Secondary board card batch screening test device and method

Abstract

The invention provides a secondary board card batch screening test device and method, and the device comprises a board card test module connected with a power conversion module, and a background monitoring module connected with the board card test module. The power supply conversion module outputs a corresponding output voltage based on basic information of a to-be-tested secondary board card in the board card test module, and then the board card test module transmits the output voltage to the to-be-tested secondary board card in the board card test module. And board card test data generated after the output voltage passes through the to-be-tested secondary board card is sent to a background monitoring module, the background monitoring module detects the test state of the to-be-tested secondary board card in the board card test module, and a board card test report is generated based on the received board card test data. According to the invention, batch test screening of the secondary board card is realized, accurate identification of the state information of the secondary board card is realized, the screening time of the secondary board card is shortened, and the accuracy of the screening test result is ensured.

Description

Technical Field

[0001] The present invention relates to the field of circuit systems, and in particular to a secondary board batch screening test device and method. Background Art

[0002] In the power system, the relay protection device often acts as the "brain" of the system control, and its safe and reliable operation is the key factor to ensure the normal operation of the system. Usually, the relay protection device is composed of a large number of secondary boards, and the boards need to be strictly screened and tested before leaving the factory to prevent unreliable operation caused by production processes or human factors. On the one hand, since the relay protection device is equipped with a large number of boards and the functions of the boards are different, customized tests need to be carried out for boards with different functions during factory testing; on the other hand, in order to ensure the reliability of factory screening, the test products need to be tested for a long time in a high and low temperature environment, and special testers are required to record the status information of the tested boards in real time. Therefore, the factory test of the relay protection secondary boards has many test items and a long test cycle. At this stage, the traditional form of manual screening has the disadvantages of low efficiency, high false pass rate and high labor cost.

[0003] Therefore, a test method that can automatically screen secondary boards is needed to meet the factory requirements of relay protection devices. Summary of the invention

[0004] In order to solve the problems of low efficiency and high false pass rate caused by manual secondary board screening in the prior art, the present invention proposes a secondary board batch screening test device and method.

[0005] In a first aspect, a secondary board batch screening test device is provided, comprising:

[0006] A power conversion module, the power conversion module is connected to the board test module, and is used to output a corresponding output voltage based on the basic information of the secondary board to be tested in the board test module;

[0007] A board test module, the board test module is also connected to the background monitoring module, and is used to transmit the output voltage to the secondary board to be tested in the board test module, and send the board test data generated after the output voltage passes through the secondary board to be tested to the background monitoring module;

[0008] The background monitoring module is used to monitor the test status of the secondary board to be tested in the board testing module, and generate a board test report based on the received board test data.

[0009] Preferably, the secondary board to be tested comprises:

[0010] A power board, the upper end of which is connected to the power conversion module and supplies power to the interface board and the core board through the lower end of the power board and the backplane;

[0011] Backplane, used to realize output voltage distribution and data exchange between the interface board and the core board;

[0012] An interface board, used for sending the board test status data corresponding to the power board and / or the interface board to the core board through the backplane;

[0013] The core board is used for packaging the board test status data sent by the interface board, and sending the board test status data to the background monitoring module through a high-speed optical port.

[0014] Preferably, the power conversion module comprises:

[0015] A multi-channel voltage output circuit, one end of which is connected to the power conversion module, and the other end is respectively connected to the power board corresponding to each secondary board to be tested in the board test module, for transmitting the output voltage of different secondary boards to be tested in the board test module.

[0016] In a second aspect, the present invention provides a secondary board batch screening test method, comprising:

[0017] Obtaining basic information of a secondary board to be tested in a board test module, and determining board test requirements based on the basic information of the secondary board to be tested;

[0018] Configuring the output voltage of the secondary board to be tested based on the board test requirements through a power conversion module;

[0019] The background monitoring module configures the test configuration state of the secondary board to be tested based on the board test requirements and the output voltage, collects board test data generated by the secondary board to be tested based on the test configuration state, and generates a board test report based on the board test data.

[0020] Preferably, the board test data includes one or more of the following:

[0021] The optical port status, optical port data communication, backplane bus communication status, real-time power supply voltage, power board status information or board temperature of the secondary board to be tested.

[0022] Preferably, configuring the test configuration state of the secondary board to be tested based on the board test requirement and the output voltage through the background monitoring module includes:

[0023] Determine the board configuration information of the secondary board to be tested based on the board test requirement and the output voltage through a background monitoring module;

[0024] Configuring the test configuration state of the secondary board to be tested based on the board configuration information;

[0025] The board configuration information includes the number of boards and the type of boards.

[0026] Preferably, after configuring the test configuration state of the secondary board to be tested based on the board configuration information, the method further includes:

[0027] Detecting whether the optical fiber of the secondary board to be tested is connected;

[0028] If not, reconnect the optical fiber of the secondary board to be tested;

[0029] If yes, then end.

[0030] Preferably, after collecting the board test data generated by the secondary board to be tested based on the test configuration state, the method further includes:

[0031] Determine whether the board test data meets the preset test alarm condition;

[0032] When it is determined that the board test data meets the preset test alarm condition, a board test alarm notification is generated.

[0033] In another aspect, the present application further provides an electronic device, comprising: at least one processor and a memory; the memory and the processor are connected via a bus;

[0034] The memory is used to store one or more programs;

[0035] When the one or more programs are executed by the at least one processor, a secondary board batch screening test method as described above is implemented.

[0036] On the other hand, the present application also provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed, a secondary board batch screening test method as described above is implemented.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] The present invention provides a secondary board batch screening test device and method, the device includes a board test module connected to a power conversion module and a background monitoring module connected to the board test module, the power conversion module outputs a corresponding output voltage based on the basic information of the secondary board to be tested in the board test module, and then transmits the output voltage to the secondary board to be tested in the board test module through the board test module, and then sends the board test data generated after the output voltage passes through the secondary board to be tested to the background monitoring module, and detects the test status of the secondary board to be tested in the board test module through the background monitoring module, and generates a board test report based on the received board test data. The present invention realizes batch test screening for secondary boards, and realizes accurate identification of secondary board status information, shortens the screening time of secondary boards, and ensures the accuracy of screening test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of the secondary board batch screening test device of the present invention;

[0040] Figure 2 It is a flow chart of the secondary board batch screening test method of the present invention;

[0041] Figure 3 It is a specific flow chart of the secondary board batch screening test method of the present invention;

[0042] Figure 4 A board configuration interface for a screening test system of a secondary board batch screening test method of the present invention;

[0043] Figure 5 A monitoring status interface of a screening test system of a secondary board batch screening test method of the present invention;

[0044] Figure 6 It is a detailed status interface of the screening test system of the secondary board batch screening test method of the present invention;

[0045] Figure 7 It is an error log interface of the screening test system of the secondary board batch screening test method of the present invention;

[0046] Figure 8 The test parameter configuration interface of the screening test system of the secondary board batch screening test method of the present invention

[0047] Fig. 9 The figure is a schematic diagram of the structure of an electronic device of the present invention. DETAILED DESCRIPTION

[0048] The present invention proposes a secondary board batch screening test device and method, which can effectively improve the screening efficiency of secondary boards before they leave the factory, and significantly reduce the problem of unqualified screening caused by human factors. In addition, in view of the problem of testing a wide variety of secondary boards and a long test project cycle, an automatic screening test method suitable for different secondary boards is proposed. The present invention has the characteristics of wide application range, high efficiency and high accuracy, and has a strong promotion significance in engineering applications.

[0049] In order to better understand the present invention, the content of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0050] Example 1

[0051] A secondary board batch screening test device, such as Figure 1 As shown, including:

[0052] A power conversion module, the power conversion module is connected to the board test module, and is used to output a corresponding output voltage based on the basic information of the secondary board to be tested in the board test module;

[0053] A board test module, the board test module is also connected to the background monitoring module, and is used to transmit the output voltage to the secondary board to be tested in the board test module, and send the board test data generated after the output voltage passes through the secondary board to be tested to the background monitoring module;

[0054] The background monitoring module is used to monitor the test status of the secondary board to be tested in the board testing module, and generate a board test report based on the received board test data.

[0055] In this embodiment, the secondary board to be tested includes a power board, the upper end of the power board is connected to the power conversion module and supplies power to the interface board and the core board through the lower end of the power board and the backplane; the backplane is used to realize the distribution of output voltage and data interaction between the interface board and the core board; the interface board is used to send the board test status data corresponding to the power board and / or the interface board to the core board through the backplane; the core board is used to package the board test status data sent by the interface board, and send the board test status data to the background monitoring module through the high-speed optical port.

[0056] In one embodiment, the board test module is mainly composed of secondary boards to be tested, and the module is based on chassis, and each chassis is equipped with a number of secondary boards to be tested. The types of boards are mainly composed of power boards, interface boards, core boards and backplanes. The power board is connected to the power conversion device at the top and supplies power to the entire chassis through the backplane at the bottom; the interface board adopts a self-receiving and self-transmitting test mode, and collects the optical port receiving and transmitting status to the core board through the backplane bus; the core board is mainly used to package the data of all interface boards, chassis temperature, power supply voltage and other information, and is connected to the monitoring background through a high-speed optical port; the backplane mainly realizes the distribution of power supply and data interaction between boards.

[0057] In this embodiment, the power conversion module includes a multi-channel voltage output circuit, one end of which is connected to the power conversion module, and the other end is respectively connected to the power board corresponding to each secondary board to be tested in the board test module, so as to transmit the output voltage to different secondary boards to be tested in the board test module.

[0058] In one embodiment, the power conversion module is used to convert the supply voltage of the device into the output voltage required by the secondary board to be tested, and supports wide AC and DC voltage input. The output adopts a flexible and adjustable method, supporting up to 16 outputs at the same time, and each output is independent of each other and can be configured separately. Before the test begins, the tester needs to flexibly adjust the output voltage of the power conversion module according to the different types of secondary boards to be tested, and adapt it to the chassis to be tested. In order to ensure the reliable operation of the device, the power conversion module is equipped with an electronic fuse, which can ensure the safety of the device by quick disconnection when overcurrent, overvoltage and overtemperature occur.

[0059] In addition, the input part of the power conversion module can adapt to AC / DC 110V~220V input. After passing through the power conversion device, the input voltage is converted into the required input power DC-24V / 12V / 5V of the secondary board to be tested, so as to meet the voltage input requirements of different functional boards, and the power conversion device can output a maximum power of 4000W.

[0060] In one embodiment, the background monitoring module is used to monitor the test status of the secondary board to be tested in real time. The monitoring information mainly includes the optical port status, optical port data communication, backplane bus communication status, real-time power supply voltage, power board status information and board temperature of the secondary board to be tested; users can flexibly configure the type, quantity and number of the boards to be tested according to engineering requirements. In addition, the background can also set the test communication rate, power supply voltage alarm threshold, overtemperature alarm threshold and communication fault continuous judgment time according to test requirements; after the test is completed, the background monitoring platform can automatically generate a test report and record the test information of all secondary boards to be tested.

[0061] In a specific implementation, the background monitoring module can be customized according to the type and quantity of the chassis and boards. After the measurement starts, the background can display the test results in real time according to the data uploaded by the core board, such as whether there is a communication failure during the test, whether the self-test information of the board chip is normal, whether the power input is normal, and whether the problem of the tested product is in a normal state, etc. The tester can choose to monitor the operating status of a single board by clicking on the hardware board configuration interface of the background. In addition, in order to improve the adaptability of the test device, the background can manually adjust the rate, cycle and length of the test communication to adapt to the factory test requirements of different projects.

[0062] Example 2

[0063] A secondary board batch screening test method, such as Figure 2 As shown, including:

[0064] Step 1: Obtain basic information of a secondary board to be tested in a board test module, and determine board test requirements based on the basic information of the secondary board to be tested;

[0065] Step 2: configuring the output voltage of the secondary board to be tested based on the board test requirements through a power conversion module;

[0066] Step 3: Configure the test configuration state of the secondary board to be tested based on the board test requirements and the output voltage through the background monitoring module, collect the board test data generated by the secondary board to be tested based on the test configuration state, and generate a board test report based on the board test data.

[0067] In this embodiment, the board test data includes one or more of the following: optical port status, optical port data communication, backplane bus communication status, real-time power supply voltage, power board status information or board temperature of the secondary board to be tested.

[0068] In this embodiment, in step 3, the process of configuring the test configuration state of the secondary board to be tested based on the board test requirements and the output voltage by the background monitoring module includes:

[0069] Determine the board configuration information of the secondary board to be tested based on the board test requirement and the output voltage through a background monitoring module;

[0070] Configuring the test configuration state of the secondary board to be tested based on the board configuration information;

[0071] The board configuration information includes the number of boards and the type of boards.

[0072] In this embodiment, after configuring the test configuration state of the secondary board to be tested based on the board configuration information, the method further includes:

[0073] Detecting whether the optical fiber of the secondary board to be tested is connected;

[0074] If not, reconnect the optical fiber of the secondary board to be tested;

[0075] If yes, then end.

[0076] In this embodiment, after collecting the board test data generated by the secondary board to be tested based on the test configuration state in step 3, the method further includes:

[0077] Determine whether the board test data meets the preset test alarm condition;

[0078] When it is determined that the board test data meets the preset test alarm condition, a board test alarm notification is generated.

[0079] See also Figure 3 , Figure 3 This is a specific flow chart of a secondary board batch screening test method of the present invention, Figure 3 The present invention is described for batch screening test of secondary boards.

[0080] First, connect the test device to the input power supply and determine the power input requirements of the chassis under test. Then, adjust the output of each power supply separately according to the requirements. The maximum power that each power supply can carry is 200W. According to the number and type of boards to be tested, configure the number and type of boards and chassis in the background, and ensure that the configuration is consistent with the actual test. According to the test requirements, set the internal communication rate, communication frame length, and alarm threshold of the board chassis in the background. After the settings are completed, check the fiber optic connection of the tested product to ensure that the optical transceiver of each board can participate in the screening test. After the inspection is correct, click Start Test in the background of the host computer, and choose to end the test and generate a report according to the test requirements.

[0081] See also Figure 4-8 , Figure 4 It is a board configuration interface of the screening test system of the secondary board batch screening test method of the present invention, Figure 5 It is the monitoring status interface of the screening test system of the secondary board batch screening test method of the present invention, Figure 6 It is a detailed status interface of the screening test system of the secondary board batch screening test method of the present invention, Figure 7 It is the error log interface of the screening test system of the secondary board batch screening test method of the present invention, Figure 8 This is the test parameter configuration interface of the screening test system of the secondary board batch screening test method of the present invention. Figures 4 to 8 The aging screening test system of the present invention is described.

[0082] Specifically, the board configuration interface can check the number and type of boards that need to be configured for this aging screening test; the monitoring status interface can provide an overview of the aging screening status of all test boards. If there is an abnormal board test, the interface can display an alarm in real time and mark the fault; the detailed status interface can select any board by clicking, especially the faulty board, to further observe the detailed test information of the faulty board to locate the source of the fault, such as the number of communication failures, whether the board temperature exceeds the threshold, whether the power supply is abnormal, etc.; the error log interface can record the fault conditions of all boards since the test, and has the function of message display; the test parameter configuration interface is used to configure the various parameters required for the screening test.

[0083] Example 3

[0084] like Fig. 9 As shown, the present invention also provides an electronic device, which may be a computer device, a single-chip device, an intelligent mobile device, etc. The electronic device in this embodiment may include a processor, a memory, a transceiver component, etc. The memory, the processor, and the transceiver component are connected via a bus; the memory may be used to store an execution program, and an exemplary execution program may include instructions; the processor is used to execute the instructions stored in the memory. The memory may also be used to store data, which may be called and / or modified when the instructions are executed.

[0085] The processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. It is the computing core and control core of the terminal, which is suitable for implementing one or more instructions, specifically suitable for loading and executing one or more instructions in a storage medium to implement the corresponding method flow or corresponding functions, so as to implement the steps of a secondary board batch screening test method in the above-mentioned embodiment.

[0086] Example 4

[0087] Based on the same inventive concept, the present invention also provides a readable storage medium, specifically an electronic device readable storage medium (Memory), which is a memory device in an electronic device for storing programs and data. It is understandable that the storage medium here can include both a built-in storage medium in an electronic device and an extended storage medium supported by the electronic device. The storage medium provides a storage space, which stores the operating system of the terminal. In addition, one or more instructions suitable for being loaded and executed by a processor are also stored in the storage space, and these instructions can be one or more execution programs (including program codes). It should be noted that the storage medium here can be a high-speed RAM memory or a non-volatile memory, such as at least one disk memory. The processor loads and executes one or more instructions stored in the storage medium, which can implement the steps of a secondary board batch screening test method in the above embodiment.

[0088] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0089] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0090] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0091] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0092] The above are merely embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention are included in the scope of the claims of the present invention to be approved.

Claims

1. A secondary board batch screening test device, characterized in that: include: A power conversion module, the power conversion module is connected to the board test module, and is used to output a corresponding output voltage based on the basic information of the secondary board to be tested in the board test module; A board test module, the board test module is also connected to the background monitoring module, and is used to transmit the output voltage to the secondary board to be tested in the board test module, and send the board test data generated after the output voltage passes through the secondary board to be tested to the background monitoring module; The background monitoring module is used to monitor the test status of the secondary board to be tested in the board testing module, and generate a board test report based on the received board test data.

2. The device according to claim 1, characterized in that The secondary board to be tested comprises: A power board, the upper end of which is connected to the power conversion module and supplies power to the interface board and the core board through the lower end of the power board and the backplane; Backplane, used to realize output voltage distribution and data exchange between the interface board and the core board; An interface board, used for sending the board test status data corresponding to the power board and / or the interface board to the core board through the backplane; The core board is used for packaging the board test status data sent by the interface board, and sending the board test status data to the background monitoring module through a high-speed optical port.

3. The device according to claim 1, characterized in that The power conversion module comprises: A multi-channel voltage output circuit, one end of which is connected to the power conversion module, and the other end is respectively connected to the power board corresponding to each secondary board to be tested in the board test module, for transmitting the output voltage of different secondary boards to be tested in the board test module.

4. A secondary board batch screening test method, characterized in that: include: Obtaining basic information of a secondary board to be tested in a board test module, and determining board test requirements based on the basic information of the secondary board to be tested; Configuring the output voltage of the secondary board to be tested based on the board test requirements through a power conversion module; The background monitoring module configures the test configuration state of the secondary board to be tested based on the board test requirements and the output voltage, collects board test data generated by the secondary board to be tested based on the test configuration state, and generates a board test report based on the board test data.

5. The method according to claim 4, characterized in that The board test data includes one or more of the following: The optical port status, optical port data communication, backplane bus communication status, real-time power supply voltage, power board status information or board temperature of the secondary board to be tested.

6. The method according to claim 4, characterized in that The configuring the test configuration state of the secondary board to be tested based on the board test requirement and the output voltage by the background monitoring module includes: Determine the board configuration information of the secondary board to be tested based on the board test requirement and the output voltage through a background monitoring module; Configuring the test configuration state of the secondary board to be tested based on the board configuration information; The board configuration information includes the number of boards and the type of boards.

7. The method according to claim 6, characterized in that After configuring the test configuration state of the secondary board to be tested based on the board configuration information, the method further includes: Detecting whether the optical fiber of the secondary board to be tested is connected; If not, reconnect the optical fiber of the secondary board to be tested; If yes, then end.

8. The method according to claim 5, characterized in that After collecting the board test data generated by the secondary board to be tested based on the test configuration state, the method further includes: Determine whether the board test data meets the preset test alarm condition; When it is determined that the board test data meets the preset test alarm condition, a board test alarm notification is generated.

9. An electronic device, characterized in that: include: at least one processor and memory; The memory and the processor are connected via a bus; The memory is used to store one or more programs; When the one or more programs are executed by the at least one processor, the secondary board batch screening test method according to any one of claims 4 to 8 is implemented.

10. A readable storage medium, characterized in that: An execution program is stored thereon, and when the execution program is executed, the secondary board batch screening test method as described in any one of claims 4 to 8 is implemented.

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