Packaging method and packaging structure of medical module

Abstract

The invention discloses a packaging method and a packaging structure of a medical module, and the packaging method comprises the steps: providing a first chip, the first chip is provided with a first surface and a second surface which are oppositely arranged, the first surface is provided with a functional region and a welding pad coupled with the functional region, and the functional region and the welding pad are provided with first welding protrusions; a substrate is provided, the substrate is provided with a third surface, and the thermal expansion coefficient of the substrate is matched with the thermal expansion coefficient of the first chip; attaching the second surface of the first chip to the third surface of the substrate; providing a second chip, arranging the second chip on the first chip, and electrically connecting the second chip with the first welding bulge on the functional area; a PCB module is provided, the welding pad of the first chip is inversely arranged on the PCB module, and the first welding protrusion on the welding pad is electrically connected with the PCB module. According to the packaging method and packaging structure of the medical module, the requirement for the warping degree in the packaging process of the medical module can be met, and the packaging technology is simpler.

Description

Technical Field

[0001] This invention relates to the field of module packaging technology, and in particular to a packaging method and packaging structure for a medical module. Background Technology

[0002] Existing traditional module packaging technologies involve creating through-holes and conductive pillars on a central PCB substrate, then placing two different functional chips on opposite sides of the PCB substrate to achieve electrical conductivity between the two chips and the PCB substrate. However, this method can lead to warping issues between the PCB substrate and the chips when mounting them onto the PCB substrate in stages, increasing packaging difficulty. Furthermore, the cost of stacking vias on the PCB substrate is high, resulting in significant packaging costs.

[0003] If this is the case for traditional module packaging, then the aforementioned packaging structures and methods are even less suitable for new medical modules with even higher warp control requirements. New medical modules require warp of less than 10µm during secondary interconnection. However, because PCB substrates are primarily made of organic materials with a high coefficient of thermal expansion, while chips and passive devices are mostly made of silicon with a low coefficient of thermal expansion, this mismatch in thermal expansion coefficients during direct packaging can lead to increased warp, making it difficult to meet the required product specifications.

[0004] Secondly, in traditional module packaging, the chip and PCB substrate are interconnected without bottom support and encapsulation, requiring special handling during transportation to prevent chip damage. Additionally, the secondary interconnection process between the second chip and PCB substrate in traditional module packaging involves additional pressure, which directly affects both the chip and PCB substrate, potentially causing chip damage.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0006] The purpose of this invention is to provide a packaging method and packaging structure for medical modules, which can meet the warpage requirements during the packaging process of medical modules, and the packaging process is simpler.

[0007] To achieve the above objectives, embodiments of the present invention provide a packaging method for a medical module, comprising: providing a first chip, the first chip having a first surface and a second surface disposed opposite to each other, the first surface having a functional area and a solder pad coupled to the functional area, the functional area and the solder pad having a first solder bump formed thereon; providing a substrate, the substrate having a third surface, the thermal expansion coefficient of the substrate matching the thermal expansion coefficient of the first chip; attaching the second surface of the first chip to the third surface of the substrate; providing a second chip, the second chip being disposed on the first chip and electrically connected to the first solder bump on the functional area; and providing a PCB module, the solder pad of the first chip being flip-chip mounted on the PCB module and the first solder bump on the solder pad being electrically connected to the PCB module.

[0008] In the above technical solution, the thermal expansion coefficient of the substrate matches that of the first chip. This can be understood as the thermal expansion coefficient of the substrate being the same as or similar to that of the first chip. Here, "similar" means that the difference between the thermal expansion coefficient of the substrate and that of the first chip is within an allowable range, which is ±5 (unit: 1 / ℃).

[0009] In one or more embodiments of the present invention, the first chip is selected from an ASIC chip, and the substrate is selected from a glass substrate.

[0010] In one or more embodiments of the present invention, providing a second chip, disposing the second chip on the first chip and electrically connecting it to a first solder bump on the functional area, includes: providing a second chip, forming a second solder bump on the surface of the second chip; flip-chipping the second chip onto the functional area of ​​the first chip, wherein the second solder bump is electrically connected to the first solder bump.

[0011] In one or more embodiments of the present invention, the second chip is bonded to the functional area of ​​the first chip by low-temperature bonding technology, and the second welding protrusion corresponds to the first welding protrusion.

[0012] In one or more embodiments of the present invention, the provision of a PCB module, wherein the solder pads of the first chip are flip-chip mounted on the PCB module and the first solder bump on the solder pads is electrically connected to the PCB module, comprises: providing a PCB module, opening a window on the PCB module; flip-chip mounting the solder pads of the first chip on the PCB module, and the second chip being located within the window.

[0013] In one or more embodiments of the present invention, providing the first chip includes: providing a wafer, the wafer including a plurality of first chips arranged in an array; fabricating the first solder bump on the wafer; and dicing the wafer to obtain the first chip.

[0014] In one or more embodiments of the present invention, the packaging method of the medical module further includes: setting a connecting device on the PCB module and setting a ribbon cable to connect the connecting device.

[0015] The present invention also provides a packaging structure for a medical module, comprising: a first chip, a substrate, a second chip, and a PCB module. The first chip has a first surface and a second surface disposed opposite to each other. A functional area and solder pads coupled to the functional area are disposed on the first surface, and first solder bumps are formed on the functional area and the solder pads. The substrate is attached to the second surface of the first chip, and the coefficient of thermal expansion of the substrate matches the coefficient of thermal expansion of the first chip. The second chip is disposed on the first surface of the first chip and electrically connected to the first solder bumps on the functional area. The solder pads of the first chip are flip-chip bonded to the PCB module, and the first solder bumps on the solder pads are electrically connected to the PCB module.

[0016] In one or more embodiments of the present invention, the substrate is selected from a glass substrate, and the first chip is selected from an ASIC chip.

[0017] In one or more embodiments of the present invention, a second solder bump is formed on the second chip; the side of the second chip with the second solder bump is attached to the functional area of ​​the first chip, and the second solder bump is electrically connected to the first solder bump.

[0018] In one or more embodiments of the present invention, an adhesive layer is provided between the second chip and the first chip, the adhesive layer being conductive in the thickness direction of the second chip and the first chip.

[0019] In one or more embodiments of the present invention, a window is opened on the PCB module, and the second chip is located within the window.

[0020] In one or more embodiments of the present invention, the packaging structure of the medical module further includes connecting devices disposed on the PCB module, and the connecting devices are connected to each other via ribbon cables.

[0021] Compared with the prior art, the packaging method and packaging structure of the medical module according to the present invention replace the intermediate substrate of the traditional module packaging by directly electrically connecting the first chip and the second chip, and by directly flip-chipping the first chip onto the PCB module, thereby simplifying the packaging process and reducing packaging costs.

[0022] According to the medical module packaging method and packaging structure of the present invention, a substrate with a thermal expansion coefficient matching that of the first chip is used as a support plate to improve the strength of the chip. The first chip is attached to the substrate. Since the thermal expansion coefficients of the two are well matched, the warpage between the first chip and the substrate can be reduced in the subsequent packaging process, thereby meeting the warpage requirements of the subsequent processing of the medical module.

[0023] According to the medical module packaging method and packaging structure of the present invention, the substrate on the first chip can provide a buffer for the first chip, thereby reducing the risk of damage to the chip during the packaging process and the packaging module during transportation.

[0024] The medical module packaging structure and packaging method of the present invention can not only achieve electrical connection between the second chip and the first chip through low temperature bonding technology, but also protect the first welding protrusion on the first chip and the second welding protrusion on the second chip, simplifying the process and reducing costs. Attached Figure Description

[0025] Figure 1 This is a process flow diagram of a medical module packaging method according to an embodiment of the present invention;

[0026] Figure 2 This is a detailed process flow diagram of a medical module packaging method according to an embodiment of the present invention;

[0027] Figure 3 This is a detailed process flow diagram of a medical module packaging method according to an embodiment of the present invention;

[0028] Figures 4a-4h This is a schematic diagram of the packaging steps of a packaging method for a medical module according to an embodiment of the present invention.

[0029] Figure 5 This is a schematic diagram of the packaging structure of a medical module according to an embodiment of the present invention. Detailed Implementation

[0030] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0031] Unless otherwise expressly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "comprises" shall be understood to include the stated elements or components without excluding other elements or other components.

[0032] As mentioned in the background section, existing conventional module packaging technologies involve creating through-holes and conductive pillars on a central PCB substrate, then placing two different functional chips on opposite sides of the PCB substrate to achieve electrical conductivity between the two chips and the PCB substrate. However, this method can lead to warping issues between the PCB substrate and the chips when the chips are mounted onto the PCB substrate surface in stages. For medical modules where warpage requirements are less than 10µm, the aforementioned structure is difficult to meet the necessary product requirements and is clearly unsuitable. Furthermore, since both the first and second chips are directly connected to the intermediate substrate without any supporting structure or encapsulation, they are prone to damage.

[0033] To address the aforementioned technical issues, this application provides a packaging method for medical modules. The method involves providing a substrate with a thermal expansion coefficient matching that of a first chip as a support, placing the first chip on the substrate, then flip-chipping a second chip onto the first chip for direct interconnection, and finally flip-chipping the interconnected module onto a PCB module. The substrate design reduces chip warpage while increasing module strength, and the flip-chip structure simplifies the packaging process. These two aspects complement each other, reducing the packaging cost of the medical module and improving packaging yield.

[0034] like Figure 1 As shown, a packaging method for a medical module according to an embodiment of the present invention includes: s1, providing a first chip, the first chip having a first surface and a second surface disposed opposite to each other, a functional area and a bonding pad coupled to the functional area being disposed on the first surface, and a first solder bump being formed on the functional area and the bonding pad; s2, providing a substrate, the substrate having a third surface, the thermal expansion coefficient of the substrate matching the thermal expansion coefficient of the first chip; s3, attaching the second surface of the first chip to the third surface of the substrate; s4, providing a second chip, disposing the second chip on the first chip and electrically connecting it to the first solder bump on the functional area; s5, providing a PCB module, flip-chipping the bonding pad of the first chip onto the PCB module and electrically connecting the first solder bump on the bonding pad to the PCB module.

[0035] Among them, reference Figure 2 As shown, the first chip in step s2 can be obtained through the following steps: s201, providing a wafer including multiple first chips arranged in an array; s202, fabricating first bonding bumps on the wafer; s203, dicing the wafer to obtain the first chip. (Reference) Figure 3As shown, the second chip in step s4 can be obtained through the following steps: S401, a wafer is provided, the wafer including a plurality of second chips arranged in an array; S402, a second bonding bump is fabricated on the wafer; S403, the wafer is diced to obtain the second chip.

[0036] Figures 4a-4h This is a schematic diagram illustrating the steps of a medical module packaging method according to an embodiment of the present invention. The packaging method of the medical module of the present invention will be described in detail below with reference to the schematic diagram.

[0037] like Figure 4a As shown, an ASIC wafer 100 is provided. A plurality of first chips 10 are arrayed on the ASIC wafer 100, and dicing channels are formed between adjacent first chips 10, allowing the ASIC wafer 100 to be diced into multiple first chips 10. Each first chip 10 has a first surface 10a and a second surface 10b disposed opposite to each other. A functional region 11 and a bonding pad 12 coupled to the functional region are disposed on the first surface 10a. The bonding pad 12 is used to achieve electrical connection with the outside. A first solder bump 13 is fabricated on the first surface of the ASIC wafer 100 (i.e., the first surface of the first chip 10). A first solder bump 13 is formed on both the functional region 11 and the bonding pad 12 of each first chip 10.

[0038] like Figure 4b As shown, the ASIC wafer 100 is cut along the cutting channel to obtain the first chip 10.

[0039] like Figure 4c As shown, a substrate 20 is provided, preferably a glass substrate, but it can also be a substrate of other materials whose coefficient of thermal expansion matches that of the ASIC wafer 100. The substrate 20 has a flat third surface. A thin film adhesive 30 is adhered to the third surface of the substrate 20, and the first chip 10 is adhered to the substrate 20 by means of the thin film adhesive 30. The first chip 10 is an ASIC chip.

[0040] In the above technical solution, since the thermal expansion coefficient of the glass substrate and the thermal expansion coefficient of the ASIC chip are highly matched, the glass substrate is used as the support in the entire packaging process. The ASIC chip is attached to the surface of the glass substrate, which can reduce or even eliminate the warpage between the ASIC chip and the glass substrate. This improves the strength without introducing warpage problems, thereby meeting the warpage requirements of subsequent processing in medical modules.

[0041] like Figure 4dAs shown, a sensor (transducer) wafer 400 is provided. A plurality of second chips 40 are arrayed on the sensor wafer 400, and dicing channels are formed between adjacent second chips 40. The sensor wafer 400 can be divided into multiple second chips 40 by dicing along the dicing channels. Second bonding bumps 41 are fabricated on the surface of the sensor wafer 400 (i.e., the surface of the second chips 40).

[0042] like Figure 4e As shown, the sensor wafer 400 is cut along the cutting channel to obtain the second chip 40.

[0043] like Figure 4f As shown, a second chip 40 is disposed on a first chip 10 and electrically connected to a first solder bump 13 of the first chip 10. Specifically, the side of the second chip 40 with the second solder bump 41 is attached to the first surface 10a of the first chip 10. Preferably, the second chip 40 is disposed within the functional area 11 of the first chip 10. The second solder bump 41 of the second chip 40 corresponds to and is electrically connected to the first solder bump 13 of the first chip 10. Furthermore, the second chip 40 and the first chip 10 are tightly interconnected using low-temperature bonding technology. Low-temperature bonding technology is a known prior art in the semiconductor industry, and will not be elaborated upon in this application.

[0044] like Figure 4g As shown, a PCB module is provided. The PCB module includes a PCB board 51 and passive components 52. Passive components 52, such as R / L / C connectors, are bonded to the same surface of the PCB board 51 using SMT (Surface Mount Technology). A window 511 is provided on the PCB board 51, the size of which is greater than or equal to the size of the second chip 40. The solder pads 12 of the first chip 10, which are bonded to the second chip 40, are flip-chip mounted onto the PCB board 51, specifically onto the side of the PCB board 51 where the passive components 52 are not located. In this case, the second chip 40 is located within the window 511. A first solder bump 13 on the solder pad 12 is electrically connected to the PCB board 51.

[0045] like Figure 4h As shown, several connectors 60 are disposed on the surface of the PCB board 51 where the first chip 10 is disposed, and signal communication between the multiple connectors 60 is achieved through the ribbon cable 70.

[0046] refer to Figure 5 As shown, the present invention also provides a packaging structure for the above-mentioned medical module, including: a first chip 10, a substrate 20, a second chip 40, and a PCB module. The first chip 10 is disposed on the surface of the substrate 20. The second chip 40 is directly disposed on the first chip 10 and electrically connected to the first chip 10. The first chip is flip-chip mounted on the PCB module to form the packaging structure of the medical module.

[0047] The first chip 10 is preferably an ASIC chip. The first chip 10 has a first surface 10a and a second surface 10b disposed opposite to each other. A functional region 11 and a solder pad 12 coupled to the functional region 11 are disposed on the first surface 10a. The solder pad 12 is used to achieve electrical connection with the outside. A first solder bump 13 is formed on the functional region 11 and the solder pad 12.

[0048] The substrate 20 is preferably a glass substrate. The substrate 20 has a flat third surface. The third surface of the substrate 20 is attached to the second surface 10b of the first chip 20 using a thin-film adhesive 30. In other embodiments, the substrate 20 can also be a substrate of other materials, as long as the coefficient of thermal expansion of the substrate matches that of the first chip 10, i.e., the coefficient of thermal expansion of the substrate is the same as or similar to that of the first chip 10. "Similar" means that the difference between the coefficient of thermal expansion of the substrate and that of the first chip 10 is within an allowable range, which is ±5 (unit: 1 / ℃).

[0049] In the above technical solution, since the thermal expansion coefficient of the glass substrate and the thermal expansion coefficient of the ASIC chip are highly matched, the glass substrate is used as the support in the entire packaging process. The ASIC chip is attached to the surface of the glass substrate, which can reduce or even eliminate the warpage between the ASIC chip and the glass substrate. This improves the strength without introducing warpage problems, thereby meeting the warpage requirements of subsequent processing in medical modules.

[0050] The second chip 40 is disposed on the first surface 10a of the first chip 10, preferably within the functional area 11 of the first chip 10. The second chip 40 is electrically connected to the first solder bump 13. For example, the second chip 40 is preferably a Transducer chip. A second solder bump 41 is formed on the second chip 40; the side of the second chip 40 with the second solder bump 41 is attached to the first surface 10a of the first chip 10, and the second solder bump 41 is electrically connected to the first solder bump 13. Further, the second chip 40 and the first chip 10 are tightly interconnected using low-temperature bonding technology. For example, an adhesive layer 80 is provided between the second chip 40 and the first chip 10 using low-temperature bonding technology. The adhesive layer 80 can be conductive in the thickness direction of the second chip 40 and the first chip 10—that is, in the connection direction between the second solder bump 41 and the first solder bump 13—and non-conductive in the direction perpendicular to the thickness of the second chip 40 and the first chip 10, thus achieving electrical connection between the second chip 40 and the first chip 10 through the adhesive layer 80.

[0051] The PCB module includes a PCB board 51 and passive components 52 formed on the PCB board 51. The passive components 52 are attached to the same surface of the PCB board 51 by SMT process. A window 511 is provided on the PCB board 51, and the size of the window 511 is greater than or equal to the size of the second chip 40. The solder pads 12 of the first chip 10 are flip-chip mounted on the surface of the PCB board where the passive components 51 are not located, and the first solder bumps 13 on the solder pads 12 are electrically connected to the PCB board. The second chip 40 is located within the window 511.

[0052] In another embodiment of the present invention, the packaging structure of the medical module may further include connectors 60. A plurality of connectors 60 are disposed on the surface of the PCB board 51 on which the first chip 10 is disposed, and the plurality of connectors 60 are connected to each other by ribbon cables 70.

[0053] Compared with the prior art, the packaging method and packaging structure of the medical module according to the present invention replace the intermediate substrate of the traditional module packaging by directly electrically connecting the first chip and the second chip, and by directly flip-chipping the first chip onto the PCB module, thereby simplifying the packaging process and reducing packaging costs.

[0054] According to the medical module packaging method and packaging structure of the present invention, a substrate with a thermal expansion coefficient matching that of the first chip is used as a support plate to improve the strength of the chip. The first chip is attached to the substrate. Since the thermal expansion coefficients of the two are well matched, the warpage between the first chip and the substrate can be reduced in the subsequent packaging process, thereby meeting the warpage requirements of the subsequent processing of the medical module.

[0055] According to the medical module packaging method and packaging structure of the present invention, the substrate on the first chip can provide a buffer for the first chip, thereby reducing the risk of damage to the chip during the packaging process and the packaging module during transportation.

[0056] The medical module packaging structure and packaging method of the present invention can not only achieve electrical connection between the second chip and the first chip through low temperature bonding technology, but also protect the first welding protrusion on the first chip and the second welding protrusion on the second chip, simplifying the process and reducing costs.

[0057] All aspects, embodiments, features, and examples of this invention are to be regarded as illustrative in all respects and are not intended to limit the invention, the scope of which is defined only by the claims. Other embodiments, modifications, and uses will become apparent to those skilled in the art without departing from the spirit and scope of the invention as claimed.

[0058] The use of headings and sections in this application is not intended to limit the invention; each section can be applied to any aspect, embodiment or feature of the invention.

[0059] Throughout this application, wherever a composition is described as having, containing, or including specific components, or wherever a process is described as having, containing, or including specific process steps, it is anticipated that the compositions taught in this invention are also composed of or comprised of the described components on a substrate, and that the processes taught in this invention are also composed of or comprised of the described process steps on a substrate.

[0060] In this application, where an element or component is referred to as being included in and / or selected from the list of described elements or components, it should be understood that the element or component may be any of the described elements or components and may be freely selected from a group consisting of two or more of the described elements or components. Furthermore, it should be understood that the elements and / or features of the compositions, devices, or methods described herein may be combined in various ways, whether expressly stated or implied, without departing from the spirit and scope of the teachings of this invention.

[0061] Unless otherwise specifically stated, the use of the terms “comprising” or “having” should generally be understood as open-ended and non-restrictive.

[0062] Unless otherwise specifically stated, the use of the singular herein includes the plural (and vice versa). Furthermore, unless the context clearly indicates otherwise, the singular forms “a” and “said” include the plural forms. Additionally, where the term “about” precedes a quantity, the teachings of this invention also include the specific quantity itself, unless otherwise specifically stated.

[0063] It should be understood that the order of the steps or the order in which specific actions are performed is not particularly important, as long as the teachings of this invention remain operable. Furthermore, two or more steps or actions can be performed simultaneously.

[0064] It should be understood that the figures and descriptions of this invention have been simplified to illustrate elements relevant to a clear understanding of the invention, and other elements have been omitted for clarity. However, those skilled in the art will recognize that these and other elements may be desirable. However, since such elements are well-known in the art and do not contribute to a better understanding of the invention, a discussion of such elements is not provided herein. It should be understood that the figures are presented for illustrative purposes and are not intended as construction diagrams. Omitted details and modifications or alternative embodiments are within the scope of those skilled in the art.

[0065] It will be understood that, in certain aspects of the invention, a single component may be replaced by multiple components and multiple components may be replaced by a single component to provide an element or structure or to perform one or more given functions. This substitution is considered to be within the scope of the invention, except where such substitution would not be operational in practice of a particular embodiment of the invention.

[0066] Although the invention has been described with reference to illustrative embodiments, those skilled in the art will understand that various other changes, omissions, and / or additions can be made without departing from the spirit and scope of the invention, and that elements of the embodiments can be substituted with substantially equivalents. Furthermore, many modifications can be made without departing from the scope of the invention to adapt particular situations or materials to the teachings of the invention. Therefore, this invention is not intended to be limited to the specific embodiments disclosed for carrying out the invention, but rather is intended to encompass all embodiments falling within the scope of the appended claims. Moreover, unless specifically stated otherwise, any use of the terms first, second, etc., does not indicate any order or importance, but is used to distinguish one element from another.

Claims

1. A packaging method for a medical module, characterized in that: include: Providing a first chip, the first chip having a first surface and a second surface arranged opposite to each other, a functional area and a welding pad coupled to the functional area are arranged on the first surface, and a first welding protrusion is formed on the functional area and the welding pad; Providing a substrate, the substrate having a third surface, the thermal expansion coefficient of the substrate matching the thermal expansion coefficient of the first chip; Laminating the second surface of the first chip to the third surface of the substrate; Providing a second chip, disposing the second chip on the first chip and electrically connecting the second chip to the first welding protrusion on the functional area; A PCB module is provided, and the soldering pad of the first chip is flipped onto the PCB module, and the first soldering protrusion on the soldering pad is electrically connected to the PCB module.

2. The packaging method of the medical module according to claim 1, characterized in that: The first chip is selected from an ASIC chip, and the substrate is selected from a glass substrate.

3. The packaging method of the medical module according to claim 1, characterized in that: The method of providing a second chip, disposing the second chip on the first chip and electrically connecting the second chip to the first welding protrusion on the functional area, comprises: Providing a second chip, and forming a second welding protrusion on a surface of the second chip; The second chip is flipped onto the functional area of ​​the first chip, and the second welding protrusion is electrically connected to the first welding protrusion.

4. The packaging method of the medical module according to claim 3, characterized in that: The second chip is bonded to the functional area of ​​the first chip by low-temperature bonding technology, and the second welding protrusion corresponds to the first welding protrusion.

5. The packaging method of the medical module according to claim 1, characterized in that: The method of providing a PCB module, flipping the pad of the first chip onto the PCB module and electrically connecting the first welding protrusion on the pad to the PCB module, comprises: Providing a PCB module, and opening a window on the PCB module; The pad of the first chip is flipped onto the PCB module, and the second chip is located in the window.

6. A packaging structure of a medical module, characterized in that: include: A first chip has a first surface and a second surface arranged opposite to each other, a functional area and a welding pad coupled to the functional area are arranged on the first surface, and a first welding protrusion is formed on the functional area and the welding pad; A substrate, attached to the second surface of the first chip, wherein the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the first chip; A second chip is disposed on the first surface of the first chip and is electrically connected to the first welding protrusion on the functional area; A PCB module, wherein the soldering pad of the first chip is flipped on the PCB module and the first soldering protrusion on the soldering pad is electrically connected to the PCB module.

7. The packaging structure of the medical module according to claim 6, characterized in that: The substrate is selected from a glass substrate, and the first chip is selected from an ASIC chip.

8. The packaging structure of the medical module according to claim 6, characterized in that: A second welding protrusion is formed on the second chip; The side of the second chip provided with the second welding protrusion is arranged to fit the functional area of ​​the first chip, and the second welding protrusion is electrically connected to the first welding protrusion.

9. The packaging structure of the medical module according to claim 8, characterized in that: An adhesive layer is disposed between the second chip and the first chip, and the adhesive layer is conductive in a thickness direction of the second chip and the first chip.

10. The packaging structure of the medical module according to claim 6, characterized in that: A window is provided on the PCB module, and the second chip is located in the window.

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