Manufacturing method of circuit board assembly and circuit board assembly

Abstract

A manufacturing method of a circuit board assembly comprises the following steps: providing a circuit board comprising a side surface; a sliding groove is formed in the circuit board, and the sliding groove is formed by recessing the side face; a reinforcing piece is provided, the reinforcing piece comprises a main body part and a clamping part which are connected with each other, and the clamping part protrudes out of the main body part; the clamping part is clamped in the sliding groove, and a gap is formed between the main body part and the circuit board; and filling colloid in the gap so as to bond the circuit board and the reinforcing piece. According to the circuit board manufactured by the manufacturing method of the circuit board assembly provided by the embodiment of the invention, the reinforcing piece is arranged on the side surface of the circuit board without occupying the area of the circuit board for electrically connecting the electronic component, so that the space of the circuit board is fully utilized; in addition, the overall thickness of the circuit board assembly can be reduced. The invention further provides a circuit board assembly.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a method for manufacturing a circuit board assembly and a circuit board assembly. Background Art

[0002] A reinforcing plate is usually connected to the bottom surface of the circuit board to reinforce the circuit board. The provision of the reinforcing plate limits the utilization space of the circuit board and is not conducive to high-density wiring of the circuit board. Summary of the invention

[0003] A method for manufacturing a circuit board assembly includes: providing a circuit board including a side surface; forming a slide groove on the circuit board, the slide groove being formed by a depression in the side surface; providing a reinforcing piece, the reinforcing piece including a main body portion and a clamping portion connected to each other, the clamping portion protruding from the main body portion; clamping the clamping portion in the slide groove, with a gap between the main body portion and the circuit board; filling a colloid in the gap to bond the circuit board and the reinforcing piece.

[0004] In some embodiments of the present application, the circuit board also includes a first surface, the side surface is connected to the first surface, a groove is opened on the circuit board, the groove is formed by the depression of the first surface, and the groove is connected to the slide groove; the circuit board includes a first solder pad, and the first solder pad is exposed in the groove; before the step of filling the colloid, the manufacturing method also includes: filling the conductive paste in the groove to electrically connect the circuit board and the reinforcement.

[0005] In some embodiments of the present application, the groove is formed by the first surface and the side surface being jointly recessed.

[0006] In some embodiments of the present application, the circuit board also includes a second solder pad and a second surface, the second surface is arranged opposite to the first surface, and the second solder pad is arranged on the first surface and / or the second surface; the manufacturing method also includes: connecting electronic components on the circuit board, and the electronic components are connected to the second solder pad.

[0007] In some embodiments of the present application, the circuit board also includes a first surface, the side surface is connected to the first surface, the circuit board includes a first solder pad, and the first solder pad is exposed to the first surface and the side surface; before the step of filling the colloid, the manufacturing method also includes: setting a conductive paste on the first solder pad to electrically connect the circuit board and the reinforcement.

[0008] A circuit board assembly includes a circuit board, a reinforcement piece and a colloid. The circuit board includes a side surface and a slide groove, the slide groove is formed by a depression in the side surface; the reinforcement piece includes a main body and a clamping part connected to each other, the clamping part protrudes from the main body, the clamping part is clamped in the slide groove, and there is a gap between the main body and the circuit board; the colloid is filled in the gap to bond the circuit board and the reinforcement piece.

[0009] In some embodiments of the present application, the circuit board also includes a first surface, the side surface is connected to the first surface, a groove is opened on the circuit board, the groove is formed by the depression of the first surface, and the groove is connected to the slide groove; the circuit board includes a first solder pad, and the first solder pad is exposed in the groove; the circuit board assembly also includes a conductive paste, and the conductive paste is filled in the groove to electrically connect the circuit board and the reinforcement.

[0010] In some embodiments of the present application, the groove is formed by the first surface and the side surface being depressed together, the conductive paste is also located in the gap, and the colloid also covers the conductive paste.

[0011] In some embodiments of the present application, the circuit board also includes a second solder pad and a second surface, the second surface is arranged opposite to the first surface, and the second solder pad is arranged on the first surface and / or the second surface; the circuit board assembly also includes an electronic component, which is connected to the second solder pad.

[0012] In some embodiments of the present application, the circuit board also includes a first surface, the side surface is connected to the first surface, the circuit board includes a first solder pad, and the first solder pad is exposed to the first surface and the side surface; the circuit board assembly also includes a conductive paste, and the conductive paste connects the first solder pad and the reinforcement.

[0013] The circuit board manufactured by the manufacturing method of the circuit board assembly provided in the embodiment of the present application sets the reinforcement component on the side of the circuit board, which does not need to occupy the area of ​​the circuit board used for electrically connecting electronic components, which is conducive to fully utilizing the space of the circuit board; and can also reduce the overall thickness of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the structure of a circuit board assembly provided for the related technology of this application.

[0015] Figure 2 A schematic diagram of the structure of a circuit board provided for some embodiments of the present application.

[0016] Figure 3 For Figure 2 The schematic diagram of the structure after the slide groove is formed on the side of the circuit board is shown.

[0017] Figure 4 A schematic diagram of the structure of the reinforcing member provided in an embodiment of the present application when it moves toward the circuit board.

[0018] Figure 5 for Figure 4 Schematic diagram of the structure after the reinforcement and circuit board are assembled.

[0019] Figure 6 For Figure 5 The schematic diagram of the structure in which conductive paste is provided on the circuit board to electrically connect the reinforcing member is shown.

[0020] Figure 7 For Figure 6 The schematic diagram of the structure of the circuit board after the electronic components are connected to the surface is shown.

[0021] Figure 8 For Figure 7 The schematic diagram of the structure of the circuit board assembly obtained after the gap between the circuit board and the reinforcing member is filled with colloid.

[0022] Fig. 9 A schematic diagram of the structure of a circuit board provided for some other embodiments of the present application.

[0023] Fig.10 For Fig. 9 A schematic structural diagram of a circuit board assembly obtained by connecting electronic components and reinforcement members to the circuit board.

[0024] Main component symbols

[0025]

[0026] DETAILED DESCRIPTION

[0027] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this article are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes all and any combination of one or more related listed items.

[0029] In the embodiments of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the patent application specification and claims of the present application is not limited to physical or mechanical connection, whether direct or indirect. "Up", "down", "above", "below", "left", "right", etc. are only used to indicate relative position relationship. When the absolute position of the described object changes, the relative position relationship also changes accordingly.

[0030] See also Figure 1In the related art, a circuit board assembly 100' is provided, which includes a circuit board 10', a conductive adhesive 65', an electronic component 50' and a reinforcing plate 60', wherein the electronic component 50' is connected to one surface of the circuit board 10', and the reinforcing plate 60' is bonded to the side of the circuit board 10' away from the electronic component 50' through the conductive adhesive 65'. The reinforcing plate 60' occupies the space on the surface of the circuit board 10' away from the electronic component 50', resulting in low space utilization of the circuit board 10'; and the conductive adhesive 65' has a low thermal conductivity, so the heat generated by the circuit board 10' is difficult to be quickly transferred.

[0031] See also Figures 2 to 8 The present invention provides a method for manufacturing a circuit board assembly 100, which may include the following steps:

[0032] Step S1: Please refer to Figure 2 , a circuit board 10 is provided, including a first surface 111 , a second surface 112 and a side surface 113 , the side surface 113 connects the first surface 111 and the second surface 112 , and a groove 116 is opened on the circuit board 10 .

[0033] The circuit board 10 may be a soft board, a hard-soft board or a hard board. In this embodiment, the circuit board 10 is a hard-soft board, and the circuit board 10 includes a first portion 11, a second portion 13 and a connecting portion 15 connecting the first portion 11 and the second portion 13. The first portion 11 is substantially a cuboid.

[0034] The first surface 111 and the second surface 112 are two opposite surfaces. The number of the side surfaces 113 is two and they are arranged oppositely, and each side surface 113 connects the first surface 111 and the second surface 112. The circuit board 10 also includes a first end surface 114 and a second end surface 115 arranged oppositely, and the first end surface 114 and the second end surface 115 are both connected to the first surface 111 and the second surface 112. The first surface 111, the second surface 112, the two side surfaces 113, the first end surface 114 and the second end surface 115 are six surfaces of the first portion 11. The connecting portion 15 connects the first end surface 114 and extends along the first direction L1.

[0035] The groove 116 may be formed by the first surface 111 being recessed, or may be formed by the first surface 111 and the side surface 113 being recessed together.

[0036] The circuit board 10 includes a first soldering pad 18 and a second soldering pad 19 . The first soldering pad 18 is exposed in the groove 116 , and the second soldering pad 19 is located on the first surface 111 and / or the second surface 112 .

[0037] Step S2: Please refer to Figure 3 A slide groove 117 is formed on the circuit board 10 , the slide groove 117 is formed by a depression of the side surface 113 , and the groove 116 is connected to the slide groove 117 .

[0038] A slide groove 117 is formed on each side surface 113, and the slide groove 117 extends along the first direction L1. One end of each slide groove 117 passes through the second end surface 115, and the other end of each slide groove 117 may pass through the first end surface 114, or may not pass through the first end surface 114. In this embodiment, both ends of each slide groove 117 pass through the first end surface 114 and the second end surface 115.

[0039] Step S3: Please refer to Figure 4 , a reinforcing piece 20 is provided, the reinforcing piece 20 includes a main body portion 21 and a clamping portion 23 connected to each other, and the clamping portion 23 protrudes from the main body portion 21.

[0040] In this embodiment, the main body 21 includes a first area 212, a second area 214, and a connecting area 216 connecting the first area 212 and the second area 214. The first area 212 and the second area 214 extend along the first direction L1, and the connecting area 216 extends along the second direction L2. The size of the main body 21 is slightly larger than the size of the first part 11, so that the reinforcing member 20 can be sleeved around the first part 11. The clamping portion 23 is disposed in the first area 212 and the second area 214 and is located on the inner side of the main body 21, and is used to be clamped in the slide groove 117.

[0041] The material of the reinforcing member 20 may be stainless steel.

[0042] Step S4: Please refer to Figure 5 , the clamping portion 23 is clamped in the sliding groove 117.

[0043] The reinforcing member 20 is moved toward the circuit board 10 along the first direction L1 , and the holding portion 23 is accommodated in the sliding groove 117 . The first area 212 and the second area 214 are located on both sides of the first portion 11 , and a gap 30 may be set between the first portion 11 .

[0044] The connection area 216 is located on the side where the second end surface 115 is located. A gap 30 may be provided between the connection area 216 and the second end surface 115 . The ends of the first area 212 and the second area 214 facing away from the connection area 216 are flush with the first end surface 114 .

[0045] Step S5: Please refer to Figure 6 , a conductive paste 40 is filled in the groove 116 , and the conductive paste 40 connects the circuit board 10 and the clamping portion 23 .

[0046] Since the groove 116 is connected to the slide groove 117 and the first pad 18 is exposed to the groove 116 , the conductive paste 40 contained in the groove 116 connects the first pad 18 and the clamping portion 23 contained in the slide groove 117 , thereby being electrically connected to each other, so that the reinforcing member 20 can be grounded.

[0047] When the groove 116 is formed by the first surface 111 and the side surface 113, the conductive paste 40 can also flow into the gap 30 between the side surface 113 and the first area 212 and the gap 30 between the side surface 113 and the second area 214 to connect with the side surface 113, which is beneficial to increase the connection area between the conductive paste 40 and the reinforcing member 20. The reinforcing member 20 can also play a role in heat dissipation, increase the connection area, and is beneficial to increase the heat dissipation effect.

[0048] The conductive paste 40 may be tin paste, copper paste, silver paste, etc.

[0049] Step S6: Please refer to Figure 7 , electronic components 50 are connected to the circuit board 10.

[0050] While the conductive paste 40 is filled in the groove 116, the conductive paste 40 is also disposed on the surface of the second pad 19 for connecting the electronic component 50. The electronic component 50 can be connected to the second pad 19 located on the first surface 111 and / or the second surface 112. The electronic component 50 can be a capacitor, a resistor, a chip, etc.

[0051] Step S7: Please refer to Figure 8 , a glue 35 is filled between the side surface 113 and the main body 21 to bond the circuit board 10 and the reinforcing member 20 , thereby forming the circuit board assembly 100 .

[0052] The colloid 35 is filled in the gap 30 , and the colloid 35 may also cover the conductive paste 40 in the gap 30 .

[0053] See also Fig. 9 In some other embodiments of the present application, a circuit board 10a is provided, wherein the first pad 18a is solid and semi-columnar and fills the entire groove 116. In the subsequent process, please refer to Fig.10 , the conductive paste 40a can be disposed on the first pad 18a exposed to the first surface 111 and the reinforcing member 20 to achieve electrical connection between the circuit board 10a and the reinforcing member 20, thereby obtaining the circuit board assembly 100a.

[0054] In some embodiments, when no electrical connection is required between the reinforcing member 20 and the circuit board 10 , the circuit board 10 does not need to be provided with the groove 116 , nor does it need to be provided with the conductive paste 40 for electrical connection.

[0055] Please refer again Figure 8 The embodiment of the present application further provides a circuit board assembly 100, including a circuit board 10, a reinforcing member 20, a conductive paste 40 and a colloid 35. The colloid 35 bonds the circuit board 10 and the reinforcing member 20, and the conductive paste 40 electrically connects the circuit board 10 and the reinforcing member 20.

[0056] The circuit board 10 includes a first surface 111 , a second surface 112 , two opposite side surfaces 113 , a first end surface 114 and a second end surface 115 . The first surface 111 is opposite to the second surface 112 , and the first end surface 114 is opposite to the second end surface 115 .

[0057] The circuit board 10 is provided with a groove 116 and a slide groove 117, and the groove 116 and the slide groove 117 are connected to each other. The groove 116 can be formed by a depression of the first surface 111, or by a depression of the first surface 111 and the side surface 113. The slide groove 117 is formed by a depression of the side surface 113, and one end of the slide groove 117 passes through the second end surface 115. In this embodiment, the two ends of the slide groove 117 pass through the first end surface 114 and the second end surface 115 respectively.

[0058] The circuit board 10 further includes a first solder pad 18 and a second solder pad 19 . The first solder pad 18 is exposed in the groove 116 , and the second solder pad 19 is located on the first surface 111 and / or the second surface 112 .

[0059] Can be combined Figure 4 The reinforcing member 20 includes a main body 21 and a clamping portion 23 connected to each other, and the clamping portion 23 protrudes from the main body 21. The main body 21 includes a first area 212, a second area 214, and a connecting area 216 connecting the first area 212 and the second area 214. The clamping portion 23 is disposed on the first area 212 and the second area 214, and the clamping portion 23 is clamped in the slide groove 117. There is a gap 30 between the first area 212, the second area 214, and the connecting area 216 and the circuit board 10, and the colloid 35 is filled in the gap 30 to bond the circuit board 10 and the reinforcing member 20.

[0060] The conductive paste 40 is filled in the groove 116, and the conductive paste 40 connects the first pad 18 exposed in the groove 116 and the clamping portion 23 filled in the slide groove 117, so that the circuit board 10 is electrically connected to the reinforcing member 20. Among them, the reinforcing member 20 can be used for grounding, and the grounding resistance is related to the grounding area. The reinforcing member 20 is set on the side 113 of the circuit board 10, and the space between the first surface 111 and the second surface 112 of the circuit board 10 can be vacated. The thermal conductivity of the conductive paste 40 is higher than that of the conductive adhesive 65', which is conducive to quickly transferring the heat of the circuit board 10 through the conductive paste 40.

[0061] When the groove 116 is formed by the first surface 111 and the side surface 113, the conductive paste 40 is located in the gap 30, which is beneficial to increase the connection area between the conductive paste 40 and the reinforcing member 20. The reinforcing member 20 can also play a role in heat dissipation, increase the connection area, and help increase the heat dissipation effect. When the conductive paste 40 is located in the gap 30, the colloid 35 also covers the conductive paste 40 located in the gap 30.

[0062] See also Fig. 9 and Fig.10 In some embodiments, the first pad 18 a fills the entire groove 116 , and the conductive paste 40 a may be disposed on the first pad 18 a exposed to the first surface 111 and the reinforcement 20 to achieve electrical connection between the circuit board 10 a and the reinforcement 20 .

[0063] In some embodiments, when the reinforcing member 20 and the circuit board 10 do not need to be electrically connected, the groove 116 and the conductive paste 40 can be omitted accordingly.

[0064] The circuit board assembly 100 may further include an electronic component 50 , which is electrically connected to the second pad 19 .

[0065] The circuit board assembly 100 provided in the embodiment of the present application sets the reinforcement member 20 on the side surface 113 of the circuit board 10, without occupying the area of ​​the circuit board 10 used for electrically connecting the electronic components 50, which is conducive to fully utilizing the space of the circuit board 10; and the overall thickness of the circuit board assembly 100 can also be reduced.

[0066] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A method for manufacturing a circuit board assembly, characterized in that: include: Providing the circuit board, including the sides; forming a slide groove on the circuit board, wherein the slide groove is formed by the side depression; Providing a reinforcing piece, the reinforcing piece comprising a main body portion and a clamping portion connected to each other, the clamping portion protruding from the main body portion; The clamping portion is clamped in the slide groove, and a gap is formed between the main body and the circuit board; and The gap is filled with colloid to bond the circuit board and the reinforcing member.

2. The method for manufacturing a circuit board assembly according to claim 1, characterized in that: The circuit board further includes a first surface, the side surface is connected to the first surface, a groove is provided on the circuit board, the groove is formed by the first surface being depressed, and the groove is connected to the slide groove; the circuit board includes a first solder pad, and the first solder pad is exposed in the groove; Before the step of filling the colloid, the manufacturing method further comprises: filling the groove with a conductive paste to electrically connect the circuit board and the reinforcing member.

3. The method for manufacturing a circuit board assembly according to claim 2, characterized in that: The groove is formed by the first surface and the side surface being depressed together.

4. The method for manufacturing a circuit board assembly according to claim 2 or 3, characterized in that: The circuit board further includes a second solder pad and a second surface, the second surface is arranged opposite to the first surface, and the second solder pad is arranged on the first surface and / or the second surface; The manufacturing method further includes: connecting an electronic component on the circuit board, wherein the electronic component is connected to the second pad.

5. The method for manufacturing a circuit board assembly according to claim 1, characterized in that: The circuit board further includes a first surface, the side surface is connected to the first surface, the circuit board includes a first solder pad, and the first solder pad is exposed to the first surface and the side surface; Before the step of filling the colloid, the manufacturing method further includes: providing a conductive paste on the first pad to electrically connect the circuit board and the reinforcing member.

6. A circuit board assembly, characterized in that: include: A circuit board, comprising a side surface and a slide groove, wherein the slide groove is formed by a depression of the side surface; A reinforcing member, comprising a main body and a clamping portion connected to each other, wherein the clamping portion protrudes from the main body, the clamping portion is clamped in the slide groove, and a gap is formed between the main body and the circuit board; and A colloid is filled in the gap to bond the circuit board and the reinforcing member.

7. The circuit board assembly according to claim 6, characterized in that: The circuit board also includes a first surface, the side surface is connected to the first surface, a groove is opened on the circuit board, the groove is formed by the depression of the first surface, and the groove is connected to the slide groove; the circuit board includes a first soldering pad, and the first soldering pad is exposed in the groove; the circuit board assembly also includes a conductive paste, and the conductive paste is filled in the groove to electrically connect the circuit board and the reinforcement.

8. The circuit board assembly according to claim 7, characterized in that: The groove is formed by the first surface and the side surface being depressed together, the conductive paste is also located in the gap, and the colloid also covers the conductive paste.

9. The circuit board assembly according to claim 7 or 8, characterized in that: The circuit board also includes a second solder pad and a second surface, the second surface is arranged opposite to the first surface, and the second solder pad is arranged on the first surface and / or the second surface; the circuit board assembly also includes an electronic component, and the electronic component is connected to the second solder pad.

10. The circuit board assembly according to claim 6, characterized in that: The circuit board also includes a first surface, the side surface is connected to the first surface, the circuit board includes a first solder pad, the first solder pad is exposed to the first surface and the side surface; the circuit board assembly also includes a conductive paste, the conductive paste connects the first solder pad and the reinforcement.

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