Temperature control system and temperature control method
通过在温度控制系统中引入蓄热器和过冷储液器,解决了现有温控设备升降温等待时间长的问题,实现了快速升降温,提升了生产效率并降低了成本。
Patent Information
- Application Number
- CN202411665486.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2044-11-20
AI Technical Summary
The existing temperature control equipment has a long wait time during the cooling process, which affects production efficiency.
A temperature control system is designed, including a refrigeration device and a circulation device. The refrigerant is supercooled by storing heating energy through a heat storage device and supercooling reservoir to regulate the temperature of the circulating liquid to achieve rapid cooling.
Without increasing the power of the compressor, condenser and evaporator, the waiting time for cooling is reduced, production efficiency is improved, energy saving is saved, equipment production costs are reduced, and equipment production costs are reduced, which is conducive to the miniaturization of equipment.
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Figure CN119512268A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of control technology, and in particular to a temperature control system and a temperature control method. Background Art
[0002] As an important equipment in the manufacturing process of semiconductor integrated circuits, semiconductor temperature control devices are required to provide the required temperature output in the etching process of integrated circuit manufacturing to control the temperature of the etching equipment process chamber. In actual use, semiconductor temperature control devices accurately control the temperature through cooling and heating links. The etching equipment process chamber requires different temperatures throughout the entire process to meet the production process. Generally, the temperature is switched periodically between -20°C and 90°C. This requires the semiconductor temperature control device to switch different temperatures according to process needs. When the process chamber temperature reaches the target value, the corresponding process production can be carried out. Waiting time will occur during the temperature rise and fall process. The traditional temperature control device has a long waiting time when switching from high temperature to low temperature, or from low temperature to high temperature, which affects the production efficiency. Summary of the invention
[0003] In view of this, the purpose of the present application is to provide a temperature control system and a temperature control method to solve the problem that the existing temperature control equipment has a long waiting time for temperature increase and decrease, which affects production efficiency.
[0004] The embodiment of the present application provides a temperature control system, the system comprising a refrigeration device and a circulation device; the refrigeration device comprises a compressor, a heat storage device, a condenser, an evaporator and a supercooling liquid storage device;
[0005] The outlet end of the first heat exchange channel in the evaporator is connected to the inlet end of the compressor; the outlet end of the compressor includes two paths, the first path is connected to the inlet end of the first heat exchange channel in the heat accumulator, and the second path and the outlet end of the first heat exchange channel in the heat accumulator are connected together to the inlet end of the second heat exchange channel in the condenser and the inlet end of the first heat exchange channel in the evaporator;
[0006] The outlet end of the second heat exchange channel in the condenser is connected to the inlet end of the supercooling liquid reservoir, and the outlet end of the supercooling liquid reservoir is connected to the inlet end of the first heat exchange channel in the evaporator;
[0007] The outlet end of the second heat exchange channel in the evaporator is connected to the inlet end of the circulation device, and the outlet end of the circulation device includes two paths, the first path is connected to the inlet end of the second heat exchange channel in the heat accumulator, and the second path and the outlet end of the second heat exchange channel in the heat accumulator are connected together to the inlet end of the second heat exchange channel in the evaporator;
[0008] The heat accumulator stores heating energy, and the supercooling liquid storage device supercools and stores the refrigerant; the temperature of the circulating liquid is adjusted by controlling the refrigerant in the refrigeration device to increase or decrease the temperature in each component of the refrigeration device and to perform heat exchange with the circulating liquid in the circulation device in the heat accumulator and / or the evaporator, so that the circulating liquid can control the temperature of the load equipment.
[0009] Further, the circulation device includes a water tank, a water pump and a heater;
[0010] The inlet end of the water tank serves as the inlet end of the circulation device, the outlet end of the water tank is connected to the inlet end of the water pump, the outlet end of the water pump is connected to the inlet end of the heater, the outlet end of the heater is connected to the liquid inlet corresponding to the load device, and the liquid outlet corresponding to the load device serves as the outlet end of the circulation device.
[0011] Furthermore, the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the external cooling pipeline of the supercooling liquid reservoir, and the outlet end of the external cooling pipeline is connected to the inlet end of the compressor;
[0012] Wherein, the external cooling pipeline is arranged outside the liquid storage space in the supercooling liquid storage device, and is used to cool the coolant stored in the liquid storage space.
[0013] Furthermore, the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the first heat exchange channel in the evaporator.
[0014] The embodiment of the present application also provides a temperature control method, which is applied to a temperature control system; the temperature control system includes a refrigeration device and a circulation device; the refrigeration device includes a compressor, a heat accumulator, a condenser, an evaporator, a supercooling liquid storage device and a plurality of valves; the circulation device includes a plurality of circulation valves; the heat accumulator stores heating energy, and the supercooling liquid storage device performs supercooling treatment on the refrigerant and stores it; the method includes:
[0015] According to the temperature adjustment instruction received from the load device, each valve in the temperature control system is controlled so that the refrigerant in the refrigeration device is heated and cooled in each component of the temperature control system and exchanges heat with the circulating fluid in the circulation device in the heat accumulator and / or the evaporator to adjust the temperature of the circulating fluid so that the circulating fluid controls the temperature of the load device.
[0016] Furthermore, the multiple valves in the refrigeration device include a first valve, a second valve, a third valve, a fourth valve, a fifth valve and a sixth valve; the first path at the outlet of the compressor is connected to the inlet of the first heat exchange channel in the heat accumulator through the first valve; the second path at the outlet of the compressor is connected to the outlet of the first heat exchange channel in the heat accumulator through the second valve, and is connected to the inlet of the first heat exchange channel in the evaporator through the third valve; the outlet of the subcooled liquid storage device is connected to the inlet of the first heat exchange channel in the evaporator through the fourth ...condenser through the fourth valve. The outlet end of the second heat exchange channel is connected to the inlet end of the external cooling pipeline of the supercooling liquid storage device through the fifth valve; the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the first heat exchange channel in the evaporator through the sixth valve; the multiple circulation valves in the circulation device include a first circulation valve and a second circulation valve; the first path of the outlet end of the circulation device is connected to the inlet end of the second heat exchange channel in the heat accumulator through the first circulation valve, and the second path is connected to the inlet end of the second heat exchange channel in the evaporator through the second circulation valve and the outlet end of the second heat exchange channel in the heat accumulator;
[0017] The step of controlling each valve in the temperature control system according to the received temperature adjustment instruction of the load device comprises:
[0018] When the temperature adjustment instruction is a temperature increase instruction, the first valve, the fourth valve, the second circulation valve and the sixth valve are closed, and the second valve, the third valve and the first circulation valve are opened;
[0019] When it is determined that the temperature of the circulating fluid rises to meet a preset condition, the first circulating valve is closed and the second circulating valve is opened.
[0020] Further, it is determined that the temperature of the circulating fluid rises to meet the preset condition by the following method:
[0021] Collecting a first circulating liquid temperature at an outlet of the circulating device and a second circulating temperature at an outlet of a second heat exchange channel in the heat accumulator;
[0022] determining a temperature difference between the second circulating fluid temperature and the first circulating fluid temperature;
[0023] If the temperature difference is less than a preset threshold, it is determined that the temperature of the circulating fluid has increased to meet a preset condition.
[0024] Furthermore, the step of controlling each valve in the temperature control system according to the received temperature adjustment instruction of the load device includes:
[0025] When the temperature adjustment instruction is a temperature reduction instruction, the second valve, the third valve, the first circulation valve and the sixth valve are closed, and the first valve, the second circulation valve and the fourth valve are opened.
[0026] Furthermore, before controlling each valve in the temperature control system according to the received temperature adjustment instruction of the load device, the method further includes:
[0027] After the temperature control system is started, it enters a temperature control preparation phase and lasts for a predetermined period of time, so that the heat accumulator stores heating energy and the supercooling liquid storage device performs supercooling treatment on the refrigerant and stores it;
[0028] Among them, in the temperature control preparation stage, the second valve, the third valve, the first circulation valve and the fourth valve are closed, and the first valve and the second circulation valve are opened; the actual value in the temperature control system is collected, and the opening of the fifth valve and the sixth valve is adjusted according to the difference between the actual value and the set value.
[0029] Further, collecting the actual value in the temperature control system, and adjusting the opening of the fifth valve and the sixth valve according to the difference between the actual value and the set value, comprises:
[0030] Collecting a first refrigeration temperature at the inlet end of the compressor, a first refrigeration pressure at the outlet end of the first heat exchange channel in the evaporator, and a third circulation temperature at the outlet end of the second heat exchange channel in the evaporator;
[0031] determining a superheat difference between an actual superheat value and a preset superheat value according to the first refrigeration temperature and the first refrigeration pressure;
[0032] Determining a temperature difference between the third cycle temperature and a preset temperature value;
[0033] adjusting the opening of the fifth valve according to the superheat difference;
[0034] The opening of the sixth valve is adjusted according to the temperature difference.
[0035] An embodiment of the present application also provides an electronic device, comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and when the machine-readable instructions are executed by the processor, the steps of the temperature control method as described above are performed.
[0036] An embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the temperature control method as described above are executed.
[0037] The embodiment of the present application provides a temperature control system and a temperature control method, wherein the heat accumulator stores heating energy, and the heat accumulator can be used to increase the temperature during the heating process to increase the heating speed; the supercooling liquid storage device supercools and stores the refrigerant, and the supercooling liquid storage device can be used to reduce the temperature during the cooling process to increase the cooling speed. In this way, the waiting time for heating and cooling can be reduced without increasing the power of the compressor, condenser, and evaporator, thereby improving production efficiency, saving energy and reducing consumption, reducing equipment production costs, and facilitating equipment miniaturization.
[0038] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0040] Figure 1 A schematic diagram of the structure of a temperature control system provided in an embodiment of the present application is shown;
[0041] Figure 2 A flow chart of a temperature control method provided in an embodiment of the present application is shown;
[0042] Figure 3 A schematic structural diagram of an electronic device provided in an embodiment of the present application is shown. DETAILED DESCRIPTION
[0043] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application usually described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, each other embodiment obtained by those skilled in the art without making creative work belongs to the scope of protection of the present application.
[0044] Research has found that semiconductor temperature control devices, as important equipment in the manufacturing process of semiconductor integrated circuits, are required to provide the required temperature output in the etching process of integrated circuit manufacturing to control the temperature of the etching equipment process chamber. In actual use, semiconductor temperature control devices accurately control the temperature through cooling and heating links. The etching equipment process chamber requires different temperatures throughout the entire process to meet the production process. Generally, the temperature is switched periodically between -20°C and 90°C. This requires the semiconductor temperature control device to switch different temperatures according to process needs. Only when the process chamber temperature reaches the target value can the corresponding process production be carried out. Waiting time will occur during the temperature rise and fall process. The traditional temperature control device has a long waiting time when switching from high temperature to low temperature, or from low temperature to high temperature, which affects production efficiency.
[0045] Based on this, an embodiment of the present application provides a temperature control system to solve the problem that the waiting time for heating and cooling is long in the existing temperature control equipment, which affects the production efficiency.
[0046] See also Figure 1 , Figure 1 This is a schematic diagram of a temperature control system provided in an embodiment of the present application. Figure 1 As shown in , the temperature control system provided by the embodiment of the present application includes a refrigeration device 100 and a circulation device 200; the refrigeration device 100 includes a compressor 112, a heat accumulator 111, a condenser 113, an evaporator 115 and a supercooling liquid storage device 114. The refrigeration device 100 contains a refrigerant (coolant), and the temperature of the refrigerant can be controlled by controlling the refrigerant to flow through various components in the refrigeration device 100 to increase or decrease the temperature; the circulation device 200 contains a circulating liquid, and the circulating liquid continuously circulates in the circulating device 200, and the load device 300 can be increased or decreased in temperature; by controlling the refrigerant in the refrigeration device 100 to perform heat exchange with the circulating liquid in the circulation device 200, the temperature of the circulating liquid can be adjusted, and then the temperature of the load device 300 can be controlled.
[0047] The outlet end of the first heat exchange channel in the evaporator 115 is connected to the inlet end of the compressor 112; the outlet end of the compressor 112 includes two paths, the first path is connected to the inlet end of the first heat exchange channel in the heat accumulator 111, and the second path and the outlet end of the first heat exchange channel in the heat accumulator 111 are connected together to the inlet end of the second heat exchange channel in the condenser 113 and the inlet end of the first heat exchange channel in the evaporator 115.
[0048] The outlet end of the second heat exchange channel in the condenser 113 is connected to the inlet end of the supercooling liquid reservoir 114 , and the outlet end of the supercooling liquid reservoir 114 is connected to the inlet end of the first heat exchange channel in the evaporator 115 .
[0049] The outlet end of the second heat exchange channel in the evaporator 115 is connected to the inlet end of the circulation device 200. The outlet end of the circulation device 200 includes two paths, the first path is connected to the inlet end of the second heat exchange channel in the heat accumulator 111, and the second path and the outlet end of the second heat exchange channel in the heat accumulator 111 are connected to the inlet end of the second heat exchange channel in the evaporator 115.
[0050] The compressor 112 uses mechanical energy to suck the low-temperature and low-pressure gaseous refrigerant in the evaporator 115, and then compresses it into a high-temperature and high-pressure gaseous refrigerant. This process increases the pressure and temperature of the refrigerant, allowing it to release heat effectively. The first heat exchange channel in the condenser 113 is connected to the service water to cool and condense the refrigerant in the second heat exchange channel.
[0051] The temperature of the circulating fluid is adjusted by controlling the refrigerant in the refrigeration device 100 to increase or decrease the temperature in each component of the refrigeration device 100 and to perform heat exchange with the circulating fluid in the circulation device 200 in the heat accumulator 111 and / or the evaporator 115 so that the circulating fluid can control the temperature of the load device 300.
[0052] On the one hand, the heat accumulator 111 stores heating energy. Specifically, the high-temperature and high-pressure gaseous refrigerant obtained after compression by the compressor 112 can heat the heat storage medium in the heat accumulator 111 through the first heat exchange channel; thus, when the circulating fluid flows through the second heat exchange channel, the heat storage medium can heat the circulating fluid. Optionally, in order to improve the heat exchange efficiency, the heat release end (the end through which the refrigerant flows, i.e., the end of the first heat exchange channel) adopts a coil method to increase the heat exchange surface, because the heat absorption end (the end through which the circulating fluid flows, i.e., the end of the second heat exchange channel) has a large flow rate and a low pressure, and a shell-and-tube design is adopted to reduce the pressure drop and increase the heat exchange area.
[0053] Existing temperature control equipment can only heat up through the hot air discharged from the compressor and the heater device, and the heating speed is slow. If the heating speed is increased, the installed power of each component can only be increased, which brings about problems such as high energy consumption, high cost and is not conducive to the miniaturization of the equipment. In the embodiment of the present application, by adding a heat accumulator 111, the heat storage medium therein can first heat up the circulating fluid, and the circulating fluid heated once by the heat accumulator 111 enters the evaporator 115 for a second heating, so that the circulating fluid is continuously circulated to absorb heat and increase the temperature, thereby increasing the heating speed of the circulating fluid.
[0054] On the other hand, the supercooling liquid reservoir 114 performs supercooling treatment on the refrigerant, and the liquid refrigerant obtained after the supercooling treatment is stored in the supercooling liquid reservoir 114. If the existing temperature control equipment wants to increase the cooling speed, it is necessary to increase the compressor power. At this time, the condenser and the evaporator also need to be increased accordingly. At this time, the energy consumption of the equipment increases, the size increases, and the equipment cost increases. In the embodiment of the present application, by adding a supercooling liquid reservoir 114, the refrigerant after the condenser 113 is cooled can be supercooled. Cooling again can increase the supercooling degree of the refrigerant, improve the refrigeration capacity and cooling speed, and avoid energy waste.
[0055] Furthermore, the outlet end of the second heat exchange channel in the condenser 113 is also connected to the inlet end of the external cooling pipeline of the supercooling liquid reservoir 114 , and the outlet end of the external cooling pipeline is connected to the inlet end of the compressor 112 .
[0056] The external cooling pipeline is arranged outside the liquid storage space in the supercooling liquid reservoir 114, and is used to cool the coolant stored in the liquid storage space.
[0057] In this way, by cooling the liquid storage space in the supercooling liquid storage device 114 through an external cooling pipeline, the temperature of the refrigerant in the liquid storage space can be further reduced and the refrigeration speed can be increased, thereby indirectly achieving the purpose of increasing the cooling speed of the circulating liquid.
[0058] Furthermore, the outlet end of the second heat exchange channel in the condenser 113 is also connected to the inlet end of the first heat exchange channel in the evaporator 115 .
[0059] Furthermore, the refrigeration device 100 also includes a first valve 101, a second valve 102, a third valve 103, a fourth valve 104, a fifth valve 105 and a sixth valve 106; optionally, each valve is a solenoid valve, which can be switched on and off and adjusted in opening by an electromagnetic signal.
[0060] The first path of the outlet end of the compressor 112 is connected to the inlet end of the first heat exchange channel in the heat accumulator 111 through the first valve 101; the second path of the outlet end of the compressor 112 is connected to the outlet end of the first heat exchange channel in the heat accumulator 111 through the second valve 102, and is connected to the inlet end of the first heat exchange channel in the evaporator 115 through the third valve 103; the outlet end of the supercooling liquid reservoir 114 is connected to the inlet end of the first heat exchange channel in the evaporator 115 through the fourth valve 104; the outlet end of the second heat exchange channel in the condenser 113 is connected to the inlet end of the external cooling pipeline of the supercooling liquid reservoir 114 through the fifth valve 105; the outlet end of the second heat exchange channel in the condenser 113 is also connected to the inlet end of the first heat exchange channel in the evaporator 115 through the sixth valve 106.
[0061] By controlling the opening and closing of each valve, the flow direction of the refrigerant in the refrigeration device 100 and the components through which it flows can be adjusted, thereby controlling the refrigerant to increase or decrease the temperature in each component of the refrigeration device 100. Among them, in each operation stage of the system (including heating, cooling and temperature control preparation, etc.), the opening of the valve 105 is adjusted according to the superheat to supercool the refrigerant in the supercooling liquid storage tank 114 to maintain system stability. Specifically, the first refrigeration temperature at the inlet end of the compressor 112 and the first refrigeration pressure at the outlet end of the first heat exchange channel in the evaporator 115 are collected to determine the actual value of the superheat; according to the superheat difference between the actual value of the superheat and the preset superheat value, the opening of the fifth valve 105 is adjusted.
[0062] On the other hand, Figure 1 As shown in FIG. 2 , the circulation device 200 includes a water tank 206 , a water pump 207 and a heater 208 .
[0063] The inlet end of the water tank 206 serves as the inlet end of the circulation device 200, the outlet end of the water tank 206 is connected to the inlet end of the water pump 207, the outlet end of the water pump 207 is connected to the inlet end of the heater 208, the outlet end of the heater 208 is connected to the liquid inlet corresponding to the load device 300, and the liquid outlet corresponding to the load device 300 serves as the outlet end of the circulation device 200.
[0064] Under the power of the water pump 207, the circulating fluid is drawn out from the water tank 206 and sucked into the water pump 207, and then discharged from the water pump 207 to the heater 208. The circulating fluid at the outlet of the heater 208 enters the corresponding position of the load device 300 and exchanges heat with the load device 300. Afterwards, the circulating fluid returns to the water tank 206 or returns to the water tank 206 through the second heat exchange channel of the heat accumulator 111.
[0065] Here, the temperature T205 of the circulating liquid at the inlet end of the water tank 206 (that is, the third circulating temperature at the outlet end of the second heat exchange channel in the evaporator) can be collected by the temperature sensor 205, and the temperature T209 of the circulating liquid at the corresponding liquid inlet of the load device 300 can be collected by the temperature sensor 209. By comparing T205 and T209, the heater 208 is controlled to heat the circulating liquid.
[0066] Furthermore, the circulation device 200 further includes a first circulation valve 201 and a second circulation valve 202; optionally, each valve is a solenoid valve, which can be switched on and off and adjusted in opening degree by electromagnetic signals.
[0067] The first path at the outlet end of the circulation device 200 is connected to the inlet end of the second heat exchange channel in the heat accumulator 111 through the first circulation valve 201, and the second path is connected to the inlet end of the second heat exchange channel in the evaporator 115 through the second circulation valve 202 and the outlet end of the second heat exchange channel in the heat accumulator 111.
[0068] By controlling the opening and closing of each valve, the flow direction and components of the circulating fluid in the circulation device 200 can be adjusted, thereby controlling whether the circulating fluid flows through the heat accumulator 111, that is, controlling the heat exchange between the circulating fluid and the refrigerant in the heat accumulator 111 and / or the evaporator 115.
[0069] The embodiment of the present application provides a temperature control system, in which the heat accumulator stores heating energy, and the heat accumulator can be used to increase the temperature during the heating process to increase the heating speed; the supercooling liquid storage device supercools and stores the refrigerant, and the supercooling liquid storage device can be used to cool the refrigerant during the cooling process to increase the cooling speed. In this way, the waiting time for heating and cooling can be reduced without increasing the power of the compressor, condenser and evaporator, thereby improving production efficiency, saving energy and reducing consumption, reducing equipment production costs, and facilitating equipment miniaturization.
[0070] The embodiment of the present application also provides a temperature control method, which can be applied to the temperature control system described in any of the above embodiments, and can specifically be a controller in the temperature control system. The refrigeration device 100 includes a compressor 112, a heat accumulator 111, a condenser 113, an evaporator 115, a supercooling liquid storage device 114 and a plurality of valves; the circulation device 200 includes a plurality of circulation valves. The controller can obtain the current operating parameters of each component by communicating with each component in the temperature control system, and send control instructions to each component to adjust the operating parameters of each component.
[0071] Specifically, the temperature control method includes:
[0072] According to the temperature adjustment instruction received from the load device, each valve in the temperature control system is controlled so that the refrigerant in the refrigeration device 100 is heated and cooled in each component of the temperature control system and exchanges heat with the circulating fluid in the circulation device 200 in the heat accumulator 111 and / or the evaporator 115 to adjust the temperature of the circulating fluid so that the circulating fluid controls the temperature of the load device 300.
[0073] The heat accumulator 111 stores heating energy, and the heat accumulator 111 can be used to increase the temperature during the heating process to increase the heating speed; the supercooling liquid storage 114 supercools and stores the refrigerant, and the supercooling liquid storage 114 can be used to reduce the temperature during the cooling process to increase the cooling speed. In this way, the waiting time for heating and cooling can be reduced without increasing the power of the compressor 112, the condenser 113, and the evaporator 115, thereby improving production efficiency, saving energy and reducing consumption, reducing equipment production costs, and facilitating equipment miniaturization.
[0074] Here, the types of temperature adjustment instructions may include temperature increase instructions and temperature decrease instructions; the execution process of the temperature control method for each temperature adjustment instruction will be described in detail below.
[0075] In one possible implementation, see Figure 2 , Figure 2 This is a flow chart of a temperature control method provided by another embodiment of the present application. Figure 2 As shown in, the temperature control method provided in the embodiment of the present application includes:
[0076] Step a1: when the temperature adjustment instruction is a temperature increase instruction, close the first valve 101, the fourth valve 104, the second circulation valve 202 and the sixth valve 106, and open the second valve 102, the third valve 103 and the first circulation valve 201.
[0077] When the load device 300 requires a high temperature, the temperature control system needs to increase the temperature. At this time, a temperature increase instruction is generated. The temperature increase instruction can set a target value for the temperature increase (which can be the target temperature value of the circulating liquid at the liquid inlet corresponding to the load device 300, i.e. Figure 1 The temperature T209 collected by the temperature sensor 209).
[0078] Return to Reference Figure 1 At this time, valves 101, 104, 202, and 106 are closed, and valves 102, 103, and 201 are opened. The circulating fluid returned from the outlet of the circulation device 200 enters the heat exchange tube at the heat absorption end of the heat accumulator 111 through valve 201, and the circulating fluid exchanges heat with the heat storage medium in the heat accumulator 111, and the heat storage medium heats the circulating fluid once.
[0079] The circulating fluid heated once in the heat accumulator 111 enters the second heat exchange channel of the evaporator 115, and the hot air (high-temperature gaseous refrigerant) discharged from the compressor 112 enters the first heat exchange channel of the evaporator 115 through the valve 103. The circulating fluid and the hot air exchange heat in the evaporator 115, and the hot air flowing through one side of the evaporator 115 heats the circulating fluid for a second time. In this way, the circulating fluid absorbs heat through continuous circulation, and the temperature is continuously increased.
[0080] Step a2: when it is determined that the temperature of the circulating fluid rises to meet a preset condition, the first circulating valve 201 is closed and the second circulating valve 202 is opened.
[0081] Here, the preset condition means that as the heating energy pre-stored in the heat accumulator 111 is released, the temperature of the circulating fluid increases until the heat accumulator 111 can no longer effectively heat the circulating fluid.
[0082] At this time, valve 202 should be opened and valve 201 should be closed, so that the circulating fluid directly enters the evaporator 115 and exchanges heat with the high-temperature hot air discharged from the compressor 112 to increase the temperature, that is, the first heating process of the circulating fluid by the heat accumulator 111 is cut off.
[0083] Specifically, the temperature of the circulating fluid may be determined to rise to meet the preset conditions in the following manner:
[0084] Step a21, collecting a first circulation temperature at the outlet end of the circulation device 200 and a second circulation temperature at the outlet end of the second heat exchange channel in the heat accumulator 111.
[0085] In this step, the first circulation temperature T204 can be collected through the temperature sensor 204 set at the outlet end of the circulation device 200; the second circulation temperature T203 can be collected through the temperature sensor 203 set at the outlet end of the second heat exchange channel in the heat accumulator 111.
[0086] Step a22: determine the temperature difference between the second circulation temperature and the first circulation temperature.
[0087] Step a23: If the temperature difference is less than a preset threshold, it is determined that the temperature of the circulating fluid is increased to meet a preset condition.
[0088] For the above two steps, the temperature difference TA = T203-T204. Obviously, TA will gradually decrease as the heat of the heat storage medium is released. When TA≤TB, it is considered that the heat of the heat storage medium in the heat storage device 111 is basically released. At this time, it is determined that the temperature of the circulating fluid rises to meet the preset conditions. Here, TB represents the preset threshold value, which is an empirical value, such as 2°C-5°C. It can be set according to different temperature control systems, and this application does not impose any restrictions here.
[0089] It should be noted that when the temperature rises to the target value set by the temperature increase instruction, the temperature increase process ends. Accordingly, the temperature control system enters the working mode, at which time the system only needs a small amount of energy to maintain the current temperature. For example, the system can adjust the valve opening and the power of each component through existing control algorithms such as PID according to the target value and the actual detected temperature value, so that the system operates in a stable state.
[0090] In another possible implementation, the temperature control method includes:
[0091] Step b: when the temperature adjustment instruction is a cooling instruction, close the second valve 102, the third valve 103, the first circulation valve 201 and the sixth valve 106, and open the first valve 101, the second circulation valve 202 and the fourth valve 104.
[0092] When the load device 300 requires a low temperature, the temperature control system needs to cool down. At this time, a cooling instruction is generated. The cooling instruction can set a target value for cooling (which can be the target temperature value of the circulating liquid at the liquid inlet corresponding to the load device 300, i.e. Figure 1 The temperature T209 collected by the temperature sensor 209).
[0093] Return to Reference Figure 1 At this time, valves 102, 103, 201, and 106 are closed, and valves 101, 202, and 104 are opened. The supercooled refrigerant stored in the supercooling liquid storage tank 114 enters the first heat exchange channel in the evaporator 115 through the valve 104. At this time, the high-temperature circulating fluid in the circulation device 200 flows through the second heat exchange channel in the evaporator 115 through the valve 202. The supercooled refrigerant vaporizes in the evaporator 115 and absorbs heat to quickly cool the circulating fluid.
[0094] While cooling, the hot air discharged from the compressor 112 enters the first heat exchange channel of the heat accumulator 111 through the valve 101 to exchange heat with the heat storage medium, storing heat for the next heating. At this time, while the temperature of the heat storage medium rises, the refrigerant hot air is also cooled down. It is cooled down again through the condenser 113, and then enters the supercooling liquid storage tank 114 for supercooling treatment. Here, through heat exchange with the heat storage medium in the heat accumulator 111, the supercooling degree of the refrigerant can also be indirectly improved, which improves the refrigeration capacity while avoiding energy waste, thereby achieving energy saving.
[0095] It should be noted that when the temperature drops to the target value set by the cooling instruction, the cooling process ends. Accordingly, the temperature control system enters the working mode, at which time the system only needs very little energy consumption to maintain the current temperature. For example, the system can adjust the valve opening and the power of each component through existing control algorithms such as PID according to the target value and the actual detected temperature value, so that the system operates in a stable state.
[0096] Furthermore, before controlling each valve in the temperature control system according to the received temperature adjustment instruction of the load device, the temperature control method further includes:
[0097] Step c: after the temperature control system is started, it enters a temperature control preparation phase and lasts for a predetermined period of time, so that the heat accumulator 111 stores heating energy, and the supercooling liquid storage device 114 performs supercooling treatment on the refrigerant and stores it.
[0098] In this way, after the predetermined operation time, the heat accumulator 111 and the supercooling liquid storage 114 store sufficient heating energy and cooling energy, and can enter the heating and cooling mode of the load device 300. Among them, the predetermined time can be set based on the energy storage capacity of the heat accumulator 111 and the supercooling liquid storage 114, and this application does not impose any restrictions on this.
[0099] Among them, in the temperature control preparation stage, the second valve 102, the third valve 103, the first circulation valve 201 and the fourth valve 104 are closed, and the first valve 101 and the second circulation valve 202 are opened; the actual value in the temperature control system is collected, and the opening of the fifth valve 105 and the sixth valve 106 are adjusted according to the difference between the actual value and the set value.
[0100] In the temperature control preparation stage, the temperature control system has been started, and the compressor 112 and the water pump 207 are running. At this time, the system is generally in an unloaded state (i.e., the load device 300 is not connected). The default temperature T209 can be set to an initial value of 20°C, and the valves 102, 103, 201, and 104 are in a closed state.
[0101] At this time, the hot air discharged from the compressor 112 enters the heat accumulator 111 through the valve 101 to heat the heat storage medium. The temperature of the heat storage medium in the initial state is equivalent to the ambient temperature, and the temperature of the hot air discharged from the compressor 112 is generally 80-90°C. The high-temperature hot air exchanges heat through the heat accumulator 111, and while the temperature of the heat storage medium rises, the hot air is cooled once. After the first cooling, the hot air passes through the condenser 113 for a second cooling; the refrigerant after the second cooling through the condenser 113 is liquefied after the supercooling treatment in the supercooling liquid storage 114, and is stored in the supercooling liquid storage 114 in large quantities.
[0102] During this stage, the output signal can also be obtained by using the superheat setting value at the inlet end of the compressor 112 and the actual superheat feedback value, using a control algorithm such as PID, and the output signal controls the opening of the valve 105 to supercool the refrigerant in the supercooling liquid storage tank 114; and the output signal can be obtained by using the temperature setting value at the outlet end of the second heat exchange channel in the evaporator and the actual temperature feedback value, using a control algorithm such as PID, and the output signal controls the opening of the valve 106 to maintain system stability.
[0103] In a specific implementation, collecting the actual value in the temperature control system and adjusting the opening of the fifth valve 105 and the sixth valve 106 according to the difference between the actual value and the set value may include:
[0104] Step c1, collecting a first refrigeration temperature at the inlet end of the compressor 112 , a first refrigeration pressure at the outlet end of the first heat exchange channel in the evaporator 115 , and a third circulation temperature at the outlet end of the second heat exchange channel in the evaporator 115 .
[0105] Return to Reference Figure 1 The first refrigeration temperature T109 at the inlet end of the compressor 112 can be collected through the temperature sensor 109, the first refrigeration pressure P110 at the outlet end of the first heat exchange channel in the evaporator 115 can be collected through the pressure sensor 110, and the third circulation temperature T205 at the outlet end of the second heat exchange channel in the evaporator 115 can be collected through the temperature sensor 205.
[0106] Step c2: determining a superheat difference between an actual superheat value and a preset superheat value according to the first refrigeration temperature and the first refrigeration pressure.
[0107] In this step, the saturation temperature of the refrigerant (i.e., the temperature at which the refrigerant completely evaporates under this pressure) can be found according to the first refrigeration pressure P110 at the outlet of the evaporator 115, and then the actual value of superheat can be obtained from the saturation temperature of the refrigerant and the first refrigeration temperature. In the embodiment of the present application, the actual value of superheat = the first refrigeration temperature (T109) at the inlet of the compressor - the saturation temperature of the refrigerant. Finally, the deviation between the actual value of superheat and the preset superheat value is determined for input to the control algorithm.
[0108] Step c3: determining the temperature difference between the third cycle temperature and a preset temperature value.
[0109] In this step, the temperature difference between the third cycle temperature and the preset temperature value (the set T209 target value) is determined for input into the control algorithm.
[0110] Step c4: adjusting the opening of the fifth valve 105 according to the superheat difference.
[0111] Step c5: adjusting the opening of the sixth valve according to the temperature difference.
[0112] Here, when the superheat difference is too large (the actual value of the supercooling is too high), the opening of the fifth valve 105 can be increased to take away the heat of the refrigerant in the supercooling liquid storage tank 114 and replenish the refrigerant in the evaporator 115 to reduce the superheat and ensure the stability of the system operation. When the temperature difference is too large (the actual value of the third cycle temperature is too high), the opening of the sixth valve 106 can be increased.
[0113] The embodiment of the present application provides a temperature control method, in which heating energy is stored in a heat accumulator, and the heat accumulator can be used to increase the temperature during the heating process to increase the heating speed; the supercooling liquid storage device supercools and stores the refrigerant, and the supercooling liquid storage device can be used to cool the refrigerant during the cooling process to increase the cooling speed. In this way, the waiting time for heating and cooling can be reduced without increasing the power of the compressor, condenser and evaporator, thereby improving production efficiency, saving energy and reducing consumption, reducing equipment production costs, and facilitating equipment miniaturization.
[0114] See also Figure 3 , Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 3 As shown in , the electronic device 300 includes a processor 310 , a memory 320 and a bus 330 .
[0115] The memory 320 stores machine-readable instructions executable by the processor 310. When the electronic device 300 is running, the processor 310 communicates with the memory 320 via the bus 330. When the machine-readable instructions are executed by the processor 310, the above-mentioned Figure 2 The steps of the temperature control method in the method embodiment shown and the specific implementation methods can be found in the method embodiment, which will not be repeated here.
[0116] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the computer program can execute the above-mentioned Figure 2 The steps of the temperature control method in the method embodiment shown and the specific implementation methods can be found in the method embodiment, which will not be repeated here.
[0117] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.
[0118] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.
[0119] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0120] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
[0121] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application can essentially or in other words, the part that contributes to the prior art or the part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.
[0122] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-mentioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-mentioned embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.
Claims
1. A temperature control system, characterized in that: The system comprises a refrigeration device and a circulation device; the refrigeration device comprises a compressor, a heat storage device, a condenser, an evaporator and a supercooling liquid storage device; The outlet end of the first heat exchange channel in the evaporator is connected to the inlet end of the compressor; the outlet end of the compressor includes two paths, the first path is connected to the inlet end of the first heat exchange channel in the heat accumulator, and the second path and the outlet end of the first heat exchange channel in the heat accumulator are connected together to the inlet end of the second heat exchange channel in the condenser and the inlet end of the first heat exchange channel in the evaporator; The outlet end of the second heat exchange channel in the condenser is connected to the inlet end of the supercooling liquid reservoir, and the outlet end of the supercooling liquid reservoir is connected to the inlet end of the first heat exchange channel in the evaporator; The outlet end of the second heat exchange channel in the evaporator is connected to the inlet end of the circulation device, and the outlet end of the circulation device includes two paths, the first path is connected to the inlet end of the second heat exchange channel in the heat accumulator, and the second path and the outlet end of the second heat exchange channel in the heat accumulator are connected together to the inlet end of the second heat exchange channel in the evaporator; The heat accumulator stores heating energy, and the supercooling liquid storage device supercools and stores the refrigerant; the temperature of the circulating liquid is adjusted by controlling the refrigerant in the refrigeration device to increase or decrease the temperature in each component of the refrigeration device and to perform heat exchange with the circulating liquid in the circulation device in the heat accumulator and / or the evaporator, so that the circulating liquid can control the temperature of the load equipment.
2. The system according to claim 1, characterized in that The circulation device comprises a water tank, a water pump and a heater; The inlet end of the water tank serves as the inlet end of the circulation device, the outlet end of the water tank is connected to the inlet end of the water pump, the outlet end of the water pump is connected to the inlet end of the heater, the outlet end of the heater is connected to the liquid inlet corresponding to the load device, and the liquid outlet corresponding to the load device serves as the outlet end of the circulation device.
3. The system according to claim 1, characterized in that The outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the external cooling pipeline of the supercooling liquid reservoir, and the outlet end of the external cooling pipeline is connected to the inlet end of the compressor; Wherein, the external cooling pipeline is arranged outside the liquid storage space in the supercooling liquid storage device, and is used to cool the coolant stored in the liquid storage space.
4. The system according to claim 3, characterized in that The outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the first heat exchange channel in the evaporator.
5. A temperature control method, characterized in that: The method is applied to a temperature control system; the temperature control system comprises a refrigeration device and a circulation device; the refrigeration device comprises a compressor, a heat accumulator, a condenser, an evaporator, a supercooling liquid storage device and a plurality of valves; the circulation device comprises a plurality of circulation valves; the heat accumulator stores heating energy, and the supercooling liquid storage device performs supercooling treatment on the refrigerant and stores it; the method comprises: According to the temperature adjustment instruction received from the load device, each valve in the temperature control system is controlled so that the refrigerant in the refrigeration device is heated and cooled in each component of the temperature control system and exchanges heat with the circulating fluid in the circulation device in the heat accumulator and / or the evaporator to adjust the temperature of the circulating fluid so that the circulating fluid controls the temperature of the load device.
6. The method according to claim 5, characterized in that The plurality of valves in the refrigeration device include a first valve, a second valve, a third valve, a fourth valve, a fifth valve and a sixth valve; a first path at the outlet of the compressor is connected to the inlet of the first heat exchange channel in the heat accumulator via the first valve; a second path at the outlet of the compressor is connected to the outlet of the first heat exchange channel in the heat accumulator via the second valve, and is connected to the inlet of the first heat exchange channel in the evaporator via the third valve; the outlet of the subcooling liquid storage device is connected to the inlet of the first heat exchange channel in the evaporator via the fourth valve; the second path at the outlet of the compressor is connected to the outlet of the first heat exchange channel in the heat accumulator via the second valve, and is connected to the inlet of the first heat exchange channel in the evaporator via the third valve; the outlet of the subcooling liquid storage device is connected to the inlet of the first heat exchange channel in the evaporator via the fourth valve; The outlet end of the hot channel is connected to the inlet end of the external cooling pipeline of the supercooling liquid storage device through the fifth valve; the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the first heat exchange channel in the evaporator through the sixth valve; the multiple circulation valves in the circulation device include a first circulation valve and a second circulation valve; the first path of the outlet end of the circulation device is connected to the inlet end of the second heat exchange channel in the heat accumulator through the first circulation valve, and the second path is connected to the inlet end of the second heat exchange channel in the evaporator through the second circulation valve and the outlet end of the second heat exchange channel in the heat accumulator; The step of controlling each valve in the temperature control system according to the received temperature adjustment instruction of the load device comprises: When the temperature adjustment instruction is a temperature increase instruction, the first valve, the fourth valve, the second circulation valve and the sixth valve are closed, and the second valve, the third valve and the first circulation valve are opened; When it is determined that the temperature of the circulating fluid rises to meet a preset condition, the first circulating valve is closed and the second circulating valve is opened.
7. The method according to claim 6, characterized in that Determine that the temperature of the circulating fluid rises to meet the preset condition by the following method: Collecting a first circulation temperature at an outlet of the circulation device and a second circulation temperature at an outlet of a second heat exchange channel in the heat accumulator; determining a temperature difference between the second cycle temperature and the first cycle temperature; If the temperature difference is less than a preset threshold, it is determined that the temperature of the circulating fluid has increased to meet a preset condition.
8. The method according to claim 6, characterized in that The step of controlling each valve in the temperature control system according to the received temperature adjustment instruction of the load device comprises: When the temperature adjustment instruction is a temperature reduction instruction, the second valve, the third valve, the first circulation valve and the sixth valve are closed, and the first valve, the second circulation valve and the fourth valve are opened.
9. The method according to claim 6, characterized in that Before controlling each valve in the temperature control system according to the received temperature adjustment instruction of the load device, the method further includes: After the temperature control system is started, it enters a temperature control preparation phase and lasts for a predetermined period of time, so that the heat accumulator stores heating energy and the supercooling liquid storage device performs supercooling treatment on the refrigerant and stores it; Among them, in the temperature control preparation stage, the second valve, the third valve, the first circulation valve and the fourth valve are closed, and the first valve and the second circulation valve are opened; the actual value in the temperature control system is collected, and the opening of the fifth valve and the sixth valve is adjusted according to the difference between the actual value and the set value.
10. The method according to claim 9, characterized in that Collecting the actual value in the temperature control system and adjusting the opening of the fifth valve and the sixth valve according to the difference between the actual value and the set value, comprising: Collecting a first refrigeration temperature at the inlet end of the compressor, a first refrigeration pressure at the outlet end of the first heat exchange channel in the evaporator, and a third circulation temperature at the outlet end of the second heat exchange channel in the evaporator; determining a superheat difference between an actual superheat value and a preset superheat value according to the first refrigeration temperature and the first refrigeration pressure; Determining a temperature difference between the third cycle temperature and a preset temperature value; adjusting the opening of the fifth valve according to the superheat difference; The opening of the sixth valve is adjusted according to the temperature difference.
Citation Information
Patent Citations
Temperature control system and temperature control method for semiconductor temperature control
CN112965546A
Semiconductor temperature control equipment with precooling function and temperature control method
CN114779848A
Semiconductor temperature control equipment and temperature control method
CN114779849A
Temperature control equipment for semiconductor production
CN207264217U
Controlling method and system for temperature of gas chiller for semiconductor and LCD manufacturing process
KR101426884B1