Electronic device and manufacturing method thereof

Abstract

The invention provides an electronic device and a manufacturing method thereof. The electronic device includes: a substrate; the plurality of electronic components are arranged on the substrate, and in a first direction, a first interval is formed between every two adjacent electronic components; the protection glue is arranged on the substrate and the plurality of electronic components, the protection glue is provided with at least one groove, and the at least one groove is arranged between two adjacent electronic components; wherein the distance between the edge of one of the two adjacent electronic components and the at least one groove meets the following formula (1): 0.3 mm < = D1lt; (P / 2) (1) wherein D1 is the distance between the edge of one of the two adjacent electronic components and the at least one trench, and P is the first spacing.

Description

Technical Field

[0001] The present disclosure relates to an electronic device and a manufacturing method thereof, and in particular to an electronic device with protective glue. Background Art

[0002] With the advancement of technology and in order to meet the needs of consumers, the market has continuously increased the resolution and contrast requirements of electronic devices. Direct-type backlight modules can improve the contrast of electronic devices by regional light control, or improve the resolution of electronic devices by adjusting the size of diodes, and are more applicable than edge-type backlight modules.

[0003] However, electronic devices using direct-type backlight modules still have problems such as poor light extraction efficiency, high cost or complicated process steps. Therefore, it is urgent to provide an electronic device and a manufacturing method thereof to improve the above defects. Summary of the invention

[0004] The present disclosure provides an electronic device, characterized in that it comprises: a substrate; a plurality of electronic components disposed on the substrate, wherein in a first direction, a first spacing exists between two adjacent electronic components; and a protective glue disposed on the substrate and the plurality of electronic components, and the protective glue has at least one groove, wherein the at least one groove is disposed between the two adjacent electronic components; wherein the distance between an edge of one of the two adjacent electronic components and the at least one groove satisfies the following formula (1):

[0005] 0.3mm≤D1<(P / 2) (1)

[0006] Wherein, D1 is the distance between the edge of one of the two adjacent electronic components and the at least one groove, and P is the first spacing.

[0007] The present disclosure further provides a method for manufacturing an electronic device, characterized by comprising: providing a substrate; arranging a plurality of electronic components on the substrate, and providing a first spacing between two adjacent electronic components in a first direction; and applying a protective glue on the plurality of electronic components and the substrate, and forming at least one groove in the protective glue, and the at least one groove is provided between the two adjacent electronic components; wherein the distance between an edge of one of the two adjacent electronic components and the at least one groove satisfies the following formula (1):

[0008] 0.3mm≤D1<(P / 2) (1)

[0009] Wherein, D1 is the distance between the edge of one of the two adjacent electronic components and the at least one groove, and P is the first spacing. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0011] Figure 2 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0012] Figure 3 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0013] Figure 4 is a block diagram of a method for manufacturing an electronic device according to an embodiment of the present disclosure.

[0014] Figure 5 The figure is a flow chart of a method for manufacturing an electronic device according to an embodiment of the present disclosure.

[0015] Description of reference numerals:

[0016] 1 substrate

[0017] 11 Upper surface

[0018] 2 Electronic components

[0019] 2A First Electronic Components

[0020] 2B Second electronic component

[0021] 21 Edge

[0022] 22 Upper surface

[0023] 3. Protective glue

[0024] 31 Upper surface

[0025] G Groove

[0026] G1 first sub-groove

[0027] G2 Second sub groove

[0028] G11, G21 Edge

[0029] D1 Distance

[0030] D2 Distance

[0031] H1, H2 Height

[0032] P First spacing

[0033] W, W1 Width

[0034] X first direction

[0035] Z Normal Direction DETAILED DESCRIPTION

[0036] The following describes the implementation of the present disclosure through specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways according to different viewpoints and applications without departing from the spirit of the present invention.

[0037] It should be noted that, in this document, unless otherwise specified, "having a" component is not limited to having a single component, but may have one or more components. Furthermore, the ordinal numbers used in the specification and claims, such as "first" and "second", to modify the components of the claims, do not themselves mean or represent any previous ordinal numbers of the claimed components, nor do they represent the order of one claimed component and another claimed component, or the order in the manufacturing method. The use of these ordinals is only used to make a claimed component with a certain name clearly distinguishable from another claimed component with the same name.

[0038] Certain words are used throughout the specification and the claims that follow to refer to specific components. It will be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following specification and claims, words such as "include", "contain", "have" are open-ended words, and therefore should be interpreted as "including but not limited to..." Therefore, when the terms "include", "contain" and / or "have" are used in the description of the present disclosure, they specify the presence of corresponding features, areas, steps, operations and / or components, but do not exclude the presence of one or more corresponding features, areas, steps, operations and / or components.

[0039] In the text, the terms "about", "approximately", "substantially", and "roughly" generally mean within 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5% of a given value or range. The numbers given here are approximate numbers, that is, in the absence of specific instructions for "about", "approximately", "substantially", and "roughly", the meanings of "about", "approximately", "substantially", and "roughly" can still be implied. In addition, the terms "range from a first value to a second value" and "range between a first value and a second value" mean that the range includes the first value, the second value, and other values ​​therebetween.

[0040] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0041] In addition, relative terms such as "below" or "bottom" and "above" or "top" may be used in the embodiments to describe the relative relationship of one component of the diagram to another component. It is understood that if the device of the diagram is turned over so that it is upside down, the component described on the "below" side will become the component on the "above" side. When a corresponding component (such as a film layer or area) is referred to as "on another component", it can be directly on the other component, or there can be other components between the two. On the other hand, when a component is referred to as "directly on another component", there is no component between the two. In addition, when a component is referred to as "on another component", the two have an up-and-down relationship in the top-down direction, and this component can be above or below the other component, and this up-and-down relationship depends on the orientation of the device.

[0042] In the present disclosure, the distance and thickness can be measured by an optical microscope, and the distance and thickness can be measured by a cross-sectional image in an electron microscope, but the present disclosure is not limited thereto. In addition, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0043] It should be noted that the technical solutions provided in the following different embodiments can be replaced, combined or mixed with each other to form another embodiment without violating the spirit of the present disclosure.

[0044] The electronic device disclosed herein may include a sensing device, a display device, a light-emitting device, an antenna device, a touch display, a curved display, or a free shape display, but is not limited thereto. The electronic components in the electronic device may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode includes a light-emitting diode or a photodiode. The light-emitting diode includes an organic light emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro LED, or a quantum dot light-emitting diode (quantum dot, QD, which may be, for example, QLED, QDLED) or any combination of the above materials, but is not limited thereto. The electronic device may be, for example, a bendable or flexible electronic device, but is not limited thereto. The sensing device may be, for example, a sensing device for detecting capacitance changes, light, heat energy, or ultrasound, but is not limited thereto. The display device may, for example, include a light-emitting diode, a fluorescent material, a phosphor material, other suitable display media, or a combination of the foregoing, but is not limited thereto. The display device may include, for example, a spliced ​​display device, but is not limited thereto. The antenna device may be, for example, a liquid crystal antenna, but is not limited thereto. In addition, the appearance of the electronic device may be, for example, a rectangular, circular, polygonal, a shape with curved edges, a curved surface (curved) or other suitable shapes. The electronic device may have peripheral systems such as a drive system, a control system, a light source system, a shelf system, etc. It should be noted that the electronic device may be any combination of the foregoing, but is not limited thereto.

[0045] Figure 1 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0046] In one embodiment of the present disclosure, Figure 1 As shown, the electronic device may include: a substrate 1; a plurality of electronic components 2, disposed on the substrate 1, wherein in a first direction X, a first spacing P is provided between two adjacent electronic components 2; and a protective adhesive 3, disposed on the substrate 1 and the electronic components 2, wherein the protective adhesive 3 has at least one groove G, wherein the at least one groove G is provided between two adjacent electronic components 2; wherein a distance D1 between an edge 21 of one of the two adjacent electronic components 2 and the at least one groove G satisfies the following formula (1):

[0047] 0.3mm≤D1<(P / 2) (1).

[0048] In the present disclosure, the “first spacing P” may refer to, for example, the distance between the centers of two adjacent electronic components 2 in the first direction X. Alternatively, the “first spacing P” may refer to, for example, the distance between the same-side edges of two adjacent electronic components 2 in the first direction X. The “distance D1” may refer to, for example, the shortest distance between the edge 21 of the electronic component 2 and the groove G adjacent thereto in the first direction X. In one embodiment, the “distance D1” may refer to, for example, the distance between the groove G and the adjacent electronic component 2 in the first direction X at a height H2 from the electronic component of the substrate 1. The “first direction X” may refer to, for example, a direction perpendicular to the normal direction Z of the substrate 1. The present disclosure can improve the light output of the electronic device by designing the distance D1 between the edge 21 of one of the two adjacent electronic components 2 and at least one groove G to satisfy the relationship of the above formula (1), so as to improve the poor light output efficiency or save costs. When the distance D1 satisfies the restrictions of the above formula (1), each distance D1 may be the same or different.

[0049] In the present disclosure, the material of the substrate 1 may include metal, alloy, polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethyleneterephthalate (PET), epoxy resin, bismaleimide, triazine or other plastic or polymer materials, or a combination of the foregoing, but the present disclosure is not limited thereto. In the present disclosure, the electronic component 2 may include a light emitting diode, such as an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro LED or a quantum dot light emitting diode (including QLED, QDLED), fluorescence, phosphor or other suitable materials, or a combination of the foregoing, but the present disclosure is not limited thereto.

[0050] In the present disclosure, the material of the protective glue 3 may be, for example, silicone or other transparent glue, but the present disclosure is not limited thereto. In the present disclosure, the transmittance of the protective glue 3 may be greater than or equal to 90%, for example, greater than or equal to 92%, greater than or equal to 95%, greater than or equal to 97%, but the present disclosure is not limited thereto. In the present disclosure, the viscosity of the protective glue 3 may be 200mPa·s to 8000mPa·s, for example, 500mPa·s to 8000mPa·s, 500mPa·s to 7000mPa·s or 200mPa·s to 5000mPa·s, but the present disclosure is not limited thereto. In the present disclosure, the refractive index of the protective glue 3 may be greater than 1.3, for example, greater than or equal to 1.4, greater than or equal to 1.5, but the present disclosure is not limited thereto. When the characteristics of the protective glue 3 meet the above-mentioned restrictions, the protective glue 3 may have good processing characteristics or increase the light output of the electronic device.

[0051] In the present disclosure, the height H1 of the protective glue 3 may be greater than or equal to 1.2 times the height H2 of the electronic component 2, and less than or equal to 3 times the height H2 of the electronic component 2 (i.e., satisfying: 1.2×H2≤H1≤3×H2). In one embodiment of the present disclosure, the height H1 of the protective glue 3 may be greater than or equal to 1.5 times the height H2 of the electronic component 2, and less than or equal to 2 times the height H2 of the electronic component 2 (i.e., satisfying: 1.5×H2≤H1≤2×H2). The “height H1 of the protective glue 3” refers, for example, to the distance between the upper surface 11 of the substrate 1 and the upper surface 31 of the protective glue 3 in the normal direction Z of the substrate 1. The “height H2 of the electronic component 2” refers, for example, to the distance between the upper surface 11 of the substrate 1 and the upper surface 22 of the electronic component 2 in the normal direction Z of the substrate 1. When the height H1 of the protective glue 3 satisfies the above-mentioned restrictions, the electronic device can achieve a good protection effect or increase the light output of the electronic device. In one embodiment of the present disclosure, the upper surface of the protective glue 3 is a plane.

[0052] In the present disclosure, the groove G may be, for example, a portion between two adjacent electronic components 2 where the protective glue 3 is not provided. In one embodiment of the present disclosure, the width W1 of the groove G refers to, for example, the average width of the groove G in the first direction X, but the present disclosure is not limited thereto. In other embodiments of the present disclosure, the width W1 of the groove G refers to, for example, the width of the groove G in the first direction X at a height H2 from the electronic component of the substrate 1. In the present disclosure, the width W1 of the groove G may be greater than or equal to 0.05 mm (i.e., the minimum value of the width W1 of the groove G may be greater than or equal to 0.05 mm), for example, greater than or equal to 0.1 mm, greater than or equal to 0.5 mm, greater than or equal to 1 mm, but the present disclosure is not limited thereto. In the present disclosure, the width W1 of the groove G may satisfy the following formula (2):

[0053] (PW-2×D1)≤W1<(PW) (2)

[0054] Wherein, P refers to a first spacing between two adjacent electronic components 2 in the first direction X; W refers to a size of the electronic component 2 in the first direction X (i.e., a width or length of the electronic component 2). Figure 1 In the figure, the size of the electronic component 2 is the width of the electronic component 2 in the first direction X; D1 refers to the distance between the edge 21 of one of two adjacent electronic components 2 and at least one groove G. In one embodiment, the width W1 of the groove G may further satisfy the following formula (3):

[0055] (PW-2×D1)≤W1<(P-2×W) (3)

[0056] When the width W1 of the groove G meets the above formula (2) and / or the above formula (3), the light output of the electronic device can be increased. In addition, when the width W1 of each groove G meets the above formula (2) and / or the above formula (3), the width W1 of each groove G can be the same or different.

[0057] In one embodiment of the present disclosure, Figure 1 As shown, the height of the groove G may be substantially equal to the height H1 of the protective glue 3. Therefore, when observed in the normal direction Z of the substrate 1, the groove G may expose a portion of the substrate 1. More specifically, the groove G may expose a portion of the upper surface 11 of the substrate 1. The "groove height" refers, for example, to the distance between the bottom of the groove G and the upper surface 31 of the protective glue 3 in the normal direction Z of the substrate 1. In the present disclosure, the shape of the groove G is not particularly limited, and the shape of each groove G may be the same or different. For example, in one embodiment of the present disclosure, Figure 1 As shown, in a cross section, the shape of the grooves G may be a rectangle, but the present disclosure is not limited thereto. In other embodiments of the present disclosure, in a cross section, the shape of the grooves G may be a U-shape, a V-shape, or other suitable shapes. In one embodiment of the present disclosure, when the shape of the grooves G is a rectangle, the width W1 of the grooves G at various locations is substantially the same, that is, the width W1 of the grooves G at various locations is substantially equal to the average width of the grooves G.

[0058] In the present disclosure, the groove G may be filled with or not filled with a dielectric material, and the refractive index of the protective glue 3 may be greater than the refractive index of the medium in the groove G. In one embodiment of the present disclosure, the groove G may not be filled with a dielectric material, in other words, the medium in the groove G may be air. When the refractive index of the dielectric material in the groove G satisfies the above-mentioned restrictions, the light provided by the electronic component can be totally reflected, and the light output of the electronic device can be increased, so as to achieve the purpose of improving light output efficiency or saving costs.

[0059] In one embodiment of the present disclosure, although not shown in the figure, the electronic device may further include an optical film disposed on the protective glue 3 to form a backlight module. The optical film may include a brightness enhancement film, a diffusion film, other suitable optical films or a combination thereof, but the present disclosure is not limited thereto. In addition, in one embodiment of the present disclosure, although not shown in the figure, the electronic device may further include a display panel disposed on the substrate 1 to form a display device. The display panel may be, for example, a flexible display panel, a touch display panel, a curved display panel or a tiled display panel. Therefore, the electronic device can be applied to any electronic device that requires a display panel, such as a display, a mobile phone, a laptop computer, a camera, a static camera, a music player, a mobile navigation device, a television set and other electronic devices that display images, but the present disclosure is not limited thereto. In addition, when the electronic device is a tiled display system, the electronic device can be applied to any electronic device that needs to display a large image, such as a movie wall or a billboard, but the present disclosure is not limited thereto.

[0060] Figure 2 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure. Figure 2 Electronic devices and Figure 1 Similar, except for the following differences.

[0061] In one embodiment of the present disclosure, Figure 2 As shown, in a cross section, the shape of each groove G may be different, and the shape of the groove G may be U-shaped or V-shaped, but the present disclosure is not limited thereto. In the present embodiment, the distance D1 between the edge 21 of one of the two adjacent electronic components 2 and at least one groove G, for example, refers to the distance between the edge 21 of the electronic component 2 and the groove G in the first direction X measured at a height H2 from the electronic component of the substrate 1. In the present embodiment, the width W1 of the groove G, for example, refers to the width of the groove G in the first direction X at a height H2 from the electronic component of the substrate 1. In addition, since the shape of each groove G may be different, when the distance D1 meets the restrictions of the aforementioned formula (1), each distance D1 may be the same or different. Similarly, when the width W1 of each groove G meets the aforementioned restrictions, the width W1 of each groove G may be the same or different.

[0062] In one embodiment of the present disclosure, Figure 2As shown, the height of the groove G may be less than the height H1 of the protective glue 3, so when observed in the normal direction Z of the substrate 1, the groove G does not expose part of the substrate 1. In one embodiment of the present disclosure, the distance D2 between the upper surface 11 of the substrate 1 and the groove G may be less than one-third of the height H2 of the electronic component 2 (i.e., D2<1 / 3×H2). More specifically, in the normal direction Z of the substrate 1, the minimum distance D2 between the upper surface 11 of the substrate 1 and the bottom of the groove G may be less than one-third of the height H2 of the electronic component 2. Since the shape of each groove G may be different, when the distance D2 meets the above restrictions, each distance D2 may be the same or different.

[0063] In this embodiment, the materials of the substrate 1, the electronic component 2 and the protective glue 3 can be as described above, and will not be repeated here. Other features of the protective glue 3 and the groove G can be as described above, and will not be repeated here.

[0064] Figure 3 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure. Figure 3 Electronic devices and Figure 1 Similar, except for the following differences.

[0065] In one embodiment of the present disclosure, Figure 3 As shown, the electronic device may include a plurality of electronic components 2 (e.g., a first electronic component 2A and a second electronic component 2B), which are disposed on a substrate 1. A groove G of a protective adhesive 3 is disposed between the first electronic component 2A and the second electronic component 2B, and the groove G may include a first sub-groove G1 and a second sub-groove G2, wherein the first sub-groove G1 is disposed closest to the first electronic component 2A, and the second sub-groove G2 is disposed closest to the second electronic component 2B. In one embodiment of the present disclosure, a portion of protective adhesive 3 or other materials may be included between the first sub-groove G1 and the second sub-groove G2. The electronic device of the present disclosure can increase the light output of the electronic device by disposing the first sub-groove G1 and the second sub-groove G2.

[0066] In one embodiment of the present disclosure, Figure 3As shown, the width W1 of the groove G refers to, for example, the maximum distance between the first sub-groove G1 and the second sub-groove G2 in the first direction X. In more detail, the width W1 of the groove G refers to, for example, the maximum distance between the edge G11 of the first sub-groove G1 and the edge G21 of the second sub-groove G2 in the first direction X. The width W1 of the groove G may be greater than or equal to 0.05 mm, for example, greater than or equal to 0.1 mm, greater than or equal to 0.5 mm, or greater than or equal to 1 mm, but the present disclosure is not limited thereto. The width W1 of the groove G may satisfy the aforementioned formula (2) and / or the aforementioned formula (3), which will not be described in detail here. In addition, in the present embodiment, the materials of the substrate 1, the electronic component 2, and the protective glue 3 may be as described above; other features of the protective glue 3 and the groove G may be as described above, which will not be described in detail here.

[0067] Figure 4 is a block diagram of a method for manufacturing an electronic device according to an embodiment of the present disclosure. Figure 5 The figure is a flow chart of a method for manufacturing an electronic device according to an embodiment of the present disclosure.

[0068] In one embodiment of the present disclosure, Figure 4 and Figure 5 As shown, the manufacturing method of the electronic device may include: providing a substrate 1; arranging a plurality of electronic components 2 on the substrate 1, and making a first spacing P between two adjacent electronic components 2 in a first direction X; and applying a protective glue 3 on the electronic components 2 and the substrate 1, and making the protective glue 3 form at least one groove G, and the at least one groove G is arranged between two adjacent electronic components 2, so as to form Figure 1 The electronic device shown in FIG. 1 , wherein the distance D1 between the edge 21 of one of the two adjacent electronic components 2 and at least one groove G satisfies the following formula (1):

[0069] 0.3mm≤D1<(P / 2) (1).

[0070] In the present disclosure, by forming at least one groove G in the protective glue 3 and making the distance D1 between the edge 21 of one of the two adjacent electronic components 2 and the at least one groove G satisfy the above formula (1), the process steps can be simplified or the cost can be saved when the light output of the electronic device is increased. In the present disclosure, the materials of the substrate 1, the electronic component 2 and the protective glue 3 can be as described above; other features of the electronic component 2, the protective glue 3 and the groove G can be as described above, and will not be repeated here.

[0071] In the present disclosure, the protective glue 3 can be applied to the electronic component 2 and the substrate 1 by a suitable method. For example, in one embodiment of the present disclosure, Figure 4 and Figure 5As shown, the protective glue 3 can be coated on the electronic component 2 and the substrate 1 by a suitable coating method, and the suitable coating method can be, for example, a dip coating method, a spin coating method, a roller coating method, a doctor blade coating method, and a spray coating method, but the present disclosure is not limited thereto. In the present disclosure, the protective glue 3 can be formed into at least one groove G by a suitable method, for example, in one embodiment of the present disclosure, as Figure 4 As shown, after the step of applying the protective glue 3 on the electronic component 2 and the substrate 1 , a step of molding the protective glue 3 to form at least one groove G may be further included, but the present disclosure is not limited thereto.

[0072] In one embodiment of the present disclosure, Figure 4 and Figure 5 As shown, after the step of forming at least one groove G in the protective glue 3, the step of curing the protective glue 3 may be further included to form the groove G. In one embodiment of the present disclosure, before the step of curing the protective glue 3, the step of pressurizing and degassing the protective glue 3 may be further included to remove bubbles in the protective glue 3, thereby improving the reliability of the protective glue 3. In the present disclosure, the conditions for pressurized degassing are not particularly limited. For example, a pressurized degassing machine can be used to perform pressurized degassing under the conditions of a pressure of 1kgf to 10kgf (e.g., 5kgf) and a temperature of 20°C to 80°C (e.g., 40°C to 60°C), but the present disclosure is not limited thereto. In one embodiment of the present disclosure, although not shown in the figure, after the step of curing the protective glue 3, an optical film may be further included to be arranged on the protective glue 3 to form a backlight module. In one embodiment of the present disclosure, although not shown in the figure, after the step of curing the protective glue 3, a display panel may be further included to be arranged on the substrate 1 to form a display device. In the present disclosure, the optical film and the display panel may be as described above and will not be described in detail herein.

[0073] In another embodiment of the present disclosure, although not shown in the figure, after the step of setting a plurality of electronic components 2 on the substrate 1, a mold may be set on the substrate 1 and then a glue filling step may be performed to form a protective glue 3 on the electronic components 2 and the substrate 1 and form at least one groove G in the protective glue 3. Then, the groove G may be formed by the step of pre-curing and / or curing the protective glue 3. In addition, before the step of pre-curing and / or curing the protective glue 3, a step of pressurizing and degassing the protective glue 3 may be further included to remove bubbles in the protective glue 3, thereby improving the reliability of the protective glue 3. In this embodiment, the conditions for pressurizing and degassing may be as described above, and will not be repeated here.

[0074] The above specific embodiments are to be construed as merely illustrative, and not limitative of the remainder of the disclosure in any way whatsoever.

Claims

1. An electronic device, characterized in that: Include: a substrate; A plurality of electronic components are disposed on the substrate, wherein in a first direction, there is a first distance between two adjacent electronic components; and A protective adhesive is disposed on the substrate and the plurality of electronic components, and the protective adhesive has at least one groove, and the at least one groove is disposed between the two adjacent electronic components; The distance between the edge of one of the two adjacent electronic components and the at least one groove satisfies the following formula (1): 0.3mm≤D1<(P / 2) (1) Wherein, D1 is the distance between the edge of one of the two adjacent electronic components and the at least one groove, and P is the first spacing.

2. The electronic device according to claim 1, wherein: The height of the protective glue is greater than or equal to 1.2 times the height of one of the plurality of electronic components, and less than or equal to 3 times the height of the one of the plurality of electronic components.

3. The electronic device according to claim 1, wherein: The width of the at least one groove is greater than or equal to 0.05 mm.

4. The electronic device according to claim 1, wherein: The width of the at least one groove satisfies the following formula (2): (PW-2×D1)≤W1<(PW) (2) Wherein, W1 is the width of the at least one groove, and W is the size of one of the plurality of electronic components in the first direction.

5. The electronic device according to claim 1, wherein: A distance between the surface of the substrate and the groove is less than one third of a height of one of the plurality of electronic components.

6. The electronic device as claimed in claim 1, wherein: The refractive index of the protective glue is greater than the refractive index of the medium in the groove.

7. The electronic device as claimed in claim 1, characterized in that: The penetration rate of the protective glue is greater than or equal to 90%.

8. A method for manufacturing an electronic device, characterized in that: Include: providing a substrate; Disposing a plurality of electronic components on the substrate, and providing a first spacing between two adjacent electronic components in a first direction; and Applying a protective glue on the plurality of electronic components and the substrate, and forming at least one groove in the protective glue, wherein the at least one groove is disposed between the two adjacent electronic components; The distance between the edge of one of the two adjacent electronic components and the at least one groove satisfies the following formula (1): 0.3mm≤D1<(P / 2) (1) Wherein, D1 is the distance between the edge of one of the two adjacent electronic components and the at least one groove, and P is the first spacing.

9. The manufacturing method according to claim 8, characterized in that: The method also includes molding the protective glue to form the groove.

10. The manufacturing method according to claim 8, characterized in that: The method also includes curing the protective glue.

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