Intelligent integrated power supply with heat dissipation system

Abstract

The invention discloses an intelligent integrated power supply with a heat dissipation system, and relates to the field of intelligent integrated power supplies, and the intelligent integrated power supply comprises a box body, a light reflection table used for installing an electric control board is fixed in the box body, plugging tables are arranged on the light reflection table at intervals, and ventilation assemblies opened by heating are installed on the plugging tables. The side wall of the box cover is provided with an air blowing assembly used for blowing air to the position below the light reflecting table, and airflow generated by the air blowing assembly on the side wall of the box cover can flow out through a ventilation assembly installed on the inserting table. The refrigeration semiconductors on the two sides of the box cover are matched with the cross-flow fan, cold air is blown to a heating electronic device through the air blowing opening, the electronic device in the working state can be automatically cooled adaptively according to the actual working condition of the intelligent integrated power supply, the cold air flow for cooling is reasonably distributed, and the cooling efficiency is improved. And efficient cooling of electronic devices in the intelligent power supply is realized.

Description

Technical Field

[0001] The invention relates to the field of intelligent integrated power supplies, in particular to an intelligent integrated power supply with a heat dissipation system. Background Art

[0002] Intelligent integrated power supply is an all-in-one power supply device that integrates AC and DC power supply management, can realize network centralized management, real-time monitoring, and display the working status of device input and output power. It has query functions such as alarm events and historical information.

[0003] A Chinese patent with related announcement number CN219421458U discloses an intelligent power supply with a heat dissipation structure, including a power box, a box door arranged on the power box, a plurality of storage boxes and a heat pipe, wherein the plurality of storage boxes are equidistantly movable and extend through both sides of the power box, a storage slot is provided in the portion of the storage box passing through the outer wall of the power box, a socket is provided in the storage box, the heat pipe passes through the socket, an air outlet pipe is fixed to the position of the heat pipe at the storage slot, a through hole connected to the air outlet pipe is provided at one end of the heat pipe located in the power box, a thermal gasket is fixed to one end of the heat pipe located inside the power box, and a hole is provided in the middle of the thermal gasket.

[0004] In the prior art, there are some intelligent power supplies installed in industrial control chassis. Multiple groups of axial flow fans are arranged in parallel in the industrial control chassis, and ventilation hole structures are arranged along the flow direction of the cooling airflow. The airflow generated by the axial flow fans is used to cool the heat-generating electronic components in the industrial control chassis.

[0005] The smart power supply in the prior art centrally manages a large number of devices. The smart power supply needs to be equipped with multiple electric control boards with different functions according to the required use. The transformers, capacitors, inductors and other devices in different circuits on each electric control board may not work at the same time.

[0006] With regard to the above-mentioned related technologies, the dustproof capability of the smart power supply installed in the industrial computer in the prior art is weak. The axial flow fan working for a long time can easily cause dust to adhere to the surface of the electronic components in the smart power supply, thereby affecting the heat dissipation effect and safety of the electronic components during operation.

[0007] However, the cooling semiconductor in the intelligent power supply with a heat dissipation structure disclosed in the prior art cools the area near the inner wall of the power box, and the electronic components on the electric control board are far away from the cooling surface of the cooling semiconductor, which is not conducive to efficient heat transfer. In addition, the movably connected heat pipes on the power box cannot adjust their positions freely, which is not conducive to the power box adapting to the installation requirements of different types of electric control boards. The intelligent power supply heat dissipation components in the prior art have the problem of being unable to perform zoned cooling of the positions where the intelligent power supply needs to be cooled according to the actual working conditions of the intelligent power supply. In summary, it is not easy for the existing intelligent integrated power supply to achieve efficient heat dissipation according to its own working conditions. Summary of the invention

[0008] Based on this, the purpose of the present invention is to provide an intelligent integrated power supply with a heat dissipation system to solve the technical problem that the existing intelligent integrated power supply is not easy to achieve efficient heat dissipation according to its own working conditions.

[0009] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an intelligent integrated power supply with a heat dissipation system, comprising a box body, a reflective table for installing an electric control panel is fixed in the box body, plug-in tables are arranged at intervals on the reflective table, a ventilation component that is turned on by heat is installed on the plug-in table, and also comprising a box cover, a blowing component for blowing air to the bottom of the reflective table is arranged on the side wall of the box cover, and the airflow generated by the blowing component on the side wall of the box cover can flow out through the ventilation component installed on the plug-in table.

[0010] By adopting the above technical solution, the refrigeration semiconductors on both sides of the box cover are used in conjunction with the cross-flow fan to allow cold air to blow toward the heat-generating electronic devices through the air outlets. This can automatically and adaptively cool the working electronic devices according to the actual working conditions of the intelligent integrated power supply, reasonably allocate the cold air flow for cooling, and achieve efficient cooling of the electronic devices in the intelligent power supply.

[0011] The present invention is further configured such that both sides of the box cover are provided with mounting openings in the extension direction, and a refrigeration semiconductor with a refrigeration surface facing the inside of the box cover is installed in the mounting opening.

[0012] By adopting the above technical solution, the cooling surface of the cooling semiconductor is used to absorb the heat in the airflow blown out by the cross-flow fan, thereby further improving the efficiency of heat diffusion from the box to the outside of the box.

[0013] The present invention is further configured such that a heat conducting plate is attached to the heating surface of the refrigeration semiconductor, and heat dissipation plates attached to the heat conducting plate are fixedly connected to both sides of the box cover.

[0014] By adopting the above technical solution, the heat conducting plate and the heat dissipating plate are used to dissipate the heat from the heating surface of the refrigeration semiconductor, thereby avoiding the situation where heat is accumulated on the heating surface of the refrigeration semiconductor and the heat is conducted to the outer wall of the box body.

[0015] The present invention is further configured such that the top surface of the reflective platform is coated with reflective paint, the bottom surface of the box cover is coated with light-absorbing paint, and the top surface of the box cover is fixedly connected with heat dissipation fins.

[0016] By adopting the above technical solution, the reflective paint on the reflective table can reflect the infrared rays generated by the electronic devices in the box when they are working to the bottom surface of the box cover. The light-absorbing paint on the bottom surface of the box cover helps the box cover to efficiently absorb the infrared radiation generated by the electronic devices in the box. After the box cover absorbs the heat, the heat is efficiently dissipated to the outside air through the heat dissipation fins fixedly connected to the top surface.

[0017] The present invention is further configured such that both sides of the inner wall of the box cover are fixedly connected with air guide bins, a cross-flow fan is installed at the top of the air guide bin along the length direction, and an air outlet is arranged at the bottom, both sides of the reflective table are provided with air inlets matching the air outlet, and the cooling surface of the refrigeration semiconductor faces into the air guide bin.

[0018] By adopting the above technical solution, the cold air blown in from under the air guide table is finally blown to the electronic devices that need to be cooled through components such as air guide columns and joints. After the airflow is heated up, it expands and flows upward and enters the cross-flow fan, thus completing efficient air circulation in the box.

[0019] The present invention is further configured as follows: an air guide column is plugged into the docking station, a joint is connected to the top of the air guide column, air blowing ports are arranged at circumferential intervals on the top of the joint, a baffle is covered at the air blowing port, a memory metal wire is connected between the top surface of the baffle and the top of the joint, the memory metal wire is in a bent state when not heated up, the baffle covers the air blowing port, and the memory metal wire gradually recovers after heating up to allow the baffle to leave the air blowing port.

[0020] By adopting the above technical solution, after the corresponding baffle is lifted, the cooling air flow can be blown out from the air outlet corresponding to the joint to cool the electronic components in the working state. Since the electronic components in the non-working state are not cooled by air, the air outlet in the open state can be kept blowing with a higher air flow speed to avoid the waste of cooling airflow.

[0021] The present invention is further configured such that an annular groove is provided on the docking station, and an annular protrusion for matching the annular groove is provided on the bottom end of the air guide column. After the top end of the air guide column is inserted downward into the docking station, the top end of the air guide column contacts the inner wall of the box body, and the annular protrusion of the air guide column is engaged in the annular groove of the docking station. At this time, the annular protrusion of the air guide column is flush with the top surface of the reflective table.

[0022] By adopting the above technical solution, when different types of electric control boards need to be installed on the reflective table, the air guide column is inserted downward into the plug-in table at the installation position of the electric control board according to the difference in the types of the different electric control boards.

[0023] The present invention is further configured such that the outer walls of the joint and the baffle are coated with reflective paint.

[0024] By adopting the above technical solution, the memory metal wire can better receive infrared radiation from the heat-generating electronic device, and thus respond to the heat-generating electronic device more quickly.

[0025] The present invention is further configured such that when the top end of the air guide column is upwardly matched with the plug-in platform, the annular protrusion at the bottom end of the air guide column is clamped in the annular clamping groove of the plug-in platform.

[0026] By adopting the above technical solution, when the air guide column is inserted into the plug-in platform with the air guide column facing upward, a more stable state can be maintained, and the air tightness between the plug-in platform and the air guide column can also be improved.

[0027] In summary, the present invention mainly has the following beneficial effects:

[0028] 1. The present invention sets a reflective table in the box of the intelligent integrated power supply, and uses the refrigeration semiconductors on both sides of the box cover to cooperate with the cross-flow fan to cool one side of the box and discharge the cold air to the bottom of the reflective table. The electronic components of the electric control board on the reflective table generate heat, which causes the memory metal wire on the joint that is close to it to deform, and then the baffle on the joint is opened. The cold air is blown to the hot electronic components through the air outlet, and the electronic components in the working state can be automatically and adaptively cooled according to the actual working conditions of the intelligent integrated power supply, and the cold air flow rate for cooling is reasonably allocated, so as to achieve efficient cooling of the electronic components in the intelligent power supply;

[0029] 2. The present invention coats reflective paint on the reflective table and light-absorbing paint on the bottom of the box cover, so that the infrared rays generated by the electronic components on the electric control board are better reflected on the box cover, and then absorbed by the box cover and emitted into the air of the external environment, thereby effectively improving the heat dissipation efficiency of the intelligent power supply box;

[0030] 3. The present invention applies reflective paint on the surface of the joint and the baffle, so that the infrared rays generated by the heat-generating electronic devices around the joint are better reflected to the memory metal wire, so that the memory metal wire is deformed after heating up and the baffle is opened, which effectively improves the reaction speed of the memory metal wire;

[0031] 4. The present invention arranges a plug-in platform on the reflective platform, and concentrically arranges an annular groove structure on the top of the plug-in platform, so that the annular groove structure cooperates with the annular boss at the bottom end of the air guide column to position the air guide column. At the same time, when the electric control board needs to be installed at the plug-in platform, the air guide column is inserted in reverse, so that the end of the air guide column away from the plug-in platform contacts the bottom wall of the box body, and the top surface is flush with the reflective platform. The plug-in platform can be conveniently closed without affecting the normal installation of the electric control board. Under the premise of achieving efficient cooling of electronic devices, the intelligent integrated power supply can be more freely equipped with various types of electric control boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A perspective view of the present invention;

[0033] Figure 2 An exploded view of the present invention;

[0034] Figure 3 It is a three-dimensional diagram of the internal structure of the box of the present invention;

[0035] Figure 4 For the present invention Figure 3 A magnified view of middle;

[0036] Figure 5 An exploded view of the reflective table of the present invention;

[0037] Figure 6 For the present invention Figure 5 Enlarged view of middle B;

[0038] Figure 7 A three-dimensional diagram of the state in which the heat dissipation fins are added to the box cover of the present invention;

[0039] Figure 8 A three-dimensional diagram of the air guide column of the present invention;

[0040] Fig. 9 It is a three-dimensional diagram of the joint of the present invention;

[0041] Fig.10 This is a stereoscopic view of the joint from another perspective of the present invention.

[0042] In the figure: 1. box body; 2. box cover; 201. installation port; 3. air guide compartment; 301. air outlet; 4. cross-flow fan; 5. refrigeration semiconductor; 6. heat conduction plate; 7. heat sink; 8. reflective table; 801. air inlet; 802. plug-in table; 9. air guide column; 10. joint; 1001. air outlet; 11. baffle; 12. memory metal wire. DETAILED DESCRIPTION

[0043] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0044] The following describes an embodiment of the present invention based on its overall structure.

[0045] Embodiment 1

[0046] An intelligent integrated power supply with a heat dissipation system, such as Figure 1-10 As shown, it includes a box body 1, in which a reflective table 8 for installing an electric control panel is fixed. Specifically, the electric control panel used for power supply management by the intelligent integrated power supply can be installed on the reflective table 8, and plug-in tables 802 are arranged at intervals on the reflective table 8. A ventilation component that is opened by heat is installed on the plug-in table 802. It also includes a box cover 2, and a blowing component for blowing air to the bottom of the reflective table 8 is arranged on the side wall of the box cover 2. The airflow generated by the blowing component on the side wall of the box cover 2 can flow out through the ventilation component installed on the plug-in table 802.

[0047] See also Figure 2-6Both sides of the box cover 2 are provided with mounting openings 201 in the extension direction, and a refrigeration semiconductor 5 with a refrigeration surface facing the inside of the box cover 2 is installed in the mounting opening 201. The refrigeration surface of the refrigeration semiconductor 5 absorbs the heat in the airflow blown out by the cross-flow fan 4, so as to further improve the efficiency of heat diffusion from the box body 1 to the outside of the box body 1. The heating surface of the refrigeration semiconductor 5 is attached with a heat conducting plate 6, and the heat conducting plate 6 can efficiently conduct the heat generated by the heating surface of the refrigeration semiconductor 5 to the heat dissipation plate 7, so as to avoid the occurrence of a gap between the heat dissipation plate 7 and the heating surface of the refrigeration semiconductor 5 and reduce the heat conduction efficiency. The two sides of the box cover 2 are fixedly connected with the heat dissipation plate 7 that is in contact with the heat conducting plate 6, and the heat conducting plate 6 and the heat dissipation plate 7 are used to dissipate the heat from the heating surface of the refrigeration semiconductor 5, so as to avoid the situation where heat accumulation on the heating surface of the refrigeration semiconductor 5 and heat conduction to the outer wall of the box body 1.

[0048] See also Figure 2-6 , both sides of the inner wall of the box cover 2 are fixedly connected with an air guide bin 3, a cross-flow fan 4 is installed at the top of the air guide bin 3 along the length direction, and an air outlet 301 is arranged at the bottom, and air inlets 801 matching the air outlet 301 are arranged on both sides of the reflective platform 8, and the cooling surface of the refrigeration semiconductor 5 faces the air guide bin 3, the air inlet of the cross-flow fan 4 at the top of the air guide bin 3 is located near the box cover 2, and the air outlet 301 is located at the bottom of the air guide bin 3, and the air outlet 301 corresponds to the air inlet 801 on both sides of the reflective platform 8. The cold air blown into the bottom of the reflective platform 8 is finally blown to the electronic devices that need to be cooled through components such as the air guide column 9 and the joint 10. After the airflow is heated up, it expands and flows upward and enters the cross-flow fan 4, thereby completing the efficient air circulation in the box body 1.

[0049] See also Figure 2-10 The plug-in platform 802 is plugged with an air guide column 9, the top of the air guide column 9 is connected to a joint 10, the top of the joint 10 is provided with air outlets 1001 at intervals along the circumferential direction, the air outlet 1001 is covered with a baffle 11, the top surface of the baffle 11 and the top of the joint 10 are connected by a memory wire 12, the memory wire 12 is in a bent state when it is not heated, the baffle 11 covers the air outlet 1001, and the memory wire 12 gradually recovers after heating to make the baffle 11 leave the air outlet 1001, and each part in the box 1 When an electronic device is not working, it will not be cooled by the cooling airflow. However, the heat radiation generated by the electronic device after working will cause the memory metal wire 12 to deform after heating up. Then, after the corresponding baffle 11 is opened, the cooling airflow can be blown out from the blowing port 1001 corresponding to the joint 10 to cool the electronic device in working state. Since the electronic device in non-working state is not cooled by blowing air, the blowing port 1001 in the open state can be kept blowing with a higher airflow speed to avoid the waste of cooling airflow.

[0050] See also Figure 3-6 , Figure 8-10, an annular groove is provided on the plug-in platform 802, and an annular protrusion is provided at the bottom end of the air guide column 9 for matching the annular groove. After the top end of the air guide column 9 is inserted downward into the plug-in platform 802, the top end of the air guide column 9 contacts the inner wall of the box body 1, and the annular protrusion of the air guide column 9 is snapped into the annular groove of the plug-in platform 802. At this time, the annular protrusion of the air guide column 9 is flush with the top surface of the reflecting platform 8. When different types of electric control boards need to be installed on the reflecting platform 8, the air guide column 9 is inserted downward into the plug-in platform 802 at the installation position of the electric control board according to the model difference of different electric control boards. When the top end of the air guide column 9 is upwardly matched with the plug-in platform 802, the annular protrusion at the bottom end of the air guide column 9 is snapped into the annular groove of the plug-in platform 802, so that when the air guide column 9 is plugged into the plug-in platform 802 facing upward, it can maintain a more stable state, and at the same time, it can also improve the air tightness between the plug-in platform 802 and the air guide column 9.

[0051] Embodiment 2

[0052] An intelligent integrated power supply with a heat dissipation system, such as Figure 1-10 As shown, on the basis of Example 1, the difference from Example 1 is that the top surface of the reflective platform 8 is coated with reflective paint. Specifically, the reflective paint in the present application is heat-insulating reflective paint. The present application has not made any improvements to its composition, which will not be described in detail here. The bottom surface of the box cover 2 is coated with light-absorbing paint. Specifically, the light-absorbing paint is a common heat-absorbing paint in the prior art. The present application has not made any improvements to its composition, which will not be described in detail here. The top surface of the box cover 2 is fixedly connected with heat dissipation fins. Specifically, the heat dissipation fins on the box cover 2 correspond one-to-one to the heat dissipation fins on the heat dissipation plate 7. In order to further improve the heat dissipation efficiency of the box cover 2 and the heat dissipation plate 7, a heat dissipation fan blowing toward the fins can be installed on the outer wall of the box cover 2. The reflective paint on the reflective platform 8 can reflect the infrared rays generated by the electronic components in the box body 1 when they are working to the bottom surface of the box cover 2. The light-absorbing paint on the bottom surface of the box cover 2 helps the box cover 2 to efficiently absorb the infrared radiation generated by the electronic components in the box body 1 when they are working. After the box cover 2 absorbs the heat, it efficiently dissipates the heat to the outside air through the heat dissipation fins fixedly connected to the top surface.

[0053] Embodiment 3

[0054] An intelligent integrated power supply with a heat dissipation system, such as Figure 1-10As shown, on the basis of Example 1, the difference from Example 1 lies in that the outer walls of the connector 10 and the baffle 11 are coated with reflective paint, and the memory metal wire 12 can better receive infrared radiation from the heating electronic device, and thus react to the heating electronic device more quickly. Specifically, the inner wall of the baffle 11 is coated with light-absorbing paint. After the memory metal wire 12 is deformed and opens the baffle 11, the inner wall of the baffle 11 faces the heating electronic device. The heat radiation generated by the electronic device is absorbed by the baffle 11 and then transmitted to the memory metal wire 12, so that it maintains the deformed state, avoiding interruption of cooling of the working electronic device. When the electronic device stops heating, the electronic device gradually cools down and the amount of heat radiation to the baffle 11 gradually decreases. After the temperature of the memory metal wire 12 itself gradually decreases, the original bending state can be restored, so that the baffle 11 re-closes the air outlet 1001, thereby conveniently realizing the function of automatically cooling the heating electronic device.

[0055] The working principle of the present invention is as follows: when the intelligent integrated power supply starts to work, the refrigeration semiconductor 5 and the cross-flow fan 4 are started synchronously, the airflow generated by the cross-flow fan 4 flows through the refrigeration surface of the refrigeration semiconductor 5 and the temperature is reduced, and flows from the air outlet 301 to the bottom of the reflecting table 8, the electronic devices in the box 1 emit infrared radiation when working, the infrared radiation causes the memory metal wire 12 to be deformed by heat and then open the corresponding baffle 11, and the cold air is blown from the air outlet 1001 to the electronic devices in the working state to cool them down. Since the air outlet 1001 corresponding to the electronic devices in the non-working state is not opened, the cold air used for cooling in the box 1 can achieve a better cooling effect on the heat-generating electronic devices.

[0056] Although an embodiment of the present invention has been shown and described, this specific embodiment is only an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contribution as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. An intelligent integrated power supply with a heat dissipation system, characterized in that: include: A box body (1), a reflective table (8) for mounting an electric control panel being fixed inside the box body (1), plug-in tables (802) being arranged at intervals on the reflective table (8), and a ventilation component that is opened by heat being mounted on the plug-in table (802); A box cover (2), wherein the side wall of the box cover (2) is provided with a blowing assembly for blowing air toward the bottom of the reflective platform (8), and the airflow generated by the blowing assembly on the side wall of the box cover (2) can flow out through the ventilation assembly installed on the docking station (802).

2. The intelligent integrated power supply with a heat dissipation system according to claim 1, characterized in that: Both sides of the box cover (2) are provided with mounting openings (201) in the extension direction, and a refrigeration semiconductor (5) with a refrigeration surface facing the interior of the box cover (2) is mounted in the mounting opening (201).

3. The intelligent integrated power supply with a heat dissipation system according to claim 2, characterized in that: A heat conducting plate (6) is attached to the heating surface of the refrigeration semiconductor (5), and heat dissipation plates (7) attached to the heat conducting plate (6) are fixedly connected to both sides of the box cover (2).

4. The intelligent integrated power supply with a heat dissipation system according to claim 1, characterized in that: The top surface of the reflective platform (8) is coated with reflective paint, the bottom surface of the box cover (2) is coated with light-absorbing paint, and the top surface of the box cover (2) is fixedly connected with heat dissipation fins.

5. The intelligent integrated power supply with a heat dissipation system according to claim 3, characterized in that: Both sides of the inner wall of the box cover (2) are fixedly connected to an air guide bin (3); a cross-flow fan (4) is installed at the top of the air guide bin (3) along the length direction, and an air outlet (301) is arranged at the bottom; both sides of the reflective platform (8) are provided with air inlets (801) matching the air outlet (301); and the cooling surface of the cooling semiconductor (5) faces into the air guide bin (3).

6. The intelligent integrated power supply with a heat dissipation system according to claim 1, characterized in that: An air guide column (9) is plugged onto the docking station (802), the top of the air guide column (9) is connected to a joint (10), the top of the joint (10) is provided with air blowing ports (1001) at intervals along the annular direction, the air blowing ports (1001) are covered with a baffle (11), the top surface of the baffle (11) and the top of the joint (10) are connected via a memory metal wire (12), the memory metal wire (12) is in a bent state when not heated, the baffle (11) covers the air blowing port (1001), and the memory metal wire (12) gradually recovers after heating to allow the baffle (11) to leave the air blowing port (1001).

7. The intelligent integrated power supply with a heat dissipation system according to claim 6, characterized in that: The docking platform (802) is provided with an annular groove, and the bottom end of the air guide column (9) is provided with an annular protrusion for matching the annular groove. After the top end of the air guide column (9) is inserted downward into the docking platform (802), the top end of the air guide column (9) contacts the inner wall of the box body (1), and the annular protrusion of the air guide column (9) is engaged in the annular groove of the docking platform (802). At this time, the annular protrusion of the air guide column (9) is flush with the top surface of the reflective platform (8).

8. The intelligent integrated power supply with a heat dissipation system according to claim 6, characterized in that: The outer walls of the joint (10) and the baffle (11) are both coated with reflective paint.

9. The intelligent integrated power supply with a heat dissipation system according to claim 7, characterized in that: When the top end of the air guide column (9) is upwardly aligned with the docking station (802), the annular protrusion at the bottom end of the air guide column (9) is engaged in the annular groove of the docking station (802).

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