Packaging structure and packaging method

Abstract

The invention discloses a packaging structure and a packaging method, and the method comprises the steps: providing a lead frame which comprises a plurality of unit regions, and comprises a frame front surface and a frame back surface which are opposite to each other; bonding a chip on the front surface of the frame in the unit area; in the unit area, a shell covering the chip is formed on the front face of the frame, and a cavity is defined by the shell and the lead frame. According to the invention, the overall stability and reliability of the packaging structure are improved, and the packaging cost is saved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of semiconductor packaging, and in particular to a packaging structure and a packaging method. Background Art

[0002] Semiconductor packaging technology includes many packaging forms. With the trend of miniaturization and thinning of chip packaging structure, the Quad Flat No-Pin Package (Quad Flat No-Pin Package) belonging to the flat package series has been developed. Leads Package (QFN). The size of the quad flat no-lead package can be greatly reduced because there are no pins extending outward, and it has a shorter signal transmission path and a relatively faster signal transmission speed. Therefore, the quad flat no-lead package is suitable for high-speed and high-frequency products with medium and low pin counts, and has become the mainstream packaging type. Summary of the invention

[0003] The problem solved by the embodiments of the present invention is to provide a packaging structure and a packaging method, which are beneficial to improving the overall stability and reliability of the packaging structure and saving packaging costs.

[0004] To solve the above problems, an embodiment of the present invention provides a packaging structure, including: a lead frame, including a frame front and a frame back facing each other; a chip bonded to the frame front of the lead frame; and a shell arranged on the frame front of the lead frame, the shell covers the chip and forms a cavity with the lead frame.

[0005] Optionally, the lead frame includes a base island for bonding the chip and pins for electrical connection, and the packaging structure also includes a partition layer running from the back side of the frame to the front side of the frame, and the partition layer divides the lead frame into a base island and multiple pins; the chip is mounted on the base island.

[0006] Optionally, the packaging structure further includes: a protective layer, wherein the protective layer covers the partition layer exposed on the front side of the frame.

[0007] Optionally, the protective layer is also located at an edge of the lead frame; and the outer shell is arranged on the protective layer at the edge of the lead frame.

[0008] Optionally, the chip includes a photosensitive chip; a through hole penetrating the shell is formed on the top of the shell, and the through hole exposes the photosensitive chip.

[0009] Optionally, the photosensitive chip includes one or more of an ambient light sensor chip and a proximity sensor chip.

[0010] Optionally, the packaging structure further includes: an adhesive layer located at an edge of the lead frame; and the housing is bonded to the adhesive layer.

[0011] Optionally, the material of the housing includes plastic.

[0012] Correspondingly, an embodiment of the present invention also provides a packaging method, including: providing a lead frame, including multiple unit areas, the lead frame including a frame front side and a frame back side facing each other; bonding a chip on the frame front side of the unit area; in the unit area, forming a shell covering the chip on the frame front side, the shell and the lead frame enclosing a cavity.

[0013] Optionally, in the unit area, after a shell covering the chip is formed on the front side of the frame, the method further includes: dividing the lead frame along the boundary between adjacent unit areas to form an independent packaging structure.

[0014] Optionally, in the step of providing a lead frame, a second groove is formed in the lead frame on the front side of the frame; after a shell covering the chip is formed on the front side of the frame and before the lead frame is divided, the step further includes: patterning the lead frame along the back side of the frame to form a first groove, the first groove being connected to the second groove, and the lead frame being divided into a base island for carrying the chip and pins for electrical connection by the first groove and the second groove; and forming a separation layer filling the first groove and the second groove.

[0015] Optionally, before bonding the chip to the front side of the frame in the unit area, it also includes: forming a first protective layer covering the second groove, the first protective layer sealing the second groove; patterning the lead frame along the back side of the frame, in the step of forming the first groove, patterning the lead frame along the back side of the frame until the first groove is connected to the second groove, exposing the first protective layer.

[0016] Optionally, the step of forming a first protective layer covering the second groove includes: forming a protective material layer covering the front side of the frame; patterning the protective material layer, removing the protective material layer not covering the second groove, and retaining the protective material layer covering the second groove as the first protective layer.

[0017] Optionally, in the step of forming a protective material layer covering the front side of the frame, the material of the protective material layer is a photosensitive material; before patterning the protective material layer, the step further includes: performing light treatment on the protective material layer not covering the second groove.

[0018] Optionally, the step of patterning the protective material layer includes: cutting the protective material layer to separate the protective material layer not covering the second groove from the remaining protective material layers; and sucking the protective material layer not covering the second groove to remove the protective material layer not covering the second groove.

[0019] Optionally, in the step of patterning the protective material layer, the protective material layer at the edge of the unit area is retained as the first protective layer; in the step of forming a shell covering the chip on the front side of the frame in the unit area, the shell is formed on the first protective layer at the edge of the unit area.

[0020] Optionally, in the step of bonding the chip to the front side of the frame in the unit area, the chip includes a photosensitive chip; in the step of forming a shell covering the chip on the front side of the frame in the unit area, a through hole is formed on the top of the shell and penetrates the shell, and the through hole exposes the photosensitive chip.

[0021] Optionally, before patterning the lead frame along the back side of the frame to form a first groove penetrating the lead frame, the method further includes: forming a second protective layer covering the top of the shell; and after segmenting the lead frame, the method further includes: removing the second protective layer.

[0022] Optionally, in the step of forming a second protective layer covering the top of the outer shell, the material of the second protective layer is a photosensitive material; the step of removing the second protective layer includes: performing light treatment on the second protective layer; forming an adhesive layer that covers and bonds the second protective layer to multiple unit areas; and removing the adhesive layer to remove multiple second protective layers together.

[0023] Optionally, after forming a separation layer that fills the first groove and the second groove, it also includes: forming a third protective layer covering the back side of the lead frame; in the step of segmenting the lead frame, using the third protective layer as the segmentation stop position to obtain multiple independent packaging structures separated on the third protective layer; after segmenting the lead frame, it also includes: removing the third protective layer.

[0024] Optionally, in the step of forming a third protective layer covering the back side of the lead frame, the material of the third protective layer is a photosensitive material; the step of removing the third protective layer includes: performing light treatment on the third protective layer; and separating the third protective layer from the independent packaging structure.

[0025] Optionally, in the unit area, the step of forming a shell covering the chip on the front side of the frame includes: spraying an adhesive layer on the front side of the frame at an edge position of the unit area; and bonding the shell to the position of the adhesive layer.

[0026] Compared with the prior art, the technical solution of the embodiment of the present invention has the following advantages:

[0027] In the packaging structure provided by the embodiment of the present invention, the lead frame includes a frame front side and a frame back side facing each other, the chip is bonded to the frame front side of the unit area, and the shell is arranged on the frame front side of the unit area, the shell covers the chip, and forms a cavity with the lead frame; in the embodiment of the present invention, the shell is used to package the chip bonded to the lead frame, which is beneficial to reducing the probability of warping in the packaging process, stratification of the packaging structure, and contamination of the packaging structure by the plastic film layer due to excessive film layers caused by packaging using a substrate plastic sealing method, thereby helping to improve the overall stability and reliability of the packaging structure, and further, the shell is used to package the chip bonded to the lead frame, and the shell and the lead frame form a cavity, which is beneficial to saving plastic sealing materials, thereby helping to save packaging costs.

[0028] In the packaging method provided in the embodiment of the present invention, a lead frame is provided, including multiple unit areas, the lead frame includes a frame front side and a frame back side opposite to each other, a chip is bonded to the frame front side of the unit area, and in the unit area, a shell covering the chip is formed on the frame front side, and the shell and the lead frame form a cavity; in the embodiment of the present invention, the chip bonded to the lead frame is packaged using the shell, which is beneficial to reducing the probability of warping in the packaging process, delamination of the packaging structure, and contamination of the packaging structure by the plastic film layer due to excessive film layers due to packaging using a substrate plastic sealing method, thereby helping to improve the overall stability and reliability of the packaging structure, and further, the chip bonded to the lead frame is packaged using the shell, and the shell and the lead frame form a cavity, which is beneficial to saving plastic sealing materials, thereby helping to save packaging costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a structural schematic diagram corresponding to an embodiment of a packaging structure of the present invention;

[0030] Figures 2 to 17 It is a schematic structural diagram corresponding to each step in an embodiment of a packaging method of the present invention. DETAILED DESCRIPTION

[0031] As can be seen from the background technology, currently, lead frames are usually packaged in a plastic packaging manner, which may easily lead to warping during the packaging process, delamination of the packaging structure, and contamination of the packaging structure by the plastic film layer, resulting in photosensitivity failure.

[0032] In order to solve the above technical problems, the present invention provides a packaging method, comprising: providing a lead frame, comprising a plurality of unit areas, the lead frame comprising a frame front side and a frame back side opposite to each other; bonding a chip on the frame front side of the unit area; in the unit area, forming a shell covering the chip on the frame front side, the shell and the lead frame enclosing a cavity.

[0033] In the embodiment of the present invention, a shell is used to encapsulate the chip bonded to the lead frame, which is beneficial to reducing the probability of warping in the packaging process, stratification of the packaging structure, and contamination of the packaging structure by the plastic film layer due to excessive film layers caused by encapsulation using a substrate plastic encapsulation method, thereby helping to improve the overall stability and reliability of the packaging structure. Moreover, the chip bonded to the lead frame is encapsulated using a shell, and the shell and the lead frame form a cavity, which is beneficial to saving plastic encapsulation materials, thereby helping to save packaging costs.

[0034] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present invention more obvious and understandable, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0035] Figure 1It is a structural schematic diagram corresponding to an embodiment of the packaging structure of the present invention.

[0036] refer to Figure 1 The packaging structure includes: a lead frame 100, including a frame front side 101 and a frame back side 102 facing each other; a chip 400, bonded to the frame front side 101 of the lead frame 100; and a shell 500, arranged on the frame front side 101 of the lead frame 100, the shell 500 covers the chip 400, and forms a cavity with the lead frame 100.

[0037] The lead frame 100 is used to realize electrical connection between the chip 400 bonded to the lead frame 100 and the outside.

[0038] In this embodiment, the lead frame 100 includes a frame front side 101 and a frame back side 102 which are opposite to each other.

[0039] The front side 101 of the frame is used as a bearing surface for placing the chip 400 , and the back side 102 of the frame is used for electrical connection with the outside.

[0040] In this embodiment, the material of the lead frame 100 includes metal materials such as copper, copper alloy or nickel-iron alloy.

[0041] In this embodiment, the lead frame 100 includes a base island 150 for bonding the chip and pins 110 for electrical connection. The packaging structure also includes a partition layer 120 extending from the back side 102 of the frame to the front side 101 of the frame. The partition layer 120 divides the lead frame 100 into the base island 150 and multiple pins 110.

[0042] The base island 150 is used to carry the chip 400 , and the pins 110 are used to electrically connect to the chip 400 , so that the chip 400 can be electrically connected to an external circuit structure through the pins 110 , thereby enabling the chip 400 to have an input / output port.

[0043] In other embodiments, the chip can be directly mounted on the front side of the pins, and the separation layer 120 is used to isolate the plurality of pins 110. In this embodiment, the separation layer 120 is used to isolate the base island 150 and the plurality of pins 110.

[0044] In this embodiment, the material of the separation layer 120 includes ink.

[0045] The chip 400 is used to achieve the performance requirements of the package structure. Specifically, the chip 400 with different functions can be selected according to the performance requirements of the package structure.

[0046] Accordingly, in this embodiment, the chip 400 is mounted on the base island 150 .

[0047] In this embodiment, the chip 400 includes a photosensor chip.

[0048] Specifically, in this embodiment, the photosensitive chip includes one or more of an ambient light sensor chip and a proximity sensor chip.

[0049] Ambient light sensors are used to sense ambient light signals and adjust display brightness. They are widely used in mobile electronic devices (such as mobile phones, PCs, tablets), car screens, etc. Proximity sensors are used to measure the presence or absence of reflective objects and the distance to the reflective objects through infrared light. Currently, ambient light sensors and proximity sensors are usually integrated into a single device.

[0050] The housing 500 is used to protect the chip 400 so as to package the lead frame 100 and the chip 400 .

[0051] In this embodiment, the chip 400 bonded to the lead frame 100 is encapsulated using a shell 500, which is beneficial to reducing the probability of warping in the packaging process, stratification of the packaging structure, and contamination of the packaging structure by the plastic film layer due to excessive film layers caused by the use of substrate plastic packaging, thereby helping to improve the overall stability and reliability of the packaging structure. Moreover, the chip bonded to the lead frame 100 is encapsulated using the shell 500, and the shell 500 and the lead frame 100 form a cavity, which is beneficial to saving plastic packaging materials, thereby helping to save packaging costs.

[0052] In this embodiment, a through hole 510 penetrating the housing 500 is formed on the top of the housing 500 , and the through hole 510 exposes the photosensitive chip.

[0053] The through hole 510 is used to allow light to pass through and illuminate the photosensitive area of ​​the photosensitive chip to achieve the normal function of the photosensitive chip.

[0054] In this embodiment, the material of the housing 500 includes plastic.

[0055] The shell 500 is made of plastic, so that the shell 500 is light in weight, which is beneficial to making the overall weight of the packaging structure lighter.

[0056] In this embodiment, the packaging structure further includes: a protective layer 210 , and the protective layer 210 at least covers the separation layer 120 exposed on the frame front side 101 .

[0057] The protective layer 210 is used to protect the frame front side 101 when the separation layer 120 is formed from the frame back side 102, thereby reducing the damage to the chip 400 on the frame front side 101 caused by the step of forming the separation layer 120, and reducing the contamination of the frame front side 101 caused by the step of forming the separation layer 120.

[0058] In this embodiment, the protective layer 210 is a photosensitive protective film, which is a thin film coated with a photosensitive material, usually made of a polymer material, and with specific photosensitive components added. These photosensitive components enable the photosensitive protective film to undergo a chemical reaction when exposed to light, thereby changing certain properties of the photosensitive protective film, such as color, transparency or viscosity. In this embodiment, the viscosity of the protective layer 210 decreases when exposed to light, so that it can be easily removed after exposure to light. At the same time, the photosensitive protective film also retains the basic characteristics of ordinary protective films, such as high transparency, high temperature resistance, wear resistance and chemical resistance, and is used to protect the front surface 101 of the frame from scratches, pollution, corrosion and other damage.

[0059] Specifically, in this embodiment, the protective layer 210 is a UV protective film with high adhesiveness.

[0060] In this embodiment, the protection layer 210 is also located at the edge of the lead frame 100 .

[0061] In other embodiments, no protection layer may be formed at the edge of the lead frame.

[0062] Accordingly, in this embodiment, the housing 500 is disposed on the protection layer 210 at the edge of the lead frame 100 .

[0063] In other embodiments, no protective layer is formed at the edge of the lead frame, and accordingly, the housing is directly disposed on the edge of the lead frame.

[0064] In this embodiment, the packaging structure further includes: an adhesive layer 300 located at the edge of the lead frame 100 .

[0065] The adhesive layer 300 is used to fix the housing 500 on the lead frame 100 .

[0066] In this embodiment, the adhesive layer 300 is adhesive glue.

[0067] Specifically, in this embodiment, the adhesive layer 300 is located on the protection layer 210 at the edge of the lead frame 100 .

[0068] In other embodiments, the adhesive layer may also be directly located on the edge of the lead frame. The lead frame is made of metal material with a high surface roughness, which is beneficial to increasing the adhesion between the adhesive layer and the lead frame, thereby improving the firmness of the shell packaging.

[0069] Correspondingly, in this embodiment, the housing 500 is bonded to the bonding layer 300 .

[0070] Figures 2 to 17 It is a schematic structural diagram corresponding to each step in an embodiment of a packaging method of the present invention.

[0071] refer to Figure 2 A lead frame 100 is provided, comprising a plurality of unit regions 100 a , wherein the lead frame 100 comprises a frame front side 101 and a frame back side 102 which are opposite to each other.

[0072] The lead frame 100 is used to realize electrical connection between the chip bonded to the lead frame 100 and the outside.

[0073] The unit area 100 a is used as a region for obtaining an independent packaging structure after the lead frame 100 is subsequently divided.

[0074] In this embodiment, the lead frame 100 includes a frame front side 101 and a frame back side 102 which are opposite to each other.

[0075] The front side 101 of the frame is used as a bearing surface for placing the chip, and the back side 102 of the frame is used for electrical connection with the outside.

[0076] In this embodiment, the material of the lead frame 100 includes metal materials such as copper, copper alloy or nickel-iron alloy.

[0077] In this embodiment, in the step of providing the lead frame 100 , a second groove 140 located on the front side 101 of the lead frame is formed in the lead frame 100 .

[0078] The second grooves 140 are used for preliminary patterning to form circuits on the front side 101 of the frame.

[0079] Combined with reference Figures 3 to 6 , before bonding the chip to the frame front side 101 of the unit area 100 a , the method further includes: forming a first protection layer 210 covering the second groove 140 , and the first protection layer 210 seals the second groove 140 .

[0080] The first protective layer 210 is used to protect the frame front side 101 when the lead frame 100 is subsequently etched from the frame back side 102, thereby reducing damage to the chip on the frame front side 101 caused by the step of etching the lead frame 100 from the frame back side 102, and reducing contamination to the frame front side 101 caused by the step of etching the lead frame 100 from the frame back side 102.

[0081] The first protective layer 210 seals the second groove 140 to prevent the subsequent process from affecting the second groove 140 , and is also beneficial for reducing the pollution and impact of the etching process on the frame front side 101 when etching through the second groove 140 from the frame back side 102 .

[0082] Specifically, refer to Figure 3The step of forming a first protection layer 210 covering the second groove 140 includes: forming a protection material layer 200 covering the frame front side 101 .

[0083] The protective material layer 200 is used to form a first protective layer 210 .

[0084] In this embodiment, in the step of forming the protective material layer 200 covering the frame front surface 101 , the material of the protective material layer 200 is a photosensitive material.

[0085] The material of the protective material layer 200 is a photosensitive material, which is usually made of a polymer material and has specific photosensitive components added. These photosensitive components enable the protective material layer 200 to undergo a chemical reaction when exposed to light, thereby changing certain properties of the protective material layer 200, such as color, transparency or viscosity. In this embodiment, the viscosity of the protective material layer 200 decreases when exposed to light, so that it can be easily removed after exposure to light. At the same time, the photosensitive material also retains the basic characteristics of ordinary protective films, such as high transparency, high temperature resistance, wear resistance and chemical resistance, and is used to protect the front surface 101 of the frame from scratches, pollution, corrosion and other damage.

[0086] refer to Figure 4 Before subsequently patterning the protective material layer 200 , the method further includes: performing light treatment on the protective material layer 200 that does not cover the second groove 140 .

[0087] The portion of the protective material layer 200 that does not cover the second groove 140 is subjected to light treatment to reduce the viscosity of this portion of the protective material layer 200 , so that this portion of the protective material layer 200 can be easily removed later.

[0088] Specifically, in this embodiment, a mask plate covering the protective material layer 200 is formed, the mask plate exposes the protective material layer 200 not covering the second groove 140 , and the mask plate is used as a light irradiation mask to perform light irradiation treatment on the protective material layer 200 .

[0089] Combined with reference Figure 5 and Figure 6 , patterning the protection material layer 200 , removing the protection material layer 200 not covering the second trench 140 , and retaining the protection material layer 200 covering the second trench 140 as the first protection layer 210 .

[0090] The protective material layer 200 not covering the second trench 140 is removed to prepare for subsequent chip bonding.

[0091] Accordingly, in this embodiment, the first protective layer 210 is a photosensitive protective film.

[0092] Specifically, in this embodiment, the first protective layer 210 is a UV protective film with high adhesiveness.

[0093] In this embodiment, in the step of patterning the protective material layer 200 , the protective material layer 200 at the edge of the unit area 100 a is also retained as the first protective layer 210 .

[0094] In other embodiments, the protective material layer at the edge of the unit area may be removed, that is, the first protective layer may not be formed at the edge of the unit area.

[0095] Specifically, refer to Figure 5 The step of patterning the protective material layer 200 includes: cutting the protective material layer 200 to separate the protective material layer 200 that does not cover the second groove 140 from the rest of the protective material layer 200 .

[0096] The protective material layer 200 not covering the second trench 140 is separated from the remaining protective material layers 200 to prepare for the subsequent removal of the protective material layer 200 not covering the second trench 140 .

[0097] In this embodiment, a blade is used to cut the protective material layer 200 to separate the protective material layer 200 that does not cover the second groove 140 from the rest of the protective material layer 200 .

[0098] refer to Figure 6 , the protection material layer 200 not covering the second trench 140 is sucked to remove the protection material layer 200 not covering the second trench 140 .

[0099] The protective material layer 200 not covering the second groove 140 is sucked to expose the frame front side 101 in preparation for subsequent chip bonding.

[0100] In this embodiment, a suction nozzle is used to suck the protective material layer 200 that does not cover the second groove 140 , so as to remove the protective material layer 200 that does not cover the second groove 140 .

[0101] In this embodiment, the process further includes: removing the mask plate covering the protective material layer 200 .

[0102] Combined with reference Figure 7 and Figure 8 , the chip 400 is bonded to the frame front side 101 of the unit area 100a.

[0103] The chip 400 is used to achieve the performance requirements of the package structure. Specifically, the chip 400 with different functions can be selected according to the performance requirements of the package structure.

[0104] Accordingly, in this embodiment, in the step of bonding the chip 400 to the frame front side 101 of the unit area 100 a , the chip 400 is bonded to the frame front side 101 exposed by the first protection layer 210 .

[0105] In this embodiment, in the step of bonding the chip 400 to the frame front side 101 of the unit area 100 a , the chip 400 includes a photosensitive chip.

[0106] Specifically, in this embodiment, the photosensitive chip includes one or more of an ambient light sensor chip and a proximity sensor chip.

[0107] Ambient light sensors are used to sense ambient light signals and adjust display brightness. They are widely used in mobile electronic devices (such as mobile phones, PCs, tablets), car screens, etc. Proximity sensors are used to measure the presence or absence of reflective objects and the distance to the reflective objects through infrared light. Currently, ambient light sensors and proximity sensors are usually integrated into a single device.

[0108] Specifically, in this embodiment, Figure 7 As shown, the chip 400 can be bonded to the frame front surface 101 exposed by the first protective layer 210 by using a dispensing process, such as Figure 8 As shown, a flip chip process may also be used to bond the chip 400 to the frame front surface 101 exposed by the first protection layer 210 .

[0109] refer to Fig. 9 In the unit area 100 a , a housing 500 covering the chip 400 is formed on the front side 101 of the frame, and the housing 500 and the lead frame 100 form a cavity.

[0110] The housing 500 is used to protect the chip 400 so as to package the lead frame 100 and the chip 400 .

[0111] In this embodiment, the chip 400 bonded to the lead frame 100 is encapsulated using a shell 500, which is beneficial to reducing the probability of warping in the packaging process, stratification of the packaging structure, and contamination of the packaging structure by the plastic film layer due to excessive film layers caused by the use of substrate plastic packaging, thereby helping to improve the overall stability and reliability of the packaging structure. Moreover, the chip bonded to the lead frame 100 is encapsulated using the shell 500, and the shell 500 and the lead frame 100 form a cavity, which is beneficial to saving plastic packaging materials, thereby helping to save packaging costs.

[0112] In this embodiment, in the unit area 100a, in the step of forming a housing 500 covering the chip 400 on the frame front side 101, a through hole 510 penetrating the housing 500 is formed on the top of the housing 500, and the through hole 510 exposes the photosensitive chip.

[0113] The through hole 510 is used to allow light to pass through and illuminate the photosensitive chip to achieve the normal function of the photosensitive chip.

[0114] Accordingly, in this embodiment, in the step of forming the housing 500 covering the chip 400 on the frame front side 101 in the unit area 100 a , the housing 500 is formed on the first protection layer 210 at the edge of the unit area 100 a .

[0115] In other embodiments, the first protection layer may not be formed at the edge of the unit area. In this case, in the step of forming a shell covering the chip on the front of the frame in the unit area, the shell is directly formed on the front of the frame at the edge of the unit area.

[0116] In this embodiment, in the step of forming the housing 500 covering the chip 400 on the frame front side 101 in the unit area 100 a , the material of the housing 500 includes plastic.

[0117] The shell 500 is made of plastic, so that the shell 500 is light in weight, which is beneficial to making the overall weight of the packaging structure lighter.

[0118] Specifically, in this embodiment, in the unit area 100 a , the step of forming the housing 500 covering the chip 400 on the frame front side 101 includes: spraying the adhesive layer 300 on the frame front side 101 at the edge of the unit area 100 a .

[0119] The adhesive layer 300 is used to fix the housing 500 on the lead frame 100 .

[0120] In this embodiment, in the step of spraying the adhesive layer 300 on the frame front surface 101 at the edge position of the unit area 100a, the adhesive layer 300 is an adhesive glue.

[0121] Specifically, in this embodiment, in the step of spraying the adhesive layer 300 on the frame front surface 101 at the edge of the unit area 100 a , the adhesive layer 300 is located on the protective layer 210 at the edge of the lead frame 100 .

[0122] In other embodiments, in the step of spraying the adhesive layer on the front side of the frame at the edge of the unit area, the adhesive layer can also be directly located on the edge of the lead frame. The lead frame is made of metal material with a high surface roughness, which is beneficial to increase the adhesion between the adhesive layer and the lead frame, thereby helping to improve the firmness of the shell packaging.

[0123] Accordingly, in this embodiment, the housing 500 is bonded to the position of the bonding layer 300 .

[0124] refer to Fig.10 Subsequently, the lead frame 100 is patterned along the back side 102 of the frame to form a first groove penetrating the lead frame 100 , and the method further includes: forming a second protective layer 220 covering the top of the housing 500 .

[0125] The second protective layer 220 is used to protect the top of the housing 500 and to seal the through hole 510, so as to prevent the components in the housing 500 from being polluted or damaged by chemicals, dust, etc. during the subsequent etching process.

[0126] In this embodiment, in the step of forming the second protective layer 220 covering the top of the housing 500 , the material of the second protective layer 220 is a photosensitive material.

[0127] The photosensitive material is usually made of a polymer material and has specific photosensitive components added thereto. These photosensitive components enable the second protective layer 220 to undergo a chemical reaction when exposed to light, thereby changing certain properties thereof, such as color, transparency or viscosity. In this embodiment, the viscosity of the second protective layer 220 decreases when exposed to light, so that it can be easily removed after exposure to light.

[0128] Specifically, in this embodiment, the second protective layer 220 is a UV protective film.

[0129] refer to Fig.11 After forming a shell 500 covering the chip 400 on the front side 101 of the frame, before subsequently dividing the lead frame 100, it also includes: patterning the lead frame 100 along the back side 102 of the frame to form a first groove 130, and dividing the lead frame 100 into a base island 150 for carrying the chip 400 and a plurality of pins 110 for electrical connection by the first groove 130 and the second groove 140.

[0130] The first grooves 130 are used for patterning circuits on the back side 102 of the frame.

[0131] The base island 150 is used to carry the chip 400 , and the pins 110 are used to electrically connect to the chip 400 , so that the chip 400 can be electrically connected to an external circuit structure through the pins 110 , thereby enabling the chip 400 to have an input / output port.

[0132] In this embodiment, in the step of patterning the lead frame 100 along the frame back side 102 to form the first groove 130 , etching is performed along the frame back side 102 until the first groove 130 is connected to the second groove 140 , exposing the first protection layer 210 .

[0133] The first groove 130 is connected to the second groove 140 to achieve normal circuit functions of the frame front side 101 and the frame back side 102 .

[0134] The lead frame 100 is patterned along the back side 102 of the frame until the first protective layer 210 is exposed to form a first groove 130. The first protective layer 210 can seal the gap between adjacent pins 110 during the process of patterning the lead frame 100 to form the first groove 130, thereby reducing the impact of the patterning lead frame 100 process on the components in the housing 500.

[0135] refer to Fig.12 , forming a separation layer 120 filling the first trench 130 and the second trench 140 .

[0136] The separation layer 120 is used to isolate the base island 150 and the pins 110 .

[0137] In this embodiment, in the step of forming the separation layer 120 filling the first trench 130 and the second trench 140 , the material of the separation layer 120 includes ink.

[0138] refer to Fig.13 After forming the separation layer 120 filling the first groove 130 and the second groove 140 , the method further includes: forming a third protection layer 230 covering the frame back side 102 of the lead frame 100 .

[0139] The third protective layer 230 is used to protect the back side 102 of the frame so that the back side 102 of the frame will not be polluted or damaged by chemicals, dust, etc. in subsequent processes. The third protective layer 230 is also used to support the packaging structure during the subsequent segmentation process of the lead frame 100.

[0140] Specifically, in the present embodiment, in the step of forming the third protective layer 230 covering the back side 102 of the lead frame 100, the third protective layer 230 covers the pins 110 and the partition layer 120 exposed on the back side 102 of the frame, so as to protect the pins 110 and the partition layer 120 from being contaminated or damaged by chemicals, dust, etc. in subsequent processes.

[0141] In this embodiment, in the step of forming the third protection layer 230 covering the frame back side 102 of the lead frame 100 , the material of the third protection layer 230 is a photosensitive material.

[0142] The photosensitive material is usually made of a polymer material and has specific photosensitive components added thereto. These photosensitive components enable the third protective layer 230 to undergo a chemical reaction when exposed to light, thereby changing certain properties thereof, such as color, transparency or viscosity. In this embodiment, the viscosity of the third protective layer 230 decreases when exposed to light, so that the third protective layer 230 can be easily removed after exposure to light.

[0143] Specifically, in this embodiment, the third protective layer 230 is a UV protective film.

[0144] refer to Fig.14 In the unit area 100a, after forming a housing 500 covering the chip 400 on the front side 101 of the frame, the method further includes: dividing the lead frame 100 along the boundary between adjacent unit areas 100a to form an independent packaging structure.

[0145] The lead frame 100 is divided along the boundary between adjacent unit areas 100 a to form an independent packaging structure, so that the packaging structure of each unit area 100 a is separated, which is convenient for attaching the packaging structure to the circuit board later.

[0146] In this embodiment, a laser cutting process is used to separate the lead frame 100 along the boundary between adjacent unit areas 100 a to form an independent packaging structure.

[0147] In other embodiments, a dry etching process may be used to segment the lead frame along the boundary between adjacent unit regions to form an independent package structure. In other embodiments, a blade may be used to segment the lead frame along the boundary between adjacent unit regions to form an independent package structure.

[0148] In this embodiment, in the step of dividing the lead frame 100 , the third protective layer 230 is used as a dividing stop position to obtain a plurality of independent packaging structures separated on the third protective layer 230 .

[0149] That is, in this embodiment, the lead frame 100 is cut and stays on the third protective layer 230 , so that the third protective layer 230 is kept carrying a plurality of independent packaging structures.

[0150] Combined with reference Fig.15 and Fig.16 After the lead frame 100 is divided, the method further includes: removing the second protective layer 220 .

[0151] The second protective layer 220 is removed to prepare for final product packaging.

[0152] Specifically, refer to Fig.15 The step of removing the second protective layer 220 includes: performing light treatment on the second protective layer 220 .

[0153] The second protective layer 220 is subjected to light treatment to reduce the adhesion between the second protective layer 220 and the housing 500, so that the second protective layer 220 is easy to remove.

[0154] Continue to refer Fig.15, an adhesive layer 240 is formed to cover and bond the second protective layer 220 of the plurality of unit regions 100 a.

[0155] The adhesive layer 240 is used to adhere the second protection layers 220 of the plurality of unit regions 100 a , so that the second protection layers 220 of the plurality of unit regions 100 a are removed together.

[0156] In the present embodiment, in the step of forming the adhesion layer 240 that covers and adheres the second protection layer 220 to the plurality of unit regions 100 a , the material of the adhesion layer 240 is a photosensitive material.

[0157] The photosensitive material is usually made of a polymer material and has specific photosensitive components added thereto. These photosensitive components enable the adhesive layer 240 to undergo a chemical reaction when exposed to light, thereby changing certain properties thereof, such as color, transparency or viscosity. In this embodiment, the adhesive layer 240 has a reduced viscosity when exposed to light, so that it can be easily removed after exposure to light.

[0158] Specifically, in this embodiment, the adhesive layer 240 is a UV protective film.

[0159] refer to Fig.16 , remove the adhesive layer 240 to remove the plurality of second protection layers 220 together.

[0160] The adhesive layer 240 is removed. At this time, the adhesion between the adhesive layer 240 and the second protective layer 220 is relatively large, while the adhesion between the second protective layer 220 and the shell 500 is relatively small. Therefore, when removing the adhesive layer 240, multiple second protective layers 220 can be removed together, which is beneficial to improving packaging efficiency.

[0161] refer to Fig.17 After the lead frame 100 is divided, the method further includes: removing the third protective layer 230 .

[0162] The third protective layer 230 is removed to prepare for final product packaging.

[0163] In this embodiment, the step of removing the third protective layer 230 includes: performing light treatment on the third protective layer 230 .

[0164] The third protective layer 230 is subjected to light treatment to reduce the adhesion between the third protective layer 230 and the back surface 102 of the frame, so that the third protective layer 230 is easy to remove.

[0165] In this embodiment, the third protection layer 230 is separated from the independent packaging structure.

[0166] The adhesion between the third protection layer 230 and the frame back surface 102 is reduced, so that the third protection layer 230 is easily separated from the independent packaging structure.

[0167] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A packaging structure, characterized in that: include: A lead frame, comprising a front side of the frame and a back side of the frame facing each other; A chip bonded to the front side of the lead frame; The shell is arranged on the front side of the lead frame, covers the chip, and forms a cavity with the lead frame.

2. The packaging structure according to claim 1, characterized in that: The lead frame includes a base island for bonding a chip and pins for electrical connection, and the packaging structure also includes a partition layer extending from the back of the frame to the front of the frame, wherein the partition layer divides the lead frame into the base island and a plurality of pins; The chip is mounted on the base island.

3. The packaging structure according to claim 2, characterized in that: The packaging structure further includes a protective layer, wherein the protective layer at least covers the partition layer exposed on the front side of the frame.

4. The packaging structure according to claim 3, characterized in that: The protective layer is also located at the edge of the lead frame; The shell is arranged on the protection layer at the edge position of the lead frame.

5. The packaging structure according to claim 1, characterized in that: The chip includes a photosensitive chip; A through hole penetrating the shell is formed on the top of the shell, and the through hole exposes the photosensitive chip.

6. The packaging structure according to claim 5, characterized in that: The photosensitive chip includes one or more of an ambient light sensor chip and a proximity sensor chip.

7. The packaging structure according to claim 1, characterized in that: The packaging structure further includes: a bonding layer located at an edge of the lead frame; The housing is bonded to the bonding layer.

8. The packaging structure according to claim 1, characterized in that: The material of the housing includes plastic.

9. A packaging method, characterized in that: include: Providing a lead frame, comprising a plurality of unit areas, wherein the lead frame comprises a frame front side and a frame back side facing each other; Bonding a chip on the front side of the frame of the unit area; In the unit area, a shell covering the chip is formed on the front side of the frame, and the shell and the lead frame form a cavity.

10. The packaging method according to claim 9, characterized in that: In the unit area, after a shell covering the chip is formed on the front of the frame, the method further includes: dividing the lead frame along the junctions of adjacent unit areas to form an independent packaging structure.

11. The packaging method according to claim 10, characterized in that: In the step of providing the lead frame, a second groove located on the front side of the frame is formed in the lead frame; After forming a shell covering the chip on the front side of the frame and before dividing the lead frame, the method further includes: patterning the lead frame along the back side of the frame to form a first groove, wherein the first groove is connected to the second groove, and the first groove and the second groove divide the lead frame into a base island for carrying the chip and a plurality of pins for electrical connection; A separation layer filling the first trench and the second trench is formed.

12. The packaging method according to claim 11, characterized in that: Before bonding the chip on the front side of the frame of the unit area, the method further includes: forming a first protective layer covering the second groove, wherein the first protective layer seals the second groove; In the step of bonding the chip on the front side of the frame of the unit area, the chip is bonded on the front side of the frame where the first protective layer is exposed; In the step of patterning the lead frame along the back side of the frame to form the first groove, the lead frame is patterned along the back side of the frame until the first groove is connected to the second groove, exposing the first protection layer.

13. The packaging method according to claim 12, characterized in that: The step of forming a first protective layer covering the second groove includes: forming a protective material layer covering the front surface of the frame; The protective material layer is patterned, the protective material layer not covering the second groove is removed, and the protective material layer covering the second groove is retained as the first protective layer.

14. The packaging method according to claim 13, characterized in that: In the step of forming a protective material layer covering the front surface of the frame, the material of the protective material layer is a photosensitive material; Before patterning the protective material layer, the method further includes: performing light treatment on the protective material layer not covering the second groove.

15. The packaging method according to claim 14, characterized in that: The step of patterning the protective material layer includes: cutting the protective material layer to separate the protective material layer not covering the second groove from the remaining protective material layer; The protective material layer not covering the second trench is sucked to remove the protective material layer not covering the second trench.

16. The packaging method according to claim 13, characterized in that: In the step of patterning the protective material layer, the protective material layer at the edge of the unit area is also retained as the first protective layer; In the step of forming a shell covering the chip on the front side of the frame in the unit area, the shell is formed on the first protection layer at the edge position of the unit area.

17. The packaging method according to claim 11, characterized in that: In the step of bonding a chip on the front side of the frame of the unit area, the chip includes a photosensitive chip; In the unit area, in the step of forming a shell covering the chip on the front side of the frame, a through hole penetrating the shell is formed on the top of the shell, and the through hole exposes the photosensitive chip.

18. The packaging method according to claim 17, characterized in that: Before patterning the lead frame along the back side of the frame to form a first groove penetrating the lead frame, the method further includes: forming a second protective layer covering the top of the housing; After the lead frame is divided, the method further includes: removing the second protective layer.

19. The packaging method according to claim 18, characterized in that: In the step of forming a second protective layer covering the top of the housing, the material of the second protective layer is a photosensitive material; The step of removing the second protective layer includes: performing light treatment on the second protective layer; forming an adhesive layer covering and bonding the second protective layer of the plurality of unit regions; The adhesive layer is removed to remove the plurality of second protection layers together.

20. The packaging method according to claim 11, characterized in that: After forming the separation layer filling the first groove, the method further includes: forming a third protection layer covering the back side of the lead frame; In the step of dividing the lead frame, the third protective layer is used as a dividing stop position to obtain a plurality of independent packaging structures separated on the third protective layer; After the lead frame is divided, the method further includes: removing the third protective layer.

21. The packaging method according to claim 20, characterized in that: In the step of forming a third protective layer covering the back side of the lead frame, the material of the third protective layer is a photosensitive material; The step of removing the third protective layer includes: performing light treatment on the third protective layer; The third protection layer is separated from the independent packaging structure.

22. The packaging method according to claim 9, characterized in that: In the unit area, the step of forming a shell covering the chip on the front of the frame includes: spraying an adhesive layer on the front of the frame at the edge of the unit area; The housing is bonded at the location of the bonding layer.

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