Packaging module and manufacturing method thereof
By using special-shaped molds to seal the electronic components, the problem of incompatibility of filters and other functional chips in the packaging module is solved, the appropriate filling of electronic components and the integrity of the cavity structure is achieved, and the reliability of the packaging module is improved. sex.
Patent Information
- Application Number
- CN202411523354.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-29
- Publication Date
- 2025-02-18
AI Technical Summary
The prior art is difficult to compatible with the molding requirements of filters and other functional chips in the package module, resulting in the loss of cavity at the bottom of the filter or poor filling of other functional chips, affecting reliability.
Different types of electronic components are plastic-sealed by using special-shaped molds. The plastic-sealing material is filled with the gaps that need to be filled through two plastic seals, while retaining the structure that requires cavity.
The proper filling and integrity of the cavity structure of different types of electronic components are achieved, and the reliability of the packaging module is improved.
Smart Images
Figure CN119483530A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of packaging technology, and in particular to a packaging module and a manufacturing method thereof. Background Art
[0002] The packaging of the filter needs to consider the influence of the molding during the plastic encapsulation, especially for module products with filters. The filter and other functional chips are integrated in one module, which will lead to the incompatibility of the molding of the filter and other functional chips. If the molding pressure is small, the bottom of the other functional chips will be poorly filled with the plastic encapsulation material, resulting in the failure of the reliability of other functional chips; if the molding pressure is large, the bottom of the filter will be filled and squeezed by the plastic encapsulation material, resulting in the loss of the cavity at the bottom of the filter and the failure of the interdigital transducer (IDT). For example, the bare chip module packaging (BDMP) product uses a bare chip level filter (bare filter) to isolate the external plastic encapsulation material by laminating to form a cavity at the bottom of the bare chip level filter, but this method has the risk of insufficient molding parameter process window and the film being broken by the plastic encapsulation material to fill the bottom of the filter chip. Or for system-in-package (SIP) module products, the wafer-level packaging (WLP) filter and other functional chips have different requirements for plastic encapsulation molding, resulting in abnormalities such as poor filling of other functional chips or IDT failure of the WLP filter. Therefore, it is necessary to find a solution that can ensure that the bottom of the non-filter chip is completely filled while ensuring the integrity of the cavity structure at the bottom of the filter chip. Summary of the invention
[0003] One of the purposes of the present invention is to provide a solution that can ensure that the bottom of an electronic component that does not need to form a cavity is completely filled, and can also ensure the integrity of the bottom cavity structure of an electronic component that needs to form a cavity.
[0004] In order to achieve the above-mentioned object, the present invention provides a method for manufacturing a packaging module on one hand. The method for manufacturing the packaging module comprises using a special-shaped mold to plastic-encapsulate one of a first type of electronic component and a second type of electronic component located on a first surface of a substrate, and then plastic-encapsulating the first type of electronic component and the second type of electronic component as a whole; wherein, through the two plastic-encapsulations, the plastic encapsulation material fills the first gap between the first type of electronic component and the substrate, while the second cavity between the second type of electronic component and the substrate is retained.
[0005] Optionally, the method for manufacturing the packaging module includes the following steps: providing a substrate, mounting the first type electronic component and the second type electronic component on a first surface of the substrate; pasting an isolation film on the first surface of the substrate, the isolation film covering the first type electronic component and the second type electronic component, the isolation film sealing a first gap between the first type electronic component and the substrate to form a first cavity and sealing a second gap between the second type electronic component and the substrate to form a second cavity; and plastic-sealing the first type electronic component to form a first plastic-sealed body, and plastic-sealing the second type electronic component to form a second plastic-sealed body; wherein the first plastic-sealed body or the second plastic-sealed body is made using the special-shaped mold, the molding methods used to form the first plastic-sealed body and the molding methods used to form the second plastic-sealed body are different, the plastic sealing material of the first plastic-sealed body breaks through the isolation film on the side wall of the first cavity and fills the first gap, the second plastic-sealed body wraps the second type electronic component and surrounds the outside of the second cavity, and one of the first plastic-sealed body and the second plastic-sealed body wraps the other.
[0006] Optionally, the first type of electronic components are sealed with the special-shaped mold to form the first sealed body, the first sealed body exposes the arrangement area of the second type of electronic components on the substrate, and the second sealed body formed subsequently wraps the first sealed body; or, the second type of electronic components are sealed with the special-shaped mold to form a second sealed body, the second sealed body exposes the arrangement area of the first type of electronic components on the substrate, and the first sealed body formed subsequently wraps the second sealed body.
[0007] Optionally, the method for manufacturing the packaging module includes the following steps: providing a substrate, mounting the first type of electronic component on a first surface of the substrate, with a first gap between the first type of electronic component and the substrate; using the special-shaped mold to plastic-seal the first type of electronic component to form a first plastic-seal body, the first plastic-seal body wraps the first type of electronic component and fills the first gap, and the first plastic-seal body exposes the arrangement area of the second type of electronic component on the substrate; mounting the second type of electronic component on the substrate; attaching an isolation film to the first surface of the substrate, the isolation film covering the first plastic-seal body and the second type of electronic component, the isolation film sealing the second gap between the second type of electronic component and the substrate to form a second cavity; and forming a second plastic-seal body on the isolation film, the second plastic-seal body wraps the second type of electronic component, the isolation film and the first plastic-seal body, and the second plastic-seal body surrounds the outside of the second cavity.
[0008] Optionally, the special-shaped mold includes at least one first concave cavity and at least one second concave cavity, the first concave cavity corresponds to the position of the first type of electronic component, and the second concave cavity corresponds to the position of the second type of electronic component; when the first type of electronic component is plastic-sealed using the special-shaped mold, the first concave cavity is filled with plastic sealing material and the second concave cavity is not filled with plastic sealing material; or, when the second type of electronic component is plastic-sealed using the special-shaped mold, the second concave cavity is filled with plastic sealing material and the first concave cavity is not filled with plastic sealing material.
[0009] Optionally, the opening area of the first concave cavity is larger than the bottom area of the first concave cavity, and / or the opening area of the second concave cavity is larger than the bottom area of the second concave cavity.
[0010] Optionally, the corners of the first concave cavity are circular chamfered or obtuse chamfered, and / or the corners of the second concave cavity are circular chamfered or obtuse chamfered.
[0011] Optionally, the second type electronic component is a filter chip, and the first type electronic component is a non-filter chip.
[0012] Another aspect of the present invention provides a packaging module. The packaging module includes a substrate, a first type of electronic component, a second type of electronic component, a first plastic package and a second plastic package; the first type of electronic component and the second type of electronic component are mounted on a first surface of the substrate, the first plastic package and the second plastic package are both located on the first surface, the first plastic package wraps the first type of electronic component, the plastic package of the first plastic package fills the first gap between the first type of electronic component and the substrate, the second plastic package wraps the second type of electronic component, the second plastic package surrounds the outside of the second cavity between the second type of electronic component and the substrate, and one of the first plastic package and the second plastic package wraps the other.
[0013] Optionally, the packaging module further includes an isolation film, which covers at least the side walls of the second type electronic component and a surface away from the substrate, and the isolation film seals a second gap between the second type electronic component and the substrate to form the second cavity.
[0014] Optionally, the isolation film covers the first type electronic component and the second type electronic component, the isolation film on the side of the first gap has a gap, and the first plastic package body is partially located on the isolation film and partially passes through the gap to fill the first gap.
[0015] Optionally, the first plastic packaging body covers the arrangement area of the first type of electronic components on the substrate and leaves a space for the arrangement area of the second type of electronic components on the substrate, and the second plastic packaging body covers the isolation film and the first plastic packaging body.
[0016] Optionally, the second plastic packaging body covers the arrangement area of the second type of electronic components on the substrate and leaves a arrangement area of the first type of electronic components on the substrate free, and the first plastic packaging body covers the second plastic packaging body.
[0017] Optionally, the isolation film covers the second type electronic component and the first plastic packaging body, and the second plastic packaging body is located above the isolation film and covers the first plastic packaging body.
[0018] Optionally, the first plastic package body has a bottom surface close to the substrate and a top surface away from the substrate, and an area of the top surface is smaller than an area of the bottom surface.
[0019] Optionally, a top corner of the first plastic package body is an arc-shaped chamfer or an obtuse-angle chamfer.
[0020] Optionally, the first plastic sealing body and the second plastic sealing body are made of the same or different materials.
[0021] Optionally, the second type electronic component is a filter chip, and the first type electronic component is a non-filter chip.
[0022] In the packaging module and the manufacturing method thereof provided by the present invention, a special-shaped mold is used to plastic-encapsulate one of the first type of electronic components and the second type of electronic components located on the first surface of the substrate, and then the first type of electronic components and the second type of electronic components are plastic-encapsulated as a whole, wherein the plastic encapsulation material fills the first gap between the first type of electronic components and the substrate through the two plastic encapsulations, while the second cavity between the second type of electronic components and the substrate is retained, thereby ensuring that the bottom of the first type of electronic components that do not need to form a cavity at the bottom is completely filled, and ensuring the integrity of the bottom cavity structure of the second type of electronic components that need to form a cavity at the bottom, thereby meeting the different plastic encapsulation requirements of different types of electronic components, which helps to improve the reliability of the packaging module; in addition, using a special-shaped mold for plastic encapsulation once and then plastic encapsulating the two types of electronic components as a whole helps to further improve the reliability of the packaging. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 A schematic flow chart of a method for manufacturing a packaging module provided in Embodiment 1 of the present invention.
[0024] Figures 2 to 6 A schematic diagram of the steps of the method for manufacturing a packaging module provided in the first embodiment of the present invention.
[0025] Figure 7 This is a schematic diagram of the structure of the packaging module provided in Example 1 of the present invention.
[0026] Figure 8 A schematic flow chart of a method for manufacturing a packaging module provided in Embodiment 2 of the present invention.
[0027] Figures 9 to 12 A schematic diagram of the steps of the method for manufacturing a packaging module provided in the second embodiment of the present invention.
[0028] Fig.13 This is a schematic diagram of the structure of the packaging module provided in the second embodiment of the present invention.
[0029] Figure 14 to Figure 15 A schematic diagram of the steps of the method for manufacturing a packaging module provided in the third embodiment of the present invention.
[0030] Explanation of the reference numerals: 100 - substrate; 101a - first gap; 101 - first cavity; 102a - second gap; 102 - second cavity; 103 - isolation film; 201 - first type electronic component; 202 - second type electronic component; 201a - first bump; 202a - second bump; 300 - special-shaped mold; 301 - first concave cavity; 302 - second concave cavity; 401 - first plastic package; 402 - second plastic package. DETAILED DESCRIPTION
[0031] In order to ensure that the bottom of an electronic component that does not need to form a cavity is completely filled, and to ensure the integrity of the bottom cavity structure of an electronic component that needs to form a cavity, the present invention provides a packaging module and a manufacturing method thereof.
[0032] In the manufacturing method of the packaging module provided by the present invention, a special-shaped mold is used to plastic-encapsulate one of the first type of electronic components and the second type of electronic components located on the first surface of the substrate, and then the first type of electronic components and the second type of electronic components are plastic-encapsulated as a whole, wherein the plastic encapsulation material fills the first gap between the first type of electronic components and the substrate through the two plastic encapsulations, while the second cavity between the second type of electronic components and the substrate is retained, thereby ensuring that the bottom of the first type of electronic components that do not need to form a cavity at the bottom is completely filled, and ensuring the integrity of the bottom cavity structure of the second type of electronic components that need to form a cavity at the bottom, thereby meeting the different plastic encapsulation requirements of different types of electronic components, which helps to improve the reliability of the packaging module; in addition, using a special-shaped mold for plastic encapsulation once and then plastic encapsulating the two types of electronic components as a whole helps to further improve the reliability of the packaging.
[0033] Accordingly, the present invention provides a packaging module, which includes a substrate, a first type of electronic component, a second type of electronic component, a first plastic packaging body and a second plastic packaging body; the first type of electronic component and the second type of electronic component are mounted on a first surface of the substrate, the first plastic packaging body and the second plastic packaging body are both located on the first surface, the first plastic packaging body wraps the first type of electronic component, the plastic packaging material of the first plastic packaging body fills the first gap between the first type of electronic component and the substrate, the second plastic packaging body wraps the second type of electronic component, the second plastic packaging body surrounds the outside of a second cavity between the second type of electronic component and the substrate, and one of the first plastic packaging body and the second plastic packaging body wraps the other of the two.
[0034] The packaging module and the manufacturing method thereof proposed by the present invention are further described in detail below in combination with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer according to the following description. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.
[0035] As used in the present invention, the singular forms "one", "an" and "the" include plural objects, unless the content clearly indicates otherwise. As used in the present invention, the term "or" is generally used in a sense that includes "and / or", unless the content clearly indicates otherwise. As used in the present invention, the term "several" is generally used in a sense that includes "at least one", unless the content clearly indicates otherwise. As used in the present invention, the term "at least two" is generally used in a sense that includes "two or more", unless the content clearly indicates otherwise. In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features, unless the content clearly indicates otherwise.
[0036] Embodiment 1
[0037] Figure 1 A schematic flow chart of a method for manufacturing a packaging module provided in Embodiment 1 of the present invention.
[0038] like Figure 1 As shown, the manufacturing method of the packaging module provided in this embodiment includes:
[0039] Step S1, providing a substrate, and mounting a first type of electronic component and a second type of electronic component on a first surface of the substrate;
[0040] Step S2, attaching an isolation film on the first surface of the substrate, the isolation film covering the first type electronic component and the second type electronic component, the isolation film sealing a first gap between the first type electronic component and the substrate to form a first cavity and sealing a second gap between the second type electronic component and the substrate to form a second cavity; and
[0041] Step S3, plastic-sealing the first type electronic component to form a first plastic-sealed body, and plastic-sealing the second type electronic component to form a second plastic-sealed body; wherein, the first plastic-sealed body or the second plastic-sealed body is made of a special-shaped mold, and the molding methods used to form the first plastic-sealed body and the molding methods used to form the second plastic-sealed body are different, the plastic sealing material of the first plastic-sealed body breaks through the isolation film of the side wall of the first cavity and fills the first gap, the second plastic-sealed body wraps the second type electronic component and surrounds the outside of the second cavity, and one of the first plastic-sealed body and the second plastic-sealed body wraps the other of the two.
[0042] Figures 2 to 6 A schematic diagram of the steps of the method for manufacturing a packaging module provided in the first embodiment of the present invention. Figure 7 This is a schematic diagram of the structure of the packaging module provided in the first embodiment of the present invention. Figures 1 to 7 The manufacturing method of the packaging module provided in this embodiment is described.
[0043] refer to Figure 2 As shown, step S1 is performed to provide a substrate 100, and to mount a first type electronic component 201 and a second type electronic component 202 on a first surface of the substrate 100. On the substrate 100, the number of the first type electronic component 201 is single or multiple, and the number of the second type electronic component 202 is single or multiple.
[0044] In this embodiment, the first surface of the substrate 100 is the top surface of the substrate 100 , but is not limited thereto.
[0045] For example, the first type electronic component 201 and the second type electronic component 202 may be soldered on the first surface of the substrate 100 by a surface mount technology (SMT).
[0046] In this embodiment, the second type electronic component 202 may be a chip that is sensitive to molding, specifically, a filter chip or a chip that is prone to cracking under high pressure. The filter chip may be a bare chip level filter chip or a wafer level package filter chip. Figure 2As shown, the surface of the second type electronic component 202 has a second bump 202a, and the second bump 202a supports the second gap 102a between the second type electronic component 202 and the substrate 100. The second bump 202a can be soldered on the substrate 100 and serves as a signal port of the second type electronic component 202. When the second type electronic component 202 is a surface acoustic wave (SAW) filter chip, an interdigital transducer (IDT) is also formed on the surface of the second type electronic component 202 having the second bump 202a. The second gap 102a supported by the second bump 202a or the second cavity formed by the subsequent sealing of the second gap 102a is used to ensure the normal operation of the interdigital transducer.
[0047] The first type electronic component 201 may be a chip that is not sensitive to molding, and specifically, may be a non-filter chip or a chip that can withstand high voltage. The first type electronic component 201 may also be a passive device, such as a capacitor or a resistor. For example, Figure 2 As shown, the first type electronic component 201 can be a flip chip, and the surface of the first type electronic component 201 has a first bump 201a, the first bump 201a is welded on the substrate 100 and serves as a signal port of the first type electronic component 201, and the first bump 201a supports the first gap 101a between the first type electronic component 201 and the substrate 100.
[0048] refer to Figure 3 As shown, step S2 is performed, an isolation film 103 is attached to the first surface of the substrate 100, the isolation film 103 covers the first type electronic component 201 and the second type electronic component 202, and the isolation film 103 seals the first gap 101a between the first type electronic component 201 and the substrate 100 to form the first cavity 101 and seals the second gap 102a between the second type electronic component 202 and the substrate 100 to form the second cavity 102. The first bump 201a on the surface of the first type electronic component 201 supports the first cavity 101, and the second bump 202a on the surface of the second type electronic component 202 supports the second cavity 102.
[0049] For example, the isolation film 103 may be an epoxy resin dry film, but is not limited thereto. The isolation film 103 may be laminated on the substrate 100 using a vacuum laminating machine, but is not limited thereto.
[0050] Next, step S3 is executed to plastic-encapsulate the first type electronic component 201 to form a first plastic-encapsulated body, and to plastic-encapsulate the second type electronic component to form a second plastic-encapsulated body. The first plastic-encapsulated body or the second plastic-encapsulated body is made using a special-shaped mold. The molding methods used to form the first plastic-encapsulated body and the molding methods used to form the second plastic-encapsulated body are different. The plastic encapsulation material of the first plastic-encapsulated body breaks through the isolation film on the side wall of the first cavity and fills the first gap. The second plastic-encapsulated body wraps the second type electronic component and surrounds the outside of the second cavity. One of the first plastic-encapsulated body and the second plastic-encapsulated body wraps the other of the two.
[0051] In this embodiment, Figure 4 , Figure 5 and Figure 6 As shown, the first type electronic component 201 is encapsulated by using a special-shaped mold 300 to form a first encapsulated body 401, and the first encapsulated body 401 exposes the arrangement area of the second type electronic component 202 on the substrate 100; and then the special-shaped mold 300 is removed. In the process of forming the first encapsulated body 401, by adjusting the molding pressure, the encapsulation material of the first encapsulated body 401 breaks through the isolation film 103 on the side wall of the first cavity 101 and fills the first gap 101a, that is, the bottom of the first type electronic component 201 is completely filled.
[0052] refer to Figure 4 As shown, the special-shaped mold 300 may include at least one first concave cavity 301 and at least one second concave cavity 302, the first concave cavity 301 corresponds to the position of the first type electronic component 201, and the second concave cavity 302 corresponds to the position of the second type electronic component 202; Figure 5 As shown, when the first type electronic component 201 is encapsulated using the special-shaped mold 300, the first concave cavity 301 is used as the encapsulation cavity and the second concave cavity 302 is used as the shielding cavity. The first concave cavity 301 is filled with encapsulation material and the second concave cavity 302 is not filled with encapsulation material.
[0053] It should be noted that the special-shaped mold 300 has concave cavities corresponding to the positions of various electronic components. During plastic encapsulation, the special-shaped mold 300 can be smoothly pressed with the substrate 100, and various electronic components are wrapped by their corresponding concave cavities. The concave cavities corresponding to the electronic components that do not need plastic encapsulation are used as shielding cavities at this time, which can prevent the electronic components that do not need plastic encapsulation from being crushed during the plastic encapsulation process. The special-shaped mold 300 can be used for multiple plastic encapsulation of multiple chips.
[0054] refer to Figure 4As shown, when the first concave cavity 301 is used as a plastic encapsulation cavity, the opening area of the first concave cavity 301 can be larger than the bottom area of the first concave cavity 301. For example, the cross section of the first concave cavity 301 perpendicular to the substrate 100 can be a trapezoid, so that after the first plastic encapsulation body 401 is formed in the first concave cavity 301, it can be smoothly demolded. In order to smoothly demold, the corners of the first concave cavity 301 can be circular chamfers or obtuse chamfers. When the second concave cavity 302 is not used for plastic encapsulation but used as a shielding cavity, the corners in the second concave cavity 302 can be right-angled chamfers, and the cross section of the second concave cavity 302 perpendicular to the substrate 100 can be rectangular, etc.
[0055] In some other embodiments of the present application, when the second concave cavity 302 is used as a plastic packaging cavity, the opening area of the second concave cavity 302 can be larger than the bottom area of the second concave cavity 302. For example, the cross-section of the second concave cavity 302 can be trapezoidal, and the corners of the second concave cavity 302 can be arc-shaped chamfers or obtuse chamfers.
[0056] In this embodiment, Figure 7 As shown, after the first type electronic component 201 is plastic-sealed using the special-shaped mold 300 to form a first plastic-sealed body 401, a conventional mold (i.e., a non-special-shaped mold) can be used to plastic-seale the second type electronic component 202 to form a second plastic-sealed body 402. The second plastic-sealed body 402 wraps the second type electronic component 202, the isolation film 103 and the first plastic-sealed body 401, and the second plastic-sealed body 402 is surrounded by the outside of the second cavity 102.
[0057] In this embodiment, Figure 7 As shown, the second plastic package 402 can cover the sidewalls of the first plastic package 401 and the top surface away from the substrate 100. In other embodiments, the second plastic package 402 can only cover the sidewalls of the first plastic package 401 and expose the top surface of the first plastic package 401, which helps to reduce the thickness of the packaging module.
[0058] In some other embodiments of the present application, the second type electronic component 202 can be encapsulated using a special-shaped mold 300 to form a second encapsulated body 402, the second encapsulated body 402 exposing the arrangement area of the first type electronic component 201 on the substrate 100, and then the first type electronic component 201 is encapsulated using a conventional mold to form a first encapsulated body 401, and the first encapsulated body 401 wraps the second encapsulated body 402. When the second type electronic component 202 is encapsulated using the special-shaped mold 300, the second concave cavity 302 is filled with encapsulating material, and the first concave cavity 301 is not filled with encapsulating material.
[0059] This embodiment provides a packaging module. Figure 7As shown, the packaging module includes a substrate 100, a first type electronic component 201, a second type electronic component 202, a first plastic sealing body 401 and a second plastic sealing body 402; the first type electronic component 201 and the second type electronic component 202 are mounted on the first surface of the substrate 100, the first plastic sealing body 401 and the second plastic sealing body 402 are both located on the first surface of the substrate 100, the first plastic sealing body 401 wraps the first type electronic component 201, the plastic sealing material of the first plastic sealing body 401 fills the first gap 101a between the first type electronic component 201 and the substrate 100, the second plastic sealing body 402 wraps the second type electronic component 202, the second plastic sealing body 402 surrounds the outside of the second cavity 102 between the second type electronic component 202 and the substrate 100, and one of the first plastic sealing body 401 and the second plastic sealing body 402 wraps the other of the two.
[0060] In this embodiment, the second type electronic component 202 may be a chip that is sensitive to molding, specifically, a filter chip or a chip that is prone to cracking under high pressure. The filter chip may be a bare chip level filter chip or a wafer level package filter chip. Figure 7 As shown, the surface of the second type electronic component 202 has a second bump 202a, and the second bump 202a supports the second cavity 102 between the second type electronic component 202 and the substrate 100. The second bump 202a can be soldered on the substrate 100 and serves as a signal port of the second type electronic component 202. When the second type electronic component 202 is a surface acoustic wave (SAW) filter chip, an interdigital transducer (IDT) is also formed on the surface of the second type electronic component 202 having the second bump 202a, and the second cavity 102 is used to ensure the normal operation of the interdigital transducer.
[0061] The first type electronic component 201 may be a chip that is not sensitive to molding, and specifically, may be a non-filter chip or a chip that can withstand high voltage. The first type electronic component 201 may also be a passive device, such as a capacitor or a resistor. For example, Figure 2 As shown, the first type electronic component 201 can be a flip chip, and the surface of the first type electronic component 201 has a first bump 201a, the first bump 201a is welded on the substrate 100 and serves as a signal port of the first type electronic component 201, and the first bump 201a supports the first gap 101a between the first type electronic component 201 and the substrate 100.
[0062] like Figure 7 As shown, in this embodiment, the second plastic sealing body 402 wraps the first plastic sealing body 401 as an example for description. In other embodiments, the first plastic sealing body 401 can wrap the second plastic sealing body 402.
[0063] like Figure 7As shown, the packaging module may further include an isolation film 103 , which at least covers the sidewalls of the second type electronic component 202 and the surface away from the substrate 100 , and the isolation film 103 seals the second gap between the second type electronic component 202 and the substrate 100 to form a second cavity 102 .
[0064] In this embodiment, the isolation film 103 covers the first type electronic component 201 and the second type electronic component 202, and the isolation film 103 on the side of the first gap 101a has a gap. The molding material of the first plastic packaging body 401 is partially located on the isolation film 103 and partially passes through the gap to fill the first gap 101a.
[0065] In this embodiment, Figure 7 As shown, the first plastic package body 401 covers the arrangement area of the first type electronic components 201 on the substrate 100 and leaves a space for the arrangement area of the second type electronic components 202 on the substrate 100 , and the second plastic package body 402 covers the second type electronic components 202 , the isolation film 103 and the first plastic package body 401 .
[0066] The first plastic package body 401 has a bottom surface close to the substrate 100 and a top surface away from the substrate 100. Taking the first plastic package body 401 made by a special-shaped mold as an example, the area of the top surface of the first plastic package body 401 is smaller than the area of the bottom surface. Exemplarily, the cross section of the first plastic package body 401 is a trapezoid. The top corner of the first plastic package body 401 can be a circular chamfer or an obtuse chamfer.
[0067] In this embodiment, the materials of the first plastic sealing body 401 and the second plastic sealing body 402 may be the same. In other embodiments, the materials of the first plastic sealing body 401 and the second plastic sealing body 402 may be different.
[0068] In another embodiment, the second plastic packaging body 402 can be made by a special-shaped mold, the second plastic packaging body 402 covers the arrangement area of the second type electronic components 202 on the substrate 100 and leaves the arrangement area of the first type electronic components 201 on the substrate 100 empty, and the first plastic packaging body 401 covers the second plastic packaging body 402.
[0069] Embodiment 2
[0070] Figure 8 A schematic flow chart of a method for manufacturing a packaging module provided in Embodiment 2 of the present invention. Figures 9 to 12 A schematic diagram of the steps of the method for manufacturing a packaging module provided in the second embodiment of the present invention.
[0071] Fig.13 This is a schematic diagram of the structure of the packaging module provided in the second embodiment of the present invention. Figures 8 to 13 The manufacturing method of the packaging module provided in this embodiment is described.
[0072] like Figure 8 As shown, the method for manufacturing a packaging module provided in this embodiment includes steps S1 to S5.
[0073] Step S1, such as Fig. 9 As shown, a substrate 100 is provided, and a first type electronic component 201 is mounted on a first surface of the substrate 100 , with a first gap 101 a between the first type electronic component 201 and the substrate 100 .
[0074] Step S2, such as Fig.10 As shown, the first type electronic component 201 is encapsulated by using a special-shaped mold 300 to form a first encapsulation body 401, which wraps the first type electronic component 201 and fills the first gap 101a, and the first encapsulation body 401 exposes the arrangement area of the second type electronic component 202 on the substrate 100. Fig.11 As shown, the special-shaped mold 300 is removed after the first plastic package body 401 is formed.
[0075] Step S3, such as Fig.11 As shown, the second type electronic component 202 is mounted on the substrate 100 .
[0076] Step S4, such as Fig.12 As shown, an isolation film 103 is attached to the first surface of the substrate 100 , the isolation film 103 covers the first plastic package 401 and the second type electronic component 202 , and the isolation film 103 seals the second gap between the second type electronic component 202 and the substrate 100 to form a second cavity 102 .
[0077] Step S5, such as Fig.13 As shown, a second plastic packaging body 402 is formed on the isolation film 103 , and the second plastic packaging body 402 wraps the second type electronic component 202 , the isolation film 103 and the first plastic packaging body 401 . The second plastic packaging body 402 surrounds the outside of the second cavity 102 .
[0078] The molding methods used to form the first plastic package body 401 and the molding methods used to form the second plastic package body 402 are different.
[0079] It should be noted that, in this embodiment, after the first plastic packaging body 401 is formed, the second type electronic component 202 is installed on the substrate 100, which can prevent the second type electronic component 202 from being damaged during the process of forming the first plastic packaging body 401, and thus the special-shaped mold 300 may not be provided with a concave cavity (such as the second concave cavity 302) corresponding to the position of the second type electronic component 202, which can simplify the structure of the special-shaped mold 300 and simplify the manufacturing process of the special-shaped mold 300.
[0080] This embodiment provides a packaging module. Fig.13As shown, the packaging module includes a substrate 100, a first type electronic component 201, a second type electronic component 202, a first plastic sealing body 401 and a second plastic sealing body 402; the first type electronic component 201 and the second type electronic component 202 are mounted on the first surface of the substrate 100, the first plastic sealing body 401 and the second plastic sealing body 402 are both located on the first surface, the first plastic sealing body 401 wraps the first type electronic component 201, the plastic sealing material of the first plastic sealing body 401 fills the first gap 101a between the first type electronic component 201 and the substrate 100, the second plastic sealing body 402 wraps the first plastic sealing body 401 and the second type electronic component 202, and the second plastic sealing body 402 surrounds the outside of the second cavity 102 between the second type electronic component 202 and the substrate 100.
[0081] The packaging module further includes an isolation film 103 . The isolation film 103 covers the second type electronic component 202 and the first plastic package body 401 . The isolation film 103 seals the second gap between the second type electronic component 202 and the substrate 100 to form a second cavity 102 .
[0082] In this embodiment, the second plastic packaging body 402 is located above the isolation film 103 , and the second plastic packaging body 402 covers the isolation film 103 and the first plastic packaging body 401 .
[0083] In this embodiment, the first plastic package body 401 has a bottom surface close to the substrate 100 and a top surface away from the substrate 100. The first plastic package body 401 is made by a special-shaped mold, and the area of the top surface of the first plastic package body 401 is smaller than the area of the bottom surface. For example, the cross section of the first plastic package body 401 is a trapezoid. The top corner of the first plastic package body 401 can be a circular chamfer or an obtuse chamfer.
[0084] In this embodiment, the materials of the first plastic sealing body 401 and the second plastic sealing body 402 may be the same. In other embodiments, the materials of the first plastic sealing body 401 and the second plastic sealing body 402 may be different.
[0085] Embodiment 3
[0086] This embodiment provides a method for manufacturing a packaging module. Figure 14 to Figure 15 The method for making a package module of the third embodiment of the present invention is schematically shown in steps. The method for making a package module of the present embodiment has some of the same steps as the method for making a package module of the second embodiment, so the method for making a package module of the third embodiment is introduced with reference to some of the drawings of the second embodiment.
[0087] The method for manufacturing the packaging module comprises the following steps: Fig.14As shown, a substrate 100 is provided, and a first type electronic component 201 and a second electronic component 202 are mounted on a first surface of the substrate 100, with a first gap 101a between the first type electronic component 201 and the substrate 100, and a second gap 102a between the second type electronic component 202 and the substrate 100; Fig.15 As shown, the first type electronic component 301 is plastic-sealed using a special-shaped mold 300 to form a first plastic-sealed body 401, the first plastic-sealed body 401 wraps the first type electronic component 201 and fills the first gap 101a, and the first plastic-sealed body 401 exposes the arrangement area of the second type electronic component 202 on the substrate 100; Fig.11 As shown, the special-shaped mold 300 is removed; Fig.12 As shown, an isolation film 103 is attached to the first surface of the substrate 100, the isolation film 103 covers the first plastic package 401 and the second type electronic component 202, and the isolation film 103 seals the second gap between the second type electronic component 202 and the substrate 100 to form a second cavity 102; Fig.13 As shown, a second plastic package 402 is formed on the isolation film 103, and the second plastic package 402 wraps the second type electronic component 202, the isolation film 103 and the first plastic package 401, and the second plastic package 402 surrounds the outside of the second cavity 102. The first plastic package 401 and the second plastic package 402 are formed by different molding methods.
[0088] It should be noted that, in this embodiment, the first type chip 201 and the second type chip 202 are both mounted on the first surface of the substrate 100 and then a special-shaped mold 300 is used to form a first plastic package 401. In order to protect the second type electronic component 202, the special-shaped mold 300 needs to have a second concave cavity 302 corresponding to the position of the second type electronic component 202 as a shielding cavity.
[0089] It should be noted that the second and third embodiments of the present application focus on the differences from the first embodiment, and the similarities between the embodiments can be referenced to each other.
[0090] The above description is only a description of the preferred embodiment of the present invention, and is not any limitation on the scope of rights of the present invention. Any technical personnel in this field can make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.
Claims
1. A method for manufacturing a packaging module, characterized in that: The invention comprises using a special-shaped mold to perform plastic encapsulation on one of a first type of electronic component and a second type of electronic component located on a first surface of a substrate, and then performing plastic encapsulation on the first type of electronic component and the second type of electronic component as a whole; wherein, through the two plastic encapsulations, the plastic encapsulation material fills the first gap between the first type of electronic component and the substrate, while the second cavity between the second type of electronic component and the substrate is retained.
2. The method for manufacturing a packaging module according to claim 1, wherein: The method for manufacturing the packaging module comprises the following steps: Providing a substrate, mounting the first type electronic component and the second type electronic component on a first surface of the substrate; An isolation film is attached to the first surface of the substrate, the isolation film covers the first type electronic component and the second type electronic component, the isolation film seals a first gap between the first type electronic component and the substrate to form a first cavity, and seals a second gap between the second type electronic component and the substrate to form a second cavity; and Plastic-sealing the first type of electronic components to form a first plastic-sealed body, and plastic-sealing the second type of electronic components to form a second plastic-sealed body; The first plastic package body or the second plastic package body is made by using the special-shaped mold, and the molding methods used to form the first plastic package body and the second plastic package body are different. The plastic packaging material of the first plastic package body breaks through the isolation film of the side wall of the first cavity and fills the first gap. The second plastic package body wraps the second type of electronic component and surrounds the outside of the second cavity. One of the first plastic package body and the second plastic package body wraps the other one.
3. The method for manufacturing a packaging module according to claim 2, wherein: The first type of electronic components are plastic-sealed using the special-shaped mold to form the first plastic-sealed body, wherein the first plastic-sealed body exposes the arrangement area of the second type of electronic components on the substrate, and the second plastic-sealed body formed subsequently wraps the first plastic-sealed body; or, the second type of electronic components are plastic-sealed using the special-shaped mold to form a second plastic-sealed body, wherein the second plastic-sealed body exposes the arrangement area of the first type of electronic components on the substrate, and the first plastic-sealed body formed subsequently wraps the second plastic-sealed body.
4. The method for manufacturing a packaging module according to claim 1, wherein: The method for manufacturing the packaging module comprises the following steps: Providing a substrate, mounting the first type of electronic component on a first surface of the substrate, with a first gap between the first type of electronic component and the substrate; Using the special-shaped mold to perform plastic sealing on the first type of electronic components to form a first plastic sealing body, wherein the first plastic sealing body wraps the first type of electronic components and fills the first gap, and the first plastic sealing body exposes the arrangement area of the second type of electronic components on the substrate; mounting the second type of electronic component on the substrate; A separation film is attached to the first surface of the substrate, the separation film covers the first plastic package body and the second type electronic component, and the separation film seals a second gap between the second type electronic component and the substrate to form a second cavity; and A second plastic packaging body is formed on the isolation film, the second plastic packaging body wraps the second type electronic component, the isolation film and the first plastic packaging body, and the second plastic packaging body surrounds the outside of the second cavity.
5. The method for manufacturing a packaging module according to claim 1, wherein: The special-shaped mold includes at least one first concave cavity and at least one second concave cavity, the first concave cavity corresponds to the position of the first type of electronic component, and the second concave cavity corresponds to the position of the second type of electronic component; When the first type of electronic component is encapsulated using the special-shaped mold, the first concave cavity is filled with molding compound and the second concave cavity is not filled with molding compound; or, when the second type of electronic component is encapsulated using the special-shaped mold, the second concave cavity is filled with molding compound and the first concave cavity is not filled with molding compound.
6. The method for manufacturing a packaging module according to claim 5, characterized in that: The opening area of the first concave cavity is larger than the bottom area of the first concave cavity, and / or the opening area of the second concave cavity is larger than the bottom area of the second concave cavity.
7. The method for manufacturing a packaging module according to claim 5, characterized in that: The corners of the first concave cavity are circular chamfered or obtuse chamfered, and / or the corners of the second concave cavity are circular chamfered or obtuse chamfered.
8. The method for manufacturing a packaging module according to any one of claims 1 to 7, characterized in that: The second type of electronic component is a filter chip, and the first type of electronic component is a non-filter chip.
9. A packaging module, characterized in that: It includes a substrate, a first type electronic component, a second type electronic component, a first plastic packaging body and a second plastic packaging body; the first type electronic component and the second type electronic component are mounted on a first surface of the substrate, the first plastic packaging body and the second plastic packaging body are both located on the first surface, the first plastic packaging body wraps the first type electronic component, the plastic packaging material of the first plastic packaging body fills the first gap between the first type electronic component and the substrate, the second plastic packaging body wraps the second type electronic component, the second plastic packaging body surrounds the outside of a second cavity between the second type electronic component and the substrate, and one of the first plastic packaging body and the second plastic packaging body wraps the other of the two.
10. The packaging module according to claim 9, characterized in that: The packaging module further includes an isolation film, which covers at least the side wall of the second type electronic component and a surface away from the substrate, and the isolation film seals a second gap between the second type electronic component and the substrate to form the second cavity.
11. The packaging module according to claim 10, characterized in that: The isolation film covers the first type electronic component and the second type electronic component, the isolation film on the side of the first gap has a gap, and the first plastic package body is partially located on the isolation film and partially passes through the gap to fill the first gap.
12. The packaging module according to claim 11, characterized in that: The first plastic packaging body covers the arrangement area of the first type of electronic components on the substrate and leaves a space for the arrangement area of the second type of electronic components on the substrate, and the second plastic packaging body covers the isolation film and the first plastic packaging body.
13. The packaging module according to claim 11, characterized in that: The second plastic packaging body covers the arrangement area of the second type of electronic components on the substrate and leaves a arrangement area of the first type of electronic components on the substrate free, and the first plastic packaging body covers the second plastic packaging body.
14. The packaging module according to claim 10, characterized in that: The isolation film covers the second type electronic component and the first plastic packaging body, and the second plastic packaging body is located above the isolation film and covers the first plastic packaging body.
15. The packaging module according to claim 12 or 14, characterized in that: The first plastic package body has a bottom surface close to the substrate and a top surface away from the substrate, and an area of the top surface is smaller than an area of the bottom surface.
16. The packaging module according to claim 15, characterized in that: The top corner of the first plastic package body is an arc chamfer or an obtuse chamfer.
17. The packaging module according to claim 9, characterized in that: The first plastic packaging body and the second plastic packaging body are made of the same or different materials.
18. The packaging module according to claim 9, wherein: The second type of electronic component is a filter chip, and the first type of electronic component is a non-filter chip.