Endoscope head end with uniform light spots and processing method thereof

Abstract

The invention relates to the technical field of medical equipment, and discloses an endoscope head end with uniform light spots, the endoscope head end comprises a head end base, and a camera chip module, an LED light source, a PCB and a module line which are arranged in the head end base, the head end base is provided with an imaging channel and an instrument channel, the head end base is transparent, and the camera chip module, the LED light source, the PCB and the module line are arranged in the head end base. Light diffusion powder is dispersed in the head end base, the camera chip module, the LED light source, the PCB and the module line are integrally formed, and the camera chip module is located in the imaging channel. When the head end base is subjected to injection molding processing, the light diffusion powder is added into the raw materials, so that light emitted by the LED light source is fully diffused when passing through the head end base, the purpose of uniform light spots is achieved, and compared with the mode that the light spots are uniform by heightening an LED lamp, the process is simple, the efficiency is high, and the effect is good.

Description

Technical Field

[0001] The present invention relates to the technical field of medical equipment, and in particular to an endoscope head end with uniform light spot and a processing method thereof. Background Art

[0002] Electronic endoscopes have a wide range of applications in medicine, such as electronic gastroscopes, electronic colonoscopes, electronic bronchoscopes, etc. It is a medical electronic optical instrument that can be inserted into the human body cavity or organs for direct observation, diagnosis, and treatment, integrating optical, mechanical, and electrical technologies.

[0003] Electronic endoscopes use small-sized CCD or CMOS sensors. The intracavitary tissue to be observed is imaged onto the CCD or CMOS sensor through an optical system, and then the received image signal is sent to the image processing system through connecting wires, and finally the processed image is output on the monitor for doctors to observe, diagnose and treat. It can be seen that the quality of the final output image is very important, and the uniformity of the illumination spot at the end of the electronic endoscope is one of the important factors affecting the image quality.

[0004] Most existing electronic endoscopes use LED lights for illumination and fill light, but this method is prone to uneven light spots. The main reason is the limitations of the head end seat, the relative position of the LED light and the camera chip module, and the height difference, which causes part of the LED light to be blocked by the camera chip module, resulting in uneven light spots. Some manufacturers will use a very small PCB to raise the LED to reduce occlusion and achieve uniform light spots. However, since the LED lamp is small, it is very difficult to raise it, and the production efficiency and yield are low. Even if it is raised, the light spot cannot be completely uniform.

[0005] In addition, most of the existing endoscopes directly weld wires to the camera chip module, and then use the reserved 2 or 4 lamp wires to weld the LED lamp, and then fix them with glue. The LED lamp and the camera chip module are relatively independent (and the LED is floating on both sides of the camera module). This method is more complicated. The camera chip module and the LED lamp are relatively small and difficult to weld. In addition, the LED lamp is in a suspended state, which is difficult to fix and weld. Moreover, the LED lamp and the camera chip module are independent, and the LED lamp and the camera module need to be installed separately. This requires the head end space to be large enough to complete the assembly, and the process is relatively complicated, which is prone to wire breakage and poor assembly. Since the LED lamp and the camera chip module are assembled separately, there needs to be a height difference, so the LED lamp line is relatively long, which affects the subsequent assembly of other structural parts and causes functional problems. Summary of the invention

[0006] The object of the present invention is to provide an endoscope head end with uniform light spot and a processing method thereof, so as to solve the technical problems in the prior art.

[0007] In order to achieve the above-mentioned objectives, on the one hand, the present invention provides an endoscope head with a uniform light spot, comprising a head end base and a camera chip module, an LED light source, a PCB board and a module line arranged in the head end base, the head end base is provided with an imaging channel and an instrument channel, the head end base is transparent, and light diffusion powder is dispersed in the head end base, the camera chip module, the LED light source, the PCB board and the module line are integrally formed, and the camera chip module is located in the imaging channel.

[0008] Preferably, the camera chip module and the LED light source are mounted on the top surface of the PCB board through SMT.

[0009] Preferably, the module line is welded to the bottom surface of the PCB board.

[0010] Preferably, the camera chip module, the LED light source, the PCB board and the module line are packaged in the head end base by glue potting.

[0011] Preferably, two LED light sources are provided, and the two LED light sources are symmetrically arranged on both sides of the camera chip module.

[0012] Preferably, the center line of the camera chip module is colinear with the center line of the imaging channel.

[0013] Preferably, a card slot adapted to the PCB board is provided in the head end base.

[0014] On the other hand, the present invention provides a method for processing an endoscope head end with a uniform light spot, comprising the following steps:

[0015] The transparent injection molding material and the light diffusion powder are mixed and stirred evenly, and the head end base is manufactured by injection molding;

[0016] Mount the camera chip module and the LED light source on the top surface of the PCB board through SMT;

[0017] Soldering the module wire to the bottom surface of the PCB board;

[0018] The PCB board equipped with the camera chip module, the LED light source and the module line is installed into the head end base, and then sealed and fixed by glue injection.

[0019] Preferably, the content of the light diffusion powder is 5-10wt%.

[0020] The beneficial effects of the present invention are:

[0021] (1) During the injection molding process of the head end base, light diffusion powder is added to the raw material so that the light emitted by the LED light source is fully diffused when passing through the head end base, thereby achieving the purpose of uniform light spot. Compared with achieving uniform light spot by raising the LED lamp, the process is simple, the efficiency is high, and the effect is better.

[0022] (2) The camera chip module, LED light source and PCB board are integrated into one piece, which is more convenient to install into the head end than direct wire welding, with simple process and good reliability and consistency. Compared with the decentralized type, it saves more space, the light line is shorter, and the outer diameter of the head end base can be made smaller, which makes the experience of entering the human body more comfortable. It is also more convenient to assemble, reduces the defective rate, and does not affect the assembly of other structural parts.

[0023] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0025] Figure 1 A schematic diagram showing the structure of an endoscope head end with a uniform light spot according to an embodiment of the present invention;

[0026] Figure 2 An exploded view of an endoscope head end with a uniform light spot according to an embodiment of the present invention is shown;

[0027] Figure 3 A schematic diagram of the internal structure of a head end base according to an embodiment of the present invention is shown (without a PCB board);

[0028] Figure 4 A schematic diagram of the internal structure of a head end base according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0029] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0030] Example 1

[0031] Please refer to Figure 1-Figure 4The present embodiment discloses an endoscope head with uniform light spot, comprising a head end base 1 and a camera chip module 2, an LED light source 3, a PCB board 4 and a module line 5 arranged in the head end base 1, an imaging channel 11 and an instrument channel 12 are arranged on the head end base 1, the head end base 1 is transparent, and light diffusion powder is dispersed in the head end base 1, the camera chip module 2, the LED light source 3, the PCB board 4 and the module line 5 are integrally formed, and the camera chip module 2 is located in the imaging channel 11.

[0032] In this embodiment, since the head end base 1 is transparent, the light emitted by the LED light source 3 can be emitted from the transparent base to illuminate the lesion, and the light will be further dispersed after passing through the light diffusion powder, which improves the uniformity of the light spot and the image quality, so that the doctor can better operate or judge the patient's condition based on the image, reducing the probability of misjudgment. In addition, the camera chip module 2, the LED light source 3, the PCB board 4 and the module line 5 are integrally formed, and there is no need to reserve 2 or 4 lamp wires during processing to weld the LED light source 3, nor is there any need to reserve space in the head end base 1 to process the camera chip module 2 and the LED light source 3, which reduces the processing difficulty, and the head end base 1 can also be made smaller, making it more comfortable for the endoscope head end to enter the human body and reducing the patient's pain.

[0033] Specifically, the camera chip module 2 and the LED light source 3 are mounted on the top surface of the PCB board 4 through SMT. SMT is a surface mounting technology. The advantages of SMT processing are as follows: (1) High assembly density, small size and light weight of electronic products. The size and weight of SMT components are only about 1 / 10 of traditional plug-in components. Generally, after using SMT, the size of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%. (2) High reliability, strong vibration resistance, low solder joint defect rate, good high-frequency characteristics, and reduced electromagnetic and radio frequency interference. (3) Easy to realize automation, improve production efficiency, reduce costs by 30% to 50%, and save materials, energy, equipment, manpower, time, etc.

[0034] Preferably, the module line 5 is welded to the bottom surface of the PCB board 4, and the welding method is more stable.

[0035] Preferably, the camera chip module 2, the LED light source 3, the PCB board 4 and the module line 5 are packaged in the head end base 1 by glue potting, and the packaging method is simple and easy.

[0036] Preferably, two LED light sources 3 are provided, and the two LED light sources 3 are symmetrically arranged on both sides of the camera chip module 2 to prevent the camera chip module 2 from blocking the light source, causing one side to be bright while the other side is dark, thereby further improving the clarity of the image.

[0037] Preferably, the center line of the camera chip module 2 is colinear with the center line of the imaging channel 11 to ensure the accuracy of the camera.

[0038] Furthermore, a slot 13 adapted to the PCB board 4 is provided in the head end base 1, so that the PCB board 4 can be better positioned to prevent the PCB board 4 from being misplaced during the subsequent packaging process.

[0039] Example 2

[0040] This embodiment provides a method for processing an endoscope head end with a uniform light spot, comprising the following steps:

[0041] The transparent injection molding material and the light diffusion powder are mixed and stirred evenly, and the head end base 1 is manufactured by injection molding, wherein the content of the light diffusion powder is 5wt%, and the balance is the transparent injection molding material.

[0042] Mount the camera chip module 2 and the LED light source 3 on the top surface of the PCB board 4 through SMT;

[0043] Solder the module wire 5 to the bottom surface of the PCB board 4;

[0044] The PCB board 4 equipped with the camera chip module 2, the LED light source 3 and the module line 5 is installed into the head end base 1, and then sealed and fixed by glue injection.

[0045] Example 3

[0046] The transparent injection molding material and the light diffusion powder are mixed and stirred evenly, and the head end base 1 is manufactured by injection molding, wherein the content of the light diffusion powder is 8wt%, and the balance is the transparent injection molding material.

[0047] Mount the camera chip module 2 and the LED light source 3 on the top surface of the PCB board 4 through SMT;

[0048] Solder the module wire 5 to the bottom surface of the PCB board 4;

[0049] The PCB board 4 equipped with the camera chip module 2, the LED light source 3 and the module line 5 is installed into the head end base 1, and then sealed and fixed by glue injection.

[0050] Example 4

[0051] The transparent injection molding material and the light diffusion powder are mixed and stirred evenly, and the head end base 1 is manufactured by injection molding, wherein the content of the light diffusion powder is 10wt%, and the balance is the transparent injection molding material.

[0052] Mount the camera chip module 2 and the LED light source 3 on the top surface of the PCB board 4 through SMT;

[0053] Solder the module wire 5 to the bottom surface of the PCB board 4;

[0054] The PCB board 4 equipped with the camera chip module 2, the LED light source 3 and the module line 5 is installed into the head end base 1, and then sealed and fixed by glue injection.

[0055] In summary, the above embodiment has the following advantages:

[0056] (1) During the injection molding process of the head end base 1, light diffusion powder is added to the raw material so that the light emitted by the LED light source 3 is fully diffused when passing through the head end base 1, thereby achieving the purpose of uniform light spot. Compared with achieving uniform light spot by raising the LED lamp, the process is simple, the efficiency is high, and the effect is good.

[0057] (2) The camera chip module 2, LED light source 3 and PCB board 4 are integrally formed, which is more convenient to install into the head end than direct wire welding, with simple process and good reliability and consistency. Compared with the decentralized type, it saves more space, the light line is further shortened, and the outer diameter of the head end base 1 can be made smaller, which makes the experience of entering the human body more comfortable, and it is more convenient to assemble, which reduces the defective rate and does not affect the assembly of other structural parts.

[0058] The preferred embodiments of the present invention are described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, the technical solution of the present invention can be subjected to a variety of simple modifications, and these simple modifications all belong to the protection scope of the present invention. It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

[0059] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. An endoscope head with uniform light spot, characterized in that: It includes a head end base and a camera chip module, an LED light source, a PCB board and a module line arranged in the head end base. The head end base is provided with an imaging channel and an instrument channel. The head end base is transparent, and light diffusion powder is dispersed in the head end base. The camera chip module, the LED light source, the PCB board and the module line are integrally formed, and the camera chip module is located in the imaging channel.

2. The endoscope head with uniform light spot according to claim 1, characterized in that: The camera chip module and the LED light source are mounted on the top surface of the PCB board through SMT.

3. The endoscope head with uniform light spot according to claim 2, characterized in that: The module line is welded to the bottom surface of the PCB board.

4. The endoscope head with uniform light spot according to claim 3, characterized in that: The camera chip module, the LED light source, the PCB board and the module line are packaged in the head end base by glue potting.

5. The endoscope head with uniform light spot according to claim 1, characterized in that: There are two LED light sources, and the two LED light sources are symmetrically arranged on both sides of the camera chip module.

6. The endoscope head with uniform light spot according to claim 1, characterized in that: The center line of the camera chip module is collinear with the center line of the imaging channel.

7. The endoscope head with uniform light spot according to any one of claims 1 to 6, characterized in that: A card slot matching the PCB board is arranged in the head end base.

8. A method for processing an endoscope head end with a uniform light spot as claimed in any one of claims 1 to 7, characterized in that: The following steps are involved: The transparent injection molding material and the light diffusion powder are mixed and stirred evenly, and the head end base is manufactured by injection molding; Mount the camera chip module and the LED light source on the top surface of the PCB board through SMT; Soldering the module wire to the bottom surface of the PCB board; The PCB board equipped with the camera chip module, the LED light source and the module line is installed into the head end base, and then sealed and fixed by glue injection.

9. The method according to claim 8, characterized in that The content of the light diffusion powder is 5-10wt%.

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