Chip die bonding control method, chip packaging production line and storage medium

Abstract

The invention discloses a chip die bonding control method, a chip packaging production line and a storage medium. The control method comprises the steps that a wafer cutting piece is placed on a feeding station, and a metal plate is placed on a die bonding station; a first vision module is controlled to carry out image recognition processing on the wafer cutting piece on the feeding station, and a first moving track of the feeding station is generated; according to the first moving track, the position of a feeding station is adjusted, so that the to-be-pasted crystal grains on the bottom supporting film are located at the feeding position; adjusting the position of the wafer mounting station according to the second moving track; controlling the material suction module to move to a feeding position, sucking the crystal grains at the feeding position, controlling the glue dripping module to move to a crystal pasting position, and performing glue dispensing on the lead frame at the crystal pasting position; and the glue dripping module is controlled to move away from the crystal pasting position, the material suction module is controlled to move from the feeding position to the crystal pasting position, and the sucked crystal grains are placed on the lead frame. The product quality and the production precision can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a chip bonding control method, a chip packaging production line and a storage medium. Background Art

[0002] In the semiconductor manufacturing industry, chip packaging is a key link in the production of integrated circuits and has a vital impact on the performance, reliability and cost of the final product. With the continuous advancement of chip technology, especially the miniaturization of chip size, the improvement of integration and the expansion of production scale, the traditional chip packaging process faces many challenges.

[0003] In the traditional die bonding process, the alignment between the wafer cut piece (carrying a large number of tiny grains) and the metal plate (or lead frame) in the subsequent packaging process often relies on the preset parameters of the mechanical positioning system or manual intervention, which is not only time-consuming but also prone to errors. And if there should be a grain at a certain position in the wafer cut piece, but there may be no grain at this position due to defects in the previous process, when the machine transfers the grain to the lead frame, the loading station moves according to the preset path in each cycle, which may result in a lead frame without a grain, thus affecting the die bonding quality of the entire metal sheet. Summary of the invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a chip bonding control method, a chip packaging production line and a storage medium, which can improve product quality and production accuracy.

[0005] In a first aspect, the present application provides a control method for chip bonding, which is applied to the chip packaging production line, wherein the chip packaging production line includes a bonding device and a baking device, wherein the bonding device includes a loading station, a die attaching station, a first visual module, a glue dripping module, and a suction module, wherein the suction module can move between a preset loading position and a die attaching position, and the baking device includes a heating unit and a blowing module;

[0006] The control method comprises:

[0007] Obtain a wafer cutting sheet and a metal plate from a wafer cutting device, and place the wafer cutting sheet on the loading station, and place the metal plate on the die attaching station; wherein the wafer cutting sheet includes a base film and grains evenly arranged on the base film, and the metal plate is provided with a lead frame evenly arranged;

[0008] Controlling the first visual module to perform image recognition processing on the wafer cutting piece on the loading station, and generating a first moving trajectory of the loading station;

[0009] According to the first moving track, adjusting the position of the loading station so that the die to be attached on the bottom film is located at the loading position;

[0010] Acquire a second movement trajectory of the die attach station, and adjust the position of the die attach station according to the second movement trajectory, so that the lead frame to be attached on the metal plate is located at the die attach position;

[0011] Control the material suction module to move to the loading position and suck the die at the loading position, and control the glue dispensing module to move to the die attaching position and dispense glue on the lead frame at the die attaching position;

[0012] Control the glue dripping module to move away from the die attaching position, and control the material suction module to move from the material loading position to the die attaching position, and place the sucked die on the lead frame;

[0013] After all the lead frames on the metal plate are placed with the grains, the metal plate is transferred to the heating unit, and the heating unit is controlled to heat and the blowing module is controlled to blow an anti-oxidation mixed gas toward the heating unit to form a plurality of parts to be packaged on the metal plate.

[0014] According to the control method of chip bonding according to the first aspect of the embodiment of the present application, there are at least the following beneficial effects: obtaining a wafer cut piece and a metal plate, and placing them on the loading station and the die attaching station of the die attaching equipment respectively. Subsequently, the first visual module is controlled to perform image recognition processing on the wafer cut piece on the loading station, and the first moving trajectory of the loading station is generated based on the recognition result. Through the image recognition technology, the precise capture of the position of the grain on the wafer cut piece is achieved, and accurate guidance is provided for the subsequent movement of the loading station. After the suction module takes a grain from the loading position, the loading station can adjust the position of the loading station according to the first moving trajectory, and move the next grain to the loading position, which not only improves the alignment accuracy, but also reduces unnecessary moving distance, and improves production efficiency. At the same time, the position of the die attaching station is also adjusted according to the pre-set second moving trajectory, so that the suction module can place a new grain into an empty lead frame. During the glue pasting process, while controlling the suction module to move to the loading position, the glue dripping module is also controlled to move to the wafer pasting position. After the suction module sucks a grain from the loading position and moves from the loading position to the wafer pasting position, the glue dripping module needs to complete the glue dispensing on the lead frame at the wafer pasting position in this process, and then controls the glue dripping module to move away from the wafer pasting position, and the suction module places the sucked grain on the lead frame. After each wafer pasting, the loading station will move according to the first moving trajectory, and the wafer pasting station will move according to the second trajectory to ensure that the grain to be processed and the lead frame are located at the corresponding loading position and wafer pasting position, avoiding problems such as empty pasting or misalignment. Repeat the above die attach process. When all lead frames of the metal plate are attached with die, move the metal plate to the heating unit, control the heating unit to heat it, and control the blowing module to blow out the anti-oxidation mixed gas. The heating promotes the curing of the glue, so that a stable connection is formed between the die and the lead frame. The blowing protection effectively prevents the oxidation reaction during the packaging process and protects the performance and quality of the product. This application optimizes the station movement trajectory by introducing image recognition technology, ensuring that each lead frame can be combined with the die, realizing automated operation, and improving product quality and production accuracy.

[0015] According to some embodiments of the first aspect of the present application, controlling the first visual module to perform image recognition processing on the wafer cutting sheet on the loading station and generating a first movement trajectory of the loading station includes:

[0016] Controlling the first visual module to image the target image of the wafer cutting piece on the loading station;

[0017] Perform edge detection and threshold segmentation processing on the target image to obtain multiple grain positions in the target image;

[0018] According to the grain position, a plurality of initial trajectories are generated and a trajectory length corresponding to each of the initial trajectories is calculated; wherein the initial trajectory traverses all the grain positions, and the initial trajectory is formed by a plurality of routes in a first direction and a second direction, and the first direction and the second direction are perpendicular to each other;

[0019] The initial trajectory with the shortest trajectory length is used as the first moving trajectory of the loading station.

[0020] According to some embodiments of the first aspect of the present application, generating a plurality of initial trajectories according to the grain position and calculating a trajectory length corresponding to each of the initial trajectories includes:

[0021] According to the position of the grain, an initial track is generated and the corresponding track length is calculated, and the track length is used as the current shortest length;

[0022] Continuously generating a new initial trajectory, and calculating the corresponding trajectory length in real time during the generation of the initial trajectory;

[0023] When the trajectory length of the new initial trajectory during the generation process is greater than the current shortest length of the first magnification, stop generating the initial trajectory; wherein the first magnification is greater than or equal to 1;

[0024] When the new initial trajectory is less than or equal to the current shortest length of the first magnification, the initial trajectory and the corresponding trajectory length are retained and recorded.

[0025] According to some embodiments of the first aspect of the present application, the continuously generating the new initial trajectory and calculating the corresponding trajectory length in real time during the generation of the initial trajectory includes:

[0026] Based on the generated initial trajectory, an optimization strategy is generated through a preset heuristic learning model;

[0027] According to the optimization strategy, a new initial trajectory is continuously generated, and the corresponding trajectory length is calculated in real time during the generation process of the initial trajectory.

[0028] According to some embodiments of the first aspect of the present application, the wafer cutting device further includes a second vision module;

[0029] The step of controlling the glue dispensing module to move to a die attaching position and dispensing glue on the lead frame at the die attaching position includes:

[0030] Controlling the first visual module and the second visual module to perform image recognition on the wafer cutting sheet on the loading station and the metal plate on the wafer attaching station, respectively, to determine the first size information of the grain and the second size information of the lead frame;

[0031] Determining glue drop parameters of the glue drop module and determining an expected morphological image of the glue drop according to the first size information and the second size information;

[0032] Controlling the glue-dropping module to move to a die attaching position, and dispensing glue on the lead frame at the die attaching position according to the glue-dropping parameters;

[0033] Controlling the second visual module to perform image recognition processing on the glue drop on the lead frame to obtain an actual morphological image of the glue drop;

[0034] According to the expected morphology image and the actual morphology image, glue dropping parameters of the glue dropping module are adjusted.

[0035] According to some embodiments of the first aspect of the present application, adjusting the glue dropping parameters of the glue dropping module according to the expected morphology image and the actual morphology image includes:

[0036] Performing edge analysis on the expected morphological image and the actual morphological image to obtain an expected contour and an actual contour;

[0037] Performing similarity analysis based on corresponding contour points between the expected contour and the actual contour to obtain contour similarity;

[0038] Counting the number of pixels of the expected morphological image and the actual morphological image to obtain an expected area and an actual area;

[0039] Calculate the area difference according to the expected area and the actual area;

[0040] Calculating a center offset according to the center point position of the expected morphological image and the center point position of the actual morphological image;

[0041] Inputting the contour similarity, the area difference and the center offset into a preset quality assessment model to obtain a quality assessment value;

[0042] According to the quality evaluation value, the glue dropping parameters of the glue dropping module are adjusted.

[0043] According to some embodiments of the first aspect of the present application, controlling the heating unit to heat and controlling the blowing module to blow the anti-oxidation mixed gas toward the wafer attaching station includes:

[0044] Controlling the heating unit to preheat the metal plate at a first temperature within a first time period;

[0045] After the preheating stage is completed, controlling the heating unit to heat the metal plate at a second temperature within a second time period; wherein the second temperature is greater than the first temperature;

[0046] After the heating stage is completed, controlling the heating unit to cool the metal plate at a third temperature within a third time period; wherein the third temperature is lower than the first temperature;

[0047] During the operation of the heating unit, the blowing module is controlled to continuously blow out the anti-oxidation mixed gas to the heating unit at a first flow rate; wherein the anti-oxidation mixed gas is a mixed gas of nitrogen and hydrogen.

[0048] According to some embodiments of the first aspect of the present application, the chip packaging production line further includes a die detection device, and the die detection device includes a positioning fixture, a pushing module, and a sensing module;

[0049] After the step of forming a plurality of parts to be packaged on the metal plate, the method further includes:

[0050] Placing the metal plate containing a plurality of parts to be packaged into a positioning fixture, and determining a number of parts to be packaged to be inspected on the metal plate;

[0051] Controlling the pushing module to push the die of the packaged component to be inspected, and using the sensing module to sense the thrust value applied by the pushing module to the die;

[0052] When the pushing module pushes the grain down, the current pushing force value is recorded as the maximum force value;

[0053] When the maximum force values ​​corresponding to all the components to be packaged to be detected are greater than or equal to the preset tolerance threshold, it is determined that the die bonding of the components to be packaged on the corresponding metal plate is good;

[0054] When the maximum force value corresponding to one of the parts to be packaged to be detected is less than the bearing threshold, a new part to be packaged to be detected is re-determined, and the pushing module and the sensing module are controlled to detect the new part to be packaged to be detected;

[0055] When the maximum force values ​​corresponding to all new parts to be tested to be packaged are greater than or equal to the preset bearing threshold, it is determined that the corresponding parts to be packaged on the metal plate are well bonded. Conversely, when the maximum force value corresponding to one of the new parts to be tested to be packaged is less than the bearing threshold, the quality of the corresponding metal plate is marked as to be determined.

[0056] In a second aspect, the present application also provides a chip packaging production line, comprising: at least one memory; at least one processor; at least one program; the program is stored in the memory, and the processor executes at least one program to implement the chip bonding control method as described in any embodiment of the first aspect.

[0057] In a third aspect, the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer-executable signal, and the computer-executable signal is used to execute the chip bonding control method as described in any embodiment of the first aspect.

[0058] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0060] Figure 1 A flow chart of a chip bonding control method provided in some embodiments of the present application;

[0061] Figure 2 for Figure 1 Flow chart of step S120;

[0062] Figure 3 for Figure 2 Flow chart of step S230;

[0063] Figure 4 for Figure 3 Flow chart of step S320;

[0064] Figure 5 for Figure 1 Flow chart of step S150;

[0065] Figure 6 for Figure 5 Flow chart of step S550;

[0066] Figure 7 for Figure 1 Flow chart of step S170;

[0067] Figure 8 for Figure 1 Flowchart after step S170;

[0068] Fig. 9 A schematic diagram of the structure of a die bonding device provided in some embodiments of the present application;

[0069] Fig.10 A first initial path formed at a wafer cutting blade provided in some embodiments of the present application;

[0070] Fig.11 A second initial path formed at a wafer cutting blade provided in some embodiments of the present application;

[0071] Fig.12 A third initial path formed at a wafer dicing blade provided in some embodiments of the present application;

[0072] Fig.13 A fourth initial path formed at a wafer cutting blade is provided in some embodiments of the present application.

[0073] The figures are as follows:

[0074] Loading station 910; die attaching station 920; first visual module 930; glue dripping module 940; material suction module 950; second visual module 960; bottom film 971; die 972; metal plate 980; lead frame 981. DETAILED DESCRIPTION

[0075] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0076] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0077] In the description of this application, if there is a description of first or second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0078] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0079] In the semiconductor manufacturing industry, chip packaging is a key link in the production of integrated circuits and has a vital impact on the performance, reliability and cost of the final product. With the continuous advancement of chip technology, especially the miniaturization of chip size, the improvement of integration and the expansion of production scale, the traditional chip packaging process faces many challenges.

[0080] In the traditional die bonding process, the alignment between the wafer cut piece (carrying a large number of tiny grains) and the metal plate (or lead frame) in the subsequent packaging process often relies on the preset parameters of the mechanical positioning system or manual intervention, which is not only time-consuming but also prone to errors. And if there should be a grain at a certain position in the wafer cut piece, but there may be no grain at this position due to defects in the previous process, when the machine transfers the grain to the lead frame, the loading station moves according to the preset path in each cycle, which may result in a lead frame without a grain, thus affecting the die bonding quality of the entire metal sheet.

[0081] Based on this, the application provides a chip bonding control method, a chip packaging production line and a storage medium to solve the above-mentioned technical problems. The technical solutions proposed in this application are described in detail one by one below.

[0082] In the first aspect, the present application provides a control method for chip bonding, which is applied to a chip packaging production line, wherein the chip packaging production line includes a bonding device and a baking device, wherein the bonding device includes a loading station 910, a bonding station 920, a first visual module 930, a glue dripping module 940, and a suction module 950, wherein the suction module 950 can move between a preset loading position and a bonding position, and the baking device includes a heating unit and a blowing module. The control method may include but is not limited to the following steps:

[0083] Step S110: Obtain a wafer cut sheet and a metal plate, and place the wafer cut sheet on a loading station, and place the metal plate on a die attach station; wherein the wafer cut sheet includes a base film and grains evenly arranged on the base film, and the metal plate is provided with a lead frame evenly arranged;

[0084] Step S120: controlling the first visual module to perform image recognition processing on the wafer cutting piece on the loading station, and generating a first moving trajectory of the loading station;

[0085] Step S130: adjusting the position of the loading station according to the first moving trajectory so that the die to be attached on the bottom film is at the loading position;

[0086] Step S140: acquiring a second moving trajectory of the die attach station, and adjusting the position of the die attach station according to the second moving trajectory, so that the lead frame to be attached on the metal plate is at the die attach position;

[0087] Step S150: controlling the material suction module to move to the loading position and suck the die at the loading position, and controlling the glue dispensing module to move to the die attaching position and dispense glue on the lead frame at the die attaching position;

[0088] Step S160: Control the glue-dropping module to move away from the die attaching position, and control the material suction module to move from the material loading position to the die attaching position, and place the sucked die on the lead frame;

[0089] Step S170: After all lead frames on the metal plate are placed with grains, the metal plate is transferred to a heating unit, and the heating unit is controlled to heat and the blowing module is controlled to blow an anti-oxidation mixed gas toward the heating unit to form a plurality of components to be packaged on the metal plate.

[0090] In step S110, wafer cutting can be completed by the wafer cutting equipment in the chip packaging production line. In the step of cutting the wafer, the wafer raw material needs to be ground and thinned as required. After the thinning is completed, a bottom film 971 is usually pasted on one side surface of the wafer. The bottom film 971 can be a blue film, a UV film or other types of protective films. The purpose of this is to protect the other side surface of the wafer (i.e., the side where the circuit pattern is located) from damage during the subsequent cutting process. The bottom film 971 not only provides physical protection, but also helps to more easily separate and collect the die 972 from the wafer after cutting. The cutting process is usually carried out using a precision cutting knife, which cuts along the predetermined cutting lines on the wafer, which define the boundaries of each die 972. Since the wafer is round and the die 972 is usually rectangular, some waste (called "wafer scraps") is generated during the cutting process. After dicing, the wafer is divided into many individual dies 972, which are still attached to the blue film. Next, a series of post-processing steps such as cleaning, inspection and sorting are usually carried out to ensure that the quality and performance of the dies 972 meet the requirements. Finally, the dies 972 will remain attached to the base film 971 until they are transferred to the next production stage.

[0091] In addition, the lead frame 981 on the metal plate 980 can be formed by stamping with a mold to shape the metal plate 980 into a lead frame 981 with a specific shape and size. In addition to stamping, chemical etching is also a method for producing the lead frame 981. It forms a specific pattern and structure on the surface of the metal plate 980 through chemical corrosion, which is not limited in this application. In addition, after the lead frame 981 is formed, it can also be cleaned and surface treated to remove oil, oxides and other impurities on the surface.

[0092] In step S110 to step S170, the wafer cut piece and the metal plate 980 are obtained and placed on the loading station 910 and the die attaching station 920 of the die bonding equipment respectively. Subsequently, the first visual module 930 is controlled to perform image recognition processing on the wafer cut piece on the loading station 910, and a first movement trajectory of the loading station 910 is generated based on the recognition result. Through the image recognition technology, the position of the grain 972 on the wafer cut piece is accurately captured, and accurate guidance is provided for the subsequent movement of the loading station 910. After the suction module 950 takes a grain 972 from the loading position, the loading station 910 can adjust the position of the loading station 910 according to the first movement trajectory, and move the next grain 972 to the loading position, which not only improves the alignment accuracy, but also reduces unnecessary movement distance, thereby improving production efficiency. At the same time, the position of the die attaching station 920 is also adjusted according to the preset second moving trajectory, so that the suction module 950 can place a new die 972 into an empty lead frame 981. During the glue attaching process, while controlling the suction module 950 to move to the loading position, the glue drop module 940 is also controlled to move to the die attaching position. After the suction module 950 sucks a die 972 from the loading position and moves from the loading position to the die attaching position, the glue drop module 940 needs to complete the glue dispensing on the lead frame 981 at the die attaching position during this process, and then controls the glue drop module 940 to move away from the die attaching position, and the suction module 950 places the sucked die 972 on the lead frame 981. After each chip bonding, the loading station 910 will move according to the first moving trajectory, and the chip bonding station 920 will move according to the second trajectory to ensure that the to-be-processed grains 972 and lead frames 981 are located at the corresponding loading positions and chip bonding positions, avoiding problems such as empty bonding or misalignment. Repeat the above chip bonding process. When all the lead frames 981 of the metal plate 980 are affixed with grains 972, the metal plate 980 is transferred to the heating unit, and the heating unit is controlled to heat, and the blowing module is controlled to blow out the anti-oxidation mixed gas. The heating promotes the curing of the glue, so that a stable connection is formed between the grains 972 and the lead frames 981, and the blowing protection effectively prevents the oxidation reaction during the packaging process, protecting the performance and quality of the product. This application optimizes the station movement trajectory by introducing image recognition technology, ensuring that each lead frame 981 can be combined with the grain 972, realizing automated operation, and improving the quality of the product and the accuracy of production.

[0093] Reference Figure 2 It is understandable that step S120 may include but is not limited to the following steps:

[0094] Step S210: Control the first visual module to obtain a target image of the wafer cut piece on the loading station;

[0095] Step S220: performing edge detection and threshold segmentation processing according to the target image to obtain multiple grain positions in the target image;

[0096] Step S230: generating a plurality of initial trajectories according to the positions of the grains and calculating the length of the trajectory corresponding to each initial trajectory; wherein the initial trajectory traverses all the positions of the grains, and the initial trajectory is formed by a plurality of routes in the first direction and the second direction, and the first direction and the second direction are perpendicular to each other;

[0097] Step S240: taking the initial trajectory with the shortest trajectory length as the first moving trajectory of the loading station.

[0098] In step S210 to step S240, first, the first visual module 930 (such as a camera or an image sensor) is controlled to align with the wafer cutting disc on the loading station 910 to capture an image. The captured target image is processed, specifically, the edges of each grain 972 in the wafer cutting disc are identified by edge detection, and different grains 972 are distinguished, and the grains 972 in the image are further separated from the background or other non-grain 972 parts by threshold segmentation processing, so as to ensure the accuracy of subsequent processing and identify all the grain 972 positions in the target image. According to the determined grain 972 position, the system starts to generate multiple possible initial trajectories, which need to traverse all the grain 972 positions to ensure that each grain 972 on the wafer cutting disc can be processed. The initial trajectory is formed by alternating the route of the first direction and the second direction (the two directions are perpendicular to each other), which can reduce the sharp turns of the robot arm or the operating tool during the movement and improve efficiency. Among all the generated initial trajectories, the one with the shortest trajectory length is selected as the final first moving trajectory of the loading station 910. This can minimize the moving distance of the robot arm or the operating tool and improve the processing efficiency.

[0099] If you can refer to Figures 10 to 13 , which is a partial enlarged view of a wafer cut piece. For the convenience of description, only some of the grains 972 are listed in the figure, and the spacing between adjacent grains 972 is equal, and the surface of the grains 972 is square, and some grains 972 are missing on the bottom film 971 in the figure. The figure lists some of the initial trajectories that may be generated by the present application. It can be seen from the figure that Fig.10 The total length of the initial trajectory is 27. Fig.11 The total length of the initial trajectory is 23, Fig.12 The total length of the initial trajectory is more than 32. Fig.13 The total length of the initial trajectory is 21. By comparison, Fig.13 The total length of the corresponding initial trajectory is the smallest, then Fig.13 The initial trajectory is used as the first moving trajectory of the loading station 910.

[0100] Reference Figure 3 It is understandable that step S230 may include but is not limited to the following steps:

[0101] Step S310: generating an initial track according to the position of the grain and calculating the corresponding track length, and taking the track length as the current shortest length;

[0102] Step S320: continuously generating new initial trajectories, and calculating the corresponding trajectory length in real time during the generation of the initial trajectories;

[0103] Step S330: when the length of the new initial trajectory during the generation process is greater than the current shortest length of the first magnification, stop generating the initial trajectory; wherein the first magnification is greater than or equal to 1;

[0104] Step S340: When the new initial trajectory is less than or equal to the current shortest length of the first magnification, the initial trajectory and the corresponding trajectory length are retained and recorded.

[0105] In step S310 to step S340, based on the known position of the grain 972, the system first generates an initial trajectory, which can be any reasonable starting point and path, or the starting point position is fixed but the end point position is not fixed, and calculates the total length of the trajectory, and sets this length as the current shortest length. The system enters a loop and continuously generates new initial trajectories. During the generation process, the system calculates the length of the current trajectory in real time. For each newly generated trajectory segment (before it is fully generated), the system checks whether its generated length exceeds the first multiple of the current shortest length. If the length of the new trajectory during the generation process has exceeded the first multiple of the current shortest length, the system determines that the trajectory is unlikely to become the final shortest trajectory, so it will stop generating the trajectory to save computing resources. If the length of the new trajectory during the generation process is always less than or equal to the first multiple of the current shortest length, the system will continue to generate the trajectory until it is fully generated. At this time, the system will calculate the complete length of the trajectory and compare it with the current shortest length. If the length of the newly generated complete trajectory is less than the current shortest length, the current shortest length is updated to the length of the trajectory, and the trajectory is retained as a new candidate shortest trajectory. If the length of the newly generated trajectory is not less than the current shortest length, but is still within the range of the first magnification, although it will not become the current shortest trajectory, the system will retain the trajectory and its length for possible subsequent comparison or analysis. When all possible initial trajectories are generated, evaluated and selected according to the above rules, the cycle ends. At this point, the current shortest length and its corresponding trajectory owned by the system are the first moving trajectory of the optimal loading station 910 required.

[0106] Continue to refer to Figures 10 to 13, the first magnification is 1.4 in this embodiment, and the first Fig.10 The initial trajectory shown in FIG. 1 has a trajectory length of 27, so the current shortest length is updated to 27. Subsequently, the system generates the second Fig.11 The initial trajectory shown in , the trajectory length of this trajectory is 23, which is less than 27 × 1.4, so the second initial trajectory is used, thereby updating the current shortest length to 23. Then, the system generates a third Fig.12 As shown in the initial trajectory, since 1.4 times the current shortest length is approximately equal to 32, when the trajectory length of the third initial trajectory reaches 32, even if the trajectory does not traverse all the grains 972, the initial trajectory will no longer be generated, and the system will determine that the trajectory is unlikely to become the final shortest trajectory to save computing resources. Then the system generates the fourth Fig.13 The initial trajectory shown in FIG. 1 has a trajectory length of 21. By comparing the first, second, and fourth initial trajectories, the fourth generated initial trajectory is finally used as the first moving trajectory of the optimal loading station 910. Of course, the number of initial trajectories in actual applications is greater, and due to the large number of grains 972, the initial trajectories are also more complex.

[0107] Reference Figure 4 However, it is understood that in step S320, the following steps may be included but not limited to:

[0108] Step S410: Based on the generated initial trajectory, an optimization strategy is generated through a preset heuristic learning model;

[0109] Step S420: continuously generating new initial trajectories according to the optimization strategy, and calculating the corresponding trajectory length in real time during the generation of the initial trajectory.

[0110] In step S410 to step S420, the heuristic learning model is able to handle complex grain 972 distribution and irregular shapes. By continuously learning and adjusting the optimization strategy, it can more efficiently find near-optimal or optimal trajectories compared to traditional exhaustive or random search methods, significantly reducing computing time and resource consumption, thereby generating an initial trajectory with strong adaptability and flexibility.

[0111] In this heuristic learning model, the system can construct heuristic rules based on the extracted feature information. For example, if most of the sections in the reference path move in a straight line or a direction close to a straight line, the system may tend to minimize sharp turns and tortuous paths in the new path. Alternatively, if the reference path adopts a certain traversal strategy (such as first inside and then outside, spiral traversal, etc.) in a specific area (such as a grain 972 dense area), the system may consider that this strategy is effective in this type of area and give priority to it in the generation of new paths. When the next initial path is generated, the system will guide the generation of the path according to the above heuristic rules. Specifically, the system may first select a starting point randomly or according to a certain strategy, and then gradually add path elements, trying to follow the heuristic rules to optimize the path at each step. In this process, the system may continuously evaluate the pros and cons of the current path, such as estimating the total length, evaluating the smoothness of the path, etc., and dynamically adjust the generation strategy according to the evaluation results. If it is found during the generation process that a certain direction or strategy causes a significant decrease in path quality (such as a sharply increased length, frequent sharp turns, etc.), the system may adjust the generation strategy in time to avoid falling into a local optimal solution. The effectiveness of the heuristic learning model depends largely on the accuracy and effectiveness of the heuristic rules extracted from historical data. Therefore, in practical applications, the model needs to be continuously trained and verified to optimize its performance.

[0112] Reference Fig. 9 In the wafer cutting equipment of the present application, a second visual module is also included, and the second visual module is used to collect images of the wafer attachment station. Figure 5 In step S150, the step of controlling the glue dispensing module to dispense glue on the lead frame may include but is not limited to the following steps:

[0113] Step S510: Control the first visual module and the second visual module to perform image recognition on the wafer cutting sheet on the loading station and the metal plate on the wafer attaching station, respectively, to determine the first size information of the grain and the second size information of the lead frame;

[0114] Step S520: determining glue drop parameters of the glue drop module and determining an expected shape image of the glue drop according to the first size information and the second size information;

[0115] Step S530: Control the glue dispensing module to move to the die attaching position, and dispense glue on the lead frame at the die attaching position according to the glue dispensing parameters;

[0116] Step S540: controlling the second visual module to perform image recognition processing on the glue drop on the lead frame to obtain an actual morphological image of the glue drop;

[0117] Step S550: adjusting the glue-dropping parameters of the glue-dropping module according to the expected morphology image and the actual morphology image.

[0118] In step S510 to step S520, the first visual module 930 and the second visual module 960 respectively perform image recognition on the wafer cutting piece and the metal plate 980, so as to accurately obtain the first size information of the grain 972 and the second size information of the lead frame 981. The glue dropping parameters determined based on the first size information and the second size information may include but are not limited to the glue dropping speed, glue amount, glue liquid consistency, etc., which can ensure that each glue dispensing meets the design requirements, thereby improving the accuracy and consistency of the production process.

[0119] In step S530 to step S550, after the glue drop module 940 dispenses glue at the die attach position, the second vision module 960 immediately performs image recognition on the glue drop to obtain its actual shape image. By comparing the expected shape image with the actual shape image, the glue drop parameters can be discovered and adjusted in time to ensure that the shape of the glue drop meets the design requirements, thereby improving the overall quality of the product.

[0120] In step S510 to step S550, this technical feature allows the glue dripping parameters to be dynamically adjusted according to the different size information of the die 972 and the lead frame 981, making the production process more flexible and able to adapt to a variety of different production needs. At the same time, it also reduces the need for manual intervention, shortens the production cycle, and reduces the risk of human error, thereby improving overall production efficiency.

[0121] Reference Figure 6 It is understandable that step S550 may include but is not limited to the following steps:

[0122] Step S610: performing edge analysis on the expected morphology image and the actual morphology image to obtain an expected contour and an actual contour.

[0123] Step S620: performing similarity analysis based on corresponding contour points between the expected contour and the actual contour to obtain contour similarity.

[0124] Step S630: Count the number of pixels of the expected morphological image and the actual morphological image to obtain the expected area and the actual area.

[0125] Step S640: Calculate the area difference according to the expected area and the actual area.

[0126] Step S650: Calculate the center offset according to the center point position of the expected morphological image and the center point position of the actual morphological image.

[0127] Step S660: inputting the contour similarity, area difference and center offset into a preset quality assessment model to obtain a quality assessment value.

[0128] Step S670: adjusting the glue-dropping parameters of the glue-dropping module according to the quality evaluation value.

[0129] In step S610 to step S620, the expected contour and the actual contour are obtained by edge analysis of the expected morphology image and the actual morphology image, and similarity analysis is performed to accurately capture the subtle differences in the shape of the glue droplets and ensure the contour accuracy of the glue dispensing. In step S630 to step S640, the number of pixels of the expected morphology image and the actual morphology image is counted, and the area difference is calculated to further quantify the accuracy of the glue droplet size. In step S650, the difference in the center point position of the expected morphology image and the actual morphology image, that is, the center offset, is calculated so that the system can promptly detect and correct the deviation of the glue dispensing position.

[0130] In step S660 to step S670, the contour similarity, area difference and center offset are input into a preset quality assessment model to obtain a quality assessment value. In the quality assessment model, the contour similarity, area difference and center offset can be respectively provided with a first weight, a second weight and a third weight. The quality assessment value can be the sum of the product of the contour similarity and the first weight, the product of the area difference and the second weight, and the product of the center offset and the third weight. For different chip IC packages, the values ​​of the first weight, the second weight and the third weight can be adaptively adjusted. The glue dispensing parameters are dynamically adjusted according to the quality assessment value to adapt to the diversified production needs, ensuring the stability and consistency of the glue dispensing quality, thereby improving the qualified rate of the product.

[0131] Reference Figure 7 It is understandable that step S170 may include but is not limited to the following steps:

[0132] Step S710: controlling the heating unit to preheat the metal plate at a first temperature within a first time period;

[0133] Step S720: after the preheating stage is completed, controlling the heating unit to heat the metal plate at a second temperature within a second time period; wherein the second temperature is greater than the first temperature;

[0134] Step S730: after the heating stage is completed, controlling the heating unit to cool the metal plate at a third temperature within a third time period; wherein the third temperature is lower than the first temperature;

[0135] Step S740: During the operation of the heating unit, the blowing module is controlled to continuously blow out the anti-oxidation mixed gas to the heating unit at a first flow rate; wherein the anti-oxidation mixed gas is a mixed gas of nitrogen and hydrogen.

[0136] In step S710 to step S730, the temperature change of the heating unit is precisely controlled to realize the processes of preheating, heating, and cooling. Different temperatures and times are set respectively, making the entire process more refined and controllable, which is conducive to a good combination between the chip and the metal plate 980, and reducing problems such as thermal stress or cracks caused by uneven temperature changes, thereby improving the product yield and reliability.

[0137] In step S740, during the heating process, the surface of the metal plate 980 and the crystal grain 972 easily reacts with oxygen in the air in a high temperature environment, resulting in oxidation, which affects the bonding effect. Controlling the blowing module to continuously blow out a mixture of nitrogen and hydrogen can effectively isolate oxygen in the air, reduce the risk of oxidation, and protect the surface quality of the metal plate 980 and the crystal grain 972.

[0138] The above control strategy can be adjusted according to chip IC packages of different materials and sizes, which improves the compatibility and flexibility of the equipment and is conducive to meeting the needs of different customers.

[0139] The chip packaging production line also includes die inspection equipment, which includes positioning fixtures, pusher modules and induction modules. Figure 8 It is understandable that after step S170, the following steps may also be included but not limited to:

[0140] Step S810: placing a metal plate containing a plurality of components to be packaged into a positioning fixture, and determining a plurality of components to be packaged to be inspected on the metal plate;

[0141] Step S820: controlling the pushing module to push the die of the packaged component to be inspected, and using the sensing module to sense the thrust value applied by the pushing module to the die;

[0142] Step S830: when the pushing module pushes the die down, the current thrust value is recorded as the maximum force value;

[0143] Step S840: when the maximum force values ​​corresponding to all the components to be packaged to be inspected are greater than or equal to the preset bearing threshold, it is determined that the die bonding of the components to be packaged on the corresponding metal plate is good;

[0144] Step S850: when the maximum force value corresponding to one of the to-be-packaged parts to be inspected is less than the bearing threshold, a new to-be-packaged part to be inspected is re-determined, and the pushing module and the sensing module are controlled to inspect the new to-be-packaged part to be inspected;

[0145] Step S860: When the corresponding maximum force values ​​of all new components to be inspected to be packaged are greater than or equal to the preset bearing threshold, it is determined that the bonding of the components to be packaged on the corresponding metal plate is good; conversely, when the corresponding maximum force value of one of the new components to be inspected to be packaged is less than the bearing threshold, the quality of the corresponding metal plate is marked as pending.

[0146] In step S810 to step S830, the bonding strength between the crystal grain 972 and the metal plate 980 is directly tested by physical destruction. The physical destruction of the present application is performed by sampling, which can quickly perform quality inspection on key samples in a batch of parts to be packaged, thereby quickly judging the quality status of the entire batch of products, thereby shortening the production cycle and improving production efficiency.

[0147] In step S840 to step S850, which is the preliminary inspection stage, a metal plate 980 containing multiple parts to be packaged is placed in a positioning fixture, and several parts to be packaged to be inspected are selected as initial samples, and the pushing module is controlled to apply thrust to the grains 972 of these initial samples, and the sensing module is used to record the maximum force value when each grain 972 is pushed down, and compare these maximum force values ​​with the preset tolerance threshold. If the maximum force values ​​of all initial samples are greater than or equal to the tolerance threshold, it is directly determined that the parts to be packaged on the metal plate 980 are well bonded and no further inspection is required. If the maximum force value of one or more of the initial samples is less than the tolerance threshold, the re-inspection process is entered.

[0148] In step S860, for the re-inspection stage, new parts to be inspected and packaged are re-determined as re-inspection samples. These samples may not have been inspected before, or may be re-selected based on a certain strategy (such as random selection, specific position selection, etc.). Repeat the operations of the preliminary inspection stage for the re-inspected samples, that is, control the pushing module to apply thrust and record the maximum force value, and compare the maximum force value of these re-inspected samples with the bearing threshold again. If the maximum force values ​​of all re-inspected samples are greater than or equal to the bearing threshold, it is determined that the die bonding of the parts to be packaged on the metal plate 980 is good. If the maximum force value of one or more of the re-inspected samples is still less than the bearing threshold, the quality of the metal plate 980 is marked as pending, and more detailed inspection or processing may be required.

[0149] Through steps S810 to S860, when unqualified samples are found in the preliminary inspection, the problem can be further confirmed through the re-inspection mechanism. The combination of the two stages of preliminary inspection and re-inspection increases the comprehensiveness and accuracy of the inspection, reduces the risk of misjudgment or missed judgment, ensures the quality and reliability of the products leaving the factory, and thus improves customer satisfaction.

[0150] In a second aspect, the present application also provides a chip packaging production line, comprising: at least one memory, at least one processor and at least one program, the program is stored in the memory, and the processor executes one or more programs to implement the above-mentioned chip bonding control method.

[0151] The crystal bonding equipment in this production line obtains the wafer cutting disc and the metal plate, and places them on the loading station and the die attaching station of the crystal bonding equipment respectively. Subsequently, the first visual module is controlled to perform image recognition processing on the wafer cutting disc on the loading station, and the first movement trajectory of the loading station is generated based on the recognition result. Through image recognition technology, the position of the grain on the wafer cutting disc is accurately captured, which provides accurate guidance for the subsequent movement of the loading station. After the suction module takes a grain from the loading position, the loading station can adjust the position of the loading station according to the first movement trajectory and move the next grain to the loading position. This not only improves the alignment accuracy, but also reduces unnecessary movement distance and improves production efficiency. At the same time, the position of the die attaching station is also adjusted according to the pre-set second movement trajectory, so that the suction module can place a new grain into an empty lead frame. During the process of gluing, while controlling the suction module to move to the loading position, the glue dripping module is also controlled to move to the die attaching position. After the suction module absorbs a die from the loading position and moves from the loading position to the die attaching position, the glue dripping module needs to complete the glue dispensing on the lead frame at the die attaching position in this process, and then the glue dripping module is controlled to move away from the die attaching position, and the suction module places the absorbed die on the lead frame. After each die attaching, the loading station will move according to the first moving trajectory, and the die attaching station will move according to the second trajectory to ensure that the die to be processed and the lead frame are located at the corresponding loading position and die attaching position, avoiding problems such as empty attaching or misalignment. Repeat the above die attaching process. When all the lead frames of the metal plate are attached with die, the heating unit is heated, and the blowing module is controlled to blow out the anti-oxidation mixed gas. The heating promotes the curing of the glue, so that a stable connection is formed between the die and the lead frame, and the blowing protection effectively prevents the oxidation reaction during the packaging process, protecting the performance and quality of the product. This application optimizes the workstation movement trajectory by introducing image recognition technology, ensuring that each lead frame can be combined with a die, realizing automated operation, and improving product quality and production accuracy.

[0152] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs, non-transient computer executable programs and signals, such as program instructions / signals corresponding to the processing module in the embodiment of the present application. The processor executes various functional applications and data processing by running the non-transient software programs, instructions and signals stored in the memory, that is, the control method of chip bonding in the above method embodiment is realized.

[0153] The memory may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required by at least one function; the data storage area may store relevant data of the control method of the above-mentioned chip solid crystal, etc. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processing module via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0154] One or more signals are stored in a memory, and when executed by one or more processors, the chip bonding control method in any of the above method embodiments is executed.

[0155] In a third aspect, an embodiment of the present application provides a computer-readable storage medium, which stores a computer program. The computer program is executed by one or more processors, allowing the one or more processors to execute the chip bonding control method in the above method embodiment.

[0156] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, i.e., may be located in one place, or may be distributed over multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0157] Through the description of the above embodiments, it will be appreciated by those skilled in the art that all or some of the steps and systems in the disclosed methods above can be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, and the computer-readable medium can include a computer storage medium (or a non-transitory medium) and a communication medium (or a temporary medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as a computer-readable signal, a data structure, a program module or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassette, magnetic tape, disk storage or other magnetic storage device, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media generally embodies computer readable signals, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0158] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0159] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0160] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0161] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0162] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including multiple instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store programs.

[0163] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present application.

Claims

1. A chip bonding control method, characterized in that: Applied to a chip packaging production line, the chip packaging production line includes a die bonding device and a baking device, the die bonding device includes a loading station, a die attaching station, a first visual module, a glue dripping module and a material suction module, the material suction module can move between a preset loading position and a die attaching position, and the baking device includes a heating unit and a blowing module; The control method comprises: Obtain a wafer cut sheet and a metal plate, and place the wafer cut sheet on the loading station, and place the metal plate on the die attaching station; wherein the wafer cut sheet includes a base film and grains evenly arranged on the base film, and the metal plate is provided with an evenly arranged lead frame; Controlling the first visual module to perform image recognition processing on the wafer cutting piece on the loading station, and generating a first moving trajectory of the loading station; According to the first moving track, adjusting the position of the loading station so that the die to be attached on the bottom film is located at the loading position; Acquire a second movement trajectory of the die attach station, and adjust the position of the die attach station according to the second movement trajectory, so that the lead frame to be attached on the metal plate is located at the die attach position; Control the material suction module to move to the loading position and suck the die at the loading position, and control the glue dispensing module to move to the die attaching position and dispense glue on the lead frame at the die attaching position; Control the glue dripping module to move away from the die attaching position, and control the material suction module to move from the material loading position to the die attaching position, and place the sucked die on the lead frame; After all the lead frames on the metal plate are placed with the grains, the metal plate is transferred to the heating unit, and the heating unit is controlled to heat and the blowing module is controlled to blow an anti-oxidation mixed gas toward the heating unit to form a plurality of parts to be packaged on the metal plate.

2. The chip bonding control method according to claim 1, characterized in that: The controlling the first visual module to perform image recognition processing on the wafer cutting piece on the loading station and generate a first moving trajectory of the loading station includes: Controlling the first visual module to image the target image of the wafer cutting piece on the loading station; Perform edge detection and threshold segmentation processing on the target image to obtain multiple grain positions in the target image; According to the grain position, a plurality of initial trajectories are generated and a trajectory length corresponding to each of the initial trajectories is calculated; wherein the initial trajectory traverses all the grain positions, and the initial trajectory is formed by a plurality of routes in a first direction and a second direction, and the first direction and the second direction are perpendicular to each other; The initial trajectory with the shortest trajectory length is used as the first moving trajectory of the loading station.

3. The chip bonding control method according to claim 2, characterized in that: The step of generating a plurality of initial trajectories according to the grain position and calculating the trajectory length corresponding to each of the initial trajectories comprises: According to the position of the grain, an initial track is generated and the corresponding track length is calculated, and the track length is used as the current shortest length; Continuously generating a new initial trajectory, and calculating the corresponding trajectory length in real time during the generation of the initial trajectory; When the trajectory length of the new initial trajectory during the generation process is greater than the current shortest length of the first magnification, stop generating the initial trajectory; wherein the first magnification is greater than or equal to 1; When the new initial trajectory is less than or equal to the current shortest length of the first magnification, the initial trajectory and the corresponding trajectory length are retained and recorded.

4. The chip bonding control method according to claim 3, characterized in that: The continuously generating the new initial trajectory and calculating the corresponding trajectory length in real time during the generation of the initial trajectory includes: Based on the generated initial trajectory, an optimization strategy is generated through a preset heuristic learning model; According to the optimization strategy, a new initial trajectory is continuously generated, and the corresponding trajectory length is calculated in real time during the generation process of the initial trajectory.

5. The chip bonding control method according to claim 1, characterized in that: The wafer cutting equipment also includes a second vision module; The step of controlling the glue dispensing module to move to a die attaching position and dispensing glue on the lead frame at the die attaching position includes: Controlling the first visual module and the second visual module to perform image recognition on the wafer cutting sheet on the loading station and the metal plate on the wafer attaching station, respectively, to determine the first size information of the grain and the second size information of the lead frame; Determining glue drop parameters of the glue drop module and determining an expected morphological image of the glue drop according to the first size information and the second size information; Controlling the glue-dropping module to move to a die attaching position, and dispensing glue on the lead frame at the die attaching position according to the glue-dropping parameters; Controlling the second visual module to perform image recognition processing on the glue drop on the lead frame to obtain an actual morphological image of the glue drop; According to the expected morphology image and the actual morphology image, glue dropping parameters of the glue dropping module are adjusted.

6. The chip bonding control method according to claim 5, characterized in that: The step of adjusting the glue dropping parameters of the glue dropping module according to the expected morphology image and the actual morphology image includes: Performing edge analysis on the expected morphological image and the actual morphological image to obtain an expected contour and an actual contour; Performing similarity analysis based on corresponding contour points between the expected contour and the actual contour to obtain contour similarity; Counting the number of pixels of the expected morphological image and the actual morphological image to obtain an expected area and an actual area; Calculate the area difference according to the expected area and the actual area; Calculating a center offset according to the center point position of the expected morphological image and the center point position of the actual morphological image; Inputting the contour similarity, the area difference and the center offset into a preset quality assessment model to obtain a quality assessment value; According to the quality evaluation value, the glue dropping parameters of the glue dropping module are adjusted.

7. The chip bonding control method according to claim 1, characterized in that: The controlling the heating unit to heat and controlling the blowing module to blow the anti-oxidation mixed gas toward the heating unit includes: Controlling the heating unit to preheat the metal plate at a first temperature within a first time period; After the preheating stage is completed, controlling the heating unit to heat the metal plate at a second temperature within a second time period; wherein the second temperature is greater than the first temperature; After the heating stage is completed, controlling the heating unit to cool the metal plate at a third temperature within a third time period; wherein the third temperature is lower than the first temperature; During the operation of the heating unit, the blowing module is controlled to continuously blow out the anti-oxidation mixed gas to the heating unit at a first flow rate; wherein the anti-oxidation mixed gas is a mixed gas of nitrogen and hydrogen.

8. The chip bonding control method according to claim 1, characterized in that: The chip packaging production line also includes a grain detection device, which includes a positioning fixture, a pushing module and a sensing module; After the step of forming a plurality of parts to be packaged on the metal plate, the method further includes: Placing the metal plate containing a plurality of parts to be packaged into a positioning fixture, and determining a number of parts to be packaged to be inspected on the metal plate; Controlling the pushing module to push the die of the packaged component to be inspected, and using the sensing module to sense the thrust value applied by the pushing module to the die; When the pushing module pushes the grain down, the current pushing force value is recorded as the maximum force value; When the maximum force values ​​corresponding to all the components to be packaged to be detected are greater than or equal to the preset tolerance threshold, it is determined that the die bonding of the components to be packaged on the corresponding metal plate is good; When the maximum force value corresponding to one of the parts to be packaged to be detected is less than the bearing threshold, a new part to be packaged to be detected is re-determined, and the pushing module and the sensing module are controlled to detect the new part to be packaged to be detected; When the maximum force values ​​corresponding to all new parts to be tested to be packaged are greater than or equal to the preset bearing threshold, it is determined that the corresponding parts to be packaged on the metal plate are well bonded. Conversely, when the maximum force value corresponding to one of the new parts to be tested to be packaged is less than the bearing threshold, the quality of the corresponding metal plate is marked as to be determined.

9. A chip packaging production line, characterized in that: include: at least one memory; at least one processor; at least one program; The programs are stored in the memory, and the processor executes at least one of the programs to implement the chip bonding control method according to any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer-executable signal, and the computer-executable signal is used to execute the chip bonding control method according to any one of claims 1 to 8.

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