Double-layer copper plate pressing process

Abstract

The invention discloses a double-layer copper plate laminating process, which relates to the technical field of circuit board processing and comprises the following steps: S1, cutting a bottom-layer copper plate; s2, cutting a middle-layer copper plate; s3, composite preparation; and S4, molding processing. According to the double-layer copper plate laminating process, two copper plates form a double-layer copper plate in a laminating and pasting mode through a process laminating material stacking structure, a groove is etched in the periphery of bottom layer copper, the groove is filled with insulating glue, and the bottom layer copper plate and a middle layer copper plate are pasted together through a high-conductivity glue insulating layer, so that the effects of heat absorption and electricity resistance are achieved; as the bottom layer copper and the middle layer copper plate are adhered together through the insulating layer heat-conducting glue, the bottom layer copper and the middle layer copper plate can be prevented from short circuit under the action of the insulating layer heat-conducting glue; therefore, a groove is added by etching the periphery of the bottom copper plate after improvement to prevent short circuit between the bottom copper plate and the interlayer copper plate and heat energy conduction and dissipation between the bottom layer and the interlayer.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, in particular to a double-layer copper plate pressing process. Background Art

[0002] Circuit board generally refers to circuit board. Circuit board can be divided into three categories according to the number of layers: single-sided board, double-sided board, and multi-layer circuit board. Double-sided board is an extension of single-sided board. When single-layer wiring cannot meet the needs of electronic products, double-sided board should be used. Both sides have copper cladding and wiring, and the lines between the two layers can be connected through vias to form the required network connection.

[0003] During the processing of existing double-layer boards, the traditional process has no way to avoid the short circuit between the bottom copper plate and the middle layer board, which makes the circuit board unsafe. For this reason, we propose a double-layer copper plate pressing process. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a double-layer copper plate pressing process, which solves the existing problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention is implemented by the following technical scheme: a double-layer copper plate pressing process, the double-layer copper plate pressing process comprising the following specific steps: S1. Cutting of bottom copper plate S11, drilling holes in the bottom copper plate to form bottom positioning holes, and then grinding the bottom copper plate and its bottom positioning holes to make the surfaces of the bottom copper plate and the bottom positioning holes smooth; S12, coating the bottom copper plate with circuits to form circuit patterns, and then pre-baking the copper plate to expose and develop the groove circuits in position; S13, using an image acquisition device to acquire visual information of the groove line image, and then checking the acquired groove line image to ensure that the line is correct; S14, etching the groove according to the blind groove etching parameter requirements, and then browning the bottom copper plate according to the browning process parameter requirements to form a groove copper plate; S15. Then, laminate 150 micron PP in the groove of the groove copper plate. Filling the groove with glue can avoid burrs generated by the upper and lower copper layers during computer micro-cutting. After completion, wait for the upper copper layer to be stacked and pressed together for use.

[0006] Furthermore, the double-layer copper plate pressing process also includes the following specific steps: S2, cutting of the middle layer copper plate S21, drilling holes in the middle copper plate to form middle positioning holes, and then grinding the middle copper plate and its middle positioning holes to make the surfaces of the middle copper plate and the middle positioning holes smooth; S22, then the middle layer copper plate is subjected to browning processing according to the browning process parameter requirements to form a bare copper plate; S23. After the browning process is completed, the copper plate is inspected, and after the inspection is correct, the copper plate is pasted with pure glue; S24, then perform secondary drilling, check the secondary drilling conditions, and then attach an insulating layer to the upper side of the bare copper plate.

[0007] Furthermore, the double-layer copper plate pressing process also includes the following specific steps: S3. Composite preparation S31, compounding a high-conductivity adhesive insulating layer on the upper side of the grooved copper plate of the bottom layer, and pressing it again, operating according to the pressing process parameter requirements, so that the two are closely fitted; S32, then combine the middle layer of the bare copper plate and the reserved bottom layer of the grooved copper plate for secondary pressing, and operate according to the pressing process parameter requirements, so that the bottom layer of the grooved copper plate and the middle layer of the bare copper plate are glued together through the high-conductivity adhesive insulation layer.

[0008] Furthermore, the double-layer copper plate pressing process also includes the following specific steps: S4, Forming Process S41, perform quality inspection on the two layers of copper plates after lamination, and after the quality inspection is qualified, perform appearance processing and production; S42. Finally, the upper surface of the insulating layer of the bare copper plate is covered with copper decoration and a decorative surface in sequence, so that the copper decoration and the decorative surface constitute an upper panel, thereby forming a complete double-layer copper plate.

[0009] Furthermore, in the process of cutting the bottom copper plate in step S1, when etching the groove, the groove width is 0.6MM and the depth is 0.15M.

[0010] The invention provides a double-layer copper plate pressing process, which has the following beneficial effects: the double-layer copper plate pressing process is processed by cutting a bottom copper plate, cutting an intermediate copper plate, composite preparation and molding. In the process of cutting the bottom copper plate, a groove circuit image is coated and then checked and etched, which can avoid circuit etching errors, and browning the bottom copper plate and the intermediate copper plate is beneficial to make the double-layer copper plate have a stronger fixation when composited, so that the two copper plates are pressed and pasted to form a double-layer copper plate through a process pressing and stacking structure, a groove is etched around the bottom copper, and insulating glue is filled in the groove. The bottom copper plate and the intermediate copper plate are pasted together through a high-conductivity adhesive insulating layer, which plays a role of heat absorption and electricity resistance, thereby improving product quality. Since the bottom copper and the intermediate copper plate are pasted together through the insulating layer of thermal conductive glue, the bottom copper and the intermediate copper plate can prevent short circuit under the action of the insulating conductive glue. Therefore, the improved process adds a groove by etching around the bottom copper plate to prevent the bottom copper and the intermediate copper plate from short circuiting and the bottom and intermediate layers from conducting and dissipating heat energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 A schematic diagram of a process flow of a double-layer copper plate pressing process of the present invention; Figure 2 The figure is a schematic diagram of a groove structure of a double-layer copper plate pressing process of the present invention. Implementation

[0012] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0013] A double-layer copper plate pressing process, the double-layer copper plate pressing process includes the following specific steps: S1. Cutting of bottom copper plate S11, drilling holes in the bottom copper plate to form bottom positioning holes, and then grinding the bottom copper plate and its bottom positioning holes to make the surfaces of the bottom copper plate and the bottom positioning holes smooth; S12, coating the bottom copper plate with circuits to form circuit patterns, and then pre-baking the copper plate to expose and develop the groove circuits in position; S13, using an image acquisition device to acquire visual information of the groove line image, and then checking the acquired groove line image to ensure that the line is correct; S14, etching the groove according to the blind groove etching parameter requirements, and then browning the bottom copper plate according to the browning process parameter requirements to form a groove copper plate; S15. Then, laminate 150 micron PP in the groove of the groove copper plate. Filling the groove with glue can avoid burrs generated by the upper and lower copper layers during computer micro-cutting. After completion, wait for the upper copper layer to be stacked and pressed together for use.

[0014] The double-layer copper plate lamination process also includes the following specific steps: S2, cutting of the middle layer copper plate S21, drilling holes in the middle copper plate to form middle positioning holes, and then grinding the middle copper plate and its middle positioning holes to make the surfaces of the middle copper plate and the middle positioning holes smooth; S22, then the middle layer copper plate is subjected to browning processing according to the browning process parameter requirements to form a bare copper plate; S23. After the browning process is completed, the copper plate is inspected, and after the inspection is correct, the copper plate is pasted with pure glue; S24, then perform secondary drilling, check the secondary drilling conditions, and then attach an insulating layer to the upper side of the bare copper plate.

[0015] The double-layer copper plate lamination process also includes the following specific steps: S3. Composite preparation S31, compounding a high-conductivity adhesive insulating layer on the upper side of the grooved copper plate of the bottom layer, and pressing it again, operating according to the pressing process parameter requirements, so that the two are closely fitted; S32, then combine the middle layer of the bare copper plate and the reserved bottom layer of the grooved copper plate for secondary pressing, and operate according to the pressing process parameter requirements, so that the bottom layer of the grooved copper plate and the middle layer of the bare copper plate are glued together through the high-conductivity adhesive insulation layer.

[0016] The double-layer copper plate lamination process also includes the following specific steps: S4, Forming Process S41, perform quality inspection on the two layers of copper plates after lamination, and after the quality inspection is qualified, perform appearance processing and production; S42. Finally, the copper decoration and the decorative surface are sequentially covered on the upper surface of the insulating layer of the bare copper plate, so that the copper decoration and the decorative surface constitute the upper panel, thereby forming a complete double-layer copper plate.

[0017] Step S1, during the process of cutting the bottom copper plate, when etching the groove, the groove width is 0.6MM and the depth is 0.15MM.

[0018] In summary, the double-layer copper plate pressing process includes the following specific steps when used: S1. Cutting the bottom copper plate: drilling holes in the bottom copper plate to form bottom positioning holes, then grinding the plate, grinding the bottom copper plate and its bottom positioning holes to make the surface of the bottom copper plate and the bottom positioning holes smooth; then coating the bottom copper plate with circuits to form circuit patterns, then pre-baking to expose and develop the groove circuits; using an image acquisition device to collect visual information of the groove circuit image, then checking the collected groove circuit image to ensure that the circuit is correct; etching the groove, the groove width is 0.6MM, the depth is 0.15MM, and the operation is carried out according to the etching blind groove parameter requirements, and then the bottom copper plate is browned, and the operation is carried out according to the browning process parameter requirements to form a groove copper plate; then 150 micron PP is composited in the groove of the groove copper plate, and filling the groove with glue can avoid burrs generated by the upper and lower layers of copper during computer micro-cutting. After completion, wait for the upper copper to be stacked and pressed together for standby; S2, cutting of the middle layer copper plate: drilling holes in the middle layer copper plate to form middle layer positioning holes, then grinding the middle layer copper plate and its middle layer positioning holes to make the surfaces of the middle layer copper plate and the middle layer positioning holes smooth; then browning the middle layer copper plate, operating according to the browning process parameter requirements to form a bare copper plate; after the browning process is completed, the bare copper plate is inspected, and after the inspection is correct, pure glue is pasted on the bare copper plate; then secondary drilling is performed, and the secondary drilling situation is checked, and then an insulating layer is pasted on the upper side of the bare copper plate; S3, composite preparation: composite a high-conductivity adhesive insulating layer on the upper side of the bottom groove copper plate, and then perform a press bonding, and operate according to the requirements of the pressing process parameters to make the two fit tightly; then combine the middle layer of the bare copper plate and the bottom groove copper plate that has been reserved for a second press bonding, and operate according to the requirements of the pressing process parameters to make the bottom groove copper plate and the middle layer of the bare copper plate stick together through the high-conductivity adhesive insulating layer; S4. Forming processing: The quality of the two layers of copper plates after pressing is inspected. After the quality inspection is qualified, the appearance processing is carried out; finally, the copper decoration and the decorative surface are sequentially covered on the upper surface of the insulating layer of the bare copper plate, so that the copper decoration and the decorative surface constitute the upper panel, and a complete double-layer copper plate can be formed.

[0019] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A double-layer copper plate pressing process, characterized in that: The double-layer copper plate pressing process comprises the following specific steps: S1. Cutting of bottom copper plate S11, drilling holes in the bottom copper plate to form bottom positioning holes, and then grinding the bottom copper plate and its bottom positioning holes to make the surfaces of the bottom copper plate and the bottom positioning holes smooth; S12, coating the bottom copper plate with circuits to form circuit patterns, and then pre-baking the copper plate to expose and develop the groove circuits in position; S13, using an image acquisition device to acquire visual information of the groove line image, and then checking the acquired groove line image to ensure that the line is correct; S14, etching the groove according to the blind groove etching parameter requirements, and then browning the bottom copper plate according to the browning process parameter requirements to form a groove copper plate; S15. Then, laminate 150 micron PP in the groove of the groove copper plate. Filling the groove with glue can avoid burrs generated by the upper and lower copper layers during computer micro-cutting. After completion, wait for the upper copper layer to be stacked and pressed together for use.

2. A double-layer copper plate pressing process according to claim 1, characterized in that: The double-layer copper plate pressing process also includes the following specific steps: S2, cutting of the middle layer copper plate S21, drilling holes in the middle copper plate to form middle positioning holes, and then grinding the middle copper plate and its middle positioning holes to make the surfaces of the middle copper plate and the middle positioning holes smooth; S22, then the middle layer copper plate is subjected to browning processing according to the browning process parameter requirements to form a bare copper plate; S23. After the browning process is completed, the copper plate is inspected, and after the inspection is correct, the copper plate is pasted with pure glue; S24, then perform secondary drilling, check the secondary drilling conditions, and then attach an insulating layer to the upper side of the bare copper plate.

3. A double-layer copper plate pressing process according to claim 2, characterized in that: The double-layer copper plate pressing process also includes the following specific steps: S3. Composite preparation S31, compounding a high-conductivity adhesive insulating layer on the upper side of the grooved copper plate of the bottom layer, and pressing it again, operating according to the pressing process parameter requirements, so that the two are closely fitted; S32, then combine the middle layer of the bare copper plate and the reserved bottom layer of the grooved copper plate for secondary pressing, and operate according to the pressing process parameter requirements, so that the bottom layer of the grooved copper plate and the middle layer of the bare copper plate are glued together through the high-conductivity adhesive insulation layer.

4. A double-layer copper plate pressing process according to claim 3, characterized in that: The double-layer copper plate pressing process also includes the following specific steps: S4, Forming Process S41, perform quality inspection on the two layers of copper plates after lamination, and after the quality inspection is qualified, perform appearance processing and production; S42. Finally, the copper decoration and the decorative surface are sequentially covered on the upper surface of the insulating layer of the bare copper plate, so that the copper decoration and the decorative surface constitute the upper panel, thereby forming a complete double-layer copper plate.

5. The double-layer copper plate pressing process according to claim 2, characterized in that: In the process of cutting the bottom copper plate in step S1, when etching the groove, the groove width is 0.6MM and the depth is 0.15MM.

Images