A silicon wafer polishing apparatus, method and readable storage medium

Abstract

The application provides a silicon wafer grinding device, method and readable storage medium, and relates to the technical field of semiconductor processing. The silicon wafer grinding device comprises a grinding assembly; the grinding assembly comprises a grinding wheel flange, a shaft body, a support structure and an adjusting unit; the grinding wheel flange is arranged at the first end of the shaft body and is used for grinding a silicon wafer; the support structure is arranged below the shaft body, and the difference between the first distance and the second distance is less than a preset value; the first distance is the distance between the support structure and the first end of the shaft body, and the second distance is the distance between the support structure and the second end of the shaft body; the adjusting unit is arranged at the second end of the shaft body and is used for controlling the second end of the shaft body to move in a target direction, and the target direction is the direction perpendicular to the axis of the shaft body. The problem that the existing technology cannot adjust the grinding precision of the edge of the silicon wafer and affects the quality of the silicon wafer is solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a silicon wafer grinding apparatus, method, and readable storage medium. Background Technology

[0002] During silicon wafer processing, the edges of the cut silicon wafers have sharp edges, burrs, chipped edges, and even cracks or other defects. To increase the mechanical strength of the silicon wafer edges and reduce particle contamination, the silicon wafer edges need to be ground. Grinding methods for silicon wafers include horizontal grinding and vertical grinding.

[0003] In the vertical grinding process of silicon wafers, a grinding wheel is used to grind the silicon wafer. However, there is a problem with the grinding precision of the grinding wheel on the edges of the silicon wafer. Existing vertical grinding equipment cannot adjust the angle of the grinding wheel, which means that the vertical grinding equipment cannot adjust the grinding precision of the silicon wafer edges, thus affecting the quality of the silicon wafer. Summary of the Invention

[0004] This invention provides a silicon wafer polishing apparatus, method, and readable storage medium to solve the problem that existing vertical polishing apparatuses cannot adjust the polishing precision of the silicon wafer edges, thus affecting the quality of the silicon wafer.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] In a first aspect, embodiments of the present invention provide a silicon wafer polishing apparatus, comprising: a polishing assembly;

[0007] The grinding assembly includes: a grinding wheel flange, a shaft, a support structure, and an adjustment unit;

[0008] The grinding wheel flange is located at the first end of the shaft and is used for grinding silicon wafers;

[0009] The support structure is disposed below the shaft, and the difference between the first distance and the second distance is less than a preset value; the first distance is the distance between the support structure and the first end of the shaft, and the second distance is the distance between the support structure and the second end of the shaft;

[0010] The adjustment unit is disposed at the second end of the shaft and is used to control the second end of the shaft to move along a target direction, wherein the target direction is a direction perpendicular to the axis of the shaft.

[0011] Optionally, the silicon wafer polishing apparatus includes: two sets of polishing components;

[0012] The two sets of polishing components are arranged opposite each other and are used to polish the two opposite surfaces of the silicon wafer respectively.

[0013] Optionally, the adjustment unit includes: a servo motor;

[0014] The output shaft of the servo motor is arranged perpendicular to the axis of the shaft body;

[0015] When the servo motor is in the first state, the output shaft extends out of the servo motor and lifts up the second end of the shaft; when the servo motor is in the second state, the output shaft retracts into the servo motor and presses down the second end of the shaft.

[0016] Optionally, the adjustment unit includes: a servo motor and a counterweight;

[0017] The counterweight is movably connected to the second end of the shaft.

[0018] The output shaft of the servo motor is connected to the counterweight.

[0019] When the servo motor is in the first state, the output shaft extends from the servo motor and drives the counterweight closer to the support structure, so that the first end of the shaft tilts downward; when the servo motor is in the second state, the output shaft retracts from the servo motor and drives the counterweight away from the support structure, so that the first end of the shaft tilts upward.

[0020] Optionally, the silicon wafer polishing apparatus further includes:

[0021] A disk-shaped carrier used to hold silicon wafers;

[0022] The disc carrier is disposed on the side of the grinding assembly near the grinding wheel flange and is rotatable about the axis of the disc carrier.

[0023] Optionally, the silicon wafer polishing apparatus further includes:

[0024] A distance measuring unit is used to measure the moving distance of the counterweight.

[0025] An angle measuring unit is used to measure the offset angle of the grinding wheel flange.

[0026] Secondly, embodiments of the present invention provide a silicon wafer polishing method, applied to the silicon wafer polishing apparatus described above, comprising:

[0027] The second end of the shaft is moved along the target direction by operating the adjustment unit to adjust the angle of the grinding wheel flange relative to the silicon wafer.

[0028] Optionally, controlling the second end of the shaft to move along the target direction by operating the adjustment unit includes:

[0029] The servo motor is operated to drive the counterweight to move along the shaft, so that the second end of the shaft moves in the target direction.

[0030] Optionally, controlling the second end of the shaft to move along the target direction by operating the adjustment unit includes:

[0031] The adjustment unit is operated, and the second end of the shaft moves along the target direction by extending or retracting the output shaft of the adjustment unit.

[0032] Thirdly, embodiments of the present invention provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the silicon wafer polishing method as described above.

[0033] The beneficial effects of this invention are:

[0034] The silicon wafer grinding apparatus of this application embodiment, by providing the adjustment unit at the second end of the shaft, can control the second end of the shaft to move upward or downward in a direction perpendicular to the shaft axis, thereby adjusting the angle of the grinding wheel flange provided at the second end of the shaft relative to the silicon wafer to be ground. This allows for adjustment of the grinding flatness of the silicon wafer edge during continuous grinding processing. This solves the problem in the prior art where vertical grinding apparatuses cannot adjust the grinding precision of the silicon wafer edge, affecting the quality of the silicon wafer. Attached Figure Description

[0035] Figure 1 This is a schematic diagram showing the structure of a silicon wafer polishing apparatus according to an embodiment of the present invention;

[0036] Figure 2 This is a schematic diagram showing the structure of the grinding assembly according to an embodiment of the present invention;

[0037] Figure 3 A schematic diagram illustrating the adjustment of the grinding wheel flange according to an embodiment of the present invention;

[0038] Figure 4 A schematic diagram illustrating the steps of a silicon wafer polishing method according to an embodiment of the present invention;

[0039] Figure 5 This is a schematic diagram of the modules representing the silicon wafer polishing method according to an embodiment of the present invention. Detailed Implementation

[0040] To make the technical problems, technical solutions, and advantages of this invention clearer, a detailed description will be provided below in conjunction with the accompanying drawings and specific embodiments. In the following description, specific details such as particular configurations and components are provided merely to aid in a comprehensive understanding of the embodiments of this invention. Therefore, those skilled in the art should understand that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this invention. Furthermore, for clarity and brevity, descriptions of known functions and structures have been omitted.

[0041] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0042] This invention addresses the problem that existing vertical grinding devices cannot adjust the grinding precision of silicon wafer edges, thus affecting silicon wafer quality, by providing a silicon wafer grinding device, method, and readable storage medium.

[0043] like Figure 1 and Figure 2 As shown, this application provides a silicon wafer polishing apparatus, including: a polishing assembly 1;

[0044] The grinding assembly 1 includes: a grinding wheel flange 11, a shaft 12, a support structure 13, and an adjustment unit;

[0045] The grinding wheel flange 11 is disposed at the first end of the shaft 12 and is used for grinding silicon wafers;

[0046] The support structure 13 is disposed below the shaft 12, and the difference between the first distance and the second distance is less than a preset value; the first distance is the distance between the support structure 13 and the first end of the shaft 12, and the second distance is the distance between the support structure 13 and the second end of the shaft 12.

[0047] The adjustment unit is disposed at the second end of the shaft 12 and is used to control the second end of the shaft 12 to move along a target direction, wherein the target direction is a direction perpendicular to the axis of the shaft 12.

[0048] Optionally, a grinding wheel 15 is provided on the grinding wheel flange 11 for grinding silicon wafers.

[0049] In this embodiment, the shaft, the support structure, and the adjustment unit constitute a lever; the adjustment unit controls the second end of the shaft to move upward, causing the first end of the shaft to move downward, thereby increasing the angle between the grinding wheel flange and the silicon wafer. Figure 3 As shown.

[0050] In this embodiment, the shaft, the support structure, and the adjustment unit constitute a lever; the adjustment unit controls the second end of the shaft to move downward, thereby causing the first end of the shaft to move upward, so as to reduce the angle between the grinding wheel flange and the silicon wafer.

[0051] The silicon wafer grinding apparatus of this application embodiment, by providing the adjustment unit at the second end of the shaft, can control the second end of the shaft to move upward or downward in a direction perpendicular to the shaft axis, thereby adjusting the angle of the grinding wheel flange provided at the second end of the shaft relative to the silicon wafer to be ground. This allows for adjustment of the grinding flatness of the silicon wafer edge during continuous grinding processing. This solves the problem in the prior art where vertical grinding apparatuses cannot adjust the grinding precision of the silicon wafer edge, affecting the quality of the silicon wafer.

[0052] Optionally, the silicon wafer polishing apparatus includes: two sets of polishing components 1;

[0053] The two sets of polishing components 1 are arranged opposite to each other and are used to polish the two opposite surfaces of the silicon wafer respectively.

[0054] The silicon wafer grinding apparatus of this application embodiment can grind two opposite surfaces of the silicon wafer simultaneously by setting the grinding components on two opposite surfaces respectively; by adjusting the angle between the grinding wheel flange and the silicon wafer by the two sets of grinding components, the grinding flatness of the silicon wafer edge can be adjusted without stopping the machine.

[0055] Optionally, the adjustment unit includes: a servo motor 16;

[0056] The output shaft 161 of the servo motor 16 is arranged perpendicular to the axis of the shaft body 12;

[0057] When the servo motor 16 is in the first state, the output shaft 161 extends out of the servo motor 16 and lifts up the second end of the shaft body 12; when the servo motor 16 is in the second state, the output shaft 161 retracts into the servo motor 16 and presses down the second end of the shaft body 12.

[0058] Optionally, the output shaft of the servo motor is connected to the shaft body.

[0059] The silicon wafer grinding apparatus of this application embodiment can control the second end of the shaft to move in the target direction via the servo motor, thereby controlling the grinding wheel flange located at the first end of the shaft to move in the opposite direction to the target direction, thereby automatically adjusting the grinding flatness of the silicon wafer edge without stopping the machine.

[0060] Optionally, the adjustment unit includes: a servo motor and a counterweight;

[0061] The counterweight is movably connected to the second end of the shaft.

[0062] The output shaft of the servo motor is connected to the counterweight.

[0063] When the servo motor is in the first state, the output shaft extends from the servo motor and drives the counterweight closer to the support structure, so that the first end of the shaft tilts downward; when the servo motor is in the second state, the output shaft retracts from the servo motor and drives the counterweight away from the support structure, so that the first end of the shaft tilts upward.

[0064] Optionally, the counterweight is suspended on the shaft via a ring;

[0065] The ring passes through the counterweight and is nested on the shaft.

[0066] In this embodiment of the application, when the servo motor pushes the counterweight, it causes the ring to move relative to the shaft.

[0067] Optionally, the counterweight has an internal hollow structure and is nested on the shaft.

[0068] The silicon wafer grinding device of this application embodiment, through the cooperation of the counterweight and the servo motor, can control the second end of the shaft to move along the target direction, thereby adjusting the angle between the flange disk on the second end of the shaft and the silicon wafer, and achieving the purpose of adjusting the grinding flatness of the silicon wafer edge.

[0069] Optionally, the silicon wafer polishing apparatus further includes:

[0070] Disk carrier 2, used to support silicon wafers;

[0071] The disc carrier 2 is disposed on the side of the grinding assembly 1 near the grinding wheel flange 11, and is capable of rotating around the axis of the disc carrier 2.

[0072] In this embodiment, a silicon wafer is respectively bonded to two opposite surfaces of the disc carrier. The two sets of grinding components grind the silicon wafer located on the same side of the disc carrier, thereby adjusting the edge flatness of the two silicon wafers and improving the grinding efficiency.

[0073] Optionally, the silicon wafer polishing apparatus further includes:

[0074] A distance measuring unit is used to measure the moving distance of the counterweight.

[0075] An angle measuring unit is used to measure the offset angle of the grinding wheel flange.

[0076] Before the silicon wafer grinding device leaves the factory, the distance measuring unit and the angle measuring unit work together to measure the correspondence between the moving distance of the counterweight and the offset angle of the grinding wheel flange. Thus, during use, the distance to adjust the counterweight can be determined according to the angle that the grinding wheel flange needs to be adjusted.

[0077] After the silicon wafer grinding device has been used for a period of time, the distance measuring unit and the angle measuring unit can be used to detect whether there is an error in the correspondence between the moving distance of the counterweight and the offset angle of the grinding wheel flange compared with the original data. Based on the error, the correspondence between the moving distance of the counterweight and the offset angle of the grinding wheel flange can be adjusted to keep the grinding device in a high-precision working state and ensure the grinding accuracy of the silicon wafer.

[0078] like Figure 4 As shown in the figure, this application embodiment also provides a silicon wafer polishing method, applied to the silicon wafer polishing apparatus described above, including the following steps:

[0079] Step 401: By operating the adjustment unit, the second end of the shaft is controlled to move along the target direction to adjust the angle of the grinding wheel flange relative to the silicon wafer.

[0080] In one embodiment of this application, the shaft, the support structure, and the adjustment unit constitute a lever; by operating the adjustment unit, the second end of the shaft is controlled to move upward, causing the first end of the shaft to move downward, so as to increase the angle between the grinding wheel flange and the silicon wafer.

[0081] In one embodiment of this application, the shaft, the support structure, and the adjustment unit constitute a lever; by operating the adjustment unit, the second end of the shaft is controlled to move downward, causing the first end of the shaft to move upward, so as to reduce the angle between the grinding wheel flange and the silicon wafer.

[0082] Optionally, controlling the second end of the shaft to move along the target direction by operating the adjustment unit includes:

[0083] The servo motor is operated to drive the counterweight to move along the shaft, so that the second end of the shaft moves in the target direction.

[0084] In this embodiment of the application, when the adjustment unit includes the servo motor and the counterweight, the servo motor is made to run in the forward direction, the output shaft of the servo motor extends out of the servo motor, and the counterweight moves along the shaft, thereby controlling the first end of the shaft to tilt downward, and the angle between the grinding wheel flange and the silicon wafer becomes larger.

[0085] In this embodiment of the application, when the adjustment unit includes the servo motor and the counterweight, the servo motor runs in reverse, the output shaft of the servo motor retracts, and the counterweight moves along the shaft, thereby controlling the first end of the shaft to tilt upward, and the angle between the grinding wheel flange and the silicon wafer becomes smaller.

[0086] Optionally, controlling the second end of the shaft to move along the target direction by operating the adjustment unit includes:

[0087] The adjustment unit is operated, and the second end of the shaft moves along the target direction by extending or retracting the output shaft of the adjustment unit.

[0088] In this embodiment of the application, when the adjustment unit includes the servo motor, the output shaft of the servo motor is set perpendicular to the axis of the shaft body; the servo motor is made to run in the forward direction, the output shaft of the servo motor extends out of the servo motor, and pushes up the second end of the shaft body, thereby controlling the first end of the shaft body to tilt downward, and the angle between the grinding wheel flange and the silicon wafer becomes larger.

[0089] In this embodiment of the application, when the adjustment unit includes the servo motor, the output shaft of the servo motor is set perpendicular to the axis of the shaft body; the servo motor is made to run in the forward direction, the output shaft of the servo motor extends out of the servo motor, and pushes up the second end of the shaft body, thereby controlling the first end of the shaft body to tilt downward, and the angle between the grinding wheel flange and the silicon wafer becomes larger.

[0090] like Figure 5 As shown in the illustration, this application also provides a silicon wafer polishing apparatus 500, comprising:

[0091] The adjustment module 501 is used to control the second end of the shaft to move along the target direction by running the adjustment unit, so as to adjust the angle of the grinding wheel flange relative to the silicon wafer.

[0092] Optionally, the adjustment module is further configured to:

[0093] The servo motor is operated to drive the counterweight to move along the shaft, so that the second end of the shaft moves in the target direction.

[0094] Optionally, the adjustment module is further configured to:

[0095] The adjustment unit is operated, and the second end of the shaft moves along the target direction by extending or retracting the output shaft of the adjustment unit.

[0096] In addition, specific embodiments of the present invention also provide a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the steps of the aforementioned silicon wafer polishing method. This achieves the same technical effect, and to avoid repetition, will not be described further here.

[0097] This application also provides a computer program product, including computer instructions. When executed by a processor, these computer instructions implement the various processes of the above-described silicon wafer polishing method embodiments and achieve the same technical effects. To avoid repetition, they will not be described again here.

[0098] The above describes the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also within the scope of protection of the present invention.

Claims

1. A silicon wafer grinding apparatus, characterized in that, include: Grinding components; The grinding assembly includes: a grinding wheel flange, a shaft, a support structure, and an adjustment unit; The grinding wheel flange is located at the first end of the shaft and is used for grinding silicon wafers; The support structure is disposed below the shaft, and the difference between the first distance and the second distance is less than a preset value; the first distance is the distance between the support structure and the first end of the shaft, and the second distance is the distance between the support structure and the second end of the shaft; The adjustment unit is disposed at the second end of the shaft and is used to control the second end of the shaft to move along a target direction, wherein the target direction is a direction perpendicular to the axis of the shaft. The adjustment unit includes a servo motor and a counterweight. The counterweight is movably connected to the second end of the shaft. The output shaft of the servo motor is connected to the counterweight. When the servo motor is in the first state, the output shaft extends from the servo motor and drives the counterweight closer to the support structure, so that the first end of the shaft tilts downward; when the servo motor is in the second state, the output shaft retracts from the servo motor and drives the counterweight away from the support structure, so that the first end of the shaft tilts upward. The silicon wafer grinding apparatus also includes: A distance measuring unit is used to measure the moving distance of the counterweight. An angle measuring unit is used to measure the offset angle of the grinding wheel flange; The moving distance and the offset angle are used to correct the silicon wafer polishing device.

2. The silicon wafer grinding apparatus according to claim 1, characterized in that, include: The two sets of grinding components; The two sets of polishing components are arranged opposite each other and are used to polish the two opposite surfaces of the silicon wafer respectively.

3. The silicon wafer grinding apparatus according to claim 1, characterized in that, The adjustment unit includes: a servo motor; The output shaft of the servo motor is arranged perpendicular to the axis of the shaft body; When the servo motor is in the first state, the output shaft extends out of the servo motor and lifts up the second end of the shaft; when the servo motor is in the second state, the output shaft retracts into the servo motor and presses down the second end of the shaft.

4. The silicon wafer grinding apparatus according to claim 1, characterized in that, Also includes: A disk-shaped carrier used to hold silicon wafers; The disc carrier is disposed on the side of the grinding assembly near the grinding wheel flange and is rotatable about the axis of the disc carrier.

5. A silicon wafer polishing method, applied to the silicon wafer polishing apparatus according to any one of claims 1 to 4, characterized in that, include: The second end of the shaft is moved along the target direction by operating the adjustment unit to adjust the angle of the grinding wheel flange relative to the silicon wafer.

6. The silicon wafer grinding method according to claim 5, characterized in that, Controlling the second end of the shaft to move along the target direction by operating the adjustment unit includes: The servo motor is operated to drive the counterweight to move along the shaft, so that the second end of the shaft moves in the target direction.

7. The silicon wafer grinding method according to claim 5, characterized in that, Controlling the second end of the shaft to move along the target direction by operating the adjustment unit includes: The adjustment unit is operated, and the second end of the shaft moves along the target direction by extending or retracting the output shaft of the adjustment unit.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the silicon wafer grinding flatness adjustment method as described in any one of claims 5 to 7.

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