A tin immersion apparatus for manufacturing a circuit board

Abstract

The present application belongs to the technical field of circuit board tin immersion, and particularly relates to a tin immersion equipment for circuit board manufacturing, which comprises a fixing frame, an electric sliding rail, a sliding plate, an electric push rod, an adjustable clamping jaw machine, a tin immersion frame and a supporting net, etc. The electric sliding rail is installed on the upper part of the fixing frame, the sliding plate is connected to the electric sliding rail in a sliding mode, the electric push rod is installed on the sliding plate, the adjustable clamping jaw machine is connected to the telescopic rod of the electric push rod, the tin immersion frame is connected to the lower part of the fixing frame, and the supporting net for supporting the circuit board is arranged on the upper part of the tin immersion frame. The circuit board is placed on the supporting net for tin immersion by controlling the electric sliding rail, the electric push rod and the adjustable clamping jaw machine. The excess tin immersion liquid on the circuit board is scraped off by moving the scraper to the left, and then the circuit board after tin immersion is transported by the electric roller and the belt, so that the excess tin immersion liquid is avoided to be left on the surface of the circuit board, and the tin immersion quality of the circuit board is ensured.

Description

Technical Field

[0001] This invention belongs to the field of circuit board tinning technology, and in particular relates to a tinning equipment for circuit board manufacturing. Background Technology

[0002] A circuit board, also known as a printed circuit board, is one of the most important components of electronic products. It connects circuits by printing circuit patterns on the surface of insulating material and mounting components, thereby enabling the function of electronic products. During the manufacturing process, circuit boards undergo a tin-dip process. Tin-dip tinning prevents oxidation of the circuit board, strengthens the connection between solder joints and the circuit board, reduces soldering temperature, and provides excellent electrical properties, among other benefits.

[0003] Chinese patent publication number CN111745246B discloses an automatic tin-dipping machine, which includes a box and an immersion tank. The lower side of the box has a cavity, and the two sides of the box have mounting cavities. A motor is mounted inside the cavity via a base. A crossbar is also mounted inside the cavity, and a passive worm gear and a driving worm wheel are mounted on the crossbar. A vertical rod is set inside the mounting cavity.

[0004] The aforementioned patent describes a process where the circuit board is placed in a tray, and the tray is moved to immerse the circuit board in a soaking bath for soldering. After soldering, the circuit board is removed through the tray. However, some solder may remain on the circuit board, potentially causing solder buildup and reducing its quality. Summary of the Invention

[0005] In order to overcome the disadvantage of existing tin-dipping technology that leaves tin-dipping solution residue on the circuit board, thus reducing the quality, the purpose of this invention is to provide a tin-dipping device for circuit board manufacturing that can scrape off the residue and achieve high-quality tin-dipping.

[0006] A circuit board manufacturing tin-dipping equipment includes a fixed frame, an electric slide rail, and a sliding plate. It also includes an electric push rod, an adjustable gripper, a tin-dipping frame, a support mesh, a scraper, and a conveying assembly. The fixed frame has an electric slide rail mounted on its upper part, and a sliding plate slidably connected to the slide rail. An electric push rod is mounted on the sliding plate, and an adjustable gripper is connected to the telescopic rod of the electric push rod. A tin-dipping frame is connected to the lower part of the fixed frame, and a support mesh for supporting the circuit board is provided on the upper part of the tin-dipping frame. A scraper for scraping away residual tin solution on the surface of the circuit board is slidably connected to the upper part of the tin-dipping frame. The fixed frame has a conveying assembly for transporting the circuit board.

[0007] Furthermore, the conveying assembly includes electric rotating rods, conveyor belts, baffles, electric rollers, belts, sliding frames, and helical springs. Several electric rotating rods are rotatably connected to the lower part of the fixed frame, and two conveyor belts for conveying circuit boards are wound between the electric rotating rods. A baffle is connected to the middle of the fixed frame to block the circuit boards on the conveyor belts. A sliding frame is slidably connected to the left side of the fixed frame, and four helical springs are connected between the sliding frame and the fixed frame. Two sets of electric rollers are rotatably connected to the lower part of the sliding frame, and belts are wound between the electric rollers in the same set.

[0008] Furthermore, it also includes a compression spring, a sliding rod, and a pressing plate. Two sliding rods are slidably connected to the lower part of the sliding plate. A compression spring is connected between each sliding rod and the sliding plate, and a pressing plate is connected to each sliding rod.

[0009] Furthermore, it also includes a discharge mechanism, which includes a connecting block, a pressing rod, a return spring, a cover cylinder, a tension spring, and a connecting frame. Connecting blocks are connected to both the front and rear sides of the scraper. When the pressing plate moves to the left, it presses the connecting block. A return spring is connected between the connecting block and the tin-dipping frame. Several pressing rods are connected to the left side of the scraper. The upper part of the tin-dipping frame has a number of circular holes equal to the number of pressing rods. When the pressing rods move to the left, they enter the adjacent circular holes. A cover cylinder equal to the number of circular holes is slidably connected to the left side of the tin-dipping frame. Two tension springs are connected between the cover cylinder and the tin-dipping frame. A connecting frame is connected to the left side of the tin-dipping frame.

[0010] Furthermore, it also includes heating elements, with several heating elements installed at the bottom of the tin-dipping frame.

[0011] Furthermore, it also includes a storage box and a delivery pipe. The storage box is connected to the left side of the mounting frame, and the delivery pipe is connected to the right side of the storage box. The delivery pipe is located above the tin-immersion frame.

[0012] Furthermore, it also includes servo motors, synchronous belts, rotating blocks, and protrusions. Two servo motors are installed on the left side of the sliding frame. Several rotating blocks that cause the circuit board to vibrate are rotatably connected to both sides of the sliding frame. The rotating blocks will contact the circuit board when they rotate. Two of the rotating blocks are connected to the output shaft of the adjacent servo motors. The rotating blocks on different sides are connected to protrusions on the side closest to each other. All rotating blocks are driven by synchronous belts.

[0013] Furthermore, it also includes a collection box, which is connected to the left side of the fixing frame and is located below the sliding frame.

[0014] Furthermore, both the left side of the extrusion plate and the upper part of the connecting block are sloped, and the extrusion plate will extrude the connecting block when it moves to the left.

[0015] Furthermore, the rotating block is a semi-circular block, and the protrusions are all located at the eccentric point of the rotating block.

[0016] The beneficial effects of the present invention are as follows: 1. The present invention controls the electric slide rail, electric push rod and adjustable gripper to place the circuit board on the support net for tinning. The excess tinning solution on the circuit board is scraped off by moving the scraper to the left. Then the circuit board after tinning is transported by electric rollers and belt, thereby avoiding excess tinning solution remaining on the surface of the circuit board and thus ensuring the tinning quality of the circuit board.

[0017] 2. The present invention uses the extrusion plate to move to the left to extrude the connecting block, thereby causing the scraper to move without manual operation, thus reducing the amount of manual labor; then the extrusion rod extrudes the cover cylinder, causing the cover cylinder to separate from the round hole, which in turn allows the scraped waste tin immersion liquid to flow out from the round hole.

[0018] 3. This invention maintains a suitable temperature for the solder immersion solution by controlling the heating element, thereby ensuring the quality of the solder immersion. Furthermore, by controlling the servo motor, the rotating block vibrates the circuit board, causing excess solder immersion solution to fall off, thus guaranteeing the quality of the solder immersion. The fallen solder immersion solution flows into a collection box for collection, preventing indiscriminate discharge and environmental pollution. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0020] Figure 2 This is a structural schematic diagram of the components of the present invention, including the fixing frame, electric slide rail, and sliding plate.

[0021] Figure 3 This is a schematic diagram of the structure of the electric push rod and adjustable gripper of the present invention.

[0022] Figure 4 This is a schematic diagram of the transport component of the present invention.

[0023] Figure 5 This is a schematic diagram of the structure of the compression spring, sliding rod, and extrusion plate of the present invention.

[0024] Figure 6 This is a structural schematic diagram of the connecting block, extrusion rod, and cover cylinder of the present invention.

[0025] Figure 7 This is a schematic diagram of the discharge mechanism of the present invention.

[0026] Figure 8 This is a structural schematic diagram of the servo motor, synchronous belt, and rotating block of the present invention.

[0027] In the attached diagrams: 1: Fixed frame, 2: Electric slide rail, 3: Sliding plate, 4: Electric push rod, 5: Adjustable gripper, 6: Tin-dipping frame, 7: Support mesh, 8: Scraper, 91: Electric rotating rod, 92: Conveyor belt, 93: Baffle plate, 94: Electric roller, 95: Belt, 96: Sliding frame, 97: Helical spring, 101: Compression spring, 102: Sliding rod, 103: Extrusion plate, 112: Connecting block, 113: Extrusion rod, 114: Return spring, 115: Round hole, 116: Covering cylinder, 117: Tension spring, 118: Connecting frame, 121: Heating tube, 131: Storage box, 132: Conveying pipe, 141: Servo motor, 142: Synchronous belt, 143: Rotating block, 144: Protrusion, 151: Collection frame. Detailed Implementation

[0028] The invention will now be described more fully below with reference to the accompanying drawings, in which presently preferred embodiments of the invention are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for thoroughness and completeness and to fully convey the scope of the invention to those skilled in the art.

[0029] Example 1: A tin-dipping device for circuit board manufacturing, such as... Figures 1-8 As shown, the circuit board includes a fixed frame 1, an electric slide rail 2, a sliding plate 3, an electric push rod 4, an adjustable gripper 5, a tin-dipping frame 6, a support mesh 7, a scraper 8, and a conveying assembly. The fixed frame 1 is equipped with an electric slide rail 2, and a sliding plate 3 is slidably connected to the electric slide rail 2. An electric push rod 4 is bolted to the sliding plate 3, and an adjustable gripper 5 is fixed to the telescopic rod of the electric push rod 4. The fixed frame 1 is fixed with a tin-dipping frame 6 at the bottom, and a support mesh 7 is provided on the top of the tin-dipping frame 6. A scraper 8 is slidably connected to the top of the tin-dipping frame 6, and the scraper 8 can scrape the surface of the circuit board on the support mesh 7. The fixed frame 1 is equipped with a conveying assembly for transporting the circuit board.

[0030] like Figure 1 , Figure 4 and Figure 8 As shown, the conveying assembly includes an electric rotary rod 91, a conveyor belt 92, a baffle plate 93, electric rollers 94, a belt 95, a sliding frame 96, and a helical spring 97. Two electric rotary rods 91 are rotatably connected to the lower part of the fixed frame 1, and two conveyor belts 92 are wound between the two electric rotary rods 91. A baffle plate 93 is fixedly connected to the middle of the fixed frame 1. A sliding frame 96 is slidably connected to the left side of the fixed frame 1. Four helical springs 97 are fixedly connected between the sliding frame 96 and the fixed frame 1. Two sets of electric rollers 94 are rotatably connected to the lower part of the sliding frame 96, and a belt 95 is wound between the electric rollers 94 in the same set.

[0031] First, place the circuit board on the conveyor belt 92. Control the electric rotary rod 91 to make the conveyor belt 92 rotate, thereby moving the circuit board to the left. Then control the electric push rod 4 to make its telescopic rod move downward, thereby moving the adjustable gripper 5 downward as well. The adjustable gripper 5 will contact the circuit board as it moves downward, and then control the adjustable gripper 5 to clamp the circuit board. Next, control the electric push rod 4 to make its telescopic rod move upward, thereby moving the circuit board upward as well. Then control the electric slide rail 2 to make the sliding plate 3 slide to the left, thereby moving the electric push rod 4, the adjustable gripper 5, and the circuit board to the left together. When the circuit board moves above the tin-dipping frame 6, similarly control the electric push rod 4 to make the circuit board move downward and contact the support mesh 7. At this time, the circuit board will fully contact the tin-dipping liquid in the tin-dipping frame 6, thereby tin-dipping the circuit board.

[0032] After the circuit board is immersed in solder, manually push the scraper 8 to move it to the left. This leftward movement of the scraper 8 removes any remaining solder solution from the surface of the circuit board on the support mesh 7, preventing excess solder from remaining on the circuit board surface and ensuring the quality of the soldering process. Similarly, control the electric push rod 4 to move the soldered circuit board upwards, and control the electric slide rail 2 to move the circuit board upwards and to the left simultaneously. When the soldered circuit board reaches above the sliding frame 96, control the electric push rod 4 again to place the circuit board onto the belt 95 inside the sliding frame 96. Then, control the electric roller 94 to rotate the belt 95, thus transporting the soldered circuit board without the need for manual collection, saving time and effort.

[0033] Example 2: Based on Example 1, such as Figure 1 and Figure 5 As shown, it also includes a compression spring 101, a sliding rod 102 and a pressing plate 103. The lower part of the sliding plate 3 is slidably connected to two sliding rods 102. The left side of the pressing plate 103 is set with an incline. The compression spring 101 is fixed between the sliding rod 102 and the sliding plate 3. The pressing plate 103 is fixed to the lower part of the sliding rod 102.

[0034] like Figure 6 and Figure 7As shown, it also includes a discharge mechanism, which includes a connecting block 112, a pressing rod 113, a return spring 114, a cover cylinder 116, a tension spring 117, and a connecting frame 118. Connecting blocks 112 are fixedly connected to both the front and rear sides of the scraper 8. The upper part of the connecting block 112 is inclined. Return springs 114 are fixedly connected between the connecting block 112 and the tin-immersion frame 6. When the pressing plate 103 moves to the left, it presses the connecting block 112. When the pressing plate 103 contacts the connecting block 112, the pressing plate 103 continues to move to the left and is pressed by the connecting block 112, thus causing the pressing plate 103 to move upwards. At this time, the pressing plate 113... 03 then stops pressing the connecting block 112, the reset spring 114 returns to its original position, causing the scraper 8 to move to the right and return to its original position. Several pressing rods 113 are fixedly connected to the left side of the scraper 8. The upper part of the tin-dipping frame 6 is provided with a number of circular holes 115 equal to the number of pressing rods 113. When the pressing rods 113 move to the left, they will enter the adjacent circular holes 115. The left side of the tin-dipping frame 6 is slidably connected with a number of cover cylinders 116 equal to the number of circular holes 115. Each cover cylinder 116 can cover the adjacent circular holes 115. Two tension springs 117 are fixedly connected between the cover cylinders 116 and the tin-dipping frame 6. A connecting frame 118 is fixedly connected to the left side of the tin-dipping frame 6.

[0035] As the sliding plate 3 moves to the left, it will drive the sliding rod 102 and the pressing plate 103 to move to the left together. The pressing plate 103 will contact the connecting block 112 when it moves to the left. When the pressing plate 103 continues to move to the left, it will press the connecting block 112, causing the connecting block 112 to move to the left together. This will drive the scraper 8 to move to the left together, and the return spring 114 will be compressed. The scraper 8 will then scrape the circuit board on the first support mesh 7, thus eliminating the need for manual operation and reducing the workload. The scraper 8 moves to the left, causing the extrusion rod 113 to move to the left as well. The extrusion rod 113 enters the circular hole 115. As it continues to move to the left with the scraper 8, it squeezes the cover cylinder 116, causing it to move to the left and separate from the circular hole 115. The tension spring 117 is then compressed, allowing the scraped tin-dipping waste liquid to be discharged from the circular hole 115 and fall onto the connecting frame 118. The sliding plate 3 then drives the extrusion plate 103 to continue moving to the left. Since the left side of the extrusion plate 103 and the upper part of the connecting block 112 are both sloped, the connecting block 112 further squeezes the extrusion plate 103. This causes the extrusion plate 103 to move upward. At this time, the compression spring 101 is compressed, and the extrusion plate 103 no longer extrudes the connecting block 112. The reset spring 114 returns to its original position, and the connecting block 112 and the scraper 8 move to the right together to reset, thus facilitating the scraping of the next circuit board. The extrusion rod 113 also returns to its original position along with the scraper 8. The extrusion rod 113 no longer extrudes the cover cylinder 116, and the tension spring 117 returns to its original position, thus causing the cover cylinder 116 to move to the right to reset. When the connecting block 112 separates from the extrusion plate 103, the compression spring 101 returns to its original position, causing the extrusion plate 103 to move downward to return to its original position.

[0036] like Figure 1 and Figure 7 As shown, it also includes heating tubes 121, and two heating tubes 121 are installed at the bottom of the tin-dipping frame 6. It also includes a storage box 131 and a delivery pipe 132. The storage box 131 is fixed to the left side of the fixing frame 1, and the delivery pipe 132 is fixed to the right side of the storage box 131. The delivery pipe 132 is located above the tin-dipping frame 6.

[0037] The heating element 121 is controlled to heat the immersion solder in the immersion frame 6, thereby maintaining a good temperature for the immersion solder and ensuring the quality of the immersion. As the immersion solder is scraped away by the scraper 8, the amount of immersion solder in the immersion frame 6 will gradually decrease. At this time, the immersion solder in the storage tank 131 can be replenished by controlling the delivery pipe 132, which allows the immersion solder in the delivery pipe 132 to enter the immersion frame 6.

[0038] like Figure 1 and Figure 8 As shown, it also includes a servo motor 141, a synchronous belt 142, a rotating block 143, and a protrusion 144. Two servo motors 141 are bolted to the left side of the sliding frame 96. Several rotating blocks 143 are rotatably connected to both the front and rear sides of the sliding frame 96. When the rotating blocks 143 rotate, they will contact the circuit board. The two leftmost rotating blocks 143 are fixed to the output shaft of the servo motors 141. The rotating blocks 143 on different sides are connected to the side closest to each other with a protrusion 144. The rotating blocks 143 are semi-circular blocks, and the protrusions 144 are all located at the eccentric part of the rotating blocks 143. When the rotating blocks 143 rotate, since the protrusions 144 are all located at the eccentric part of the rotating blocks 143, the rotation of the rotating blocks 143 can cause the circuit board on the belt 95 to vibrate, thereby causing excess solder on the circuit board to fall off, thus ensuring the soldering quality of the circuit board. All rotating blocks 143 are driven by the synchronous belt 142.

[0039] like Figure 1 As shown, it also includes a collection frame 151. The collection frame 151 is fixed to the left side of the fixing frame 1. The collection frame 151 is located below the sliding frame 96. The tin-immersion waste liquid on the connecting frame 118 can also flow into the collection frame 151.

[0040] A servo motor 141 is controlled to drive the rotating block 143 to rotate via a synchronous belt 142. This, in turn, drives the protrusions 144 to rotate as well. Since the rotating block 143 is a semi-circular block and the protrusions 144 are all located at the eccentric points of the rotating block 143, the rotation of the rotating block 143 causes the circuit board to vibrate, causing excess solder to fall off the circuit board and thus ensuring the soldering quality of the circuit board. The fallen solder flows into the collection frame 151 for collection, thus preventing the solder from being discharged randomly and polluting the environment.

[0041] Although this disclosure has been described with respect to only a limited number of embodiments, those skilled in the art who benefit from this disclosure will understand that various other embodiments can be devised without departing from the scope of the invention. Therefore, the scope of the invention should be limited only by the appended claims.

Claims

1. A tin-dipping apparatus for circuit board manufacturing, comprising a fixed frame (1), an electric slide rail (2), and a sliding plate (3), characterized in that: It also includes an electric push rod (4), an adjustable gripper (5), a soldering frame (6), a support net (7), a scraper (8), and a conveying assembly. An electric slide rail (2) is installed on the upper part of the fixed frame (1). A sliding plate (3) is slidably connected to the electric slide rail (2). An electric push rod (4) is installed on the sliding plate (3). An adjustable gripper (5) is connected to the telescopic rod of the electric push rod (4). A soldering frame (6) is connected to the lower part of the fixed frame (1). A support net (7) is provided on the upper part of the soldering frame (6) to support the circuit board. A scraper (8) is slidably connected on the upper part of the soldering frame (6) to scrape off the residual soldering liquid on the surface of the circuit board. A conveying assembly for transporting the circuit board is provided on the fixed frame (1). The conveying assembly includes an electric rotating rod (91), a conveyor belt (92), a baffle plate (93), an electric roller (94), a belt (95), a sliding frame (96), and a helical spring (97). Several electric rotating rods (91) are rotatably connected to the lower part of the fixed frame (1). Two conveyor belts (92) for conveying circuit boards are wound between the electric rotating rods (91). A baffle plate (93) for blocking the circuit boards on the conveyor belt (92) is connected to the middle part of the fixed frame (1). A sliding frame (96) is slidably connected to the left side of the fixed frame (1). A helical spring (97) is connected between the sliding frame (96) and the fixed frame (1). Two sets of electric rollers (94) are rotatably connected to the lower part of the sliding frame (96). A belt (95) is wound between the electric rollers (94) in the same set. It also includes a compression spring (101), a sliding rod (102) and a pressing plate (103). The lower part of the sliding plate (3) is slidably connected to two sliding rods (102). A compression spring (101) is connected between the sliding rod (102) and the sliding plate (3). A pressing plate (103) is connected to each sliding rod (102). It also includes a discharge mechanism, which includes a connecting block (112), a pressing rod (113), a return spring (114), a cover cylinder (116), a tension spring (117), and a connecting frame (118). The scraper (8) is connected to the front and rear sides with connecting blocks (112). When the pressing plate (103) moves to the left, it will press the connecting block (112). The connecting block (112) and the tin-dip frame (6) are both connected with return springs (114). The left side of the scraper (8) is connected to a... Several extrusion rods (113) are provided. The upper part of the tin-dipping frame (6) is provided with a number of circular holes (115) equal to the number of extrusion rods (113). When the extrusion rods (113) move to the left, they will enter the adjacent circular holes (115). The left side of the tin-dipping frame (6) is slidably connected with a number of cover tubes (116) equal to the number of circular holes (115). A tension spring (117) is connected between the cover tubes (116) and the tin-dipping frame (6). A connecting frame (118) is connected to the left side of the tin-dipping frame (6).

2. The tin-dipping equipment for circuit board manufacturing according to claim 1, characterized in that: It also includes heating tubes (121), and several heating tubes (121) are installed at the bottom of the tin-dipping frame (6).

3. A circuit board manufacturing tin-dipping apparatus according to claim 2, characterized in that: It also includes a storage box (131) and a delivery pipe (132). The storage box (131) is connected to the left side of the fixing frame (1), and the delivery pipe (132) is connected to the right side of the storage box (131). The delivery pipe (132) is located above the tin-dip frame (6).

4. A tin-dipping apparatus for circuit board manufacturing according to claim 3, characterized in that: It also includes a servo motor (141), a synchronous belt (142), a rotating block (143), and a protrusion (144). Two servo motors (141) are installed on the left side of the sliding frame (96). Several rotating blocks (143) that cause the circuit board to vibrate are rotatably connected to both sides of the sliding frame (96). The rotating blocks (143) will contact the circuit board when they rotate. Two of the rotating blocks (143) are connected to the output shaft of the adjacent servo motor (141). The rotating blocks (143) on different sides are connected to the protrusion (144) on the side closest to each other. All the rotating blocks (143) are driven by the synchronous belt (142).

5. A circuit board manufacturing tin-dipping apparatus according to claim 4, characterized in that: It also includes a collection box (151), and the collection box (151) is connected to the left side of the fixing frame (1). The collection box (151) is located below the sliding frame (96).

6. A circuit board manufacturing tin-dipping apparatus according to claim 5, characterized in that: The left side of the extrusion plate (103) and the upper part of the connecting block (112) are both set with slopes. When the extrusion plate (103) moves to the left, it will extrude the connecting block (112).

7. A circuit board manufacturing tin-dipping apparatus according to claim 6, characterized in that: The rotating block (143) is a semi-circular block, and the protrusions (144) are all located at the eccentric part of the rotating block (143).

Images