Wafer quick-arranging groove with magnetic self-adjusting function

Abstract

The invention discloses a wafer quick discharging groove with a magnetic self-adjusting function, and relates to the technical field of wafer cleaning. Comprising a wafer quick-discharging groove, a nitrogen aerator pipe is installed at the bottom of an inner cavity of the wafer quick-discharging groove, a spraying pipe and a detection unit used for conducting resistivity detection on deionized water in the groove are arranged on the wafer quick-discharging groove, a magnet is arranged on the outer wall of the side, close to the detection unit, of the wafer quick-discharging groove, and the magnet is an electromagnet. The device further comprises an automatic magnetism adjusting unit installed on the wafer fast discharging groove, and the magnetism of the magnet is automatically adjusted according to the temperature change of deionized water in the wafer fast discharging groove so as to meet the requirement for expelling nitrogen bubbles through a magnetic field. Through the automatic magnetism adjusting unit, the magnetism of the magnet is automatically adjusted according to the temperature change of the deionized water in the wafer quick discharge groove, so that the requirement of expelling nitrogen bubbles by using a magnetic field is met.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cleaning, and in particular to a wafer quick-discharging slot with a magnetic self-adjusting function. Background Art

[0002] With the increase in IC integration, the cleanliness of the wafer surface is crucial to obtaining high performance and high yield of IC devices, and wafer cleaning is particularly important. Cleaning is to reduce contamination, because contamination will affect the performance of the device, cause reliability problems, and reduce the yield, which requires thorough cleaning before the next process of each layer. Usually, in the tank-type wet cleaning equipment, after each chemical liquid cleaning process, the wafer will generally be followed by a rapid drainage cleaning step to remove the material particles and chemical liquid residues attached to the wafer in the previous process. At present, in the cleaning process of the wafer, the rapid drainage cleaning method using a fast drain tank is a relatively common wafer cleaning method. The so-called rapid drainage cleaning method is to first completely immerse the wafer in the deionized water of the fast drain tank, and then quickly drain the deionized water in the cleaning tank. At the same time, the deionized water is sprayed on the wafer using a nozzle to achieve the purpose of cleaning the wafer.

[0003] The fast discharge tank in the existing wet cleaning equipment is an indispensable part of the cleaning process. It is mainly used to remove the particle impurities and residual chemical liquid on the surface of the wafer to make the surface of the wafer clean. Its structure can refer to the Chinese patent with the authorization announcement number of CN 115945434B.

[0004] A magnet is arranged on the inner wall of the trough body in the above-mentioned patent, and a magnetic field is generated by the magnet on the nitrogen bubbles that are moving upward in the deionized water. Since nitrogen has a reverse magnetic shape, the magnetic field can make the nitrogen bubbles move away from the resistivity detection probe, thereby improving the detection accuracy. In practical applications, the temperature of the deionized water needs to be changed accordingly for the cleaning of different particulate impurities and residual chemical solutions, and the temperature of the deionized water affects the rising speed of the nitrogen bubbles (the higher the temperature, the faster the nitrogen bubbles rise). At this time, it is necessary to replace and install magnets with different magnetic field strengths according to different temperatures to meet the need to drive the steam drum away from the resistivity detection probe to avoid affecting the detection accuracy. Frequent replacement is troublesome. Therefore, the present application provides a wafer quick discharge trough with magnetic self-adjustment function to meet the needs. Summary of the invention

[0005] The purpose of the present application is to provide a wafer quick-displacement slot with a magnetic self-adjusting function, which is used to solve the technical problem in the prior art that magnets with different magnetic field strengths need to be manually replaced and installed according to different deionized water temperatures.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a wafer quick discharge slot with a magnetic self-adjusting function, comprising a wafer quick discharge slot with a nitrogen aeration pipe installed at the bottom of the inner cavity, the wafer quick discharge slot is provided with a spray pipe and a detection unit for detecting the resistivity of deionized water in the slot, a magnet is provided on the outer wall of the wafer quick discharge slot on the side close to the detection unit, the magnet is configured as an electromagnet, and also includes an automatic magnetic adjustment unit installed on the wafer quick discharge slot, which automatically adjusts the magnetic size of the magnet according to the temperature change of the deionized water in the wafer quick discharge slot to meet the requirement of using the magnetic field to drive away nitrogen bubbles.

[0007] As a preferred implementation in this embodiment, the automatic magnetic adjustment unit includes a heat pipe with a lower end mounted on the inner wall of the wafer quick-displacement slot, a movable vertical rod is arranged above the heat pipe, and the lower end of the movable vertical rod is located in the inner cavity of the heat pipe, an elastic sealing head is fixed to the lower end of the movable vertical rod, and the outer wall of the elastic sealing head is in sliding contact with the inner wall of the heat pipe, a tooth plate is installed at the upper end of the movable vertical rod, and the tooth plate is gear-engaged with the adjustment knob of the current controller, and the current controller is arranged above the wafer quick-displacement slot; The expansion cavity formed between the lower end of the movable upright rod and the inner wall of the heat conducting tube is filled with helium; The current controller is electrically connected to the magnet.

[0008] As a preferred implementation manner in this embodiment, it also includes a segmented lifting unit for controlling the segmented upward movement of the tooth plate.

[0009] As a preferred implementation scheme in this embodiment, the segmented rising unit includes a hollow tube, which is sleeved on the outer periphery of the upper end of the heat-conducting tube and fixedly connected to the movable vertical rod, the lower end of the hollow tube is located at the upper end of the wafer quick-displacement groove, and a contact head is provided on the inner wall of the hollow tube, and the upper and lower surfaces of the contact head are provided with inclined surfaces, and hollow columns are arranged in sequence from bottom to top on the outer wall of the heat-conducting tube near the contact head, and the inner cavity of the hollow column is connected to a telescopic head through a spring, and the upper and lower ends of the telescopic head are provided with inclined surfaces.

[0010] As a preferred implementation manner in this embodiment, it also includes a contactless driving unit, so that the moving contact head can drive the corresponding telescopic head to move in and out of the inner cavity of the hollow column without contact.

[0011] As a preferred implementation manner in this embodiment, the contactless drive unit includes permanent magnets arranged on the contact head and the two inclined surfaces of the telescopic head, and the upper magnetic pole of the permanent magnet arranged above the contact head is the same as the lower magnetic pole of the permanent magnet arranged below the telescopic head; The lower magnetic pole of the permanent magnet disposed below the contact head is the same as the upper magnetic pole of the permanent magnet disposed above the telescopic head.

[0012] As a preferred implementation manner in this embodiment, counting from bottom to top among the plurality of hollow columns, the distance between two adjacent hollow columns becomes smaller and smaller, and correspondingly counting from bottom to top, the elastic coefficient of the spring becomes larger and larger.

[0013] As a preferred implementation manner in this embodiment, the contact heads are relatively arranged in two groups, and the hollow columns, the springs and the telescopic heads are correspondingly arranged in two rows.

[0014] In summary, the technical effects and advantages of the present invention are as follows: The invention has a reasonable structure, and the magnetic magnitude of the magnet is automatically adjusted according to the temperature change of the deionized water in the wafer fast discharge tank through the automatic magnetic adjustment unit, so as to meet the requirement of using the magnetic field to drive away the nitrogen bubbles; In the present invention, a segmented rising unit is further provided to control the segmented upward movement of the tooth plate. This segmented rising method realizes an accurate response to the temperature, thereby realizing accurate control of the magnetic field strength. At the same time, since each rise is limited, even if the water temperature suddenly rises, the tooth plate will not rise to the limit position all at once, thereby avoiding system imbalance caused by excessive adjustment, and further improving the stability and reliability of the system. In the present invention, the distance between two adjacent hollow columns becomes smaller from bottom to top, and correspondingly, the elastic coefficient of the spring becomes larger from bottom to top. This arrangement enables a more delicate response to temperature changes as the water temperature gradually increases, thereby achieving more detailed control of water temperature changes. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a schematic diagram of the cross-sectional structure of the wafer quick-discharge slot of the present invention; Figure 2 for Figure 1 A schematic diagram of the partial cross-section structure of the automatic magnetic adjustment unit; Figure 3 for Figure 2 The enlarged structural diagram at A in the middle; Figure 4 This is a schematic diagram of the permanent magnet installation position structure; Figure 5 for Figure 4 Enlarged structural diagram at B in the middle.

[0017] In the figure: 1. Wafer quick discharge slot; 2. Nitrogen aeration pipe; 3. Magnet; 4. Spray pipe; 5. Detection unit; 6. Automatic magnetic adjustment unit; 61. Heat transfer pipe; 62. Hollow pipe; 63. Current controller; 64. Adjustment knob; 65. Tooth plate; 66. Movable vertical rod; 67. Elastic sealing head; 68. Hollow column; 69. Spring; 610. Telescopic head; 611. Contact head; 612. Permanent magnet. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] Example: Reference Figure 1 The wafer quick discharge slot shown has a magnetic self-adjusting function, comprising a wafer quick discharge slot 1 with a nitrogen aeration pipe 2 installed at the bottom of the inner cavity, a spray pipe 4 and a detection unit 5 for detecting the resistivity of deionized water in the slot are arranged on the wafer quick discharge slot 1, and a magnet 3 is arranged on the outer wall of the wafer quick discharge slot 1 close to the detection unit 5. The characteristics are as follows: the magnet 3 is set as an electromagnet, and also includes an automatic magnetic adjustment unit 6 installed on the wafer quick discharge slot 1, which automatically adjusts the magnetic size of the magnet 3 according to the temperature change of the deionized water in the wafer quick discharge slot 1 to meet the requirement of using the magnetic field to drive away nitrogen bubbles.

[0020] As a preferred implementation in this embodiment, Figure 1-2 As shown, the automatic magnetic adjustment unit 6 includes a heat pipe 61 whose lower end is mounted on the inner wall of the wafer quick-displacement slot 1, a movable vertical rod 66 is arranged above the heat pipe 61, and the lower end of the movable vertical rod 66 is located in the inner cavity of the heat pipe 61, an elastic sealing head 67 is fixed to the lower end of the movable vertical rod 66, and the outer wall of the elastic sealing head 67 is in sliding contact with the inner wall of the heat pipe 61, a tooth plate 65 is installed at the upper end of the movable vertical rod 66, and the tooth plate 65 is gear-engaged with the adjustment knob 64 of the current controller 63, and the current controller 63 is arranged above the wafer quick-displacement slot 1; The expansion cavity formed between the lower end of the movable upright rod 66 and the inner wall of the heat conducting tube 61 is filled with helium; The current controller 63 is electrically connected to the magnet 3 .

[0021] When the deionized water in the wafer quick discharge slot 1 immerses the lower end of the heat pipe 61, the internal helium will expand through heat conduction and drive the tooth plate 65 to move upward through the movable vertical rod 66, thereby causing the adjustment rotation 64 to rotate, and the current passing through the electromagnet becomes larger, and the magnetism of the electromagnet becomes stronger, so that the magnetism of the electromagnet increases with the increase of temperature and decreases with the decrease of temperature, thereby realizing that the magnetic field strength changes with the change of temperature, that is, automatic adjustment, avoiding manual replacement, installation and adjustment.

[0022] As a preferred implementation manner in this embodiment, a segmented lifting unit is also included to control the segmented upward movement of the tooth plate 65.

[0023] As a preferred implementation in this embodiment, Figure 2-3 As shown, the segmented rising unit includes a hollow tube 62, which is sleeved on the outer periphery of the upper end of the heat-conducting tube 61 and fixedly connected to the movable vertical rod 66. The lower end of the hollow tube 62 is located at the upper end of the wafer quick-displacement slot 1. A contact head 611 is arranged on the inner wall of the hollow tube 62, and the upper and lower surfaces of the contact head 611 are both provided with inclined surfaces. Hollow columns 68 are arranged in sequence from bottom to top on the outer wall of the heat-conducting tube 61 near the contact head 611, and the inner cavity of the hollow column 68 is connected to the telescopic head 610 through a spring 69, and the upper and lower ends of the telescopic head 610 are both provided with inclined surfaces.

[0024] When detecting the temperature, the heat conducting tube 61 is heated by deionized water, and the internal helium expands and drives the contact head 611 to move upward, and contacts with the inclined surface of the lower end of the telescopic head 610 and remains motionless for a period of time. At this time, the air pressure in the heat conducting tube 61 increases (the increase in temperature causes the internal gas to expand and the air pressure to increase). When it increases to a set value, the contact head 611 will cause the telescopic head 610 to move like the compression spring 69 and eventually move upward over the telescopic head 610 and contact with the inclined surface of the telescopic head 610 set above. As the air pressure in the heat conducting tube 61 continues to increase, the contact head 611 will pass over this telescopic head 610 and contact with the inclined surface of the telescopic head 610 above. The inclined surface at the lower end of the telescopic head 610 contacts, and this is repeated, so that the tooth plate 65 forms a segmented upward movement, thereby realizing segmented regulation of the magnetism of the magnet 3, so that every time the temperature rises a certain level, the magnetism of the magnet 3 is correspondingly enhanced. This segmented rising method actually realizes an accurate response to the temperature. Whenever the water temperature rises to a certain level, the tooth plate 65 will rise a certain level, and the current in the electromagnet is increased by adjusting the knob 64, thereby enhancing the magnetic field strength. This segmented regulation method enables the system to make detailed adjustments according to slight changes in the water temperature, thereby realizing accurate control of the magnetic field strength. If the tooth plate 65 continues to rise with the increase of temperature, the current and magnetic field strength in the electromagnet will also continue to increase. However, this trend of continuous increase may cause the system to overreact, that is, when the water temperature fluctuates slightly, the magnetic field strength will change significantly. The segmented rise method can avoid this situation because every time the tooth plate 65 stops rising, it is equivalent to providing a "buffer period" for the system, so that the system can make the next adjustment after the water temperature stabilizes. Since each rise is limited, even when the water temperature suddenly rises, the tooth plate 65 will not rise to the limit position all at once, thereby avoiding system imbalance caused by excessive adjustment and further improving the stability and reliability of the system.

[0025] As a preferred implementation manner in this embodiment, a contactless driving unit is also included, so that the moving contact head 611 can drive the corresponding telescopic head 610 to move in and out of the inner cavity of the hollow column 68 without contact.

[0026] As a preferred implementation in this embodiment, Figure 4-5 As shown, the contactless drive unit includes a permanent magnet 612 disposed on two inclined surfaces of a contact head 611 and a telescopic head 610, and the upper magnetic pole of the permanent magnet 612 disposed above the contact head 611 is the same as the lower magnetic pole of the permanent magnet 612 disposed below the telescopic head 610; The lower magnetic pole of the permanent magnet 612 disposed below the contact head 611 is the same as the upper magnetic pole of the permanent magnet 612 disposed above the telescopic head 610 .

[0027] Due to the repulsion between like poles of magnets, when the contact head 611 rises or falls, a force is exerted on the telescopic head 610. This force causes the telescopic head 610 to move the compression spring 69, thereby causing the contact head 611 to pass over the telescopic head 610, thereby reducing the contact friction between the two and avoiding excessive wear of the components and reducing the adjustment accuracy.

[0028] It should be noted that a universal ball bearing may be provided on the end of the contact head 611 to reduce the friction generated when the contact head 611 contacts the end of the telescopic head 610 .

[0029] As a preferred implementation in this embodiment, Figure 4 As shown, among the plurality of hollow columns 68 , the distance between two adjacent hollow columns 68 becomes smaller as they are counted from bottom to top, and correspondingly, the elastic coefficient of the spring 69 becomes larger as they are counted from bottom to top.

[0030] This arrangement enables a more delicate response to temperature changes as the water temperature gradually rises, because the distance the contact head 611 rises gradually decreases each time the temperature rises by the same amount, which means that the system can more accurately adjust the current and magnetic field strength in the electromagnet, thereby achieving more delicate control of water temperature changes; As the temperature gradually increases, if the distance that the contact head 611 rises each time remains unchanged, when the water temperature approaches the critical point, the system may react greatly due to a small temperature fluctuation. However, by setting the rising distance to gradually decrease, the sensitivity of the system in the high temperature area can be reduced, and the system instability caused by temperature fluctuation can be reduced; This setting enables the system to better adapt to working requirements in different temperature environments. Whether in low or high temperature environments, the system can maintain stable performance output by adjusting the rising distance of the contact head 611. This adaptability enables the system to operate stably in a wider temperature range, thereby improving the reliability and practicality of the system.

[0031] As a preferred implementation in this embodiment, Figure 2 As shown, the contact heads 611 are relatively arranged in two groups, and the corresponding hollow columns 68, springs 69 and telescopic heads 610 are arranged in two rows.

[0032] The structural setting is conducive to uniform force on the elastic sealing head 67, avoiding the movable vertical rod 66 from tilting, which would cause severe local force on the elastic sealing head 67 and reduce the sealing effect, which is conducive to the stability of the entire system.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer quick discharge tank with a magnetic self-adjusting function, comprising a wafer quick discharge tank (1) with a nitrogen aeration pipe (2) installed at the bottom of the inner cavity, a spray pipe (4) and a detection unit (5) for detecting the resistivity of deionized water in the tank are arranged on the wafer quick discharge tank (1), and a magnet (3) is arranged on the outer wall of the wafer quick discharge tank (1) on the side close to the detection unit (5), characterized in that; The magnet (3) is configured as an electromagnet and further comprises an automatic magnetic adjustment unit (6) mounted on the wafer quick discharge slot (1) for automatically adjusting the magnetic magnitude of the magnet (3) according to temperature changes of deionized water in the wafer quick discharge slot (1) to meet the requirement of using a magnetic field to drive away nitrogen bubbles.

2. The wafer quick discharge slot with magnetic self-adjusting function according to claim 1, characterized in that: The automatic magnetic adjustment unit (6) comprises a heat conducting tube (61) whose lower end is mounted on the inner wall of the wafer quick-displacement slot (1); a movable vertical rod (66) is arranged above the heat conducting tube (61), and the lower end of the movable vertical rod (66) is located in the inner cavity of the heat conducting tube (61); an elastic sealing head (67) is fixed to the lower end of the movable vertical rod (66), and the outer wall of the elastic sealing head (67) is in sliding contact with the inner wall of the heat conducting tube (61); a tooth plate (65) is installed at the upper end of the movable vertical rod (66), and the tooth plate (65) is toothed with the adjustment knob (64) of the current controller (63); and the current controller (63) is arranged above the wafer quick-displacement slot (1); An expansion cavity formed between the lower end of the movable upright rod (66) and the inner wall of the heat conducting tube (61) is filled with helium; The current controller (63) is electrically connected to the magnet (3).

3. The wafer quick-displacement slot with magnetic self-adjustment function according to claim 2, characterized in that: It also includes a segmented lifting unit, which is used to control the tooth plate (65) to move upward in segments.

4. The wafer quick-displacement slot with magnetic self-adjustment function according to claim 3, characterized in that: The segmented ascending unit comprises a hollow tube (62), the hollow tube (62) being sleeved on the outer periphery of the upper end of the heat conducting tube (61) and fixedly connected to the movable vertical rod (66), the lower end of the hollow tube (62) being located at the upper end of the wafer quick discharge slot (1), a contact head (611) being arranged on the inner wall of the hollow tube (62), and the upper and lower surfaces of the contact head (611) are both provided with inclined surfaces, and hollow columns (68) are arranged in sequence from bottom to top on the outer wall of the heat conducting tube (61) near the contact head (611), and the inner cavity of the hollow column (68) is connected to a telescopic head (610) via a spring (69), and the upper and lower ends of the telescopic head (610) are both provided with inclined surfaces.

5. The wafer quick-displacement slot with magnetic self-adjustment function according to claim 4, characterized in that: It also includes a contactless driving unit, so that the moving contact head (611) can drive the corresponding telescopic head (610) to move in and out of the inner cavity of the hollow column (68) without contact.

6. The wafer quick-displacement slot with magnetic self-adjustment function according to claim 5, characterized in that: The contactless drive unit comprises permanent magnets (612) arranged on two inclined surfaces of the contact head (611) and the telescopic head (610), wherein the upper magnetic pole of the permanent magnet (612) arranged above the contact head (611) is the same as the lower magnetic pole of the permanent magnet (612) arranged below the telescopic head (610); The lower magnetic pole of the permanent magnet (612) arranged below the contact head (611) is the same as the upper magnetic pole of the permanent magnet (612) arranged above the telescopic head (610).

7. The wafer quick-displacement slot with magnetic self-adjustment function according to claim 4, characterized in that: Counting from bottom to top among the plurality of hollow columns (68), the distance between two adjacent hollow columns (68) becomes smaller and smaller, and correspondingly, the elastic coefficient of the spring (69) becomes larger and larger when counting from bottom to top.

8. The wafer quick-displacement slot with magnetic self-adjustment function according to claim 4, characterized in that: The contact heads (611) are relatively arranged in two groups, and the hollow columns (68), the springs (69) and the telescopic heads (610) are correspondingly arranged in two rows.

Images