Packaging piece, electronic device and computer equipment

Abstract

The invention relates to a packaging part, an electronic device and computer equipment. The packaging piece comprises a connecting layer structure and at least one functional module. The connection layer structure comprises a wiring layer and an optical connection layer, and the optical connection layer comprises at least one first optical channel. The at least one functional module is located on one side of the connecting layer structure and connected with the wiring layer, and the functional module is used for achieving a preset function and conducting photoelectric conversion. Moreover, one end of the first optical channel is connected with one functional module, and the other end of the first optical channel is used for connecting an optical interface or another functional module. According to the invention, the stability and reliability of signal transmission can be effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuits, and in particular to a package, an electronic device and a computer device. Background Art

[0002] A plurality of functional modules may be formed in the package, and each functional module or a functional module and an external device may be connected to each other to realize corresponding functions.

[0003] However, conventional packaging components are prone to poor reliability. Summary of the invention

[0004] Based on this, the present application provides a package, an electronic device and a computer device capable of improving reliability.

[0005] A package, comprising:

[0006] A connection layer structure, comprising a wiring layer and an optical connection layer, wherein the optical connection layer comprises at least one first optical channel;

[0007] At least one functional module, located on one side of the connection layer structure and connected to the wiring layer, the functional module is used to realize a preset function and to perform photoelectric conversion;

[0008] Furthermore, one end of the first optical channel is connected to one of the functional modules, and the other end of the first optical channel is used to connect to an optical interface or another functional module.

[0009] In one of the embodiments, the optical connection layer further includes a second optical channel, wherein the second optical channel is used to connect the optical interface or the functional module, and the same second optical channel is connected to at least one of the first optical channels.

[0010] In one embodiment, a plurality of the first optical channels surround and are connected to the same second optical channel.

[0011] In one embodiment, the second light channel is ring-shaped.

[0012] In one embodiment, the second optical channel includes an optical input channel and / or an optical output channel, the optical input channel is connected to the optical input end of the functional module through the first optical channel, and the optical output channel is connected to the optical output end of the functional module through the first optical channel.

[0013] In one embodiment, the package further includes conductive terminals, the conductive terminals include input terminals and / or output terminals, the input terminals are electrically connected to the electrical input end of the functional module, and the output terminals are electrically connected to the electrical output end of the functional module.

[0014] In one embodiment, the connection layer structure further includes a plurality of organic medium layers, and the wiring layer and the optical connection layer are located in the organic medium layers.

[0015] In one embodiment, the connection layer structure includes an interposer structure, the interposer structure includes an interposer substrate and the wiring layer, the wiring layer is located on one side of the interposer substrate; the functional module is located on a side of the wiring layer away from the interposer substrate, and the optical connection layer and the wiring layer are located on the same side of the interposer substrate.

[0016] An electronic device, comprising:

[0017] At least one package as described above;

[0018] At least one optical interface is connected to the first optical channel.

[0019] A computer device comprising:

[0020] Electronic devices such as those described above;

[0021] An external device is connected to the optical interface.

[0022] The above-mentioned package, electronic device and computer equipment, the connection layer structure includes a wiring layer and an optical connection layer. The functional module is used to realize the preset function and to perform photoelectric conversion. One end of the first optical channel of the optical connection layer is connected to the corresponding functional module, and the other end is used to connect the optical interface or another functional module, so that data can be output through an optical signal, or a command can be input through an optical signal, or a signal can be transmitted between two functional modules through an optical signal. Since the optical signal has a high stability and is not prone to short circuit or open circuit, the present application can effectively improve the stability and reliability of signal transmission by building an optical connection layer into the package, and can reduce the loss of the functional realization capability of the package (such as computing power or storage capacity). At the same time, the optical signal transmission rate is faster, which can effectively improve the signal transmission rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 is a partial top view schematic diagram of a package provided in an embodiment;

[0025] Figure 2is a partial cross-sectional schematic diagram of a connecting layer structure provided in an embodiment;

[0026] Figure 3 is a module block diagram of an electronic device provided in an embodiment;

[0027] Figure 4 A module block diagram of a computer device provided in one embodiment.

[0028] Description of reference numerals:

[0029] 100 - connection layer structure, 110 - wiring layer, 120 - optical connection layer, 121 - first optical channel, 122 - second optical channel, 130 - intermediate layer substrate, 200 - functional module, 210 - chip, 10 - electronic device, 11 - packaging, 12 - optical interface, 20 - external device. DETAILED DESCRIPTION

[0030] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0032] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers, doping types and / or parts, these elements, components, regions, layers, doping types and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer, doping type or part from another element, component, region, layer, doping type or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer, doping type or part discussed below can be represented as a second element, component, region, layer or part.

[0033] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0034] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, in this specification, the term "and / or" includes any and all combinations of the relevant listed items.

[0035] As mentioned in the background art, traditional packages are prone to poor reliability. The inventors have found that the reason for the poor reliability is that traditional functional modules or functional modules and external devices are connected through conductive lines. Conductive lines are prone to short circuits or open circuits, which leads to reliability problems in packages.

[0036] Based on this, the present application provides a package, an electronic device and a computer device.

[0037] In one embodiment, see Figure 1 as well as Figure 2 , a package 11 is provided. The package 11 includes a connection layer structure 100 and a functional module 200 .

[0038] The connection layer structure 100 includes a wiring layer 110. Specifically, the connection layer structure 100 may include multiple interconnected wiring layers 110. At the same time, the connection layer structure 100 also includes an optical connection layer 120. The optical connection layer 120 is a structural layer that can be used for optical signal transmission. The optical connection layer 120 includes at least one first optical channel 121.

[0039] The functional module 200 can implement a preset function. Exemplarily, the functional module 200 can include a computing module, a storage module, etc. Accordingly, the preset function can include a computing function, a storage function, etc. The computing module can implement a computing function. The storage module can implement a storage function.

[0040] The functional module 200 is located on one side of the connection layer structure 100 and is connected to the wiring layer 110. The same functional module 200 may include multiple chips 210, and each chip 210 may be conductively connected through the wiring layer 110. The number of functional modules 200 is at least one. Alternatively, one functional module 200 may represent one chip 210, which may be specifically set according to actual needs.

[0041] The functional module 200 can also perform photoelectric conversion, so that an optical signal can be transmitted. Exemplarily, the functional module 200 can include a computing module. The computing module includes a computing unit and a photoelectric conversion unit. The computing unit can include multiple electrical chips 210 to perform calculations. The photoelectric conversion unit can include an optical chip 210 to achieve mutual conversion between electrical signals and optical signals.

[0042] As an example, one end of the first optical channel 121 may be connected to the functional module 200, and the other end may be used to connect to the optical interface 12, and further transmit optical signals to the external device 20. At this time, the functional module 200 and the first optical channel 121 may be arranged correspondingly.

[0043] Specifically, the optical interface 12 may include an optical output interface, an optical input interface, or both, wherein the optical output interface may be used to output data, and the optical output interface may be used to input commands.

[0044] The functional module 200 may output data through the first optical channel 121 and the optical interface 12 or input commands through the first optical channel 121 and the optical interface 12 .

[0045] As another example, one end of the first optical channel 121 may be connected to one functional module 200, and the other end may be connected to another functional module 200. That is, the first optical channel 121 may optically connect the functional modules 200 to each other.

[0046] In addition, the package 11 may further include an encapsulation layer. The encapsulation layer may cover each functional module 200, thereby encapsulating and protecting each functional module 200. The material of the encapsulation layer may include, but is not limited to, epoxy molding compound (EMC) and the like.

[0047] In the package 11 of this embodiment, the connection layer structure 100 includes a wiring layer 110 and an optical connection layer 120. The functional module 200 is used to realize the preset function and to perform photoelectric conversion. One end of the first optical channel 121 of the optical connection layer 120 is connected to the corresponding functional module 200, and the other end is used to connect the optical interface 12 or another functional module 200, so that data can be output through an optical signal, or a command can be input through an optical signal, or a signal can be transmitted between two functional modules 200 through an optical signal. The optical signal has high stability and is not prone to short circuit or open circuit. Therefore, this embodiment can effectively improve the stability and reliability of signal transmission by building an optical connection layer 120 in the package 11, and can reduce the loss of the functional realization capability (such as computing power or storage capacity) of the package 11. At the same time, the optical signal transmission rate is faster, which can effectively improve the signal transmission rate.

[0048] In one embodiment, the optical connection layer 120 further includes a second optical channel 122 .

[0049] As an example, the second optical channel 122 is used to connect the optical interface 12 , and the same second optical channel 122 is connected to at least one first optical channel 121 , so that the other end of the first optical channel 121 can be connected to the optical interface 12 through the second optical channel.

[0050] All first optical channels 121 may be connected to the same second optical channel 122 , so that all functional modules 200 are connected to the optical interface 12 through the same second optical channel 122 , thereby saving packaging area.

[0051] Alternatively, part of the first optical channels 121 may be connected to the same second optical channel 122 , so that part of the functional modules 200 are connected to the optical interface 12 through the same second optical channel 122 , thereby saving packaging area.

[0052] Alternatively, the first optical channel 121 and the second optical channel 122 may be connected in a one-to-one correspondence, so that each functional module 200 is connected to the corresponding optical interface 12 through the corresponding second optical channel 122, so that each functional module 200 can be independently controlled.

[0053] As another example, the second optical channel 122 is used to connect the functional modules 200. Specifically, the first optical channel 121 connecting at least two functional modules 200 can be connected to the same second optical channel 122, so that the at least two functional modules 200 are optically connected through the second optical channel 122.

[0054] In this embodiment, by providing the second optical channel 122 , the connection mode between the functional module 200 and the optical interface 12 or the connection mode between the functional modules 200 can be made more flexible.

[0055] In one embodiment, a plurality of first optical channels 121 surround and are connected to the same second optical channel 122 .

[0056] At this time, the same second optical channel 122 is connected to a plurality of first optical channels 121 , thereby also saving packaging area.

[0057] At the same time, when the second optical channel 122 is used to connect the optical interface 12, the second optical channel 122 is surrounded by the multiple first optical channels 121 connected thereto, so that the distance between the second optical channel 122 and each first optical channel 121 connected thereto is close, so that the signal transmission time between the external device 20 and each functional module 200 is more uniform. In addition, it can prevent the lengths of each first optical channel 121 from being different, and some first optical channels 121 from being too long and easily damaged.

[0058] In one embodiment, a plurality of first light channels 121 surround and are connected to the same second light channel 122 , and the second light channel 122 is ring-shaped.

[0059] At this time, on the one hand, the distance between the second optical channel 122 and each first optical channel 121 connected thereto can be made closer, and on the other hand, the transmission path between the functional module 200 and the optical interface 12 or between the functional modules 200 can be increased, thereby further improving the signal stability and reliability.

[0060] Specifically, the annular second optical channel 122 can provide two optical transmission paths between the first optical channel 121 and the optical interface 12 (the optical interface 12 can be connected to a portion of the second optical channel 122) or another first optical channel 121, that is, the optical signal on the first optical channel 121 can be transmitted along both sides after being transmitted to the second optical channel 122. Therefore, even if the second optical channel 122 in one of the optical transmission paths is damaged, the optical signal on the first optical channel 121 can be transmitted along the other optical transmission path, thereby further improving the signal stability and reliability.

[0061] Of course, in other embodiments, when a plurality of first light channels 121 surround and connect to the same second light channel 122, the second light channel 122 may be in other forms (such as a straight line), which is not limited in the present application.

[0062] In one embodiment, the second optical channel 122 is used to connect to the optical interface 12 and includes an optical input channel and / or an optical output channel.

[0063] The optical input channel is used to connect the optical input interface, and the optical input channel is connected to the optical input end of the functional module 200 through the first optical channel 121 , so as to input commands to the functional module 200 .

[0064] The optical output channel is used to connect the optical output interface, and the optical output channel is connected to the optical output end of the functional module 200 through the first optical channel 121, so as to output the data of the functional module 200.

[0065] In one embodiment, the package 11 further includes a conductive terminal. The conductive terminal includes an input terminal and / or an output terminal.

[0066] The input terminal is electrically connected to the electrical input end of the functional module 200, thereby inputting a command to the functional module 200. Specifically, the input terminal can be electrically connected to the electrical input end of the functional module 200 through a conductive line. Exemplarily, the same input terminal can be connected to multiple functional modules 200, thereby facilitating connection.

[0067] The output terminal is electrically connected to the electrical output end of the functional module 200, thereby outputting data of the functional module 200. Specifically, the output terminal can be electrically connected to the electrical output end of the functional module 200 through a conductive line. Exemplarily, the same output terminal can be connected to multiple functional modules 200, thereby facilitating connection.

[0068] As an example, the second optical channel 122 may be configured to include an optical input channel and an optical output channel, and the conductive terminal may be configured to include an input terminal and an output terminal.

[0069] At this time, whether it is the input end or the output end of the functional module 200, even if the conductive line between the conductive terminal and the functional module 200 is disconnected, the signal can be transmitted through the optical signal. Alternatively, when there is a problem with the optical signal output path, it can also be transmitted through the electrical signal transmission path. Therefore, at this time, it can be ensured that the functional module 200 and the external device 20 can effectively transmit signals, thereby further improving the reliability of signal transmission.

[0070] Of course, in other examples, the second optical channel 122 may be configured to include an optical output channel, and the conductive terminal may be configured to include an input terminal, so that the input end of the functional module 200 inputs commands through electrical signals, and the output end outputs data through optical signals. Alternatively, the second optical channel 122 may be configured to include an optical input channel, and the conductive terminal may be configured to include an output terminal, so that the input end of the functional module 200 inputs commands through optical signals, and the output end outputs data through electrical signals. The specific configuration may be based on actual needs.

[0071] In one embodiment, the connection layer structure 100 further includes a plurality of organic dielectric layers. The material of the organic dielectric layer may include but is not limited to polyimide (PI) and the like.

[0072] The wiring layer 110 and the optical connection layer 120 are located in the organic dielectric layer.

[0073] Specifically, an organic dielectric layer may be formed by coating, and then a first opening may be formed in the organic dielectric layer. A conductive material may be formed in the first opening by electroplating to form a wiring layer. Multiple wiring layers 110 may be formed in multiple organic dielectric layers.

[0074] At the same time, a second opening may be formed in at least one organic medium layer, and the second opening may be filled with a light-guiding material (such as silicon dioxide) to form an optical connection layer 120 .

[0075] The optical connection layer 120 and the wiring layer 110 may be formed in different organic dielectric layers, respectively. Alternatively, for some organic dielectric layers, both the wiring layer 110 and the optical connection layer 120 may be formed therein.

[0076] In one embodiment, the connection layer structure 100 includes an interposer structure.

[0077] The interposer structure includes an interposer substrate 130 and a wiring layer 110 .

[0078] As an example, the interposer substrate 130 includes a silicon wafer. In this case, the interposer structure may include a silicon interposer.

[0079] The wiring layer 110 is located on one side of the interposer substrate 130. The functional module 200 is located on the side of the wiring layer 110 away from the interposer substrate 130. Exemplarily, the chip 210 in the functional module 200 can be mounted to the interposer structure by surface mount mounting or hybrid bonding.

[0080] In this embodiment, the connection layer structure 100 includes an interposer structure. The interposer technology can realize a wiring layer 110 with a high degree of integration. Thus, the circuit integration of the package 11 can be improved through the interposer structure. In addition, when the interposer structure is a silicon interposer, since silicon has relatively good heat dissipation, the heat dissipation of the product can also be effectively improved.

[0081] In one embodiment, the wiring layer 110 and the optical connection layer 120 are located on the same side of the interposer substrate 130 .

[0082] Specifically, the connection layer structure 100 includes a plurality of wiring layers 110. The optical connection layer 120 is located at the same layer as one or more of the wiring layers 110, so that the thickness of the connection layer structure 100 does not need to be increased, thereby facilitating the improvement of integration. Alternatively, an optical connection layer 120 that is a different layer from the wiring layer 110 may be provided on the side of the interposer substrate 130 where the wiring layer 110 is provided, so as not to affect the circuit arrangement of the wiring layer 110.

[0083] The chip 210 in the functional module 200 is mounted on the side of the interposer substrate 130 where the wiring layer 110 is provided. Therefore, by arranging the wiring layer 110 and the optical connection layer 120 on the same side of the interposer substrate 130, it is convenient to connect the functional module 200 with the first optical channel 121 of the optical connection layer 120. The connection method between the functional module 200 and the first optical channel 121 may include, but is not limited to, connection through optical fibers and the like.

[0084] Of course, in other embodiments, the optical connection layer 120 and the wiring layer 110 may also be located on two opposite sides of the intermediate layer substrate 130, respectively. This is not limited here.

[0085] In one embodiment, see Figure 3 , an electronic device 10 is also provided, which includes at least one package 11 as any one of the above items and at least one optical interface 12. Exemplarily, the electronic device 10 may include a calculator or a memory.

[0086] When the number of packages 11 is greater than one, the packages 11 may be arranged in parallel, thereby improving the performance of the electronic device 10 , such as improving computing power or storage capacity.

[0087] The optical interface 12 is connected to the first optical channel 121, so that optical signals are transmitted between the first optical channel 121 and the functional module 200. Exemplarily, the optical interface 12 can be connected to the first optical channel 121 through the second optical channel 122. Exemplarily, the optical interface 12 and the second optical channel 122 can be connected through an optical fiber or the like. Exemplarily, multiple packages 11 can be connected to the same optical interface 12. Or, exemplarily, different packages 11 can be connected to different optical interfaces 12.

[0088] In one embodiment, see Figure 4 , a computer device is also provided, which includes an external device 20 and the above electronic device 10. The external device 20 is connected to the optical interface 12, so that optical signals can be transmitted between the external device 20 and the functional module 200 in the package 11.

[0089] The external device 20 may include an input device and / or an output device. The input device may include but is not limited to a controller, etc. The output device may include but is not limited to a processor, etc.

[0090] In addition, as an example, the computer device may also include a display, etc. The display may be connected to a processor, etc., so as to display data or perform corresponding image display according to the data, etc.

[0091] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0092] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0093] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A package, characterized in that: include: A connection layer structure, comprising a wiring layer and an optical connection layer, wherein the optical connection layer comprises at least one first optical channel; At least one functional module, located on one side of the connection layer structure and connected to the wiring layer, the functional module is used to realize a preset function and to perform photoelectric conversion; Furthermore, one end of the first optical channel is connected to one of the functional modules, and the other end of the first optical channel is used to connect to an optical interface or another functional module.

2. The package according to claim 1, characterized in that The optical connection layer also includes a second optical channel, where the second optical channel is used to connect the optical interface or the functional module, and the same second optical channel is connected to at least one of the first optical channels.

3. The package according to claim 2, characterized in that A plurality of the first optical channels surround and are connected to the same second optical channel.

4. The package according to claim 2, characterized in that: The second optical channel is ring-shaped.

5. The package according to claim 2, characterized in that: The second optical channel is used to connect the optical interface and includes an optical input channel and / or an optical output channel. The optical input channel is connected to the optical input end of the functional module through the first optical channel, and the optical output channel is connected to the optical output end of the functional module through the first optical channel.

6. The package according to claim 5, characterized in that The package further includes conductive terminals, which include input terminals and / or output terminals. The input terminal is electrically connected to an electrical input end of the functional module, and the output terminal is electrically connected to an electrical output end of the functional module.

7. The package according to claim 1, characterized in that The connection layer structure further includes a plurality of organic medium layers, and the wiring layer and the optical connection layer are located in the organic medium layers.

8. The package according to claim 1, characterized in that The connection layer structure includes an interposer structure, which includes an interposer substrate and the wiring layer, wherein the wiring layer is located on one side of the interposer substrate; the functional module is located on a side of the wiring layer away from the interposer substrate, and the optical connection layer and the wiring layer are located on the same side of the interposer substrate.

9. An electronic device, characterized in that: include: At least one package according to any one of claims 1 to 8; At least one optical interface is connected to the first optical channel.

10. A computer device, characterized in that: include: The electronic device according to claim 9; An external device is connected to the optical interface.

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