Substrate processing apparatus and substrate processing method

Abstract

The invention relates to a substrate processing apparatus and a substrate processing method. The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus and a substrate processing method capable of accurately placing a substrate in a center portion of a susceptor on which the substrate is placed in accordance with a substrate process, even when an inclination angle or an inclination direction of the susceptor changes. The substrate processing apparatus includes: a chamber providing a processing space for a substrate; a susceptor which is provided inside the chamber, on which the substrate is placed, and which heats the substrate; the mechanical arm is used for placing the substrate on the base or taking the substrate out of the base; a tilt adjustment unit that adjusts the tilt of the base; and a control unit that controls the driving of the tilt adjustment unit and corrects the position at which the substrate is placed on the base by the robot arm in accordance with the tilt of the base.

Description

Technical Field

[0001] The present invention relates to a substrate processing device and a substrate processing method, and more particularly, to a substrate processing device and a substrate processing method capable of accurately placing the substrate in the center of the base even when the inclination angle or inclination direction of the base on which the substrate is placed changes according to the substrate or according to the substrate process. Background Art

[0002] Typically, a substrate processing device may include a chamber capable of performing processes such as evaporation and etching on a substrate, and may include a heater or a susceptor for placing and heating the substrate in the chamber. A recessed portion for placing the substrate may also be formed on the susceptor.

[0003] In such a structure, when the substrate is placed on the base, more precisely, in the recessed portion of the base, it is important that the substrate is disposed in the center of the recessed portion. In other words, it is important to keep the distance from the edge of the substrate to the recessed portion constant.

[0004] However, during the process of performing the process on the substrate, the tilt angle and tilt direction of the base need to be adjusted. This can be determined according to the process conditions of the substrate. For example, when performing processes on multiple substrates, the tilt angle and tilt direction predetermined according to each substrate may change. In addition, when multiple processes are performed on one substrate, the tilt angle and tilt direction may change according to each process condition.

[0005] When the substrate is placed in the recessed portion of the base with the base tilted in this manner, the substrate may not be placed in the center of the recessed portion but may be placed offset to one side.

[0006] That is, the center line of the base in a tilted state may change position in the X-axis and Y-axis directions relative to the center line of the base in a horizontal state. Therefore, if the substrate is placed in accordance with the center line of the base in a horizontal state, the substrate will be tilted to one side in the recessed portion. In serious cases, the substrate cannot be inserted into the recessed portion and one side of the substrate will hang on the upper side of the recessed portion.

[0007] In this case, the distance from the edge of the substrate to the recessed portion changes, and a difference in thermal conductivity occurs between the substrate and the base, so that the evaporation process on the substrate cannot be carried out smoothly. As a result, the thin film may be unevenly deposited on the substrate, and arcing may occur in the process using plasma. Summary of the invention

[0008] In order to solve the above-mentioned problems, an object of the present invention is to provide a substrate processing device and a substrate processing method which can accurately place the substrate in the center of the base even when the inclination angle or inclination direction of the base on which the substrate is placed changes according to the substrate or according to the substrate process.

[0009] The above-mentioned object of the present invention is achieved by a substrate processing device, which is characterized in that it comprises: a chamber, which provides a processing space for a substrate; a susceptor, which is arranged inside the chamber and on which the substrate is placed and heats the substrate; a robot arm, which places the substrate on the susceptor or takes the substrate out of the susceptor; a tilt adjustment unit, which adjusts the tilt of the susceptor; and a control unit, which controls the driving of the tilt adjustment unit and corrects the position of the substrate placed on the susceptor by the robot arm according to the tilt of the susceptor.

[0010] Wherein, a recessed portion for inserting and placing the substrate may be formed on the top of the base, and the substrate may be placed in the center of the recessed portion by the robot arm.

[0011] In addition, the tilt information of the base based on the substrate or the tilt information of the base based on the process of the substrate and the correction position information of the robot arm corresponding to the tilt information of the base may be pre-stored in the control unit in the form of a tilt-correction position information table.

[0012] On the other hand, the tilt information of the base may include at least one of a tilt angle and a tilt direction of the base.

[0013] Furthermore, the control unit may drive the tilt adjustment unit to adjust at least one of the tilt angle and the tilt direction of the base according to the tilt information of the base based on the substrate or the tilt information of the base based on the process of the substrate, and extract the correction position of the robot arm corresponding to the tilt angle and the tilt direction of the base from the tilt-correction position information table to correct the position of the substrate placed on the base by the robot arm.

[0014] On the other hand, the object of the present invention as described above is achieved by a substrate processing method of a substrate processing device, wherein the substrate processing device has a base in a chamber for placing a substrate to carry out a process, and the substrate processing method of the substrate processing device is characterized by the steps of tilting at least one of the tilt angle and tilt direction of the base to a predetermined tilt angle and tilt direction; extracting the correction position of the robot arm from the tilt-correction position information table corresponding to the tilt angle and tilt direction of the base; and correcting the position of the robot arm and placing the substrate on the base.

[0015] Among them, the tilt information of the base based on the substrate or the tilt information of the base based on the substrate process and the correction position information of the robot arm corresponding to the tilt of the base may be pre-stored in the control unit in the form of a tilt-correction position information table.

[0016] Furthermore, in the step of placing the substrate on the base, a recessed portion for inserting and placing the substrate may be formed on the base, and the substrate may be placed at the center of the recessed portion by the robot arm.

[0017] According to the present invention having the aforementioned structure, even when the tilt angle or tilt direction of a base on which a substrate is placed changes according to the substrate or according to a substrate process, the correction position information of the robot arm corresponding to the tilt information of the base can be extracted from the tilt-correction position information table to accurately place the substrate in the center of the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 as well as Figure 2 is a side view of a substrate processing apparatus according to an embodiment of the present invention,

[0019] Figure 3 It is a plan view and a side view of a base of a substrate processing device.

[0020] Figure 4 is a three-dimensional diagram of a tilt adjustment unit of a substrate processing device,

[0021] Figure 5 is along Figure 4 The cross-sectional view of the line “Ⅴ-Ⅴ”,

[0022] Figure 6 is a graph showing the rotation angle of the rotation axis of the tilt adjustment unit and the lifting distance of the support plate,

[0023] Figure 7 is a diagram showing the relationship between the rotation axis and the rotation center of the cam member based on the rotation angle of the rotation axis in the tilt adjustment unit,

[0024] Figure 8 It is shown in Figure 6 The reference height is a graph showing the case where the phase of the rotation axis is displaced from 90°.

[0025] Fig. 9 is the plan view of the support plate,

[0026] Fig.10 as well as Fig.11 This is a plan view and a side view of the base in a tilted state.

[0027] (Explanation of Reference Numerals)

[0028] 12: Chamber

[0029] 13: Opening

[0030] 14: Gas supply department

[0031] 16: Base

[0032] 17: Depression

[0033] 18: Extension

[0034] 19: Pin hole

[0035] 30: Support rod

[0036] 40: Support plate

[0037] 70: Lifting pin

[0038] 100: Tilt adjustment unit

[0039] 120: Drive unit

[0040] 200: Robotic Arm

[0041] 1000: Substrate processing equipment DETAILED DESCRIPTION

[0042] Hereinafter, a substrate processing apparatus and a substrate processing method according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0043] Figure 1 as well as Figure 2 FIG. 1 is a side view of a substrate processing apparatus 1000 according to an embodiment of the present invention. Figure 1 The state in which the susceptor 16 is lowered and the substrate W is placed on the lift pins 70 is shown. Figure 2 The state in which the susceptor 16 is raised to the process position and the substrate W is placed on the susceptor 16 is shown.

[0044] Reference Figure 1 as well as Figure 2 The substrate processing apparatus 1000 may include a chamber 12 for providing a processing space for the substrate W.

[0045] An opening 13 may be formed at one side of the chamber 12 , and the substrate W may be introduced into the chamber 12 or taken out of the chamber 12 through the opening 13 .

[0046] The door 11 may be provided at the opening 13 and the opening 13 may be sealed by driving the door 11 . Figure 1 The opening 13 is shown in an open state. Figure 2The state in which the opening 13 is blocked by the door 11 is shown. Figure 1 as well as Figure 2 The structure of the door 11 shown is only an example and can be implemented in various forms.

[0047] On the other hand, a robot arm 200 may be disposed outside the chamber 12 . The robot arm 200 may be disposed to be capable of linear motion and vertical movement so as to enter the interior of the chamber 12 through the opening 13 .

[0048] For example, the robot arm 200 may be Figure 1 As shown in FIG. 1 , the substrate W is sent into the chamber 12 and placed on the lift pins 70 in the chamber 12. When the process on the substrate W is finished, the susceptor 16 is moved from Figure 2 The process location is as follows Figure 1 In this case, the substrate W on the base 16 is placed on the lift pins 70 , and the robot arm 200 extends and moves below the substrate W to take the substrate W out.

[0049] On the other hand, a gas supply unit 14 for supplying a process gas toward the substrate W may be provided at the upper inner portion of the chamber 12. The gas supply unit 14 receives a process gas from a process gas source (not shown) located outside the chamber 12 and supplies the process gas toward the substrate W. The gas supply unit 14 may be constituted by a so-called showerhead, but is not limited thereto.

[0050] A susceptor 16 on which the substrate W is placed and which can heat the substrate W to a predetermined temperature may be provided inside the chamber 12 . The susceptor 16 is provided to be movable up and down inside the chamber 12 .

[0051] For example, the extension portion 18 extending downward from the base 16 is connected to a lifting plate (not shown) below through a bellows 22. In addition, the lifting plate is provided to be movable up and down along a support rod 30, and the support rod 30 is fixed to a support plate 40 connected to the lower part of the chamber 12. In the present invention, a tilt adjustment unit 100 is provided to adjust the tilt of the base 16 by adjusting the tilt of the support plate 40, which will be described in detail later.

[0052] On the other hand, the base 16 may be provided with lift pins 70 for lifting the substrate W. The lift pins 70 may be multiple, and the base 16 may be provided with pin holes 19 through which the lift pins 70 pass.

[0053] like Figure 1When the substrate W is fed in or the process of the substrate W is finished, the base 16 is lowered. In this case, the upper end of the lifting pin 70 protrudes through the pin hole 19. Therefore, the substrate W is placed on the upper end of the lifting pin 70 by the aforementioned robot arm 200, or the robot arm 200 takes out the substrate W placed on the upper end of the lifting pin 70.

[0054] On the other hand, when Figure 1 When the substrate W that has not been processed is placed on the upper end of the lifting pin 70, Figure 2 The opening 13 is sealed by the door 11 , and the base 16 is raised to the process position. In this case, the lifting pins 70 are lowered through the pin holes 19 , and the substrate W is placed on the base 16 .

[0055] Figure 3 A plan view and a side view of the susceptor 16 of the substrate processing apparatus 1000 are shown. Figure 3 (A) is a plan view of the base 16, Figure 3 (B) is a side view of the base.

[0056] Reference Figure 3 A recessed portion 17 into which the substrate W is inserted and placed may be provided on the base 16 .

[0057] The recessed portion 17 may be formed at a predetermined depth. For example, the depth of the recessed portion 17 may correspond to the thickness of the substrate W, but is not limited thereto and may be appropriately deformed.

[0058] When the substrate W is placed on the base 16, more precisely, in the recessed portion 17 of the base 16, it is important that the substrate W is disposed in the center of the recessed portion 17. Figure 3 As shown, it is important to keep the distance D1 from the edge of the substrate W to the recessed portion 17 constant.

[0059] If the distance D1 between the edge of the substrate W and the recessed portion 17 cannot be kept constant, the distance between the substrate W and the recessed portion 17 will change. As a result, a difference in thermal conductivity will occur between the substrate W and the susceptor 16, and a process such as a vapor deposition process cannot be smoothly performed on the substrate W, so that a thin film may be unevenly formed on the substrate W. In addition, arcing may also occur in the process using plasma.

[0060] In this case, the robot arm 200 moves in the X-axis and Y-axis directions above the base 16, and places the substrate W on the lift pins 70 corresponding to the predetermined center line CL of the base 16 or the recessed portion 17. The substrate W placed on the lift pins 70 is as shown in FIG. Figure 2 As described in the description, it is placed in the central part of the recessed portion 17.

[0061] On the other hand, during the process of performing the process on the substrate W, the tilt angle and tilt direction of the base 16 need to be adjusted. This can be determined according to the process conditions of the substrate W. For example, when performing processes on multiple substrates W, the tilt angle and tilt direction predetermined according to each substrate W may change. In addition, when multiple processes are also performed on one substrate W, the tilt angle and tilt direction may change according to each process condition.

[0062] In the present invention, when the tilt angle and tilt direction of the base 16 are to be changed, the tilt adjustment unit 100 is driven as described above. The tilt adjustment unit 100 changes the tilt angle and tilt direction of the support plate 40 to adjust the tilt angle and tilt direction of the base 16.

[0063] Figure 4 is a perspective view of the tilt adjustment unit 100 of the substrate processing apparatus 1000 .

[0064] Reference Figure 1 as well as Figure 4 The tilt adjustment unit 100 may include a first adjustment unit 102 for moving the support plate 40 up and down by a predetermined distance and a second adjustment unit 104 for preventing the support plate 40 from moving upward due to negative pressure inside the chamber 12 .

[0065] That is, the first adjustment unit 102 moves one side of the support plate 40 up and down in order to adjust the inclination of the support plate 40 as described later.

[0066] However, the support plate 40 is connected to the susceptor 16 through the support rod 30, and the susceptor 16 is located inside the chamber 12. In this case, if the chamber 12 is kept in a predetermined vacuum state for the evaporation process, the chamber 12 is negatively pressurized and the susceptor 16 can rise upward due to the negative pressure. Such a rising action changes the distance between the susceptor 16 and the gas supply unit 14 inside the chamber 12.

[0067] Therefore, when the interior of the chamber 12 is at a negative pressure, the second regulating unit 104 prevents the support plate 40 from rising, thereby preventing the susceptor 16 connected to the support plate 40 from rising and maintaining the distance between the susceptor 16 and the gas supply part 14 .

[0068] The first adjustment unit 102 is as follows Figure 1 as well as Figure 4 As shown in the figure, a housing 110 is connected to the lower part of the chamber 12. The housing 110 is fixed to the lower part of the chamber 12 and forms a groove 112 into which one side of the support plate 40 is inserted. When one side of the support plate 40 is inserted into the groove 112, the first adjustment unit 102 is used to finely move one side of the support plate 40 up and down, or the second adjustment unit 104 is used to prevent the support plate 40 from rising and fix the height of the support plate 40.

[0069] For example, the second adjustment unit 104 may be formed by a spring member 190 .

[0070] A fixing rod 180 may be provided which spans the groove 112 of the housing 110 from top to bottom, and the spring member 190 may be provided on the upper portion of the fixing rod 180. In this case, a through hole 46 (see FIG. 4 ) through which the fixing rod 180 passes may be formed in the support plate 40. Figure 5 ), the spring member 190 presses the support plate 40 downward. The spring member 190 is configured to prevent the base 16 and the support plate 40 from moving upward when the chamber 12 is under negative pressure as described above. The above configuration is only an example, and the fixing rod 180 may be omitted, and the spring member 190 may be directly coupled to the housing 110 to press the support plate 40.

[0071] Therefore, the elastic force of the spring member 190 should be configured to be greater than the external force obtained by subtracting the load of the tilt adjustment unit 100 from the force by which the support plate 40 is pulled upward due to the negative pressure. In addition, the elastic force of the spring member 190 should be determined to be smaller than the force by which the support plate 40 is moved upward by the first adjustment unit 102. This is because, if the elastic force of the spring member 190 is greater than the force by which the support plate 40 is moved upward by the first adjustment unit 102, even when the support plate 40 is pushed upward by the first adjustment unit 102, the support plate 40 will not move upward due to the elastic force of the spring member 190.

[0072] Figure 5 is along Figure 4 Cross-sectional view of the “Ⅴ-Ⅴ” line.

[0073] Reference Figure 5The first adjustment unit 102 includes a cam component 130 that applies a predetermined force to the support plate 40 and a driving part 120 that includes a rotating shaft 122 that is connected to the cam component 130 at a predetermined distance from the rotation center of the cam component 130 and rotates the cam component 130.

[0074] The housing 110 is provided with a driving unit 120 such as a motor, and a rotating shaft 122 extending from the driving unit 120 is connected to the cam member 130. At this time, the rotation center of the cam member 130 is connected to the rotating shaft 122 of the driving unit 120 at a predetermined distance d. Figure 5 middle, The line corresponds to a virtual line extending from the center of the rotation axis 122 of the driving portion 120, The line corresponds to a virtual line extending from the rotation center of the cam member 130 .

[0075] That is, the rotating shaft 122 of the driving unit 120 is connected to a position separated by a predetermined distance from the rotation center of the cam member 130, rather than being connected to the rotation center of the cam member 130. In the above-mentioned structure, when the rotating shaft 122 rotates due to the driving of the driving unit 120, the cam member 130 also rotates in conjunction.

[0076] In this case, since the rotation center of the cam member 130 is spaced apart from the center of the rotation shaft 122, when the cam member 130 rotates, the distance between the outer periphery of the cam member 130 and the rotation shaft 122 changes. That is, when the cam member 130 rotates, the outer periphery of the cam member 130 forms an irregular trajectory in which the distance from the rotation shaft 122 changes, rather than forming a constant circular trajectory. Therefore, when the distance between the outer periphery of the cam member 130 and the rotation shaft 122 becomes relatively far, the support plate 40 can be raised upward, and conversely, when the distance between the outer periphery of the cam member 130 and the rotation shaft 122 becomes relatively short, the support plate 40 drops downward.

[0077] At this time, a bearing portion 140 may be further provided between the cam member 130 and the support plate 40 to surround the outer circumference of the cam member 130 and apply a predetermined force to the support plate 40. The bearing portion 140 prevents the cam member 130 from directly contacting a push rod 150 to be described later, thereby preventing the cam member 130 or the push rod 150 from being worn.

[0078] Furthermore, the tilt adjustment unit 100 may further include a push rod 150 , one end of which contacts the outer circumference of the bearing 140 and applies a predetermined force to the support plate 40 through the rotation of the bearing 140 .

[0079] The push rod 150 is provided to be able to move up and down through a linear bush 160, and the linear bush 160 passes through an opening 114 provided on the other side of the housing 110. When the push rod 150 moves up and down by the rotation of the cam member 130, the linear bush 160 guides the push rod 150 to move up and down. Therefore, when the bearing 140 rotates together with the rotation of the cam member 130, the push rod 150 moves up and down to move the support plate 40 up and down.

[0080] In addition, the push rod 150 supports the support plate 40 to prevent the support plate 40 from sagging. That is, when the cam member 130 does not rotate, the cam member 130 is engaged and fixed with the rotating shaft 122, so the upper end of the push rod 150 is fixed in height to support the support plate 40 and prevent sagging.

[0081] On the other hand, a speed reducer 124 may be provided between the cam member 130 and the rotating shaft 122. The speed reducer 124 reduces the rotational force of the rotating shaft 122 and transmits it to the cam member 130. In this case, the speed reduction rate of the speed reducer 124 may be set according to the maximum distance that the support plate 40 can be raised and lowered.

[0082] Figure 6 1 and 2 show the rotation angle of the rotation shaft 122 of the driving part 120 included in the first adjustment unit 102 of the tilt adjustment unit 100 and the lifting distance of the support plate 40 . Figure 7 The relationship between the rotation shaft 122 and the rotation center 132 of the cam member 130 based on the rotation angle of the rotation shaft 122 is shown.

[0083] exist Figure 6 In the figure, the horizontal axis shows the rotation angle (°) of the rotation shaft 122, and the vertical axis shows the lifting distance (mm) of the support plate 40. Figure 7 (A) shows Figure 6 When the phase of the rotating shaft 122 is rotated 0° clockwise, Figure 7 (B) shows Figure 6 When the phase of the rotating shaft 122 is rotated 90° in the clockwise direction, Figure 7 (C) shows in Figure 6 The phase of the rotating shaft 122 is rotated 180° clockwise. Figure 7 In the description, for the sake of convenience, it is assumed that the rotating shaft 122 rotates in the clockwise direction, but it can also rotate in the opposite direction.

[0084] Reference Figure 6 as well as Figure 7 The tilt adjustment method includes: a step of setting a condition in which the rotation centers of the rotating shaft 122 and the cam component 130 are horizontal due to the rotation of the rotating shaft 122 as a reference height; a step of setting a range of a rotation angle of the rotating shaft 122 to be less than 180° when the rotating shaft 122 rotates in a positive direction or a reverse direction from the reference height; and a step of rotating the rotating shaft 122 in either a positive direction or a reverse direction to raise or lower the support plate 40.

[0085] First, a state where the rotation center of the rotation shaft 122 and the cam member 130 are horizontal due to the rotation of the rotation shaft 122 is set as a reference height. Figure 7 (B) The rotation axis 122 and the rotation center 132 of the cam member 130 are in a state where they are horizontal to each other. In this case, the height of the support plate 40 based on the cam member 130 is set as a reference height.

[0086] On the other hand, the Figure 7 (A) is that the rotation axis 122 and the rotation center 132 of the cam member 130 are arranged perpendicular to each other, and the rotation center 132 is located below the rotation axis 122. In this case, the outer periphery of the cam member 130 abutting against the support plate 40 is located below the reference height, and in this case, the support plate 40 is located below the reference height. At this time, the distance between the support plate 40 and the reference height is the same as the spacing distance d between the rotation axis 122 and the rotation center.

[0087] If the rotating shaft 122 is rotated 90° clockwise in this state, Figure 7 In the state (B), the rotation axis 122 and the rotation center 132 are arranged to be horizontal to each other, and the rotation center 132 and the rotation axis 122 are located at the same height. In this case, the outer periphery of the cam member 130 abutting against the support plate 40 corresponds to the reference height, and the support plate 40 is located at the reference height.

[0088] If the rotating shaft 122 is rotated 90° clockwise in this state, Figure 7 In the state (C), the rotation axis 122 and the rotation center 132 are arranged perpendicular to each other, and the rotation center 132 is located above the rotation axis 122. In this case, the outer periphery of the cam member 130 abutting against the support plate 40 exceeds the reference height, so that the support plate 40 moves upward. At this time, the distance between the support plate 40 and the reference height is the same as the spacing distance d between the rotation axis 122 and the rotation center 132.

[0089] As described above, when the rotation shaft 122 rotates and the rotation centers of the rotation shaft 122 and the cam member 130 are aligned horizontally (in Figure 6 The reason for setting the reference height (in the case where the phase of the rotating axis is at 90° or 270°) is to make the height adjustment range of the supporting plate 40 based on the rotation of the rotating axis 122 be between the highest point and the lowest point of the supporting plate 40 when the supporting plate 40 is moved up and down.

[0090] That is, if the range of the rotation angle of the rotating shaft 122 is set to be less than 180° when the rotating shaft 122 rotates in the forward direction or the reverse direction at the reference height, or if the range of the height adjustment of the support plate 40 by the rotation of the rotating shaft 122 is set to be less than twice the distance between the rotating shaft 122 and the rotation center 142 of the cam member 130, then the height adjustment range of the support plate 40 is as follows: Figure 6 As shown, it is located between the highest point and the lowest point of the support plate 40.

[0091] For example, in Figure 6 In the embodiment, when the distance between the rotating shaft 122 and the rotation center 142 of the cam component 130 corresponds to 1.5 mm, the distance between the highest point and the lowest point of the support plate 40 corresponds to 3.0 mm corresponding to twice the separation distance, and the height adjustment range can be set to 2.0 mm, and a margin of 0.5 mm is provided from the highest point to the lowest point on both sides of the height adjustment range.

[0092] However, when the reference height is set, the rotation axis 122 and the rotation center of the cam member 130 are horizontal (in Figure 6 In reality, it is difficult to accurately set the reference height (in the case where the phase of the rotation axis is at 90° or 270°).

[0093] Therefore, if Figure 8 As shown, the phase of the rotating shaft 122 is deviated from 90° and set as the reference height, and the range of the rotation angle of the rotating shaft 122 is set to 180°, then the height adjustment range of the support plate 40 is deviated from between the highest point and the lowest point of the support plate 40.

[0094] That is, when the rotation shaft 122 is rotated in order to raise the support plate 40 to the maximum, the rotation angle range of the rotation shaft 122 exceeds 180° at which the support plate 40 reaches the highest point. In this case, even if the phase of the rotation shaft 122 is rotated to more than 180°, the support plate 40 will no longer rise, and will instead fall from the moment the phase of the rotation shaft 122 exceeds 180°. Therefore, when the tilt of the support plate 40 is adjusted by controlling the driving of the rotation shaft 122 to adjust the height of the support plate 40, the tilt may not be adjusted appropriately.

[0095] As a result, after the rotation angle range of the rotation shaft 122 or the height adjustment range of the support plate 40 is set as described above, the rotation shaft 122 is rotated in either the forward direction or the reverse direction to move the support plate 40 up and down.

[0096] on the other hand, Fig. 9 As a plan view of the support plate 40 , the support plate 40 and the tilt adjustment units 100A and 100B are shown.

[0097] As described above, in order to adjust the tilt angle and tilt direction of the support plate 40 through the tilt adjustment units 100A and 100B, it is preferred to provide a plurality of tilt adjustment units 100A and 100B rather than providing a single tilt adjustment unit 100A and 100B.

[0098] For example, Fig. 9 As shown, two tilt adjustment units 100A and 100B may be provided on the support plate 40. Here, the number of the tilt adjustment units 100A and 100B is just an example, and of course more than two may be provided.

[0099] In this case, the support plate 40 may be supported by a plurality of tilt adjustment units 100A, 100B, or by the fixing unit 300 and a plurality of tilt adjustment units 100A, 100B. Hereinafter, it is assumed that one fixing unit 300 and two tilt adjustment units 100A, 100B are provided.

[0100] Here, the fixing unit 300 cannot adjust the tilt angle of the support plate 40 but only plays the role of fixing and supporting the support plate 40 .

[0101] On the other hand, the structures of the tilt adjustment units 100A and 100B have been described in detail, and thus repeated descriptions are omitted.

[0102] like Fig. 9As shown, when one fixing unit 300 and two tilt adjustment units 100A, 100B are provided, the fixing unit 300 and the tilt adjustment units 100A, 100B may be symmetrically arranged. For example, the fixing unit 300 and the tilt adjustment units 100A, 100B may be arranged so as to form a central angle of 120 degrees, respectively, with the central portion of the support plate 40 as the center.

[0103] In addition, as described above, when the fixing unit 300 is provided, the fixing unit 300 may be connected to the support plate 40 along a direction toward the opening 13 of the chamber 12 .

[0104] In this way, when a plurality of tilt adjustment units 100A and 100B are provided, the tilt angles of the tilt adjustment units 100 may be the same or different from each other.

[0105] The tilt angle and tilt direction of the support plate 40 and the base 16 may be adjusted by making the tilt angles of the tilt adjustment units 100A and 100B the same or different from each other.

[0106] on the other hand, Fig.10 1 is a plan view and a side view of the base 16 in an inclined state. Fig.10 FIG. 2 shows a state where the substrate W is placed on the inclined susceptor 16 according to the prior art.

[0107] Reference Fig.10 When the base 16 is tilted, when the substrate W is placed in the recess 17 of the base 16 by the robot 200, the substrate W may not be placed in the center of the recess 17 but may be placed biased to one side.

[0108] That is, when the base 16 is tilted, the second center line CL' in the tilted state relative to the first center line CL in the horizontal state of the base 16 may change its position in the X-axis and Y-axis directions. Therefore, if the robot 200 places the substrate W on the aforementioned lifting pins 70 in accordance with the first center line CL in the horizontal state of the base 16, Fig.10 In that case, the substrate W is arranged biased to one side in the recessed portion 17 . In serious cases, the substrate W cannot be inserted into the recessed portion 17 and one side of the substrate W hangs on the upper side of the recessed portion 17 .

[0109] In this case, the distances D2 and D3 from the edge of the substrate W to the recessed portion 17 may change, resulting in a difference in thermal conductivity between the substrate W and the susceptor 16 , and processing of the substrate W cannot be smoothly performed. In the process using plasma, arcing may occur.

[0110] Fig.11 1 is a plan view and a side view of the base 16 in an inclined state. Fig.11 FIG. 4 shows a state where the substrate W is placed on the inclined susceptor 16 according to the present invention.

[0111] Reference Fig.11 The substrate processing apparatus 1000 may include a control unit (not shown), which controls the driving of the tilt adjustment unit 100 to correct the position of the substrate W placed on the base 16 by the robot arm 200 according to the tilt of the base 16.

[0112] For example, the tilt information of the base 16 based on the substrate W or the tilt information of the base 16 based on the process of the substrate W and the correction position information of the robot arm 200 corresponding to the tilt information of the base 16 can be pre-stored in the control unit in a tilt-correction position information table.

[0113] That is, the tilt information of the susceptor 16 based on the substrate W or the tilt information of the susceptor 16 based on the process of the substrate W and the corrected positions of the X-axis and Y-axis of the robot 200 corresponding to the tilt information may be organized in a table form.

[0114] Here, the tilt information of the base 16 may include at least one of the tilt angle and the tilt direction of the base 16. Therefore, the tilt information of the base 16 may include only one of the tilt angle and the tilt direction of the base 16, or both.

[0115] For example, as described above, when a plurality of tilt adjustment units 100 are provided, the driving time, driving voltage or driving speed of the driving unit 120 driving each tilt adjustment unit 100 can be predetermined according to the substrate or according to the process of the substrate. Furthermore, the height change of the base 16 can also be directly determined by driving each tilt adjustment unit 100.

[0116] On the other hand, the driving time, driving voltage or driving speed of the driving unit 120 driving each tilt adjustment unit 100 can be input into the tilt-correction position information table as an input condition. Furthermore, the height change of the base 16 caused by the driving of each tilt adjustment unit 100 can also be directly input into the tilt-correction position information table as an input condition.

[0117] Furthermore, the correction position information of the robot arm 200 may be input as X-axis correction coordinates and Y-axis correction coordinates corresponding to the input conditions.

[0118] Therefore, the method for processing a substrate using the substrate processing device 1000 includes: a step of tilting at least one of the tilt angle and tilt direction of the base 16 to a predetermined tilt angle and tilt direction; a step of extracting the correction position of the robot arm 200 from the tilt-correction position information table corresponding to the tilt angle and tilt direction of the base 16; and a step of correcting the position of the robot arm 200 and placing the substrate W on the base 16.

[0119] First, the control unit can control the driving of the driving unit 120 of each tilt adjustment unit 100 to adjust the tilt angle and tilt direction of the base 16 according to the tilt information of the base 16 based on the substrate W or the tilt information of the base 16 based on the process of the substrate W.

[0120] In this case, when a plurality of tilt adjustment units 100 are provided, the driving time, driving voltage or driving speed of the driving unit 120 driving each tilt adjustment unit 100 can be adjusted according to the substrate or according to the process of the substrate. Furthermore, the height of the base 16 can be directly adjusted by driving each tilt adjustment unit 100.

[0121] Next, the control unit may extract the correction position of the robot arm 200 corresponding to the tilt angle and tilt direction of the base 16 from the tilt-correction position information table.

[0122] In this case, the control unit can extract the driving time, driving voltage or driving speed of the driving unit 120 that drives each tilt adjustment unit 100, as well as the X-axis correction coordinate and Y-axis correction coordinate of the robotic arm 200 corresponding to the height of the base 16 from the tilt-correction position information table.

[0123] Next, the control unit corrects the position of the robot arm 200 according to the X-axis correction coordinate and the Y-axis correction coordinate of the robot arm 200 and places the substrate W on the base 16 .

[0124] After the above process, the substrate W is also tilted at a predetermined angle and direction. Fig.11 As shown in the figure, the substrate W is placed in accordance with the new second center line CL′ of the recessed portion 17 , so that the distance D1 from the edge of the substrate W to the recessed portion 17 can be kept constant.

[0125] Thus, processes on the substrate W can be smoothly performed. For example, a thin film can be uniformly deposited on the substrate W, and arcing can be prevented in a process using plasma.

[0126] The above description is made with reference to the preferred embodiments of the present invention, and those skilled in the art can make various modifications and changes to the present invention without departing from the concept and scope of the present invention as described in the attached claims. Therefore, if the implementation of the modification basically includes the constituent elements of the claims of the present invention, it should be deemed to be included in the technical scope of the present invention.

Claims

1. A substrate processing device, characterized in that: have: The chamber provides a processing space for the substrate; A susceptor is disposed inside the chamber and is used to place the substrate and heat the substrate; A robot arm, for placing the substrate on the base or taking the substrate out of the base; a tilt adjustment unit for adjusting the tilt of the base; and The control unit controls the driving of the tilt adjustment unit and corrects the position of the substrate placed on the base by the robot arm according to the tilt of the base.

2. The substrate processing device according to claim 1, characterized in that: A recessed portion for inserting and placing the substrate is formed on the base. The substrate is placed at the center of the recessed portion by the robot arm.

3. The substrate processing device according to claim 1, characterized in that: Tilt information of the susceptor based on the substrate or tilt information of the susceptor based on a process of the substrate and correction position information of the robot arm corresponding to the tilt information of the susceptor are pre-stored in the control unit in a tilt-correction position information table.

4. The substrate processing device according to claim 3, characterized in that: The tilt information of the base includes at least one of a tilt angle and a tilt direction of the base.

5. The substrate processing apparatus according to claim 1, wherein: The control unit drives the tilt adjustment unit according to the tilt information of the base based on the substrate or the tilt information of the base based on the process of the substrate, so as to adjust at least one of the tilt angle and the tilt direction of the base. The correction position of the robot arm corresponding to the tilt angle and tilt direction of the base is extracted from the tilt-correction position information table to correct the position of the substrate placed on the base by the robot arm.

6. A substrate processing method of a substrate processing device, wherein the substrate processing device has a susceptor in a chamber for placing a substrate for processing, characterized in that: The substrate processing method comprises: The step of tilting at least one of the tilt angle and the tilt direction of the base to a predetermined tilt angle and tilt direction; A step of extracting a correction position of the robot arm from the tilt-correction position information table corresponding to the tilt angle and tilt direction of the base; and The step of correcting the position of the robot arm and placing the substrate on the base.

7. The substrate processing method according to claim 6, characterized in that: Tilt information of the susceptor based on the substrate or tilt information of the susceptor based on the process of the substrate and correction position information of the robot arm corresponding to the tilt of the susceptor are pre-stored in the control unit in a tilt-correction position information table.

8. The substrate processing method according to claim 6, characterized in that: In the step of placing the substrate on the base, A recessed portion for inserting and placing the substrate is formed on the upper surface of the base, and the substrate is placed at the center of the recessed portion by the robot arm.

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