High-temperature aging test fixture for microwave power amplifier

Abstract

The invention provides a microwave power amplifier high-temperature aging test fixture, which is characterized in that the microwave power amplifier high-temperature aging test fixture comprises a knob type compression module, a matching circuit board and a detection control module, the knob type compression module is located at the upper half part of the fixture and is fixed on a cavity, and the cavity is fixed on a base; the matching circuit board is located in the cavity and below the to-be-tested piece; the detection control module comprises a control terminal, a temperature sensor and a heating piece, the temperature sensor is located in the cavity, the heating piece is located in the base, and the temperature sensor and the heating piece are monitored by the control terminal in real time; the knob type pressing module comprises a screw cap, a stud, a base, a cover plate, a clamping frame, a pressing block mounting plate, a pressing block and a pressing rod; the stud is fixed on the base, and the screw cap is fixed on the stud. The method can be used for high-temperature dynamic aging of the microwave power amplifier, and the shell temperature of the amplifier is accurately controlled in the aging process.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component reliability testing, and in particular to a microwave power amplifier high temperature aging test fixture. Background Art

[0002] High-temperature aging of high-reliability microwave power amplifiers used in aerospace and other fields is the main technical means to evaluate their reliability. First, the current high-temperature aging fixture of microwave power amplifiers uses a single hot plate to control the temperature of multiple devices in the aging temperature control. It not only ignores the differences in the heating of the devices during the aging process, resulting in inconsistent aging temperatures for each device on the hot plate, but also lacks control measures for the stability of the aging temperature of each device during the aging process, which affects the accuracy of the entire aging test; secondly, the current closed microwave power amplifier high-temperature aging test fixture has a large ambiguity in reducing the damage of the pressure block to the test piece during the aging process. The pressure of the pressure block on the test piece is often too high, which often causes damage to the surface marking of the device, and even damages the cover of the test piece in severe cases; finally, the current high-temperature aging data of microwave power amplifiers often needs to be recorded by testers, which greatly reduces the efficiency of the entire aging test process. Therefore, for the high-temperature aging of high-reliability microwave power amplifiers, it is necessary to develop a high-temperature aging fixture that can ensure the accuracy and stability of the aging temperature setting, effectively avoid damage to the test piece caused by the pressure block in a closed environment, and have a certain level of automation. Summary of the invention

[0003] The object of the present invention is to provide a microwave power amplifier high temperature aging test fixture to solve the problems of low efficiency and low test accuracy of the existing microwave power amplifier high temperature aging test.

[0004] Specifically, the present invention provides a microwave power amplifier high temperature aging test fixture, which is characterized by comprising a knob-type clamping module, a matching circuit board and a detection control module.

[0005] The knob-type clamping module is located in the upper part of the fixture and is fixed on the cavity, and the cavity is fixed on the base;

[0006] The matching circuit board is located inside the cavity and below the device to be tested;

[0007] The detection control module includes a control terminal, a temperature sensor and a heating plate, wherein the temperature sensor is located inside the cavity, the heating plate is located inside the base, and the temperature sensor and the heating plate are monitored in real time by the control terminal;

[0008] The knob-type clamping module comprises a rotary cover, a stud, a base, a cover plate, a card frame, a pressure block mounting plate, a pressure block and a pressure rod; the stud is fixed on the base, and the rotary cover is fixed on the stud; the bottom of the base is fixedly connected to the cover plate, and the cover plate is installed between the base and the pressure block mounting plate;

[0009] A pressure indicator light is installed on the side of the base; the pressure block is installed on the pressure block mounting plate, the pressure rods are fixed on both sides of the pressure block, a pressure sensor is installed inside the pressure block, and the pressure sensor is connected to the pressure indicator light through an internal circuit; according to the information of the pressure indicator light, the angle of the rotary cover is adjusted to adjust the tightness of the spring on the stud, and then adjust the degree of compression of the pressure block and the pressure rod on the test piece.

[0010] Furthermore, the knob-type pressing module further comprises a card frame and a buckle, wherein the card frame is fixed around the cavity, and the buckle is fixed on the card frame through a knob.

[0011] The base has two layers, the upper layer of the base is slightly narrower and is used to fix the stud; the lower layer of the base is slightly wider and is connected to the pressure block mounting plate and the cover plate at the bottom, and a notch is provided on the lower layer of the base facing the buckle, and the buckle is buckled in the notch on the side of the lower layer of the base through a knob; the lower layer of the base is fixedly connected to the cavity through a knob on the side facing away from the buckle, so that the entire clamping module is covered on the cavity through the knob.

[0012] Furthermore, the cover plate and the pressing block mounting plate are made of heat-insulating materials; the pressing block and the pressing rod are made of heat-insulating materials; the card frame and the buckle are made of heat-insulating materials, and the cavity is made of heat-conductive materials.

[0013] When the DUT is in the aging process, the cover plate, the clamp frame, the buckle, the pressure block mounting plate, the pressure block and the pressure rod form an insulation layer in the middle of the fixture to prevent the heat generated by the DUT during aging from propagating to the upper layer of the fixture.

[0014] Furthermore, the outside of the cavity is coated with a layer of heat-insulating material, and the bottom and side surfaces of the base are coated with a layer of heat-insulating material.

[0015] Furthermore, the pressing rod is made of elastic material and is longer than the pressing block. When the pressing block presses the housing of the DUT, the pressing rod further presses the pins of the DUT due to the characteristics of its elastic material to ensure good electrical contact of the DUT.

[0016] Furthermore, the base material is a good conductor of heat, the heating plate heats the base and transfers heat to the test piece inside the cavity, the heating plate is connected to an external power supply via a power line, and the control terminal is connected to the power supply via a signal line to control the heating temperature and time of the heating plate;

[0017] The temperature sensor is located inside the cavity and is in close contact with the lower surface of the test piece. The temperature sensor collects the surface temperature data of the test piece and sends it to the control terminal through a signal line.

[0018] The control terminal feeds back instructions to the heating plate according to the measurement data, thereby controlling the temperature of the test piece during aging.

[0019] Furthermore, the matching circuit board is located in the cavity, and a hole is opened in the middle of the matching circuit board for placing the device to be tested, and the bottom surface of the device to be tested is in contact with the cavity;

[0020] The matching circuit board includes a DC bias circuit, an input matching circuit and an output matching circuit. The DC bias circuit is connected to an external power supply through a power line. The input matching circuit matches the input pin of the device under test. The output matching circuit matches the output pin of the device under test. The DC bias circuit is connected to the gate and drain of the device under test.

[0021] Furthermore, the input matching circuit is connected to an external signal source through a 2.92 RF coaxial connector, and the control terminal is connected to the signal source through a signal line to control the signal input during aging of the test piece; the output matching circuit is connected to the control terminal through a 2.92 RF coaxial connector to achieve real-time monitoring of the amplifier output power.

[0022] Furthermore, the 2.92 RF coaxial connector is connected to the signal source and the control terminal via an RF coaxial cable, and the hub is connected to the external power supply and the control terminal via a signal line, so as to monitor and control the time, temperature, voltage, signal and other data of the test piece during aging in real time, periodically record all aging data, record abnormal data when abnormalities occur during aging, and issue warnings to the testers, thereby realizing the automation of the entire aging process.

[0023] Furthermore, a screw hole is opened on one side of the cavity, and a hub is installed on the screw hole. The power line for controlling the DC bias of the DUT, the power line for controlling the heating of the heating plate, and the signal line for controlling the temperature sensor all pass through the hub.

[0024] The invention can be used for high-temperature dynamic aging of microwave power amplifiers, and the amplifier shell temperature can be precisely controlled during the aging process.

[0025] Compared with the prior art, the beneficial technical effects of the present invention are:

[0026] 1) The microwave power amplifier high temperature aging test fixture proposed by the present invention has a knob-type clamping module located in the upper half of the entire fixture. The pressure of the clamp on the test piece is monitored by a pressure sensor and displayed by a pressure indicator light, which effectively avoids the damage of the test piece to the closed cavity by the clamp. The parts close to the cavity in the entire knob-type clamping module are made of heat-insulating materials, which effectively prevents the upward propagation of heat during aging.

[0027] 2) In the microwave power amplifier high temperature aging test fixture of the present invention, the temperature sensor is installed inside the closed cavity and close to the bottom of the device under test, so that the temperature obtained by the temperature sensor is closer to the actual temperature of the device under test. Combined with the thermal resistance data between the housing and the channel of the device under test, the aging temperature is set more accurately and scientifically, and the reliability of the aging data is improved;

[0028] 3) In the microwave power amplifier high-temperature aging test fixture of the present invention, the control terminal dynamically controls the heating of the base hot stage by the heating plate according to the data fed back by the temperature sensor, and accurately controls the accuracy and stability of the aging temperature during the entire aging process, thereby ensuring the accuracy of the aging data; at the same time, the control terminal collects information on the basic aging electrical parameters of the test piece in real time, and automatically generates charts and alarm information as needed, effectively improving the automation level of the entire aging fixture. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The microwave power amplifier high temperature aging test fixture of the present invention is provided by the following embodiments and drawings.

[0030] Figure 1 It is an exploded view of the high temperature aging test fixture of the microwave power amplifier of the present invention.

[0031] Figure 2 It is a front view of the high temperature aging test fixture of the microwave power amplifier of the present invention.

[0032] Figure 3 It is a left view of the high temperature aging test fixture of the microwave power amplifier of the present invention.

[0033] Figure 4 It is a top view of the high temperature aging test fixture of the microwave power amplifier of the present invention.

[0034] Figure 5 The schematic diagram of the pressing block and pressing rod used in the high temperature aging test fixture of the microwave power amplifier of the present invention.

[0035] Figure 6 The block diagram is a detection control module of a microwave power amplifier high temperature aging test fixture of the present invention. DETAILED DESCRIPTION

[0036] The specific embodiments of the present invention are further described in detail below with reference to the accompanying drawings.

[0037] The following will be combined Figure 1 to Figure 6 A microwave power amplifier high temperature aging test fixture of the present invention is further described in detail.

[0038] A microwave power amplifier high temperature aging test fixture of the present invention comprises a knob-type clamping module, a matching circuit board and a detection control module;

[0039] The knob-type clamping module is located in the upper part of the fixture and is fixed on the cavity, and the cavity is fixed on the base;

[0040] The matching circuit board is located inside the cavity and below the device to be tested;

[0041] The detection control module includes a control terminal, a temperature sensor and a heating plate. The temperature sensor is located inside the cavity, and the heating plate is located inside the base. The temperature sensor and the heating plate are monitored in real time by the control terminal.

[0042] High temperature aging is an important test for evaluating the reliability of microwave power amplifiers. Designing a high-accuracy and high-efficiency high-temperature aging fixture is crucial to effectively evaluate the reliability of amplifiers.

[0043] A microwave power amplifier high-temperature aging system of the present invention mainly comprises a knob-type clamping module, a matching circuit board and a detection control module. The knob-type clamping module displays the pressure of the clamp on the workpiece to be tested through a pressure sensor and a pressure indicator light, effectively avoiding damage to the surface marking and cover plate of the workpiece to be tested inside a closed cavity by the clamp, thereby ensuring the smooth progress of the entire aging test. In the detection control module, the control terminal directly controls the heating base of the heating plate through the surface temperature data of the workpiece to be tested fed back by a temperature sensor close to the bottom of the workpiece to be tested, dynamically controls the aging temperature in the entire aging process, realizes the scientific and precise setting of the aging temperature, and significantly improves the accuracy of the aging test data.

[0044] A microwave power amplifier high-temperature aging test fixture of the present invention utilizes a control terminal to control a heating plate and a temperature sensor to dynamically adjust the aging temperature, thereby realizing the automation of aging temperature control; the control terminal also controls the input and output of an external power supply and a signal source, monitors the aging status of a test piece in real time, periodically records the aging data of the test piece according to demand, and issues a warning for abnormal data, thereby realizing the automation of the entire aging test data collection.

[0045] Example 1

[0046] A microwave power amplifier high temperature aging test fixture of this embodiment mainly includes a knob-type clamping module, a matching circuit board and a detection control module. The knob-type clamping module is located above the test piece 10, and can monitor the pressure of the pressure block 6 on the test piece 10 in real time, and adjust the clamping force of the pressure block 6 on the test piece 10 under the combined action of the rotary cover 1, the stud 2 and the buckle 9; the matching circuit board is located below the test piece, including a DC bias circuit, an input matching circuit and an output matching circuit, which can realize high temperature aging test of microwave power amplifiers with a maximum operating frequency of 40GHz; the detection control module includes a temperature sensor 15, a heating plate 16 and a control terminal, etc., which can realize dynamic monitoring and control of the aging temperature, automatically control the access of external power and signal sources, and monitor and record aging data in real time.

[0047] Figure 1 The figure shows an exploded view of a microwave power amplifier high temperature aging test fixture according to the first embodiment of the present invention; Figure 2 FIG. 1 is a front view of a microwave power amplifier high temperature aging test fixture according to Embodiment 1 of the present invention; Figure 3 Shown is a left view of a microwave power amplifier high temperature aging test fixture according to the first embodiment of the present invention. Figure 4 FIG. 1 is a top view of a microwave power amplifier high temperature aging test fixture according to Embodiment 1 of the present invention. Figures 1 to 4 The knob-type clamping module is located in the upper part of the fixture and is fixed on the cavity 12, and the cavity 12 is fixed on the base 17;

[0048] The knob-type pressing module comprises a rotary cover 1 , a stud 2 , a buckle 9 , a base 3 , a cover plate 4 , a pressing block mounting plate 5 , a pressing block 6 , a pressing rod 7 , and a clamping frame 8 .

[0049] The screw cap 1 is fixed on the stud 2, the stud 2 is fixed on the base 3, and the bottom of the base 3 is fixedly connected to the cover plate 4. The base 3 has two layers, the upper layer of the base 3 is slightly narrower, and is used to fix the stud 2. The lower layer of the base 3 is slightly wider, and the lower part is connected to the pressure block mounting plate 5 and the cover plate 4. There is a layer of the cover plate 4 between the base 3 and the pressure block mounting plate 5, and the materials of the cover plate 4 and the pressure block mounting plate 5 are both thermal insulation materials.

[0050] The pressing block 6 is installed on the pressing block mounting plate 5 .

[0051] The card frame 8 is fixed around the cavity 12, and the buckle 9 is fixed to the card frame 8 by a knob. The card frame 8 and the buckle 9 are both made of heat-insulating materials, and the material of the cavity 12 is a heat-conductive material. A notch is provided on the lower layer of the base 3 facing the buckle 9, and the buckle 9 is buckled at the notch on the side of the lower layer of the base 3 by a knob. The lower layer of the base 3 is fixedly connected to the cavity 12 by a knob on the side facing away from the buckle 9, so that the entire clamping module can be covered on the cavity 12 by a knob.

[0052] Figure 5 FIG. 2 is a schematic diagram of a briquetting and pressing rod used in Example 1 of the present invention. Figure 1 , 5 The pressing rods 7 are fixed on both sides of the pressing block 6. The pressing rods 7 are made of elastic material and have a certain elasticity. The pressing block 6 and the pressing rods 7 are installed on the pressing block mounting plate 5. The pressing block 6 and the pressing rods 7 are made of heat-insulating materials.

[0053] The pressing rod 7 is longer than the pressing block 6. When the pressing block 6 presses the housing of the device under test, the pressing rod 7 further presses the pins of the device under test 10 due to the characteristics of its elastic material, thereby ensuring good electrical contact of the device under test 10.

[0054] See also Figure 1 A pressure indicator light 301 is installed on the side of the base 3, and a pressure sensor is installed inside the pressing block 6. The pressure sensor is connected to the pressure indicator light 301 through an internal fixed circuit, and the internal fixed circuit passes through the pressing block 6, the pressing block mounting plate 5 and the base 3.

[0055] By adjusting the angle of the rotary cover 1 according to the information of the pressure indicator light 301 , the tightness of the spring on the stud 2 can be adjusted, and then the degree of pressing of the pressure block 6 and the pressure rod 7 on the test piece 10 can be adjusted.

[0056] When the pressure sensor detects that the pressure of the pressing block 6 on the test piece 10 just reaches the pressure threshold (the pressure threshold is artificially set, under which the pressing block can press the test piece 10 without damaging the surface mark of the device), the indicator light changes from green to red, and the knob of the rotary cover 1 is stopped.

[0057] When the test piece 10 is in the aging process, the cover plate 4, the pressure block mounting plate 5, the pressure block 6, the clamp frame 8, the buckle 9 and the pressure rod 7 form an insulation layer in the middle of the fixture to prevent the heat generated by the test piece 10 during aging from propagating to the upper layer of the fixture.

[0058] See also Figure 1The bottom surface of the DUT 10 is attached to the cavity 12, and the matching circuit board 11 is located inside the cavity 12 and below the DUT 10. The matching circuit board 11 is located in the cavity 12, and a hole is opened in the middle of the matching circuit board 11 for placing the DUT 10.

[0059] The outer side of the cavity 12 is coated with a layer of heat insulating material. The bottom and side surfaces of the base 17 are coated with a layer of heat insulating material. The base 17 is made of a good conductor of heat. In a preferred embodiment, the base 17 is made of copper, and the surface coating is gold, which has good thermal conductivity and electrical conductivity.

[0060] Figure 6 FIG. 1 is a block diagram of a detection control module in Embodiment 1 of the present invention. Figure 1 , Figure 2 and Figure 6 The detection control module includes a control terminal, a temperature sensor 15 and a heating plate 16. The temperature sensor 15 is located inside the cavity 12, and the heating plate 16 is located inside the base 17. The temperature sensor 15 and the heating plate 16 are monitored in real time by the control terminal.

[0061] The temperature sensor 15 is located inside the cavity and is close to the lower surface of the test piece 10. The temperature sensor 15 collects the surface temperature data of the test piece 10 and sends it to the control terminal through the signal line. The control terminal feeds back instructions to the heating plate 16 according to the measurement data, thereby controlling the temperature of the test piece 10 during aging. The control terminal is connected to the external power supply, signal source and the temperature sensor 15 through the signal line to monitor the time, temperature, voltage and signal data of the test piece 10 during aging.

[0062] The heating plate 16 heats the base 17 and transfers heat to the DUT 10 inside the cavity 12. The heating plate 16 is connected to an external power source via a power line, and the control terminal is connected to the external power source via a signal line to control the heating temperature and time of the heating plate 16.

[0063] See also Figure 1 , Figure 2 and Figure 3 A screw hole is opened on one side of the cavity 12, and a hub 13 can be installed on the screw hole. The power line for controlling the DC bias of the device under test 10, the power line for controlling the heating of the heating plate 16, and the signal line for controlling the temperature sensor 15 all pass through the hub.

[0064] The matching circuit board 11 includes a DC bias circuit, an input matching circuit and an output matching circuit. The DC bias circuit is connected to an external power supply through a power line. The input matching circuit matches the input pin of the device under test 10, the output matching circuit matches the output pin of the device under test 10, and the DC bias circuit is connected to the gate and drain of the device under test 10.

[0065] The control terminal controls the gate and drain voltages of the device under test 10 during aging through the power line.

[0066] The input matching circuit is connected to an external signal source via a 2.92 RF coaxial connector 14, and the control terminal is connected to the signal source via a signal line to control the signal input during the aging of the DUT.

[0067] The output matching circuit is connected to the control terminal via a 2.92 RF coaxial connector 14, so that real-time monitoring of the amplifier output power can be achieved.

[0068] The input matching circuit and the output matching circuit are connected to an external signal source and a control terminal via a 2.92 RF coaxial connector 14. The control terminal is connected to the signal source via a signal line to control the signal input during aging of the device under test 10.

[0069] The 2.92 RF coaxial connector 14 is connected to the signal source and the control terminal via a RF coaxial cable, and the hub 13 is connected to the external power supply and the control terminal via a signal line, so as to monitor and control the time, temperature, voltage, signal and other data of the test piece 10 during aging in real time, periodically record all aging data, record abnormal data when abnormalities occur during aging, and issue warnings to the testers, thereby realizing the automation of the entire aging process.

[0070] The working principle of a high temperature aging fixture for a power amplifier in this embodiment is as follows:

[0071] The device under test 10 is correctly placed inside the cavity 12, ensuring that the input pin of the device under test 10 is connected to the input matching circuit of the matching circuit board 11, the output pin is connected to the output matching circuit of the matching circuit board 11, and the gate and drain are connected to the DC bias circuit of the matching circuit board 11;

[0072] The clamping module is rotated to cover the cavity 12, and the knob is turned to cover 1. At this time, the pressure block 6 slowly presses the upper surface of the test piece 10, and the pressure rod 7 presses the input and output pins of the test piece 10. When the pressure sensor inside the pressure block 6 detects that the pressure of the pressure block 6 on the test piece 10 reaches the pressure threshold, the pressure indicator 301 changes from green to red. At this time, stop turning the knob to cover 1, buckle the buckle 9, and fix the clamping module;

[0073] After the assembly of the test piece 10 is completed, the control terminal controls the external power supply and the signal source to supply power to the test piece 10, and controls the heating plate 16 to heat the base 17, and the heat is transferred to the test piece 10. The temperature sensor 15 at the bottom of the test piece 10 monitors the surface temperature data of the test piece 10 in real time, and feeds the data back to the control terminal. The control terminal adjusts the heating power of the heating plate 16 in real time according to the temperature data fed back by the temperature sensor 15, so as to ensure the stability of the aging temperature during the whole aging process;

[0074] During the entire aging test process, the control terminal monitors the aging status of the test piece 10 in real time, and can periodically record the aging data of the test piece 10 as needed, record abnormal data during the aging process, and generate charts and alarm information.

[0075] The contents not described in detail in this specification belong to the prior art known to those skilled in the art. It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention.

Claims

1. A microwave power amplifier high temperature aging test fixture, characterized in that: It includes a knob-type clamping module, a matching circuit board and a detection control module. The knob-type clamping module is located in the upper part of the fixture and is fixed on the cavity, and the cavity is fixed on the base; The matching circuit board is located inside the cavity and below the device to be tested; The detection control module includes a control terminal, a temperature sensor and a heating plate, wherein the temperature sensor is located inside the cavity, the heating plate is located inside the base, and the temperature sensor and the heating plate are monitored in real time by the control terminal; The knob-type clamping module comprises a rotary cover, a stud, a base, a cover plate, a card frame, a pressure block mounting plate, a pressure block and a pressure rod; the stud is fixed on the base, and the rotary cover is fixed on the stud; the bottom of the base is fixedly connected to the cover plate, and the cover plate is installed between the base and the pressure block mounting plate; A pressure indicator light is installed on the side of the base; the pressure block is installed on the pressure block mounting plate, the pressure rods are fixed on both sides of the pressure block, a pressure sensor is installed inside the pressure block, and the pressure sensor is connected to the pressure indicator light through an internal circuit; according to the information of the pressure indicator light, the angle of the rotary cover is adjusted to adjust the tightness of the spring on the stud, and then adjust the degree of compression of the pressure block and the pressure rod on the test piece.

2. A microwave power amplifier high temperature aging test fixture as claimed in claim 1, characterized in that: The knob-type clamping module further includes a card frame and a buckle, wherein the card frame is fixed around the cavity, and the buckle is fixed on the card frame through a knob. The base has two layers, the upper layer of the base is slightly narrower and is used to fix the stud; the lower layer of the base is slightly wider and is connected to the pressure block mounting plate and the cover plate at the bottom, and a notch is provided on the lower layer of the base facing the buckle, and the buckle is buckled in the notch on the side of the lower layer of the base through a knob; the lower layer of the base is fixedly connected to the cavity through a knob on the side facing away from the buckle, so that the entire clamping module is covered on the cavity through the knob.

3. A microwave power amplifier high temperature aging test fixture as claimed in claim 2, characterized in that: The cover plate and the pressing block mounting plate are made of heat-insulating materials; the pressing block and the pressing rod are made of heat-insulating materials; the card frame and the buckle are made of heat-insulating materials, and the cavity is made of heat-conductive materials. When the DUT is in the aging process, the cover plate, the clamp frame, the buckle, the pressure block mounting plate, the pressure block and the pressure rod form an insulation layer in the middle of the fixture to prevent the heat generated by the DUT during aging from propagating to the upper layer of the fixture.

4. A microwave power amplifier high temperature aging test fixture as claimed in claim 3, characterized in that: The outside of the cavity is coated with a layer of heat-insulating material, and the bottom and side surfaces of the base are coated with a layer of heat-insulating material.

5. A microwave power amplifier high temperature aging test fixture as claimed in claim 1, characterized in that: The pressing rod is made of elastic material and is longer than the pressing block. When the pressing block presses the housing of the DUT, the pressing rod further presses the pins of the DUT due to the characteristics of its elastic material to ensure good electrical contact of the DUT.

6. A microwave power amplifier high temperature aging test fixture as claimed in claim 1, characterized in that: The base material is a good conductor of heat, the heating plate heats the base and transfers heat to the test piece inside the cavity, the heating plate is connected to an external power supply via a power line, and the control terminal is connected to the power supply via a signal line to control the heating temperature and time of the heating plate; The temperature sensor is located inside the cavity and is in close contact with the lower surface of the test piece. The temperature sensor collects the surface temperature data of the test piece and sends it to the control terminal through a signal line. The control terminal feeds back instructions to the heating plate according to the measurement data, thereby controlling the temperature of the test piece during aging.

7. A microwave power amplifier high temperature aging test fixture as claimed in claim 1, characterized in that: The matching circuit board is located in the cavity, and a hole is opened in the middle of the matching circuit board for placing the device under test, and the bottom surface of the device under test is in contact with the cavity; The matching circuit board includes a DC bias circuit, an input matching circuit and an output matching circuit. The DC bias circuit is connected to an external power supply through a power line. The input matching circuit matches the input pin of the device under test. The output matching circuit matches the output pin of the device under test. The DC bias circuit is connected to the gate and drain of the device under test.

8. A microwave power amplifier high temperature aging test fixture as claimed in claim 1, characterized in that: The input matching circuit is connected to an external signal source through a 2.92 RF coaxial connector, and the control terminal is connected to the signal source through a signal line to control the signal input during aging of the DUT; the output matching circuit is connected to the control terminal through a 2.92 RF coaxial connector to achieve real-time monitoring of the amplifier output power.

9. A microwave power amplifier high temperature aging test fixture as claimed in claim 8, characterized in that: The 2.92 RF coaxial connector is connected to the signal source and the control terminal via a RF coaxial cable, and the hub is connected to the external power supply and the control terminal via a signal line. It monitors and controls the time, temperature, voltage, signal and other data of the test piece during aging in real time, records all aging data periodically, records abnormal data when aging occurs abnormally, and issues warnings to the tester, thereby realizing the automation of the entire aging process.

10. A microwave power amplifier high temperature aging test fixture as claimed in claim 1, characterized in that: A screw hole is opened on one side of the cavity, and a hub is installed on the screw hole. The power line for controlling the DC bias of the DUT, the power line for controlling the heating of the heating plate, and the signal line for controlling the temperature sensor all pass through the hub.

Images