Heat dissipation loudspeaker box for notebook computer

Abstract

The invention discloses a notebook computer heat dissipation sound box, which comprises a heat dissipation base, a heat dissipation cover, a heat dissipation cover, a heat dissipation cover and a heat dissipation cover, the heat dissipation base is provided with a hollow plate-shaped structure, and one side of the heat dissipation base is provided with a cylindrical sound box loading part; the air cooling heat dissipation assembly is arranged in the heat dissipation base; the air cooling heat dissipation assembly is provided with a second mounting plate, a plug-in base sleeve is arranged on one side face of the second mounting plate, a first auxiliary heat dissipation plate is arranged on one side of the second mounting plate, the first auxiliary heat dissipation plate and the plug-in base sleeve are arranged on the same side, and a second auxiliary heat dissipation plate is arranged on one side of the second mounting plate. The first auxiliary heat dissipation plate and the second auxiliary heat dissipation plate are of wedge-shaped plate-shaped structures, and the thickness of the first auxiliary heat dissipation plate and the thickness of the second auxiliary heat dissipation plate are gradually reduced in the direction away from the second installation plate. The air cooling heat dissipation assembly and the water cooling heat dissipation assembly are used for conducting heat dissipation on the loudspeaker box loading part and the notebook computer at the same time, efficient heat dissipation is achieved, and meanwhile the problems that dust is prone to entering the loudspeaker box loading part, and the compressive strength of the heat dissipation base is insufficient are solved.

Description

Technical Field

[0001] The invention relates to the technical field of audio playing equipment, in particular to a heat dissipating speaker box for a notebook computer. Background Art

[0002] A speaker is an audio playback device that can be used not only in outdoor stages, theaters, conference halls, etc., but also in laptops or desktop computers. Since the power amplifier will generate a lot of heat when working, the aluminum radiator that comes with the speaker cannot eliminate the impact on the laptop computer when it is working. The heat generated by the laptop computer and the speaker itself will cause the temperature to continue to rise when it meets. In addition, since speakers are mostly made of lightweight, flammable materials that are conducive to sound transmission, such as wooden boxes, paper unit boxes, sound-absorbing cotton, etc., there is a risk of fire when they work continuously with a laptop computer.

[0003] The prior art discloses a heat dissipation device with a sound output function (US20100046169A1), which includes a base for placing an audio / video player thereon, the base having an inclined surface, a fan arranged under the inclined surface to dissipate heat generated from the audio / video player, the base including a sound output component, the sound output component including a left channel, a right channel, a center channel and a subwoofer channel, the base having an audio input jack arranged on the rear side thereof for connecting to an audio cable, when the audio cable is connected between the audio / video player and the audio input jack, the sound of the audio / video player can be played back through the sound output component to form a surround sound effect, but the heat dissipation effect on the laptop computer and the speaker is not good, and there is no dustproof measure for the speaker. Summary of the invention

[0004] The purpose of the present invention is to provide a notebook computer heat dissipation speaker to solve the problems of poor notebook computer heat dissipation, inability to dissipate heat simultaneously between the notebook computer and the speaker, and easy heat accumulation when the notebook computer and the speaker work together.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a notebook computer heat dissipation speaker, comprising a heat dissipation base, the heat dissipation base having a hollow plate-like structure, a cylindrical speaker loading part being provided on one side of the heat dissipation base, an air flow area being provided below the heat dissipation base, one side of the heat dissipation base being bent to form a support part, the speaker loading part being located on the opposite side of the support part, an audio connection end being provided on the speaker loading part, speaker ports being provided at both ends of the speaker loading part, a notebook computer being placed on the heat dissipation base, a non-slip protrusion being provided at the bottom of the notebook computer, and a heat dissipation port being provided on one side of the notebook computer; An air-cooled heat dissipation component is provided inside the heat dissipation base; The air-cooled heat dissipation component comprises a second mounting plate, a plug-in base sleeve is arranged on one side surface of the second mounting plate, a first auxiliary heat dissipation plate is arranged on one side of the second mounting plate, the first auxiliary heat dissipation plate and the plug-in base sleeve are arranged on the same side, a second auxiliary heat dissipation plate is arranged on one side of the second mounting plate, the first auxiliary heat dissipation plate and the second auxiliary heat dissipation plate have a wedge-shaped plate structure, the thickness of the first auxiliary heat dissipation plate and the second auxiliary heat dissipation plate gradually decreases along the direction away from the second mounting plate, adjacent second auxiliary heat dissipation plates are symmetrically provided with heat absorbing plates, the heat absorbing plates have a wedge-shaped plate structure, the heat absorbing plates are arranged close to the end of the second auxiliary heat dissipation plate, a heat conducting member is arranged between adjacent heat absorbing plates, and the end of the second auxiliary heat dissipation plate is located inside the speaker loading part; The laptop computer heat dissipation speaker box simultaneously dissipates heat from the speaker box loading part and the laptop computer by combining an air-cooling heat dissipation component with a water-cooling heat dissipation component, thereby achieving efficient heat dissipation while avoiding heat accumulation, and also avoiding problems such as dust easily entering the speaker box loading part and insufficient compressive strength of the heat dissipation base; The heat dissipation speaker of the notebook computer can dissipate heat for the notebook computer placed on the heat dissipation base through the air-cooling heat dissipation assembly provided in the heat dissipation base, and can also dissipate heat for the related components of the sound system inside the speaker loading part. Specifically, the air-cooling fan of the air-cooling heat dissipation assembly can drive the air flow downward when working, and continuously take away the heat absorbed by the air-cooling heat dissipation plate on the air-cooling heat dissipation base, so that the heat absorbed by the second auxiliary heat dissipation plate on the second mounting plate adjacent to it from the speaker loading part is continuously transferred to the first auxiliary heat dissipation plate and the air-cooling heat dissipation base, wherein the first auxiliary heat dissipation plate can be abutted or plugged with the air-cooling heat dissipation plate according to actual needs, so as to reduce the internal temperature of the speaker loading part, thereby achieving the heat dissipation of the notebook computer and the speaker loading part. on the other hand, the second auxiliary heat sink cooperates with the water-cooled heat sink to speed up the heat transfer rate, and no airflow enters the interior of the speaker loading part during the entire heat dissipation process, thereby preventing dust from entering the speaker loading part with the airflow, thereby preventing dust particles, water vapor, etc. from interfering with or damaging the sound system in the speaker loading part; on the other hand, the second mounting plate and the first auxiliary heat sink and the second auxiliary heat sink provided thereon make the heat distribution in the mounting area thereof uniform, that is, the heat in the speaker loading part and part of the heat inside the heat sink base will be concentrated to the air-cooled heat sink and its vicinity for discharge, and the temperature difference between the first auxiliary heat sink, the second auxiliary heat sink and the air-cooled heat sink will be reduced, thereby reducing the overall ambient temperature in the heat sink base; On the other hand, the part of the second auxiliary heat sink located in the speaker loading part further enhances the heat transfer effect between the second auxiliary heat sinks through the combination of the heat absorption plate and the heat conductor, and improves the heat absorption and transfer rate inside the speaker loading part. It can also have a shock-absorbing effect on the second auxiliary heat sink, so as to avoid the long-term sound vibration from being continuously transmitted to the air tightness of the welding connection between the second auxiliary heat sink and the side wall of the speaker loading part when the audio system is working. Specifically, in the actual production and manufacturing process, the heat conductor is an easy-to-conduct heat-conducting component with a spiral structure, and its installation method can pass through all the second auxiliary heat sinks according to actual needs, rather than only adopting the method of installing the heat conductor between each adjacent two heat absorption plates, so as to reduce manufacturing costs and installation hours; on the other hand, when only a laptop computer is used and the heat dissipation base is not powered on for heat dissipation, the air-cooled heat sink and the first auxiliary heat sink can also absorb the heat generated by the laptop computer when it is working, and transfer it to the second auxiliary heat sink, so that the heat in the heat dissipation base is evenly diffused into the speaker loading part, which not only expands the heat dissipation space of the heat dissipation base, but also has a moisture-proof effect on the inside of the speaker loading part.

[0006] The air-cooled heat dissipation component also has an air-cooled heat dissipation base, which has a square structure formed by a plurality of air-cooled heat dissipation plates arranged in an arrangement. A first mounting plate is provided on the outer side of the air-cooled heat dissipation base, and a plug-in bent rod is fixedly connected to the first mounting plate. The plug-in bent rod has a bent round rod-shaped structure. An air-cooled fan is provided in the middle of the air-cooled heat dissipation base, and a fixed end is provided on the air-cooled heat dissipation base.

[0007] The second mounting plate is parallel to the first mounting plate and is arranged outside the air-cooling heat dissipation base body, and the plug-in bent rod is plugged into the inside of the plug-in base sleeve.

[0008] The inner bottom surface of the heat dissipation base is provided with a guide chute corresponding to the position of the air-cooled heat dissipation component; The heat dissipation speaker box for a laptop computer guides the hot air flow discharged from the air-cooled heat dissipation component to flow toward one side of the heat dissipation base by setting a guide chute, so as to prevent the downward hot air flow from being dispersed when it contacts the inner bottom surface of the heat dissipation base, thereby utilizing the air pressure difference to promote the flow of air below the heat dissipation base. It should be noted that according to the conventional structure of the laptop computer, the CPU and the heat dissipation and heat dissipation ports are all arranged on the left side, so the guide chute is inclined to the direction of the heat dissipation port of the laptop computer to facilitate achieving a better heat dissipation effect.

[0009] A water-cooled heat dissipation component is arranged inside the heat dissipation base, the water-cooled heat dissipation component has a water-cooled heat dissipation base, a micro water pump is arranged inside the heat dissipation base, a water-cooled heat exchange component is arranged outside the heat dissipation base, and the water-cooled heat dissipation base, the water-cooled heat exchange component and the micro water pump are connected through a water-cooled transmission pipe.

[0010] The water-cooling transmission pipe runs through the middle of the second auxiliary heat sink.

[0011] The water-cooled heat dissipation base has a circular third mounting plate, a first rotating shaft is coaxially arranged in the middle of the third mounting plate, an assembly ring is coaxially fixedly connected to the first rotating shaft, a plurality of rotating blades are equidistantly arranged on the outer wall of the assembly ring in a circumferential direction, a second rotating shaft is coaxially arranged on the upper axial surface of the first rotating shaft, a plurality of guide blades are circumferentially arranged on the side wall of the second rotating shaft, the water-cooled heat dissipation base has a circular third mounting plate, a water-cooled transmission ring is arranged above the third mounting plate, and a plurality of shock-absorbing rubber pads are arranged below the third mounting plate.

[0012] The water-cooled transmission ring has an open circular ring structure. A plurality of water-cooled heat sinks are circumferentially arranged between the water-cooled transmission ring and the third mounting plate. The water-cooled transmission ring penetrates the water-cooled heat sinks. The two ends of the water-cooled transmission ring are respectively connected to a water inlet and a water outlet. The laptop computer heat dissipation speaker box provides a plurality of combined heat exchange modes and heat exchange paths for the laptop computer and the sound system through a water-cooled heat dissipation component, which not only realizes efficient heat dissipation, but also increases the overall compressive strength of the hollow structure inside the heat dissipation base. Specifically, one end of the first rotating shaft is axially connected to the inner bottom surface of the heat dissipation base, and the other end thereof is axially connected to the second rotating shaft, and the second rotating shaft is simultaneously axially connected to the inner wall of the top surface of the heat dissipation base, so as to maintain the overall compressive strength of the hollow structure inside the heat dissipation base, and prevent the laptop computer from being placed on the heat dissipation base for a long time, resulting in a concave deformation or thermal deformation in the middle part thereof; on the other hand, the air flow inside the heat dissipation base will generate a certain flow under the influence of the air-cooled heat dissipation component, and the guide vane will first drive the second rotating shaft to rotate under the influence of this air flow, and then the second rotating shaft will drive the first rotating shaft to rotate, and the first rotating shaft will then drive the rotary blade to rotate, so that the rotary blade can increase the air flow rate in the water-cooled heat sink area, and promote the heat absorption effect of the water-cooled heat sink.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. The laptop computer heat dissipation speaker, through the arrangement of the air-cooling heat dissipation component, can dissipate heat for the laptop computer placed on the heat dissipation base, and can also dissipate heat for the components related to the sound system inside the speaker loading part, and prevent dust from entering the speaker loading part with the air flow, thereby preventing dust particles, water vapor, etc. from interfering with or damaging the sound system inside the speaker loading part; 2. The heat dissipation speaker for a laptop computer further enhances the heat transfer effect between the second auxiliary heat sink through the combination of the heat absorption plate and the heat conductive member, thereby increasing the heat absorption and transfer rate inside the speaker loading part. It can also provide a shock absorbing effect on the second auxiliary heat sink, thereby preventing the sound vibration from being continuously transmitted to the airtightness of the welded connection between the second auxiliary heat sink and the side wall of the speaker loading part when the sound system is working; 3. This laptop cooling speaker provides a variety of heat exchange modes and paths for the laptop and the sound system through a water cooling component, which not only achieves efficient heat dissipation, but also increases the overall compressive strength of the hollow structure inside the heat dissipation matrix; 4. The notebook computer cooling speaker uses the flow effect of the airflow inside the cooling base under the influence of the air-cooling heat dissipation component to drive the guide blades and the rotor blades to rotate, so that the rotor blades can increase the airflow rate in the water-cooling heat sink area and promote the heat absorption effect of the water-cooling heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic structural diagram of a preferred embodiment of a notebook computer heat dissipation speaker provided by the present invention; Figure 2 for Figure 1 Side view of Figure 3 for Figure 1 A schematic diagram of the structure of the heat dissipation base shown; Figure 4 for Figure 3 Side view of Figure 5 for Figure 3 A top view of Figure 6 for Figure 5 A partial cross-sectional view of Figure 7 for Figure 6 The structural schematic diagram of the air-cooled heat dissipation component shown; Figure 8 for Figure 7 Enlarged view of middle Ⅰ-Ⅰ; Fig. 9 for Figure 7 A schematic structural diagram of a second auxiliary heat sink is shown; Fig.10 for Fig. 9 Enlarged view of middle II-II; Fig.11 for Figure 6 A schematic diagram of the structure of a water-cooling heat dissipation substrate in the water-cooling heat dissipation assembly shown; Fig.12 for Fig.11 Another view of the .

[0015] In the figure: 1. heat dissipation base; 11. support part; 12. speaker loading part; 121. audio connection end; 122. speaker port; 13. laptop computer; 131. anti-skid protrusion; 132. heat dissipation port; 14. vent; 15. heat dissipation rotor; 16. air flow area; 17. guide chute; 2. air-cooled heat dissipation assembly; 21. air-cooled heat dissipation base; 211. air-cooled heat dissipation plate; 212. first mounting plate; 213. plug-in bent rod; 22. air-cooled fan; 23. second mounting plate; 231. plug-in base sleeve; 24. An auxiliary heat sink; 25, a second auxiliary heat sink; 251, a heat absorbing plate; 252, a heat conducting member; 26, a fixed end; 3, a water-cooled heat sink assembly; 31, a water-cooled heat sink substrate; 311, a third mounting plate; 312, a water-cooled heat sink; 313, a first rotating shaft; 314, an assembly ring; 315, a rotary blade; 316, a second rotating shaft; 317, a guide blade; 32, a water-cooled heat exchange member; 33, a micro water pump; 34, a water-cooled transmission ring; 35, a shock-absorbing rubber pad; 36, a water-cooled transmission pipe; 37, a water inlet end; 38, a water outlet end. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] See also Figure 1-10 , an embodiment of the present invention: a notebook computer heat dissipation speaker, comprising: a heat dissipation base 1, the heat dissipation base 1 has a hollow plate-like structure, a cylindrical speaker loading part 12 is provided on one side of the heat dissipation base 1, an air flow area 16 is provided below the heat dissipation base 1, one side of the heat dissipation base 1 is bent to form a support part 11, the speaker loading part 12 is located on the opposite side of the support part 11, an audio connection end 121 is provided on the speaker loading part 12, and both ends of the speaker loading part 12 are provided with speaker ports 122, a notebook computer 13 is placed on the heat dissipation base 1, a non-slip protrusion 131 is provided at the bottom of the notebook computer 13, and a heat dissipation port 132 is opened on one side of the notebook computer 13; An air-cooled heat dissipation component 2 is provided inside the heat dissipation base 1; The air-cooling heat dissipation component 2 has a second mounting plate 23, a plug-in base sleeve 231 is provided on one side of the second mounting plate 23, a first auxiliary heat sink 24 is provided on one side of the second mounting plate 23, the first auxiliary heat sink 24 and the plug-in base sleeve 231 are arranged on the same side, a second auxiliary heat sink 25 is provided on one side of the second mounting plate 23, the first auxiliary heat sink 24 and the second auxiliary heat sink 25 have a wedge-shaped plate structure, the thickness of the first auxiliary heat sink 24 and the second auxiliary heat sink 25 gradually decreases along the direction away from the second mounting plate 23, adjacent second auxiliary heat sinks 25 are symmetrically provided with heat absorbing plates 251, the heat absorbing plates 251 have a wedge-shaped plate structure, the heat absorbing plates 251 are arranged close to the ends of the second auxiliary heat sinks 25, a heat conducting member 252 is provided between adjacent heat absorbing plates 251, the ends of the second auxiliary heat sinks 25 are located inside the speaker loading portion 12, and a fixed end 26 is provided on the air-cooling heat dissipation base 21; The laptop computer heat dissipation speaker box simultaneously dissipates heat for the speaker loading part 12 and the laptop computer 13 by combining the air cooling heat dissipation component 2 and the water cooling heat dissipation component 3, thereby achieving efficient heat dissipation and avoiding the problems of dust easily entering the speaker loading part 12 and insufficient compressive strength of the heat dissipation base 1. The heat dissipation speaker box for a laptop computer has an air-cooling heat dissipation assembly 2 provided in a heat dissipation base 1. On the one hand, it can dissipate heat for a laptop computer 13 placed on the heat dissipation base 1, and at the same time, it can dissipate heat for the audio system-related components inside the speaker loading part 12. Specifically, the air-cooling fan 22 of the air-cooling heat dissipation assembly 2 drives the air flow downward when working, and continuously takes away the heat absorbed by the air-cooling heat sink 211 on the air-cooling heat dissipation base 21, so that the heat absorbed by the second auxiliary heat sink 25 on the second mounting plate 23 adjacent to it from the speaker loading part 12 is continuously transferred to the first auxiliary heat sink 24 and the air-cooling heat sink 21, wherein the first auxiliary heat sink 24 can be abutted or plugged with the air-cooling heat sink 211 according to actual needs, so that the internal temperature of the speaker loading part 12 is reduced, thereby achieving the heat dissipation of the laptop computer 13 and the speaker. The speaker loading part 12 is cooled by the air-cooling heat dissipation component 3, and the second auxiliary heat sink 25 cooperates with the water-cooling heat dissipation component 3 to accelerate the heat transfer rate. During the entire heat dissipation process of the speaker loading part 12, no airflow enters the interior thereof, thereby preventing dust from entering the speaker loading part 12 with the airflow, thereby preventing dust particles, water vapor, etc. from interfering with or damaging the sound system in the speaker loading part 12. On the other hand, the second mounting plate 23 and the first auxiliary heat sink 24 and the second auxiliary heat sink 25 arranged thereon make the heat distribution in the mounting area thereof uniform, that is, the heat in the speaker loading part 12 and part of the heat inside the heat dissipation base 1 will be concentrated to the air-cooling heat dissipation base 21 and its vicinity for discharge, and the temperature difference between the first auxiliary heat sink 24, the second auxiliary heat sink 25 and the air-cooling heat sink 211 will be reduced, thereby reducing the overall ambient temperature in the heat dissipation base 1. On the other hand, the second auxiliary heat sink 25 is located in the part of the speaker loading part 12. The heat transfer effect between the second auxiliary heat sink 25 is further enhanced through the combination of the heat absorption plate 251 and the heat conductive member 252, and the heat absorption and transfer rate inside the speaker loading part 12 is improved. It can also have a shock absorbing effect on the second auxiliary heat sink, so as to avoid the long-term sound vibration from being continuously transmitted to the airtightness of the welding connection between the second auxiliary heat sink 25 and the side wall of the speaker loading part 12 when the sound system is working. Specifically, in the actual production process, the heat conductive member 252 is a heat-conducting component with a spiral structure, and its installation method can be based on actual needs. The second auxiliary heat sink 251 is connected through all the second auxiliary heat sinks, instead of only installing the heat conductor 252 between each two adjacent heat absorbing plates 251, so as to reduce the manufacturing cost and installation time. On the other hand, when only the laptop computer 13 is used without energizing the heat sink 1 for heat dissipation, the air-cooled heat sink 211 and the first auxiliary heat sink 24 can also absorb the heat generated by the laptop computer 13 when it is working, and transfer it to the second auxiliary heat sink 25, so that the heat in the heat sink 1 is evenly diffused into the speaker loading part 12, which not only expands the heat dissipation space of the heat sink 1, but also has a moisture-proof effect on the inside of the speaker loading part 12.

[0018] See also Figure 7-8 The air-cooled heat dissipation component 2 also has an air-cooled heat dissipation base 21. The air-cooled heat dissipation base 21 has a square structure formed by arranging multiple air-cooled heat dissipation plates 211. A first mounting plate 212 is provided on the outer side of the air-cooled heat dissipation base 21. A plug-in bent rod 213 is fixedly connected to the first mounting plate 212. The plug-in bent rod 213 has a bent round rod structure. An air-cooled fan 22 is provided in the middle of the air-cooled heat dissipation base 21.

[0019] See also Figure 7-8 The second mounting plate 23 is parallel to the first mounting plate 212 and is disposed outside the air-cooled heat dissipation base 21 , and the plug-in bent rod 213 is plugged into the plug-in base sleeve 231 .

[0020] See also Figure 6 , a guide chute 17 corresponding to the position of the air-cooling heat dissipation component 2 is provided on the inner bottom surface of the heat dissipation base 1; This kind of laptop computer heat dissipation speaker, through the setting of the guide chute 17, guides the hot air flow discharged from the air-cooled heat dissipation component 2 to flow to one side of the heat dissipation base 1, and prevents the downward hot air flow from being dispersed when it contacts the inner bottom surface of the heat dissipation base 1, thereby utilizing the air pressure difference to promote the flow of air below the heat dissipation base 1. It should be noted that according to the conventional structure of the laptop computer 13, the CPU and the heat dissipation and heat dissipation port 132 are all arranged on the left side, so the guide chute 17 is inclined to the direction of the heat dissipation port 132 of the laptop computer 13, so as to achieve a better heat dissipation effect.

[0021] See also Figure 6 , Figure 11-12 A water-cooled heat dissipation component 3 is provided inside the heat dissipation base 1, and the water-cooled heat dissipation component 3 has a water-cooled heat dissipation base 31. A micro water pump 33 is provided inside the heat dissipation base 1, and a water-cooled heat exchanger 32 is provided outside the heat dissipation base 1. The water-cooled heat dissipation base 31 and the water-cooled heat exchanger 32 and the micro water pump 33 are connected through a water-cooled transmission pipe 36.

[0022] See also Figure 6 The water-cooling transmission pipe 36 runs through the middle of the second auxiliary heat sink 25 .

[0023] See also Figure 6 , Figure 11-12 The water-cooled heat dissipation base 31 has a circular third mounting plate 311, a first rotating shaft 313 is coaxially arranged in the middle of the third mounting plate 311, a mounting ring 314 is coaxially fixedly connected to the first rotating shaft 313, a plurality of rotating blades 315 are circumferentially equidistantly arranged on the outer wall of the mounting ring 314, a second rotating shaft 316 is coaxially arranged on the upper axial surface of the first rotating shaft 313, a plurality of guide blades 317 are circumferentially arranged on the side wall of the second rotating shaft 316, the water-cooled heat dissipation base 31 has a circular third mounting plate 311, a water-cooled transmission ring 34 is arranged above the third mounting plate 311, and a plurality of shock-absorbing rubber pads 35 are arranged below the third mounting plate 311.

[0024] See also Figure 6 , Figure 11-12 The water-cooled transmission ring 34 has an open annular structure. A plurality of water-cooled heat sinks 312 are circumferentially arranged between the water-cooled transmission ring 34 and the third mounting plate 311. The water-cooled transmission ring 34 penetrates the water-cooled heat sink 312. The two ends of the water-cooled transmission ring 34 are respectively connected to a water inlet 37 and a water outlet 38; The laptop computer heat dissipation speaker provides a plurality of combined heat exchange modes and heat exchange paths for the laptop computer 13 and the sound system through the water-cooled heat dissipation component 3, which not only realizes efficient heat dissipation, but also increases the overall compressive strength of the hollow structure inside the heat dissipation matrix. Specifically, one end of the first rotating shaft 313 is axially connected to the inner bottom surface of the heat dissipation base 1, and the other end thereof is axially connected to the second rotating shaft 316, and the second rotating shaft 316 is axially connected to the inner wall of the top surface of the heat dissipation matrix at the same time, so as to maintain the overall compressive strength of the hollow structure inside the heat dissipation matrix, and avoid the laptop computer 13 from being used for a long time. On the other hand, the air flow inside the heat sink 1 will generate a certain flow under the influence of the air-cooled heat sink component 2. Under the influence of this air flow, the guide vane 317 will first drive the second rotating shaft 316 to rotate, and then the second rotating shaft 316 will drive the first rotating shaft 313 to rotate, and the first rotating shaft 313 will drive the rotating blade 315 to rotate, so that the rotating blade 315 can increase the air flow rate in the area of ​​the water-cooled heat sink 312, and promote the heat absorption effect of the water-cooled heat sink 312.

[0025] See also Figure 5-6 , Embodiment 2 provided by the present invention: On the basis of the first embodiment, the heat dissipation base 1 is provided with heat dissipation rotor blades 15 inside, and is provided with a plurality of vents 14, and the vents 14 have a multi-circular hole structure; The startup of the heat dissipation rotor 15, the air-cooled heat dissipation component 2, and the water-cooled heat dissipation component 3 should be set to an intelligent startup mode according to the operating temperature of the laptop CPU. For example, when the CPU temperature is between 25°C and 55°C, start the heat dissipation rotor 15; when the CPU temperature is between 55°C and 70°C, start the air-cooled heat dissipation component 2 simultaneously; when the CPU temperature is above 70°C, start the water-cooled heat dissipation component 3 simultaneously, so as to cope with the heat generated by the laptop under different working conditions through stepped heat dissipation capabilities.

[0026] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A notebook computer heat dissipation speaker, comprising: A heat dissipation base (1), the heat dissipation base (1) having a hollow plate-like structure, a cylindrical sound box loading portion (12) being provided on one side of the heat dissipation base (1), and an air flow area (16) being provided below the heat dissipation base (1); An air-cooling heat dissipation component (2), wherein the heat dissipation base (1) is provided with an air-cooling heat dissipation component (2); Features: The air-cooled heat dissipation component (2) comprises a second mounting plate (23), a plug-in base sleeve (231) is provided on one side of the second mounting plate (23), a first auxiliary heat dissipation plate (24) is provided on one side of the second mounting plate (23), the first auxiliary heat dissipation plate (24) and the plug-in base sleeve (231) are arranged on the same side, a second auxiliary heat dissipation plate (25) is provided on one side of the second mounting plate (23), the first auxiliary heat dissipation plate (24) and the second auxiliary heat dissipation plate (25) have a wedge-shaped plate structure, and the first auxiliary heat dissipation plate (24) and the second auxiliary heat dissipation plate (25) have a wedge-shaped plate structure. The thickness of the plate (24) and the second auxiliary heat sink (25) gradually decreases in a direction away from the second mounting plate (23); heat absorbing plates (251) are symmetrically arranged on adjacent second auxiliary heat sinks (25); the heat absorbing plates (251) have a wedge-shaped plate structure; the heat absorbing plates (251) are arranged close to the ends of the second auxiliary heat sinks (25); a heat conducting member (252) is arranged between adjacent heat absorbing plates (251); and the ends of the second auxiliary heat sinks (25) are located inside the speaker loading portion (12).

2. The notebook computer heat dissipation speaker according to claim 1, characterized in that: The air-cooling heat dissipation component (2) further comprises an air-cooling heat dissipation base (21), the air-cooling heat dissipation base (21) having a square structure formed by arranging a plurality of air-cooling heat dissipation plates (211), a first mounting plate (212) being provided on the outer side of the air-cooling heat dissipation base (21), a plug-in bent rod (213) being fixedly connected to the first mounting plate (212), the plug-in bent rod (213) having a bent round rod-shaped structure, an air-cooling fan (22) being provided in the middle of the air-cooling heat dissipation base (21), and a fixed end (26) being provided on the air-cooling heat dissipation base (21).

3. The notebook computer heat dissipation speaker according to claim 2, characterized in that: The second mounting plate (23) is parallel to the first mounting plate (212) and is arranged outside the air-cooled heat dissipation base (21), and the plug-in bent rod (213) is plugged into the inside of the plug-in base sleeve (231).

4. The notebook computer heat dissipation speaker according to claim 1, characterized in that: The inner bottom surface of the heat dissipation base (1) is provided with a flow guide chute (17) corresponding to the position of the air-cooling heat dissipation component (2).

5. The notebook computer heat dissipation speaker according to claim 1, characterized in that: A water-cooled heat dissipation component (3) is provided inside the heat dissipation base (1), the water-cooled heat dissipation component (3) has a water-cooled heat dissipation base (31), a micro water pump (33) is provided inside the heat dissipation base (1), a water-cooled heat exchange component (32) is provided outside the heat dissipation base (1), and the water-cooled heat dissipation base (31), the water-cooled heat exchange component (32) and the micro water pump (33) are connected via a water-cooled transmission pipe (36).

6. The notebook computer heat dissipation speaker box according to claim 5, characterized in that: The water-cooling transmission pipe (36) passes through the middle of the second auxiliary heat sink (25).

7. The notebook computer heat dissipation speaker box according to claim 5, characterized in that: The water-cooling heat dissipation base (31) has a circular third mounting plate (311), a first rotating shaft (313) is coaxially arranged in the middle of the third mounting plate (311), a mounting ring (314) is coaxially fixedly connected to the first rotating shaft (313), a plurality of rotating blades (315) are equidistantly arranged on the outer wall of the mounting ring (314) in the circumferential direction, a second rotating shaft (316) is coaxially arranged on the upper axial surface of the first rotating shaft (313), a plurality of guide blades (317) are circumferentially arranged on the side wall of the second rotating shaft (316), a water-cooling transmission ring (34) is arranged above the third mounting plate (311), and a plurality of shock-absorbing rubber pads (35) are arranged below the third mounting plate (311).

8. The notebook computer heat dissipation speaker box according to claim 7, characterized in that: The water-cooled transmission ring (34) has an open annular structure. A plurality of water-cooled heat sinks (312) are circumferentially arranged between the water-cooled transmission ring (34) and the third mounting plate (311). The water-cooled transmission ring (34) passes through the water-cooled heat sinks (312). The two ends of the water-cooled transmission ring (34) are respectively connected to a water inlet end (37) and a water outlet end (38).

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