Semiconductor component FOUP box with closing function
By designing a FOUP box with locks, transmission mechanism and negative pressure adsorption mechanism, the problem that the existing FOUP box is inconvenient to open and cannot stably maintain the center of gravity of the wafer during long-term use is solved, and fast, stable and safe wafer transmission is achieved and storage.
Patent Information
- Application Number
- CN202411769271.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-02-18
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing FOUP box is inconvenient to open during long-term use, and cannot stably maintain the center of gravity of the wafer, resulting in the wafer moving and damage in the box, and inconvenient operation.
A semiconductor component FOUP box with a closure function is designed, and a lock and a transmission mechanism are used to achieve rapid opening and closing. The built-in negative pressure adsorption mechanism stabilizes the limit wafer, and the inclination angle of the built-in box is adjusted through a telescopic rod to maintain the stable center of gravity.
The FOUP box is quickly and stably opened and closed, and can be used for a long time without affecting the sealing property, ensuring the stable placement and transfer of wafers in the box, reducing the risk of wafer damage.
Smart Images

Figure CN119480728A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor technology, and more particularly to the field of wafer storage technology, and in particular to a semiconductor component FOUP box with a closing function. Background Art
[0002] Front Opening Unified Pod (FOUP) is a container used in semiconductor manufacturing to protect, transport, and store wafers. It can hold wafers and is an important carrier container for the automated transport system in a wafer fab. The current front-opening wafer transfer box, such as the invention with authorization announcement number CN 109969593 B, provides a foup box automatic unlocking device and a foup box. The foup box automatic unlocking device includes at least two groups of foup box automatic unlocking mechanisms, and the foup box automatic unlocking mechanisms are installed on a support plate of the foup box; each group of foup box automatic unlocking mechanisms includes: a cylinder assembly, an unlocking connector, a key mounting seat, a key, a bearing mounting seat, a key support base shaft, and a rotating bearing. The foup box automatic unlocking device provided by the present invention has a reasonable structure, a low unlocking error rate, good reliability, and low cost. The foup box can be automatically unlocked, and the error rate is reduced, the reliability is good, and the silicon wafer transmission efficiency is guaranteed; For another example, the invention with the authorization announcement number CN 109979866 B provides a foup device, including a foup box, which is fixed on a base plate; it also includes: an upper clamping mechanism, which is installed on the base plate where the foup box is located, and the upper clamping mechanism is installed on the upper end of the foup box, and is used to clamp and fix the foup box; a lower fixing mechanism, which is installed on the base plate where the foup box is located, and the lower fixing mechanism is installed on the lower end of the foup box, and is used to fix the foup box, and the lower fixing device and the upper clamping device are relatively arranged so that the foup box cannot move in the up and down directions; an automatic unlocking mechanism, which is used to automatically unlock the foup box. The foup device provided by the present invention can completely fix the foup box, is easy to operate, and can automatically unlock the foup box; However, in combination with current actual use, the existing FOUP boxes still have certain disadvantages. For example: 1. Most common FOUP boxes use a relatively sophisticated lock structure to seal the front door when opening and closing it, which is inconvenient to operate and easy to be damaged, affecting the seal; 2. After the wafers are stored and placed in the current FOUP box, the FOUP box needs to be moved, which makes it easy for the inside to shake, which is not conducive to maintaining a stable center of gravity. It cannot prevent the wafers from moving inside the FOUP box, causing damage, and even causing the FOUP box to topple over. 3. When placing wafers, the general FOUP box usually simply places the wafers, which is not conducive to the stability of the wafer position, cannot be used for stable limiting, and is not conducive to stable transfer; Therefore, we propose a semiconductor component FOUP box with a closing function to solve the above-mentioned problems. Summary of the invention
[0003] The purpose of the present invention is to provide a semiconductor component FOUP box with a closing function to solve the problems raised in the above background technology that the current FOUP box is not convenient to open for long-term use, is not conducive to maintaining the stability of the center of gravity, cannot ensure the stability of the wafer, and is not conducive to stable transfer.
[0004] To achieve the above object, the present invention provides the following technical solution: A semiconductor component FOUP box with a closing function, comprising: an outer shell, a front-opening door connected to the front side of the outer shell for sealing, and an internal box arranged inside the outer shell for placing wafers; Also includes: A lock, wherein the lock is rotatably mounted on the middle side of the front door, and the upper and lower sides of the inner side of the lock are respectively connected with a second slide bar and a fourth slide bar through a transmission mechanism, and the ends of the second slide bar and the fourth slide bar are integrally protruded toward the outer shell and are provided with a first buckle; Wherein, a clamping rod is protruding from the end of the lock, and the lock, the second slide bar and the fourth slide bar are respectively engaged with the first clamping slot and the second clamping slot provided on the front side of the front door through the clamping rod and the first buckle; Shelves, shelves are symmetrically arranged at equal intervals on the inner side of the built-in box, a connector is fixedly connected to the bottom end of the built-in box, a fixing block is fixedly installed on the inner bottom surface of the outer shell, the top of the fixing block is correspondingly rotatably connected to the connector, telescopic rods are installed at the four corners of the bottom of the built-in box, and both ends of the telescopic rods are rotatably connected to the outer shell and the built-in box; A contact plate, wherein the surface of the shelf is symmetrically provided with the contact plate, and the inner side of the contact plate is provided with a negative pressure adsorption mechanism for stabilizing the position of the wafer; Preferably, a clamping head is fixedly installed on the top of the outer shell, and handles are fixedly installed on the left and right sides of the outer shell, an observation window is snap-fitted into the middle of the rear side surface of the outer shell, and a second buckle located on both sides of the observation window is fixed to the rear side of the outer shell, and the observation window is correspondingly snapped into place between a pull plate protruding from the outer side thereof and the second buckle.
[0005] Preferably, the transmission mechanism comprises: A connecting plate, the connecting plate is integrally fixedly connected to the outer side of the middle part of the lock, and the connecting plate is a fan-shaped structure; A first sliding rod, the first sliding rod is connected to the inside of the front door in an up-and-down sliding manner, and the inner side of the bottom end of the first sliding rod is correspondingly meshed and connected with the end of the first sliding rod; A fixing plate, wherein the fixing plate is disposed between the first slide bar and the second slide bar, and the top end of the first slide bar is fixedly connected to the bottom end of the second slide bar through the fixing plate; A connecting gear, the connecting gear is rotatably connected to the inside of the front door, and the bottom outer side of the first slide bar is meshed and connected with the connecting gear; The third slide bar is slidably connected to the inside of the front door, and the top end of the third slide bar is meshedly connected with the connecting gear, and the bottom end of the third slide bar is fixedly connected with the fourth slide bar.
[0006] Preferably, a first contact is fixedly installed on the top end of the first sliding rod, and a third contact located inside the front door is arranged above the first contact; a second contact is fixedly installed on the bottom end of the second sliding rod, and a fourth contact located inside the front door is arranged directly below the second contact.
[0007] Preferably, through holes are symmetrically provided inside the fixing plate, and the fixing plate is slidably connected to the inside of the front door through the through holes.
[0008] Preferably, the negative pressure adsorption mechanism comprises: A fifth sliding rod, the fifth sliding rod is connected to the inside of the shelf in an up-and-down sliding manner, and the top end of the fifth sliding rod is integrally fixedly connected to the contact plate; An elastic pad, which is fixedly mounted on the outer side of the fifth sliding rod, has an elastic structure, and is located between the contact plate and the shelf; A clearance groove is provided on the surface of the shelf, and the bottom of the elastic pad is placed inside the clearance groove; A blind groove is provided at the top end of the fifth sliding rod, and a first connecting pipe is provided outside the bottom end of the blind groove.
[0009] Preferably, a protrusion is fixed to the inner bottom of the shelf, the protrusion is located on the outer side of the fifth sliding rod, and the bottom of the fifth sliding rod is provided with a groove which is engaged and slidably engaged with the protrusion.
[0010] Preferably, the top surface of the contact plate is concave downward, and the concave top surface of the contact plate is communicated with the blind groove, and the contact plate forms an elastic lifting structure on the surface of the shelf through the fifth sliding rod and the elastic pad.
[0011] Preferably, a through hole is provided at the bottom of the blind groove, and the through hole corresponds to the end of the first connecting tube in upper and lower directions. The end of the first connecting tube is connected to the second connecting tube, and the bottom end of the second connecting tube is connected to a negative pressure pump, and the negative pressure pump is installed at the bottom of the built-in box.
[0012] Compared with the prior art, the present invention has at least the following beneficial effects: the semiconductor component FOUP box with a closing function is convenient for rapid opening and closing, can be stably used for a long time, is convenient for stable placement of wafers, is conducive to dynamically maintaining a stable center of gravity, and is convenient for rapid transfer and use; 1. In this solution, a connecting plate, a first sliding rod and a second sliding rod are provided. By rotating the lock, the first sliding rod can be slid up and down by the engagement between the connecting plate and the first sliding rod, so that the second sliding rod can slide up and down, so that the second sliding rod can be stably connected between the first buckle and the second slot on the surface of the outer shell; Furthermore, a connecting gear, a third slide bar and a fourth slide bar are provided. The first slide bar is meshed with the third slide bar through the connecting gear. When the first slide bar moves, the third slide bar is driven to move, so that the fourth slide bar at the bottom is stably connected to the second card slot. At the same time, a card bar is provided on the top of the lock to connect with the first card slot, and the top of the lock is directly locked with the front door by its own lock tongue to ensure a stable connection. 2. In this solution, a first contact, a second contact, a third contact and a fourth contact are provided. The first contact is connected to the third contact for convenient electrical connection and indication of the opening of the front door. The second contact is connected to the fourth contact for convenient electrical connection and indication of the closing of the front door, so as to facilitate quick response and nitrogen filling and other operations, and at the same time prompt whether the opening and closing of the front door is completed; 3. This solution is provided with a built-in box, a fixed block, a connecting head and a telescopic rod. The bottom of the built-in box forms a rotating structure through the connecting head and the fixed block, and the telescopic rod is set at the four corners. The inclination angle of the built-in box can be adjusted by extending and retracting the telescopic rod, and then the center of the whole can be adjusted to ensure the stability of the wafer; 4. In this scheme, a shelf, a contact plate, a fifth slide bar and a first connecting tube are provided. The wafer is placed through the contact plate. Under the gravity of the wafer, the contact plate slides down on the surface of the shelf through the fifth slide bar, so that the side through hole of the blind groove is connected with the first connecting tube. The second connecting tube and the first connecting tube are connected by a negative pressure pump, and the contact plate is used for negative pressure adsorption to keep the wafer stably placed; 5. In this solution, an observation window, a pull plate and a second clip are provided. The observation window is snap-fitted and installed on the back of the outer shell. The snap-fit connection between the pull plate and the second clip can ensure a stable connection between the observation window and the outer shell, making it easy to fix and observe the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 It is a schematic diagram of the overall front structure of the present invention; Figure 2 It is a schematic diagram of the overall back structure of the present invention; Figure 3 It is a schematic diagram of the front structure of the outer shell of the present invention; Figure 4 It is a schematic diagram of the internal cutaway structure of the front-opening door of the present invention; Figure 5 It is a schematic diagram of the overall front structure of the transmission mechanism of the present invention; Figure 6 It is a schematic diagram of the overall back structure of the transmission mechanism of the present invention; Figure 7 For the present invention Figure 4 A schematic diagram of the enlarged structure of the middle part A; Figure 8 It is a schematic diagram of the middle section structure of the built-in box of the present invention; Fig. 9 It is a schematic diagram of the front cross-section structure of the contact plate of the present invention; Fig.10 For the present invention Fig. 9 The enlarged structural diagram of the middle B part; Fig.11 It is a schematic diagram of the side cross-section structure of the contact plate of the present invention.
[0014] In the figure: 1, outer shell; 2, clamping head; 3, handle; 4, front door; 5, lock; 6, connecting plate; 7, first slide bar; 8, second slide bar; 9, fixed plate; 10, connecting gear; 11, third slide bar; 12, fourth slide bar; 13, clamping rod; 14, first buckle; 15, first slot; 16, second slot; 17, first contact; 18, second contact; 19, third contact; 20, fourth contact; 21, built-in box; 22, shelf; 23, fixed block; 24, connector; 25, telescopic rod; 26, contact plate; 27, fifth slide bar; 28, elastic pad; 29, make way groove; 30, bump; 31, blind groove; 32, first connecting pipe; 33, second connecting pipe; 34, negative pressure pump; 35, observation window; 36, pull plate; 37, second buckle. DETAILED DESCRIPTION
[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention, so that the implementation process of how the present application applies technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them.
[0016] See also Figure 1-11 , the present invention provides the following technical solutions: Embodiment 1: To solve A semiconductor component FOUP box with a closing function, comprising: an outer shell 1, a clamping head 2, a handle 3, a front door 4, a lock 5, a connecting plate 6, a first slide bar 7, a second slide bar 8, a fixing plate 9, a connecting gear 10, a third slide bar 11, a fourth slide bar 12, a clamping rod 13, a first buckle 14, a first slot 15, a second slot 16, a first contact 17, a second contact 18, a third contact 19, a fourth contact 20, a built-in box 21, a shelf 22, a fixing block 23, a connecting head 24, a telescopic rod 25, a contact plate 26, a fifth slide bar 27, an elastic pad 28, a clearance groove 29, a protrusion 30, a blind groove 31, a first connecting pipe 32, a second connecting pipe 33, a negative pressure pump 34, an observation window 35, a pull plate 36 and a second buckle 37; Among them, Figure 1-Figure 7 The middle lock 5 is rotatably mounted on the middle side of the front door 4, and the second slide bar 8 and the fourth slide bar 12 are respectively connected to the inner upper and lower sides of the lock 5 through a transmission mechanism, and the ends of the second slide bar 8 and the fourth slide bar 12 are both integrally protruded toward the outer shell 1 and provided with a first buckle 14, and the end of the lock 5 is protruded with a clamping rod 13, and the lock 5, the second slide bar 8 and the fourth slide bar 12 are respectively engaged with the first clamping groove 15 and the second clamping groove 16 opened on the front side of the front door 4 through the clamping rod 13 and the first clamping buckle 14; The transmission mechanism includes: a connecting plate 6, a first slide bar 7, a second slide bar 8, a fixing plate 9, a connecting gear 10 and a third slide bar 11. The connecting plate 6 is integrally fixedly connected to the outer middle part of the lock 5. The connecting plate 6 is a fan-shaped structure. The first slide bar 7 is slidably connected to the inside of the front door 4. The inner side of the bottom end of the first slide bar 7 is correspondingly meshed with the end of the first slide bar 7. The fixing plate 9 is arranged between the first slide bar 7 and the second slide bar 8. The top of the first slide bar 7 is fixedly connected to the bottom end of the second slide bar 8 through the fixing plate 9. The connecting gear 10 is rotatably connected to the inside of the front door 4. The bottom outer side of the first slide bar 7 is meshed with the connecting gear 10. The third slide bar 11 is slidably connected to the inside of the front door 4, and the top of the third slide bar 11 is meshed with the connecting gear 10. The bottom end of the third slide bar 11 is fixedly connected with a fourth slide bar 12. Through holes are symmetrically provided inside the fixing plate 9, and the fixing plate 9 is limited and slidably connected to the inside of the front door 4 through the through holes. In a specific application scenario, when locking, the front door 4 is fitted with the outer shell 1, so that the end of the lock 5 is inserted into the second card slot 16, and the card rod 13 and the first card buckle 14 are respectively plugged into the first card slot 15 and the second card slot 16, and the key is inserted into the lock 5 to make the lock 5 rotate inward. Through the rotation of the lock 5, the first slide bar 7 can be slid downward by the engagement between the connecting plate 6 and the first slide bar 7, and the second slide bar 8 is connected to the first slide bar 7 through the fixing plate 9, so that the second slide bar 8 Slide downward so that the second slide bar 8 is stably connected to the second slot 16 on the surface of the outer shell 1 through the first buckle 14, and the first slide bar 7 is meshed with the third slide bar 11 through the connecting gear 10. When the first slide bar 7 moves, the third slide bar 11 is also driven to move, so that the fourth slide bar 12 at the bottom is stably connected to the second slot 16. At the same time, a card rod 13 is provided on the top of the lock 5 to connect with the first slot 15, and the top of the lock 5 is directly locked with the front door 4 by its own lock tongue to ensure a stable connection.
[0017] Among them, Figure 4-Figure 6 A first contact 17 is fixedly installed on the top end of the first sliding rod 7, and a third contact 19 located inside the front door 4 is arranged above the first contact 17. A second contact 18 is fixedly installed on the bottom end of the second sliding rod 8, and a fourth contact 20 located inside the front door 4 is arranged directly below the second contact 18.
[0018] In a specific application scenario, the first sliding bar 7 is raised to connect the first contact 17 and the third contact 19, which is convenient for electrical connection and indication of the opening of the front door 4. The first sliding bar 7 is lowered to connect the second contact 18 and the fourth contact 20, which is convenient for electrical connection and indication of the closing of the front door 4, so as to facilitate quick response and nitrogen filling and other operations, and at the same time prompt whether the opening and closing of the front door 4 is completed.
[0019] Among them, Figure 3 , Figure 8 The inner side of the built-in box 21 is symmetrically and evenly spaced with shelves 22, the bottom end of the built-in box 21 is fixedly connected with a connector 24, the inner bottom surface of the outer shell 1 is fixedly installed with a fixing block 23, the top of the fixing block 23 is correspondingly rotatably connected with the connector 24, and telescopic rods 25 are installed at the four corners of the bottom of the built-in box 21, and both ends of the telescopic rod 25 are rotatably connected with the outer shell 1 and the built-in box 21; In a specific application scenario, the bottom of the built-in box 21 forms a rotating structure through the connecting head 24 and the fixed block 23, and the telescopic rod 25 is set at the four corners. The inclination angle of the built-in box 21 can be adjusted by extending and retracting the telescopic rod 25, and then the center of the whole can be adjusted to ensure the stability of the wafer.
[0020] Among them, Figure 3 , Figure 8-Figure 11 The surface of the middle shelf 22 is symmetrically provided with a contact plate 26, and the inner side of the contact plate 26 is provided with a negative pressure adsorption mechanism for stabilizing the position of the wafer; The negative pressure adsorption mechanism includes: a fifth slide bar 27, an elastic pad 28, a clearance groove 29, a protrusion 30, a blind groove 31, a first connecting pipe 32, a second connecting pipe 33 and a negative pressure pump 34. The fifth slide bar 27 is connected to the inside of the shelf 22 in an up-and-down sliding manner. The top of the fifth slide bar 27 is integrally fixedly connected to the contact plate 26. The elastic pad 28 is fixedly installed on the outside of the fifth slide bar 27. The elastic pad 28 has an elastic structure and is located between the contact plate 26 and the shelf 22. The clearance groove 29 is provided on the surface of the shelf 22, and the bottom of the elastic pad 28 is placed on the inner side of the clearance groove 29. The blind groove 31 is provided on the top of the fifth slide bar 27, and the first connecting pipe 32 is provided on the outside of the bottom end of the blind groove 31. A protrusion 30 is fixed to the inner bottom of the shelf 22, and the protrusion 30 is located on the outer side of the fifth sliding rod 27, and the bottom of the fifth sliding rod 27 is provided with a groove that engages and slides with the protrusion 30. The top surface of the contact plate 26 is recessed downward, and the recessed top surface of the contact plate 26 is connected to the blind groove 31. The contact plate 26 forms an elastic lifting structure on the surface of the shelf 22 through the fifth sliding rod 27 and the elastic pad 28. A through hole is provided at the bottom of the blind groove 31, and the through hole corresponds to the end of the first connecting tube 32 up and down. The end of the first connecting tube 32 is connected to the second connecting tube 33, and the bottom end of the second connecting tube 33 is connected to a negative pressure pump 34, and the negative pressure pump 34 is installed at the bottom of the built-in box 21 In a specific application scenario, the wafer is placed through the contact plate 26, and under the action of the gravity of the wafer, the contact plate 26 slides down the surface of the shelf 22 through the fifth slide bar 27. A blind groove 31 is provided on the top of the fifth slide bar 27, which is connected to the groove on the top of the contact plate 26. After the fifth slide bar 27 descends, the side through hole of the blind groove 31 is connected to the first connecting tube 32, and the second connecting tube 33 and the first connecting tube 32 are connected by a negative pressure pump 34, and the contact plate 26 is used to perform negative pressure adsorption on the wafer to keep the wafer stably placed.
[0021] Among them, Figure 1 , Figure 2 A clamping head 2 is fixedly installed on the top of the middle outer shell 1, and handles 3 are fixedly installed on the left and right sides of the outer shell 1. An observation window 35 is snap-fitted and installed in the middle of the rear side surface of the outer shell 1. Second buckles 37 located on both sides of the observation window 35 are fixed to the rear side of the outer shell 1, and the observation window 35 is correspondingly snapped with a pull plate 36 protruding from the outer side thereof and the second buckle 37.
[0022] In a specific application scenario, it is convenient to lift through the clamping head 2 and to carry through the handle 3. The observation window 35 is arranged on the back of the outer shell 1 for easy observation. The observation window 35 is snap-fitted and installed on the back of the outer shell 1. The snap-fit connection between the pull plate 36 and the second buckle 37 can ensure a stable connection between the observation window 35 and the outer shell 1, which is convenient for fixation.
[0023] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present invention; the contents not described in detail in this specification belong to the existing technology known to professional and technical personnel in the field. In addition, the directional nouns such as up, down, left, right, front and back in the text only represent their relative positions rather than absolute positions.
[0024] The standard parts used in the present invention can all be purchased from the market, and special-shaped parts can be customized according to the instructions and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. Machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.
[0025] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A semiconductor component FOUP box with a closing function, comprising: An outer shell (1), a front-opening door (4) connected to the front side of the outer shell (1) for sealing, and a built-in box (21) arranged inside the outer shell (1) for placing wafers; It is characterized by further comprising: A lock (5), the lock (5) being rotatably mounted on the middle side of the front door (4), and the upper and lower sides of the inner side of the lock (5) are respectively connected to a second slide bar (8) and a fourth slide bar (12) through a transmission mechanism, and the ends of the second slide bar (8) and the fourth slide bar (12) are both integrally protruding toward the outer shell (1) and provided with a first buckle (14); The end of the lock (5) is provided with a locking rod (13) protruding therefrom, and the lock (5), the second slide bar (8) and the fourth slide bar (12) are respectively engaged with a first locking groove (15) and a second locking groove (16) provided on the front side of the front door (4) via the locking rod (13) and the first buckle (14); Shelves (22), shelves (22) are symmetrically arranged at equal intervals on the inner side of the built-in box (21), a connector (24) is fixedly connected to the bottom end of the built-in box (21), a fixing block (23) is fixedly installed on the inner bottom surface of the outer shell (1), the top of the fixing block (23) is correspondingly rotatably connected to the connector (24), telescopic rods (25) are installed at the four corners of the bottom of the built-in box (21), and both ends of the telescopic rod (25) are rotatably connected to the outer shell (1) and the built-in box (21); A contact plate (26), wherein the surface of the shelf (22) is provided with the contact plate (26) in a front-to-back symmetrical manner, and a negative pressure adsorption mechanism for stably limiting the position of the wafer is provided on the inner side of the contact plate (26).
2. A semiconductor component FOUP box with a closing function according to claim 1, characterized in that: A clamping head (2) is fixedly mounted on the top of the outer shell (1), and handles (3) are fixedly mounted on the left and right sides of the outer shell (1). An observation window (35) is snap-fitted and mounted in the middle of the rear side surface of the outer shell (1). Second snaps (37) located on both sides of the observation window (35) are fixedly mounted on the rear side of the outer shell (1), and the observation window (35) is snap-fitted with a pull plate (36) protruding from the outer side thereof and correspondingly snapped with the second snaps (37).
3. The semiconductor component FOUP box with a closing function according to claim 1, characterized in that: The transmission mechanism comprises: A connecting plate (6), the connecting plate (6) being integrally fixedly connected to the outer side of the middle portion of the lock (5), the connecting plate (6) being in a fan-shaped structure; A first sliding rod (7), the first sliding rod (7) being connected to the inside of the front door (4) in an up-and-down sliding manner, the inner side of the bottom end of the first sliding rod (7) being correspondingly meshed with the end of the first sliding rod (7); A fixing plate (9), the fixing plate (9) being arranged between the first sliding rod (7) and the second sliding rod (8), the top end of the first sliding rod (7) being fixedly connected to the bottom end of the second sliding rod (8) via the fixing plate (9); A connecting gear (10), the connecting gear (10) being rotatably connected to the inside of the front door (4), and the bottom outer side of the first sliding rod (7) being meshingly connected to the connecting gear (10); A third sliding rod (11), the third sliding rod (11) is slidably connected to the inside of the front door (4), and the top end of the third sliding rod (11) is meshingly connected to the connecting gear (10), and the bottom end of the third sliding rod (11) is fixedly connected to a fourth sliding rod (12).
4. A semiconductor component FOUP box with a closing function according to claim 3, characterized in that: A first contact (17) is fixedly mounted on the top end of the first sliding rod (7), and a third contact (19) located inside the front door (4) is arranged above the first contact (17); a second contact (18) is fixedly mounted on the bottom end of the second sliding rod (8), and a fourth contact (20) located inside the front door (4) is arranged directly below the second contact (18).
5. The semiconductor component FOUP box with a closing function according to claim 3, characterized in that: The fixing plate (9) is symmetrically provided with through holes inside, and the fixing plate (9) is limitedly slidably connected to the inside of the front door (4) through the through holes.
6. The semiconductor component FOUP box with a closing function according to claim 1, characterized in that: The negative pressure adsorption mechanism comprises: a fifth sliding rod (27), the fifth sliding rod (27) being connected to the interior of the shelf (22) in an up-and-down sliding manner, the top end of the fifth sliding rod (27) being integrally fixedly connected to the contact plate (26); an elastic pad (28), the elastic pad (28) being fixedly mounted on the outside of the fifth sliding rod (27), the elastic pad (28) being an elastic structure, and the elastic pad (28) being located between the contact plate (26) and the shelf (22); A clearance groove (29), wherein the clearance groove (29) is formed on the surface of the shelf (22), and the bottom of the elastic pad (28) is placed inside the clearance groove (29); A blind groove (31), wherein the blind groove (31) is formed at the top end of the fifth sliding rod (27), and a first connecting pipe (32) is disposed outside the bottom end of the blind groove (31).
7. The semiconductor component FOUP box with a closing function according to claim 6, characterized in that: A protrusion (30) is fixed to the inner bottom of the shelf (22), the protrusion (30) is located outside the fifth sliding rod (27), and the bottom of the fifth sliding rod (27) is provided with a groove that is mutually engaged and slidable with the protrusion (30).
8. The semiconductor component FOUP box with a closing function according to claim 6, characterized in that: The top surface of the contact plate (26) is concave downwards, and the concave top surface of the contact plate (26) is connected to the blind groove (31). The contact plate (26) forms an elastic lifting structure on the surface of the shelf (22) via a fifth sliding rod (27) and an elastic pad (28).
9. The semiconductor component FOUP box with a closing function according to claim 6, characterized in that: A through hole is provided at the bottom of the blind groove (31), and the through hole corresponds vertically to the end of the first connecting tube (32); the end of the first connecting tube (32) is connected to the second connecting tube (33); the bottom end of the second connecting tube (33) is connected to a negative pressure pump (34); and the negative pressure pump (34) is installed at the bottom of the built-in box (21).
Citation Information
Patent Citations
An automatic unlocking device for a foup box and a foup box.
CN109969593B
A foup device
CN109979866B