Suction nozzle offset correction method, device, equipment and medium

Abstract

The embodiment of the invention discloses a suction nozzle offset correction method and device, equipment and a medium. The suction nozzle offset correction method comprises the following steps: controlling a suction nozzle module to move a standard chip from a material platform to a target position of a calibration platform; controlling a camera module to obtain a first actual position of the standard chip on the calibration platform; a suction nozzle module is controlled to adsorb a standard chip from a target position, a rotating module is controlled to rotate the suction nozzle module by a preset angle, and the suction nozzle module is controlled to place the standard chip rotating by the preset angle on a calibration platform; controlling a camera module to obtain a second actual position of the standard chip on the calibration platform; and correcting the offset error of the suction nozzle module according to the first actual position and the second actual position. The suction nozzle offset correction method provided by the embodiment of the invention achieves the effect of reducing the movement deviation of taking and placing the chip by the suction nozzle.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of mechanical deviation correction, and in particular to a nozzle offset correction method, device, equipment and medium. Background Art

[0002] Automated equipment is widely used in various production links. In the process of transferring and soldering a large number of chips to circuit boards, a nozzle mechanism is needed to pick up and move the chips. The existing technology generally confirms the nozzle offset by measuring the static distance between the positioning camera and the nozzle. However, such nozzle offset cannot adapt to various usage scenarios of the nozzle, which makes it easy for the nozzle to move when picking up and placing chips. Summary of the invention

[0003] The embodiments of the present invention provide a nozzle offset correction method, device, equipment and medium, which achieve the effect of reducing the movement deviation of the nozzle when picking up and placing a chip.

[0004] According to one aspect of the present invention, a method for correcting nozzle offset is provided, comprising: controlling a nozzle module to move a standard chip from a material platform to a target position on a calibration platform; controlling a camera module to obtain a first actual position of the standard chip on the calibration platform; controlling the nozzle module to adsorb the standard chip from the target position, controlling a rotation module to rotate the nozzle module by a preset angle, and controlling the nozzle module to place the standard chip rotated by a preset angle on the calibration platform; controlling the camera module to obtain a second actual position of the standard chip on the calibration platform; and correcting the offset error of the nozzle module according to the first actual position and the second actual position.

[0005] Optionally, the correction of the offset error of the nozzle module according to the first actual position and the second actual position includes: the coordinate position of the rotation center of the nozzle module relative to the viewing angle center of the camera is: X=(X3-X1+X2-X1) / 2, Y=Y3-Y1+Y2-Y1) / 2, wherein (X1, Y1) is the target position, (X2, Y2) is the first actual position, and (X3, Y3) is the second actual position.

[0006] Optionally, before controlling the nozzle module to move the standard chip from the material platform to the target position of the calibration platform, the method includes: moving the camera module to a preset reset point to reset the nozzle module.

[0007] According to another aspect of the present invention, a nozzle offset correction device is provided, including: a material placement module, used to control the nozzle module to move the standard chip from the material platform to the target position of the calibration platform; a first calibration module, used to control the camera module to obtain the first actual position of the standard chip on the calibration platform; a material rotation module, used to control the nozzle module to adsorb the standard chip from the target position, control the rotation module to rotate the nozzle module by a preset angle, and control the nozzle module to place the standard chip rotated by the preset angle on the calibration platform; a second calibration module, used to control the camera module to obtain the second actual position of the standard chip on the calibration platform; an error correction module, used to correct the offset error of the nozzle module according to the first actual position and the second actual position.

[0008] Optionally, the correction of the offset error of the nozzle module according to the first actual position and the second actual position includes: the coordinate position of the rotation center of the nozzle module relative to the viewing angle center of the camera is: X=(X3-X1+X2-X1) / 2, Y=Y3-Y1+Y2-Y1) / 2, wherein (X1, Y1) is the target position, (X2, Y2) is the first actual position, and (X3, Y3) is the second actual position.

[0009] Optionally, a reset module is further included, which is used to move the camera module to a preset reset point to reset the nozzle module before controlling the nozzle module to move the standard chip from the material platform to the target position of the calibration platform.

[0010] According to another aspect of the present invention, a nozzle offset correction device is provided, comprising: a calibration platform for placing a standard chip; a nozzle module for generating a vacuum to adsorb the standard chip or placing the standard chip when the vacuum disappears; a rotation module for rotating the nozzle module to control the angle at which the standard chip is placed; a camera module for photographing the standard chip placed on the calibration platform to obtain the position of the standard chip; a moving module for moving the nozzle module, the rotation module, and the camera module in different dimensions; a processing module comprising one or more processors; a memory for storing one or more programs; when the one or more programs are executed by the one or more processors, the one or more processors implement any one of the above-mentioned nozzle offset correction methods.

[0011] According to another aspect of the present invention, a storage medium is provided, on which a computer program is stored, wherein the program implements the above-mentioned nozzle deviation correction method when executed by a processor.

[0012] Compared with the prior art, the nozzle offset correction method of this embodiment corrects both the nozzle moving chip and the rotating chip at the same time, avoiding nozzle placement errors caused by different axes or wear of the rotating module and the nozzle module, improving the accuracy of the nozzle picking up and placing the chip, and reducing the probability of product defects. In addition, during the correction process, separate corrections can be made for different angles to further improve the accuracy of the nozzle picking up and placing the chip. In addition, when the correction angles are large and complex, the mean of multiple angle deviations can be used for statistical correction, which can simplify the correction algorithm and improve the operating efficiency of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0014] Figure 1 This is a flow chart of a nozzle offset correction method provided in Embodiment 1 of the present invention.

[0015] Figure 2 It is a schematic diagram of a nozzle offset correction device provided in Embodiment 2 of the present invention.

[0016] Figure 3 It is a schematic diagram of the block structure of a nozzle offset correction device provided in Embodiment 3 of the present invention.

[0017] Figure 4 It is a partial structural schematic diagram of a nozzle offset correction device provided in Embodiment 3 of the present invention.

[0018] Figure 5 It is a partial structural schematic diagram of a nozzle offset correction device provided in Embodiment 3 of the present invention.

[0019] Figure 6 It is a schematic diagram of the nozzle module of the third embodiment of the present invention preparing to suck the standard chip from the material platform.

[0020] Figure 7 It is a schematic diagram of the nozzle module of the third embodiment of the present invention moving the standard chip from the material platform to the target position of the calibration platform.

[0021] Figure 8 It is a schematic diagram of a standard chip in which a moving module moves a camera module to align the center of a lens and place it at a target position according to a third embodiment of the present invention.

[0022] Fig. 9It is a schematic diagram of the suction nozzle module of the third embodiment of the present invention sucking the placed standard chip in situ, rotating it by a preset angle and then placing it down. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0024] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, device, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0025] Embodiment 1

[0026] Figure 1 is a flow chart of a nozzle offset correction method provided in the first embodiment of the present invention. This embodiment can be applied to a nozzle offset correction device for execution. The device can be implemented by software and / or hardware, and can generally be integrated into a nozzle offset correction device, such as Figure 3-5 As shown, in one embodiment, the nozzle offset correction device 300 may include a calibration platform 390 for placing a standard chip, a nozzle module 320 for generating a vacuum to adsorb the standard chip, a rotation module 330 for rotating the nozzle module, a camera module 340 for photographing the standard chip placed on the calibration platform to obtain the position of the standard chip, a moving module 350 for moving the nozzle module 320, the rotation module 330, and the camera module 340 in different dimensions, and a processing module, including one or more processors 11. Accordingly, as Figure 1 As shown, the method includes the following operations:

[0027] S110, controlling the nozzle module to move the standard chip from the material platform to the target position of the calibration platform.

[0028] like Figure 4-5As shown, in one embodiment, the nozzle module 320 is rotatably fixed to the end of the rotating module 330. Under the rotation of the rotating module 330, the nozzle module 320 can rotate freely within a range of 360 degrees and keep the nozzle opening facing downward, and the nozzle opening takes and places the chip through vacuum. The rotating module 330 and the camera module 340 are directly or indirectly fixed to the mobile module 350. In this embodiment, the optical axis of the camera module 340 and the rotation axis of the nozzle module 320 are arranged parallel. The mobile module 350 can move in three vertical directions of XYZ, and the nozzle module 320, the rotating module 330, and the camera module 340 can move in three vertical directions of XYZ driven by the mobile module 350. In one embodiment, a card slot 311 for accommodating a standard chip 380 is provided on the material platform 310, and the standard chip 380 is accommodated in the card slot 311. The calibration platform 390 is located on one side of the material platform 310. The calibration platform 390 has a preset mark at a target position 391 for placing the standard chip 380 , and a vacuum adsorption hole 392 for adsorbing and fixing the standard chip 380 is provided near the target position 391 .

[0029] See also Figure 6-7 , Figure 6 Schematic diagram of the nozzle module 320 preparing to suck the standard chip 380 from the material platform 310 . Figure 7 The figure is a schematic diagram of the nozzle module 320 moving the standard chip 380 from the material platform 310 to the target position 391 of the calibration platform 390. In one embodiment, under the control of the processing module, the nozzle module 320 moves to the top of the standard chip 380 according to the placement coordinates of the standard chip 380, then grabs the standard chip 380 from the material platform 310 by vacuum adsorption and leaves the card slot 311, and then moves the standard chip 380 to the target position 391 of the calibration platform 390 and puts it down.

[0030] In this embodiment, the standard chip 380 is made of a transparent material, and a fixed alignment mark 381 is provided on the standard chip 380. The user can also confirm the placement coordinates by photographing the alignment mark 381 on the standard chip 380 in the card slot 311 through the camera module 340.

[0031] In one embodiment, before controlling the nozzle module to move the standard chip from the material platform to the target position of the calibration platform, the camera module 340 is also moved to a preset reset point (not shown) to reset the nozzle module 320, so as to eliminate the position deviation caused by the nozzle module 320 being accidentally touched after the device 300 was last shut down.

[0032] In one embodiment, the material platform 310 further includes a pick-up mark 382 of the standard chip. When the visual center of the camera module 340 is aligned with the pick-up mark 382, ​​the nozzle module 320 is just above the standard chip 391 in the card slot. In one embodiment, the user can input the corresponding first coordinate information (X1, Y1) in the control interface, and the control module controls the nozzle module 320 to move the standard chip 380 from the placement coordinate of the material platform 310 to the target position 391 (X1, Y1) corresponding to the first coordinate information of the calibration platform 390 according to the first coordinate information (X1, Y1).

[0033] S120: Control the camera module to obtain a first actual position of the standard chip on the calibration platform.

[0034] In one embodiment, refer to Figure 8 , the control module moves the camera module 340 through the moving module 350 to align the center of the lens with the alignment mark on the standard chip 380 placed at the target position, and then records the first actual position (X2, Y2) of the standard chip 380 on the calibration platform 390. The multiple vacuum adsorption holes on the upper surface of the calibration platform 390 are used to adsorb and fix the standard chip 380 placed at the target position. In this embodiment, a reference mark line 393 is provided on the calibration platform 390. When the camera module 340 is aligned with the alignment mark on the standard chip 380, the reference mark line 393 below can be identified through the transparent standard chip 380. The rotation angle of the standard chip 380 during the movement can be confirmed through the overlapping images between the alignment mark and the reference line.

[0035] S130, controlling the nozzle module to absorb the standard chip from the target position, controlling the rotation module to rotate the nozzle module to a preset angle, and controlling the nozzle module to place the standard chip rotated to the preset angle on the calibration platform.

[0036] In one embodiment, refer to 9 together, the control module controls the suction nozzle module 320 to in-situ absorb and grab the standard chip 380 just put down, and then controls the rotation module 330 to rotate the suction nozzle module 320 by a preset angle, and then controls the suction nozzle module 320 to place the standard chip 380 rotated by the preset angle on the calibration platform 390. In one embodiment, according to the specific situation of the angle that the rotation module 330 needs to rotate in the manufacturing process, a single angle correction can be performed, a multi-angle correction can be performed, and an average angle correction can also be performed. Specifically, if the chip is only rotated 180 degrees during the process, a single angle 180 degree rotation correction can be performed. If the chip is rotated 90 degrees and 180 degrees in succession during the process, corrections of the two angles of 90 degrees and 180 degrees can be performed respectively. If the process will rotate the chip at various angles of 60 degrees, 90 degrees, 120 degrees, 180 degrees, and 270 degrees in sequence, average corrections can be made for the rotations of multiple angles of 60 degrees, 90 degrees, 120 degrees, 180 degrees, and 270 degrees, respectively.

[0037] S140: Control the camera module to obtain a second actual position of the standard chip on the calibration platform.

[0038] In one embodiment, refer again to Figure 8 , the control module moves the camera module 340 through the moving module 350 to align the center of the lens with the alignment mark on the standard chip 380 placed after rotation, and then records the second actual position (X3, Y3) of the standard chip 380 on the calibration platform. In this embodiment, a reference mark line is provided on the calibration platform 390. When the camera module 340 aligns the alignment mark on the standard chip 380, the reference mark line below can be identified through the transparent standard chip 380. The error of the rotation angle of the standard chip 380 during the rotation process can be confirmed through the overlapping images between the alignment mark and the reference line.

[0039] S150, correcting the offset error of the nozzle module according to the first actual position and the second actual position.

[0040] In one embodiment, taking the correction of a single angle 180-degree rotation as an example, the correction of the offset error of the nozzle module according to the first actual position and the second actual position includes: the processing module calculates the coordinate position of the rotation center of the nozzle module relative to the viewing angle center of the camera as: X=(X3-X1+X2-X1) / 2, Y=Y3-Y1+Y2-Y1) / 2, wherein (X1, Y1) is the target position, (X2, Y2) is the first actual position, and (X3, Y3) is the second actual position.

[0041] In one embodiment, taking the correction of two rotation angles of 60 degrees and 90 degrees as an example, for the correction of the angle 60 degrees: the correction of the offset error of the nozzle module according to the first actual position and the second actual position includes: the processing module calculates the coordinate position (X, Y) of the rotation center of the nozzle module relative to the viewing angle center of the camera as: X=(X3-X1+X2-X1) / 2, Y=Y3-Y1+Y2-Y1) / 2, wherein (X1, Y1) is the target position, (X2, Y2) is the first actual position, and (X3, Y3) is the second actual position. Correction for an angle of 90 degrees: The correction of the offset error of the nozzle module according to the first actual position and the second actual position includes: the processing module calculates the coordinate position (X', Y') of the rotation center of the nozzle module relative to the center of the camera's viewing angle as follows: X' = (X3'-X1' + X2'-X1') / 2, Y' = Y3'-Y1' + Y2'-Y1') / 2, wherein (X1', Y1') is the target position, (X2', Y2') is the first actual position, and (X3', Y3') is the second actual position. In one embodiment, (X, Y) can be called to correct a 60-degree rotation when performing an angle rotation, and (X', Y') can be called to correct a 90-degree rotation.

[0042] In an alternative embodiment, the coordinate mean of 60 degrees and 90 degrees ((X+X') / 2, (Y+Y') / 2) can also be used to calibrate all angles. This embodiment only takes two angles as an example. When there are multiple angles, the coordinate mean of multiple angles can be used for unified correction.

[0043] Compared with the prior art, the nozzle offset correction method of this embodiment corrects the nozzle moving chip and rotating chip, avoiding the nozzle placement error caused by the different axes of the rotating module and the nozzle module, improving the accuracy of the nozzle picking up and placing the chip, and reducing the probability of product defects. In addition, during the correction process, separate corrections can be made for different angles to further improve the accuracy of the nozzle picking up and placing the chip. In addition, when the correction angles are large and complex, the mean of multiple angle deviations can be used for statistical correction, which can simplify the correction algorithm and improve the operating efficiency of the system.

[0044] Embodiment 2

[0045] Figure 2 2 is a schematic diagram of a nozzle offset correction device provided in the second embodiment of the present invention. The device 200 can be implemented by software and / or hardware, and can generally be integrated into Figure 3 The nozzle offset correction device shown, such as Figure 2 As shown, the device 300 includes a material placement module 210 , a first calibration module 220 , a material rotation module 230 , a second calibration module 240 and an error correction module 250 .

[0046] The material placement module 210 is used to control the nozzle module to move the standard chip from the material platform to the target position of the calibration platform.

[0047] like Figure 4-5 As shown, in one embodiment, the nozzle module 320 is rotatably fixed to the end of the rotating module 330. Under the rotation of the rotating module 330, the nozzle module 320 can rotate freely within a range of 360 degrees and keep the nozzle opening facing downward, and the nozzle opening takes and places the chip through vacuum. The rotating module 330 and the camera module 340 are directly or indirectly fixed to the mobile module 350. In this embodiment, the optical axis of the camera module 340 and the rotation axis of the nozzle module 320 are arranged parallel. The mobile module 350 can move in three vertical directions of XYZ, and the nozzle module 320, the rotating module 330, and the camera module 340 can move in three vertical directions of XYZ driven by the mobile module 350. In one embodiment, a card slot 311 for accommodating a standard chip 380 is provided on the material platform 310, and the standard chip 380 is accommodated in the card slot 311. The calibration platform 390 is located on one side of the material platform 310. The calibration platform 390 has a preset mark at a target position 391 for placing the standard chip 380 , and a vacuum adsorption hole 392 for adsorbing and fixing the standard chip 380 is provided near the target position 391 .

[0048] See also Figure 6-7 , Figure 6 Schematic diagram of the nozzle module 320 preparing to suck the standard chip 380 from the material platform 310 . Figure 7 The figure is a schematic diagram of the nozzle module 320 moving the standard chip 380 from the material platform 310 to the target position 391 of the calibration platform 390. In one embodiment, under the control of the processing module, the nozzle module 320 moves to the top of the standard chip 380 according to the placement coordinates of the standard chip 380, then grabs the standard chip 380 from the material platform 310 by vacuum adsorption and leaves the card slot, and then moves the standard chip 380 to the target position 391 of the calibration platform 390 and puts it down.

[0049] In this embodiment, the standard chip 380 is made of a transparent material, and a fixed alignment mark 381 is provided on the standard chip 380. The user can also confirm the placement coordinates by photographing the alignment mark 381 on the standard chip 380 in the card slot 311 through the camera module 340.

[0050] In one embodiment, before controlling the nozzle module to move the standard chip from the material platform to the target position of the calibration platform, it also includes moving the camera module 340 to a preset reset point (not shown) to reset the nozzle module 320 to eliminate the position deviation caused by the nozzle module 320 being accidentally touched after the device 300 was last shut down.

[0051] In one embodiment, the material platform 310 further includes a pick-up mark 382 of the standard chip. When the visual center of the camera module 340 is aligned with the pick-up mark 382, ​​the nozzle module 320 is just above the standard chip 391 in the card slot. In one embodiment, the user can input the corresponding first coordinate information (X1, Y1) in the control interface, and the control module controls the nozzle module 320 to move the standard chip 380 from the placement coordinate of the material platform 310 to the target position 391 (X1, Y1) corresponding to the first coordinate information of the calibration platform 390 according to the first coordinate information (X1, Y1).

[0052] The first calibration module 220 is used to control the camera module to obtain the first actual position of the standard chip on the calibration platform.

[0053] In one embodiment, refer to Figure 8 , the control module moves the camera module 340 through the moving module 350 to align the center of the lens with the alignment mark on the standard chip 380 placed at the target position, and then records the first actual position (X2, Y2) of the standard chip 380 on the calibration platform 390. The multiple vacuum adsorption holes on the upper surface of the calibration platform 390 are used to adsorb and fix the standard chip 380 placed at the target position. In this embodiment, a reference mark line 393 is provided on the calibration platform 390. When the camera module 340 is aligned with the alignment mark on the standard chip 380, the reference mark line 393 below can be identified through the transparent standard chip 380. The rotation angle of the standard chip 380 during the movement can be confirmed through the overlapping images between the alignment mark and the reference line.

[0054] The material rotation module 230 is used to control the nozzle module to absorb the standard chip from the target position, rotate the nozzle module by a preset angle, and then control the nozzle module to place the standard chip rotated by the preset angle on the calibration platform.

[0055] In one embodiment, refer to Fig. 9, the control module controls the suction nozzle module 320 to adsorb and grab the standard chip 380 just put down in situ, and then controls the rotation module 330 to rotate the suction nozzle module 320 to a preset angle, and then controls the suction nozzle module 320 to place the standard chip 380 rotated by the preset angle on the calibration platform 390. In one embodiment, according to the specific situation of the angle that the rotation module 330 needs to rotate in the manufacturing process, a single angle correction can be performed, a multi-angle correction can be performed, and an average angle correction can also be performed. Specifically, if the chip is only rotated 180 degrees during the process, a single angle 180-degree rotation correction can be performed. If the chip is rotated 90 degrees and 180 degrees in succession during the process, corrections of the two angles of 90 degrees and 180 degrees can be performed respectively. If the process will rotate the chip at various angles of 60 degrees, 90 degrees, 120 degrees, 180 degrees, and 270 degrees in sequence, average corrections can be made for the rotations of multiple angles of 60 degrees, 90 degrees, 120 degrees, 180 degrees, and 270 degrees, respectively.

[0056] The second calibration module 240 is used to control the camera module to obtain the second actual position of the standard chip on the calibration platform.

[0057] In one embodiment, refer again to Figure 8 , the control module moves the camera module 340 through the moving module 350 to align the center of the lens with the alignment mark on the standard chip 380 placed after rotation, and then records the second actual position (X3, Y3) of the standard chip 380 on the calibration platform. In this embodiment, a reference mark line is provided on the calibration platform 390. When the camera module 340 aligns the alignment mark on the standard chip 380, the reference mark line below can be identified through the transparent standard chip 380. The error of the rotation angle of the standard chip 380 during the rotation process can be confirmed through the overlapping images between the alignment mark and the reference line.

[0058] The error correction module 250 is used to correct the offset error of the nozzle module according to the first actual position and the second actual position.

[0059] In one embodiment, taking the correction of a single angle 180-degree rotation as an example, the correction of the offset error of the nozzle module according to the first actual position and the second actual position includes: the processing module calculates the coordinate position of the rotation center of the nozzle module relative to the viewing angle center of the camera as: X=(X3-X1+X2-X1) / 2, Y=Y3-Y1+Y2-Y1) / 2, wherein (X1, Y1) is the target position, (X2, Y2) is the first actual position, and (X3, Y3) is the second actual position.

[0060] In one embodiment, taking the correction of two rotation angles of 60 degrees and 90 degrees as an example, for the correction of the angle 60 degrees: the correction of the offset error of the nozzle module according to the first actual position and the second actual position includes: the processing module calculates the coordinate position (X, Y) of the rotation center of the nozzle module relative to the viewing angle center of the camera as: X=(X3-X1+X2-X1) / 2, Y=Y3-Y1+Y2-Y1) / 2, wherein (X1, Y1) is the target position, (X2, Y2) is the first actual position, and (X3, Y3) is the second actual position. Correction for an angle of 90 degrees: The correction of the offset error of the nozzle module according to the first actual position and the second actual position includes: the processing module calculates the coordinate position (X', Y') of the rotation center of the nozzle module relative to the center of the camera's viewing angle as follows: X' = (X3'-X1' + X2'-X1') / 2, Y' = Y3'-Y1' + Y2'-Y1') / 2, wherein (X1', Y1') is the target position, (X2', Y2') is the first actual position, and (X3', Y3') is the second actual position. In one embodiment, (X, Y) can be called to correct a 60-degree rotation when performing an angle rotation, and (X', Y') can be called to correct a 90-degree rotation.

[0061] In an alternative embodiment, the coordinate mean of 60 degrees and 90 degrees ((X+X') / 2, (Y+Y') / 2) can also be used to calibrate all angles. This embodiment only takes two angles as an example. When there are multiple angles, the coordinate mean of multiple angles can be used for unified correction.

[0062] The above-mentioned nozzle offset correction device can execute the nozzle offset correction method provided by any embodiment of the present invention, and has functional modules and beneficial effects corresponding to the execution method. For technical details that are not described in detail in this embodiment, please refer to the nozzle offset correction method provided by any embodiment of the present invention. Since the nozzle offset correction device introduced above is a device that can execute the nozzle offset correction method in the embodiment of the present invention, based on the nozzle offset correction method introduced in the embodiment of the present invention, the technical personnel in this field can understand the specific implementation method of the nozzle offset correction device of this embodiment and its various variations, so how the nozzle offset correction device implements the nozzle offset correction method in the embodiment of the present invention will not be introduced in detail here. As long as the technical personnel in this field implement the device adopted by the nozzle offset correction method in the embodiment of the present invention, it belongs to the scope of protection of this application.

[0063] Embodiment 3

[0064] Figure 3 FIG. 2 shows a schematic diagram of the structure of a nozzle offset correction device provided by Embodiment 3 of the present invention. Figure 3As shown, the nozzle offset correction device 300 may include a calibration platform 390 for placing a standard chip, a nozzle module 320 for generating a vacuum to adsorb the standard chip, a rotation module 330 for rotating the nozzle module, a camera module 340 for photographing the standard chip placed on the calibration platform to obtain the position of the standard chip, a moving module 350 for moving the nozzle module 320, the rotation module 330, and the camera module 340 in different dimensions, a processing module, including one or more processors 11, and a memory connected to at least one processor 11 in communication, the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In RAM 13, various programs and data required for the operation of the nozzle offset correction device 300 can also be stored. The processor 11, ROM 12, and RAM 13 are connected to each other through a bus 14. The input / output (I / O) interface 15 is also connected to the bus 14.

[0065] Multiple components of the processor 11 in the nozzle offset correction device 300 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the nozzle offset correction device 300 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0066] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The processor 11 executes the various methods and processes described above, such as the processor of the nozzle offset correction device 300 implementing the nozzle offset correction method.

[0067] In some embodiments, the nozzle offset correction method may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed into the nozzle offset correction device 300 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the nozzle offset correction method described above may be performed. Alternatively, in other embodiments, the processor 11 may be configured to perform the nozzle offset correction method in any other appropriate manner (e.g., by means of firmware).

[0068] Various implementations of the devices and techniques described above herein can be implemented in digital electronic circuit devices, integrated circuit devices, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip devices (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations may include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable device including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage device, at least one input device, and at least one output device, and transmit data and instructions to the storage device, the at least one input device, and the at least one output device.

[0069] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0070] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by an instruction execution device, device or equipment or used in combination with an instruction execution device, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor equipment, device or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0071] To provide interaction with a user, the devices and techniques described herein may be implemented on a mobile terminal having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the mobile terminal. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0072] The devices and techniques described herein may be implemented in a computing device that includes backend components (e.g., as a data server), or a computing device that includes middleware components (e.g., an application server), or a computing device that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the devices and techniques described herein), or a computing device that includes any combination of such backend components, middleware components, or frontend components. Components of the device may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0073] The computing device may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship between the client and the server is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0074] Embodiment 4

[0075] Embodiment 4 of the present invention further provides a computer storage medium storing a computer program, wherein the computer program, when executed by a computer processor, is used to execute the nozzle deviation correction method described in any of the above embodiments of the present invention.

[0076] The computer storage medium of the embodiment of the present invention can adopt any combination of one or more computer-readable media. The computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor device, apparatus or device, or any combination of the above. More specific examples (non-exhaustive list) of computer-readable storage media include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM, or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this document, a computer-readable storage medium can be any tangible medium containing or storing a program, which can be used by an instruction execution device, device or device or used in combination with it.

[0077] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, which carry computer-readable program code. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than a computer-readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution device, apparatus, or device.

[0078] The program code contained on the computer-readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wire, optical cable, radio frequency (RF), etc., or any suitable combination of the foregoing.

[0079] The above specific implementations do not define limitations on the scope of protection of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

[0080] The above specific implementations do not define limitations on the scope of protection of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A nozzle offset correction method, characterized in that: include: Controlling the nozzle module to move the standard chip from the material platform to the target position of the calibration platform; Controlling the camera module to obtain a first actual position of the standard chip on the calibration platform; Control the nozzle module to absorb the standard chip from the target position, control the rotation module to rotate the nozzle module to a preset angle, and control the nozzle module to place the standard chip rotated to the preset angle on the calibration platform; Controlling the camera module to obtain a second actual position of the standard chip on the calibration platform; The offset error of the nozzle module is corrected according to the first actual position and the second actual position.

2. The nozzle offset correction method according to claim 1, characterized in that: The correction of the offset error of the nozzle module according to the first actual position and the second actual position includes: the coordinate position of the rotation center of the nozzle module relative to the viewing angle center of the camera is: X=(X3-X1+X2-X1) / 2, Y=Y3-Y1+Y2-Y1) / 2, wherein (X1, Y1) is the target position, (X2, Y2) is the first actual position, and (X3, Y3) is the second actual position.

3. The nozzle offset correction method according to claim 1, characterized in that: Before controlling the nozzle module to move the standard chip from the material platform to the target position of the calibration platform, it includes: Move the camera module to a preset reset point to reset the nozzle module.

4. A nozzle deviation correction device, characterized in that: include: A material placement module, used to control the nozzle module to move the standard chip from the material platform to the target position of the calibration platform; A first calibration module, used for controlling the camera module to obtain a first actual position of the standard chip on the calibration platform; A material rotation module, used to control the nozzle module to absorb the standard chip from the target position, control the rotation module to rotate the nozzle module to a preset angle, and control the nozzle module to place the standard chip rotated to the preset angle on the calibration platform; A second calibration module, used for controlling the camera module to obtain a second actual position of the standard chip on the calibration platform; The error correction module is used to correct the offset error of the nozzle module according to the first actual position and the second actual position.

5. The nozzle deviation correction device according to claim 4, characterized in that: The correction of the offset error of the nozzle module according to the first actual position and the second actual position includes: the coordinate position of the rotation center of the nozzle module relative to the viewing angle center of the camera is: X=(X3-X1+X2-X1) / 2, Y=Y3-Y1+Y2-Y1) / 2, wherein (X1, Y1) is the target position, (X2, Y2) is the first actual position, and (X3, Y3) is the second actual position.

6. The nozzle deviation correction device according to claim 4, characterized in that: It further includes a reset module, which is used to move the camera module to a preset reset point to reset the nozzle module before controlling the nozzle module to move the standard chip from the material platform to the target position of the calibration platform.

7. A nozzle offset correction device, characterized in that: include: Calibration platform, used to place standard chips; A nozzle module, used to generate vacuum to absorb the standard chip or place the standard chip when the vacuum disappears; A rotating module, used for rotating the nozzle module to control the angle at which the standard chip is placed; A camera module is used to photograph the standard chip placed on the calibration platform to obtain the position of the standard chip; A mobile module, used to move the nozzle module, the rotation module, and the camera module in different dimensions; a processing module, comprising one or more processors; A memory for storing one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the nozzle offset correction method as described in any one of claims 1 to 3.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the nozzle offset correction method as described in any one of claims 1 to 3 is implemented.

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