Optical module

Abstract

The invention provides an optical module and an optical module control method. The optical module comprises a circuit board and an optical receiving component. The circuit board is provided with an MCU, and the light receiving component comprises an adjustable filter, a semiconductor cooler, a thermistor and a light receiving chip. And the MCU is respectively connected with the light receiving chip, the semiconductor cooler and the thermistor. When the difference value between the current temperature and the target temperature value is large, the output voltage of the semiconductor cooler is set through the PID algorithm, and the temperature is adjusted to be close to the target temperature value; when the difference value between the current temperature and the target temperature value is small, an RSSI tracking algorithm is started, the output voltage of the semiconductor cooler is finely adjusted in a stepping mode, the maximum value of the optical power of the optical receiving component is found, and the output voltage of the thermoelectric driving circuit is kept so that the optical power of the optical receiving component can be kept at the maximum value; the stability of the optical power of the optical receiving component is improved.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] Optical communication technology is used in new business models and application models such as cloud computing, mobile Internet, and video. In optical communication, optical modules are tools for converting photoelectric signals into each other and are one of the key components in optical communication equipment. With the rapid development of 5G networks, optical modules, which are at the core of optical communication, have made great progress.

[0003] Among them, based on time division and wavelength division multiplexing wireless optical fiber network technology, each optical fiber can provide optical signals with four or more wavelengths, the wavelength spacing of the optical signal is 100GHZ or 50GHZ, and each wavelength can provide a transmission capacity of 2.5Gbps or 10Gbps symmetrical or asymmetrical rate. When optical signals with multiple different wavelengths are used as communication wavelengths, the optical filter of the optical module is required to be able to tune the optical signals of different wavelengths to the required wavelength. However, in the process of wavelength switching, it is very likely that due to the deviation of adjustment, the center point of the received wavelength cannot be accurately aligned, resulting in abnormal received optical power. Summary of the invention

[0004] The present application provides an optical module to increase the received optical power of the optical module.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] On the one hand, an embodiment of the present application discloses an optical module, including:

[0007] A circuit board, wherein the circuit board is provided with an MCU;

[0008] A light receiving component is electrically connected to the circuit board, and the light receiving component includes:

[0009] Adjustable filter;

[0010] A semiconductor refrigerator is thermally connected to the adjustable filter;

[0011] A light receiving chip, receiving the light signal filtered by the adjustable filter;

[0012] The MCU is electrically connected to the light receiving chip and the semiconductor refrigerator respectively; the MCU is configured as follows:

[0013] The current temperature value is obtained; the output voltage of the semiconductor cooler is set by the PID algorithm so that the target temperature value and the current temperature value are within a preset threshold range; when the difference between the current temperature and the target temperature value is within the preset threshold range, the current optical power is obtained, and the output voltage of the semiconductor cooler is adjusted by the feedback algorithm so that the current optical power value is greater than the previous optical power.

[0014] In a second aspect, an embodiment of the present application discloses an optical module, including:

[0015] A circuit board, wherein the circuit board is provided with an MCU;

[0016] A light receiving component is electrically connected to the circuit board, and the light receiving component includes:

[0017] Adjustable filter;

[0018] A semiconductor refrigerator is thermally connected to the adjustable filter;

[0019] a thermistor, adjacent to the tunable filter;

[0020] A light receiving chip, receiving the light signal filtered by the adjustable filter;

[0021] The MCU is electrically connected to the light receiving chip, the semiconductor refrigerator, and the thermistor respectively; the MCU is configured as follows:

[0022] The sampling value of the thermistor is obtained, and the current temperature value is calculated according to the sampling value of the thermistor; the output voltage of the semiconductor refrigerator is set by the PID algorithm so that the target temperature value and the current temperature value are within the preset threshold range; when the difference between the current temperature and the target temperature value is within the preset threshold range, the current optical power is obtained, the preset adjustment temperature is adjusted to be greater than the current temperature, and the output voltage of the semiconductor refrigerator is set with the preset adjustment temperature as the target temperature; the current optical power is obtained again, and the optical power obtained last time is used as the previous optical power. If the current optical power is greater than the previous optical power, the preset adjustment temperature is adjusted to increase; if the current optical power is less than the previous optical power, the preset adjustment temperature is adjusted to decrease.

[0023] In a third aspect, an embodiment of the present application discloses a method for controlling temperature of an optical module, including:

[0024] Obtain the current temperature value of the light receiving component;

[0025] Get the target temperature value;

[0026] Obtain the optical power of the optical receiving component, and obtain the current optical power and the previous optical power;

[0027] When the difference between the target temperature value and the current temperature value is outside the preset threshold range, the target temperature value is used as the preset adjustment temperature;

[0028] The difference between the target temperature value and the current temperature value is within a preset threshold range, and a feedback algorithm is used to adjust the preset adjustment temperature so that the current optical power is greater than the previous optical power;

[0029] The preset adjustment temperature is input into the PID algorithm, and the voltage control value is obtained by performing proportional, differential and integral calculations on the preset adjustment temperature and the current temperature value.

[0030] Compared with the prior art, the present invention has the following advantages:

[0031] The optical module and optical module control method provided by the present application, wherein the optical module includes: a circuit board and a light receiving component. The circuit board is provided with an MCU, and the light receiving component includes: an adjustable filter, a semiconductor refrigerator and a light receiving chip. The MCU is connected to the light receiving chip and the semiconductor refrigerator respectively. The MCU is configured to: obtain the current temperature value, set the output voltage of the semiconductor refrigerator through the PID algorithm so that the target temperature value and the current temperature value are within the preset threshold range; when the difference between the current temperature and the target temperature value is within the preset threshold range, obtain the current optical power, and use the feedback algorithm to adjust the output voltage of the semiconductor refrigerator so that the value of the current optical power is greater than the previous optical power. When the difference between the current temperature and the target temperature value is large, the present application sets the output voltage of the semiconductor refrigerator through the PID algorithm to adjust the temperature to near the target temperature value; when the difference between the current temperature and the target temperature value is small, start the tracking algorithm to adjust the output voltage of the semiconductor refrigerator, find the maximum optical power of the optical receiving component, and maintain the output voltage of the thermoelectric drive circuit so that the optical power of the optical receiving component remains at the maximum value, thereby improving the stability of the optical power of the optical receiving component. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0033] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0034] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0035] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0036] Figure 4 is an exploded view of an optical module according to some embodiments;

[0037] Figure 5 A schematic diagram of the structure of a light emitting component and a light receiving component provided according to some embodiments of the present application;

[0038] Figure 6 A schematic diagram of the exploded structure of a light emitting component and a light receiving component provided according to some embodiments of the present application;

[0039] Figure 7 A schematic cross-sectional view of a light emitting component and a light receiving component provided according to some embodiments of the present application;

[0040] Figure 8 A schematic diagram of the structure of a light receiving component provided according to some embodiments of the present application;

[0041] Fig. 9 A cross-sectional schematic diagram of a light receiving component provided according to some embodiments of the present application;

[0042] Fig.10 A partial schematic diagram of a light receiving component provided according to some embodiments of the present application;

[0043] Fig.11 A schematic diagram of the structure of a light receiving component and a circuit board provided according to some embodiments of the present application;

[0044] Fig.12 A schematic diagram of an MCU structure provided according to some embodiments of the present application;

[0045] Fig.13 A schematic diagram of a temperature control method for an optical module provided according to some embodiments of the present application;

[0046] Fig.14 A schematic diagram of a step feedback algorithm provided according to some embodiments of the present application. DETAILED DESCRIPTION

[0047] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0048] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0049] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0050] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0051] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0052] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0053] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0054] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and Data Center Server are common host computers.

[0055] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0056] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0057] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0058] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0059] Figure 2FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0060] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0061] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 is an exploded view of an optical module according to some embodiments. Figure 5 FIG. 1 is a structural diagram of an optical module with a housing and unlocking components removed according to some embodiments. Figure 6 FIG. 1 is a structural diagram of a fiber optic adapter, a light source, coherent components, and a circuit board according to some embodiments. Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0062] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0063] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0064] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0065] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0066] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400 and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0067] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0068] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0069] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0070] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (MOSFET), etc. The chips may include microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers, clock and data recovery chips (CDR), power management chips, and digital signal processing (DSP) chips.

[0071] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0072] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0073] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0074] The light emitting component and / or the light receiving component are located on a side of the circuit board 300 away from the gold finger; in some embodiments, the light emitting component and the light receiving component are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0075] Figure 5 A schematic diagram of the structure of a light emitting component and a light receiving component provided according to some embodiments of the present application. Figure 6 The following is a schematic diagram of the exploded structure of a light emitting component and a light receiving component according to some embodiments of the present application. Figure 5 and Figure 6 As shown, the optical transceiver assembly includes an optical emitting component and an optical receiving component, and the optical module also includes a first housing 810 and an optical fiber adapter 700. In the embodiment of the present application, the optical transceiver assembly preferably uses an optical fiber adapter to connect the optical fiber, that is, the optical fiber adapter 700 is embedded in the first housing 810 for connecting the optical fiber. Specifically, the first housing 810 is provided with a third pipe opening 813 for inserting the optical fiber adapter 700, and the optical fiber adapter 700 is embedded in the third pipe opening 813. The optical emitting component 400 and the optical receiving component 500 respectively establish optical connections with the optical fiber adapter. The light emitted and the light received in the optical transceiver assembly are transmitted via the same optical fiber in the optical fiber adapter, that is, the same optical fiber in the optical fiber adapter is the transmission channel for the light entering and exiting the optical transceiver assembly, and the optical transceiver assembly realizes a single-fiber bidirectional optical transmission mode.

[0076] The first housing 810 is used to carry the light emitting component and the light receiving component. In the embodiment of the present application, the first housing is made of metal material, which is conducive to electromagnetic shielding and heat dissipation. The first pipe opening 811, the second pipe opening 812 and the third pipe opening 813 are arranged on the round square tube body, and the first pipe opening 811 and the second pipe opening 812 are respectively arranged on the adjacent side walls of the round square tube body.

[0077] The first pipe opening 811 is disposed on the side wall of the round square tube in the width direction, and the second pipe opening 812 is disposed on the side wall of the first shell 810 in the length direction.

[0078] The light receiving component 500 is embedded in the first pipe opening 811, and the light emitting component 400 is in thermal contact with the first housing 810 through the first pipe opening 811; the light emitting component 400 is connected to the second pipe opening 812 through the connection seat 820. A heat conducting block 540 is provided outside the light receiving component 500, and the heat conducting block 540 is connected to the upper housing for heat dissipation, which is convenient for heat dissipation of the light receiving component 500.

[0079] The light emitting component 400 and the light receiving component 500 are directly pressed into the first housing 810, and the first housing 810 is in direct contact with the light emitting component 400 and the light receiving component 500 or through a heat conducting medium. In this way, the round square tube can be used for heat dissipation of the light emitting component 400 and the light receiving component 500, ensuring the heat dissipation effect of the light emitting component 400 and the light receiving component 500.

[0080] The first shell 810 may be a square tube or other internal hollow shell.

[0081] Figure 7 Schematic diagram of a cross-section of a light emitting component and a light receiving component provided according to some embodiments of the present application. Figure 7 As shown, a first lens 815 is provided in the first housing 810, and the first lens 815 is located between the optical fiber adapter 700 and the optical emitting component 400. The optical fiber adapter 700 includes a first optical signal and a second optical signal, wherein the first optical signal comes from the optical fiber, and the first optical signal enters the optical transceiver assembly from the optical fiber. The first optical signal comes from the optical emitting component, and enters the optical fiber from the optical emitting component.

[0082] The first lens 815 has a semi-transparent and semi-reflective coating, and reflects the first optical signal and transmits the second optical signal, that is, the first lens 815 reflects the light from the optical fiber adapter to the optical emitting component and transmits the light in the opposite direction.

[0083] The first optical signal enters the optical transceiver assembly from the optical fiber, and after being reflected by the first lens 815, it moves toward the first pipe opening and enters the optical receiving component. The first optical signal may contain signal light of one wavelength, or may contain signal light of two or more wavelengths. The optical receiving component filters the first optical signal, and the optical receiver of the optical receiving component only receives signal light of one wavelength and converts the signal light into an electrical signal.

[0084] A plano-convex lens is provided between the optical fiber adapter 700 and the first lens 815, and the plano-convex lens collimates the first optical signal, so that the first optical signal changes from a scattered light beam to a parallel light beam. At the same time, the plano-convex lens converges the second optical signal, and the converged second optical signal enters the optical fiber adapter 700. Or a plano-convex lens is provided inside the optical fiber adapter 700, so that the first optical signal changes from a scattered light beam to a parallel light beam. At the same time, the plano-convex lens converges the second optical signal, and the converged second optical signal enters the optical fiber adapter 700.

[0085] In some embodiments of the present application, in order to reduce the size of the first housing, a displacement prism 817 is further provided in the first housing. The displacement prism 817 is located between the first lens 815 and the light receiving component 500, and displaces the first light signal reflected by the first lens 815 to the emission light window 415 of the light receiving component 500.

[0086] A connection base is provided between the light receiving component and the first housing 810. Exemplarily, one end of the connection base 820 is connected to the first housing 810, and the other end is connected to the second housing 411, and the connection base 820 is connected to the second nozzle, so that the first housing 810 and the second housing 411 are connected through the connection base 820. In some embodiments, the cross-sectional area of ​​the connection base 820 is smaller than the area of ​​the outer side wall of the first housing, and the cross-sectional area of ​​the connection base 820 is smaller than the area of ​​one side of the second housing 411, which can facilitate the connection between the second housing 411 and the first housing 810, and can also facilitate the sealing effect of the second cavity 4110.

[0087] In some embodiments, the outer contour of the connection seat 820 is cylindrical. When the connection seat 820 is connected to the first shell 810 by laser welding, the cylindrical connection seat 820 facilitates the operation of the laser welding process, thereby facilitating the connection between the connection seat 820 and the first shell 810.

[0088] Figure 8 This is a schematic diagram of the structure of a light receiving component provided according to some embodiments of the present application. Fig. 9 It is a cross-sectional schematic diagram of a light receiving component provided according to some embodiments of the present application. Fig.10 FIG. 1 is a partial schematic diagram of a light receiving component provided according to some embodiments of the present application. Figure 8 , Fig. 9 and Fig.10 As shown, the light receiving component includes: a tube base 510, a tube cap 520, and other components arranged in the tube cap 520 and the tube base 510. The tube cap 520 is covered at one end of the tube base 510. The tube base 510 includes a plurality of receiving pins 530, which are used to realize the electrical connection between the flexible circuit board and other electrical components in the light receiving component 500, and further realize the electrical connection between the light receiving component 500 and the circuit board 300. This embodiment is only based on Fig.10 The structure shown is taken as an example.

[0089] The tube cap 520 is buckled on the tube base 510 to form a light receiving space, and the filter support 512, the third temperature regulator 511, the adjustable filter 514, the thermistor 513, the converging lens 515, the light receiving chip 516, and the transimpedance amplifier chip 517 are located in the light receiving space. The centers of the adjustable filter 514, the converging lens 515, and the light receiving chip 516 are on the same vertical line and are coaxially arranged.

[0090] The third temperature regulator 511 can be a TEC (semiconductor refrigerator, Thermo Electric Cooler). The temperature of the tunable filter is controlled by adjusting the third temperature regulator 511. When the temperature of the tunable filter changes, the molecular kinetic energy in the tunable filter changes, that is, the tunable filter undergoes thermal expansion and contraction, or the molecular structure in the tunable filter undergoes a reversible change, thereby changing the refractive index emission of the tunable filter. The wavelength of the optical signal passing through the tunable filter and the wavelength of the optical signal cut off by the tunable filter are changed, so that the optical signal of the wavelength corresponding to the changed temperature can pass through the tunable filter, and the optical signals of other wavelengths are cut off. Therefore, by making the tunable filter at different temperatures through the third temperature regulator 511, optical signals of different wavelengths can pass through the tunable filter.

[0091] The third temperature regulator 511 is located on the tube base 510, and the filter holder 512 is located above the third temperature regulator 511. Specifically, the lower surface of the third temperature regulator 511 is attached to the surface of the tube base 510, wherein the lower surface of the third temperature regulator 511 is the negative electrode of the third temperature regulator 511, that is, the negative electrode of the third temperature regulator 511 in this application is connected to the surface of the vertical tube base 510; the upper surface of the third temperature regulator 511 is the positive electrode of the third temperature regulator 511, and the tube base surface has a semiconductor cooler pin, and the positive electrode of the semiconductor cooler is electrically connected to the semiconductor cooler pin; the upper surface of the semiconductor cooler is vertically provided with a filter holder 512, and the filter holder 512 is used to support the adjustable filter 514 and the thermistor 513.

[0092] The filter support 512 has step surfaces of different heights for carrying different optoelectronic devices. The filter support 512 includes: a first frame and a second frame, wherein the height of the upper surface of the first frame is lower than the height of the upper surface of the second frame. The lower surface of the first frame is connected to the upper surface of the third temperature regulator 511, and the upper surface of the second frame is higher than the upper surface of the first frame. The converging lens 515 and the light receiving chip 516 are sequentially located below the second frame.

[0093] The upper surface of the filter support 512 may be a plane or may have different heights.

[0094] The second frame plate is provided with a through hole 5123 , and the first optical signal is reflected to the displacement prism by the first lens 815 , and enters the converging lens 515 through the receiving light window and the through hole of the adjustable filter 514 .

[0095] The surface temperature of the adjustable filter 514 is collected in real time through the thermistor 513, and the collected surface temperature of the adjustable filter 514 is fed back to the thermoelectric driving circuit. The thermoelectric driving circuit determines the heating or cooling current input into the third temperature regulator according to the received surface temperature of the adjustable filter 514, so as to achieve heating or cooling of the adjustable filter 514, so that the adjustable filter 514 presents different temperatures to receive signal light of different wavelengths.

[0096] Fig.11 Schematic diagram of the structure of a light receiving component and a circuit board according to some embodiments of the present application. Fig.11 As shown, in order to accurately adjust the temperature of the third temperature regulator so that the optical power of the light receiving component is at the maximum value, the light receiving component disclosed in the embodiment of the present application also includes: a first digital-to-analog converter (ADC1), which is connected to the thermistor, and the first digital-to-analog converter is also connected to the MCU. The first digital-to-analog converter converts the electrical signal of the thermistor into a first digital signal, and transmits the first digital signal to the MCU. The MCU calculates the current temperature value of the light receiving component according to the preset temperature table, and stores the current temperature value in the temperature change table.

[0097] The preset temperature table is a mapping relationship table between the first digital signal and the temperature value, and the current temperature value of the light receiving component can be calculated through the first digital signal.

[0098] The MCU can also obtain the current channel wavelength and calculate the target temperature value corresponding to the current channel according to the current channel wavelength and the preset wavelength temperature relationship table. The preset wavelength temperature relationship table is a mapping relationship table between the channel wavelength and the target temperature value.

[0099] A second analog-to-digital converter (ADC2) is provided between the MCU and the optical receiving chip. The optical receiving chip converts the optical power of the received first optical signal into a photocurrent, and the second analog-to-digital converter converts the photocurrent into a second digital value. The MCU is connected to the second analog-to-digital converter, and the MCU calculates the current optical power based on the second digital value and the preset optical power relationship table. The MCU collects the current optical power in a polling manner at intervals of a preset time period, and stores the optical power in the optical power information table. For example, at a certain time point, the optical power collected by the MCU is recorded as the current optical power, and the optical power collected between the preset time intervals at this time point is recorded as the previous optical power.

[0100] The MCU is configured such that: when the difference between the target temperature value and the current temperature value is outside the preset threshold range, the target temperature value is used as the preset adjustment temperature. When the difference between the target temperature value and the current temperature value is within the preset threshold range, the preset adjustment temperature is adjusted using a feedback algorithm.

[0101] Using the feedback algorithm to adjust the preset adjustment temperature includes: using an increasing or decreasing adjustment method to set the preset adjustment temperature. If the current optical power is greater than the previous optical power, the preset adjustment temperature is set using a step adjustment method, and the current adjustment direction is consistent with the previous adjustment direction; if the current optical power is less than the previous optical power, the preset adjustment temperature is set using a step adjustment method, and the current adjustment direction is opposite to the previous step direction.

[0102] For example, the temperature adjustment process may be a step-by-step method or a non-step-by-step method.

[0103] For example: Add a step value to the target temperature value as the preset adjustment temperature. Transmit the preset adjustment temperature to the PID operation unit, and the PID operation unit outputs a voltage control value to control the semiconductor cooler. Obtain the current optical power. If the current optical power is greater than the previous optical power, add a step value to the target temperature value as the preset adjustment temperature; if the current optical power is less than the previous optical power, the target temperature value is reduced by a step value as the preset adjustment temperature. If the current optical power is equal to the previous optical power, the current temperature value is used as the preset adjustment temperature.

[0104] The target temperature value is reduced by one step value as the preset adjustment temperature. The preset adjustment temperature is transmitted to the PID operation unit, and the PID operation unit outputs a voltage control value to control the semiconductor cooler. The current optical power is obtained. If the current optical power is greater than the previous optical power, the target temperature value is reduced by one step value as the preset adjustment temperature; if the current optical power is less than the previous optical power, the target temperature value is increased by one step value as the preset adjustment temperature. If the current optical power is equal to the previous optical power, the current temperature value is used as the preset adjustment temperature.

[0105] The preset adjustment temperature is used as the input of the PID algorithm to calculate the control voltage value. The control voltage value is used to control the output voltage of the thermoelectric drive circuit so that the temperature of the semiconductor refrigerator reaches the preset adjustment temperature.

[0106] When the difference between the target temperature value and the current temperature value is outside the preset threshold range, the target temperature value is used as the preset adjustment temperature input into the PID algorithm to calculate the control voltage value. The control voltage value is used to control the output voltage of the thermoelectric drive circuit so that the temperature of the semiconductor cooler reaches the preset adjustment temperature.

[0107] For example, the preset threshold range includes: a high temperature limit and a low temperature limit, and the temperature value of the preset threshold range is greater than or equal to the low temperature limit, and less than or equal to the high temperature limit. For example, the high temperature limit is 0.5°C and the low temperature limit is -0.6°C, then -0.6≤preset threshold≤0.5.

[0108] When the difference between the target temperature value and the current temperature value is greater than or equal to the low temperature limit, and the difference between the target temperature value and the current temperature value is less than or equal to the high temperature limit, if the current optical power is less than the previous optical power, the target temperature value is reduced by a step value as the preset adjustment temperature; the preset adjustment temperature is used as the input of the PID algorithm to calculate the control voltage value. The control voltage value is used to control the output voltage of the thermoelectric drive circuit so that the temperature of the semiconductor refrigerator reaches the preset adjustment temperature.

[0109] When the difference between the target temperature value and the current temperature value is greater than or equal to the low temperature limit, and the difference between the target temperature value and the current temperature value is less than or equal to the high temperature limit, if the current optical power is greater than the previous optical power, and the previous adjustment is a step increase, then a step value is added to the target temperature value as the preset adjustment temperature. The preset adjustment temperature is used as the input of the PID algorithm to calculate the control voltage value. The control voltage value is used to control the output voltage of the thermoelectric drive circuit so that the temperature of the semiconductor cooler reaches the preset adjustment temperature.

[0110] When the difference between the target temperature value and the current temperature value is greater than the low temperature limit or the difference between the target temperature value and the current temperature value is greater than the high temperature limit, the target temperature value is used as the preset adjustment temperature, input into the PID algorithm, and the control voltage value is calculated. The control voltage value is used to control the output voltage of the thermoelectric drive circuit so that the temperature of the semiconductor cooler reaches the preset adjustment temperature.

[0111] This application calculates the current temperature value of the light receiving component through the sampling value of the thermistor. The MCU obtains the target temperature value, sets the output voltage of the semiconductor cooler through the PID algorithm, and adjusts the temperature to near the target temperature value. When the difference between the current temperature and the target temperature value is within the preset threshold range, the maximum optical power of the light receiving component is found by stepping and fine-tuning the output voltage of the semiconductor cooler, and the output voltage of the thermoelectric drive circuit is maintained so that the optical power of the light receiving component remains at the maximum value, thereby improving the stability of the optical power of the light receiving component.

[0112] Fig.12 FIG. 1 is a schematic diagram of an MCU structure provided according to some embodiments of the present application. Fig.12 As shown, the MCU is provided with: a first input port, a second input port, a first output port, a comparison operation unit, a PID operation unit and a step operation unit.

[0113] The first input port is connected to the first analog-to-digital converter for receiving the first digital signal of the first analog-to-digital converter. The second input port is connected to the second analog-to-digital converter for receiving the second digital signal of the second analog-to-digital converter. The comparison operation unit is connected to the first analog-to-digital converter and the second analog-to-digital converter respectively, and the comparison operation unit is also connected to the PID operation unit and the step operation unit.

[0114] The comparison operation unit is provided with a preset wavelength-temperature relationship table, a preset optical power relationship table and a preset threshold range. The comparison operation unit receives the first digital signal output by the first analog-to-digital converter, and calculates the current temperature value of the optical receiving component according to the first digital signal; the comparison operation unit receives the second digital signal output by the second analog-to-digital converter, and calculates the current optical power of the optical receiving component according to the first digital signal. The comparison operation unit can also obtain the wavelength of the current channel, and calculate the target temperature value corresponding to the current channel according to the current channel wavelength and the preset wavelength-temperature relationship table.

[0115] The comparison operation unit calculates the difference between the target temperature value and the current temperature value, and selects to output the voltage signal to the first output pin or the second output pin according to the comparison between the difference and a preset threshold range.

[0116] For example, a first output pin is provided between the comparison operation unit and the step operation unit. When the difference between the target temperature value and the current temperature value is within a preset threshold range, the comparison operation unit outputs a first enable signal to enable the step operation unit to obtain the current optical power, the previous optical power, the target temperature value, and the current temperature value.

[0117] For example, the current optical power is the value of the current optical power of the light receiving component collected at a first time point; the previous optical power is the value of the current optical power of the light receiving component collected at a second time point; the first time point is the time point after a preset time period from the second time point.

[0118] The step operation unit adjusts the preset adjustment temperature by using a step feedback algorithm according to the current optical power and the previous optical power.

[0119] The step feedback algorithm includes: using an increasing or decreasing step adjustment method to set a preset adjustment temperature. If the current optical power is greater than the previous optical power, the preset adjustment temperature is set using the step adjustment method, and the current step direction is consistent with the previous step direction; if the current optical power is less than the previous optical power, the preset adjustment temperature is set using the step adjustment method, and the current step direction is opposite to the previous step direction.

[0120] In some embodiments, the preset adjustment temperature is set by using an increasing or decreasing step adjustment method, and the target temperature value can be increased by one step or decreased by one step.

[0121] For example: Add a step value to the target temperature value as the preset adjustment temperature. Transmit the preset adjustment temperature to the PID operation unit, and the PID operation unit outputs a voltage control value to control the semiconductor cooler. Obtain the current optical power. If the current optical power is greater than the previous optical power, add a step value to the target temperature value as the preset adjustment temperature; if the current optical power is less than the previous optical power, the target temperature value is reduced by a step value as the preset adjustment temperature. If the current optical power is equal to the previous optical power, the current temperature value is used as the preset adjustment temperature.

[0122] The target temperature value is reduced by one step value as the preset adjustment temperature. The preset adjustment temperature is transmitted to the PID operation unit, and the PID operation unit outputs a voltage control value to control the semiconductor cooler. The current optical power is obtained. If the current optical power is greater than the previous optical power, the target temperature value is reduced by one step value as the preset adjustment temperature; if the current optical power is less than the previous optical power, the target temperature value is increased by one step value as the preset adjustment temperature. If the current optical power is equal to the previous optical power, the current temperature value is used as the preset adjustment temperature.

[0123] When the difference between the target temperature value and the current temperature value is within the preset threshold range, the comparison operation unit outputs a control signal to the step operation unit, and the step operation unit reads the target temperature value, the current temperature value, the current optical power and the previous optical power, and calculates the difference between the current optical power and the previous optical power. When the current optical power is less than the previous optical power, the target temperature value is reduced by a step value as the preset adjustment temperature, and the step operation unit transmits the preset adjustment temperature to the PID operation unit. When the current optical power is greater than the previous optical power, the target temperature value is increased by a step value as the preset adjustment temperature, and the step operation unit transmits the preset adjustment temperature to the PID operation unit.

[0124] The stepping operation unit operates cyclically within the preset time period. If the current optical power is greater than the previous optical power, it means that the current adjustment makes the optical power increase, the adjustment direction is correct, and the current stepping direction is consistent with the previous stepping direction. If the current optical power is less than the previous optical power, it means that the current adjustment makes the optical power smaller, the adjustment direction is wrong, and the current stepping direction is opposite to the previous stepping direction, so that the optical power of the optical receiving component remains at the maximum value.

[0125] The output end of the stepping operation unit is connected to the PID operation unit. The stepping operation unit transmits the preset adjustment temperature to the PID operation unit. The PID operation unit performs proportional, differential and integral calculations on the preset adjustment temperature and the current temperature value to obtain a voltage control value.

[0126] A second output pin is provided between the comparison operation unit and the PID operation unit. When the difference between the target temperature value and the current temperature value is outside the preset threshold range, the comparison operation unit outputs the target temperature value to the PID operation unit. At this time, the target temperature value is the preset adjustment temperature, which is the target value of the PID operation unit. The PID operation unit performs proportional, differential, and integral calculations on the preset adjustment temperature and the current temperature value to obtain a voltage control value.

[0127] The PID operation unit is connected to the first output port, and the first output port is also connected to a digital-to-analog converter (DAC). The other end of the DAC is connected to the thermoelectric drive circuit, and the voltage control value output by the PID operation unit is converted into a voltage analog value by the DAC to control the thermoelectric drive circuit.

[0128] In some embodiments of the present application, the MCU may also be provided with a register, which is connected to the comparison operation unit and the step operation unit. The comparison operation unit writes the current temperature value, current optical power, and target temperature value obtained by operation into the register so that the step operation unit can read it.

[0129] In some embodiments of the present application, the step operation unit uses a step feedback algorithm to calculate the preset adjustment temperature.

[0130] This application calculates the current temperature value of the light receiving component through the sampling value of the thermistor. The MCU obtains the target temperature value, sets the output voltage of the semiconductor refrigerator through the PID feedback algorithm, and adjusts the temperature to near the target temperature value. When the difference between the current temperature and the target temperature value is within the preset threshold range, the step feedback algorithm is turned on to fine-tune the output voltage of the semiconductor refrigerator, and the maximum optical power of the light receiving component is found through RSSI feedback. The output voltage of the thermoelectric drive circuit is maintained so that the optical power of the light receiving component remains at the maximum value, thereby improving the stability of the optical power of the light receiving component.

[0131] Based on the optical module described in the above embodiment, the embodiment of the present disclosure also provides an optical module temperature control method, which collects the current temperature value and target temperature value of the optical receiving component, sets the output voltage of the semiconductor refrigerator through the PID feedback algorithm, and adjusts the temperature to near the target temperature value. When the difference between the current temperature and the target temperature value is within the preset threshold range, the step feedback algorithm is turned on to fine-tune the output voltage of the semiconductor refrigerator, and the maximum optical power of the optical receiving component is found through RSSI feedback, and the output voltage of the thermoelectric drive circuit is maintained, so that the temperature of the optical receiving component is at the preset adjustment temperature, so that the optical power of the optical receiving component is kept at the maximum value, thereby improving the stability of the optical power of the optical receiving component.

[0132] Fig.13 A schematic diagram of a method for controlling the temperature of an optical module according to some embodiments of the present application is shown in FIG. Fig.13 As shown, the optical module temperature control method provided in the embodiment of the present application includes:

[0133] S100: Acquire the current temperature value of the light receiving component.

[0134] The thermistor is located on one side of the filter, the MCU is connected to the thermistor, the MCU obtains a first digital signal from the thermistor, and calculates the current temperature value of the light receiving component according to the first digital signal and a preset temperature table.

[0135] The first digital-to-analog converter is connected to the thermistor, and the first digital-to-analog converter is also connected to the MCU. The first digital-to-analog converter converts the electrical signal of the thermistor into a first digital signal, and transmits the first digital signal to the MCU. The MCU calculates the current temperature value of the light receiving component according to the preset temperature table, and stores the current temperature value in the temperature change table.

[0136] The preset temperature table is a mapping relationship table between the first digital signal and the temperature value, and the current temperature value of the light receiving component can be calculated through the first digital signal.

[0137] S200: Obtain a target temperature value.

[0138] Obtaining the target temperature value may be obtaining the wavelength of the current channel, and calculating the target temperature value corresponding to the current channel according to a relationship table between the wavelength of the current channel and a preset wavelength temperature.

[0139] The preset wavelength-temperature relationship table is a mapping relationship table between channel wavelength and target temperature value.

[0140] The MCU obtains the current channel wavelength and calculates the target temperature value corresponding to the current channel according to the current channel wavelength and the preset wavelength temperature relationship table. The preset wavelength temperature relationship table is a mapping relationship table between the channel wavelength and the target temperature value.

[0141] S300: Obtain the optical power of the optical receiving component, and obtain the current optical power and the previous optical power.

[0142] A second analog-to-digital converter is provided between the MCU and the optical receiving chip. The optical receiving chip converts the optical power of the received first optical signal into a photocurrent, and the second analog-to-digital converter converts the photocurrent into a second digital value. The MCU is connected to the second analog-to-digital converter, and the MCU calculates the current optical power according to the second digital value and the preset optical power relationship table.

[0143] The MCU collects the current optical power in a polling manner at intervals of a preset time period and stores the optical power in the optical power information table. For example, at a certain time point, the optical power collected by the MCU is recorded as the current optical power, and the optical power collected between the preset time intervals at the time point is recorded as the previous optical power.

[0144] S400: When the difference between the target temperature value and the current temperature value is outside the preset threshold range, the target temperature value is used as the preset adjustment temperature.

[0145] For example, the preset threshold range includes: a high temperature limit and a low temperature limit, and the temperature value of the preset threshold range is greater than or equal to the low temperature limit, and less than or equal to the high temperature limit. For example, the high temperature limit is 0.5°C and the low temperature limit is -0.6°C, then -0.6≤preset threshold≤0.5.

[0146] When the difference between the target temperature value and the current temperature value is greater than the low temperature limit, or the difference between the target temperature value and the current temperature value is greater than the high temperature limit, the target temperature value is used as the preset adjustment temperature, input into the PID algorithm, and the control voltage value is calculated.

[0147] S500: When the difference between the target temperature value and the current temperature value is within a preset threshold range, a step feedback algorithm is used to adjust the preset adjustment temperature.

[0148] The preset adjustment temperature is set by increasing or decreasing step adjustment mode. If the current optical power is greater than the previous optical power, the preset adjustment temperature is set by step adjustment mode, and the current step direction is consistent with the previous step direction; if the current optical power is less than the previous optical power, the preset adjustment temperature is set by step adjustment mode, and the current step direction is opposite to the previous step direction.

[0149] When the difference between the target temperature value and the current temperature value is within a preset threshold range, a comparison is cyclically performed within a preset time to determine whether the current optical power is greater than the previous optical power.

[0150] Fig.14 FIG. 1 is a schematic diagram of a step feedback algorithm provided according to some embodiments of the present application. Fig.14 As shown, the difference between the target temperature value and the current temperature value in S500 is within the preset threshold range, and the step feedback algorithm is used to adjust the preset adjustment temperature, including:

[0151] S501: Setting a preset adjustment temperature by using an increasing or decreasing step adjustment method.

[0152] S502: Input the preset adjustment temperature into the PID algorithm.

[0153] S503: Obtain the current optical power to determine whether the current optical power is greater than the previous optical power.

[0154] S504: the current optical power is greater than the previous optical power, and the preset adjustment temperature is set by using the step adjustment method, and the current step direction is the same as the previous step direction; enter S502.

[0155] S505: The current optical power is less than the previous optical power, and the preset adjustment temperature is set by using a step adjustment method, and the step direction of this time is opposite to the previous step direction; enter S502.

[0156] S600: Input the preset adjustment temperature into the PID algorithm, and perform proportional, differential, and integral calculations on the preset adjustment temperature and the current temperature value to obtain a voltage control value.

[0157] The voltage control value is used to adjust the output voltage of the thermoelectric driving circuit so that the temperature of the light receiving component reaches a preset adjustment temperature.

[0158] This application calculates the current temperature value of the light receiving component through the sampling value of the thermistor. The MCU obtains the target temperature value, sets the output voltage of the semiconductor refrigerator through the PID feedback algorithm, and adjusts the temperature to near the target temperature value. When the difference between the current temperature and the target temperature value is within the preset threshold range, the step feedback algorithm is turned on to fine-tune the output voltage of the semiconductor refrigerator, and the maximum optical power of the light receiving component is found through step feedback. The output voltage of the thermoelectric drive circuit is maintained so that the optical power of the light receiving component remains at the maximum value, thereby improving the stability of the optical power of the light receiving component.

[0159] In some embodiments of the present application, the optical module temperature control method further includes: S700: when the difference between the target temperature value and the current temperature value is within a preset threshold range and the current optical power is equal to the previous optical power, the target temperature value is used as the preset adjustment temperature.

[0160] Since the above embodiments are all described by citing and combining with other embodiments, different embodiments have the same parts, and the same and similar parts between the embodiments in this specification can be referred to each other. No further detailed description is given here.

[0161] It should be noted that, in this specification, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such circuit structure, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the circuit structure, article or device including the element.

[0162] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure of the present application. The present application is intended to cover any variation, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the content of the claims.

[0163] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: A circuit board, wherein the circuit board is provided with an MCU; A light receiving component is electrically connected to the circuit board, and the light receiving component includes: Adjustable filter; A semiconductor refrigerator is thermally connected to the adjustable filter; A light receiving chip, receiving the light signal filtered by the adjustable filter; The MCU is electrically connected to the light receiving chip and the semiconductor refrigerator respectively; the MCU is configured as follows: The current temperature value is obtained, and according to the current temperature value, the output voltage of the semiconductor cooler is set by a PID algorithm so that the target temperature value and the current temperature value are within a preset threshold range; when the difference between the current temperature and the target temperature value is within the preset threshold range, the current optical power is obtained, and the output voltage of the semiconductor cooler is adjusted by a feedback algorithm so that the current optical power value is greater than the previous optical power.

2. The optical module according to claim 1, characterized in that: The MCU includes: The PID operation unit performs proportional, differential and integral calculations based on the preset adjustment temperature and the current temperature value to obtain the voltage control value; A comparison operation unit is electrically connected to the thermistor and the light receiving chip, and is used to receive the sampling value of the thermistor, receive the voltage value of the light receiving chip, and calculate the current temperature value according to the sampling value of the thermistor, and calculate the current optical power according to the voltage value of the light receiving chip; the comparison operation unit is also used to obtain a target temperature value, and when the difference between the target temperature value and the current temperature value is outside a preset threshold range, the target temperature value is output as a preset adjustment temperature to the PID operation unit; when the difference between the target temperature value and the current temperature value is within a preset threshold range, an enable signal is output to start the step operation unit to run; A step operation unit is connected to the comparison operation unit and the PID operation unit, and the step operation unit is configured to use a feedback algorithm to adjust the preset adjustment temperature. The feedback algorithm includes: setting the preset adjustment temperature by using an increasing or decreasing step adjustment method; if the current optical power is greater than the previous optical power, setting the preset adjustment temperature by using a step adjustment method, and the current step direction is consistent with the previous step direction; if the current optical power is less than the previous optical power, setting the preset adjustment temperature by using a step adjustment method, and the current step direction is opposite to the previous step direction.

3. The optical module according to claim 1, characterized in that: The circuit board is provided with a first analog-to-digital converter, a second analog-to-digital converter, a digital-to-analog converter and a thermoelectric driving circuit; The first analog-to-digital converter is located between the MCU and the thermistor; The second analog-to-digital converter is located between the MCU and the optical receiving chip; The digital-to-analog converter is located between the thermoelectric driving circuit and the MCU.

4. The optical module according to claim 2, characterized in that: The step operation unit is further configured to output the current temperature value as the preset adjustment temperature to the PID operation unit when the current optical power is equal to the previous optical power.

5. The optical module according to claim 2, characterized in that: The MCU further includes a register, which is connected to the comparison operation unit and the step operation unit, and is configured to store the current temperature value, the target temperature value, and the current optical power.

6. An optical module, characterized in that: include: A circuit board, wherein the circuit board is provided with an MCU; A light receiving component is electrically connected to the circuit board, and the light receiving component includes: Adjustable filter; A semiconductor refrigerator is thermally connected to the adjustable filter; a thermistor, adjacent to the tunable filter; A light receiving chip, receiving the light signal filtered by the adjustable filter; The MCU is electrically connected to the light receiving chip, the semiconductor refrigerator, and the thermistor respectively; the MCU is configured as follows: The sampling value of the thermistor is obtained, and the current temperature value is calculated according to the sampling value of the thermistor; the output voltage of the semiconductor refrigerator is set by the PID algorithm so that the target temperature value and the current temperature value are within the preset threshold range; when the difference between the current temperature and the target temperature value is within the preset threshold range, the current optical power is obtained, the preset adjustment temperature is adjusted to be greater than the current temperature, and the output voltage of the semiconductor refrigerator is set with the preset adjustment temperature as the target temperature; the current optical power is obtained again, and the optical power obtained last time is used as the previous optical power. If the current optical power is greater than the previous optical power, the preset adjustment temperature is adjusted to increase; if the current optical power is less than the previous optical power, the preset adjustment temperature is adjusted to decrease.

7. A method for controlling the temperature of an optical module, characterized in that: include: Obtain the current temperature value of the light receiving component; Get the target temperature value; Obtain the optical power of the optical receiving component, and obtain the current optical power and the previous optical power; When the difference between the target temperature value and the current temperature value is outside the preset threshold range, the target temperature value is used as the preset adjustment temperature; The difference between the target temperature value and the current temperature value is within a preset threshold range, and a feedback algorithm is used to adjust the preset adjustment temperature so that the current optical power is greater than the previous optical power; The preset adjustment temperature is input into the PID algorithm, and the voltage control value is obtained by performing proportional, differential and integral calculations on the preset adjustment temperature and the current temperature value.

8. The optical module temperature control method according to claim 7, characterized in that: The obtaining of the target temperature value comprises: Get the current channel wavelength, and calculate the target temperature value corresponding to the current channel according to the relationship table between the current channel wavelength and the preset wavelength temperature.

9. The optical module temperature control method according to claim 7, characterized in that: The method of adjusting the preset adjustment temperature by using a feedback algorithm includes: setting the preset adjustment temperature by using an increasing or decreasing step adjustment method; if the current optical power is greater than the previous optical power, setting the preset adjustment temperature by using a step adjustment method, and the current step direction is consistent with the previous step direction; if the current optical power is less than the previous optical power, setting the preset adjustment temperature by using a step adjustment method, and the current step direction is opposite to the previous step direction.

10. The optical module temperature control method according to claim 7, characterized in that: The current optical power is the value of the current optical power of the light receiving component collected at the first time point; The previous optical power is the value of the current optical power of the light receiving component collected at the second time point; The first time point is a time point after a preset time period from the second time point.

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