Wafer positioning apparatus for spin coater

Abstract

The application belongs to the technical field of glue coating and developing auxiliary equipment, and discloses a wafer positioning equipment for a glue coating and developing machine, which comprises a carrier plate and a positioning operating arm, a main clamping assembly is fixedly arranged in the carrier plate, and mounting plates are fixedly arranged at the two ends of the main clamping assembly. The both-side extrusion assembly is used for extruding and pushing along the both sides of the back of the adjustable clamping part, the deformation of the elastic metal sheet and the thermal stress sheet is controlled, and the both-side extrusion assembly is adhered along the outer side of the wafer, so that the wafer outer side arc surface is adapted to realize sufficient close adhesion and clamping, thereby the clamping of wafers with different sizes is adapted, the bending curvature is quickly adjusted to adapt to the wafer outer side arc surface, the use range of the experience positioning is greatly improved, the positioning clamping mold is avoided to be replaced, the adjusting process can be adjusted in real time according to the wafer size, the bending temperature can be maintained after the adjustment, the continuous and quick use after one-time adjustment of the wafers with the same size is realized, the comprehensive use effect is good, the adaptive adjustment is simple and fast, and the use effect is good.

Description

Technical Field

[0001] This invention belongs to the technical field of coating and developing auxiliary equipment, specifically a wafer positioning device for a coating and developing machine. Background Technology

[0002] Wafer positioning equipment in photolithography is a key component in semiconductor manufacturing. It ensures the precise positioning of the wafer during the photolithography process and development, thereby guaranteeing the formation of fine exposure patterns in the photolithography process and the pattern quality in the development process. It completes the photolithography and development operations by stably clamping and moving the wafer to the development area.

[0003] Existing wafer positioning equipment for coating and developing machines uses a method of clamping the wafer from its outer side. After clamping and fixing the wafer, the positioning arm moves in a pre-set motion to position the wafer in the coating and developing area. However, in actual positioning and clamping, a good clamping area is required to maintain stable clamping and good positioning effect. Usually, the clamping part is made into an arc-shaped contact surface. Sufficient clamping area improves positioning stability, avoids wafer vibration during positioning, and adapts to the outer arc surface of the wafer. This provides stable positioning and clamping while further reducing damage to the wafer by the clamping part during positioning operation. However, different wafers have different sizes and specifications, often requiring the replacement of different arc-shaped clamping dies. Dies can also be changed as needed for different batches of wafers. When wafers of different sizes need to be processed alternately, frequent die changes are labor-intensive, affecting wafer processing efficiency and making it difficult to achieve quick and effective adaptive positioning and clamping. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer positioning device for a coating and developing machine to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a wafer positioning device for a coating and developing machine, comprising a carrier plate and a positioning operating arm. A main clamping assembly is fixedly disposed inside the carrier plate. Mounting plates are fixedly disposed at both ends of the main clamping assembly. A connecting rod is fixedly connected to the top of the mounting plate. An adjustable clamping part is fixedly disposed at the end of the connecting rod. A transverse adjustment assembly is fixedly disposed on the top of the mounting plate. Extrusion and pushing assemblies are symmetrically distributed on both sides of the connecting rod. The movable end of the extrusion and pushing assembly is movably sleeved on the back of the adjustable clamping part. The transverse adjustment assembly controls the extrusion and pushing assemblies distributed on both sides to move away from each other simultaneously and synchronously. A distribution air supply assembly is fixedly disposed on the top of the connecting rod. The distribution air supply assembly has two air outlets, one air outlet communicating with the adjustable clamping part and the other air outlet communicating with the extrusion and pushing assembly. The main clamping assembly controls the adjustable clamping parts on both sides to move synchronously.

[0006] The adjustable clamping part includes an elastic metal sheet, an arc groove, a thermal stress sheet, an internal arc cavity, and an oblique vent hole. The arc groove is formed on the back of the elastic metal sheet, the thermal stress sheet is fixedly connected to the front of the elastic metal sheet, and the internal arc cavity and the oblique vent hole are both formed inside the elastic metal sheet and are interconnected.

[0007] Preferably, the positioning operating arm is fixed to one side of the carrier plate, and a suction assembly is fixedly sleeved on the other side of the carrier plate, the suction assembly sucking air from the main clamping assembly.

[0008] Preferably, the main clamping assembly includes a connecting seat, a fixed sleeve, a push rod, a fixing ring, and a spring. The fixed sleeve is fixedly fitted inside the carrier plate. One end of the push rod is movably fitted in the fixed sleeve, and the other end is fixedly connected to the connecting seat. The fixing ring is fixedly fitted in the fixed sleeve. One end of the spring is fixedly connected to the fixing ring, and the other end is fixedly connected to the push rod.

[0009] Preferably, the suction assembly includes an electric push rod, a movable plug, and a suction chamber. The electric push rod is fixed to the side of the carrier plate by a bracket. The suction chamber is opened inside the carrier plate and communicates with the fixed sleeve. The movable plug is fixedly connected to the movable end of the electric push rod and is movably sleeved in the suction chamber.

[0010] Preferably, the outer end of the venting oblique hole is inclined downward, the array of venting oblique holes is distributed inside the elastic metal sheet and located above the thermal stress sheet, the thermal stress sheet is an elastic alloy, and one end of the connecting rod is fixedly sleeved in the middle of the arc groove.

[0011] Preferably, the extrusion assembly includes an extrusion block, a side block, a second push rod, a mounting sleeve, and a second spring. The inner end of the extrusion block is movably sleeved inside the arc groove. The side block is fixed to one side of the extrusion block. One end of the second push rod is fixed to the outer end of the extrusion block and the side block, and the other end of the second push rod is movably sleeved inside the mounting sleeve. One end of the second spring is fixedly connected to the second push rod, and the other end is fixed in the mounting sleeve. A slider is fixedly provided at the bottom of the mounting sleeve. The mounting sleeve is slidably mounted on the top of the mounting plate via the slider. A groove is provided on the top of the mounting plate, and the inner surface of the groove is slidably sleeved with the slider.

[0012] Preferably, the lateral adjustment assembly includes a threaded shaft, a mounting block, a rotating part, and a first gear. The threaded shaft is rotatably sleeved inside the mounting block, the mounting block is fixed to the top of the mounting plate, the rotating part is fixed to the top of the connecting rod, the threaded shaft is rotatably sleeved with the connecting rod, the first gear is fixedly sleeved on the outer surface of the threaded shaft and located in the adapter port of the connecting rod, the rotating part includes a motor and a second gear, the second gear meshes with the first gear, the motor drives the second gear to rotate, the threaded shaft is threadedly sleeved with the mounting block, and the threads on both sides of the threaded shaft have opposite directions of rotation.

[0013] Preferably, the distribution-type air supply assembly includes an air pump, a reversing valve, a connecting sleeve, a first air pipe, and a second air pipe. The air pump is fixedly installed on the top of the connecting rod. The reversing valve is fixedly connected to the air outlet end of the air pump and has two air outlet ends. The connecting sleeve is fixedly connected to one air outlet end of the reversing valve. The first air pipe is fixedly connected to the other air outlet end of the reversing valve. The second air pipe is fixedly connected between the connecting sleeve and the mounting sleeve. The connecting sleeve is connected to the mounting sleeve through the second air pipe.

[0014] The beneficial effects of this invention are as follows:

[0015] 1. This invention utilizes the main clamping assembly and the suction assembly to bring the two adjustable clamping parts together, completing the initial positioning of the wafer. After positioning, the lateral adjustment assembly and the distribution air supply assembly work together to push the two extrusion components along the back of the adjustable clamping parts, controlling the deformation of the elastic metal sheet and the thermal stress sheet, and adhering them to the outer surface of the wafer. This ensures a tight fit and clamping, adapting to the outer curved surface of the wafer, thus accommodating wafers of different sizes. It allows for rapid adjustment of the bending curvature to adapt to the outer curved surface of the wafer, greatly expanding the application range of experience-based positioning, avoiding the need to change the positioning clamping mold. Furthermore, the adjustment process can be adjusted in real time according to the wafer size, and the bending temperature can be maintained after adjustment. It enables continuous and rapid use of wafers of the same size after a single adjustment, resulting in good overall performance. The adaptive adjustment is simple and quick, and the overall effect is excellent.

[0016] 2. This invention reuses the distribution-type air supply component, combined with the internal arc cavity inside the adjustable clamping part and the connected air outlet oblique holes. After positioning and clamping, pressurized air is guided out through the air outlet oblique holes. With the inclined arrangement of the air outlet oblique holes, the top of the wafer is cleaned by blowing, avoiding contamination dust or particles from affecting subsequent coating and developing operations. It reduces power input while quickly achieving accurate and effective cleaning of the top of the wafer, resulting in good performance.

[0017] 3. This invention reuses the distribution-type air supply component. After the wafer coating and development operations are completed, as the wafer is removed from the positioning device, the intermittent start and stop of the air pump enables the intermittent input and discharge of pressurized air in the extrusion component. This causes the extrusion component to intermittently push the adjustable clamping part to deform and bend. In the state of elastic bending and elastic recovery between the elastic metal sheets, it achieves self-swing. Combined with its own deformation effect, the comprehensive disturbance avoids the removal of attached stains, achieving simple and convenient self-cleaning. This prevents the positioning device itself from getting dirty and contaminating the wafer, resulting in good performance. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the present invention;

[0019] Figure 2 This is a cross-sectional schematic diagram of the present invention;

[0020] Figure 3 This is a schematic diagram showing the connection between the gas supply assembly and the adjustable clamping part of the present invention.

[0021] Figure 4 This is a cross-sectional schematic diagram of the adjustable clamping part of the present invention;

[0022] Figure 5 This is a schematic diagram of the lateral adjustment component of the present invention;

[0023] Figure 6 This is an exploded view of the extrusion assembly of the present invention;

[0024] Figure 7 This is a schematic diagram of the gas distribution assembly of the present invention;

[0025] Figure 8 This is a cross-sectional schematic diagram of the main clamping component and the suction component of the present invention.

[0026] In the diagram: 1. Carrier plate; 2. Positioning operating arm; 3. Main clamping assembly; 31. Connecting seat; 32. Fixing sleeve; 33. Push rod one; 34. Fixing ring; 35. Spring one; 4. Mounting plate; 5. Connecting rod; 6. Adjustable clamping part; 61. Elastic metal sheet; 62. Arc groove; 63. Thermal stress sheet; 64. Internal arc cavity; 65. Air outlet oblique hole; 7. Extrusion assembly; 71. Extrusion block; 72. Side block; 7 3. Push rod two; 74. Mounting sleeve; 75. Spring two; 8. Lateral adjustment assembly; 81. Threaded shaft; 82. Mounting block; 83. Rotating part; 84. Gear one; 9. Distributor-type air supply assembly; 91. Air pump; 92. Reversing valve; 93. Connecting sleeve; 94. No. 1 air pipe; 95. No. 2 air pipe; 10. Suction assembly; 101. Electric push rod; 102. Movable plug; 103. Suction chamber; 11. Slide groove. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] like Figures 1 to 8 As shown, this embodiment of the invention provides a wafer positioning device for a coating and developing machine, including a carrier plate 1 and a positioning operating arm 2. A main clamping assembly 3 is fixedly installed inside the carrier plate 1. Mounting plates 4 are fixedly installed at both ends of the main clamping assembly 3. A connecting rod 5 is fixedly connected to the top of the mounting plate 4. An adjustable clamping part 6 is fixedly installed at the end of the connecting rod 5. A transverse adjustment assembly 8 is fixedly installed on the top of the mounting plate 4. Extrusion and pushing assemblies 7 are symmetrically distributed on both sides of the connecting rod 5. The movable end of the extrusion and pushing assembly 7 is movably sleeved on the back of the adjustable clamping part 6. The transverse adjustment assembly 8 controls the extrusion and pushing assemblies 7 distributed on both sides to move away from each other synchronously. A distribution air supply assembly 9 is fixedly installed on the top of the connecting rod 5. The distribution air supply assembly 9 has two air outlets. One air outlet is connected to the adjustable clamping part 6, and the other air outlet is connected to the extrusion and pushing assembly 7. The main clamping assembly 3 controls the adjustable clamping parts 6 on both sides to move synchronously.

[0029] The adjustable clamping part 6 includes an elastic metal sheet 61, an arc groove 62, a thermal stress sheet 63, an internal arc cavity 64, and an venting oblique hole 65. The arc groove 62 is formed on the back side of the elastic metal sheet 61, and the thermal stress sheet 63 is fixedly connected to the front side of the elastic metal sheet 61. The internal arc cavity 64 and the venting oblique hole 65 are both formed inside the elastic metal sheet 61 and are interconnected. Due to the difference in the coefficient of thermal expansion, the wafer and the clamping device will have different amounts of thermal expansion, which will lead to relative displacement and stress concentration between them. This problem is overcome by using a thermal stress sheet 63 with a coefficient of thermal expansion close to that of the wafer.

[0030] Example 1: In use, the wafer to be positioned is placed on top of the carrier plate 1. The suction assembly 10 is activated, causing the electric push rod 101 to move the movable plug 102 in the suction chamber 103, and to draw gas from the fixed sleeve 32 in the main clamping assembly 3. This reduces the air pressure inside the fixed sleeve 32, and the negative pressure causes the push rods 33 on both sides to move and come together, compressing the spring 35 and moving the connecting seat 31. This causes the mounting plates 4 on both sides to move and come together, thereby driving the adjustable clamping parts 6 on both sides to move closer and contact the outside of the wafer through the connecting rod 5, completing the initial clamping. The air pump 91 in the distribution air supply assembly 9 is then activated. The air pump 91 inputs pressurized air into the connecting sleeve 93 through the reversing valve 92, and distributes it symmetrically to the second air pipes 95 on both sides. This pressurized air then enters the mounting sleeve 74 through the second air pipes 95, increasing the internal air pressure and pushing the push rod 73 outwards. Simultaneously, the spring 75 is stretched, causing the push rod 73 to move the extrusion block 71 within the arc groove 62 and press against the inner wall of the arc groove 62. This causes the elastic metal sheet 61 and the thermal stress sheet 63 to shift outwards and contact the outer arc surface of the wafer. Simultaneously, the transverse adjustment assembly 8 is activated, causing the rotating part 83 to drive the meshing gear 84 to rotate, and causing the thread... The rotation of shaft 81 causes the mounting sleeve 74, which is threaded onto the outside of the threaded shaft 81, to slide along the top of the mounting plate 4 via a slider. The two extrusion assemblies 7 move away from each other, and the extrusion block 71 moves along the arc groove 62. As pressurized air is continuously input, the extrusion block 71 continues to extrude the elastic metal sheet 61 while moving laterally. This causes the elastic metal sheet 61 and the thermal stress sheet 63 to deform uniformly from the center outwards, pressing the thermal stress sheet 63 against the outer arc surface of the wafer. The adjustable clamping part 6 fully bends and adheres to the outer arc surface of the wafer, completing the adjustable clamping. After adjustment, the adjustable clamping part 6 maintains its deformed state, ensuring uniform dimensional accuracy. The wafer is positioned and clamped. When changing to wafers of different sizes, the curvature can be adjusted accordingly. After the positioning and clamping operation is performed, the reversing valve 92 is activated, switching the air outlet direction and sealing the second air pipe 95. This allows pressurized air to be input into the internal arc cavity 64 of the elastic metal sheet 61 through the first air pipe 94. The pressurized air in the internal arc cavity 64 is then blown out through the air outlet oblique hole 65 to clean the wafer surface. After positioning and cleaning are completed, the positioning operating arm 2 is activated to position and send the wafer clamped in the positioning position into the developing area of ​​the developing machine (existing equipment, not shown in the figure) for coating and developing operations.

[0031] First, by utilizing the main clamping assembly 3 and the suction assembly 10, the two adjustable clamping parts 6 are brought together to complete the initial positioning of the wafer. After positioning, the lateral adjustment assembly 8 and the distribution air supply assembly 9 work together to push the two extrusion and pushing assemblies 7 along the back of the adjustable clamping part 6, controlling the deformation of the elastic metal sheet 61 and the thermal stress sheet 63, and adhering them to the outer surface of the wafer to achieve a tight fit and clamping. This allows for clamping of wafers of different sizes, quick adjustment of the bending curvature to adapt to the outer curved surface of the wafer, greatly improving the application range of experience-based positioning, avoiding the need to change the positioning clamping mold, and allowing for real-time adjustment according to the wafer size. The bending temperature can also be maintained after adjustment, enabling continuous and rapid use of wafers of the same size after a single adjustment. The overall effect is good, the adaptability adjustment is simple and quick, and the usage effect is excellent.

[0032] Furthermore, by reusing the distribution-type air supply component 9, in conjunction with the internal arc cavity 64 inside the adjustable clamping part 6, and the connected air outlet oblique hole 65, after the positioning and clamping are completed, pressurized air is guided out through the air outlet oblique hole 65 to purge. With the inclined air outlet oblique hole 65, the top of the wafer is purged and cleaned, avoiding contamination dust or particles from affecting subsequent coating and development operations. This reduces power input while quickly achieving accurate and effective purge cleaning of the top of the wafer, resulting in good performance.

[0033] Example 2: After the positioning and clamping are completed and the developing operation is completed with the external developing machine, as the wafer is removed from the positioning device, the reversing valve 92 is opened and the air pump 91 is turned off. The pressurized air in the mounting sleeve 74 is discharged, the spring 75 elastically resets, the push block 71 moves, and the elastic metal sheet 61 follows and elastically returns to its original position. Subsequently, the air pump 91 is started and stopped multiple times, so that the pressurized air in the mounting sleeve 74 is intermittently input and discharged, thereby causing the push block 71 to intermittently push the elastic metal sheet 61 to elastically deform. As the elastic metal sheet 61 bends and quickly elastically resets, it uses its own deformation and shaking to shake off and separate the dirt from the adjustable clamping part 6, thus completing the self-cleaning.

[0034] First, by reusing the distribution air supply component 9, after completing operations such as wafer coating and development, as the wafer is removed from the positioning device, the intermittent start and stop of the air pump 91 is used to intermittently input and vent the pressurized air in the extrusion component 7. This causes the extrusion component 7 to intermittently push the adjustable clamping part 6 to deform and bend. In the state of elastic bending and elastic recovery of the elastic metal sheet 61, it achieves its own swinging motion. Combined with its own deformation effect, the comprehensive disturbance helps to remove the attached stains, achieving simple and convenient self-cleaning. This avoids the positioning device itself from getting dirty and contaminating the wafer, resulting in good performance.

[0035] The positioning arm 2 is fixed to one side of the carrier plate 1, and the suction assembly 10 is fixedly sleeved on the other side of the carrier plate 1. The suction assembly 10 sucks air from the main clamping assembly 3. The main clamping assembly 3 includes a connecting seat 31, a fixing sleeve 32, a push rod 33, a fixing ring 34, and a spring 35. The fixing sleeve 32 is fixedly sleeved inside the carrier plate 1. One end of the push rod 33 is movably sleeved in the fixing sleeve 32, and the other end is fixedly connected to the connecting seat 31. The fixing ring 34 is fixedly sleeved... The spring 35 is fixedly connected to the fixed ring 34 at one end and to the push rod 33 at the other end in the fixed sleeve 32. The suction assembly 10 includes an electric push rod 101, a movable plug 102 and a suction chamber 103. The electric push rod 101 is fixed to the side of the carrier plate 1 by a bracket. The suction chamber 103 is opened inside the carrier plate 1 and communicates with the fixed sleeve 32. The movable plug 102 is fixedly connected to the movable end of the electric push rod 101 and is movably sleeved in the suction chamber 103.

[0036] The suction action of the suction assembly 10 drives the movement of the movable plug 102 via the electric push rod 101, thereby reducing the pressure inside the suction chamber 103 and creating negative pressure inside the fixed sleeve 32. Utilizing this negative pressure effect, the dynamic adsorption action of the push rods 33 on both sides is achieved, thus completing the main clamping work by bringing the adjustable clamping parts 6 on both sides together via the mounting plate 4. The spring 35 can easily return to its elastic state when the air pressure is restored, releasing the clamp.

[0037] Among them, the outer end of the air outlet oblique hole 65 is inclined downward, the air outlet oblique hole 65 array is distributed inside the elastic metal sheet 61 and is located above the thermal stress sheet 63. The thermal stress sheet 63 is an elastic alloy, and one end of the connecting rod 5 is fixedly sleeved in the middle of the arc groove 62.

[0038] The top of the wafer is cleaned by using the venting oblique hole 65, which is combined with the introduced airflow. The thermal stress sheet 63 is made of elastic alloy and adapts to the expansion and deformation of the wafer when it is heated, thus avoiding excessive clamping with the wafer.

[0039] The extrusion assembly 7 includes an extrusion block 71, a side block 72, a second push rod 73, a mounting sleeve 74, and a second spring 75. The inner end of the extrusion block 71 is movably sleeved inside the arc groove 62. The side block 72 is fixed to one side of the extrusion block 71. One end of the second push rod 73 is fixed to the outer end of the extrusion block 71 and the side block 72. The other end of the second push rod 73 is movably sleeved inside the mounting sleeve 74. One end of the second spring 75 is fixedly connected to the second push rod 73, and the other end is fixed in the mounting sleeve 74. A slider is fixedly provided at the bottom of the mounting sleeve 74. The mounting sleeve 74 is slidably mounted on the top of the mounting plate 4 by the slider. A groove 11 is provided on the top of the mounting plate 4. The inner surface of the groove 11 is slidably sleeved with the slider.

[0040] The extrusion assembly 7 pushes the elastic metal sheet 61 forward while moving laterally, so that the elastic metal sheet 61 located on the outer side of the wafer gradually bends from the middle to both sides and gradually fits onto the outer arc surface of the wafer. After full fit, it has a clamping effect with sufficient contact area and can be deformed according to the wafer size. The mounting sleeve 74 is used to introduce pressurized air, and the second spring 75 facilitates elastic reset.

[0041] The transverse adjustment assembly 8 includes a threaded shaft 81, a mounting block 82, a rotating part 83, and a gear 84. The threaded shaft 81 is rotatably sleeved inside the mounting block 82, which is fixed to the top of the mounting plate 4. The rotating part 83 is fixed to the top of the connecting rod 5. The threaded shaft 81 is rotatably sleeved with the connecting rod 5. The gear 84 is fixedly sleeved on the outer surface of the threaded shaft 81 and located in the fitting port of the connecting rod 5. The rotating part 83 includes a motor and a gear 2. The gear 2 meshes with the gear 84. The motor drives the gear 2 to rotate. The threaded shaft 81 is threadedly sleeved with the mounting sleeve 74. The threads on both sides of the threaded shaft 81 have opposite directions of rotation.

[0042] The lateral movement adjustment component 8 controls the synchronous movement of the two adjustable clamping parts 6, enabling them to move away and move closer simultaneously. The rotating part 83 is powered by a motor and rotates using meshing. It also works in conjunction with the limiting sliding sleeve of the adjustable clamping part 6 to achieve lateral movement control after guidance.

[0043] The distribution-type air supply assembly 9 includes an air pump 91, a reversing valve 92, a connecting sleeve 93, a first air pipe 94, and a second air pipe 95. The air pump 91 is fixedly installed on the top of the connecting rod 5. The reversing valve 92 is fixedly connected to the air outlet end of the air pump 91 and has two air outlet ends. The connecting sleeve 93 is fixedly connected to one air outlet end of the reversing valve 92. The first air pipe 94 is fixedly connected to the other air outlet end of the reversing valve 92. The second air pipe 95 is fixedly connected between the connecting sleeve 93 and the mounting sleeve 74. The connecting sleeve 93 is connected to the mounting sleeve 74 through the second air pipe 95.

[0044] By utilizing the distribution air supply component 9 to provide pressurized air, and cooperating with the reversing operation of the reversing valve 92, ventilation guidance in different directions can be achieved, and different effects can be achieved through the ventilation effects in different directions.

[0045] The working principle and usage process of this invention are as follows: In use, the wafer to be positioned is placed on top of the carrier plate 1. The suction assembly 10 is activated, causing the electric push rod 101 to move the movable plug 102 within the suction chamber 103, drawing gas from the fixing sleeve 32 in the main clamping assembly 3. This reduces the internal air pressure of the fixing sleeve 32, causing the push rods 33 on both sides to move and converge under negative pressure, compressing the spring 35 and moving the connecting seat 31. This causes the mounting plates 4 on both sides to move and converge, thereby driving the adjustable clamping parts 6 on both sides to move closer to and contact the outer side of the wafer via the connecting rod 5, completing the initial clamping. The distribution gas supply assembly 9 is then activated. The air pump 91 in the middle, through the reversing valve 92, inputs pressurized air into the connecting sleeve 93, and distributes it symmetrically to the second air pipes 95 on both sides. The pressurized air enters the mounting sleeve 74 through the second air pipes 95, increasing the air pressure inside the mounting sleeve 74. This increases the internal air pressure and pushes the push rod 73 outward, while simultaneously stretching the spring 75. This causes the push rod 73 to move the extrusion block 71 in the arc groove 62 and press against the inner wall of the arc groove 62. This causes the elastic metal sheet 61 and the thermal stress sheet 63 to shift outward and contact the outer arc surface of the wafer. Simultaneously, the transverse adjustment assembly 8 is activated, causing the rotating part 83 to drive the meshing gear 84 to rotate. This causes the threaded shaft 81 to rotate, allowing the mounting sleeve 74, which is threaded onto the outside of the threaded shaft 81, to slide along the top of the mounting plate 4 via a slider. The two extrusion assemblies 7 move away from each other, and the extrusion block 71 moves along the arc groove 62. As pressurized air is continuously input, the extrusion block 71 continues to extrude the elastic metal sheet 61 while moving laterally. This causes the elastic metal sheet 61 and the thermal stress sheet 63 to deform uniformly from the center outwards, pressing the thermal stress sheet 63 against the outer arc surface of the wafer. The adjustable clamping part 6 fully bends and adheres to the outer arc surface of the wafer, completing the adjustable clamping. After adjustment, the adjustable clamping part 6 maintains its deformed state, performing the same operation uniformly. The wafer is positioned and clamped according to its size. When changing to a different size wafer, the curvature can be adjusted accordingly. After the positioning and clamping operation is performed, the reversing valve 92 is activated, switching the air outlet direction and sealing the second air pipe 95. This allows pressurized air to be input into the internal arc cavity 64 of the elastic metal sheet 61 through the first air pipe 94. The pressurized air in the internal arc cavity 64 is then blown out through the air outlet oblique hole 65 to clean the wafer surface. After positioning and cleaning are completed, the positioning operating arm 2 is activated to position and send the wafer clamped according to the preset position into the developing area of ​​the developing machine (existing equipment, not shown in the figure) for coating and developing operations.After the wafer is clamped and developed using an external developing machine, it is removed from the positioning device. The reversing valve 92 is opened and the air pump 91 is turned off, releasing the pressurized air from the mounting sleeve 74. Spring 75 returns to its elastic state, the push block 71 moves, and the elastic metal sheet 61 follows suit, returning to its original elastic state. The air pump 91 is then repeatedly started and stopped, intermittently inputting and evacuating the pressurized air from the mounting sleeve 74. This causes the push block 71 to intermittently push the elastic metal sheet 61, causing it to deform. As the elastic metal sheet 61 bends and quickly returns to its elastic state, it uses its own deformation and vibration to dislodge and separate the dirt from the adjustable clamping part 6, completing the self-cleaning process.

[0046] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer positioning device for a coating and developing machine, comprising a carrier plate (1) and a positioning operating arm (2), characterized in that: The main clamping assembly (3) is fixedly provided inside the carrier plate (1). Mounting plates (4) are fixedly provided at both ends of the main clamping assembly (3). A connecting rod (5) is fixedly connected to the top of the mounting plate (4). An adjustable clamping part (6) is fixedly provided at the end of the connecting rod (5). A transverse adjustment assembly (8) is fixedly provided at the top of the mounting plate (4). Squeezing and pushing assemblies (7) are symmetrically distributed on both sides of the connecting rod (5). The movable end of the squeezing and pushing assembly (7) is movably sleeved on the back of the adjustable clamping part (6). The transverse adjustment assembly (8) controls the squeezing and pushing assemblies (7) distributed on both sides to move away from each other synchronously. A distribution air supply assembly (9) is fixedly provided at the top of the connecting rod (5). The distribution air supply assembly (9) has two air outlets. One air outlet is connected to the adjustable clamping part (6), and the other air outlet is connected to the squeezing and pushing assembly (7). The main clamping assembly (3) controls the adjustable clamping parts (6) on both sides to move synchronously. The adjustable clamping part (6) includes an elastic metal sheet (61), an arc groove (62), a thermal stress sheet (63), an internal arc cavity (64), and an air outlet oblique hole (65). The arc groove (62) is opened on the back of the elastic metal sheet (61), the thermal stress sheet (63) is fixedly connected to the front of the elastic metal sheet (61), and the internal arc cavity (64) and the air outlet oblique hole (65) are both opened inside the elastic metal sheet (61) and are connected to each other.

2. The wafer positioning equipment for a coating and developing machine according to claim 1, characterized in that: The positioning operating arm (2) is fixed on one side of the carrier plate (1), and a suction assembly (10) is fixedly sleeved on the other side of the carrier plate (1). The suction assembly (10) sucks air from the main clamping assembly (3).

3. The wafer positioning equipment for a coating and developing machine according to claim 2, characterized in that: The main clamping assembly (3) includes a connecting seat (31), a fixed sleeve (32), a push rod (33), a fixed ring (34), and a spring (35). The fixed sleeve (32) is fixedly sleeved inside the carrier plate (1). One end of the push rod (33) is movably sleeved in the fixed sleeve (32), and the other end is fixedly connected to the connecting seat (31). The fixed ring (34) is fixedly sleeved in the fixed sleeve (32). One end of the spring (35) is fixedly connected to the fixed ring (34), and the other end is fixedly connected to the push rod (33).

4. A wafer positioning device for a coating and developing machine according to claim 3, characterized in that: The suction assembly (10) includes an electric push rod (101), a movable plug (102), and a suction chamber (103). The electric push rod (101) is fixed to the side of the carrier plate (1) by a bracket. The suction chamber (103) is opened inside the carrier plate (1) and communicates with the fixed sleeve (32). The movable plug (102) is fixedly connected to the movable end of the electric push rod (101) and is movably sleeved in the suction chamber (103).

5. A wafer positioning device for a coating and developing machine according to claim 4, characterized in that: The outer end of the venting oblique hole (65) is inclined downward. The array of venting oblique holes (65) is distributed inside the elastic metal sheet (61) and located above the thermal stress sheet (63). The thermal stress sheet (63) is an elastic alloy. One end of the connecting rod (5) is fixedly sleeved in the middle of the arc groove (62).

6. A wafer positioning device for a coating and developing machine according to claim 5, characterized in that: The extrusion assembly (7) includes an extrusion block (71), a side block (72), a second push rod (73), a mounting sleeve (74), and a second spring (75). The inner end of the extrusion block (71) is movably sleeved inside the arc groove (62). The side block (72) is fixed on one side of the extrusion block (71). One end of the second push rod (73) is fixed on the outer end of the extrusion block (71) and the side block (72). The other end of the second push rod (73) is movably sleeved inside the mounting sleeve (74). One end of the second spring (75) is fixedly connected to the second push rod (73), and the other end is fixed in the mounting sleeve (74). A slider is fixedly provided at the bottom of the mounting sleeve (74). The mounting sleeve (74) is slidably mounted on the top of the mounting plate (4) by the slider. A groove (11) is provided on the top of the mounting plate (4). The inner surface of the groove (11) is slidably sleeved with the slider.

7. A wafer positioning device for a coating and developing machine according to claim 6, characterized in that: The lateral adjustment assembly (8) includes a threaded shaft (81), a mounting block (82), a rotating part (83), and a gear (84). The threaded shaft (81) is rotatably sleeved inside the mounting block (82). The mounting block (82) is fixed on the top of the mounting plate (4). The rotating part (83) is fixed on the top of the connecting rod (5). The threaded shaft (81) is rotatably sleeved with the connecting rod (5). The gear (84) is fixedly sleeved on the outer surface of the threaded shaft (81) and located in the fitting port of the connecting rod (5). The rotating part (83) includes a motor and a gear. The gear is meshed with the gear (84). The motor drives the gear to rotate. The threaded shaft (81) is threadedly sleeved with the mounting sleeve (74). The threads on both sides of the threaded shaft (81) have opposite directions of rotation.

8. A wafer positioning device for a coating and developing machine according to claim 7, characterized in that: The distribution-type air supply assembly (9) includes an air pump (91), a reversing valve (92), a connecting sleeve (93), a first air pipe (94), and a second air pipe (95). The air pump (91) is fixedly installed on the top of the connecting rod (5). The reversing valve (92) is fixedly connected to the air outlet end of the air pump (91). The reversing valve (92) has two air outlet ends. The connecting sleeve (93) is fixedly connected to one air outlet end of the reversing valve (92). The first air pipe (94) is fixedly connected to the other air outlet end of the reversing valve (92). The second air pipe (95) is fixedly connected between the connecting sleeve (93) and the mounting sleeve (74). The connecting sleeve (93) is connected to the mounting sleeve (74) through the second air pipe (95).

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