Mini LED packaging structure and packaging method thereof

Abstract

The invention discloses a Mini LED packaging structure and a packaging method thereof, and relates to the field of Mini LEDs, the Mini LED packaging structure comprises a packaging plate and a packaging frame, the top of the packaging plate is provided with a plurality of groups of packaging grooves, a substrate is arranged in the packaging grooves in a sliding manner, the bottom of the substrate is provided with a guide column, the guide column is provided with a guide column hole, and the packaging frame is provided with a plurality of LED chips. Inserting rods are symmetrically and slidably arranged in the packaging plate and located on the two sides of the packaging groove in the vertical direction, sliding rods are transversely and slidably arranged at the bottoms of the inserting rods, a plurality of sets of heat dissipation holes are formed in the packaging groove, and heat conduction columns are installed in the heat dissipation holes. According to the LED lamp bead packaging device, the packaging frame is fixed under the cooperation of the limiting mechanism and the limiting hole in the inserting rod, meanwhile, the sliding rod moves towards one side to be inserted into the guide column hole of the guide column, therefore, packaging work of LED lamp beads is completed, the heat conduction column is driven to move upwards after packaging is completed subsequently, and part of heat generated by the heat conduction column is discharged to the bottom through the heat conduction column.

Description

Technical Field

[0001] The present invention relates to the field of Mini LED, and in particular to a Mini LED packaging structure and a packaging method thereof. Background Art

[0002] Mini-LED device, an LED device with a chip long side size between 100 and 300 um, is composed of a Mini LED pixel array and a driving circuit with a pixel center spacing of 0.3-1.5mm. With the rapid development of Mini LED display technology, Mini LED display products have begun to be used in ultra-large-screen high-definition displays, such as monitoring and command, high-definition broadcasting, high-end cinemas, medical diagnosis, advertising display, conferences and exhibitions, office display, virtual reality and other commercial fields.

[0003] Most of the existing Mini LED packaging is done through welding. The packaging efficiency is too low in this process and it wastes too much manpower and material resources. At the same time, the Mini LED after packaging will generate some heat during the operation process. The heat will accumulate in the packaging frame for a long time, which can easily reduce the overall service life of the Mini LED, thereby affecting the overall operation of the device.

[0004] In summary, the overall packaging efficiency of the above structure is too low during the packaging process, and heat accumulates in the packaging board for a long time, which can easily reduce the overall service life of the Mini LED, thereby affecting the overall operation of the device. Summary of the invention

[0005] Based on this, the purpose of the present invention is to provide a Mini LED packaging structure and a packaging method thereof to solve the technical problems that the packaging efficiency is too low and the heat accumulates in the packaging board for a long time, which can easily reduce the overall service life of the Mini LED and thus affect the overall operation of the device.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a packaging structure of Mini LED, comprising a packaging plate and a packaging frame, an array packaging groove is arranged on the top of the packaging plate, and a substrate is slidably arranged in the packaging groove, a guide column is installed on the bottom of the substrate, and a guide column hole is opened on the guide column, an insertion rod is symmetrically slidably arranged on both sides of the packaging groove in the vertical direction in the packaging plate, and a sliding rod is horizontally slidably arranged at the bottom of the insertion rod, the other end of the sliding rod is eccentrically arranged between the guide column hole, an array of heat dissipation holes is opened in the packaging groove, and a heat-conducting column is installed in the heat dissipation hole, the other end of the heat-conducting column is connected to the substrate, a limiting hole is opened on the insertion rod, and a limiting mechanism matching with it is installed in the packaging plate.

[0007] By adopting the above technical solution, the packaging frame is fixed by the cooperation of the limiting mechanism and the limiting hole on the insertion rod, and at the same time, the sliding rod moves to one side and is inserted into the guide post hole of the guide post, thereby driving the substrate to move upward, thereby completing the packaging of the LED lamp beads. After the subsequent packaging is completed, the thermal conductive column will be driven to move upward. In this process, the thermal conductive column is flush with the bottom of the packaging board, which is convenient for subsequent staff to install it. At the same time, during the subsequent operation of the LED lamp beads, part of the heat generated will be discharged to the bottom through the thermal conductive column.

[0008] The present invention is further configured such that the limiting mechanism includes a telescopic cylinder, a limiting block and a compression spring, the packaging plate is installed with a telescopic cylinder, and a compression spring is connected inside the telescopic cylinder, the other end of the compression spring is connected to the limiting block, and one end of the limiting block is arranged in an arc shape.

[0009] By adopting the above technical solution, a telescopic cylinder is fixedly installed in the packaging plate, and the limit block is brought into contact with the outer wall of the insertion rod under the action of the compression spring. At this time, the compression spring itself is in a compressed state, and then the insertion rod is driven to slide downward during the installation of the packaging frame. When the limit hole on the insertion rod and the limit block are at the same horizontal height, the limit block is inserted into the limit hole through the restoring force of the compression spring itself, thereby completing the fixing of the entire insertion rod.

[0010] The present invention is further configured such that a pad is provided on the top of the insertion rod, and the pad is snap-connected with the bottom of the packaging frame.

[0011] By adopting the above technical solution, the packaging frame can be easily supported as a whole by the pad, and the clip-on arrangement between the two can facilitate the packaging frame to be displaced during installation.

[0012] The present invention is further configured such that both sides of the guide post hole are configured in an open shape.

[0013] By adopting the above technical solution, the open-shaped setting ensures that the sliding rod can be stably inserted into the guide column during the sliding process of the sliding rod to one side. At the same time, the open-shaped setting guides the sliding rod, further improving the stability of the overall movement of the sliding rod.

[0014] The present invention is further configured such that the packaging frame includes a reflective layer, a water and oxygen barrier layer and a light-transmitting layer, the outer wall of the packaging frame is provided with a water and oxygen barrier layer, and the inner wall thereof is provided with a reflective layer, and a light-transmitting layer is provided between the water and oxygen barrier layer and the reflective layer.

[0015] By adopting the above technical scheme, the water oxygen barrier layer absorbs the water oxygen that penetrates into the LED lamp beads, thereby protecting the LED lamp beads and extending the life of the LED lamp beads. The light transmittance ensures the overall working brightness of the LED lamp beads, and the reflective layer ensures the uniformity of the diffusion of the LED lamp beads, further improving the overall working stability of the device.

[0016] The present invention is further configured such that a groove is provided on the top of the substrate, and a rough surface is provided on the inner wall of the groove.

[0017] By adopting the above technical solution, the LED lamp bead is easily placed on the top of the substrate due to the action of the groove, and the rough surface in the groove increases the sliding friction between the LED lamp bead and the outer wall of the LED lamp bead, thereby ensuring the stability of the LED lamp bead on the top of the substrate.

[0018] The present invention is further configured such that the bottom end of the insert rod and both ends of the sliding rod are both configured in an arc shape.

[0019] By adopting the above technical solution, the arc-shaped setting makes it easier for the insertion rod to stably squeeze the sliding rod at the bottom, thereby ensuring the stability of the sliding rod in sliding in the packaging plate.

[0020] The present invention is further configured such that mounting holes are symmetrically arranged on the top of the packaging plate.

[0021] By adopting the above technical solution, it is convenient for workers to install the device at a designated position through the installation hole.

[0022] A Mini LED packaging method includes the following steps: Step 1: Place the LED lamp beads inside the packaging groove, and then install the packaging frame on the top of the packaging board. At this time, the packaging board and the packaging frame are sealed, and the installation of the packaging frame is completed under the cooperation of the limiting mechanism and the limiting hole; Step 2: The water-oxygen barrier layer of the outermost wall of the packaging frame is composed of water-oxygen absorbing particles, and the diameter of the water-oxygen absorbing particles ranges from 0.15 μm to 0.3 μm, the thickness of the reflective layer of the innermost wall ranges from 0.5 μm to 1.5 μm, and the overall thickness of the light-transmitting layer is 0.1 mm to 0.3 mm; Step 3: When the sliding rod slides, the guide column drives the substrate to move upward, and at the same time, the thermal conductive column slides in the heat dissipation hole, so that the thermal conductive column is flush with the bottom of the packaging board.

[0023] By adopting the above technical solution, while ensuring stable packaging of the LED lamp beads, it can also achieve the effect of heat dissipation for the LED lamp beads during operation.

[0024] In summary, the present invention mainly has the following beneficial effects: 1. The present invention provides a plug rod for sliding in the vertical direction in the packaging plate, and a sliding rod for sliding horizontally at the bottom thereof. When packaging the LED lamp beads, the packaging frame is inserted into the top of the plug rod, and then the plug rod is driven to slide downward. In this process, the packaging frame is fixed by the cooperation of the limiting mechanism and the limiting hole on the plug rod. At the same time, the sliding rod moves to one side and is inserted into the guide post hole of the guide post. Since the guide post hole and the sliding rod are eccentrically arranged, the substrate is driven to move upward, thereby completing the packaging of the LED lamp beads. In this process, a lot of manpower and material resources are saved, and the packaging burden of the staff is effectively reduced. 2. The present invention provides a heat dissipation hole on the packaging groove, and a heat-conducting column is installed in the heat dissipation hole. At the same time, the other end of the heat-conducting column is located at the bottom of the substrate. Under normal conditions, one end of the heat-conducting column penetrates the bottom of the packaging board. After the subsequent packaging is completed, the heat-conducting column will be driven to move upward. During this process, the heat-conducting column is flush with the bottom of the packaging board, which is convenient for subsequent staff to install it. At the same time, during the subsequent operation of the LED lamp bead, part of the heat generated by it will be discharged to the bottom through the heat-conducting column, thereby facilitating internal heat dissipation and ensuring the stability of the overall operation of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A top perspective view of the present invention; Figure 2 A bottom-up stereogram of the present invention; Figure 3 It is a schematic diagram of the heat dissipation hole structure of the present invention; Figure 4 This is a schematic diagram of the structure of the packaging board of the present invention before packaging; Figure 5 This is a schematic diagram of the structure of the packaging board after packaging of the present invention; Figure 6 For the present invention Figure 4 A magnified view of middle; Figure 7 For the present invention Figure 4 Enlarged view of B.

[0026] In the figure: 1. packaging board; 2. packaging groove; 3. LED lamp bead; 4. packaging frame; 5. heat dissipation hole; 6. sliding rod; 7. groove; 8. thermal conductive column; 9. base plate; 10. plug rod; 11. guide column; 12. pad; 13. limit hole; 14. limit mechanism; 15. guide column hole. DETAILED DESCRIPTION

[0027] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0028] The following describes an embodiment of the present invention based on its overall structure.

[0029] Embodiment 1 A Mini LED packaging structure and packaging method thereof, such as Figure 1-Figure 7 As shown, it includes a packaging plate 1, a packaging groove 2, an LED lamp bead 3, a packaging mechanism, a heat dissipation mechanism and a clamping mechanism. A substrate 9 is slidably arranged in the packaging groove 2, wherein a groove 7 is provided on the top of the substrate 9, and a rough surface is provided on the inner wall of the groove 7. The LED lamp bead 3 is conveniently placed on the top of the substrate 9 by the action of the groove 7. The rough surface in the groove 7 increases the sliding friction between the LED lamp bead 3 and the outer wall of the LED lamp bead 3, thereby ensuring the stability of the LED lamp bead 3 on the top of the substrate 9. Subsequently, the packaging frame 4 is clamped on the top of the packaging plate 1. In the vertical direction on both sides of the packaging groove 2 in the packaging plate 1, The insert rod 10 is symmetrically slidably arranged, and the sliding rod 6 is lateraly slidably arranged at the bottom of the insert rod 10. The insert rod 10 will be driven to slide downward during the clamping process of the packaging frame 4. During this process, the insert rod 10 will cause the sliding rod 6 to slide horizontally. Since a guide column 11 is installed at the bottom of the substrate 9, and a guide column hole 15 is opened on the guide column 11, and the other end of the sliding rod 6 is eccentrically arranged with the guide column hole 15, the substrate 9 will be driven to move upward, thereby completing the packaging work of the LED lamp bead 3. In this process, a lot of manpower and material resources are saved, and the packaging burden of the staff is effectively reduced; A limiting hole 13 is provided on the plug rod 10, and a limiting mechanism 14 cooperating therewith is installed in the packaging plate 1. When the plug rod 10 slides downward, the packaging frame 4 is fixed by the limiting mechanism 14 cooperating with the limiting hole 13 on the plug rod 10. At the same time, an array of heat dissipation holes 5 is provided in the packaging groove 2, and a heat-conducting column 8 is installed in the heat-dissipating hole 5, and the other end of the heat-conducting column 8 is connected to the substrate 9. Under normal conditions, one end of the heat-conducting column 8 passes through the bottom of the packaging plate 1, and the heat-conducting column 8 will be driven to move upward after the packaging is completed. In this process, the heat-conducting column 8 is flush with the bottom of the packaging plate 1, which is convenient for subsequent staff to install it. At the same time, during the subsequent operation of the LED lamp bead 3, part of the heat generated by it will be discharged to the bottom through the heat-conducting column 8, thereby facilitating internal heat dissipation and ensuring the stability of the overall operation of the device.

[0030] See also Figure 4A pad 12 is provided on the top of the insertion rod 10, and the pad 12 and the bottom of the packaging frame 4 are in a clip-on arrangement. The pad 12 is used to support the packaging frame 4 as a whole. At the same time, the clip-on arrangement between the two is convenient for the packaging frame 4 to shift in position during the installation process. Both sides of the guide post hole 15 are open-shaped. The open-shaped arrangement ensures that the sliding rod 6 can be stably inserted into the guide post 11 during the sliding process to one side. At the same time, the open-shaped arrangement guides the sliding rod 6, further improving the stability of the overall movement of the sliding rod 6.

[0031] See also Figure 5 The packaging frame 4 includes a reflective layer, a water-oxygen barrier layer and a light-transmitting layer. A water-oxygen barrier layer is arranged on the outer wall of the packaging frame 4. The water-oxygen barrier layer absorbs water and oxygen that penetrate into the LED lamp beads, protects the LED lamp beads and prolongs the life of the LED lamp beads. A reflective layer is arranged on its inner wall. At the same time, the reflective layer ensures the uniformity of the diffusion of the LED lamp beads, further improving the overall working stability of the device. A light-transmitting layer is arranged between the water-oxygen barrier layer and the reflective layer, and the light-transmitting layer ensures the overall working brightness of the LED lamp beads.

[0032] Embodiment 2 like Figure 6 A Mini LED packaging structure and packaging method shown in the figure have an overall structure similar to that of the first embodiment, wherein the limiting mechanism 14 includes a telescopic tube, a limiting block and a compression spring, a telescopic tube is installed in the packaging plate 1, and a compression spring is connected inside the telescopic tube, the other end of the compression spring is connected to the limiting block, and one end of the limiting block is arranged in an arc shape, and the telescopic tube is fixedly installed in the packaging plate 1, and the limiting block contacts the outer wall of the insertion rod 10 under the action of the compression spring, at which time the compression spring itself is in a compressed state, and then during the installation of the packaging frame 4, the insertion rod 10 is driven to slide downward, and when the limiting hole 13 on the insertion rod 10 and the limiting block are at the same horizontal height, the limiting block is inserted into the limiting hole 13 through the reset force of the compression spring itself, thereby completing the fixing of the insertion rod 10 as a whole.

[0033] The working principle of the present invention is as follows: when in use, the LED lamp bead 3 to be packaged is placed inside the packaging groove 2, and then the bottom end of the packaging frame 4 is clamped with the pad 12. The clamping setting prevents the pad 12 from separating from the packaging frame 4, and then the pad 12 is pressed downward. During this process, the pad 12 will drive the bottom plug rod 10 to slide downward, and the limiting mechanism 14 and the limiting hole 13 on the plug rod 10 cooperate to complete the limiting work of the plug rod 10, and a sliding rod 6 is provided at the bottom end of the plug rod 10 to slide horizontally, and the sliding rod 6 moves to one side and is inserted into the guide post hole 15 of the guide post 11. Since the guide post hole 15 and the sliding rod 6 are eccentrically arranged, the substrate 9 will be driven to move upward, thereby completing the packaging work of the LED lamp bead 3, saving a lot of manpower and material resources; At the same time, a heat-conducting column 8 is installed in the heat dissipation hole 5. After the packaging is completed, the heat-conducting column 8 will be driven to move upward. During this process, the heat-conducting column 8 is flush with the bottom of the packaging board 1, which is convenient for subsequent staff to install it. At the same time, during the subsequent operation of the LED lamp bead 3, part of the heat generated by it will be discharged to the bottom through the heat-conducting column 8, thereby facilitating internal heat dissipation.

[0034] Although an embodiment of the present invention has been shown and described, this specific embodiment is only an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contribution as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A Mini LED packaging structure, comprising a packaging board (1) and a packaging frame (4), characterized in that: An array of packaging grooves (2) is arranged on the top of the packaging plate (1), and a base plate (9) is slidably arranged in the packaging groove (2), a guide column (11) is installed at the bottom of the base plate (9), and a guide column hole (15) is provided on the guide column (11), an insertion rod (10) is symmetrically slidably arranged on both sides of the packaging groove (2) in the packaging plate (1), and a sliding rod (6) is slidably arranged at the bottom of the insertion rod (10), and the other end of the sliding rod (6) is eccentrically arranged with respect to the guide column hole (15), an array of heat dissipation holes (5) is provided in the packaging groove (2), and a heat conducting column (8) is installed in the heat dissipation hole (5), and the other end of the heat conducting column (8) is connected to the base plate (9), a limiting hole (13) is provided on the insertion rod (10), and a limiting mechanism (14) cooperating with the limiting hole is installed in the packaging plate (1).

2. The Mini LED packaging structure according to claim 1, characterized in that: The limiting mechanism (14) comprises a telescopic cylinder, a limiting block and a compression spring. The packaging plate (1) is provided with a telescopic cylinder, and a compression spring is connected to the telescopic cylinder. The other end of the compression spring is connected to the limiting block, and one end of the limiting block is arranged in an arc shape.

3. The Mini LED packaging structure according to claim 1, characterized in that: A pad (12) is provided on the top of the insertion rod (10), and the pad (12) and the bottom of the packaging frame (4) are arranged in a snap-fitting manner.

4. The Mini LED packaging structure according to claim 1, characterized in that: Both sides of the guide post hole (15) are arranged in an open shape.

5. The Mini LED packaging structure according to claim 1, characterized in that: The packaging frame (4) comprises a reflective layer, a water-oxygen barrier layer and a light-transmitting layer; the outer wall of the packaging frame (4) is provided with a water-oxygen barrier layer, and the inner wall thereof is provided with a reflective layer; and a light-transmitting layer is provided between the water-oxygen barrier layer and the reflective layer.

6. The Mini LED packaging structure according to claim 1, characterized in that: A groove (7) is provided on the top of the base plate (9), and a rough surface is provided on the inner wall of the groove (7).

7. The Mini LED packaging structure according to claim 1, characterized in that: The bottom end of the insert rod (10) and the two ends of the sliding rod (6) are both arranged in an arc shape.

8. The Mini LED packaging structure according to claim 1, characterized in that: The top of the packaging plate (1) is symmetrically provided with mounting holes.

9. A method for packaging Mini LED, characterized in that: The following steps are involved: Step 1: Place the LED lamp beads inside the packaging groove, and then install the packaging frame on the top of the packaging board. At this time, the packaging board and the packaging frame are sealed, and the installation of the packaging frame is completed under the cooperation of the limiting mechanism and the limiting hole; Step 2: The water-oxygen barrier layer of the outermost wall of the packaging frame is composed of water-oxygen absorbing particles, and the diameter of the water-oxygen absorbing particles ranges from 0.15 μm to 0.3 μm, the thickness of the reflective layer of the innermost wall ranges from 0.5 μm to 1.5 μm, and the overall thickness of the light-transmitting layer is 0.1 mm to 0.3 mm; Step 3: When the sliding rod slides, the guide column drives the substrate to move upward, and at the same time, the thermal conductive column slides in the heat dissipation hole, so that the thermal conductive column is flush with the bottom of the packaging board.

Images