Wafer conversion device for semiconductor processing

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and discloses a wafer conversion device for semiconductor processing, which comprises a mounting seat, the middle part of the mounting seat is fixedly sleeved with a connecting sleeve, the circumference of the bottom surface of the mounting seat is equidistantly provided with a plurality of guide grooves, the middle parts of the plurality of guide grooves are slidably sleeved with a clamping mechanism, and the clamping mechanism comprises a sliding seat. A middle block is fixedly mounted on the side, away from the mounting base, of the bottom face of the sliding base. Nitrogen with required temperature and humidity is sprayed to the bottom surface of a wafer through a guide pipe and an air injection block, and is sprayed to the upper surface of the wafer through a through groove and a fixing plug, so that nitrogen protection layers with required temperature and humidity are formed on the upper surface and the lower surface of the wafer, and adverse effects of external changing air, humidity and temperature on the wafer are isolated; the problem that in the wafer conversion process, a clamping device is additionally arranged, dust in the environment and changing temperature and humidity cause wafer deformation and damage is solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and in particular relates to a wafer conversion device for semiconductor processing. Background Art

[0002] A wafer conversion device for semiconductor processing is a device specially designed to safely and efficiently transfer wafers between different processing platforms during the semiconductor manufacturing process. This device is very important to ensure the integrity and non-damage of the wafers throughout the entire manufacturing process, especially when different process steps need to be switched frequently.

[0003] When clamping and operating wafers, existing clamping devices usually fix the wafers by clamping the edges of the wafers. Due to the uneven distribution of the clamping force and the force applied to the edges of the wafers, the edges of the wafers will be subjected to the clamping force, causing the wafers to bend and deform, thereby reducing the flatness of the wafer surface, causing the chip defect rate after the wafer is produced to increase. In addition, during the transfer of the wafers, dust, temperature fluctuations and humidity changes in the environment will cause internal stress in the wafers, causing internal deformation and surface damage of the wafers, which will not only reduce the manufacturing accuracy of the wafers, but also significantly increase production costs. Therefore, it is necessary to ensure dustproof, constant temperature and humidity conditions during the wafer conversion process. Summary of the invention

[0004] The object of the present invention is to provide a wafer conversion device for semiconductor processing to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer conversion device for semiconductor processing, comprising a mounting seat, a connecting sleeve is fixedly sleeved in the middle of the mounting seat, a plurality of guide grooves are equidistantly provided on the circumference of the bottom surface of the mounting seat, a holding mechanism is slidably sleeved in the middle of the plurality of guide grooves, the holding mechanism comprises a sliding seat, the sliding seat is slidably sleeved in the guide groove, a middle block is fixedly mounted on a side of the bottom surface of the sliding seat away from the mounting seat, a side block is fixedly mounted on the upper part of the middle block away from the mounting seat, an injection block is movably sleeved on the bottom end of the middle block, a conduit is fixedly sleeved on one side of the injection block, the conduit is fixedly sleeved on the mounting seat, a pull belt is fixedly mounted on one end of the injection block away from the mounting seat, the top end of the pull belt passes through the inner cavity of the sliding seat and is fixedly connected to the connecting sleeve, the injection The cam is secured on a side of the upper surface of the block away from the mounting seat, a sleeve is secured on the bottom surface of the side block, an elastic member is secured on the top surface of the sleeve inner cavity, a sleeve rod is fixedly mounted on the bottom end of the elastic member, the sleeve rod is slidably sleeved with the sleeve, and the bottom end of the sleeve rod is movably sleeved with the first movable seat, a mounting shell is fixedly mounted on the upper surface of the mounting seat, a plurality of side grooves are equidistantly provided on the circumference of the outer curved surface of the mounting shell, a pushing mechanism is provided between the plurality of side grooves and the supporting mechanism, a top plate is fixedly mounted on the top of the mounting shell, a plurality of input pipes are fixedly sleeved on the middle circumference of the top plate at equal intervals, a main shaft is movably sleeved in the middle of the mounting seat, a temperature and humidity mechanism is provided on the upper part of the inner cavity of the mounting shell, a storage mechanism is provided in the middle of the inner cavity of the mounting shell, and an auxiliary drive mechanism is provided at the bottom of the inner cavity of the mounting shell.

[0006] Preferably, the pushing mechanism includes a plurality of second movable seats, which are respectively fixedly mounted on a side of the upper surface of the plurality of sliding seats away from the mounting seat, a plurality of second movable seats are movably sleeved with a bent rod in the middle part, a plurality of bent rods are movably sleeved with a third movable seat on the top, a plurality of third movable seats are fixedly mounted with sliders on a side close to the mounting shell, a plurality of sliders are respectively slidably sleeved with adjacent side grooves, the contact surfaces between the sliders and the side grooves are smooth, and the contact surfaces between the sliders and the side grooves are provided with a wear-resistant coating, a connecting ring is fixedly mounted from the top of the plurality of sliders, telescopic rods are equidistantly fixedly mounted on the outer curved surface circumference of the mounting shell, and the telescopic ends of the telescopic rods are fixedly connected to the connecting rings.

[0007] Preferably, a plurality of through grooves are equidistantly provided on the bottom circumference of the spindle curved surface, the through grooves are located above the mounting seat, a fixing plug is fixedly sleeved on the bottom of the spindle inner curved surface, the fixing plug is located above the through grooves, a nozzle is fixedly sleeved on the bottom of the spindle inner curved surface, the nozzle is located below the through grooves, a driving member is provided in the middle of the top plate, the spindle is fixedly sleeved in the middle of the driving sleeve of the driving member, and the top end of the spindle is connected to an external power device that drives a moving device of a wafer conversion device.

[0008] Preferably, the temperature and humidity mechanism includes a solution shell, which is fixedly sleeved on the upper part of the inner curved surface of the mounting shell, and a plurality of electric water plates are fixedly sleeved at equal intervals in the middle part of the solution shell, and the middle part of the electric water plates is made of hard metal material, and a plurality of partition plates are fixedly sleeved at equal intervals on the upper part of the outer curved surface of the temperature and humidity mechanism, and the plurality of partition plates are respectively located in the middle position of two connected partition plates, and a plurality of centrifugal blades are fixedly installed at equal intervals on the upper surface of the partition plate.

[0009] Preferably, the storage mechanism includes two separation plates, which are respectively fixedly sleeved on the upper and lower parts of the inner curved surface of the mounting shell; a one-way valve is provided between the upper separation plate and the main shaft; the one-way valve is fixedly connected to the upper separation plate; the one-way valve is movably sleeved on the main shaft; the gas flow direction of the one-way valve is from top to bottom; a pressure valve is provided between the bottom separation plate and the main shaft; the pressure valve is fixedly sleeved on the bottom separation plate; and the pressure valve is movably sleeved on the main shaft.

[0010] Preferably, the auxiliary drive mechanism includes a guide plate, which is fixedly sleeved on the bottom of the outer curved surface of the main shaft, and a scroll is fixedly sleeved on the bottom of the outer curved surface of the main shaft. The scroll is located at the bottom of the guide plate, and a plurality of vortex blades are fixedly installed at equal intervals on the circumference of the outer curved surface of the guide plate, and there is a gap between the guide plate, the scroll and the lower separation plate.

[0011] Preferably, the air outlet of the jet block close to the mounting seat is deflected counterclockwise, the conduit is made of rubber material, the drawstring is woven from high-strength material, and the mounting shell is made of heat-insulating material.

[0012] The beneficial effects of the present invention are as follows:

[0013] 1. The present invention first starts the temperature and humidity mechanism, which heats, humidifies and pressurizes the nitrogen flowing through the gap between the electric water plate and the partition plate, so that the nitrogen flowing through the temperature and humidity mechanism reaches the required temperature, humidity and pressure, and then the nitrogen flows into the sealed space formed between the upper and lower separation plates in the inner cavity of the installation shell through the one-way valve, so that the space formed between the upper and lower separation plates in the inner cavity of the installation shell is filled with nitrogen high-pressure gas with the required temperature and humidity. When the gas pressure reaches the setting requirement of the pressure valve, the pressure valve is pushed to open, and the gas flows to the bottom of the pressure valve through the pressure valve. At this time, due to the increase in the space at the bottom of the pressure valve, the high-pressure gas begins to automatically reduce the pressure to a suitable pressure range. Finally, the nitrogen with the required temperature and humidity is sprayed onto the bottom surface of the wafer through the conduit and the jet block, and the nitrogen with the required temperature and humidity is sprayed onto the upper surface of the wafer through the through groove and the fixed plug, thereby forming a nitrogen protective layer with the required temperature and humidity on the upper and lower surfaces of the wafer, isolating the changes in external air, humidity and temperature, and causing adverse effects on wafer deformation.

[0014] 2. In addition, when the equipment suddenly loses power during the conversion process, the nitrogen supply and the external nitrogen output device replace the nitrogen bottle, the one-way valve is closed, and the high-pressure nitrogen with the required temperature and humidity between the two separation plates in the inner cavity of the installation shell continues to push the pressure valve to open, and when it passes through the vortex blades, the vortex disk is driven to rotate through the vortex blades, and the vortex disk drives the main shaft fixedly connected to it to rotate, and the main shaft continues to drive the external mobile device connected to it to continue to drive the wafers protected by the nitrogen with the required temperature and humidity to be transferred to the storage area.

[0015] 3. When the present invention clamps the wafer, the pushing mechanism is started, and the pushing mechanism pushes the sliding seat to move to the side away from the mounting seat, the sliding seat drives the middle block to move to the side away from the mounting seat, and the middle block drives the jet block to move to the side away from the mounting seat. At the same time, since the length of the pull belt is fixed, the pull belt pulls the jet block away from the side away from the mounting seat and rotates downward, and the air outlet of the pull belt close to the mounting seat moves downward. At the same time, the jet block squeezes the elastic member through the first movable seat and the sleeve rod to shrink, so that the gas ejected from the air outlet of the jet block always points to the middle of the multiple jet blocks. When the jet block is opened to the middle position where the wafer is located in the middle of the multiple jet blocks, it is converted to move downward to the jet block below the wafer. The outlet hole of the jet block ejects nitrogen with the required temperature and humidity to push the wafer to move upward while rotating. At this time, since the linear velocity of the middle part of the wafer is less than the linear velocity of the outer side of the wafer, the gas sprayed to the middle part moves toward the outer side of the wafer and the wafer surface under the action of atmospheric pressure, so that a protective layer is formed on the surface and edge of the wafer, thereby avoiding contact and collision between the edge of the wafer and the middle block and the jet block. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall appearance structure of the present invention;

[0017] Figure 2 It is a schematic diagram of the structure of the supporting mechanism of the present invention;

[0018] Figure 3 This is a schematic diagram of the mounting seat structure of the present invention;

[0019] Figure 4 It is a schematic diagram of the structure of the temperature and humidity mechanism of the present invention;

[0020] Figure 5 It is a schematic diagram of the main shaft structure of the present invention.

[0021] In the figure: 1, mounting seat; 101, connecting sleeve; 102, guide groove; 2, supporting mechanism; 201, sliding seat; 202, middle block; 203, side block; 204, jet block; 205, guide tube; 206, drawstring; 207, first movable seat; 208, sleeve; 209, elastic member; 210, sleeve rod; 3, mounting shell; 301, side groove; 302, top plate; 303, input pipe; 4, pushing mechanism; 401, second movable seat; 402, curved rod; 403 , the third movable seat; 404, the slider; 405, the connecting ring; 406, the telescopic rod; 5, the main shaft; 501, the through groove; 502, the fixing plug; 503, the nozzle; 504, the driving part; 6, the temperature and humidity mechanism; 601, the solution shell; 602, the electric water plate; 603, the partition plate; 604, the centrifugal blade; 7, the storage mechanism; 701, the separation plate; 702, the one-way valve; 703, the pressure valve; 8, the auxiliary drive mechanism; 801, the guide plate; 802, the vortex disk; 803, the vortex blade. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] like Figures 1 to 5As shown, an embodiment of the present invention provides a wafer conversion device for semiconductor processing, comprising a mounting seat 1, a connecting sleeve 101 is fixedly sleeved in the middle of the mounting seat 1, a plurality of guide grooves 102 are equidistantly provided on the bottom surface of the mounting seat 1, a holding mechanism 2 is slidably sleeved in the middle of the plurality of guide grooves 102, the holding mechanism 2 comprises a sliding seat 201, the sliding seat 201 is slidably sleeved with the guide groove 102, a middle block 202 is fixedly mounted on the side of the bottom surface of the sliding seat 201 away from the mounting seat 1, a side block 203 is fixedly mounted on the upper part of the side of the middle block 202 away from the mounting seat 1, an air jet block 204 is movably sleeved at the bottom end of the middle block 202, an air outlet of the air jet block 204 close to the side of the mounting seat 1 is deflected counterclockwise, so that the nitrogen gas ejected from the air outlet of the air jet block 204 drives the wafer floating above it to rotate, so that according to the linear velocity of the inner side of the wafer is less than the linear velocity of the outer side of the wafer and the Bernoulli principle, the pressure on the side with a large flow rate is small. The pressure on the side with a small flow rate makes the nitrogen sprayed to the middle of the wafer surface flow along the middle of the wafer to the outside of the wafer, thereby increasing the nitrogen density on the wafer surface and further improving the wafer protection effect. A conduit 205 is fixedly sleeved on one side of the jet block 204. The upper part of the conduit 205 is fixedly sleeved with the mounting seat 1. The conduit 205 is made of rubber material, thereby improving the bending performance of the conduit 205 and preventing the conduit 205 from being broken when the jet block 204 moves and slides away from the mounting seat 1. A drawstring 206 is fixedly installed on one end of the jet block 204 away from the mounting seat 1. The top of the drawstring 206 passes through the inner cavity of the sliding seat 201 and is fixedly connected to the connecting sleeve 101. The drawstring 206 is woven from high-strength materials and is made of carbon fiber, thereby improving the strength and service life of the drawstring 206 and preventing the drawstring 206 from breaking when the jet block 204 is pulled to rotate, thereby improving the service life of the drawstring 206.

[0024] Among them, a first movable seat 207 is fixedly installed on the side of the upper surface of the jet block 204 away from the mounting seat 1, a sleeve 208 is fixedly installed on the bottom surface of the side block 203, an elastic member 209 is fixedly installed on the top surface of the inner cavity of the sleeve 208, a sleeve rod 210 is fixedly installed on the bottom end of the elastic member 209, the sleeve rod 210 is slidably sleeved with the sleeve 208, and the bottom end of the sleeve rod 210 is movably sleeved with the first movable seat 207, and a mounting shell 3 is fixedly installed on the upper surface of the mounting seat 1. The mounting shell 3 is made of heat-insulating material and high-carbon steel, thereby avoiding the upper and lower separation plates 701 in the inner cavity of the mounting shell 3. The heat of the nitrogen with required temperature and humidity in the container is lost to the outside in large quantities through the mounting shell 3, resulting in poor insulation effect of the wafer. A plurality of side grooves 301 are equidistantly provided on the circumference of the outer curved surface of the mounting shell 3, a pushing mechanism 4 is provided between the plurality of side grooves 301 and the supporting mechanism 2, a top plate 302 is fixedly installed on the top of the mounting shell 3, a plurality of input pipes 303 are fixedly sleeved equidistantly on the middle circumference of the top plate 302, a main shaft 5 is movably sleeved on the middle part of the mounting seat 1, a temperature and humidity mechanism 6 is provided on the upper part of the inner cavity of the mounting shell 3, a storage mechanism 7 is provided in the middle part of the inner cavity of the mounting shell 3, and an auxiliary drive mechanism 8 is provided on the bottom of the inner cavity of the mounting shell 3.

[0025] like Figure 1 , Figure 2 As shown, the pushing mechanism 4 includes a plurality of second movable seats 401, and the plurality of second movable seats 401 are respectively fixedly mounted on a side of the upper surface of the plurality of sliding seats 201 away from the mounting seat 1, and the middle parts of the plurality of second movable seats 401 are movably sleeved with a bent rod 402, and the tops of the plurality of bent rods 402 are movably sleeved with a third movable seat 403, and the sides of the plurality of third movable seats 403 close to the mounting shell 3 are fixedly mounted with a slider 404, and the plurality of sliders 404 are respectively slidably sleeved with adjacent side grooves 301, and the contact surfaces of the sliders 404 and the side grooves 301 are smooth. The contact surfaces of the side grooves 301 are all provided with wear-resistant coatings, thereby reducing the friction resistance between the curved rod 402 and the side grooves 301, reducing the load when the telescopic rod 406 pushes the second movable seat 401 to slide up and down along the side grooves 301 through the connecting ring 405, reducing the wear between the curved rod 402 and the side grooves 301, and reducing the subsequent friction vibration between the curved rod 402 and the side grooves 301. The top ends of the multiple sliders 404 are fixedly installed with connecting rings 405, and the outer curved surface circumference of the mounting shell 3 is equidistantly fixed with telescopic rods 406, and the telescopic ends of the telescopic rods 406 are fixedly connected to the connecting rings 405.

[0026] like Figure 1 , Figure 4 and Figure 5As shown, a plurality of through grooves 501 are equidistantly provided on the bottom circumference of the curved surface of the spindle 5, and the through grooves 501 are located above the mounting seat 1, a fixing plug 502 is fixedly sleeved on the bottom of the inner curved surface of the spindle 5, and the fixing plug 502 is located above the through groove 501, a nozzle 503 is fixedly sleeved on the bottom of the inner curved surface of the spindle 5, and the nozzle 503 is located below the through groove 501, a driving member 504 is provided in the middle of the top plate 302, and the spindle 5 is fixedly sleeved in the middle of the driving sleeve of the driving member 504, and the top end of the spindle 5 is connected to the power device of the external wafer conversion device moving device, so that when the equipment suddenly loses power during the conversion process, and the nitrogen supply and external nitrogen output device replace the nitrogen bottle, the storage mechanism 7 and the auxiliary drive mechanism 8 drive the spindle 5 to rotate, and the spindle 5 continues to drive the external moving device connected thereto to continue to drive the wafers protected by the nitrogen with the required temperature and humidity to be transferred to the storage area.

[0027] like Figure 4 As shown, the temperature and humidity mechanism 6 includes a solution shell 601, which is fixedly sleeved on the upper part of the inner curved surface of the mounting shell 3, and a plurality of electric water plates 602 are fixedly sleeved at equal intervals in the middle of the solution shell 601. The middle part of the electric water plate 602 is made of hard metal material, and the electric water plate 602 is made of nickel-chromium alloy, so that when the electric water plate 602 is energized, the electric water plate 602 heats the pure water in the inner cavity of the solution shell 601, and prevents the electric water plate 602 from bending and deforming and contacting the partition plate 603. The upper and lower surfaces of the electric water plate 602 are provided with a water-absorbing coating, and the water-absorbing coating is made of cotton material, so as to realize the conduction of pure water in the inner cavity of the solution shell 601 from the inner cavity of the solution shell 601 to the inner side of the upper and lower surfaces of the electric water plate 602, and a plurality of partition plates 603 are equidistantly fixedly sleeved on the upper part of the outer curved surface of the temperature and humidity mechanism 6, and the plurality of partition plates 603 are respectively located in the middle position of two connected partition plates 603, and a plurality of centrifugal blades 604 are equidistantly fixedly installed on the upper surface of the partition plate 603.

[0028] like Figure 4 As shown, the storage mechanism 7 includes two separation plates 701, which are respectively fixedly sleeved on the upper and lower parts of the inner curved surface of the mounting shell 3. A one-way valve 702 is provided between the upper separation plate 701 and the main shaft 5. The one-way valve 702 is fixedly connected to the upper separation plate 701, and the one-way valve 702 is movably sleeved on the main shaft 5. The gas flow direction of the one-way valve 702 is from top to bottom, so that when the external nitrogen output device suddenly stops inputting nitrogen, the one-way valve 702 is closed to prevent the high-pressure nitrogen stored between the two separation plates 701 in the inner cavity of the mounting shell 3 from flowing back. A pressure valve 703 is provided between the bottom separation plate 701 and the main shaft 5, and the pressure valve 703 is fixedly sleeved on the bottom separation plate 701, and the pressure valve 703 is movably sleeved on the main shaft 5.

[0029] like Figure 5As shown, the auxiliary drive mechanism 8 includes a guide plate 801, which is fixedly sleeved on the bottom of the outer curved surface of the main shaft 5, and a scroll 802 is fixedly sleeved on the bottom of the outer curved surface of the main shaft 5. The scroll 802 is located at the bottom of the guide plate 801, and a plurality of vortex blades 803 are fixedly installed on the circumference of the outer curved surface of the guide plate 801 at equal intervals. There are gaps between the guide plate 801, the scroll 802 and the lower separation plate 701, so as to avoid mutual friction between the guide plate 801, the scroll 802 and the lower separation plate 701, thereby reducing the resistance when the main shaft 5 rotates.

[0030] Working principle:

[0031] When the present invention is used, pure water is first poured into the inner cavity of the solution shell 601, and the water level is adjusted according to the humidity requirement during the wafer conversion process, so that the pure water immerses a suitable number of electric water plates 602 from bottom to top. When the humidity requirement is higher, the adjusted water level is higher, and the number of electric water plates 602 immersed is more, and vice versa. At this time, the pure water in the inner cavity of the solution shell 601 flows to the surface of the inner side of the electric water plate 602 in the inner cavity of the solution shell 601 under the adsorption and conduction effect of the water-absorbing coating on the surface of the electric water plate 602. Then, the electric water plate 602 is energized, and the electric water plate 602 heats the pure water to the required temperature during the wafer conversion process;

[0032] Then, the driving member 504 is started, and the output end of the driving member 504 drives the main shaft 5 to rotate, and the main shaft 5 drives the partition plate 603, the guide plate 801 and the vortex 802 fixedly connected thereto to rotate, and then the output device of the external nitrogen is started. At this time, the output device of the external nitrogen outputs nitrogen from the multiple input pipes 303 to the middle part of the solution shell 601 in the inner cavity of the installation shell 3, and the nitrogen in the middle part of the solution shell 601 in the inner cavity of the installation shell 3 passes through the gap between the electric water plate 602 and the partition plate 603 and is centrifugally accelerated and squeezed by the rotating partition plate 603 and the centrifugal blade 604 to flow to the one-way valve 702, and after reaching the set pressure of the one-way valve 702, the one-way valve 702 is pushed to open, and at the same time, when the gas flows through the gap between the electric water plate 602 and the partition plate 603, the flowing nitrogen contacts the absorption water layer on the surface of the electric water plate 602 that absorbs the required moisture and temperature, so that the nitrogen flow with the required temperature and humidity is Into the sealed space formed between the upper and lower separation plates 701 in the inner cavity of the installation shell 3, so that the space formed between the upper and lower separation plates 701 in the inner cavity of the installation shell 3 is filled with nitrogen high-pressure gas of required temperature and humidity. When the gas pressure reaches the setting requirement of the pressure valve 703, the pressure valve 703 is pushed to open, and the gas flows to the bottom of the pressure valve 703 through the pressure valve 703. At this time, due to the increase in the space at the bottom of the pressure valve 703, the high-pressure gas begins to automatically reduce the pressure to a suitable pressure range. Finally, the nitrogen with the required temperature and humidity is sprayed onto the bottom surface of the wafer through the conduit 205 and the jet block 204, and the nitrogen with the required temperature and humidity is sprayed onto the upper surface of the wafer through the through groove 501 and the fixed plug 502, so as to form a nitrogen protective layer with the required temperature and humidity on the upper and lower surfaces of the wafer, isolating the adverse effects of the changing air, humidity and temperature in the external environment on the wafer structure;

[0033] In addition, when the device of the present invention suddenly loses power during the conversion process, loses power, and the nitrogen supply and external nitrogen output device replace the nitrogen bottle, the one-way valve 702 is closed at this time, and the high-pressure nitrogen with the required temperature and humidity between the two separation plates 701 in the inner cavity of the installation shell 3 continues to push the pressure valve 703 to open, and when passing through the vortex blade 803, the vortex blade 803 drives the vortex disc 802 to rotate, and the vortex disc 802 drives the main shaft 5 fixedly connected to it to rotate, and the main shaft 5 continues to drive the external mobile device connected to it to continue to drive the wafers protected by the nitrogen with the required temperature and humidity to be transferred to the storage area;

[0034] In addition, when the present invention clamps the wafer, the telescopic rod 406 is started, and the telescopic end of the telescopic rod 406 drives the connecting ring 405 to move downward, and the connecting ring 405 pushes the slider 404 to move downward, and the slider 404 drives the third movable seat 403 to move downward, and the third movable seat 403 drives the second movable seat 401 to move toward the side away from the mounting seat 1 through the curved rod 402, and the second movable seat 401 drives the sliding seat 201 to move toward the side away from the mounting seat 1, and the sliding seat 201 drives the middle block 202 to move toward the side away from the mounting seat 1, and the middle block 202 drives the jet block 204 to move toward the side away from the mounting seat 1. At the same time, since the length of the pull belt 206 is fixed, the pull belt 206 pulls the jet block 204 to rotate downward toward the side away from the mounting seat 1, and the pull belt 206 is close to the side of the mounting seat 1. The air hole moves downward, and at the same time, the air jet block 204 squeezes the elastic member 209 through the first movable seat 207 and the sleeve rod 210 to contract, so that the gas ejected from the air outlet of the air jet block 204 always points to the middle of the multiple air jet blocks 204. When the air jet block 204 opens to the middle position of the wafer located at the multiple air jet blocks 204, it switches and moves downward to the air jet block 204 located below the wafer. The outlet hole of the air jet block 204 ejects nitrogen with the required temperature and humidity to push the wafer to move upward while rotating. At this time, since the linear velocity of the middle part of the wafer is less than the linear velocity of the outer side of the wafer, the gas sprayed to the middle part moves toward the outer side of the wafer and the wafer surface under the action of atmospheric pressure, so that a protective layer is formed on the surface and edge of the wafer to prevent the edge of the wafer from contacting and colliding with the middle block 202 and the air jet block 204, causing damage and deformation of the wafer.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer conversion device for semiconductor processing, comprising a mounting seat (1), characterized in that: A connecting sleeve (101) is fixedly sleeved in the middle of the mounting seat (1), a plurality of guide grooves (102) are equidistantly provided on the circumference of the bottom surface of the mounting seat (1), a holding mechanism (2) is slidably sleeved in the middle of each of the plurality of guide grooves (102), the holding mechanism (2) comprising a sliding seat (201), the sliding seat (201) being slidably sleeved with the guide groove (102), a middle block (202) being fixedly mounted on a side of the bottom surface of the sliding seat (201) away from the mounting seat (1), the upper portion of the middle block (202) being away from the mounting seat (1) A side block (203) is fixedly installed, the bottom end of the middle block (202) is movably sleeved with an injection block (204), one side of the injection block (204) is fixedly sleeved with a guide tube (205), the guide tube (205) is fixedly sleeved with the mounting seat (1), a drawstring (206) is fixedly installed on one end of the injection block (204) away from the mounting seat (1), the top end of the drawstring (206) passes through the inner cavity of the sliding seat (201) and is fixedly connected to the connecting sleeve (101), and a side of the upper surface of the injection block (204) away from the mounting seat (1) is fixedly installed A first movable seat (207) is provided, a sleeve (208) is fixedly mounted on the bottom surface of the side block (203), an elastic member (209) is fixedly mounted on the top surface of the inner cavity of the sleeve (208), a sleeve rod (210) is fixedly mounted on the bottom end of the elastic member (209), the sleeve rod (210) is slidably sleeved with the sleeve (208), the bottom end of the sleeve rod (210) is movably sleeved with the first movable seat (207), a mounting shell (3) is fixedly mounted on the upper surface of the mounting seat (1), and a plurality of equidistantly arranged outer curved surfaces of the mounting shell (3) are provided. Side grooves (301), a pushing mechanism (4) is provided between the plurality of side grooves (301) and the supporting mechanism (2), a top plate (302) is fixedly installed at the top end of the mounting shell (3), a plurality of input tubes (303) are fixedly sleeved at equal intervals on the middle circumference of the top plate (302), a main shaft (5) is movably sleeved on the middle part of the mounting seat (1), a temperature and humidity mechanism (6) is provided on the upper part of the inner cavity of the mounting shell (3), a storage mechanism (7) is provided in the middle part of the inner cavity of the mounting shell (3), and an auxiliary drive mechanism (8) is provided on the bottom of the inner cavity of the mounting shell (3).

2. A semiconductor processing wafer conversion device according to claim 1, characterized in that: The pushing mechanism (4) comprises a plurality of second movable seats (401), the plurality of second movable seats (401) being respectively fixedly mounted on a side of the upper surface of the plurality of sliding seats (201) away from the mounting seat (1), the middle parts of the plurality of second movable seats (401) being movably sleeved with a bent rod (402), the tops of the plurality of bent rods (402) being movably sleeved with a third movable seat (403), and the sides of the plurality of third movable seats (403) close to the mounting shell (3) being fixedly mounted with a sliding block (404) ), the plurality of sliders (404) are respectively slidably sleeved with adjacent side grooves (301), the contact surfaces between the sliders (404) and the side grooves (301) are smooth, and the contact surfaces between the sliders (404) and the side grooves (301) are both provided with wear-resistant coatings, a connecting ring (405) is fixedly installed from the top ends of the plurality of sliders (404), telescopic rods (406) are fixedly installed at equal intervals on the circumference of the outer curved surface of the mounting shell (3), and the telescopic ends of the telescopic rods (406) are fixedly connected to the connecting ring (405).

3. The semiconductor processing wafer conversion device according to claim 1, characterized in that: The bottom circumference of the curved surface of the spindle (5) is equidistantly provided with a plurality of through grooves (501), the through grooves (501) are located above the mounting seat (1), the bottom of the inner curved surface of the spindle (5) is fixedly sleeved with a fixing plug (502), the fixing plug (502) is located above the through groove (501), the bottom of the inner curved surface of the spindle (5) is fixedly sleeved with a nozzle (503), the nozzle (503) is located below the through groove (501), a driving member (504) is provided in the middle of the top plate (302), the spindle (5) is fixedly sleeved in the middle of the driving sleeve of the driving member (504), and the top end of the spindle (5) is connected to an external power device that drives a moving device of a wafer conversion device.

4. The semiconductor processing wafer conversion device according to claim 1, characterized in that: The temperature and humidity mechanism (6) comprises a solution shell (601), wherein the solution shell (601) is fixedly sleeved on the upper part of the inner curved surface of the mounting shell (3), a plurality of electric water plates (602) are fixedly sleeved at equal intervals in the middle part of the solution shell (601), the middle part of the electric water plates (602) being made of a hard metal material, a plurality of partition plates (603) are fixedly sleeved at equal intervals on the upper part of the outer curved surface of the temperature and humidity mechanism (6), the plurality of partition plates (603) are respectively located at the middle position of two connected partition plates (603), and a plurality of centrifugal blades (604) are fixedly installed at equal intervals on the circumference of the upper surface of the partition plate (603).

5. The semiconductor processing wafer conversion device according to claim 1, characterized in that: The storage mechanism (7) comprises two separation plates (701), the two separation plates (701) are respectively fixedly sleeved on the upper and lower parts of the inner curved surface of the mounting shell (3), a one-way valve (702) is provided between the upper separation plate (701) and the main shaft (5), the one-way valve (702) is fixedly connected to the upper separation plate (701), the one-way valve (702) is movably sleeved with the main shaft (5), the gas flow direction of the one-way valve (702) is from top to bottom, a pressure valve (703) is provided between the bottom separation plate (701) and the main shaft (5), the pressure valve (703) is fixedly sleeved with the bottom separation plate (701), and the pressure valve (703) is movably sleeved with the main shaft (5).

6. The semiconductor processing wafer conversion device according to claim 1, characterized in that: The auxiliary drive mechanism (8) comprises a guide plate (801), wherein the guide plate (801) is fixedly sleeved on the bottom of the outer curved surface of the main shaft (5), a scroll (802) is fixedly sleeved on the bottom of the outer curved surface of the main shaft (5), the scroll (802) is located at the bottom of the guide plate (801), a plurality of vortex blades (803) are fixedly installed at equal intervals on the circumference of the outer curved surface of the guide plate (801), and gaps are left between the guide plate (801), the scroll (802) and the lower separation plate (701).

7. The semiconductor processing wafer conversion device according to claim 1, characterized in that: The air outlet of the jet block (204) close to the mounting seat (1) is deflected counterclockwise, the conduit (205) is made of rubber material, the drawstring (206) is woven from high-strength material, and the mounting shell (3) is made of heat-insulating material.

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