Semiconductor packaging piece processing device

Abstract

The invention discloses a semiconductor packaging piece processing device, relates to the technical field of semiconductor packaging, and solves the problems that the automatic and stable feeding effect on a semiconductor piece and a packaging shell is not high when the semiconductor piece is packaged, and the conversion processing effect on different packaging positions of the semiconductor piece is not high when the semiconductor piece is packaged. And the problem that the blanking synchronism of the automatic stretching device for the packaged semiconductor parts is not high is solved. The processing device comprises a device main body, a first placing plate, a second placing plate, a conveying port, a packaging shell, a semiconductor part and a conversion mechanism, and the side wall of the device main body is fixedly connected with the first placing plate; according to the semiconductor packaging device, automatic clamping and feeding movement and automatic pushing movement of the semiconductor and the packaging shell can be achieved at a time, after the semiconductor is packaged, the packaging table can be driven to automatically stretch out while the door body of the device is opened, and the effect of convenient taking and discharging is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a semiconductor packaging processing device. Background Art

[0002] Semiconductor packaging technology is one of the important processes for protecting and connecting semiconductor chips. With the development of semiconductor technology, packaging technology is also constantly evolving. The traditional packaging method is to use double-lead packaging. With the development of technology, the common packaging method has now become a more complex and high-density packaging form, such as ball grid array and lead-free packaging. However, although the existing semiconductor packaging technology has made great progress, there are still some limitations. For example, the existing packaging devices can often only complete part of the packaging process, such as welding or packaging.

[0003] The existing Chinese patent application with publication number CN 113725129 B discloses a semiconductor packaging device, including an equipment body, a processing frame is fixedly connected to the top of the equipment body, a feed rack is fixedly connected to the middle position of the bottom of the inner cavity of the processing frame, the front bottom of the packaging device passes through the feed rack and extends to the outside of the feed rack, a control panel is fixedly connected to the top of the front of the processing frame, and detection light curtains are fixedly connected to both sides of the front bottom of the processing frame. The invention relates to the field of semiconductor packaging technology. The semiconductor packaging device effectively improves the packaging rate. The glue dispenser reciprocates clockwise or counterclockwise on the adjustment device, thereby deflecting the glue dispensing position, effectively increasing the glue dispensing range of the fixed position of the semiconductor, and the transmission member can drive the adjustment device to adjust the glue dispenser, so as to ensure that a suitable glue dripping height is maintained between the glue dispenser and the semiconductor, which is beneficial to avoid a reduction in the height between the glue dispenser and the semiconductor.

[0004] The existing Chinese patent application with publication number CN 118116847 A discloses a semiconductor packaging device, which belongs to the technical field of semiconductor packaging equipment, including a base, on which an arc-shaped fixing plate is fixedly installed, and two symmetrically arranged welding grooves are arranged on the arc-shaped fixing plate. The base is also provided with a welding mechanism and a detection mechanism, and the welding mechanism includes two symmetrically arranged welding guns, and the welding guns are used to weld semiconductors. The detection mechanism includes two symmetrically arranged power connection posts, and the power connection posts are slidably installed on the arc-shaped fixing plate. The power connection posts are used to detect semiconductors placed in the arc-shaped fixing plate. The invention automatically completes the packaging of semiconductors through the welding mechanism and the detection mechanism, and has a simple structure and is easy to operate.

[0005] However, the processing platform has the following defects when used:

[0006] 1. The existing packaging processing device can perform good packaging processing operations on semiconductor parts when packaging and processing semiconductor parts. However, after processing a group of semiconductor parts and packaging covers, operators are required to load the semiconductor parts. The automatic clamping and loading of semiconductor parts and packaging covers in the device is not highly automated. Moreover, when packaging and processing semiconductor parts, the effect of adjusting the packaging of multiple parts of semiconductor parts is not high, so that when packaging and processing semiconductors, blind spots will appear in the packaging parts of semiconductor parts, reducing the packaging and processing quality of semiconductor parts.

[0007] 2. After the existing packaging processing device has packaged and processed the semiconductor parts, when unloading the packaged semiconductor parts, the staff needs to open the device and then reach into the device to take the semiconductor parts and unload them. The linkage between the semiconductor parts on the packaging table and the opening and unloading of the device door is not high, so that after the device door is opened, the packaging table is automatically extended from the device, which is not very convenient, reducing the efficiency of unloading semiconductor parts in the packaging device and increasing the cumbersomeness of the operator to unload the semiconductor parts. Summary of the invention

[0008] The object of the present invention is to provide a semiconductor package processing device to solve the problems raised in the above background technology.

[0009] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme:

[0010] A semiconductor package processing device provided by the present invention comprises a device body, a first placement plate, a second placement plate, a conveying port, a packaging shell, a semiconductor device and a conversion mechanism, wherein the first placement plate is fixedly connected to the side wall of the device body, the second placement plate is fixedly connected to the other side of the device body, the conveying port located on one side of the first placement plate is opened on the side wall of the device body, the packaging shell is placed on the outer wall of the first placement plate, and the semiconductor device is placed on the outer wall of the second placement plate;

[0011] The conversion mechanism includes:

[0012] An adjustment component, wherein a first electric push rod is fixedly connected to the top of the device body, one end of the first electric push rod is fixedly connected to a lifting rod slidably connected to the inner wall of the device body, a fixing groove is provided at a connection position between the inner wall of the device body and the lifting rod, a first threaded rod is rotatably connected to the outer wall of the lifting rod, one end of the first threaded rod is fixedly connected to a first servo motor, an adjustment block slidably connected to the outer wall of the lifting rod is threadedly connected to the outer wall of the lifting rod, and a first telescopic groove is provided at a connection position between the outer wall of the lifting rod and the adjustment block;

[0013] Rotating assembly, the outer wall of the adjustment block is fixedly connected to the second servo motor, the output end of the second servo motor is fixedly connected to the turntable, the outer wall of the turntable is fixedly connected to the welding body, and the outer wall of the turntable is fixedly connected to the connecting frame located on one side of the welding body;

[0014] Wherein, the adjusting component is arranged inside the device body, and the rotating component is arranged on the outer wall of the adjusting block.

[0015] As a preferred embodiment of the present invention, the positions of the first placement plate and the second placement plate are symmetrically distributed about the central axis of the device body, the positions of the welding device body and the connecting frame are symmetrically distributed about the rotation center of the turntable, the outer wall of the connecting frame is provided with a limiting mechanism, the outer walls of the first placement plate and the second placement plate are both provided with a conveying mechanism, and the interior of the device body is provided with a pushing mechanism.

[0016] As a preferred embodiment of the present invention, the limiting mechanism includes:

[0017] A connecting rod, the top of the connecting frame is fixedly connected to a second electric push rod, one end of the second electric push rod is fixedly connected to the connecting rod, and the outer wall of the connecting rod is fixedly connected to a limiting rod slidably connected to the outer wall of the connecting rod;

[0018] A clamping rod, wherein the outer wall of the connecting rod is rotatably connected to a rotating rod, one end of the rotating rod is rotatably connected to a telescopic rod slidably connected to the outer wall of the connecting frame, and one end of the telescopic rod is fixedly connected to a clamping rod located on one side of the packaging shell;

[0019] A positioning block, wherein the outer wall of the first placement plate is fixedly connected with a positioning block that fits with the side wall of the packaging shell.

[0020] As a preferred solution of the present invention, the rotating rod forms a rotating structure through the connecting rod and the telescopic rod, and two groups of rotating rods are provided. The positions of the two groups of rotating rods are symmetrical about the central axis of the connecting rod, and the rotation directions of the two groups of rotating rods are opposite.

[0021] There are two groups of limit rods, the positions of the two groups of limit rods are symmetrical about the central axis of the connecting rod, and the limit rods are arranged on the movement track of the packaging shell.

[0022] As a preferred embodiment of the present invention, the conveying mechanism comprises:

[0023] A swing rod, the outer wall of the first placement plate is fixedly connected to a third servo motor, the output end of the third servo motor is fixedly connected to a synchronous belt rotatably connected to the outer wall of the first placement plate, the outer wall of the synchronous belt is fixedly connected to a connecting shaft, and the outer wall of the connecting shaft is fixedly connected to a swing rod rotatably connected to the outer wall of the first placement plate;

[0024] Among them, two sets of connecting shafts are provided, and the position distributions of the two sets of connecting shafts are symmetrical about the central axis of the synchronous belt;

[0025] A conveying rod, a conveying rod that is slidably connected to the outer wall of the swinging rod and is also slidably connected to the outer wall of the first placing plate is provided. A limiting groove is opened at the connecting portion between the outer wall of the swinging rod and the conveying rod, and a sliding groove is opened at the connecting portion between the outer wall of the first placing plate and the conveying rod.

[0026] As a preferred solution of the present invention, two sets of swinging rods are provided, and the position distributions of the two sets of swinging rods are symmetrical about the central axis of the connecting shaft. The rotation centers of the swinging rods and the rotation center of the synchronous belt are on the same horizontal plane as the rotation center of the connecting shaft;

[0027] Among them, the outer wall contour of the sliding groove is in the shape of a "mouth". The conveying rod is arranged on the movement track of the encapsulation housing, and the inner wall contour of the conveying port is adapted to the outer wall contour of the encapsulation housing.

[0028] As a preferred solution of the present invention, the pushing mechanism includes:

[0029] A threaded slider, a fourth servo motor is fixedly connected to the side wall of the device main body. The output end of the fourth servo motor is fixedly connected to a second threaded rod that is rotatably connected to the inner wall of the device main body. A threaded slider that is slidably connected to the outer wall of the device main body is threadedly connected to the outer wall of the second threaded rod. An adjustment groove is opened at the connecting portion between the outer wall of the device main body and the threaded slider, and an observation door body that is slidably connected to the outer wall of the device main body is fixedly connected to the outer wall of the threaded slider;

[0030] A rotating rod, a fixed rod is fixedly connected to the outer wall of the threaded slider. A rotating rod that is rotatably connected to the inner wall of the device main body is slidably connected to the outer wall of the fixed rod. A first connection groove is opened at the connecting portion between the outer wall of the rotating rod and the fixed rod;

[0031] An encapsulation table, a sliding block that is slidably connected to the inner wall of the device main body is slidably connected to the outer wall of the rotating rod. A second connection groove is opened at the connecting portion between the outer wall of the rotating rod and the sliding block. An encapsulation table located below the turntable is fixedly connected to the top of the sliding block. A second telescopic groove is opened at the connecting portion between the inner wall of the device main body and the sliding block.

[0032] As a preferred solution of the present invention, two sets of second threaded rods are provided, and the rotation directions of the two sets of second threaded rods are opposite, and the threaded sliders and the second threaded rods are arranged in a one-to-one correspondence;

[0033] Among them, a transparent observation window is opened on the outer wall of the observation door body. Two sets of observation door bodies are provided, and the sliding directions of the two sets of observation door bodies are opposite.

[0034] As a preferred solution of the present invention, two groups of rotating rods are provided, the rotating directions of the two groups of rotating rods are opposite, and the positions of the first connecting grooves and the second connecting grooves are equidistantly distributed about the rotation center of the rotating rods.

[0035] As a preferred solution of the present invention, the packaging platform is arranged opposite to the sliding track of the observation door body, and the packaging platform is arranged on the movement track of the turntable.

[0036] Compared with the prior art, one or more of the above technical solutions have the following beneficial effects:

[0037] 1. A semiconductor package processing device, when the semiconductor is packaged and processed by the packaging device, in order to improve the effect of converting the package of the semiconductor in the device, the packaging shell can be placed on the top of the semiconductor on the surface of the packaging table under the action of the clamping rod, and according to the adjustment needs of the packaging position, the first electric push rod can be turned on to drive the lifting rod to slide along the inner wall of the fixed groove to achieve the effect of adjusting the welding height of the welder, and the first servo motor can be turned on to drive the adjustment block to slide along the inner wall of the first telescopic groove through the rotation of the first threaded rod to adjust the horizontal position of the welder. At the same time, the second servo motor can be turned on to drive the welder to perform a circumferential welding movement around the semiconductor by rotating the turntable, so as to achieve the effect of the welder welding the semiconductor in all directions;

[0038] 2. In a semiconductor package processing device, when the semiconductor parts are packaged and processed by the packaging device, in order to improve the effect of automatic loading of the packaging shell and the semiconductor parts after packaging, and to improve the stability of the transportation of the packaging shell and the semiconductor parts after loading, the third servo motor can be turned on first to drive the connecting shaft to rotate synchronously through the rotation of the synchronous belt. The rotation of the connecting shaft drives the conveying rod to slide synchronously along the inner wall of the limit groove and the slide groove through the rotation of the swing rod, which plays a role in driving the conveying rod to perform reciprocating pushing motion, so that the packaging shell fits with the positioning block, and the second electric push rod is turned on. Under the connection of the limit rod, the connecting rod is driven to move downward. The movement of the connecting rod drives the clamping rod fixedly connected to the telescopic rod to perform telescopic motion through the rotation of the rotating rod, which plays a role in effectively clamping and fixing the two sides of the packaging shell, so as to improve the stability of automatic loading and transportation of semiconductor parts and packaging shells in the device;

[0039] 3. This kind of semiconductor package processing device, after the semiconductor parts are packaged and processed by the packaging device, in order to improve the synchronization of automatically extending the packaged semiconductor parts out of the device to take out the materials when the observation door is opened, after the semiconductor is packaged, the fourth servo motor can be turned on to drive the threaded slider to slide along the inner wall of the adjusting groove through the rotation of the second threaded rod. The sliding of the threaded slider drives the observation door body to open synchronously along the inner wall of the adjusting groove. At the same time, the threaded slider slides along the inner wall of the first connecting groove through the fixed rod when sliding, driving the rotating rod to rotate. The rotation of the rotating rod drives the sliding block to slide synchronously along the inner wall of the second connecting groove and the second telescopic groove, and drives the packaging table to extend synchronously, so as to achieve the effect of reverse movement of the observation door body and the packaging table, and play a role in facilitating the unloading of packaged semiconductor parts. It has the advantages of automated packaging processing and the advantages of device packaging processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0041] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0043] Figure 2 It is a schematic diagram of the overall internal structure of the present invention;

[0044] Figure 3 It is a structural schematic diagram of the position distribution of the turntable of the present invention;

[0045] Figure 4 It is a structural schematic diagram of the position distribution of the lifting rod of the present invention;

[0046] Figure 5 It is a schematic diagram of the position distribution structure of the connecting frame of the present invention;

[0047] Figure 6 It is a structural schematic diagram of the clamping rod of the present invention;

[0048] Figure 7 It is a schematic diagram of the structure of the swing rod connected to the conveying pipe of the present invention;

[0049] Figure 8 It is a schematic diagram of the structure of the swing rod of the present invention in another direction;

[0050] Fig. 9 It is a structural schematic diagram of the position distribution of semiconductor components of the present invention;

[0051] Fig.10 It is a schematic structural diagram of the connection between the second threaded rod and the threaded slider of the present invention;

[0052] Fig.11 It is a schematic diagram of the structure of the connection between the rotating rod and the sliding block of the present invention;

[0053] In the figure:

[0054] 1. Device body;

[0055] 2. The first placement board;

[0056] 3. The second placement board;

[0057] 4. Delivery port;

[0058] 5. Encapsulation shell;

[0059] 6. Semiconductor parts;

[0060] 7. Conversion mechanism;

[0061] 8. Adjustment assembly; 801. First electric push rod; 802. Lifting rod; 803. Fixed slot; 804. First threaded rod; 805. First servo motor; 806. Adjustment block; 807. First telescopic slot;

[0062] 9. Rotating assembly; 901. Second servo motor; 902. Turntable; 903. Welding device body; 904. Connecting frame;

[0063] 10. Limiting mechanism; 1001. Second electric push rod; 1002. Connecting rod; 1003. Limiting rod; 1004. Rotating rod; 1005. Telescopic rod; 1006. Clamping rod; 1007. Positioning block;

[0064] 11. Conveying mechanism; 1101. third servo motor; 1102. synchronous belt; 1103. connecting shaft; 1104. swing rod; 1105. conveying rod; 1106. limiting groove; 1107. slide groove;

[0065] 12. Pushing mechanism; 1201. Fourth servo motor; 1202. Second threaded rod; 1203. Threaded slider; 1204. Adjusting slot; 1205. Observation door; 1206. Fixed rod; 1207. Rotating rod; 1208. First connecting slot; 1209. Sliding block; 1210. Second connecting slot; 1211. Packaging table; 1212. Second telescopic slot. DETAILED DESCRIPTION

[0066] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0067] See also Figure 1-Figure 11 A semiconductor package processing device comprises a device body 1, a first placement plate 2, a second placement plate 3, a conveying port 4, a packaging shell 5, a semiconductor component 6 and a conversion mechanism 7, wherein the side wall of the device body 1 is fixedly connected with the first placement plate 2, the other side of the device body 1 is fixedly connected with the second placement plate 3, the side wall of the device body 1 is provided with a conveying port 4 located on one side of the first placement plate 2, the outer wall of the first placement plate 2 is provided with a packaging shell 5, and the outer wall of the second placement plate 3 is provided with a semiconductor component 6; the conversion mechanism 7 comprises: an adjustment component 8, a first electric push rod 801 is fixedly connected with the top of the device body 1, one end of the first electric push rod 801 is fixedly connected with a lifting rod 802 slidably connected with the inner wall of the device body 1, and a fixing groove 80 is provided at the connection portion between the inner wall of the device body 1 and the lifting rod 802 3. The outer wall of the lifting rod 802 is rotatably connected to the first threaded rod 804, one end of the first threaded rod 804 is fixedly connected to the first servo motor 805, the outer wall of the first threaded rod 804 is threadedly connected to the adjusting block 806 which is slidably connected to the outer wall of the lifting rod 802, and the connecting part between the outer wall of the lifting rod 802 and the adjusting block 806 is provided with a first telescopic groove 807; the rotating component 9, the outer wall of the adjusting block 806 is fixedly connected to the second servo motor 901, the output end of the second servo motor 901 is fixedly connected to the turntable 902, the outer wall of the turntable 902 is fixedly connected to the welding device body 903, and the outer wall of the turntable 902 is fixedly connected to the connecting frame 904 located on one side of the welding device body 903; wherein, the adjusting component 8 is arranged inside the device body 1, and the rotating component 9 is arranged on the outer wall of the adjusting block 806.

[0068] The above working principle: when the semiconductor component 6 is packaged by the packaging device, in order to improve the effect of automatic loading of the packaging shell 5 and the semiconductor component 6 after packaging, and to improve the stability of the transportation of the packaging shell and the semiconductor component 6 after loading, the third servo motor 1101 can be turned on first to drive the connecting shaft 1103 to perform synchronous rotation through the rotation of the synchronous belt 1102. The rotation of the connecting shaft 1103 drives the conveying rod 1105 to slide synchronously along the inner wall of the limit groove 1106 and the slide groove 1107 through the rotation of the swing rod 1104, which plays a role in the belt. The movable conveying rod 1105 performs a reciprocating pushing motion, so that the packaging shell 5 fits with the positioning block 1007, and opens the second electric push rod 1001. Under the connection of the limit rod 1003, the connecting rod 1002 is driven to move downward. The movement of the connecting rod 1002 drives the clamping rod 1006 fixedly connected to the telescopic rod 1005 to perform a telescopic movement through the rotation of the rotating rod 1004, which plays a role in effectively clamping and fixing the two sides of the packaging shell 5, thereby improving the stability of automatic loading and transportation of semiconductor components 6 and packaging shells 5 in the device.

[0069] Specific reference Figure 3-Figure 5 The positions of the first placement plate 2 and the second placement plate 3 are symmetrically distributed about the central axis of the device body 1, the positions of the welding body 903 and the connecting frame 904 are symmetrically distributed about the rotation center of the turntable 902, the outer wall of the connecting frame 904 is provided with a limiting mechanism 10, the outer walls of the first placement plate 2 and the second placement plate 3 are both provided with a conveying mechanism 11, and the interior of the device body 1 is provided with a pushing mechanism 12.

[0070] A semiconductor package processing device of the present invention is beneficial to improving the stability of clamping and transporting the packaging shell 5 and the semiconductor component 6 through the setting of the limiting mechanism 10, and is beneficial to automatically loading the packaging shell 5 and the semiconductor component 6 during packaging through the setting of the conveying mechanism 11. It is beneficial to facilitate the unloading of the packaged semiconductor component 6 through the setting of the pushing mechanism 12. It has the advantages of automated packaging processing and the advantages of device packaging processing efficiency.

[0071] Specific reference Figure 5 and Figure 6The limiting mechanism 10 includes: a connecting rod 1002, a second electric push rod 1001 is fixedly connected to the top of the connecting frame 904, one end of the second electric push rod 1001 is fixedly connected to the connecting rod 1002, and the outer wall of the connecting rod 1002 is fixedly connected to a limiting rod 1003 slidably connected to the outer wall of the connecting rod 1002; a clamping rod 1006, the outer wall of the connecting rod 1002 is rotatably connected to a rotating rod 1004, one end of the rotating rod 1004 is rotatably connected to a telescopic rod 1005 slidably connected to the outer wall of the connecting frame 904, and one end of the telescopic rod 1005 is fixedly connected to the clamping rod 1006 located on one side of the packaging shell 5; a positioning block 1007, a positioning block 1007 that fits the side wall of the packaging shell 5 is fixedly connected to the outer wall of the first placement plate 2.

[0072] In this embodiment, the rotating rod 1004 forms a rotating structure through the connecting rod 1002 and the telescopic rod 1005. Two groups of rotating rods 1004 are provided. The position distribution of the two groups of rotating rods 1004 is symmetrical about the central axis of the connecting rod 1002, and the rotation directions of the two groups of rotating rods 1004 are opposite; wherein, two groups of limit rods 1003 are provided. The position distribution of the two groups of limit rods 1003 is symmetrical about the central axis of the connecting rod 1002, and the limit rods 1003 are arranged on the movement trajectory of the packaging shell 5. The movement of the connecting rod 1002 drives the rotating rod 1004 to rotate conveniently through the connection of the telescopic rod 1005, thereby playing a role in effectively clamping and fixing the two sides of the packaging shell 5.

[0073] A semiconductor package processing device of the present invention can open the second electric push rod 1001 when it is necessary to clamp and load the package shell, and drive the connecting rod 1002 to move downward under the connection of the limit rod 1003. The movement of the connecting rod 1002 drives the clamping rod 1006 fixedly connected to the telescopic rod 1005 to perform telescopic movement through the rotation of the rotating rod 1004, thereby effectively clamping and fixing the two sides of the package shell 5, thereby improving the stability of automatic loading and transportation of semiconductor components 6 and the package shell 5 in the device.

[0074] Specific reference Fig. 9 and Fig.10The conveying mechanism 11 includes: a swing rod 1104, a third servo motor 1101 is fixedly connected to the outer wall of the first placement plate 2, the output end of the third servo motor 1101 is fixedly connected to a synchronous belt 1102 rotatably connected to the outer wall of the first placement plate 2, the outer wall of the synchronous belt 1102 is fixedly connected to a connecting shaft 1103, and the outer wall of the connecting shaft 1103 is fixedly connected to a swing rod 1104 rotatably connected to the outer wall of the first placement plate 2; wherein, two groups of connecting shafts 1103 are provided, and the position distribution of the two groups of connecting shafts 1103 is symmetrical about the central axis of the synchronous belt 1102; a conveying rod 1105, the outer wall of the swing rod 1104 is slidably connected to a conveying rod 1105 slidably connected to the outer wall of the first placement plate 2, a limiting groove 1106 is provided at the connection position between the outer wall of the swing rod 1104 and the conveying rod 1105, and a sliding groove 1107 is provided at the connection position between the outer wall of the first placement plate 2 and the conveying rod 1105.

[0075] In this embodiment, two groups of swing rods 1104 are provided, and the position distribution of the two groups of swing rods 1104 is symmetrical about the central axis of the connecting shaft 1103, and the rotation center of the swing rod 1104 and the rotation center of the synchronous belt 1102 and the rotation center of the connecting shaft 1103 are on the same horizontal plane; wherein, the outer wall contour of the slide groove 1107 is in the shape of a "mouth", the conveying rod 1105 is arranged on the motion trajectory of the packaging shell 5, and the inner wall contour of the conveying port 4 is adapted to the outer wall contour of the packaging shell 5, which is beneficial to improve the stability of driving the conveying rod 1105 to push the material back and forth by arranging two groups of swing rods 1104 whose position distribution is symmetrical about the central axis of the connecting shaft 1103, thereby achieving the effect of automatic feeding stability of the packaging shell 5 and the semiconductor component 6.

[0076] A semiconductor package processing device of the present invention can improve the effect of automatic loading of the packaging shell 5 and the semiconductor component 6 after packaging. The third servo motor 1101 can be turned on first to drive the connecting shaft 1103 to rotate synchronously through the rotation of the synchronous belt 1102. The rotation of the connecting shaft 1103 drives the conveying rod 1105 to slide synchronously along the inner walls of the limit groove 1106 and the slide groove 1107 through the rotation of the swing rod 1104, thereby driving the conveying rod 1105 to perform reciprocating pushing motion, so that the packaging shell 5 fits the positioning block 1007.

[0077] Specific reference Fig.10 and Fig.11The pushing mechanism 12 includes: a threaded slider 1203, a fourth servo motor 1201 is fixedly connected to the side wall of the device body 1, a second threaded rod 1202 rotatably connected to the inner wall of the device body 1 is fixedly connected to the output end of the fourth servo motor 1201, the outer wall of the second threaded rod 1202 is threadedly connected to the threaded slider 1203 slidably connected to the outer wall of the device body 1, an adjustment groove 1204 is provided at the connection part between the outer wall of the device body 1 and the threaded slider 1203, and an observation door body 1205 slidably connected to the outer wall of the device body 1 is fixedly connected to the outer wall of the device body 1; a rotating rod 1207, and the outer wall of the threaded slider 1203 is fixedly connected to a fixed rod 1206, the outer wall of the fixed rod 1206 is slidably connected to the rotating rod 1207 which is rotatably connected to the inner wall of the device body 1, and a first connecting groove 1208 is provided at the connecting position between the outer wall of the rotating rod 1207 and the fixed rod 1206; a packaging table 1211, the outer wall of the rotating rod 1207 is slidably connected to the sliding block 1209 which is slidably connected to the inner wall of the device body 1, and a second connecting groove 1210 is provided at the connecting position between the outer wall of the rotating rod 1207 and the sliding block 1209, the top of the sliding block 1209 is fixedly connected to the packaging table 1211 located below the turntable 902, and a second telescopic groove 1212 is provided at the connecting position between the inner wall of the device body 1 and the sliding block 1209.

[0078] In this embodiment, two groups of second threaded rods 1202 are provided, and the rotation directions of the two groups of second threaded rods 1202 are opposite, and the threaded sliders 1203 and the second threaded rods 1202 are arranged in a one-to-one correspondence; wherein, a transparent observation window is opened on the outer wall of the observation door body 1205, and two groups of observation door bodies 1205 are provided, and the sliding directions of the two groups of observation door bodies 1205 are opposite, which is conducive to the one-to-one correspondence between the threaded sliders 1203 and the second threaded rods 1202, thereby driving the two groups of observation door bodies 1205 to slide open relative to each other.

[0079] In this embodiment, two groups of rotating rods 1207 are provided, and the rotation directions of the two groups of rotating rods 1207 are opposite. The positions of the first connecting groove 1208 and the second connecting groove 1210 are equidistantly distributed about the rotation center of the rotating rod 1207. This is beneficial for driving the packaging table 1211 to move telescopically conveniently by providing two groups of rotating rods 1207 with opposite rotation directions.

[0080] At the same time, in this embodiment, the packaging table 1211 and the observation door body 1205 have opposite sliding trajectories, and the packaging table 1211 is set on the movement trajectory of the turntable 902. This is beneficial to facilitate the unloading of the packaged semiconductor parts 6 through the opposite setting of the sliding trajectories of the packaging table 1211 and the observation door body 1205, and has the advantages of automated packaging processing and the advantages of device packaging processing efficiency.

[0081] A semiconductor package processing device of the present invention, after the semiconductor 6 is packaged by the packaging device, in order to improve the synchronization of the packaged semiconductor 6 automatically extending out of the device to take out the material when the observation door is opened, after the semiconductor is packaged, the fourth servo motor 1201 can be turned on to drive the threaded slider 1203 to slide along the inner wall of the adjustment groove 1204 through the rotation of the second threaded rod 1202, and the sliding of the threaded slider 1203 drives the observation door body 1205 to open synchronously along the inner wall of the adjustment groove 1204, and at the same time, the threaded slider 1203 03 When sliding, the fixed rod 1206 slides along the inner wall of the first connecting groove 1208, driving the rotating rod 1207 to rotate. The rotation of the rotating rod 1207 drives the sliding block 1209 to slide synchronously along the inner walls of the second connecting groove 1210 and the second telescopic groove 1212, and drives the packaging table 1211 to extend synchronously, thereby achieving the effect of reverse movement of the observation door body 1205 and the packaging table 1211, and facilitating the unloading of the packaged semiconductor parts 6, and has the advantages of automated packaging processing and the advantages of device packaging processing efficiency.

[0082] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor package processing device, comprising a device body (1), a first placement plate (2), a second placement plate (3), a conveying port (4), a package shell (5), a semiconductor component (6) and a conversion mechanism (7), characterized in that: A first placement plate (2) is fixedly connected to the side wall of the device body (1), a second placement plate (3) is fixedly connected to the other side of the device body (1), a delivery port (4) is provided on the side wall of the device body (1) and is located on one side of the first placement plate (2), a packaging shell (5) is placed on the outer wall of the first placement plate (2), and a semiconductor component (6) is placed on the outer wall of the second placement plate (3); The conversion mechanism (7) comprises: An adjustment component (8), wherein a first electric push rod (801) is fixedly connected to the top of the device body (1), one end of the first electric push rod (801) is fixedly connected to a lifting rod (802) slidably connected to the inner wall of the device body (1), a fixing groove (803) is provided at a connection position between the inner wall of the device body (1) and the lifting rod (802), a first threaded rod (804) is rotatably connected to the outer wall of the lifting rod (802), one end of the first threaded rod (804) is fixedly connected to a first servo motor (805), the outer wall of the first threaded rod (804) is threadedly connected to an adjustment block (806) slidably connected to the outer wall of the lifting rod (802), and a first telescopic groove (807) is provided at a connection position between the outer wall of the lifting rod (802) and the adjustment block (806); A rotating assembly (9), wherein the outer wall of the adjusting block (806) is fixedly connected to a second servo motor (901), the output end of the second servo motor (901) is fixedly connected to a rotating disk (902), the outer wall of the rotating disk (902) is fixedly connected to a welding device body (903), and the outer wall of the rotating disk (902) is fixedly connected to a connecting frame (904) located at one side of the welding device body (903); The adjusting component (8) is arranged inside the device body (1), and the rotating component (9) is arranged on the outer wall of the adjusting block (806).

2. The semiconductor package processing device according to claim 1, characterized in that: The positions of the first placement plate (2) and the second placement plate (3) are symmetrically distributed with respect to the central axis of the device body (1); the positions of the welding device body (903) and the connecting frame (904) are symmetrically distributed with respect to the rotation center of the turntable (902); a limiting mechanism (10) is arranged on the outer wall of the connecting frame (904); a conveying mechanism (11) is arranged on the outer walls of the first placement plate (2) and the second placement plate (3); and a pushing mechanism (12) is arranged inside the device body (1).

3. The semiconductor package processing device according to claim 2, characterized in that: The limiting mechanism (10) comprises: A connecting rod (1002), the top of the connecting frame (904) is fixedly connected to a second electric push rod (1001), one end of the second electric push rod (1001) is fixedly connected to the connecting rod (1002), and the outer wall of the connecting rod (1002) is fixedly connected to a limiting rod (1003) slidably connected to the outer wall of the connecting rod (1002); A clamping rod (1006), wherein the outer wall of the connecting rod (1002) is rotatably connected to a rotating rod (1004), one end of the rotating rod (1004) is rotatably connected to a telescopic rod (1005) slidably connected to the outer wall of the connecting frame (904), and one end of the telescopic rod (1005) is fixedly connected to a clamping rod (1006) located on one side of the packaging shell (5); A positioning block (1007), wherein the outer wall of the first placement plate (2) is fixedly connected with a positioning block (1007) which fits the side wall of the packaging shell (5).

4. The semiconductor package processing device according to claim 3, characterized in that: The rotating rod (1004) forms a rotating structure through the connecting rod (1002) and the telescopic rod (1005), and two groups of the rotating rod (1004) are provided. The positions of the two groups of the rotating rods (1004) are symmetrical about the central axis of the connecting rod (1002), and the rotation directions of the two groups of the rotating rods (1004) are opposite; There are two groups of limit rods (1003), the positions of the two groups of limit rods (1003) are symmetrical about the central axis of the connecting rod (1002), and the limit rods (1003) are arranged on the movement track of the packaging shell (5).

5. The semiconductor package processing device according to claim 2, characterized in that: The conveying mechanism (11) comprises: A swing rod (1104), the outer wall of the first placement plate (2) is fixedly connected to a third servo motor (1101), the output end of the third servo motor (1101) is fixedly connected to a synchronous belt (1102) rotatably connected to the outer wall of the first placement plate (2), the outer wall of the synchronous belt (1102) is fixedly connected to a connecting shaft (1103), and the outer wall of the connecting shaft (1103) is fixedly connected to a swing rod (1104) rotatably connected to the outer wall of the first placement plate (2); Wherein, the connecting shafts (1103) are provided in two groups, and the positions of the two groups of connecting shafts (1103) are distributed symmetrically with respect to the central axis of the synchronous belt (1102); A conveying rod (1105), the outer wall of the swing rod (1104) is slidably connected to the conveying rod (1105) which is slidably connected to the outer wall of the first placement plate (2), a limiting groove (1106) is provided at the connection position between the outer wall of the swing rod (1104) and the conveying rod (1105), and a sliding groove (1107) is provided at the connection position between the outer wall of the first placement plate (2) and the conveying rod (1105).

6. The semiconductor package processing device according to claim 5, characterized in that: Two groups of swing rods (1104) are provided, and the positions of the two groups of swing rods (1104) are symmetrical about the central axis of the connecting shaft (1103), and the rotation centers of the swing rods (1104) and the rotation centers of the synchronous belt (1102) and the connecting shaft (1103) are on the same horizontal plane; The outer wall profile of the slide groove (1107) is in the shape of a "mouth", the conveying rod (1105) is arranged on the movement track of the packaging shell (5), and the inner wall profile of the conveying port (4) is adapted to the outer wall profile of the packaging shell (5).

7. The semiconductor package processing device according to claim 2, characterized in that: The pushing mechanism (12) comprises: A threaded slider (1203), a side wall of the device body (1) is fixedly connected to a fourth servo motor (1201), an output end of the fourth servo motor (1201) is fixedly connected to a second threaded rod (1202) rotatably connected to the inner wall of the device body (1), an outer wall of the second threaded rod (1202) is threadedly connected to a threaded slider (1203) slidably connected to the outer wall of the device body (1), an adjustment groove (1204) is provided at a connection portion between the outer wall of the device body (1) and the threaded slider (1203), and an observation door (1205) slidably connected to the outer wall of the device body (1) is fixedly connected to the outer wall of the device body (1); A rotating rod (1207), the outer wall of the threaded slider (1203) is fixedly connected to a fixed rod (1206), the outer wall of the fixed rod (1206) is slidably connected to a rotating rod (1207) that is rotatably connected to the inner wall of the device body (1), and a first connecting groove (1208) is provided at a connection portion between the outer wall of the rotating rod (1207) and the fixed rod (1206); The packaging table (1211) is provided with a sliding block (1209) which is slidably connected to the inner wall of the device body (1) on the outer wall of the rotating rod (1207); a second connecting groove (1210) is provided at the connection position between the outer wall of the rotating rod (1207) and the sliding block (1209); the top of the sliding block (1209) is fixedly connected to the packaging table (1211) located below the turntable (902); and a second telescopic groove (1212) is provided at the connection position between the inner wall of the device body (1) and the sliding block (1209).

8. The semiconductor package processing device according to claim 7, characterized in that: The second threaded rods (1202) are provided in two groups, the rotation directions of the two groups of the second threaded rods (1202) are opposite, and the threaded sliders (1203) and the second threaded rods (1202) are provided in a one-to-one correspondence; The outer wall of the observation door body (1205) is provided with a transparent observation window, and two groups of the observation door bodies (1205) are provided, and the sliding directions of the two groups of the observation door bodies (1205) are opposite.

9. The semiconductor package processing device according to claim 7, characterized in that: The rotating rods (1207) are provided in two groups, and the rotation directions of the two groups of rotating rods (1207) are opposite. The positions of the first connecting grooves (1208) and the second connecting grooves (1210) are equidistantly distributed about the rotation center of the rotating rods (1207).

10. The semiconductor package processing device according to claim 7, characterized in that: The packaging platform (1211) and the sliding track of the observation door (1205) are arranged in opposite directions, and the packaging platform (1211) is arranged on the movement track of the turntable (902).

Images