Fluorine-free compounds and uses thereof

Abstract

The invention discloses two series of environment-friendly refrigerants or coolants, the first kind is carbonyl oxidation tertiary amine, the molecular formula of the carbonyl oxidation tertiary amine is R < 3 > N (CO2) < 1-3 >, and R is methyl or ethyl. And the organic silane compound is characterized in that the chemical formula of the silane compound is (CH3) x (CH3O) y (CH2CH) z (CH3CH2) k (CH3CH2O) I CltOmSin, x is equal to 0-6, y is equal to 0-4, z is equal to 0-2, k is equal to 0-6, l is equal to 0-4, t is equal to 1-4, m is equal to 0-1, and n is equal to 1-2. When the two compounds are used as refrigerants or coolants, the two compounds can be independently used, can also be mixed and blended for use, and can also be added with dichloromethane. The refrigerant or coolant can be applied to cold plate heat exchange indirect cooling and immersion type direct cooling of electronic equipment, and can be applied to cooling of equipment such as a server, a computer, an ion implanter, a dry etching machine and chemical vapor deposition equipment.

Description

Technical Field

[0001] The invention relates to the technical field of refrigerants and cooling liquids, in particular to a fluorine-free compound and application thereof. Background Art

[0002] The history of refrigerant development can be traced back to the late 19th century and early 20th century, when ammonia, sulfur dioxide and other substances were used as the main refrigerants to operate refrigeration systems. However, these traditional refrigerants were found to have some serious safety and environmental issues during use, such as toxicity, flammability and damage to the ozone layer.

[0003] With the improvement of environmental awareness and the signing of international environmental agreements, such as the Montreal Protocol, countries around the world have formulated plans to phase out the use of ozone-depleting substances, prompting refrigerant technology to enter a transition period.

[0004] In recent years, hydrocarbons (HCFCs) and some hydrogen fluoride (HFCs) have gradually become mainstream refrigerants because of their lower toxicity and flammability, but they still have potential negative impacts on global warming and the ozone layer. Therefore, the research and development of global refrigerants are mainly focused on the following aspects:

[0005] Environmental impact: Traditional refrigerants (such as HFCs) have a high global warming potential (GWP) and are also problematic for their ozone depletion potential (ODP). Therefore, the development of new refrigerants needs to consider their potential impact on the environment, including reducing GWP and ODP. Energy efficiency and effectiveness: New refrigerants need to have good energy efficiency and refrigeration performance to ensure that cooling effects are achieved without increasing energy consumption. Safety: The safety of refrigerants is an extremely important consideration, especially in high-pressure and high-temperature operating environments, where leaks must be prevented from harming personnel and equipment. Cost-effectiveness: The cost of refrigerants has a direct impact on the operating costs of the overall refrigeration system, so the research and development of new refrigerants also needs to consider their production costs and market feasibility.

[0006] At present, some emerging refrigerant technologies, such as natural refrigerants (such as hydrocarbons and natural gas) and low GWP synthetic refrigerants (such as HFOs), are gradually being developed and promoted. These refrigerants usually have lower GWP and ODP, and also have good performance in safety and efficiency, representing the development direction of future refrigerant technology.

[0007] As artificial intelligence (AI) has emerged, data center servers have adopted models with AI computing capabilities, but at the same time, a large amount of heat energy has been generated that must be removed. Server cooling has become a key technical challenge in data center operations, mainly involving the following issues and their solutions.

[0008] The performance of modern server processors and other components continues to improve, resulting in a sharp increase in the heat density generated per unit area. Traditional cooling methods may have a negative impact on the environment, such as using fossil fuels to generate electricity or emitting greenhouse gases. The climatic conditions in some areas are not suitable for direct cooling with air conditioning, or the cooling system is poorly designed, resulting in inefficiency. AI-type data centers must adopt advanced cooling technologies, such as liquid cooling technology (including direct liquid cooling and indirect liquid cooling), heat exchange technology, etc., to improve cooling efficiency and energy utilization. These technologies can effectively remove heat from the server.

[0009] The refrigerant used in liquid cooling technology needs to have good thermal conductivity, chemical stability and operability to effectively remove heat from the server. Common refrigerants include water, ethylene glycol aqueous solution, and some special liquid media. For example, FC-770 produced by 3M has a boiling point of 95o℃ and can be used for cooling ion implanters, dry etchers, and chemical vapor deposition equipment (CVD Machine).

[0010] Liquid cooling technology can be divided into indirect cooling using cold plate heat exchange and immersion direct cooling. Obviously, the latter has better cooling effect, but the cooling liquid cannot affect the operation, performance and life of electronic components such as chips.

[0011] Immersion cooling is divided into single-phase and two-phase. Currently, single-phase coolants are mainly synthetic fluids such as synthetic oils, esters, and silicone oils.

[0012] Two-phase cooling uses a low-boiling-point coolant. When the chip temperature in the server exceeds the boiling point of the coolant, the coolant evaporates and removes heat. It then condenses into liquid in the cooling pipe and flows back to the server, thus achieving the functions of heat removal and coolant circulation.

[0013] The fluorine-based coolant commonly used in two-phase refrigerants is composed of fluoroalkyl compounds (Per-and PolyfluoroalkylSubstances; PFAS). PFAS has the characteristics of durability, low boiling point and non-flammability, but it will damage the ozone layer and show a high global warming potential (Global Warming Potential; GWP). Therefore, it is urgent to find new non-fluorine-based environmentally friendly refrigerants to solve the problem. Summary of the invention

[0014] The object of the present invention is to overcome the above-mentioned problems and provide a fluorine-free compound and its application.

[0015] The present invention proposes two series of environmentally friendly refrigerants (coolants), the first of which is carbonyl oxide tertiary amine, and the second is fluorine-free low-melting-point organic silane.

[0016] The first is a new material for liquefying carbon dioxide (CO2) by adsorbing tertiary amine at normal pressure, carbonyl oxide tertiary amine, R3N˙(CO2) 1-3 , non-flammable refrigerant coolant with super high efficiency in absorbing and releasing heat).

[0017] Taking trimethylamine carbonyl oxide and triethylamine carbonyl oxide as examples, the structural formulas of the two are as follows:

[0018]

[0019] Carbon dioxide is a very good refrigerant and a non-flammable fire extinguishing material. After being adsorbed by tertiary amine, it becomes a liquid refrigerant at normal pressure and temperature, which is the main creation of the present invention.

[0020] It is known in the past that organic amines can absorb carbon dioxide, but the carbon dioxide adsorbed by the amines will dehydrate and react to become high-boiling point liquid, viscous, or solid amides.

[0021] Primary amine RNH2, such as monoethanolamine, reacts with carbon dioxide to form monoethanolamide, which is in a paste state with a boiling point greater than 200°C.

[0022] H2NCH2CH2OH+CO2→O=C=NCH2CH2OH

[0023] Secondary amine, R 2 NH, for example, dimethylamine reacts with carbon dioxide to dehydrate to form tetramethylammonium diamide, a solid.

[0024] 2HN(CH3)2+CO2→O=C[(NCH3)2]2

[0025] Tertiary amines cannot react with carbon dioxide for dehydration. They can only be used to alkaline adsorb carbon dioxide with acid radicals and liquefy it, as shown below:

[0026]

[0027] Because there is no dehydration reaction, it still retains the properties of carbon dioxide, and after absorbing heat source, it can expand and dissociate at low temperature, and then use the composite liquid pressure of the infiltrated composite material and its own liquefied tertiary amine to absorb pressure and release heat energy, returning to the cold contraction state to complete the cycle operation.

[0028] The second refrigerant (coolant) of the present invention is a fluorine-free organic silane compound, and its chemical formula is as follows:

[0029] (CH3) x (CH3O)y (CH2CH) z (CH3CH2) k (CH3CH2O) I Cl t O m Si n

[0030] x=0-6,y=0-4,z=0-2,k=0-6,l=0-4,t=1-4,m=0-1,n=1-2

[0031] The organosilane material of the present invention has functional groups such as methyl, vinyl, chlorinated, methoxy and ethoxy. Among them, vinyl and ethoxy can reduce the melting point and are flame retardant functional groups. Methyl can reduce the boiling point, and chlorinated has a fire extinguishing function. These functional groups can make the organosilane have a low melting point, that is, various melting points and boiling points can be adjusted.

[0032] The organosilane compound of the present invention may include silane and disiloxane, and may include functional groups such as methyl, methoxy, ethoxy, vinyl, etc. The organosilane compound of the present invention does not contain non-environmentally friendly elements such as fluorine, and has a low melting point and high safety. The boiling point ranges from 20 to 250° C. and is suitable as a refrigerant, especially for cooling electronic processing equipment such as servers, computers, ion implanters, dry etching machines, and chemical vapor deposition equipment.

[0033] The specific compounds of the present invention are shown in the following table:

[0034]

[0035]

[0036]

[0037] The compounds in the above table can be used alone or in combination. The former has a single boiling point (condensation point), while the latter has a corresponding range of boiling points (condensation points) when used in combination. For example, if a coolant is composed of two compounds with different boiling points (condensation points), its boiling point (condensation point) will be between the boiling points (condensation points) of the two compounds.

[0038] The compounds in the table above can be used for indirect cooling with cold plate heat exchange, as well as direct immersion cooling, although the latter has lower cooling efficiency and energy consumption.

[0039] The compounds in the above table can be used in direct liquid cooling systems, which are divided into two operating modes: single-phase and two-phase. For single-phase systems, compounds with higher boiling points are selected, such as compounds numbered 11-16.

[0040] If the compounds in the above table are used in a two-phase operation mode, those with lower boiling points, such as compounds numbered 1-10, can be selected.

[0041] If a range of cooling temperatures is required, a blending method can be selected, using compounds with different boiling points in the table. For example, a coolant composed of 50% of compounds No. 1 and No. 8 has a boiling point (condensation point) of 26-99°C.

[0042] Dichloromethane is currently the cheapest chlorine-containing solvent. It is a polar solvent itself with a low boiling point (39.6°C) and fire extinguishing properties. Its melting point is -96.7°C. It can be mixed with the first and second refrigerants (coolants) of the present invention, which is beneficial to the photolysis and hydrolysis reactions after recovery, and produces decomposable environmental benefits.

[0043] The aforementioned organosilane compounds, when used as refrigerants or coolants, can be applied to heat dissipation in transformers, air conditioners, refrigerators, electric motors, engines, etc.

[0044] The aforementioned organosilane compounds, when used as heat media, such as compound No. 17, hexaethyldisiloxane, have a boiling point of 231°C and can be used as heat-conducting working media used in heating furnaces, concentrated solar energy systems, and geothermal power generation systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 Indirect cooling system with cold plate heat exchange;

[0046] Figure 2 Single-phase direct liquid cooling system;

[0047] Figure 3 Two-phase direct liquid cooling system. DETAILED DESCRIPTION

[0048] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0049] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0050] Example

[0051] The method for preparing trimethylamine carbonyl oxide is as follows;

[0052] Trimethylamine monocarbonate oxide. Take 59 kg of trimethylamine at -20°C, add 44 kg of dry ice carbon dioxide, dissolve and release heat to obtain trimethylamine monocarbonate oxide, (CH3)3N˙(CO2), with a boiling point of about 60°C and a decomposition point of 50°C.

[0053] Trimethylamine dicarbonate. Take 59 kg of trimethylamine at -20°C and add 88 kg of dry ice carbon dioxide. After dissolving and releasing heat, trimethylamine dicarbonate (CH3)3N˙(CO2)2 with a boiling point of about 50°C and a decomposition point of 30°C is obtained.

[0054] Trimethylamine tricarbonyl oxide. Take trimethylamine at 59℃-20℃, add dry ice carbon dioxide at 132℃, dissolve and release heat to obtain trimethylamine tricarbonyl oxide, (CH3)3N˙(CO2)3, with a boiling point of about 50℃ and a decomposition point of 30℃.

[0055] The method for preparing triethylamine carbonyl oxide is as follows;

[0056] Monocarbonyl oxide triethylamine. Take 101 kg of triethylamine and add 44 kg of dry ice carbon dioxide. After dissolving and releasing heat, monocarbonyl oxide triethylamine with a boiling point of about 100°C and a decomposition point of 50°C is obtained, (C2H5)3N˙(CO2).

[0057] Take 101 kg of triethylamine and add 88 kg of dry ice carbon dioxide. After dissolving and releasing heat, triethylamine dicarbonate with a boiling point of about 90°C and a decomposition point of 40°C is obtained, (C2H5)3N˙(CO2)2.

[0058] Take 101 kg of triethylamine and add 132 kg of dry ice and carbon dioxide. After dissolving and releasing heat, dicarbonyl triethylamine (C2H5)3N˙(CO2)3 with a boiling point of about 85°C and a decomposition point of 35°C is obtained.

[0059] At high temperatures, carbonyl oxidation of tertiary amines absorbs heat and dissociates, and at low temperatures, releases heat and reacts, forming a cycle, as shown in the figure below.

[0060]

[0061] The first example of organosilane is the use of an indirect cooling system using cold plate heat exchange, such as Figure 1 shown.

[0062] Compound No. 6, trimethylethoxysilane, is used as the coolant, with a boiling point (condensation point) of 76° C. A cooling plate is used to indirectly cool the electronic components, and a circulating pump is used to cool the heated coolant through a heat exchanger for recycling.

[0063] like Figure 1 As shown, the hot water after absorbing heat in the heat exchanger can be removed from the heat by a cooling tower or a water chiller, and can be circulated using a circulating pump.

[0064] The second embodiment of the organosilane is the application of a single-phase direct liquid cooling system, such as Figure 2 as shown in the system.

[0065] Compound No. 8, dimethylvinylethoxysilane, is used as the coolant, with a boiling point (condensation point) of 99° C. The coolant is directly input and immersed in the electronic components for direct cooling, and a circulating pump is used to cool the heated coolant through a heat exchanger for recycling.

[0066] like Figure 2 As shown, the hot water after absorbing heat in the heat exchanger can be removed from the heat by a cooling tower or a water chiller, and then circulated by a circulating pump.

[0067] The third embodiment of the organosilane is the application of a two-phase direct liquid cooling system, such as Figure 2 as shown in the system.

[0068] Compound No. 1, tetramethylsilane, and compound No. 11, dimethyldiethoxysilane, were mixed in a ratio of 50% to 50% as the coolant. The boiling point (condensation point) of the former was 26°C; the boiling point (condensation point) of the latter was 114°C.

[0069] The coolant is directly input into the unit to be cooled and immersed in the electronic components for direct cooling. The coolant after heating and evaporation is cooled through the upper condenser and then falls into the coolant of the components for recycling.

[0070] like Figure 3 As shown, the hot water or working fluid after absorbing heat from the condenser can be used for evaporation in a cooling tower or a water chiller to remove the heat, and can be circulated using a circulating pump.

[0071] The above-mentioned embodiments only express the specific implementation of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A fluorine-free, environmentally friendly compound characterized by: It includes a carbonyl oxide tertiary amine with the molecular formula R3N˙(CO2) 1-3 , wherein R is methyl or ethyl.

2. A fluorine-free organosilane compound, characterized in that: The chemical formula of the silane compound is as follows: (CH3) x (CH3O) y (CH2CH) z (CH3CH2) k (CH3CH2O) I Cl t O m Si n x=0-6, y=0-4, z=0-2, k=0-6, l=0-4, t=1-4, m=0-1, n=1-2.

3. Use of the compound according to claim 1 and claim 2, characterized in that: When used as a refrigerant or coolant, it can be used alone or mixed.

4. Use of the compound according to claim 1 and claim 2, characterized in that: When used as a refrigerant or coolant, additives such as corrosion inhibitors, flame retardants, or dichloromethane may be added.

5. Use of the compound according to claim 1 and claim 2, characterized in that: When used as a refrigerant or coolant, it can be used for indirect cooling of cold plate heat exchange and immersion direct cooling.

6. Use of the compound according to claim 1 and claim 2, characterized in that: When used as a refrigerant or coolant, it can be used to cool electronic processing equipment such as servers, computers, ion implanters, dry etching machines, and chemical vapor deposition equipment.

7. Use of the compound according to claim 1 and claim 2, characterized in that: When used as a refrigerant or coolant, it can be used to dissipate heat in transformers, air conditioners, refrigerators, electric motors, engines, etc.

8. Use of a compound as claimed in claim 2, characterized in that: When used as a heat medium, it can be applied to heating furnaces, concentrated solar energy systems, and geothermal power generation systems as heat-conducting working media.

9. Use of a compound as claimed in claim 2, characterized in that: When used as a heat medium, it can be used as a cleaning agent for electronic equipment and electronic parts.

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