directions, etc. It has a large volume, high cost due to additional accessories and equipment, and complex operation.

[0004] Therefore, it is necessary to provide a new chip testing device to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a miniaturized chip testing device, which simplifies the signal transmission line, reduces the influence of low-frequency lines on high-frequency signal transmission, and has high efficiency.

[0006] To achieve the above purpose, the present invention adopts the following technical solutions:

[0007] A chip testing device includes: a housing, a coaxial spring pin module, a high-frequency board, and an SMP connector. The high-frequency board is disposed in the housing. The coaxial spring pin module includes multiple groups of coaxial pins. Each coaxial pin includes a pin body, a pin head, and a pin tail. The pin head is used to vertically contact the pins of the chip, the pin tail contacts the high-frequency board, multiple SMP connectors are provided, and each SMP connector includes a connector. The connector is welded to the high-frequency board and is conductively connected to the coaxial pin one by one.

[0008] As a further improved technical solution of the present invention, the housing includes an outer shell and a cover body that are buckled with each other, and are fixed by a locking member passing through the cover body, the high-frequency board, and the bottom wall of the outer shell in sequence.

[0009] As a further improved technical solution of the present invention, the chip testing device further includes a fixing plate, the fixing plate is disposed inside the housing, the high-frequency board is clamped between the bottom wall of the housing and the fixing plate, and the locking member sequentially passes through the cover body, the fixing plate, the high-frequency board and the bottom wall of the housing and is fixed.

[0010] As a further improved technical solution of the present invention, the chip testing device further includes a first base, the bottom wall of the housing is provided with a first hollow portion communicating the inside and the outside of the housing, the radial outer contour of the first base is adapted to the first hollow portion, the first base is disposed in the first hollow portion, the coaxial spring pin module is disposed on the first base, and at least part of the coaxial pins are located inside the housing and at least part are located outside the housing.

[0011] As a further improved technical solution of the present invention, the first base includes a first clamping plate and a second clamping plate, the first clamping plate is provided with a first through hole, the second clamping plate is provided with a corresponding second through hole, the coaxial spring pin module further includes a probe base, the coaxial pins are disposed on the probe base, and the probe base is fixed to the first base and at least part is located in the first through hole and the second through hole.

[0012] As a further improved technical solution of the present invention, the probe base is adapted to the first through hole and the second through hole, the first through hole includes a first hole portion and a second hole portion, the first hole portion is farther from the second through hole than the second hole portion, the aperture of the second hole portion is larger than the aperture of the first hole portion, the second through hole includes a third hole portion and a fourth hole portion, the third hole portion is farther from the first through hole than the fourth hole portion, and the aperture of the fourth hole portion is larger than the aperture of the third hole portion.

[0013] As a further improved technical solution of the present invention, a plurality of mounting grooves and third through holes communicating the mounting grooves with the inside of the housing are provided on the outer side wall of the housing, the SMP connector is disposed in the mounting groove, the connector includes a center pin, and at least part of the center pin is welded to the high-frequency board and at least part is located in the mounting groove.

[0014] As a further improved technical solution of the present invention, the chip testing device further includes a second base, the bottom wall of the housing is further provided with a second hollow portion communicating the inside and the outside of the housing, the second base is disposed in the second hollow portion, and the surfaces of the first base and the second base facing the inside of the housing are flush with the inner bottom wall of the housing, and at least part of one surface of the high-frequency board abuts against the first base, the second base and the inner bottom wall of the housing.

[0015] As a further improved technical solution of the present invention, a plurality of first grooves are provided on the inner bottom wall of the housing. The surface of the first clamping plate away from the second clamping plate faces the same direction as the inner bottom wall of the housing. The first clamping plate is provided with a plurality of second grooves, the second base is provided with a plurality of third grooves, and the probe base is provided with a plurality of fourth grooves. The fourth grooves, the second grooves, the first grooves and the third grooves are sequentially and correspondingly communicated. At least part of the center pin is located in the third groove, and at least part of the coaxial pin is located in the fourth groove.

[0016] As a further improved technical solution of the present invention, the coaxial pin includes a high-frequency probe and a ground probe. At least part of the high-frequency probe is located in the fourth groove. One surface of the high-frequency board abuts at least part of the probe base, the first clamping plate, the inner bottom wall of the housing and the second base, so that each group of communicated fourth grooves, second grooves, first grooves and third grooves forms a closed channel.

[0017] Compared with the prior art, the beneficial effects of the chip testing device of the present invention are as follows: By adopting the integrated method of the coaxial spring pin module, the high-frequency board and the SMP connector, the volume of the whole device is relatively small. The needle head of the coaxial pin contacts the pins of the chip, the needle tail contacts the high-frequency board, and the connector of the SMP connector is welded to the high-frequency board, which can effectively support the transmission of high-frequency signals. And by optimizing the impedance matching, the influence of the low-frequency circuit on the signal transmission is reduced. This chip testing device simplifies the manufacturing process, reduces the line length and complexity, and greatly reduces the time for assembly and operation, thereby improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a three-dimensional structural schematic diagram of a chip testing device according to a specific embodiment of the present invention;

[0019] Figure 2 is a three-dimensional structural schematic diagram of another perspective of a chip testing device according to a specific embodiment of the present invention;

[0020] Figure 3 is Figure 2 an enlarged structural schematic diagram of area A in

[0021] Figure 4 is an exploded structural schematic diagram of a chip testing device according to a specific embodiment of the present invention;

[0022] Figure 5 is a front view schematic diagram of a chip testing device according to a specific embodiment of the present invention;

[0023] Figure 6 is Figure 5 a cross-sectional structural schematic diagram along X-X;

[0024] Figure 7 is Figure 6 the enlarged structural schematic diagram of area B in

[0025] Figure 8 is Figure 5 the sectional structural schematic diagram along Y-Y;

[0026] Figure 9 is Figure 8 the enlarged structural schematic diagram of area C in

[0027] Figure 10 the exploded structural schematic diagram of the housing of a specific embodiment of the present invention;

[0028] Figure 11 the partial top view schematic diagram of the chip testing device of a specific embodiment of the present invention;

[0029] Figure 12 is Figure 11 the partial exploded structural schematic diagram of

[0030] Figure 13 the assembly schematic diagram of the coaxial spring pin module and the first base of a specific embodiment of the present invention;

[0031] Figure 14 is Figure 13 the enlarged structural schematic diagram of area D in

[0032] Figure 15 the sectional structural schematic diagram of the coaxial spring pin module and the first base of a specific embodiment of the present invention;

[0033] Figure 16 is Figure 15 the enlarged structural schematic diagram of area E in

[0034] Figure 17 the partial exploded structural schematic diagram of the coaxial spring pin module and the first base of a specific embodiment of the present invention;

[0035] Figure 18 the three-dimensional structural schematic diagram of the coaxial spring pin module of a specific embodiment of the present invention;

[0036] Figure 19 is Figure 18 the enlarged structural schematic diagram of area F in

[0037] Figure 20 the exploded structural schematic diagram of the coaxial spring pin module of a specific embodiment of the present invention;

[0038] Figure 21 the exploded structural schematic diagram of the SMP connector and the second base of a specific embodiment of the present invention;

[0039] Figure 22 Schematic cross-sectional view of an SMP connector according to a specific embodiment of the present invention;

[0040] Figure 23 Left and front views of a connector housing according to a specific embodiment of the present invention;

[0041] Figure 24 Schematic diagram of the path of a chip testing device according to a specific embodiment of the present invention;

[0042] Figure 25 Application schematic diagram of a chip testing device according to a specific embodiment of the present invention;

[0043] Figure 26 Schematic diagram of the structure of a chip under test according to a specific embodiment of the present invention. Detailed description of specific embodiments

[0044] The following will describe in detail the exemplary specific embodiments of the present invention with reference to the accompanying drawings. If there are several specific embodiments, the features in these embodiments can be combined with each other without conflict. When the description involves the accompanying drawings, unless otherwise specified, the same numbers in different drawings represent the same or similar elements. The content described in the following exemplary specific embodiments does not represent all embodiments consistent with the present invention; on the contrary, they are only examples of devices, products, and / or methods that are consistent with some aspects of the present invention as recited in the claims of the present invention.

[0045] The terms used in the present invention are only for the purpose of describing specific embodiments and are not intended to limit the protection scope of the present invention. The singular forms "a", "the", or "said" used in the specification and claims of the present invention are also intended to include the plural forms unless the context clearly indicates otherwise.

[0046] It should be understood that the terms such as "first", "second", and similar terms used in the specification and claims of the present invention do not represent any order, quantity, or importance, but are only used to distinguish the named features. Similarly, the similar terms such as "a" or "one" do not represent a quantity limitation, but indicate the existence of at least one. Unless otherwise specified, the terms such as "front", "rear", "upper", "lower", etc. used in the present invention are only for convenience of description and are not limited to a specific position or a spatial orientation. The open-ended expression "comprising" or "including" means that the elements appearing before "comprising" or "including" cover the elements appearing after "comprising" or "including" and their equivalents, and this does not exclude that the elements appearing before "comprising" or "including" may also include other elements. If "several" appears in the present invention, it means two or more.

[0047] Please refer to Figures 1 to 26 As shown, an embodiment of the present invention discloses a chip testing device, which realizes the miniaturization of the device and can effectively support the transmission of high-frequency signals. The chip testing device is a static connector between a circuit board and a chip, which can make the replacement test of the chip more convenient, without constantly repeating the welding and removal of the chip, thereby reducing the damage to the chip and the circuit board, and achieving a fast and efficient testing effect.

[0048] Please refer to Figure 1 、 Figure 2 and Figure 4 As shown, the chip testing device includes a housing 1, a coaxial spring pin module 2, a high-frequency board 3, and an SMP (sub-miniature push-on) connector 4. The high-frequency board 3 is disposed inside the housing 1. One end of the coaxial spring pin module 2 contacts the high-frequency board 3, and the other end contacts the chip. One end of the SMP connector 4 is welded to the high-frequency board 3, and the other end is connected to a coaxial cable.

[0049] Please refer to Figure 1 、 Figure 2 、 Figure 4 and Figure 10 As shown, the housing 1 includes an outer shell 11 and a cover 12 that are snap-fitted together. They are mutually adapted and locked and fixed by a locking member 81. The cover 12, the high-frequency board 3, and the bottom wall of the outer shell 11 are provided with corresponding mounting holes. The locking member 81 sequentially passes through the mounting holes of the cover 12, the high-frequency board 3, and the bottom wall of the outer shell 11 and is fixed to fixedly connect the cover 12, the high-frequency board 3, and the outer shell 11. The top of the outer shell 11 is open, and sinking grooves 116 are provided on both sides of the opening. The corresponding sides of the cover 12 are disposed in the sinking grooves 116, and the surface of the cover 12 exposed outside is flush with the corresponding surface of the outer shell 11. In this embodiment, the housing 1 is generally in a cuboid shape, and the sinking grooves 116 are recessed downward from both short sides at the top of the outer shell 11; further, one end of the sinking groove 116 extends to one long side of the outer shell 11, and the other end is at a certain distance from the other long side of the outer shell 11. That is to say, the length of the sinking groove 116 is less than the length of the short side of the outer shell 11, and there is a part of the short side of the outer shell 11 that protrudes relative to the sinking groove 116. The cover 12 is provided with a notch 121 for avoiding this part. Thus arranged, at least part of the side surface and the lower surface of the cover 12 are in contact with the outer shell 11, and the outer surface of the housing 1 is relatively flat.

[0050] Please refer to Figure 4 、 Figure 6 and Figure 8As shown, the chip testing device further includes a fixing plate 5. The fixing plate 5 is disposed inside the housing 1. The high-frequency board 3 is clamped between the bottom wall of the outer shell 11 and the fixing plate 5. One side of the high-frequency board 3 abuts at least partially against the bottom wall of the outer shell 11, and the other side abuts at least partially against the fixing plate 5. Similarly, the fixing plate 5 is also provided with mounting holes. The locking member 81 sequentially passes through the mounting holes of the cover 12, the fixing plate 5, the high-frequency board 3, and the bottom wall of the outer shell 11 and is fixed to fixedly connect the cover 12, the fixing plate 5, the high-frequency board 3, and the outer shell 11.

[0051] Please refer to Figures 2 to 4 、 Figures 10 to 13 As shown, the coaxial spring pin module 2 is installed in the device through the first base 6. The bottom wall of the outer shell 11 is provided with a first hollow portion 111 communicating the inside and the outside of the housing 1. The radial outer contour of the first base 6 is adapted to the first hollow portion 111, and the first base 6 is disposed in the first hollow portion 111. Further, there is no fixed connection between the first base 6 and the first hollow portion 111. The first base 6 is inserted from the first hollow portion 111. After being in place, it can be helically fixed by passing a fastener through the first base 6, the high-frequency board 3, and the fixing plate 5 to position and contact the coaxial spring pin module 2 with the high-frequency board 3. When the coaxial spring pin module 2 needs to be replaced, the fastener is loosened to remove the first base 6 together with the coaxial spring pin module 2 disposed on the first base 6, which is convenient for disassembly and assembly. A strip groove 118 is further provided on the outer wall of the outer shell 11 for easy operation.

[0052] Please refer to Figures 2 to 4 、 Figures 13 to 17As shown in the figure, the coaxial spring pin module 2 includes coaxial pins 21 and a probe base 22. Multiple groups of coaxial pins 21 are arranged on the probe base 22. The probe base 22 is fixed to the first base 6. At least part of the coaxial pins 21 is located inside the housing 1 and at least part is located outside the housing 1. The coaxial pins 21 include a pin body 211 and needle tips 212 and needle tails 213 at both ends. The needle tips 212 are used to vertically contact the pins of the chip, and the needle tails 213 are in contact with the high-frequency board 3. The first base 6 includes a first clamping plate 61 and a second clamping plate 62. The first clamping plate 61 is provided with a first through hole 611, and the second clamping plate 62 is provided with a corresponding second through hole 621. At least part of the probe base 22 is located in the first through hole 611 and at least part is located in the second through hole 621. The probe base 22 is adapted to the first through hole 611 and the second through hole 621. Further, the first through hole 611 includes a first hole portion 6111 and a second hole portion 6112, wherein the first hole portion 6111 is farther from the second through hole 621 than the second hole portion 6112, and the aperture of the second hole portion 6112 is larger than that of the first hole portion 6111; the second through hole 621 includes a third hole portion 6211 and a fourth hole portion 6212, wherein the third hole portion 6211 is farther from the first through hole 611 than the fourth hole portion 6212, and the aperture of the fourth hole portion 6212 is larger than that of the third hole portion 6211. That is to say, the apertures of the upper and lower ends of the entire hole formed by the communication of the first through hole 611 and the second through hole 621 are smaller than the aperture of the middle part, and the outer diameter sizes of the upper and lower ends of the probe base 22 are smaller than the middle part. With such a setting, while ensuring the radial limit of the probe base 22 by the first base 6, the probe base 22 is also clamped and limited axially, so that the probe base 22 is fixed to the first base 6.

[0053] Further, please refer to Figure 15 、 Figure 16 、 Figure 16 and Figure 20As shown, the probe base 22 includes a first pin base 222 and a second pin base 223. The first pin base 222 is at least partially located in the first through hole 611, and the second pin base 223 is at least partially located in the second through hole 621. Specifically, the first pin base 222 includes a first base portion 2221 and a second base portion 2222. The first base portion 2221 is farther from the second pin base 223 than the second base portion 2222, and the first base portion 2221 is adapted to the first hole portion 6111, and the second base portion 2222 is adapted to the second hole portion 6112. The second pin base 223 includes a third base portion 2231 and a fourth base portion 2232. The third base portion 2231 is farther from the first pin base 222 than the fourth base portion 2232, and the third base portion 2231 is adapted to the third hole portion 6211, and the fourth base portion 2232 is adapted to the fourth hole portion 6212. There is a first connecting wall 6113 between the first hole portion 6111 and the second hole portion 6112, and there is a first abutting wall 2223 between the first base portion 2221 and the second base portion 2222. The first abutting wall 2223 abuts against the first connecting wall 6113, and the surface of the first base portion 2221 away from the second base portion 2222 is flush with the surface of the first clamping plate 61 away from the second clamping plate 62, and the surface of the second base portion 2222 away from the first base portion 2221 is flush with the surface of the first clamping plate 61 close to the second clamping plate 62. There is a second connecting wall 6213 between the third hole portion 6211 and the fourth hole portion 6212, and there is a second abutting wall 2233 between the third base portion 2231 and the fourth base portion 2232. The second abutting wall 2233 abuts against the second connecting wall 6213, and the surface of the third base portion 2231 away from the fourth base portion 2232 is flush with the surface of the second clamping plate 62 away from the first clamping plate 61, and the surface of the fourth base portion 2232 away from the third base portion 2231 is flush with the surface of the second clamping plate 62 close to the first clamping plate 61. The first clamping plate 61 and the second clamping plate 62 are at least partially in contact, and the first pin base 222 and the second pin base 223 are at least partially in contact. With such a setting, the limit fixation between the probe base 22 and the first base 6 is realized with a simple structure, and the flatness after the fixation of the two is ensured, so that the overall assembly after the fixation of the probe base 22 and the first base 6 can be more easily assembled.

[0054] Please refer to Figure 1 、 Figure 2 、 Figure 8 and Figure 9As shown, a plurality of inwardly recessed mounting grooves 112 are provided on the outer side wall of the outer shell 11, and a third through hole 113 communicating the mounting groove 112 with the inside of the housing 1 is provided. The SMP connector is disposed in the mounting groove 112. The SMP connector 4 includes a connector 41 and a socket 42. The connector 41 includes a center pin 411. The connector 41 is disposed on the socket 42 and the two are welded after positioning. The socket 42 is disposed in the mounting groove 112. At least a part of the center pin 411 is welded to the high-frequency board 3 and at least a part thereof is located in the mounting groove 112. Further, the outer contour of the socket 42 is adapted to the mounting groove 112, so as to ensure the flatness of the outside of the housing 1 after the SMP connector 4 is mounted in the mounting groove 112. The number of connectors 41 is the same as that of the coaxial pins 21, and the two are conductively connected one by one.

[0055] Please refer to Figure 8 、 Figure 9 、 Figure 10 、 Figure 22 and Figure 23 As shown, the socket 42 is provided with a fourth through hole 421 and a fifth through hole 422. The fourth through hole 421 is used for mounting the connector 41, and the fifth through hole 422 is used for fixing the socket 42. The connector 41 is adapted to the fourth through hole 421. The fourth through hole 421 communicates with the third through hole 113. At least a part of the center pin 411 is located in the fourth through hole 421 and passes through the third through hole 113 to the inside of the housing 1 and is welded to the high-frequency board 3. Further, the socket 42 is further provided with a welding hole 423 penetrating from the radial side surface of the fourth through hole 421 to the outer side wall of the socket 42, so as to facilitate welding the plug 41 to the socket 42. A sixth through hole 117 communicating the mounting groove 112 with the inside of the housing 1 is further provided at the mounting groove 112 of the outer shell 11. The fifth through hole 422 and the sixth through hole 117 are coaxially communicated and axially correspond to a fixing plate 5 inside the housing 1. The SMP connector 4, the outer shell 11 and the fixing plate 5 are fixedly connected by a fastener screwed to the fifth through hole 422, the sixth through hole 117 and the fixing plate 5.

[0056] Please refer to Figure 2 、 Figure 4 、 Figures 10 to 12 As shown, the chip testing device of this embodiment further includes a second base 7. A second hollow portion 114 communicating the inside of the housing 1 with the outside is further provided on the bottom wall of the outer shell 11. The second base 7 is disposed in the second hollow portion 114 and can be fixedly connected by screwing a fastener through the second base 7, the high-frequency board 3 and the fixing plate 5.

[0057] Further, please refer to Figure 4 、 Figure 6 、 Figure 8 、 Figures 10 to 13 、 Figure 21As shown, the surfaces of the first base 6 and the second base 7 facing the interior of the housing 1 are flush with the inner bottom wall of the outer shell 11. One side of the high-frequency board 3 abuts at least partially against the first base 6, the second base 7, and the inner bottom wall of the outer shell 11, and the other side of the high-frequency board 3 abuts at least partially against the fixing plate 5. The inner bottom wall of the outer shell 11 is provided with a plurality of recessed first grooves 115. The surface of the first clamping plate 61 away from the second clamping plate 62 faces the same direction as the inner bottom wall of the outer shell 11. The first clamping plate 61 is provided with a plurality of recessed second grooves 612. The second base 7 is provided with a plurality of recessed third grooves 71. The probe base 22 is provided with a fourth groove 221, and the fourth groove 221 is provided in the first pin base 222. The depths and widths of the recesses of the first groove 115, the second groove 612, the third groove 71, and the fourth groove 221 are equal. Then, when the entire device is assembled, the fourth groove 221, the second groove 612, the first groove 115, and the third groove 71 are sequentially corresponding and communicating, and one side of the high-frequency board 3 abuts at least partially against the first pin base 22 of the probe base 22, the first clamping plate 61, the inner bottom wall of the outer shell 11, and the second base 7, so that each group of communicating fourth groove 221, second groove 612, first groove 115, and third groove 71 forms a closed channel. At least a part of the center pin 411 of the connector 41 is located in the third groove 71, and at least a part of the coaxial pin 21 is located in the fourth groove 221. With such a setting, it can provide an avoidance function for the high-frequency channel between the coaxial pin 21 and the connector 41 that are conductively connected one by one. On the basis of effectively supporting the high-frequency signal transmission, by optimizing the impedance matching, the influence of the low-frequency circuit on the high-frequency signal transmission is reduced, so as to ensure stable and low-loss signal transmission still under high-frequency conditions.

[0058] Please refer to Figure 2 、 Figure 3 、 Figure 13 、 Figure 14 、 Figure 18 、 Figure 19 and Figure 20As shown, the coaxial needle 21 includes a high-frequency probe 201 and a ground probe 202. In each group of coaxial needles 21, the two ground probes 202 are arranged on both sides of the high-frequency probe 201, and the high-frequency probe 201 is at least partially located in the fourth groove 221. The needle bodies 211 of the high-frequency probe 201 and the ground probe 202 are both arranged in the probe base 22, the needle tips 212 both at least partially protrude from the second needle base 223, and the needle tails 213 both at least partially protrude from the first needle base 222. The high-frequency probe 201 and the ground probe 202 have the same length. The first needle base 222 is provided with a first needle hole 2224 penetrating through the first base 2221 and the second base 2222, and the second needle base 223 is provided with a second needle hole 2234 penetrating through the third base 2231 and the fourth base 2232. The first needle hole 2224 and the second needle hole 2234 are coaxial and communicate with each other for arranging the high-frequency probe 201. The needle body 211 of the high-frequency probe 201 is at least partially located in the first needle hole 2224 and at least partially located in the second needle hole 2234, the needle tip 212 at least partially protrudes from one end of the second needle hole 2234 away from the first needle hole 2224, and the needle tail 213 at least partially protrudes from one end of the first needle hole 2224 away from the second needle hole 2234. The first needle base 222 is further provided with a third needle hole 2225 penetrating through the first base 2221 and the second base 2222, and the second needle base 223 is provided with a fourth needle hole 2235 penetrating through the third base 2231 and the fourth base 2232. The third needle hole 2225 and the fourth needle hole 2235 are coaxial and communicate with each other for arranging the ground probe 202. The needle body 211 of the ground probe 202 is at least partially located in the third needle hole 2225 and at least partially located in the fourth needle hole 2235, the needle tip 212 at least partially protrudes from one end of the fourth needle hole 2235 away from the third needle hole 2225, and the needle tail 213 at least partially protrudes from one end of the third needle hole 2225 away from the fourth needle hole 2235.

[0059] Please refer to Figure 3 、 Figure 7 、 Figure 18 、 Figure 19 and Figure 20As shown, the second needle base 223 further includes a plurality of bosses 2236. The bosses 2236 protrude from the side of the third base 2231 away from the fourth base 2232. The second needle hole 2234 and the fourth needle hole 2235 both penetrate through the bosses 2236, the third base 2231, and the fourth base 2232. The needle tips 212 of the high-frequency probe 201 and the ground probe 202 are exposed from the bosses 2236. Further, a counterbore groove 2237 is provided on the side of the boss 2236 away from the third base 2231. The side of the boss 2236 away from the third base 2231 has a first wall surface 2238 and a second wall surface 2239. Among them, the first wall surface 2238 is the wall of the boss 2236 that is farthest from the third base 2231 as a whole, and the second wall surface 2239 is the bottom wall of the counterbore groove 2237. The high-frequency probe 201 is exposed from the second wall surface 2239, and the ground probe 202 is exposed from the first wall surface 2238.

[0060] Please refer to Figure 13 , Figure 14 , Figures 18 to 20 As shown, the fourth groove 221 communicates with the first needle hole 2224. A table portion 2211 is provided in the fourth groove 221. The top wall of the table portion 2211 is located between the bottom wall of the fourth groove 221 and the wall of the first base 2221 away from the second base 2222. The high-frequency probe 201 further includes a first insulator 214 and a second insulator 215 sleeved on the outer periphery. The first insulator 214 sleeves and fits the part of the needle body 211 close to the needle tail 213 and the part of the needle tail 213 close to the needle body 211, and at least part of the needle tail 213 is exposed outside the first insulator 214. Further, at least part of the side of the first insulator 214 close to the needle tip 212 abuts against the top wall of the table portion 2211, and the side of the first insulator 214 away from the needle tip 212 is flush with the wall of the first base 2221 away from the second base 2222. The second insulator 215 sleeves and fits the part of the needle body 211 close to the needle tip 212 and the part of the needle tip 212 close to the needle body 211, and at least part of the needle tip 212 is exposed outside the second insulator 215. Further, at least part of the second insulator 215 is located in the second needle hole 2234 and at least part of it is exposed from the counterbore groove 2237. The side of the second insulator 215 away from the needle tail 213 is flush with the first wall surface 2238.

[0061] Please refer to Figure 24 As shown, for the chip testing device of this embodiment, the needle tip 212 of the coaxial needle 21 contacts the pin of the device under test, i.e., the chip, and the needle tail 213 contacts the high-frequency board 3. The high-frequency board 3 leads out a high-frequency line and is welded to the SMP connector 4, so that the pins of the device under test are led out in sequence by the coaxial needle 21, the high-frequency board 3, and the SMP connector 4.

[0062] Please refer to Figure 25 and Figure 26As shown, in an embodiment of the present invention, the chip 10 to be tested is placed in the test frame 20. The illustrated test frame 20 can hold four chips 10 to be tested simultaneously. A limiting shaft 30 is installed in the test frame 20 to limit the chip testing device. Axially corresponding holes are preset in the bottom wall of the housing 11, the high-frequency board 3, the fixing plate 5, and the cover 12. The limiting shaft 20 passes through these holes in sequence, and a spring 40 is sleeved on the outer periphery of the limiting shaft 20. The spring 40 is located between the test frame 20 and the bottom wall of the housing 11 of the chip testing device, realizing elastic operation and precise positioning. Specifically, the chip 10 to be tested is a KU antenna chip, and the chip testing device measures its electrical characteristics at millimeter-wave frequencies. The chip 10 to be tested has eight test points, that is, eight pins 101. Therefore, eight groups of coaxial pins 21 and eight SMP connectors 4 are correspondingly provided in the chip testing device, and the coaxial pins 21 are perpendicularly corresponding to the pins 101 of the chip 10 to be tested one by one. This chip testing device does not need to use a probe station as a base, has a small volume, and greatly reduces the steps and time in the production, assembly, and operation processes, significantly improving the efficiency; at the same time, it can adapt to the characteristics of the chip 10 to be tested such as inversion, small space, and quick insertion, providing a new testing method.

[0063] In summary, compared with the prior art, the chip testing device of the present invention has the following advantages: By adopting the integrated method of the coaxial spring needle module 2, the high-frequency board 3, and the SMP connector 4, the volume of the whole device is small. The needle tip 212 of the coaxial pin 21 contacts the pin of the chip, and the needle tail 213 contacts the high-frequency board. The connector 41 of the SMP connector 4 is welded to the high-frequency board 3, which can effectively support the transmission of high-frequency signals, and by optimizing the impedance matching, the influence of the low-frequency circuit on the signal transmission is reduced. This chip testing device simplifies the manufacturing process, reduces the line length and complexity, and greatly reduces the time for assembly and operation, thereby improving the production efficiency.

[0064] The above embodiments are only used to illustrate the present invention and do not limit the technical solutions described in the present invention. The understanding of this specification should be based on those skilled in the art of the relevant technical field. Although this specification has described the present invention in detail with reference to the above embodiments, those of ordinary skill in the art should understand that those skilled in the relevant technical field can still modify the present invention or make equivalent substitutions, and all technical solutions and their improvements that do not depart from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.

Claims

1. A chip testing device, characterized in that, Including: A housing (1), a coaxial spring pin module (2), a high-frequency board (3), an SMP connector (4), a first base (6) and a second base (7). The high-frequency board (3) is disposed inside the housing (1). The coaxial spring pin module (2) is disposed on the first base (6). The coaxial spring pin module (2) includes multiple groups of coaxial pins (21) and a probe base (22). The coaxial pins (21) are disposed on the probe base (22). The probe base (22) is disposed on the first base (6). The coaxial pin (21) includes a pin body (211), a pin head (212) and a pin tail (213). The pin head (212) is used for vertically contacting the pins of the chip. The pin tail (213) contacts the high-frequency board (3). The SMP connector (4) abuts against the second base (7). Both the first base (6) and the second base (7) are disposed on the inner bottom wall of the housing (1). A plurality of SMP connectors (4) are provided. The SMP connector (4) includes a connector (41). The connector (41) is welded to the high-frequency board (3) and is conductively connected to the coaxial pin (21) one by one. A plurality of first grooves (115) are provided on the inner bottom wall of the housing (1). A plurality of second grooves (612) are provided on the first base (6). A plurality of third grooves (71) are provided on the second base (7). A plurality of fourth grooves (221) are provided on the probe base (22). The fourth grooves (221), the second grooves (612), the first grooves (115) and the third grooves (71) are sequentially and correspondingly communicated. At least a part of the connector (41) is located in the third groove (71). At least a part of the coaxial pin (21) is located in the fourth groove (221).

2. The chip testing device according to claim 1, characterized in that: The housing (1) includes an outer shell (11) and a cover body (12) that are buckled with each other. A locking member (81) sequentially passes through the cover body (12), the high-frequency board (3) and the bottom wall of the outer shell (11) and is fixed.

3. The chip testing device according to claim 2, wherein: The chip testing device further includes a fixing plate (5). The fixing plate (5) is disposed inside the housing (1). The high-frequency board (3) is clamped between the bottom wall of the outer shell (11) and the fixing plate (5). The locking member (81) sequentially passes through the cover body (12), the fixing plate (5), the high-frequency board (3) and the bottom wall of the outer shell (11) and is fixed.

4. The chip testing device according to claim 2, wherein: The bottom wall of the outer shell (11) is provided with a first hollowed-out portion (111) that communicates the inside and the outside of the housing (1). The radial outer contour of the first base (6) is adapted to the first hollowed-out portion (111). The first base (6) is disposed in the first hollowed-out portion (111). At least a part of the coaxial pin (21) is located inside the housing (1) and at least a part of it is located outside the housing (1).

5. The chip testing device according to claim 4, wherein: The first base (6) includes a first clamping plate (61) and a second clamping plate (62). The first clamping plate (61) is provided with a first through hole (611), and the second clamping plate (62) is provided with a corresponding second through hole (621). The probe base (22) is fixed to the first base (6) and at least partially located in the first through hole (611) and the second through hole (621).

6. The chip testing device according to claim 5, wherein: The probe base (22) is adapted to the first through hole (611) and the second through hole (621). The first through hole (611) includes a first hole portion (6111) and a second hole portion (6112). The first hole portion (6111) is farther from the second through hole (621) than the second hole portion (6112). The aperture of the second hole portion (6112) is larger than that of the first hole portion (6112). The second through hole (621) includes a third hole portion (6211) and a fourth hole portion (6212). The third hole portion (6211) is farther from the first through hole (611) than the fourth hole portion (6212). The aperture of the fourth hole portion (6212) is larger than that of the third hole portion (6211).

7. The chip testing device according to claim 5, wherein: A plurality of mounting grooves (112) and third through holes (113) communicating the mounting grooves (112) with the interior of the housing (1) are provided on the outer side wall of the housing (11). The SMP connector (4) is disposed in the mounting grooves (112). The connector (41) includes a center pin (411). The center pin (411) is at least partially welded to the high-frequency board (3) and at least partially located in the mounting grooves (112).

8. The chip testing device according to claim 7, wherein: The bottom wall of the housing (11) is further provided with a second hollow portion (114) communicating the interior of the housing (1) with the outside. The second base (7) is disposed in the second hollow portion (114). The surfaces of the first base (6) and the second base (7) facing the interior of the housing (1) are flush with the inner bottom wall of the housing (11). One surface of the high-frequency board (3) at least partially abuts against the first base (6), the second base (7), and the inner bottom wall of the housing (11).

9. The chip testing device according to claim 8, wherein: A plurality of first grooves (115) are provided on the inner bottom wall of the housing (11). The surface of the first clamping plate (61) away from the second clamping plate (62) faces the same direction as the inner bottom wall of the housing (11). The first clamping plate (61) is provided with a plurality of second grooves (612).

10. The chip testing device according to claim 9, wherein: The coaxial pin (21) includes a high-frequency probe (201) and a ground probe (202). The high-frequency probe (201) is at least partially located in the fourth groove (221). One surface of the high-frequency board (3) at least partially abuts against the probe base (22), the first clamping plate (61), the inner bottom wall of the housing (11), and the second base (7), so that each group of connected fourth grooves (221), second grooves (612), first grooves (115), and third grooves (71) forms a closed channel.

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