Automatic packaging system for single multi-row hybrid power module

Abstract

The invention discloses an automatic packaging system for a single multi-row hybrid power module, and relates to the technical field of power module packaging, the automatic packaging system comprises a feeding area, a module grabbing mechanism, a lead ship conveying mechanism, a preheating table, a press unit, a side face core-pulling mold and a packaging table, and the module grabbing mechanism is arranged on the side of the feeding area. By adopting the high-precision vacuum core-pulling mold, the size precision of the mold block can be ensured, the vacuum core-pulling mold can uniformly apply pressure to the material in the forming process, local deformation of the mold block caused by non-uniform pressure is avoided, when the encapsulating material is formed, the encapsulating material can be uniformly distributed in the mold due to uniform pressure, and the forming quality of the encapsulating material is improved. The shape of the shell of the power module is ensured to be regular, and the shell is perfectly matched with components such as an internal chip and a substrate, so that the packaging quality of the whole power module is improved, various materials can be accurately identified by adopting a visual fool-proof function, and the assembly sequence and position of the materials can be monitored in real time.

Description

Technical Field

[0001] The present invention relates to the technical field of power module packaging, in particular to an automatic packaging system for single-chip multi-row hybrid power modules. Background Art

[0002] With the rapid development of power electronics technology, power modules are increasingly used in various electrical equipment. Single multi-row hybrid power modules can meet the power conversion requirements in different application scenarios due to their unique structure and performance advantages.

[0003] In the prior art, such as the patent application number: CN202410514801.3 "A hybrid double-sided heat dissipation power module package for parallel GaN devices", this packaging structure adopts the method of connecting the PCB and several groups of parallel GaN devices to the bottom MCB respectively, and at the same time connecting the PCB to the gate of the GaN device through the bottom MCB; decoupling the gate layout and the power layout without interfering with each other, reducing the complexity of the gate and power layout of the parallel GaN device, and easily realizing a smaller and consistent circuit layout, ensuring high switching speed and current sharing; connecting the substrate side of the GaN device to the top MCB through the first metal buffer block to realize double-sided heat dissipation of the GaN device, so that the thermal performance of the package is about twice that of the single-sided heat dissipation package; at the same time, placing a second metal buffer block between the top MCB and the bottom MCB, which not only realizes the connection between the top MCB and the bottom MCB but also protects the GaN device; this package can easily expand the number of parallel GaN devices without major adjustments to the power and gate layouts, and can be applied to power modules of various current levels.

[0004] The existing power module packaging modules lack an automatic packaging system for single-cell multi-row hybrid power modules during use, and most of them rely on manual or semi-automatic operation. The operation accuracy is difficult to guarantee, and the production efficiency is low. It is also easy to cause the problem of unstable packaging quality. To address the above problems, an automatic packaging system for single-cell multi-row hybrid power modules is proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a single multi-row hybrid power module automatic packaging system to solve the problem that the existing technology proposed in the above background technology lacks a single multi-row hybrid power module automatic packaging system during operation, and most of them rely on manual operation or semi-automatic operation, the operation accuracy is difficult to guarantee, and the production efficiency is low, and it is also easy to cause the problem of unstable packaging quality.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a single-chip multi-row hybrid power module automatic packaging system, comprising a feeding area, a module grabbing mechanism, a lead boat conveying mechanism, a preheating table, a press unit, a side core pulling mold and a packaging table, wherein the module grabbing mechanism is arranged on the side of the feeding area, the lead boat conveying mechanism is arranged below the module grabbing mechanism, the preheating table is arranged on the side of the module grabbing mechanism, the press unit is arranged on the top of the side core pulling mold, the number of the side core pulling molds is multiple and evenly distributed on the packaging table, the product is conveniently loaded through the feeding area, and then transported to the area of ​​the visual inspection mechanism for inspection through the lead boat conveying mechanism, and after the inspection, the product is grabbed by the module grabbing mechanism and moved to the preheating table The position is heated, and at the same time, the loading robot moves to transport the resin on the resin loading area to load the resin, and grabs the single multi-row product during the movement of the preheating table, and places it inside the side core-pulling mold on the press unit. The single multi-row power module product is plastic-sealed by core pulling and vacuum molding. After the set plastic sealing time, the mold is opened, and the unloading robot grabs the product to the degumming mechanism, takes out the excess material cake, and then grabs it to the inside of the receiving box through the PP gripper to complete the work. The function of automated production is realized through repeated work processing, thereby realizing the automatic packaging of single multi-row hybrid power modules, effectively improving work efficiency, ensuring operation accuracy, and further improving production quality.

[0007] Preferably, a visual inspection mechanism is provided at the bottom of the feeding area. For a single multi-row hybrid power module automatic packaging system, in the chip loading link, the visual inspection mechanism can accurately identify chips of different types and specifications, and can also identify the identification on the chip, such as the chip model, production batch and other information. This information is very important for tracing the source of the chip, ensuring product quality, and troubleshooting when quality problems occur. In the loading process of the substrate and the shell, the visual inspection mechanism can check the number of layers, circuit layout, copper foil thickness and other characteristics of the substrate, as well as the shape, size and material of the shell. Different power modules may require substrates and shells of different specifications. The visual inspection mechanism can prevent the wrong substrate or shell from entering the production line to ensure the smooth progress of the packaging process. The visual inspection mechanism can detect whether there are scratches, cracks, contaminants and other defects on the chip surface. At the same time, when inspecting the substrate, it can find problems such as open circuit, short circuit, copper foil peeling on the substrate. When the chip, substrate or shell is transported to the loading position, the visual inspection mechanism can determine their precise position. If the material deviates during the conveying process, the visual inspection mechanism can measure the deviation and feed the information back to the feeding mechanism, so that the feeding mechanism can adjust the position of the material to ensure that the material enters the next packaging process accurately.

[0008] Preferably, a resin loading area is provided on the side of the preheating table, and the resin loading area is arranged at the top end of the packaging table. In the packaging process of the single multi-row hybrid power module, potting is a crucial link. The resin loading area stores resin materials used for potting, such as epoxy resin, etc. It can continuously and stably provide resin to the potting module to ensure that the potting process is carried out uninterruptedly. In the large-scale production process, a stable resin supply is one of the key factors to ensure production efficiency. Different single multi-row hybrid power modules may have different requirements for the type and performance of the potting resin. The resin loading area can have different characteristics in storage and supply according to the specific product design and production process.

[0009] Preferably, a loading manipulator and a unloading manipulator are respectively provided at the top middle section of the packaging station, and the unloading manipulator is arranged on the side of the loading manipulator. In the single multi-row hybrid power module automatic packaging system, the loading manipulator can accurately grab various materials to be packaged, such as chips, substrates, shells, etc. For materials of different shapes and sizes, the manipulator can perform adaptive grabbing according to a pre-set program, and accurately place the grabbed materials at the designated processing position. The loading manipulator can grab and place materials at a faster speed. Compared with manual loading, the speed of material supply is greatly improved, and long-term work can be carried out without interruption, and there is no fatigue problem in manual operation. In the single multi-row hybrid power module packaging process, the unloading manipulator is responsible for transporting the finished product from the packaging production line to the designated storage area. By accurately classifying and isolating unqualified products, the unloading manipulator can prevent defective products from mixing into qualified products, ensuring the quality of the shipped products. The working status and handling data of the unloading manipulator can be fed back to the control system to help optimize the entire production process.

[0010] Preferably, a degumming mechanism and a PP gripper are provided at the other end of the top of the packaging station, and the PP gripper is provided below the degumming mechanism. In the single multi-row hybrid power module automatic packaging system, some colloids may remain on the substrate during the processing. If these colloids are not removed, the flatness and firmness of the chip mounting will be affected. The degumming mechanism can accurately remove the colloid on the surface of the substrate, so that the chip can be tightly and flatly attached to the substrate. In the subsequent wire bonding process, a clean substrate surface is the basis for ensuring the bonding quality. If there is glue on the surface of the substrate, it will affect the connection strength between the bonding wire and the chip and the substrate. After the degumming mechanism removes the colloid, it can ensure that the bonding wire can form a firm and reliable connection with the chip and the substrate when the bonding head is wire bonding, avoiding quality problems such as the bonding wire falling off. In the packaging process of a single multi-row hybrid power module, there may be excess glue overflowing to the outer surface of the module, affecting the appearance and quality of the product. The degumming mechanism can clean the excess colloid on the surface of the product after packaging, making the product look neat and beautiful. In the single multi-row hybrid power module automatic packaging system, PP material is an important packaging material. The PP gripper can accurately grasp the PP material, regardless of its size and shape, and can accurately select the required PP material from the storage area according to the system's instructions. In a storage environment where multiple specifications of PP materials coexist, the PP gripper can identify and grasp the PP material that meets the requirements of the current packaging process to ensure the correct use of the packaging material. After grasping the PP material, the PP gripper can accurately place it in the specified position. In the production process of multi-layer substrates, PP materials need to be accurately placed between different layers.

[0011] Preferably, a material receiving box is provided at the other end of the packaging station, and the material receiving box is arranged below the PP gripper. In the single multi-row hybrid power module automatic packaging system, the primary function of the material receiving box is to collect the finished products that have been packaged and passed the inspection. After the packaging and inspection processes are completed, the qualified power modules will be transferred to the material receiving box. The material receiving box is usually designed with a certain partition or positioning structure, which enables the power modules to be stored in an orderly manner in the box to avoid damage caused by mutual collision and friction. The material receiving box can accommodate packaged finished products in batches, which is convenient for subsequent centralized processing. During the production process, the material receiving box can be transported uniformly after a certain number of finished products are collected. The material receiving box itself is usually made of clean and pollution-free materials. In the process of collecting finished products, it can prevent external dust, impurities, etc. from causing secondary pollution to the power modules.

[0012] Preferably, a plurality of bottom support frames are provided at the bottom of the packaging platform, and side support rods are fixedly connected to the sides of the bottom support frames. The bottom support frames cooperate with the side support rods to ensure stable support of the entire device and improve the stability in use.

[0013] Preferably, a plurality of shock-absorbing and sound-absorbing bases are distributed at the bottom of the bottom support frame, and the shock-absorbing and sound-absorbing bases are beneficial for providing stable support while reducing vibration generated to the ground, thereby ensuring stability in use.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, the dimensional accuracy of the module can be ensured by adopting a high-precision vacuum core-pulling mold. The vacuum core-pulling mold can evenly apply pressure to the material during the molding process to avoid local deformation of the module due to uneven pressure. When the potting material is molded, the uniform pressure can make the potting material evenly distributed in the mold, ensuring that the shell shape of the power module is regular and perfectly matched with internal chips, substrates and other components, thereby improving the packaging quality of the entire power module.

[0015] 2. In the present invention, through the system control technology of automatic loading and unloading, the materials to be packaged can be continuously and continuously according to the preset program and rhythm, and the material replacement and removal of the finished products can be completed quickly and accurately. Compared with manual operation which may take several minutes, the production cycle of a single power module is greatly shortened.

[0016] 3. In the present invention, the single-piece multi-row resin automatic packaging technology can ensure that the resin is evenly distributed in the module, and the resin can be filled into each tiny space without dead angles, avoiding the problem of unstable electrical performance due to partial non-filling, and can effectively reduce bubbles in the resin.

[0017] 4. In the present invention, by adopting the visual anti-foolproofing function, various materials can be accurately identified, the assembly order and position of the materials can be monitored in real time, and it can be checked whether the chips are placed on the substrate in the correct multi-row arrangement and whether the bonding wires are connected to the correct pin positions, thereby avoiding the production of defective power modules and improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A three-dimensional diagram of the automatic packaging system for a single multi-row hybrid power module of the present invention; Figure 2 For the present invention Figure 1 A is an enlarged structural diagram; Figure 3 For the present invention Figure 1 The enlarged structural diagram at B in FIG. Figure 4 It is a top view structural schematic diagram of a single multi-row hybrid power module automatic packaging system of the present invention; Figure 5 It is a front view structural schematic diagram of a single multi-row hybrid power module automatic packaging system of the present invention.

[0019] In the figure: 1. Feeding area; 2. Visual inspection mechanism; 3. Module grabbing mechanism; 4. Lead boat conveying mechanism; 5. Preheating table; 6. Resin loading area; 8. Loading robot; 9. Unloading robot; 10. Press unit; 11. Side core pulling mold; 12. Glue removal mechanism; 13. PP gripper; 14. Material receiving box; 15. Packaging table. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Example 1: Reference Figure 1-Figure 5 As shown: a single multi-row hybrid power module automatic packaging system, including a feeding area 1, a module grabbing mechanism 3, a lead boat conveying mechanism 4, a preheating table 5, a press unit 10, a side core pulling mold 11 and a packaging table 15, the module grabbing mechanism 3 is arranged on the side of the feeding area 1, the lead boat conveying mechanism 4 is arranged below the module grabbing mechanism 3, the preheating table 5 is arranged on the side of the module grabbing mechanism 3, the press unit 10 is arranged on the top of the side core pulling mold 11, the number of the side core pulling molds 11 is multiple and evenly distributed on the packaging table 15, the product is conveniently loaded through the feeding area 1, and then transported to the area of ​​the visual inspection mechanism 2 for inspection through the lead boat conveying mechanism 4, and after the inspection, the product is grabbed by the module grabbing mechanism 3 and moved to the position of the preheating table 5 for heating Heat treatment, at the same time, the loading robot 8 moves to transport the resin on the resin loading area 6 for resin loading work, and grabs a single multi-row toad piece during the movement of the preheating table 5, and places it inside the side core-pulling mold 11 on the press unit 10, and seals the single multi-row power module product through core pulling and vacuum molding. After the set plastic sealing time, the mold is opened, and the unloading robot 9 grabs the product to the degumming mechanism 12, takes out the excess material cake, and then grabs it to the inside of the receiving box 14 through the PP gripper 13 to complete the work. The function of automated production is realized through repeated work processing, thereby realizing the automatic packaging of single multi-row hybrid power modules, effectively improving work efficiency, ensuring operation accuracy, and further improving production quality.

[0022] like Figure 2As shown, a visual inspection mechanism 2 is provided at the bottom of the feeding area 1. For a single multi-row hybrid power module automatic packaging system, in the chip loading link, the visual inspection mechanism 2 can accurately identify chips of different types and specifications, and can also identify the identification on the chip, such as the chip model, production batch and other information. This information is very important for tracing the source of the chip, ensuring product quality, and troubleshooting when quality problems occur. In the loading process of the substrate and the shell, the visual inspection mechanism 2 can check the number of layers, circuit layout, copper foil thickness and other characteristics of the substrate, as well as the shape, size and material of the shell. Different power modules may require substrates and shells of different specifications. The visual inspection mechanism 2 can prevent the wrong substrate or shell from entering the production line and ensure the smooth progress of the packaging process. The visual inspection mechanism 2 can detect whether there are scratches, cracks, contaminants and other defects on the chip surface. At the same time, when inspecting the substrate, it can find problems such as open circuit, short circuit, and copper foil peeling on the substrate. Mainly when the chip, substrate or shell is transported to the loading position, the visual inspection mechanism 2 can determine their precise position. If the material is offset during the conveying process, the visual inspection mechanism 2 can measure the offset and feed the information back to the feeding mechanism so that the feeding mechanism can adjust the position of the material to ensure that the material accurately enters the next packaging process.

[0023] like Figure 2 As shown, a resin loading area 6 is provided on the side of the preheating table 5, and the resin loading area 6 is arranged at the top end of the packaging table 15. In the packaging process of the single multi-row hybrid power module, potting is a crucial link. The resin loading area 6 stores resin materials used for potting, such as epoxy resin, etc. It can continuously and stably provide resin for the potting module to ensure that the potting process is carried out uninterruptedly. In the large-scale production process, a stable resin supply is one of the key factors to ensure production efficiency. Different single multi-row hybrid power modules may have different requirements on the type and performance of the potting resin. The resin loading area 6 can store and supply different characteristics according to the specific product design and production process.

[0024] like Figure 4As shown, the top middle section of the packaging station 15 is respectively provided with a loading manipulator 8 and a unloading manipulator 9, and the unloading manipulator 9 is arranged on the side of the loading manipulator 8. In the single multi-row hybrid power module automatic packaging system, the loading manipulator 8 can accurately grab various materials to be packaged, such as chips, substrates, shells, etc. For materials of different shapes and sizes, the manipulator can adaptively grab according to the pre-set program, and accurately place the grabbed materials at the designated processing position. The loading manipulator 8 can grab and place materials at a faster speed. Compared with manual loading, the speed of material supply is greatly improved, and long-term work can be carried out without interruption, and there is no fatigue problem in manual operation. In the packaging process of the single multi-row hybrid power module, the unloading manipulator 9 is responsible for transporting the finished product from the packaging production line to the designated storage area. By accurately classifying and isolating unqualified products, the unloading manipulator 9 can prevent defective products from mixing into qualified products, ensuring the quality of the shipped products. The working status and handling data of the unloading manipulator 9 can be fed back to the control system to help optimize the entire production process.

[0025] like Figure 3 and Figure 5 As shown, a degumming mechanism 12 and a PP gripper 13 are provided at the other end of the top of the packaging platform 15, and the PP gripper 13 is provided below the degumming mechanism 12. In the single multi-row hybrid power module automatic packaging system, some colloids may remain on the substrate during the processing. If these colloids are not removed, the flatness and firmness of the chip mounting will be affected. The degumming mechanism 12 can accurately remove the colloid on the surface of the substrate, so that the chip can be tightly and flatly attached to the substrate. In the subsequent wire bonding process, a clean substrate surface is the basis for ensuring the bonding quality. If there is glue on the surface of the substrate, it will affect the connection strength between the bonding wire and the chip and the substrate. After the degumming mechanism 12 removes the colloid, it can ensure that the bonding wire can form a firm and reliable connection with the chip and the substrate when the bonding head is wire bonding, avoiding quality problems such as the bonding wire falling off. In the packaging process of a single multi-row hybrid power module, there may be excess glue overflowing to the outer surface of the module, affecting the appearance and quality of the product. The degumming mechanism 12 can clean the excess colloid on the surface of the product after packaging, making the product look neat and beautiful. In the single-chip multi-row hybrid power module automatic packaging system, PP material is an important packaging material. The PP gripper 13 can accurately grab the PP material, regardless of its size and shape, and can accurately select the required PP material from the storage area according to the system's instructions. In a storage environment where multiple specifications of PP materials coexist, the PP gripper 13 can identify and grab PP materials that meet the requirements of the current packaging process to ensure the correct use of packaging materials. After grabbing the PP material, the PP gripper 13 can accurately place it in the specified position. In the production process of multi-layer substrates, PP materials need to be accurately placed between different layers.

[0026] like Figure 3 and Figure 5 As shown, a material receiving box 14 is provided at the other end of the packaging station 15. The material receiving box 14 is arranged below the PP gripper 13. In the single multi-row hybrid power module automatic packaging system, the primary function of the material receiving box 14 is to collect the finished products that have been packaged and passed the inspection. After the packaging and inspection processes are completed, the qualified power modules will be transferred to the material receiving box 14. The material receiving box 14 is usually designed with a certain partition or positioning structure, which can enable the power modules to be stored in order in the box to avoid damage caused by mutual collision and friction. The material receiving box 14 can accommodate packaged finished products in batches, which is convenient for subsequent centralized processing. During the production process, the material receiving box 14 can transport a certain number of finished products after collecting them. The material receiving box 14 itself is usually made of clean and pollution-free materials. In the process of collecting finished products, it can prevent external dust, impurities, etc. from causing secondary pollution to the power modules.

[0027] like Figure 1 and Figure 5 As shown, a plurality of bottom support frames are arranged at the bottom of the packaging platform 15, and side support rods are fixedly connected to the sides of the bottom support frames. The bottom support frames cooperate with the side support rods to ensure stable support of the entire device and improve the stability in use.

[0028] like Figure 1 and Figure 5 As shown, there are multiple shock-absorbing and sound-absorbing bases distributed at the bottom of the bottom support frame. The shock-absorbing and sound-absorbing bases are beneficial to providing stable support while reducing vibration caused to the ground, thereby ensuring stability in use.

[0029] In the present invention, when the single multi-row hybrid power module automatic packaging system is in use, first the feeding area 1 facilitates the loading of the product, and then the product is transported to the area of ​​the visual inspection mechanism 2 for inspection through the lead boat conveying mechanism 4. After the inspection, the product is grabbed by the module grabbing mechanism 3 and moved to the position of the preheating table 5 for heating treatment. At the same time, the loading robot 8 moves to transport the resin on the resin loading area 6 for resin loading work, and grabs the single multi-row product during the movement of the preheating table 5, and places it inside the side core pulling mold 11 on the press unit 10. The single multi-row power module product is plastic-sealed by core pulling and vacuum molding. After the set plastic sealing time, the mold is opened, and the product is grabbed by the unloading robot 9 to the degumming mechanism 12, and the excess material cake is taken out, and then the PP gripper 13 is grabbed to the inside of the receiving box 14 to complete the work. The function of automated production is realized through repeated work processing, thereby realizing the automatic packaging of single multi-row hybrid power modules, effectively improving the work efficiency, ensuring the accuracy of operation, and further improving the quality of production.

[0030] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A single multi-row hybrid power module automatic packaging system, comprising a feed area (1), a module grabbing mechanism (3), a lead boat conveying mechanism (4), a preheating table (5), a press unit (10), a side core pulling mold (11) and a packaging table (15), characterized in that: The die grabbing mechanism (3) is arranged on the side of the feeding area (1), the lead boat conveying mechanism (4) is arranged below the die grabbing mechanism (3), the preheating table (5) is arranged on the side of the die grabbing mechanism (3), and the press unit (10) is arranged on the top of the side core pulling mold (11). The number of the side core pulling molds (11) is multiple and evenly distributed on the packaging table (15).

2. The single-chip multi-row hybrid power module automatic packaging system according to claim 1, characterized in that: A visual inspection mechanism (2) is provided at the bottom of the feeding area (1).

3. The single-chip multi-row hybrid power module automatic packaging system according to claim 1, characterized in that: A resin loading area (6) is provided on the side of the preheating table (5), and the resin loading area (6) is arranged at one end of the top of the packaging table (15).

4. The single-chip multi-row hybrid power module automatic packaging system according to claim 1, characterized in that: A loading robot (8) and a unloading robot (9) are respectively arranged at the top middle section of the packaging platform (15), and the unloading robot (9) is arranged on the side of the loading robot (8).

5. The single-chip multi-row hybrid power module automatic packaging system according to claim 1, characterized in that: A degumming mechanism (12) and a PP gripper (13) are provided at the other end of the top of the packaging platform (15), and the PP gripper (13) is provided below the degumming mechanism (12).

6. The single-chip multi-row hybrid power module automatic packaging system according to claim 5, characterized in that: A material receiving box (14) is provided at the other end of the packaging platform (15), and the material receiving box (14) is arranged below the PP gripper (13).

7. The single-chip multi-row hybrid power module automatic packaging system according to claim 6, characterized in that: A plurality of bottom support frames are arranged at the bottom of the packaging platform (15), and side support rods are fixedly connected to the sides of the bottom support frames.

8. The single-chip multi-row hybrid power module automatic packaging system according to claim 7, characterized in that: A plurality of shock-absorbing and sound-silent bases are distributed at the bottom of the bottom support frame.

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