Medical module packaging structure and packaging method

Abstract

The invention discloses a medical module packaging structure and a packaging method. The packaging structure comprises a substrate, a first chip, a second chip, a PCB module and a plastic package body. The substrate is provided with a first surface; the first chip is provided with a second surface and a third surface which are oppositely arranged, the second surface is attached to the first surface of the substrate, and a first welding bulge and a bonding pad are formed on the third surface; the second chip is arranged on the third surface of the first chip and is electrically connected with the first welding bulge; the PCB module is arranged on the first surface of the substrate and is electrically connected with the bonding pad of the first chip; the plastic package body is formed on the first surface of the substrate and covers the PCB module and the bonding pad of the first chip; wherein the thermal expansion coefficient of the substrate is matched with the thermal expansion coefficient of the first chip. According to the medical module packaging structure and the packaging method, the warping degree of the chip and the substrate can be reduced, and meanwhile, the risk of chip damage is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of module packaging, and in particular to a medical module packaging structure and a packaging method. Background Art

[0002] At present, factories have certain basic process capabilities for module packaging in traditional fields. However, for the packaging of medical modules, higher requirements are placed on the process in every process detail.

[0003] The existing module packaging technology based on the traditional field is to add a central PCB substrate as a support and set chips on both sides of the PCB substrate. However, in order to achieve the interconnection and conduction of the chips on both sides, it is necessary to select the PCB substrate stacking process. The substrate stacking process is relatively expensive. Secondly, the PCB substrate is a single operation, and each strip has multiple Unit substrates (substrate units). In this way, when the chip is packaged, the edge of the substrate and the chip will be relatively warped, which will increase the difficulty of packaging. At the same time, the utilization rate of the substrate during packaging is likely to be reduced to about 60%, resulting in greater loss of the substrate.

[0004] Since the traditional module packaging does not have high requirements on the warping degree of the edge of the PCB substrate, the above-mentioned packaging structure can be applied to the traditional module packaging.

[0005] However, the new medical module requires the warpage to be less than 10um during secondary interconnection. However, because the material of the PCB substrate is mainly organic material, its thermal expansion coefficient is large, while the material of the chip and passive components is mostly silicon, the thermal expansion coefficient is small. During the manufacturing process, the mismatch of the thermal expansion coefficients of the two may cause the warpage to increase, making it difficult to meet the required product requirements.

[0006] Secondly, in the traditional module packaging, the bottom of the chip and PCB substrate are not supported and not plastic-sealed after being interconnected, so special control is required during transportation to avoid chip damage. At the same time, in traditional module packaging, the secondary interconnection process between the second chip-TransducerArray and the PCB substrate will be pressurized again, and the direct pressure on the chip and PCB substrate is also prone to chip damage.

[0007] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0008] The object of the present invention is to provide a medical module packaging structure and packaging method, which can reduce the warping of the chip and the substrate and reduce the risk of chip damage.

[0009] To achieve the above-mentioned purpose, an embodiment of the present invention provides a medical module packaging structure, including a substrate, a first chip, a second chip, a PCB module and a plastic package. The substrate has a first surface; the first chip has a second surface and a third surface arranged opposite to each other, the second surface is arranged in contact with the first surface of the substrate, and a first welding protrusion and a welding pad are formed on the third surface; the second chip is arranged on the third surface of the first chip and is electrically connected to the first welding protrusion; the PCB module is arranged on the first surface of the substrate and is electrically connected to the welding pad of the first chip; the plastic package is formed on the first surface of the substrate and covers the PCB module and the welding pad of the first chip; wherein the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the first chip.

[0010] In the above technical solution, the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the first chip, which can be understood as the thermal expansion coefficient of the substrate being the same as or similar to the thermal expansion coefficient of the first chip, wherein similar means that the difference between the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the first chip is within an allowable range, and the allowable range is ±5 (unit: 1 / °C).

[0011] In one or more embodiments of the present invention, the substrate is selected from a glass substrate, and the first chip is selected from an ASIC chip.

[0012] In one or more embodiments of the present invention, a first welding area and at least one pad area are provided on the third surface of the first chip, the pad area is located at the edge of the first welding area, the first welding protrusion is formed in the first welding area, and the pad is formed in the pad area.

[0013] In one or more embodiments of the present invention, the second chip is disposed in the first bonding area of ​​the first chip.

[0014] In one or more embodiments of the present invention, the plastic package body is disposed to cover a pad area of ​​the first chip.

[0015] In one or more embodiments of the present invention, a second welding protrusion is formed on the second chip; a side of the second chip provided with the second welding protrusion is arranged in contact with the third surface of the first chip, and the second welding protrusion is electrically connected to the first welding protrusion.

[0016] In one or more embodiments of the present invention, an adhesive layer is disposed between the second chip and the first chip.

[0017] In one or more embodiments of the present invention, the PCB module is spaced apart from the first chip, and wire bonding is performed between the PCB module and pads of the first chip.

[0018] In one or more embodiments of the present invention, the PCB module includes a PCB board and passive components formed on the PCB board, and the PCB board is partially disposed on the first surface of the substrate.

[0019] The present invention also provides a medical module packaging method, comprising: providing a substrate, the substrate having a first surface; providing a first chip, the first chip having a second surface and a third surface arranged opposite to each other, a first welding protrusion and a welding pad formed on the third surface, and the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the first chip; attaching the second surface of the first chip to the first surface of the substrate; providing a PCB module, attaching the PCB module to the first surface of the substrate and electrically connecting the welding pad of the first chip; plastic-sealing the PCB module and the welding pad of the first chip; providing a second chip, arranging the second chip on the first chip and electrically connecting the first welding protrusion of the first chip.

[0020] In one or more embodiments of the present invention, the second chip is attached to a side of the first chip away from the substrate by using a low-temperature bonding technique.

[0021] In one or more embodiments of the present invention, providing the first chip includes: providing a wafer, the wafer including a plurality of first chips arranged in an array; manufacturing the first welding bump on the wafer; and cutting the wafer to obtain the first chip.

[0022] An embodiment of the present invention further provides a medical module packaging structure, comprising a substrate, a first chip, a PCB module and a plastic package. The substrate has a first surface; the first chip has a second surface and a third surface arranged opposite to each other, the second surface is arranged in contact with the first surface of the substrate, and a solder pad is formed on the third surface; the PCB module is arranged on the first surface of the substrate and is electrically connected to the solder pad of the first chip; the plastic package is formed on the first surface of the substrate and covers the PCB module and the solder pad of the first chip; wherein the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the first chip.

[0023] Compared with the prior art, the medical module packaging structure and packaging method of the embodiments of the present invention use a substrate whose thermal expansion coefficient matches that of the first chip as a support plate, and use a chip bonding film-thin film adhesive to attach the first chip to the substrate. Since the thermal expansion coefficients of the two are matched, the warping of the first chip and the substrate during the packaging process can be reduced, thereby achieving the warping requirements for subsequent processing of the medical module.

[0024] In the medical module packaging structure and packaging method of the embodiment of the present invention, the first chip is arranged on the substrate, and the substrate provides a buffer for the first chip, which can reduce the risk of damage to the chip and the packaging module.

[0025] In the medical module packaging structure and packaging method of the embodiment of the present invention, the second chip and the first chip are directly interconnected, and there is no need to perform an intermediate substrate stacking process, thereby reducing the packaging cost.

[0026] The medical module packaging structure and packaging method of the embodiments of the present invention can not only realize the electrical connection between the second chip and the first chip through the low-temperature bonding technology, but also protect the first welding protrusion on the first chip and the second welding protrusion on the second chip, thereby simplifying the process, making the structure between the first chip and the second chip compact, reducing the chip packaging size, and reducing the packaging cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of a medical module packaging structure according to an embodiment of the present invention;

[0028] Figure 2 is a process flow chart of a medical module packaging method according to an embodiment of the present invention;

[0029] Figure 3 is a detailed diagram of the process flow of a medical module packaging method according to an embodiment of the present invention;

[0030] Figure 4a-4k It is a schematic diagram of packaging steps of a medical module packaging method according to one embodiment of the present invention. DETAILED DESCRIPTION

[0031] The specific implementation modes of the present invention are described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific implementation modes.

[0032] Unless explicitly stated otherwise, throughout the specification and claims, the term “comprise” or variations such as “include” or “comprising”, etc., will be understood to include the stated elements or components but not to exclude other elements or components.

[0033] As mentioned in the background technology, the module packaging structure in the traditional field includes an intermediate substrate, a first chip formed on the upper surface of the intermediate substrate, and a second chip formed on the lower surface of the intermediate substrate, wherein the interconnection between the first chip and the second chip is achieved through the intermediate substrate stacking process. However, the substrate stacking process is expensive, resulting in a high packaging cost for the above-mentioned packaging structure. Secondly, due to the mismatch in the thermal expansion coefficients of the intermediate substrate and the first chip or the second chip, the degree of warping between the first chip or the second chip and the intermediate substrate will increase (much greater than 10um). For the packaging structure of the medical module whose warping requirement needs to be less than 10um, the above structure is difficult to meet the required product requirements and is obviously not applicable. Furthermore, since the first chip and the second chip are directly connected to the intermediate substrate, there is no supporting structure to support them and there is no plastic sealing, which can easily cause chip damage.

[0034] In order to solve the above technical problems, with respect to the medical module, the present application provides a packaging structure of a medical module, by providing a substrate whose thermal expansion coefficient matches that of the first chip as a support, placing the PCB module and the first chip on the substrate and connecting them with wires, then performing plastic sealing on the pad areas of the PCB module and the first chip for protection, and finally directly interconnecting the second chip with the first chip, thereby reducing chip warping while increasing the strength of the module and reducing the packaging cost of the medical module.

[0035] like Figure 1 As shown, a medical module packaging structure according to an embodiment of the present invention includes: a substrate 10, a first chip 20, a second chip 30, a PCB module and a plastic package 50. The first chip 20 and the PCB module are both arranged on the same surface of the substrate 10, and the two are wire bonded by metal wires 60. The second chip 30 is directly arranged on the first chip 20 and is electrically connected to the first chip 20. The plastic package 50 covers the PCB module and part of the first chip 20 to provide protection.

[0036] The substrate 10 is preferably a glass substrate. The substrate 10 has a flat first surface 11. In other embodiments, the substrate 10 may also be a substrate of other materials, as long as the thermal expansion coefficient of the substrate of the material matches the thermal expansion coefficient of the first chip, that is, the thermal expansion coefficient of the substrate of the material is the same as or similar to the thermal expansion coefficient of the first chip. Wherein, similar means that the difference between the thermal expansion coefficient of the substrate of the material and the thermal expansion coefficient of the first chip is within an allowable range, and the allowable range is ±5 (unit: 1 / ℃).

[0037] The first chip 20 is preferably an ASIC chip. The first chip 20 has a second surface 20a and a third surface 20b that are arranged opposite to each other. The second surface 20a of the first chip 20 is attached to the first surface 11 of the substrate 10 by a film adhesive 70. A first welding area 21 and one or more pad areas 22 are arranged on the third surface 20b of the first chip 20, and the pad area 22 is located at the edge of the first welding area 21. A plurality of first welding protrusions 211 are formed in the first welding area 21 of the third surface 20b, and a plurality of pads are formed in the pad area 22.

[0038] In the above technical solution, since the thermal expansion coefficient of the glass substrate is highly matched with the thermal expansion coefficient of the ASIC chip, the ASIC chip is attached to the surface of the glass substrate to reduce the warping, thereby meeting the warping requirements of subsequent processing in the medical module.

[0039] The second chip 30 is arranged on the third surface 20b of the first chip 20, preferably, arranged in the first welding area 21 of the first chip 20. The second chip 30 is electrically connected to the first welding protrusion 211. Exemplarily, the second chip 30 is preferably a transducer chip. A second welding protrusion 31 is formed on the second chip 30; the side of the second chip 30 provided with the second welding protrusion 31 is arranged in contact with the third surface 20b of the first chip 20, and the second welding protrusion 31 is electrically connected to the first welding protrusion 211. Further, the second chip 30 and the first chip 20 are closely interconnected by low-temperature bonding technology. Exemplarily, an adhesive layer 80 is provided between the second chip 30 and the first chip 20 by low-temperature bonding technology. The adhesive layer 80 can not only enhance the electrical connection strength of the first chip 20 and the second chip 30, but also protect the first welding protrusion 211 of the first chip 20 and the second welding protrusion 31 of the second chip 30.

[0040] The PCB module is attached to the first surface 11 of the substrate 10 by a film adhesive 70 and is electrically connected to the pads of the first chip 20. Exemplarily, the PCB module is spaced apart from the first chip 20, and the PCB module is electrically connected to the pads of the first chip 20 by a metal wire 60. The PCB module includes a PCB board 41 and passive components 42 formed on the PCB board 41. The PCB board 41 is partially disposed on the first surface 11 of the substrate 10, and other corresponding components can also be disposed on the portion of the PCB board protruding from the substrate 10 as required.

[0041] The plastic package 50 is formed on the first surface 11 of the substrate 10 and covers the PCB module and the pad arrangement of the first chip 20. Specifically, the plastic package 50 completely covers the PCB module (including the portion thereof protruding from the substrate 10), and the plastic package 50 completely covers the metal lead 60 and the pad area 22 where the pad is located. The plastic package 50 can enhance the connection strength of the connection structure (pad, PCB module and metal lead) in the medical module and protect the connection structure from damage.

[0042] refer to Figure 2 As shown, the present invention also provides a packaging method for the above-mentioned medical module, including: s1, providing a substrate, the substrate having a first surface; s2, providing a first chip, the first chip having a second surface and a third surface arranged opposite to each other, a first welding protrusion and a welding pad formed on the third surface, and the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the first chip; s3, attaching the second surface of the first chip to the first surface of the substrate; s4, providing a PCB module, attaching the PCB module to the first surface of the substrate, and electrically connecting the welding pad of the first chip; s5, plastic-sealing the PCB module and the welding pad of the first chip; s6, providing a second chip, arranging the second chip on the first chip and electrically connecting the second chip to the first welding protrusion of the first chip.

[0043] Among them, reference Figure 3 As shown, the first chip in step s2 can be obtained by the following steps: s201, providing a wafer, the wafer comprising a plurality of first chips arranged in an array; s202, making a first welding bump on the wafer; s203, cutting the wafer to obtain the first chip.

[0044] Figure 4a-4k The following is a schematic diagram of the steps of the medical module packaging method in one embodiment of the present invention. The medical module packaging method of the present invention is described in detail below in conjunction with the schematic diagram of the steps of the medical module packaging method.

[0045] like Figure 4a As shown, an ASIC wafer 100 is provided. A plurality of first chips 20 are arranged in an array on the ASIC wafer 100, and a cutting channel is formed between adjacent first chips 20, and the ASIC wafer 100 can be cut along the cutting channel to be divided into a plurality of first chips 20. Each first chip 20 includes a welding area 21 for forming a first welding protrusion 211 and a pad area 22 located at the edge of the welding area 21. An I / O pad for achieving electrical connection with the outside is formed in the pad area 22. The first welding protrusion 211 is manufactured in each welding area 21 of the ASIC wafer 100.

[0046] like Figure 4bAs shown, the back side of the ASIC wafer 100 (the side without the first welding protrusion 211) is back ground to reduce the thickness of the chip and obtain the required chip size.

[0047] like Figure 4c As shown, a film adhesive 70 is pasted on the back side of the ASIC wafer 100 (the side without the first solder bumps 211 ) to facilitate the subsequent pasting of the first chip 20 on the substrate 10 .

[0048] like Figure 4d As shown, the ASIC wafer 100 is cut along cutting channels to obtain first chips 20 .

[0049] like Figure 4e As shown, the first chip 20 is bonded to the substrate 10. The substrate 10 is preferably a glass substrate, and may also be a substrate of other materials whose thermal expansion coefficient matches that of the ASIC wafer 100. The substrate 10 has a flat first surface 11. The first chip 20 is an ASIC chip. The first chip 20 has a second surface 20a and a third surface 20b that are arranged opposite to each other. The second surface 20a of the first chip 20 is bonded to the first surface 11 of the substrate 10 by a film adhesive 70.

[0050] In the above technical solution, since the thermal expansion coefficient of the glass substrate is highly matched with the thermal expansion coefficient of the ASIC chip, the ASIC chip is attached to the surface of the glass substrate to reduce the warping, thereby meeting the warping requirements of subsequent processing in the medical module.

[0051] like Figure 4f As shown, a PCB module is provided. The PCB module includes a PCB board 41 and passive components 42. The passive components 42 such as R / L / C are pasted onto the PCB board 41 through the SMT process.

[0052] like Figure 4g As shown, a film adhesive 70 is pasted on a part of the back side of the PCB board 41 (the side where the passive components 42 are not provided) to facilitate the subsequent pasting of the PCB module on the substrate 10. The area on the back side of the PCB board 41 where the film adhesive 70 is not provided can be electrically connected to other corresponding components as needed.

[0053] like Figure 4h and 4i As shown, the PCB module is attached to the first surface 11 of the substrate 10 and electrically connected to the pads of the first chip 20. The PCB module and the first chip 20 are spaced apart, and the PCB module and the pads of the first chip 20 are electrically connected by wire bonding through metal wires 60.

[0054] like Figure 4jAs shown, the PCB module and the pads of the first chip 20 are plastic-encapsulated. The plastic encapsulation body 50 is formed on the first surface 11 of the substrate 10 and covers the PCB module and the pads of the first chip 20. Specifically, the plastic encapsulation body 50 completely covers the PCB module (including the portion protruding from the substrate 10), and the plastic encapsulation body 50 completely covers the metal lead 60 and the pad area 22 where the pad is located. The plastic encapsulation body 50 can enhance the connection strength of the connection structure (pad, PCB module and metal lead) in the medical module and protect the connection structure from damage.

[0055] like Figure 4k As shown, a second chip 30 is provided, and the second chip 30 is arranged on the first chip 20 and is electrically connected to the first welding protrusion 211 of the first chip 20. Specifically, the second chip 30 is arranged on the third surface 20b of the first chip 20, and preferably, is arranged in the first welding area 21 of the first chip 20. The second chip 30 is electrically connected to the first welding protrusion 211. Exemplarily, the second chip 30 is preferably a transducer chip. A second welding protrusion 31 is formed on the second chip 30; one side of the second chip 30 provided with the second welding protrusion 31 is arranged in contact with the third surface 20b of the first chip 20, and the second welding protrusion 31 is electrically connected to the first welding protrusion 211. Furthermore, the second chip 30 and the first chip 20 are closely interconnected by low-temperature bonding technology. Low-temperature bonding technology is a known prior art in the semiconductor industry, and this application will not elaborate on it.

[0056] In another embodiment of the present application, the medical module packaging structure may also only include: a substrate 10, a first chip 20, a PCB module and a plastic package 50. The first chip 20 and the PCB module are both arranged on the same surface of the substrate 10, and the two are wire bonded by metal wires 60. The plastic package 50 covers the PCB module and part of the first chip 20 to provide protection. This packaging structure can also increase the strength of the module while reducing chip warping, while reducing the packaging cost of the medical module.

[0057] In this embodiment, the structure, material, and mutual connection method of the substrate 10, the first chip 20, the PCB module, and the plastic package 50 are consistent with the medical module packaging structure in the previous embodiment. The difference between this embodiment and the previous embodiment is that the medical module packaging structure in this embodiment does not include the second chip 30. The second chip 30 can be connected to the medical module packaging structure in this embodiment in other subsequent processes.

[0058] Compared with the prior art, the medical module packaging structure and packaging method of the embodiments of the present invention use a substrate whose thermal expansion coefficient matches that of the first chip as a support plate, and use a chip bonding film-thin film adhesive to attach the first chip to the substrate. Since the thermal expansion coefficients of the two are matched, the warping of the first chip and the substrate during the packaging process can be reduced, thereby achieving the warping requirements for subsequent processing of the medical module.

[0059] In the medical module packaging structure and packaging method of the embodiment of the present invention, the first chip is arranged on the substrate, and the substrate provides a buffer for the first chip, which can reduce the risk of damage to the chip and the packaging module.

[0060] In the medical module packaging structure and packaging method of the embodiment of the present invention, the second chip and the first chip are directly interconnected, and there is no need to perform an intermediate substrate stacking process, thereby reducing the packaging cost.

[0061] The medical module packaging structure and packaging method of the embodiments of the present invention can not only realize the electrical connection between the second chip and the first chip through the low-temperature bonding technology, but also protect the first welding protrusion on the first chip and the second welding protrusion on the second chip, thereby simplifying the process, making the structure between the first chip and the second chip compact, reducing the chip packaging size, and reducing the packaging cost.

[0062] The various aspects, embodiments, features and examples of the present invention should be considered as illustrative in all aspects and are not intended to limit the present invention, the scope of the present invention is defined only by the claims. Other embodiments, modifications and uses will be apparent to those skilled in the art without departing from the spirit and scope of the claimed invention.

[0063] The use of headings and sections in this application is not meant to limit the invention; each section may apply to any aspect, embodiment, or feature of the invention.

[0064] Throughout this application, where a composition is described as having, containing, or including particular components, or where a process is described as having, containing, or including particular process steps, it is contemplated that the compositions taught by the present invention also consist essentially of or consist of the recited components, and that the processes taught by the present invention also consist essentially of the recited process steps or consist of the recited groups of process steps.

[0065] In this application, where an element or component is referred to as being included in and / or selected from a list of described elements or components, it should be understood that the element or component may be any of the described elements or components and may be selected from a group consisting of two or more of the described elements or components. In addition, it should be understood that the elements and / or features of the compositions, apparatuses, or methods described herein may be combined in various ways, whether explicitly or implicitly described herein, without departing from the spirit and scope of the present teachings.

[0066] Unless specifically stated otherwise, the use of the terms "including", "having" and "comprising" should generally be construed as open ended and non-limiting.

[0067] Unless specifically stated otherwise, the use of the singular herein includes the plural (and vice versa). Furthermore, the singular forms "a," "an," and "the" include the plural unless the context clearly dictates otherwise. Additionally, where the term "about" is used before a quantitative value, the present teachings also include the specific quantitative value itself unless specifically stated otherwise.

[0068] It should be understood that the order of the various steps or the order in which a particular action is performed is not very important, as long as the teachings of the present invention remain operable. In addition, two or more steps or actions may be performed simultaneously.

[0069] It should be understood that the various figures and descriptions of the present invention have been simplified to illustrate elements relevant to a clear understanding of the present invention, while other elements have been eliminated for clarity purposes. However, those skilled in the art will recognize that these and other elements may be desirable. However, since such elements are well known in the art and since they do not promote a better understanding of the present invention, a discussion of such elements is not provided herein. It should be understood that the various figures are presented for illustrative purposes and are not intended to be construction diagrams. Omitted details and modified or alternative embodiments are within the scope of those skilled in the art.

[0070] It is understood that in certain aspects of the present invention, a single component may be replaced by multiple components and multiple components may be replaced by a single component to provide an element or structure or to perform one or several given functions. Except where this substitution will not operate to practice a specific embodiment of the present invention, this substitution is considered to be within the scope of the present invention.

[0071] Although the present invention has been described with reference to illustrative embodiments, it will be appreciated by those skilled in the art that various other changes, omissions and / or additions may be made without departing from the spirit and scope of the present invention and that the elements of the embodiments may be replaced by substantial equivalents. In addition, many modifications may be made without departing from the scope of the present invention to adapt specific circumstances or materials to the teachings of the present invention. Therefore, it is not intended herein to limit the present invention to the disclosed specific embodiments for performing the present invention, but it is intended that the present invention will include all embodiments within the scope of the appended claims. In addition, unless specifically stated, any use of the terms first, second, etc. does not indicate any order or importance, but rather uses the terms first, second, etc. to distinguish one element from another.

Claims

1. A medical module packaging structure, characterized in that: include: A substrate having a first surface; A first chip has a second surface and a third surface that are arranged opposite to each other, wherein the second surface is arranged in contact with the first surface of the substrate, and a first welding protrusion and a welding pad are formed on the third surface; A second chip is disposed on the third surface of the first chip and is electrically connected to the first welding protrusion; A PCB module is disposed on the first surface of the substrate and is electrically connected to the pads of the first chip; A plastic package body, formed on the first surface of the substrate and covering the PCB module and the pads of the first chip; Wherein, the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the first chip.

2. The medical module packaging structure according to claim 1, characterized in that: The substrate is selected from a glass substrate, and the first chip is selected from an ASIC chip.

3. The medical module packaging structure according to claim 1, characterized in that: A first welding area and at least one pad area are provided on the third surface of the first chip. The pad area is located at the edge of the first welding area. The first welding protrusion is formed in the first welding area. The pad is formed in the pad area.

4. The medical module packaging structure according to claim 3, characterized in that: The second chip is disposed in the first welding area of ​​the first chip; and / or, The plastic package body covers the pad area of ​​the first chip.

5. The medical module packaging structure according to claim 1, characterized in that: A second welding protrusion is formed on the second chip; A side of the second chip provided with a second welding protrusion is arranged in contact with the third surface of the first chip, and the second welding protrusion is electrically connected to the first welding protrusion.

6. The medical module packaging structure according to claim 5, characterized in that: An adhesive layer is disposed between the second chip and the first chip.

7. The medical module packaging structure according to claim 1, characterized in that: The PCB module is spaced apart from the first chip, and wire bonding is performed between the PCB module and the pads of the first chip.

8. A medical module packaging method, characterized in that: include: providing a substrate having a first surface; Providing a first chip, wherein the first chip has a second surface and a third surface that are oppositely disposed, a first welding protrusion and a welding pad are formed on the third surface, and the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the first chip; Laminating the second surface of the first chip to the first surface of the substrate; Providing a PCB module, attaching the PCB module to the first surface of the substrate, and electrically connecting the pads of the first chip; Plastic-sealing the PCB module and the pads of the first chip; A second chip is provided. The second chip is disposed on the first chip and is electrically connected to the first welding protrusion of the first chip.

9. The medical module packaging method according to claim 8, characterized in that: The second chip is attached to a side of the first chip away from the substrate by using a low temperature bonding technology.

10. A medical module packaging structure, characterized in that: include: A substrate having a first surface; The first chip has a second surface and a third surface which are arranged opposite to each other, wherein the second surface is arranged in contact with the first surface of the substrate, and a pad is formed on the third surface; A PCB module is disposed on the first surface of the substrate and is electrically connected to the pads of the first chip; A plastic package body, formed on the first surface of the substrate and covering the PCB module and the pads of the first chip; Wherein, the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the first chip.

Images