Wafer turnover device

Abstract

The invention relates to a wafer turnover device, and belongs to the technical field of wafer production equipment. According to the wafer overturning device, when the rotating frame faces the side face, the mechanical arm can load the wafer on the clamping block, the clamping block is driven by the clamping driving mechanism to clamp the wafer, the rotating driving piece drives the rotating frame to rotate to face the bottom face, the mechanical arm can take away the wafer, and the wafer is taken away for cleaning. And the cleaned wafer is upwards conveyed back to the wafer turnover device from the bottom by other parts. The clamping teeth are divided into two pairs, one pair of clamping teeth is always used for clamping an uncleaned wafer, the other pair of clamping teeth is always used for clamping a cleaned wafer, the two wafers do not interfere with each other, and the situation that the uncleaned wafer is clamped by the clamping teeth, so that pollution is caused, and the cleaned wafer is polluted is avoided.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer production equipment, and in particular, relates to a wafer flipping device. Background Art

[0002] During the production process of wafers, it is necessary to adjust the orientation of the wafers, such as adjusting the wafers from a horizontal state to a vertical state, or from a vertical state to a horizontal state. Chinese invention patent application CN114999995A discloses a wafer flipping mechanism, including: a frame and two groups of clamping mechanisms that synchronously clamp multiple wafers on both radial sides, the frame includes a bottom plate and side plates vertically connected to the opposite sides of the bottom plate, the two groups of clamping mechanisms respectively pass through the two side plates and are connected to a first driving device for controlling the two groups of clamping mechanisms to approach each other and clamp the two sides of the wafer, and the side plates are connected to a driving assembly for controlling the two groups of clamping mechanisms to synchronously pivot in a plane parallel to the side plates. Through the present application, the technical effect of wafer flipping without flipping the wafer flipping mechanism as a whole is achieved, thereby extending the working life of the flipping mechanism and reducing the working space it occupies.

[0003] However, when using this wafer flipping mechanism, if you need to flip the wafers before and after cleaning at the same time, you can only use them together. In this way, the wafers before cleaning will contaminate the clamping mechanism due to the dirt on them. If it is used to clamp the wafers after cleaning, it will contaminate the wafers, resulting in a worse cleaning effect of the wafers. Summary of the invention

[0004] The technical problem to be solved by the present invention is: to solve the deficiencies in the prior art, thereby providing a wafer flipping device capable of separating cleaned wafers and non-cleaned wafers.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A wafer flipping device, comprising:

[0007] An outer frame having at least two openings on mutually perpendicular planes;

[0008] A rotating frame is arranged inside the outer frame;

[0009] The clamping blocks are two parallel blocks, which are respectively arranged on two opposite sides of the sliding rotating frame;

[0010] Clamping teeth, arranged on the clamping block, including first clamping teeth for clamping uncleaned wafers and second clamping teeth for clamping cleaned wafers;

[0011] A rotary drive member, disposed on the outer frame, for driving the rotary frame to rotate;

[0012] The clamping drive mechanism is used to drive the clamping blocks to move the two clamping blocks closer to or farther away from each other.

[0013] Preferably, in the wafer flipping device of the present invention, the first clamping teeth are located below the second clamping teeth or the first clamping teeth and the second clamping teeth are parallel to each other.

[0014] Preferably, in the wafer flipping device of the present invention, the distance between two of the second clamping teeth is smaller than the distance between two of the first clamping teeth.

[0015] Preferably, in the wafer flipping device of the present invention, the rotating frame comprises two parallel rotating plates and a crossbar connecting the two parallel rotating plates.

[0016] Preferably, in the wafer flipping device of the present invention, the clamping drive mechanism comprises a clamping drive member, a connecting member and a driving rod, the driving rod passes through the rotating shaft of the rotating frame and the rotating frame is connected to the clamping block. The rotating shaft of the rotating frame is hollow, and a bearing is provided between the driving rod and the rotating shaft of the rotating frame.

[0017] Preferably, in the wafer flipping device of the present invention, the clamping drive mechanisms are in two groups, which are respectively located on both sides of the outer frame.

[0018] Preferably, in the wafer flipping device of the present invention, the rotating driving member includes a motor, a driving wheel connected to the output shaft of the motor, and a driven wheel connected to the driving wheel via a belt, and the rotating shaft of the rotating frame is coaxially arranged with the driven wheel.

[0019] The beneficial effects of the present invention are:

[0020] The wafer flipping device of the present application, when the rotating frame faces sideways, the manipulator can load the wafer onto the clamping block, the clamping block clamps the wafer under the drive of the clamping drive mechanism, the rotating drive member drives the rotating frame to rotate toward the bottom surface, and the manipulator can take the wafer away, the wafer is taken away for cleaning, and the cleaned wafer is then transported from the bottom to the wafer flipping device by other components. The clamping teeth are divided into two pairs, one pair of clamping teeth is always used to clamp uncleaned wafers, and the other pair of clamping teeth is always used to clamp cleaned wafers. The two types of wafers do not interfere with each other, and will not cause contamination due to the clamping teeth clamping uncleaned wafers, thereby contaminating the cleaned wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.

[0022] Figure 1 is a three-dimensional diagram of the front side of the wafer flipping device according to an embodiment of the present application;

[0023] Figure 2 is a side cross-sectional view of a wafer flipping device according to an embodiment of the present application;

[0024] Figure 3 is a three-dimensional diagram of the back side of the wafer flipping device according to an embodiment of the present application;

[0025] Figure 4 is a front cross-sectional view of a wafer flipping device according to an embodiment of the present application;

[0026] The reference numerals in the figure are:

[0027] 1 outer frame;

[0028] 2 rotating racks;

[0029] 3 Clamping block;

[0030] 4 Clamping teeth;

[0031] 5. Rotating drive member;

[0032] 6. Clamping drive mechanism;

[0033] 21 Rotating plate;

[0034] 22 crossbar;

[0035] 31 first tightening block;

[0036] 32 second tightening block;

[0037] 41 second clamping tooth;

[0038] 42 first clamping tooth;

[0039] 51 Motor;

[0040] 52 driving wheel;

[0041] 53 driving wheel;

[0042] 61 Connectors;

[0043] 63 Drive rod. DETAILED DESCRIPTION

[0044] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0045] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention, unless otherwise specified, "multiple" means two or more.

[0046] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0047] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0048] Example

[0049] This embodiment provides a wafer flipping device, such as Figure 1-4 As shown, including:

[0050] The outer frame 1 has openings at the bottom and two sides (at least two openings on mutually perpendicular surfaces);

[0051] A rotating frame 2 is arranged inside the outer frame 1;

[0052] The clamping blocks 3 are two parallel blocks, which are respectively arranged on two opposite sides of the sliding rotating frame 2;

[0053] The clamping teeth 4 are arranged on the clamping block 3, and include a first clamping tooth 42 for clamping the uncleaned wafer and a second clamping tooth 41 for clamping the cleaned wafer;

[0054] A rotating driving member 5, arranged on the outer frame 1, for driving the rotating frame 2 to rotate;

[0055] The clamping drive mechanism 6 is used to drive the clamping blocks 3 to move the two clamping blocks 3 closer to or farther from each other. (That is, the clamping blocks 3 can move together or together.)

[0056] In the wafer flipping device of this embodiment, when the rotating frame 2 faces the side, the manipulator can load the wafer onto the clamping block 3, and the clamping block 3 clamps the wafer under the drive of the clamping drive mechanism 6. The rotating drive member 5 drives the rotating frame 2 to rotate toward the bottom surface, and the manipulator can take the wafer away. The wafer is taken away for cleaning, and the cleaned wafer is then transported from the bottom to the wafer flipping device by other components. The clamping teeth 4 are divided into two pairs, one pair of clamping teeth 4 is always used to clamp the uncleaned wafer, and the other pair of clamping teeth 4 is always used to clamp the cleaned wafer. The two types of wafers do not interfere with each other, and will not be contaminated by the clamping teeth 4 clamping the uncleaned wafer, thereby contaminating the cleaned wafer.

[0057] Furthermore, the first clamping teeth 42 are located below the second clamping teeth 41 or the first clamping teeth 42 and the second clamping teeth 41 are parallel to each other. The parallelism only occurs when the wafer is in a horizontal state. This can prevent the stolen goods on the first clamping teeth 42 from falling onto the second clamping teeth 41 due to gravity to a certain extent.

[0058] Furthermore, the distance between the second clamping teeth 41 is smaller than the distance between the first clamping teeth 42, that is, no matter in any state, the second clamping teeth 41 will be closer to each other. In this way, when the cleaned wafer is loaded into the second clamping teeth 41, it will be more convenient for the robot to reach in and pass the wafer through the first clamping teeth 42 and then reach the second clamping teeth 41 without touching the first clamping teeth 42.

[0059] Furthermore, the rotating frame 2 includes two parallel rotating plates 21 and a crossbar 22 connecting the two parallel rotating plates 21 .

[0060] Furthermore, the clamping drive mechanism 6 includes a clamping drive member 61, a connecting member 62 and a driving rod 63, and the driving rod 63 passes through the rotating shaft of the rotating frame 2 and connects the rotating frame 2 with the clamping block 3. The rotating shaft of the rotating frame 2 is hollow, and a bearing is provided between the driving rod 63 and the rotating shaft of the rotating frame 2. The clamping block 3 is divided into a first clamping block 31 and a second clamping block 32, and can drive one of the first clamping block 31 or the second clamping block 32 to move, or can drive the first clamping block 31 and the second clamping block 32 to move simultaneously.

[0061] Furthermore, the clamping drive mechanism 6 is divided into two groups, which are respectively located on both sides of the outer frame 1 .

[0062] Furthermore, the rotary drive member 5 includes a motor 51 , a driving wheel 52 connected to the output shaft of the motor 51 , and a driven wheel 53 connected to the driving wheel 52 via a belt. The rotating shaft of the rotating frame 2 is coaxially arranged with the driven wheel 53 .

[0063] The clamping block 3 is connected to the rotating frame 2 via a sliding guide rod.

[0064] Based on the above ideal embodiments of this application, the relevant staff can make various changes and modifications without departing from the technical concept of this application through the above description. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer flipping device, characterized in that: include: The outer frame (1) has at least two openings on mutually perpendicular surfaces; A rotating frame (2) is arranged inside the outer frame (1); The clamping blocks (3) are two parallel blocks, which are respectively arranged on two opposite sides of the sliding rotating frame (2); Clamping teeth (4) are arranged on the clamping block (3), and include first clamping teeth (42) for clamping uncleaned wafers and second clamping teeth (41) for clamping cleaned wafers; A rotating drive member (5), arranged on the outer frame (1) and used for driving the rotating frame (2) to rotate; The clamping drive mechanism (6) is used to drive the clamping blocks (3) to move so that the two clamping blocks (3) move closer to or farther from each other.

2. The wafer flipping device according to claim 1, characterized in that: The first clamping tooth (42) is located below the second clamping tooth (41) or the first clamping tooth (42) and the second clamping tooth (41) are parallel to each other.

3. The wafer flipping device according to claim 1, characterized in that: The distance between the two second clamping teeth (41) is smaller than the distance between the two first clamping teeth (42).

4. The wafer flipping device according to claim 1, characterized in that: The rotating frame (2) comprises two parallel rotating plates (21) and a crossbar (22) connecting the two parallel rotating plates (21).

5. The wafer flipping device according to claim 1, characterized in that: The clamping drive mechanism (6) comprises a clamping drive member (61), a connecting member (62) and a driving rod (63); the driving rod (63) passes through the rotating shaft of the rotating frame (2) and the rotating frame (2) is connected to the clamping block (3).

6. The wafer flipping device according to claim 1, characterized in that: The clamping drive mechanism (6) consists of two groups, which are respectively located on both sides of the outer frame (1).

7. The wafer flipping device according to claim 1, characterized in that: The rotary drive member (5) comprises a motor (51), a driving wheel (52) connected to the output shaft of the motor (51), and a driven wheel (53) connected to the driving wheel (52) via a belt, and the rotating shaft of the rotary frame (2) and the driven wheel (53) are coaxially arranged.

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