Micro light-emitting component, transfer method of micro light-emitting element and display device

Abstract

The invention discloses a micro light-emitting component, a transfer method of micro light-emitting elements and a display device. The micro light-emitting component comprises a substrate, a plurality of micro light-emitting elements and a pickup layer. The plurality of micro light-emitting elements are arranged on the substrate at intervals, each micro light-emitting element is connected with the substrate through a supporting structure, a cavity is formed in an area between the micro light-emitting elements and the substrate, and each micro light-emitting element comprises a first surface deviating from the substrate and a second surface deviating from the first surface. The pickup layer is arranged on the first face of each micro light-emitting element and at least partially covers the first face, and the surface, away from the first face, of the pickup layer is a pickup face. The pickup layer is arranged on each micro light-emitting element, so that a fixed force can be applied to pick multiple groups of micro light-emitting elements, meanwhile, the transfer yield can be ensured, and the transfer efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a micro-luminescent component, a transfer method of a micro-luminescent element, and a display device. Background Art

[0002] Micro-LED display technology refers to the use of micron-scale self-luminous LEDs as light-emitting pixel units, which are assembled on a drive panel to form a high-density LED array. Due to the small size, high integration and self-luminescence of micro-LEDs, they have greater advantages in brightness, resolution, contrast, energy consumption, service life, response speed and thermal stability compared with LCD and OLED in terms of display direction.

[0003] In the prior art, the micro-LEDs are fixed on a carrier substrate by an anchor chain structure, and are picked up from the carrier substrate, transported, and transferred to a receiving substrate. In the process of transferring the micro-LEDs in large quantities from the anchor chain structure on the carrier substrate to the receiving substrate, a stamping head formed of a polymer material is usually used to directly contact the core particles on the carrier substrate, and pressure is applied to adhere the core particles to transfer the core particles to the receiving substrate. However, since the surfaces of the core particles with different structures in contact with the stamping head are different, the transfer yield is poor. If the transfer yield is improved by changing the pressure applied to the stamping head, it may be necessary to adjust the structural strength of the anchor chain structure to adapt to the pressure change applied to the stamping head. In this way, on the one hand, it is difficult to control the quality of the anchor chain structure to adapt to the pressure applied by the stamping head, and on the other hand, it will also increase the transfer cost of the micro-light-emitting element. Summary of the invention

[0004] In view of the above shortcomings of the prior art, an object of the present invention is to provide a micro-light emitting assembly, a transfer method of a micro-light emitting element and a display device to ensure the transfer yield of micro-light emitting elements with different transfer adhesive surfaces.

[0005] In order to achieve the above-mentioned object and other related objects, the present invention provides a micro-light emitting component, comprising:

[0006] substrate;

[0007] A plurality of micro-luminescent elements are arranged on the substrate at intervals, and each of the micro-luminescent elements is connected to the substrate via a supporting structure to form a cavity in a region between the micro-luminescent element and the substrate, and each of the micro-luminescent elements includes a first surface away from the substrate and a second surface away from the first surface;

[0008] The pickup layer is disposed on the first surface of each micro-luminescent element and at least partially covers the first surface. The surface of the pickup layer facing away from the first surface is the pickup surface.

[0009] The present invention also provides a method for transferring a micro-luminescent component, comprising:

[0010] A micro-light-emitting component is provided, the micro-light-emitting component comprising a substrate, a plurality of micro-light-emitting elements suspended on the substrate, each micro-light-emitting element being connected to the substrate via a supporting structure to form a cavity in a region between the micro-light-emitting element and the substrate; a pickup layer is provided on a surface of the micro-light-emitting element away from the substrate, the pickup layer at least covers a portion of a surface of the micro-light-emitting element away from the substrate, and a surface of the pickup layer away from the micro-light-emitting element is a pickup surface;

[0011] Controlling the embossing head to move to a position of the micro-luminescent component corresponding to the pickup layer, until the embossing head contacts the pickup layer;

[0012] Applying pressure on the micro-luminescent element from the embossing head to break the supporting structure of the micro-luminescent element, and bonding the embossing head to the pickup layer of the micro-luminescent element;

[0013] The imprint head is moved to transfer the picked-up micro-luminescent element to the target substrate.

[0014] According to one aspect of the present invention, a display device is also provided. The display device is prepared by using the above-mentioned transfer method of the micro-luminescent element.

[0015] Compared with the prior art, the micro-luminescent assembly, the transfer method of the micro-luminescent element and the display device of the present invention have at least the following beneficial effects:

[0016] The micro-luminescent assembly of the present invention includes a substrate, a plurality of micro-luminescent elements and a pickup layer. Among them, the plurality of micro-luminescent elements are arranged on the substrate at intervals, and each micro-luminescent element is connected to the substrate through a supporting structure to form a cavity in the area between the micro-luminescent element and the substrate, and each micro-luminescent element includes a first surface away from the substrate and a second surface away from the first surface. The pickup layer is arranged on the first surface of each micro-luminescent element and at least partially covers the first surface, and the surface of the pickup layer away from the first surface is the pickup surface. Therefore, the present invention arranges a pickup layer on the first surface of the micro-luminescent element, and when picking up the micro-luminescent element, the stamping head sticks to the pickup layer of the micro-luminescent element. Since the pickup layer of each micro-luminescent element has the same structure, a fixed force can be applied to pick up multiple groups of micro-luminescent elements, while ensuring the transfer yield and improving the transfer efficiency.

[0017] The transfer method of the micro-luminescent element and the display device of the present invention both adopt the above-mentioned micro-luminescent component and also have the above-mentioned technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of a micro-light-emitting component;

[0019] Figure 2A schematic diagram of moving the stamping head to the micro-light-emitting element of the corresponding micro-light-emitting component;

[0020] Figure 3 Schematic diagram of an imprint head picking up a micro-luminescent element and transferring it to a target substrate;

[0021] Figure 4a It is a schematic structural diagram of a micro-light-emitting component in an embodiment of the present invention;

[0022] Figure 4b It is a schematic structural diagram of a micro-light-emitting component in an embodiment of the present invention;

[0023] Figure 4c It is a schematic structural diagram of a micro-light-emitting component in an embodiment of the present invention;

[0024] Figure 4d It is a schematic structural diagram of a micro-light-emitting component in an embodiment of the present invention;

[0025] Figure 5 It is a schematic diagram of the structure of a micro-luminescent element in an embodiment of the present invention;

[0026] Figure 6 This is a schematic diagram of the structure of a micro-light-emitting component in an embodiment of the present invention;

[0027] Figure 7 This is a schematic diagram of the structure of a micro-light-emitting component in an embodiment of the present invention;

[0028] Figure 8 This is a schematic diagram of the structure of a micro-light-emitting component in an embodiment of the present invention;

[0029] Fig. 9 This is a schematic diagram of the structure of a micro-light-emitting component in an embodiment of the present invention;

[0030] Fig.10 This is a schematic diagram of the structure of a micro-light-emitting component in an embodiment of the present invention;

[0031] Fig.11 A schematic diagram of moving the imprint head to a pickup layer of a micro-light-emitting element of a corresponding micro-light-emitting assembly in an embodiment of the present invention;

[0032] Fig.12 A schematic diagram of an imprint head picking up a micro-luminescent element and transferring it to a target substrate in an embodiment of the present invention;

[0033] Fig.13 It is a schematic diagram of the structure of bonding the micro-luminescent element to the target substrate in an embodiment of the present invention.

[0034] List of reference numerals:

[0035] 100 substrates

[0036] 200 Support structure

[0037] 201 Anchor structure

[0038] 202 Chain Structure

[0039] 300 Cavity

[0040] 400 micro-luminescent elements

[0041] 401 epitaxial structure

[0042] 4011 First semiconductor layer

[0043] 4012 Active layer

[0044] 4013 Second semiconductor layer

[0045] 4021 First electrode contact layer

[0046] 4022 second electrode contact layer

[0047] 403 first electrode layer

[0048] 404 second electrode layer

[0049] 405 Insulation layer

[0050] 406 First Page

[0051] 407 Second Side

[0052] 408 dielectric layer

[0053] 410 Pickup Layer

[0054] 411 Sub-pickup layer

[0055] 500 Imprinting Head

[0056] 600 Target substrate

[0057] 601 Pad DETAILED DESCRIPTION

[0058] The following specific embodiments illustrate the embodiments of the present invention, and those familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0059] It should be noted that the diagrams provided in the embodiments of the present invention are only used to illustrate the basic concept of the present invention in a schematic manner. Although the diagrams only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of each component can be changed at will during actual implementation, and the layout of the components may also be more complex. The structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that can be implemented in this application, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by the present invention.

[0060] like Figure 1 As shown, the micro-luminescent assembly includes a substrate 100, an anchor structure 200 formed on the substrate 100, and a micro-luminescent element 400 suspended in a groove (not marked in the figure) of the anchor structure 200. The micro-luminescent element 400 is connected to the side wall of the groove through a chain structure 300. When the micro-luminescent elements 400 in the micro-luminescent assembly are transferred in batches, such as Figure 2 As shown, the stamping head 500 is moved to the position of the micro-luminescent assembly corresponding to the first surface 406 of the micro-luminescent element 400, and a certain pressure is applied to make the stamping head 500 stamp on the first surface 406 of the micro-luminescent element 400, and the chain structure 300 fixing the micro-luminescent element 400 is broken under the action of pressure, as shown in FIG. Figure 3 As shown, the micro light-emitting element 400 is picked up by the adhesive imprint head 500 and transferred to the target substrate 600 .

[0061] However, the inventors have found that the structures on the adhesive surface of the micro-luminescent element 400 are different, resulting in a decrease in the transfer yield of micro-luminescent elements 400 with different structures using the same transfer method. After further in-depth research, this may be caused by the different areas of the adhesive surface of the imprint head 500 and the micro-luminescent element 400 when the same force is applied during the process of picking up the micro-luminescent element 400. For example, the adhesive surface of some micro-luminescent elements 400 is a plane, while the adhesive surface of some micro-luminescent elements 400 has a regular or irregular roughened structure. If the same pressure is used to pick up different micro-luminescent elements 400, the contact area between the imprint head 500 and the micro-luminescent element 400 with a flat adhesive surface is larger, while the contact area with the micro-luminescent element 400 with a roughened adhesive surface is smaller. The micro-luminescent element 400 with a smaller contact area is easy to fall off during the transfer process, which leads to a decrease in the transfer yield. If the size of the applied pressure is changed, the strength of the chain structure 300 needs to be adjusted accordingly, which is bound to increase the transfer cost and transfer efficiency.

[0062] In order to solve the background technology and the above-mentioned technical problems, the present embodiment provides a micro-luminescent component, a transfer method of the micro-luminescent component and a display device, so as to ensure the transfer yield of different micro-luminescent elements without changing the chain structure, improve the transfer efficiency and reduce the transfer cost.

[0063] Specifically, this embodiment provides a micro-light emitting component, including:

[0064] substrate;

[0065] A plurality of micro-luminescent elements are arranged on the substrate at intervals, and each of the micro-luminescent elements is connected to the substrate via a supporting structure to form a cavity in a region between the micro-luminescent element and the substrate, and each of the micro-luminescent elements includes a first surface away from the substrate and a second surface away from the first surface;

[0066] The pickup layer is disposed on the first surface of each micro-luminescent element and at least partially covers the first surface. The surface of the pickup layer facing away from the first surface is the pickup surface. When picking up the micro-luminescent element, the embossing head adheres to the pickup layer of the micro-luminescent element. Since the pickup layer of each micro-luminescent element has the same structure, a fixed force can be applied to pick up multiple groups of micro-luminescent elements, while ensuring the transfer yield and improving the transfer efficiency.

[0067] Optionally, the pick-up surface is a flat surface. Therefore, when the micro-luminescent element is picked up and transferred, a small force can be used to achieve maximum contact between the stamping head and the pick-up surface of the micro-luminescent element, thereby achieving a better transfer yield.

[0068] Optionally, the first surface of the micro-luminescent element is a patterned surface or a flat surface.

[0069] Optionally, the micro-luminescent element comprises:

[0070] An epitaxial structure, comprising a first surface side and a second surface side, the epitaxial structure sequentially comprising a first semiconductor layer, an active layer and a second semiconductor layer in a direction from the first surface side to the second surface side, and the epitaxial structure exposing a portion of the first semiconductor layer on the second surface side;

[0071] A first electrode layer is disposed above the first semiconductor layer exposed on the second surface side and is connected to the first semiconductor layer;

[0072] The second electrode layer is disposed above the second semiconductor layer on the second surface side and is connected to the second semiconductor layer.

[0073] Optionally, the surface of the first semiconductor layer corresponding to the first surface side of the epitaxial structure is formed as the first surface of the micro-light-emitting element, and the surface having the first electrode layer and the second electrode layer corresponding to the second surface side of the epitaxial structure is formed as the second surface.

[0074] Optionally, the surface of the first semiconductor layer corresponding to the first surface side of the epitaxial structure is formed as the second surface of the micro-light-emitting element, and the surface having the first electrode layer and the second electrode layer corresponding to the second surface side of the epitaxial structure is formed as the first surface.

[0075] Optionally, a dielectric layer is formed on the first surface of the epitaxial structure, and the pickup layer is formed on the dielectric layer.

[0076] Optionally, the pickup layer is sticky to further improve the bonding force between the stamping head and the micro-luminescent element, thereby improving the transfer yield.

[0077] Optionally, the material of the pickup layer is a high molecular polymer material.

[0078] Optionally, the pickup layer is a light-transmitting layer, and the thickness of the pickup layer is less than 5 μm. When the pickup layer is arranged on the light-emitting side of the micro-luminescent element and does not affect the light emission of the micro-luminescent element, the pickup layer does not need to be removed subsequently. At the same time, the pickup layer can also protect the micro-luminescent element.

[0079] Optionally, the pickup layer includes two or more sub-pickup layers, and each sub-pickup layer is arranged at intervals.

[0080] Optionally, the support structure comprises:

[0081] An anchor structure, fixedly disposed on the substrate;

[0082] The chain structure has one end connected to the anchor structure and the other end connected to the micro-luminescent element.

[0083] Optionally, the micro-luminescent element comprises:

[0084] An epitaxial structure, comprising a first surface side and a second surface side, wherein the epitaxial structure comprises a first semiconductor layer, an active layer and a second semiconductor layer in sequence from the first surface side to the second surface side;

[0085] A first electrode layer is disposed above the first semiconductor layer on the first surface side and is connected to the first semiconductor layer;

[0086] The second electrode layer is disposed above the second semiconductor layer on the second surface side and is connected to the second semiconductor layer.

[0087] Optionally, a side of the epitaxial structure having the first electrode layer is the first side, and a side of the epitaxial structure having the second electrode layer is the second side.

[0088] This embodiment also provides a method for transferring a micro-luminescent component, including:

[0089] A micro-light-emitting component is provided, the micro-light-emitting component comprising a substrate, a plurality of micro-light-emitting elements suspended on the substrate, each micro-light-emitting element being connected to the substrate via a supporting structure to form a cavity in a region between the micro-light-emitting element and the substrate; a pickup layer is provided on a surface of the micro-light-emitting element away from the substrate, the pickup layer at least covers a portion of a surface of the micro-light-emitting element away from the substrate, and a surface of the pickup layer away from the micro-light-emitting element is a pickup surface;

[0090] Controlling the embossing head to move to a position of the micro-luminescent component corresponding to the pickup layer, until the embossing head contacts the pickup layer;

[0091] Applying pressure on the micro-luminescent element from the embossing head to break the supporting structure of the micro-luminescent element, and bonding the embossing head to the pickup layer of the micro-luminescent element;

[0092] The embossing head is moved to transfer the picked-up micro-luminescent element to the target substrate. Similarly, when picking up the micro-luminescent element, the embossing head adheres to the pick-up layer of the micro-luminescent element. Since the pick-up layer of each micro-luminescent element has the same structure, a fixed force can be applied to pick up multiple groups of micro-luminescent elements, while ensuring the transfer yield and improving the transfer efficiency.

[0093] Optionally, the step of providing a micro-light emitting component includes:

[0094] providing a growth substrate;

[0095] forming a micro-light-emitting element on a growth substrate;

[0096] forming a chain structure on both sides of the micro-light-emitting element;

[0097] Covering the surface of the chain structure and the micro-light-emitting element with a sacrificial layer;

[0098] forming an anchor structure on at least the side surfaces of the micro-light-emitting element, the chain structure and the sacrificial layer;

[0099] Bonding a substrate to the anchor structure and removing the growth substrate to expose the micro-luminescent element;

[0100] forming a pickup layer on the exposed surface of the micro-luminescent element;

[0101] The sacrificial layer is removed to form a micro-light-emitting component.

[0102] Optionally, after the step of moving the imprint head to transfer the picked-up micro-luminescent element to the target substrate, the method further includes:

[0103] Remove the pickup layer.

[0104] This embodiment also provides a display device, which is prepared by using the above-mentioned transfer method of the micro-luminescent element. Therefore, the display device of the present invention has higher preparation efficiency and lower cost.

[0105] The present invention is described in detail below with reference to specific embodiments.

[0106] Example 1

[0107] This embodiment provides a micro-light emitting component, referring to Figure 4a The micro-luminescent assembly includes a substrate 100, a support structure 200, a plurality of micro-luminescent elements 400 and a pickup layer 410. The plurality of micro-luminescent elements 400 are arranged on the substrate 100 at intervals, and each micro-luminescent element 400 is connected to the substrate 100 through the support structure 200, and a cavity 300 is formed in the area between the micro-luminescent element 400 and the substrate 100. Each micro-luminescent element 400 includes a first surface 406 away from the substrate 100 and a second surface 407 away from the first surface 406. The pickup layer 410 is arranged on the first surface 406 of each micro-luminescent element 400, and at least partially covers the first surface 406. The surface of the pickup layer 410 away from the first surface 406 is the pickup surface. Therefore, in this embodiment, the pickup layer 410 is arranged on the first surface 406 of the micro-luminescent element 400. When the micro-luminescent element 400 is picked up, the imprint head 500 adheres to the pickup layer 410 of the micro-luminescent element 400. Since the pickup layer 410 of each micro-luminescent element 400 has the same structure, a fixed force can be applied to pick up multiple groups of micro-luminescent elements 400, while ensuring the transfer yield and improving the transfer efficiency.

[0108] Specifically, refer to Figure 4a The substrate 100 may be a transfer substrate 100, for example, sapphire, glass, resin or quartz. A support structure 200 is formed on the surface of the substrate 100, and the support structure 200 includes an anchor structure 201 and a chain structure 202. The anchor structure 201 is fixedly arranged on the surface of the substrate 100. In one example, referring to Figure 4a , the anchor structure 201 is disposed on the substrate 100, and a plurality of grooves are formed on the surface of the anchor structure 201. Figure 4b , the anchor structure 201 is formed as at least two support columns arranged on the substrate 100. One end of the chain structure 202 is connected to the anchor structure 201, and the other end is used to connect the micro-luminescent element 400. The chain structure 202 serves as a connector between the anchor structure 201 and the micro-luminescent element 400, and its shape can be straight, curved, etc., as long as it can achieve its connection function and ensure that it can be broken under the action of the imprinting pressure later. Of course, the support structure 200 that can support the micro-luminescent element 400 and form the cavity 300 between the micro-luminescent element 400 and the substrate 100 can also be other structural forms, and the present invention is not limited to this.

[0109] A plurality of micro-luminescent elements 400 are arranged on the substrate 100 at intervals, and each micro-luminescent element 400 is connected to the substrate 100 through the support structure 200, and a cavity 300 is formed in the region between the micro-luminescent element 400 and the substrate 100, and each micro-luminescent element 400 includes a first surface 406 away from the substrate 100 and a second surface 407 away from the first surface 406. In one example, referring to Figure 4a The micro-luminescent element 400 is connected to the side wall of the groove through the chain structure 202, and there is a certain distance between the micro-luminescent element 400 and the bottom wall of the groove to form a cavity 300 between the micro-luminescent element 400 and the substrate 100. In another example, referring to Figure 4b The micro-luminescent element 400 is connected to each anchor structure 201 in the form of a support column through a chain structure 202, and a cavity 300 is formed between the micro-luminescent element 400 and the substrate 100. Optionally, there may be multiple chain structures 202, which are spaced around the sidewall of the micro-luminescent element 400 and connected to the anchor structure 201.

[0110] In this embodiment, the micro-light emitting element 400 refers to a micron-sized light emitting diode, which can be a Mini LED light emitting diode or a Micro LED light emitting diode. The micro-light emitting diode has a length, width or height ranging from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, 20 to 50 μm or 50 to 100 μm, and a thickness ranging from 2 to 15 μm, preferably 5 to 10 μm.

[0111] Reference Figure 5, the micro-light-emitting element 400 includes an epitaxial structure 401, a first electrode layer 403 and a second electrode layer 404. The epitaxial structure 401 includes a first surface side and a second surface side, and includes a first semiconductor layer 4011, an active layer 4012 and a second semiconductor layer 4013 in sequence from the first surface side to the second surface side. In one example, the epitaxial structure 401 exposes a portion of the first semiconductor layer 4011 on the second surface side. The exposed portion of the first semiconductor layer 4011 can be in any structural form, and the present invention is not limited to this. For example, the exposed portion of the first semiconductor layer 4011 can be located at the edge of the epitaxial structure 401, and can form a step structure with the second semiconductor layer 4013 located on the second surface side; or it can be an electrode hole formed in the second semiconductor layer 4013, and the bottom of the electrode hole is the exposed first semiconductor layer 4011. The first electrode layer 403 is arranged above the first semiconductor layer 4011 exposed on the second surface 407, and is connected to the first semiconductor layer 4011. The second electrode layer 404 is disposed above the second semiconductor layer 4013 on the second surface side and is connected to the second semiconductor layer 4013. Optionally, the semiconductor layer on the second surface side is further covered with an insulating layer 405, the first electrode layer 403 is connected to the first semiconductor layer 4011 via a first electrode contact layer 4021 disposed in the insulating layer 405, and the second electrode layer 404 is connected to the second semiconductor layer 4013 via a second electrode contact layer 4022 disposed in the insulating layer 405.

[0112] Optionally, the first surface 406 of the micro-luminescent element 400 may be a patterned surface or a flat surface, wherein the patterned surface may be a regular patterned surface or an irregular roughened surface, which is not limited in this embodiment. Figure 5 In the embodiment, the first surface 406 of the micro-luminescent element 400 is an irregular roughened surface. Figure 6 In FIG. 4 , the first surface 406 of the micro-luminescent element 400 is a flat surface. Figure 7 In the embodiment, the first surface 406 of the micro-luminescent element 400 is a regular pattern surface. Due to the different structures of the first surface 406, the contact surface between the first surface of the micro-luminescent element 400 and the imprint head is different under the same transfer pressure, which affects the transfer yield. The pickup layer with the same structure of the pickup surface formed on the first surface 406 can ensure the same transfer efficiency.

[0113] Optionally, refer to Figure 8 A dielectric layer 408 is also formed on the first surface 406 of the micro-luminescent element 400, and a pickup layer 410 is formed on the dielectric layer 408. The dielectric layer 408 may be an anti-reflection film, which is used to improve the light transmittance of the micro-luminescent element. Optionally, the anti-reflection film is a SiO2 anti-reflection film.

[0114] The first surface (i.e., the adhesive surface) can be either the surface with the electrode or the light-emitting surface of the micro-luminescent element. Figure 4a and 5 , the first semiconductor layer 4011 corresponding to the first surface side of the epitaxial structure 401 forms the first surface 406 of the micro-luminescent element 400, and the surface having the first electrode layer 403 and the second electrode layer 404 corresponding to the second surface side of the epitaxial structure 401 forms the second surface 407. That is, the light emitting surface of the micro-luminescent element 400 is the first surface 406, which is also the surface forming the pickup layer 410. In one example, referring to Figure 4a and 9 The first semiconductor layer 4011 corresponding to the first surface side of the epitaxial structure 401 is formed as the second surface 407 of the micro-luminescent element 400, and the surface having the first electrode layer 403 and the second electrode layer 404 corresponding to the second surface side of the epitaxial structure 401 is formed as the first surface 406, that is, the surface of the micro-luminescent element 400 having the electrode layer is the first surface 406, that is, the surface forming the pickup layer 410.

[0115] Of course, the structure of the micro-luminescent element is not limited to a horizontal structure, but can also be a vertical structure. Fig.10 The micro-luminescent element 400 includes a first surface side and a second surface side, and the epitaxial structure 401 includes a first semiconductor layer 4011, an active layer 4012, and a second semiconductor layer 4013 in sequence from the first surface side to the second surface side. The first electrode layer 403 is disposed above the first semiconductor layer 4011 on the first surface side and is connected to the first semiconductor layer 4011. The second electrode layer 404 is disposed above the second semiconductor layer 4013 on the second surface side and is connected to the second semiconductor layer 4013. Thus, the micro-luminescent element 400 is formed as a chip with a vertical structure. Any surface of the micro-luminescent element 400 can be used as the first surface 406, that is, a surface forming the pickup layer 410.

[0116] Reference Figures 4a to 10, the pickup layer 410 is arranged on the first surface 406 of the micro-luminescent element 400, and at least partially covers the first surface 406, and the surface of the pickup layer 410 facing away from the first surface 406 is the pickup surface. When the micro-luminescent element 400 is transferred in multiple groups of micro-luminescent components using the stamping head 500, since the structure of the pickup layer 410 on the surface of the micro-luminescent element 400 is the same, the same pressure can be applied to transfer the micro-luminescent element 400. Since the structure of the pickup surface is the same, the contact area between the stamping head 500 and the pickup surface is also the same, which will not cause the micro-luminescent element 400 to fall off due to the contact area, thereby improving the transfer yield. The pickup surface of the pickup layer 410 can be a patterned surface or a flat surface. Optionally, in order to achieve maximum contact between the stamping head 500 and the pickup surface of the micro-luminescent element 400 using a smaller force, the pickup surface of the pickup layer 410 is set as a flat surface in this embodiment. Optionally, the material of the pickup layer 410 may be a polymer material or other materials that are easy to form or remove.

[0117] Reference Figure 4a The pickup layer 410 may be a layer that covers the first surface of the micro-luminescent element 400. Figure 4c Or 4d, it can also partially cover the first surface of the micro-luminescent element 400, as long as it does not affect the pickup of the imprint head. For example, the pickup layer 410 covers at least half of the area of ​​the first surface of the micro-luminescent element 400 to ensure good pickup efficiency. Figure 4d , the pickup layer 410 may also include a plurality of sub-pickup layers 411 that are spaced apart, and each sub-pickup layer 411 is spaced apart. Furthermore, in order to ensure the adhesion between the micro-luminescent element 400 and the imprint head 500, and further improve the transfer yield. The pickup layer 410 in this embodiment may also be made of a material with a certain viscosity to enhance the adhesion between the pickup layer 410 and the imprint head 500. For example, the material of the pickup layer 410 may be a viscous polymer material, such as polydimethylsiloxane (PDMS), polyimide (PI) or benzocyclobutene (BCB), etc. The pickup layer 410 may be formed by spin coating or chemical vapor deposition. Optionally, the thickness of the pickup layer 410 is less than 5μm. Optionally, the pickup layer 410 is a light-transmitting layer or a transparent layer.

[0118] Example 2

[0119] This embodiment provides a method for transferring a micro-light-emitting component, including:

[0120] S1: providing a micro-light-emitting component, the micro-light-emitting component comprising a substrate, a plurality of micro-light-emitting elements suspended on the substrate, each micro-light-emitting element being connected to the substrate via a supporting structure to form a cavity in a region between the micro-light-emitting element and the substrate; a pickup layer is provided on a surface of the micro-light-emitting element away from the substrate, the pickup layer at least covers a portion of a surface of the micro-light-emitting element away from the substrate, and a surface of the pickup layer away from the micro-light-emitting element is a pickup surface;

[0121] Specifically, refer to Figure 4a or Figure 4b The step of providing a micro-luminescent component includes: providing a growth substrate, forming a micro-luminescent element 400 on the growth substrate. A chain structure 300 is formed on both sides of the micro-luminescent element 400, a sacrificial layer is covered on the surface of the chain structure 300 and the micro-luminescent element 400, and an anchor structure 200 is formed on at least the side of the micro-luminescent element 400, the chain structure 300 and the sacrificial layer. The substrate 100 is bonded on the anchor structure 200, and the growth substrate is removed to expose the micro-luminescent element 400. A pickup layer 410 is formed on the exposed surface of the micro-luminescent element 400. The sacrificial layer is removed so that the micro-luminescent element 400 is suspended on the groove to form a micro-luminescent component. The sacrificial layer can be selected from a material whose removal efficiency of the sacrificial layer is higher than that of the chip under specific circumstances, such as a metal material or an organic material, and the specific circumstances include chemical decomposition or physical decomposition, such as ultraviolet light decomposition, etching removal or impact removal.

[0122] S2: Control the embossing head to move to the position of the micro-luminescent element of the micro-luminescent assembly corresponding to the pickup layer, until the embossing head contacts the pickup layer;

[0123] Specifically, refer to Fig.11 , control the imprint head 500 to move to the position of the micro-light-emitting component corresponding to the pickup layer 410, until the imprint head 500 contacts the pickup layer 410.

[0124] S3: applying pressure to the micro-luminescent element from the embossing head, so that the chain structures on both sides of the micro-luminescent element of the micro-luminescent assembly are broken, and the embossing head is bonded to the pickup layer of the micro-luminescent element;

[0125] Specifically, in Fig.11 On the basis of, a certain pressure is applied to the stamping head 500 to break the chain structure 300 on both sides of the micro-luminescent element 400. At this time, the stamping head 500 and the pickup layer 410 of the micro-luminescent element 400 are bonded under the action of pressure, and the stamping head 500 picks up the micro-luminescent element 400.

[0126] S4: Move the imprint head to transfer the picked-up micro-luminescent element to the target substrate.

[0127] Specifically, refer to Fig.12, move the imprint head 500 bonded with the micro-luminescent element 400 to the target substrate 600, refer to Fig.13 , the micro-luminescent element 400 is bonded to the pad 601 of the target substrate 600. Subsequently, it can be selected whether to remove the pickup layer 410 according to the function of the pickup layer 410. If the pickup layer 410 is set on the light-emitting side of the micro-luminescent element 400 and is a transparent insulating material, the pickup layer 410 can be retained to protect the surface of the micro-luminescent element 400 without affecting the light emission of the micro-luminescent element 400. In some embodiments, the pickup layer 410 can also be removed. For example, the pickup layer 410 can be removed by wet etching or dry etching.

[0128] Example 3

[0129] This embodiment provides a display device, which is manufactured by the transfer method of the micro-luminescent element in the above embodiment 2. Since the display device is manufactured by the transfer method of the micro-luminescent element, the manufacturing efficiency of the display device is higher and the manufacturing cost is lower.

[0130] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A micro-light emitting component, characterized in that: include: substrate; A plurality of micro-luminescent elements are arranged on the substrate at intervals, and each of the micro-luminescent elements is connected to the substrate through a supporting structure, and a cavity is formed in a region between the micro-luminescent element and the substrate, and each of the micro-luminescent elements includes a first surface away from the substrate and a second surface away from the first surface; The pickup layer is disposed on the first surface of each of the micro-luminescent elements and at least partially covers the first surface. The surface of the pickup layer facing away from the first surface is the pickup surface.

2. The micro-light emitting assembly according to claim 1, characterized in that: The first surface of the micro-luminescent element is a patterned surface or a flat surface.

3. The micro-light emitting assembly according to claim 1, characterized in that: The micro-luminescent element comprises: An epitaxial structure, comprising a first surface side and a second surface side, wherein the epitaxial structure comprises a first semiconductor layer, an active layer and a second semiconductor layer in sequence from the first surface side to the second surface side, and the epitaxial structure exposes a portion of the first semiconductor layer on the second surface side; A first electrode layer is disposed above the first semiconductor layer exposed on the second surface side and is connected to the first semiconductor layer; The second electrode layer is disposed above the second semiconductor layer on the second surface side and is connected to the second semiconductor layer.

4. The micro-light emitting assembly according to claim 3, characterized in that: The surface of the first semiconductor layer corresponding to the first surface side of the epitaxial structure is formed as the first surface of the micro-light-emitting element, and the surface having the first electrode layer and the second electrode layer corresponding to the second surface side of the epitaxial structure is formed as the second surface.

5. The micro-light emitting assembly according to claim 3, characterized in that: The surface of the first semiconductor layer corresponding to the first surface side of the epitaxial structure is formed as the second surface of the micro-light-emitting element, and the surface having the first electrode layer and the second electrode layer corresponding to the second surface side of the epitaxial structure is formed as the first surface.

6. The micro-light emitting assembly according to claim 4, characterized in that: A dielectric layer is formed on the first surface of the epitaxial structure, and the pickup layer is formed on the dielectric layer.

7. The micro-light emitting assembly according to claim 1, characterized in that: The pickup layer has adhesive properties.

8. The micro-light emitting assembly according to claim 1 or 7, characterized in that: The material of the pickup layer is a high molecular polymer material.

9. The micro-light emitting assembly according to claim 8, characterized in that: The pickup layer is a light-transmitting layer, and the thickness of the pickup layer is less than 5 μm.

10. The micro-light emitting assembly according to claim 1, characterized in that: The pickup layer includes two or more sub-pickup layers, and each of the sub-pickup layers is arranged at intervals.

11. The micro-light emitting assembly according to claim 1, characterized in that: The support structure comprises: An anchor structure, fixedly disposed on the substrate; A chain structure has one end connected to the anchor structure and the other end connected to the micro-luminescent element.

12. The micro-light emitting assembly according to claim 1, characterized in that: The micro-luminescent element comprises: An epitaxial structure, comprising a first surface side and a second surface side, wherein the epitaxial structure comprises a first semiconductor layer, an active layer and a second semiconductor layer in sequence from the first surface side to the second surface side; A first electrode layer is disposed above the first semiconductor layer on the first surface side and is connected to the first semiconductor layer; The second electrode layer is disposed above the second semiconductor layer on the second surface side and is connected to the second semiconductor layer.

13. The micro-light emitting assembly according to claim 12, characterized in that: The side of the epitaxial structure having the first electrode layer is the first side, and the side of the epitaxial structure having the second electrode layer is the second side.

14. A method for transferring a micro-luminescent component, characterized in that: include: A micro-light emitting component is provided, the micro-light emitting component comprising a substrate, a plurality of micro-light emitting elements suspended on the substrate, each of the micro-light emitting elements being connected to the substrate via a supporting structure to form a cavity in a region between the micro-light emitting element and the substrate; A pickup layer is disposed on a side of the micro-luminescent element away from the substrate, the pickup layer at least partially covers the side of the micro-luminescent element away from the substrate, and a side of the pickup layer away from the micro-luminescent element is a pickup surface; Controlling the stamping head to move to a position of the micro-light-emitting component corresponding to the pickup layer, until the stamping head contacts the pickup layer; Applying pressure on the micro-luminescent element from the stamping head to break the support structure of the micro-luminescent element, and the stamping head is bonded to the pickup layer of the micro-luminescent element; The imprint head is moved to transfer the picked-up micro-luminescent element to a target substrate.

15. The method for transferring a micro-luminescent component according to claim 14, characterized in that: The step of providing a micro-light emitting component includes: providing a growth substrate; forming a micro-light-emitting element on the growth substrate; forming a chain structure on both sides of the micro-luminescent element; Covering the surface of the chain structure and the micro-light-emitting element with a sacrificial layer; forming an anchor structure on at least the side surfaces of the micro-luminescent element, the chain structure and the sacrificial layer; Bonding a substrate to the anchor structure, and removing the growth substrate to expose the micro-luminescent element; forming a pickup layer on the exposed surface of the micro-luminescent element; The sacrificial layer is removed to form the micro-light-emitting component.

16. The method for transferring a micro-luminescent component according to claim 14, characterized in that: After the step of moving the imprint head to transfer the picked-up micro-luminescent element to the target substrate, the method further includes: The pickup layer is removed.

17. A display device, characterized in that: The micro-luminescent element is prepared by the transfer method of any one of claims 14 to 16.

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