Wafer positioning equipment for gluing developing machine

Abstract

The invention belongs to the technical field of gluing and developing auxiliary equipment, and discloses wafer positioning equipment for a gluing and developing machine, the wafer positioning equipment comprises a carrier plate and a positioning operation arm, a main clamping assembly is fixedly arranged in the carrier plate, and mounting plates are fixedly arranged at the two ends of the main clamping assembly. According to the invention, the two-side extruding and pushing assemblies extrude and push along the two sides of the back of the adjustable clamping part, control the deformation of the elastic metal sheet and the thermal stress sheet, and fit along the outer side surface of the wafer to adapt to the arc surface of the outer side of the wafer so as to realize sufficient tight fit and clamping, thereby adapting to clamping of wafers of different sizes, and improving the clamping efficiency. The bending radian is rapidly adjusted to adapt to the outer side arc surface of the wafer, the use range of experience positioning is greatly widened, replacement of a positioning clamping mold is avoided, meanwhile, the adjusting process can be adjusted in real time according to the wafer size, the bending temperature can be maintained after adjustment, continuous and rapid use after one-time adjustment is achieved for the wafers of the same size, the comprehensive use effect is good, and the production efficiency is high. Adaptive adjustment is simple and fast, and the use effect is good.

Description

Technical Field

[0001] The invention belongs to the technical field of adhesive coating and developing auxiliary equipment, in particular to a wafer positioning device for an adhesive coating and developing machine. Background Art

[0002] The wafer positioning equipment for the photolithography developer is a key component in the semiconductor manufacturing lithography process. It ensures the precise positioning of the wafer during the photolithography and development process, thereby ensuring the formation of fine exposure patterns in the photolithography process and the graphic quality of the development process. It completes the photolithography and development operations by stably clamping and steadily moving the wafer to the development area.

[0003] The wafer positioning equipment for the coating and developing machine in the prior art adopts the method of clamping the outer side of the wafer during use. After the wafer is clamped and fixed, the wafer is positioned in the area to be coated and developed in cooperation with the preset action of the positioning operating arm. However, in the actual positioning and clamping process, in order to maintain a good positioning effect by stable clamping, a good clamping area is required. Usually, the clamping part is made into an arc-shaped contact surface. The stability of positioning is improved by a sufficient clamping area to avoid wafer vibration during positioning. It also adapts to the outer arc surface of the wafer, provides stable positioning and clamping, and further reduces the damage of the clamping part to the wafer during the positioning operation. However, different wafers have different sizes and specifications, and different arc-shaped clamping molds are often required to be replaced. The molds can also be replaced as needed for different batches of wafers. When wafers of different sizes need to be processed alternately, frequent mold replacement is labor-intensive, which affects the wafer processing efficiency and makes it difficult to achieve quick and effective adaptive positioning and clamping. Summary of the invention

[0004] The object of the present invention is to provide a wafer positioning device for a glue coating and developing machine to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical scheme: a wafer positioning device for a glue coating and developing machine, comprising a carrier plate and a positioning operating arm, a main clamping assembly is fixedly arranged inside the carrier plate, mounting plates are fixedly arranged at both ends of the main clamping assembly, a connecting rod is fixedly connected to the top of the mounting plate, an adjustable clamping part is fixedly arranged at the end of the connecting rod, a lateral movement adjustment assembly is fixedly arranged on the top of the mounting plate, squeezing and pushing assemblies are symmetrically distributed on both sides of the connecting rod, the movable ends of the squeezing and pushing assemblies are movably sleeved on the back side of the adjustable clamping part, the lateral movement adjustment assembly controls the squeezing and pushing assemblies distributed on both sides to move synchronously at the same time, a distributed air supply assembly is fixedly arranged on the top of the connecting rod, the distributed air supply assembly has two air outlet ends, one air outlet end is connected to the adjustable clamping part, and the other air outlet end is connected to the squeezing and pushing assembly, and the main clamping assembly controls the adjustable clamping parts on both sides to move synchronously; The adjustable clamping part includes an elastic metal sheet, an arc groove, a thermal stress sheet, an internal arc cavity and an oblique air outlet hole. The arc groove is opened on the back side of the elastic metal sheet, the thermal stress sheet is fixedly connected to the front side of the elastic metal sheet, and the internal arc cavity and the oblique air outlet hole are both opened inside the elastic metal sheet and are connected to each other.

[0006] Preferably, the positioning operating arm is fixed on one side of the carrier plate, and a suction component is fixedly sleeved on the other side of the carrier plate, and the suction component sucks air in the main clamping component.

[0007] Preferably, the main clamping assembly includes a connecting seat, a fixed sleeve, a push rod, a fixed ring and a spring. The fixed sleeve is fixedly sleeved inside the carrier plate, one end of the push rod is movably sleeved in the fixed sleeve, and the other end is fixedly connected to the connecting seat, the fixed ring is fixedly sleeved in the fixed sleeve, one end of the spring is fixedly connected to the fixed ring, and the other end is fixedly connected to the push rod.

[0008] Preferably, the suction assembly includes an electric push rod, a movable plug and a suction chamber, the electric push rod is fixed to the side of the carrier plate through a bracket, the suction chamber is opened inside the carrier plate and communicated with the fixed sleeve, the movable plug is fixedly connected to the movable end of the electric push rod, and the movable sleeve is connected in the suction chamber.

[0009] Preferably, the outer end of the inclined air outlet hole is inclined downward, the inclined air outlet hole array is distributed inside the elastic metal sheet and located above the thermal stress sheet, the thermal stress sheet is an elastic alloy, and one end of the connecting rod is fixedly sleeved in the middle of the arc groove.

[0010] Preferably, the pushing and squeezing assembly comprises a pushing block, a side block, a push rod 2, a mounting sleeve and a spring 2, the inner end of the pushing and squeezing block is movably sleeved inside the arc groove, the side block is fixed to one side of the pushing and squeezing block, one end of the push rod 2 is fixed to the outer ends of the pushing and squeezing block and the side block, the other end of the push rod 2 is movably sleeved inside the mounting sleeve, one end of the spring 2 is fixedly connected to the push rod 2, and the other end is fixed in the mounting sleeve, a slider is fixedly provided at the bottom of the mounting sleeve, the mounting sleeve is slidably installed on the top of the mounting plate through the slider, a slide groove is opened on the top of the mounting plate, and the inner surface of the slide groove is slidably sleeved with the slider.

[0011] Preferably, the lateral adjustment assembly includes a threaded shaft, a mounting block, a rotating part and a gear 1, the threaded shaft is rotatably sleeved inside the mounting block, the mounting block is fixed on the top of the mounting plate, the rotating part is fixed on the top of the connecting rod, the threaded shaft is rotatably sleeved with the connecting rod, the gear 1 is fixedly sleeved on the outer surface of the threaded shaft and is located in the adapter of the connecting rod, the rotating part includes a motor and a gear 2, the gear 2 is meshingly connected with the gear 1, the motor drives the gear 2 to rotate, the threaded shaft is threadably sleeved with the mounting sleeve, and the threads on both sides of the threaded shaft have opposite rotation directions.

[0012] Preferably, the distributed air supply assembly includes an air pump, a reversing valve, a connecting sleeve, a No. 1 air pipe and a No. 2 air pipe. The air pump is fixedly mounted on the top of the connecting rod, the reversing valve is fixedly connected to the air outlet end of the air pump, the reversing valve has two air outlet ends, the connecting sleeve is fixedly connected to one air outlet end of the reversing valve, the No. 1 air pipe is fixedly connected to the other air outlet end of the reversing valve, the No. 2 air pipe is fixedly connected between the connecting sleeve and the mounting sleeve, and the connecting sleeve is connected to the mounting sleeve through the No. 2 air pipe.

[0013] The beneficial effects of the present invention are as follows: 1. The present invention utilizes the cooperation of the main clamping component and the suction component to realize the closeness of the adjustable clamping parts on both sides, completes the preliminary positioning of the wafer, and after positioning, through the cooperation of the lateral adjustment component and the distribution type air supply component, the squeezing and pushing components on both sides are squeezed and pushed along the two sides of the back of the adjustable clamping part, and the deformation of the elastic metal sheet and the thermal stress sheet are controlled, and they are fitted along the outer side surface of the wafer to adapt to the outer arc surface of the wafer to achieve full tight fitting and clamping, thereby adapting to the clamping of wafers of different sizes, and quickly adjusting the bending curvature to adapt to the outer arc surface of the wafer, greatly improving the use scope of empirical positioning, avoiding the need to replace the positioning clamping mold, and at the same time the adjustment process can be adjusted in real time according to the wafer size, and the bending temperature can be maintained after the adjustment, so that the same size of wafers can be used continuously and quickly after one adjustment, and the comprehensive use effect is good, the adaptive adjustment is simple and fast, and the use effect is good.

[0014] 2. The present invention reuses the distribution air supply component, cooperates with the internal arc cavity inside the adjustable clamping part, and the connected inclined air outlet holes. After completing the positioning and clamping, the pressurized air is guided to be blown out through the inclined air outlet holes, and cooperates with the inclined air outlet holes to achieve purging and cleaning of the top of the wafer, avoiding contamination by dust or particles that affect subsequent glue coating and development operations, reducing power input, and quickly achieving accurate and effective purging and cleaning of the top of the wafer, with good use effect.

[0015] 3. The present invention reuses the distributed air supply component. After completing the operations such as wafer coating and development, as the wafer is taken out of the positioning device, the air pump is intermittently opened and closed to achieve intermittent input and exhaust of pressurized air in the squeezing and pushing component, so that the squeezing and pushing component intermittently pushes the deformation and bending of the adjustable clamping part, and realizes its own swing under the elastic bending and elastic recovery state of the elastic metal sheet gap. In combination with its own deformation effect, the comprehensive disturbance is utilized to avoid the removal of attached stains, thereby achieving simple and convenient self-cleaning, avoiding the dirtiness of the positioning equipment itself and contaminating the wafer, and achieving good use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a cross-sectional schematic diagram of the present invention; Figure 3 It is a schematic diagram of the connection between the distribution air supply assembly and the adjustable clamping part of the present invention; Figure 4 is a cross-sectional schematic diagram of the adjustable clamping portion of the present invention; Figure 5 is a schematic diagram of a lateral adjustment assembly of the present invention; Figure 6 It is an exploded schematic diagram of the squeezing and pushing assembly of the present invention; Figure 7 A schematic diagram of a distributed air supply assembly of the present invention; Figure 8 It is a cross-sectional schematic diagram of the main clamping assembly and the suction assembly of the present invention.

[0017] In the figure: 1, carrier plate; 2, positioning operating arm; 3, main clamping assembly; 31, connecting seat; 32, fixing sleeve; 33, push rod 1; 34, fixing ring; 35, spring 1; 4, mounting plate; 5, connecting rod; 6, adjustable clamping part; 61, elastic metal sheet; 62, arc groove; 63, thermal stress sheet; 64, internal arc cavity; 65, air outlet inclined hole; 7, squeezing and pushing assembly; 71, squeezing and pushing block; 72, side block; 7 3. Push rod 2; 74. Mounting sleeve; 75. Spring 2; 8. Transverse adjustment assembly; 81. Threaded shaft; 82. Mounting block; 83. Rotating part; 84. Gear 1; 9. Distributed air supply assembly; 91. Air pump; 92. Reversing valve; 93. Connecting sleeve; 94. Air pipe No. 1; 95. Air pipe No. 2; 10. Suction assembly; 101. Electric push rod; 102. Movable plug; 103. Suction chamber; 11. Slide groove. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] like Figures 1 to 8 As shown, the embodiment of the present invention provides a wafer positioning device for a glue coating and developing machine, including a carrier plate 1 and a positioning operating arm 2, a main clamping assembly 3 is fixedly provided inside the carrier plate 1, mounting plates 4 are fixedly provided at both ends of the main clamping assembly 3, a connecting rod 5 is fixedly connected to the top of the mounting plate 4, an adjustable clamping portion 6 is fixedly provided at the end of the connecting rod 5, a lateral adjustment assembly 8 is fixedly provided on the top of the mounting plate 4, squeezing and pushing assemblies 7 are symmetrically distributed on both sides of the connecting rod 5, the movable ends of the squeezing and pushing assemblies 7 are movably sleeved on the back of the adjustable clamping portion 6, the lateral adjustment assembly 8 controls the squeezing and pushing assemblies 7 distributed on both sides to move synchronously at the same time, a distributed air supply assembly 9 is fixedly provided on the top of the connecting rod 5, the distributed air supply assembly 9 has two air outlets, one air outlet is connected to the adjustable clamping portion 6, and the other air outlet is connected to the squeezing and pushing assembly 7, and the main clamping assembly 3 controls the adjustable clamping portions 6 on both sides to move synchronously; The adjustable clamping part 6 includes an elastic metal sheet 61, an arc groove 62, a thermal stress sheet 63, an internal arc cavity 64 and an air outlet inclined hole 65. The arc groove 62 is opened on the back side of the elastic metal sheet 61, and the thermal stress sheet 63 is fixedly connected to the front side of the elastic metal sheet 61. The internal arc cavity 64 and the air outlet inclined hole 65 are both opened inside the elastic metal sheet 61 and are connected to each other. Due to the difference in thermal expansion coefficients, the wafer and the clamping device will produce different thermal expansion amounts, which will lead to relative displacement and stress concentration between them. This problem is overcome by selecting a thermal stress sheet 63 with a thermal expansion coefficient close to that of the wafer.

[0020] Embodiment 1: When in use, the wafer to be positioned is placed on the top of the carrier plate 1, and the suction assembly 10 is started, so that the electric push rod 101 drives the movable plug 102 to move in the suction chamber 103, and sucks the internal gas of the fixed sleeve 32 in the main clamping assembly 3, so that the internal gas pressure of the fixed sleeve 32 is reduced, and the push rod 1 33 connected on both sides moves and approaches under the action of negative pressure, compressing the spring 1 35 and driving the connecting seat 31 to move, so that the mounting plates 4 on both sides move and approach, thereby driving the adjustable clamping parts 6 on both sides to move close to and contact the outer side of the wafer through the connecting rod 5, completing the initial clamping, and starting the air pump 91 in the distributed air supply assembly 9, The air pump 91 inputs pressurized air into the connecting sleeve 93 through the reversing valve 92, and distributes it symmetrically to the No. 2 air pipes 95 on both sides, so that the pressurized air enters the installation sleeve 74 through the No. 2 air pipe 95, so that the air pressure inside the installation sleeve 74 increases, and pushes the push rod 2 73 to move outward inside, and at the same time stretches the spring 2 75, so that the push rod 2 73 drives the pushing block 71 to move in the arc groove 62 and press the inner wall of the arc groove 62, and makes the elastic metal sheet 61 and the thermal stress sheet 63 deviate outward and contact the arc surface of the outer side of the wafer, and synchronously starts the lateral adjustment component 8, so that the rotating part 83 drives the meshing gear 1 84 to rotate, and makes the thread The shaft 81 rotates, so that the mounting sleeve 74 threadedly sleeved on the outside of the threaded shaft 81 slides along the top of the mounting plate 4 through the slider, and the squeezing and pushing components 7 on both sides move away from each other, and the squeezing and pushing block 71 moves along the arc groove 62. As the pressurized air is continuously input, the squeezing and pushing block 71 moves horizontally while continuing to squeeze and push the elastic metal sheet 61, so that the elastic metal sheet 61 and the thermal stress sheet 63 are continuously and evenly deformed from the middle to the outside and the thermal stress sheet 63 is pressed against the outer arc surface of the wafer. The adjustable clamping part 6 is fully bent and attached to the outer arc surface of the wafer to complete the adjustable clamping. After adjustment, the adjustable clamping part 6 maintains the deformed state and is uniformly made to the same size. The wafer is positioned and clamped. When replacing wafers of different sizes, different curvatures can be adjusted in the same way. After the positioning and clamping operation is performed, the reversing valve 92 is activated, the outlet direction is switched and the No. 2 air pipe 95 is sealed, so that the pressurized air is input into the internal arc cavity 64 of the elastic metal sheet 61 through the No. 1 air pipe 94, and the pressurized air in the internal arc cavity 64 is blown out through the outlet inclined hole 65 to blow and clean the wafer surface. After completing the positioning and cleaning, the positioning operating arm 2 is activated to position the positioned and clamped wafer according to the preset position and send it to the developing area of ​​the developer (existing equipment, not shown in the figure) for the glue coating and developing operation.

[0021] Firstly, by utilizing the cooperation of the main clamping component 3 and the suction component 10, the adjustable clamping parts 6 on both sides are brought together to complete the preliminary positioning of the wafer. After positioning, by utilizing the cooperation of the lateral adjustment component 8 and the distributed air supply component 9, the squeezing and pushing components 7 on both sides are squeezed and pushed along the two sides of the back of the adjustable clamping part 6, and the deformation of the elastic metal sheet 61 and the thermal stress sheet 63 are controlled, and they are fitted along the outer side surface of the wafer to adapt to the outer arc surface of the wafer to achieve full tight fitting and clamping, so as to adapt to the clamping of wafers of different sizes, and quickly adjust the bending curvature to adapt to the outer arc surface of the wafer, which greatly improves the use scope of empirical positioning and avoids replacing the positioning clamping mold. At the same time, the adjustment process can be adjusted in real time according to the wafer size, and the bending temperature can be maintained after adjustment, so that the same size of wafers can be used continuously and quickly after one adjustment, with good comprehensive use effect, simple and fast adaptability and good use effect.

[0022] In addition, by reusing the distributing air supply assembly 9, in conjunction with the internal arc cavity 64 inside the adjustable clamping portion 6, and the connected inclined air outlet holes 65, after completing the positioning and clamping, by guiding the pressurized air to blow out through the inclined air outlet holes 65, in conjunction with the inclined air outlet holes 65, the top of the wafer can be purged and cleaned to avoid contaminating dust or particles affecting subsequent coating and developing operations, while reducing power input and quickly achieving accurate and effective purging and cleaning of the top of the wafer, with good use effect.

[0023] Embodiment 2: After positioning and clamping, as the developing operation is completed in cooperation with the external developing machine, as the wafer is removed from the positioning device, the reversing valve 92 is opened and the air pump 91 is closed, the pressurized air in the mounting sleeve 74 is discharged, the spring 2 75 is elastically reset, the pushing block 71 moves, and the elastic metal sheet 61 follows the elastic recovery. Subsequently, the air pump 91 is started and closed multiple times, so that the pressurized air in the mounting sleeve 74 is intermittently input and exhausted, so that the pushing block 71 intermittently pushes the elastic metal sheet 61 to elastically deform. As the elastic metal sheet 61 bends and quickly elastically resets, the stains on the adjustable clamping part 6 are thrown out and separated by its own deformation and shaking, thereby completing self-cleaning.

[0024] First, by reusing the distributed air supply component 9, after completing operations such as wafer coating and development, as the wafer is taken out of the positioning device, the air pump 91 is intermittently opened and closed to achieve intermittent input and exhaust of pressurized air in the squeezing and pushing component 7, so that the squeezing and pushing component 7 intermittently pushes the deformation and bending of the adjustable clamping part 6, and realizes its own swing in the elastic bending and elastic recovery state of the elastic metal sheet 61 gap, cooperates with its own deformation effect, and utilizes comprehensive disturbance to avoid removing attached stains, thereby achieving simple and convenient self-cleaning, avoiding the positioning equipment itself from being dirty and contaminating the wafer, and achieving good use effect.

[0025] The positioning operating arm 2 is fixed to one side of the carrier plate 1, and the other side of the carrier plate 1 is fixedly sleeved with a suction assembly 10, and the suction assembly 10 sucks the air in the main clamping assembly 3. The main clamping assembly 3 includes a connecting seat 31, a fixed sleeve 32, a push rod 33, a fixed ring 34 and a spring 35. The fixed sleeve 32 is fixedly sleeved inside the carrier plate 1, one end of the push rod 33 is movably sleeved in the fixed sleeve 32, and the other end is fixedly connected to the connecting seat 31, and the fixed ring 34 is fixedly sleeved. Connected to the fixed sleeve 32, one end of the spring 35 is fixedly connected to the fixed ring 34, and the other end is fixedly connected to the push rod 33. The suction assembly 10 includes an electric push rod 101, a movable plug 102 and a suction chamber 103. The electric push rod 101 is fixed to the side of the carrier plate 1 through a bracket. The suction chamber 103 is opened inside the carrier plate 1 and communicated with the fixed sleeve 32. The movable plug 102 is fixedly connected to the movable end of the electric push rod 101, and is movably sleeved in the suction chamber 103.

[0026] Through the suction action of the suction component 10, the electric push rod 101 is used to drive the movement of the movable plug 102 to achieve pressure reduction inside the suction chamber 103, thereby achieving negative pressure inside the fixed sleeve 32. The negative pressure effect is used to achieve dynamic adsorption action of the push rods 33 on both sides, thereby completing the approach and preliminary clamping of the adjustable clamping parts 6 on both sides through the mounting plate 4, completing the main clamping work, and the spring 35 is convenient for elastic reset when the air pressure is restored to release the clamping.

[0027] Among them, the outer end of the air outlet inclined hole 65 is inclined downward, and the air outlet inclined hole 65 array is distributed inside the elastic metal sheet 61 and is located above the thermal stress sheet 63. The thermal stress sheet 63 is an elastic alloy. One end of the connecting rod 5 is fixedly sleeved in the middle of the arc groove 62.

[0028] The purging work toward the top of the wafer is achieved by utilizing the inclined air outlet hole 65, and the top cleaning is completed in cooperation with the introduced airflow. The thermal stress sheet 63 is made of elastic alloy. When the wafer expands due to heat, it adapts to the expansion and deformation of the wafer to avoid excessive clamping with the wafer.

[0029] Among them, the pushing and squeezing assembly 7 includes a pushing block 71, a side block 72, a push rod 73, a mounting sleeve 74 and a spring 75. The inner end of the pushing block 71 is movably sleeved in the interior of the arc groove 62, the side block 72 is fixed to one side of the pushing and squeezing block 71, one end of the push rod 73 is fixed on the outer ends of the pushing and squeezing block 71 and the side block 72, the other end of the push rod 73 is movably sleeved in the interior of the mounting sleeve 74, one end of the spring 75 is fixedly connected to the push rod 73, and the other end is fixed in the mounting sleeve 74, a slider is fixedly provided at the bottom of the mounting sleeve 74, and the mounting sleeve 74 is slidably installed on the top of the mounting plate 4 through the slider, and a slide groove 11 is provided on the top of the mounting plate 4, and the inner surface of the slide groove 11 is slidably sleeved with the slider.

[0030] The squeezing and pushing assembly 7 pushes the elastic metal sheet 61 forward while moving laterally, so that the elastic metal sheet 61 located on the outside of the wafer gradually bends from the middle to both sides and gradually fits on the outer arc surface of the wafer. After full fitting, it has a clamping effect with sufficient contact area and can adaptively deform according to the size of the wafer. The interior of the mounting sleeve 74 is used to introduce pressurized air, and the spring 2 75 facilitates elastic resetting.

[0031] Among them, the lateral adjustment component 8 includes a threaded shaft 81, a mounting block 82, a rotating part 83 and a gear 1 84. The threaded shaft 81 is rotatably sleeved inside the mounting block 82, the mounting block 82 is fixed on the top of the mounting plate 4, the rotating part 83 is fixed on the top of the connecting rod 5, the threaded shaft 81 is rotatably sleeved with the connecting rod 5, the gear 1 84 is fixedly sleeved on the outer surface of the threaded shaft 81 and is located in the adapter of the connecting rod 5, the rotating part 83 includes a motor and a gear 2, the gear 2 is meshed with the gear 1 84, the motor drives the gear 2 to rotate, the threaded shaft 81 is threadably sleeved with the mounting sleeve 74, and the threads on both sides of the threaded shaft 81 have opposite rotation directions.

[0032] The synchronous movement of the adjustable clamping parts 6 on both sides is controlled by the lateral adjustment component 8 to achieve simultaneous separation and approach. The rotating part 83 provides rotational force through the motor, realizes rotation by meshing action, and cooperates with the limited sliding sleeve of the adjustable clamping part 6 to realize the lateral movement control after guidance.

[0033] Among them, the distributed air supply component 9 includes an air pump 91, a reversing valve 92, a connecting sleeve 93, a No. 1 air pipe 94 and a No. 2 air pipe 95. The air pump 91 is fixedly installed on the top of the connecting rod 5. The reversing valve 92 is fixedly connected to the air outlet end of the air pump 91. The reversing valve 92 has two air outlet ends. The connecting sleeve 93 is fixedly connected to one air outlet end of the reversing valve 92. The No. 1 air pipe 94 is fixedly connected to the other air outlet end of the reversing valve 92. The No. 2 air pipe 95 is fixedly connected between the connecting sleeve 93 and the mounting sleeve 74. The connecting sleeve 93 is connected to the mounting sleeve 74 through the No. 2 air pipe 95.

[0034] By utilizing the distribution-type air supply assembly 9 to provide pressurized air and cooperating with the reversing operation of the reversing valve 92, ventilation guidance in different directions is achieved, and different effects are achieved through ventilation effects in different directions.

[0035] The working principle and use process of the present invention are as follows: when in use, the wafer to be positioned is placed on the top of the carrier plate 1, and the suction assembly 10 is started, so that the electric push rod 101 drives the movable plug 102 to move in the suction chamber 103, and sucks the internal gas of the fixed sleeve 32 in the main clamping assembly 3, so that the internal gas pressure of the fixed sleeve 32 is reduced, and the push rod 1 33 sleeved on both sides moves and approaches under the action of negative pressure, compressing the spring 1 35, and driving the connecting seat 31 to move, so that the mounting plates 4 on both sides move and approach, thereby driving the adjustable clamping parts 6 on both sides to move close to and contact the outer side of the wafer through the connecting rod 5, completing the initial clamping, and starting the distributed gas supply assembly 9. The air pump 91 in the air pump 91 allows the air pump 91 to input the pressurized air into the connecting sleeve 93 through the reversing valve 92, and symmetrically distribute it to the No. 2 air pipes 95 on both sides, so that the pressurized air enters the installation sleeve 74 through the No. 2 air pipe 95, so that the air pressure inside the installation sleeve 74 increases, and pushes the push rod 2 73 to move outward inside, and at the same time stretches the spring 2 75, so that the push rod 2 73 drives the pushing block 71 to move in the arc groove 62 and press the inner wall of the arc groove 62, and makes the elastic metal sheet 61 and the thermal stress sheet 63 deviate outward and contact the arc surface of the outer side of the wafer, and synchronously starts the lateral adjustment component 8, so that the rotating part 83 drives the meshing gear 1 84 to rotate, The threaded shaft 81 is rotated, so that the mounting sleeve 74 threadedly sleeved on the outside of the threaded shaft 81 slides along the top of the mounting plate 4 through the slider, and the squeezing and pushing components 7 on both sides move away from each other. The squeezing and pushing block 71 moves along the arc groove 62, and as the pressurized air is continuously input, the squeezing and pushing block 71 moves horizontally while continuing to squeeze and push the elastic metal sheet 61, so that the elastic metal sheet 61 and the thermal stress sheet 63 are continuously and evenly deformed from the middle to the outside and the thermal stress sheet 63 is pressed against the outer arc surface of the wafer. The adjustable clamping part 6 is fully bent and attached to the outer arc surface of the wafer to complete the adjustable clamping. After adjustment, the adjustable clamping part 6 maintains the deformed state, and the same The positioning and clamping of wafers of different sizes, when changing wafers of different sizes, the adjustment of different curvatures is realized in the same way; after the positioning and clamping operation is performed, the reversing valve 92 is actuated, the outlet direction is switched and the second air pipe 95 is sealed, so that the pressurized air is input into the inner arc cavity 64 of the elastic metal sheet 61 through the first air pipe 94, and the pressurized air in the inner arc cavity 64 is purged out through the outlet inclined hole 65, and the surface of the wafer is purged and cleaned. After the positioning and cleaning are completed, the positioning operating arm 2 is actuated, and the wafer clamped is positioned and sent to the developing area of ​​the developer (existing equipment, not shown in the figure) according to the preset position, and the glue coating and developing operation can be performed;After the positioning and clamping, as the development operation is completed with the external developer, as the wafer is removed from the positioning device, the reversing valve 92 is opened and the air pump 91 is closed, the pressurized air in the mounting sleeve 74 is discharged, the spring 2 75 is elastically reset, the squeezing and pushing block 71 moves, and the elastic metal sheet 61 follows the elastic recovery. Then the air pump 91 is started and closed several times, so that the pressurized air in the mounting sleeve 74 is intermittently input and emptied, so that the squeezing and pushing block 71 intermittently pushes the elastic metal sheet 61 to deform elastically. As the elastic metal sheet 61 bends and quickly resets elastically, the stains of the adjustable clamping part 6 are thrown out and separated by its own deformation and shaking, completing self-cleaning. ;

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer positioning device for a coating and developing machine, comprising a carrier plate (1) and a positioning operating arm (2), characterized in that: A main clamping assembly (3) is fixedly provided inside the carrier plate (1), mounting plates (4) are fixedly provided at both ends of the main clamping assembly (3), a connecting rod (5) is fixedly connected to the top of the mounting plate (4), an adjustable clamping portion (6) is fixedly provided at the end of the connecting rod (5), a lateral adjustment assembly (8) is fixedly provided on the top of the mounting plate (4), squeezing and pushing assemblies (7) are symmetrically distributed on both sides of the connecting rod (5), the movable ends of the squeezing and pushing assemblies (7) are movably sleeved on the back of the adjustable clamping portion (6), the lateral adjustment assembly (8) controls the squeezing and pushing assemblies (7) distributed on both sides to move synchronously at the same time, a distributed air supply assembly (9) is fixedly provided on the top of the connecting rod (5), the distributed air supply assembly (9) has two air outlet ends, one air outlet end is connected to the adjustable clamping portion (6), and the other air outlet end is connected to the squeezing and pushing assembly (7), and the main clamping assembly (3) controls the adjustable clamping portions (6) on both sides to move synchronously; The adjustable clamping portion (6) comprises an elastic metal sheet (61), an arc groove (62), a thermal stress sheet (63), an internal arc cavity (64) and an oblique air outlet hole (65); the arc groove (62) is provided on the back side of the elastic metal sheet (61); the thermal stress sheet (63) is fixedly connected to the front side of the elastic metal sheet (61); and the internal arc cavity (64) and the oblique air outlet hole (65) are both provided inside the elastic metal sheet (61) and are in communication with each other.

2. The wafer positioning device for a coating and developing machine according to claim 1, characterized in that: The positioning operating arm (2) is fixed to one side of the carrier plate (1), and a suction component (10) is fixedly sleeved on the other side of the carrier plate (1), wherein the suction component (10) sucks air in the main clamping component (3).

3. The wafer positioning device for a coating and developing machine according to claim 2, characterized in that: The main clamping assembly (3) comprises a connecting seat (31), a fixed sleeve (32), a push rod (33), a fixed ring (34) and a spring (35); the fixed sleeve (32) is fixedly sleeved inside the carrier plate (1); one end of the push rod (33) is movably sleeved in the fixed sleeve (32), and the other end is fixedly connected to the connecting seat (31); the fixed ring (34) is fixedly sleeved in the fixed sleeve (32); one end of the spring (35) is fixedly connected to the fixed ring (34), and the other end is fixedly connected to the push rod (33).

4. The wafer positioning device for a coating and developing machine according to claim 3, characterized in that: The suction assembly (10) comprises an electric push rod (101), a movable plug (102) and a suction chamber (103); the electric push rod (101) is fixed to the side of the carrier plate (1) via a bracket; the suction chamber (103) is opened inside the carrier plate (1) and communicates with the fixed sleeve (32); the movable plug (102) is fixedly connected to the movable end of the electric push rod (101) and is movably sleeved in the suction chamber (103).

5. The wafer positioning device for a coating and developing machine according to claim 4, characterized in that: The outer ends of the gas outlet inclined holes (65) are inclined downwards, and the gas outlet inclined holes (65) are distributed in an array inside the elastic metal sheet (61) and are located above the thermal stress sheet (63). The thermal stress sheet (63) is an elastic alloy, and one end of the connecting rod (5) is fixedly sleeved in the middle of the arc groove (62).

6. The wafer positioning device for a coating and developing machine according to claim 5, characterized in that: The squeezing and pushing assembly (7) comprises a squeezing and pushing block (71), a side block (72), a second push rod (73), a mounting sleeve (74) and a second spring (75); the inner end of the squeezing and pushing block (71) is movably sleeved inside the arc groove (62); the side block (72) is fixed to one side of the squeezing and pushing block (71); one end of the second push rod (73) is fixed to the outer ends of the squeezing and pushing block (71) and the side block (72); the other end of the second push rod (73) is movably sleeved inside the mounting sleeve (74); one end of the second spring (75) is fixedly connected to the second push rod (73) and the other end is fixed in the mounting sleeve (74); a slider is fixedly provided at the bottom of the mounting sleeve (74); the mounting sleeve (74) is slidably mounted on the top of the mounting plate (4) through the slider; a slide groove (11) is provided at the top of the mounting plate (4); the inner surface of the slide groove (11) is slidably sleeved with the slider.

7. The wafer positioning device for a coating and developing machine according to claim 6, characterized in that: The transverse shift adjustment assembly (8) comprises a threaded shaft (81), a mounting block (82), a rotating portion (83) and a gear 1 (84); the threaded shaft (81) is rotatably sleeved inside the mounting block (82); the mounting block (82) is fixed to the top of the mounting plate (4); the rotating portion (83) is fixed to the top of the connecting rod (5); the threaded shaft (81) is rotatably sleeved with the connecting rod (5); the gear 1 (84) is fixedly sleeved on the outer surface of the threaded shaft (81) and is located in the adapter of the connecting rod (5); the rotating portion (83) comprises a motor and a gear 2; the gear 2 is meshingly connected with the gear 1 (84); the motor drives the gear 2 to rotate; the threaded shaft (81) is threadably sleeved with the mounting sleeve (74); the threads on both sides of the threaded shaft (81) have opposite rotation directions.

8. The wafer positioning device for a coating and developing machine according to claim 7, characterized in that: The distributed air supply assembly (9) comprises an air pump (91), a reversing valve (92), a connecting sleeve (93), a first air pipe (94) and a second air pipe (95); the air pump (91) is fixedly mounted on the top of the connecting rod (5); the reversing valve (92) is fixedly connected to the air outlet end of the air pump (91); the reversing valve (92) has two air outlet ends; the connecting sleeve (93) is fixedly connected to one air outlet end of the reversing valve (92); the first air pipe (94) is fixedly connected to the other air outlet end of the reversing valve (92); the second air pipe (95) is fixedly connected between the connecting sleeve (93) and the mounting sleeve (74); the connecting sleeve (93) is connected to the mounting sleeve (74) via the second air pipe (95).

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