Heat dissipation device and server

Abstract

This invention discloses a heat dissipation device and a server, relating to the field of server heat dissipation technology. The heat dissipation device includes a heat-generating device, a heat-conducting component, and a heat dissipation structure. The heat-generating device comprises a heat-generating component, a first fixing structure, and a second fixing structure. The heat-conducting component has a first heat transfer contact surface for contacting the heat-generating component; the heat-conducting component is fixed to the first fixing structure. The heat dissipation structure has a second heat transfer contact surface for contacting the heat-conducting component and is used to dissipate the heat transferred by the heat-conducting component; the heat dissipation structure is fixed to the second fixing structure. In practical use, when it is necessary to replace or repair components within the heat-generating device, only the heat dissipation structure needs to be disassembled, without disassembling the heat-conducting component, effectively avoiding the impact on the heat-generating component during heat sink disassembly. Furthermore, the heat-conducting component and the heat dissipation structure are designed as separate units, adaptable to various heat-generating devices with installed heat-generating components.

Description

Technical Field

[0001] This invention relates to the field of server heat dissipation technology, and in particular to a heat dissipation device. Furthermore, this invention also relates to a server including the aforementioned heat dissipation device. Background Technology

[0002] Heat sinks are one of the most commonly used components in servers. A complete server contains various types of heat sinks, such as CPU (Central Processing Unit) heat sinks, VR (Voltage Regulator) heat sinks, GPU (Graphics Processing Unit) heat sinks, etc. Heat-generating components that generate heat and consume power basically need to be cooled by heat sinks.

[0003] Currently, thermally conductive adhesive is often needed to make contact between the heat sink and the heat-generating components. The better the thermal conductivity of the thermally conductive adhesive, the more viscous it becomes when the temperature returns to normal. This means that a large amount of external force is required when disassembling the heat sink. When a heat sink corresponds to multiple heat-generating components, the required disassembly force is even greater. The huge force pulling the heat sink and the heat-generating components can easily cause micro-strains in the heat-generating components and the circuit board, affecting the product performance of the heat-generating components.

[0004] In summary, how to avoid the impact on heat-generating components during radiator disassembly is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a heat dissipation device with a split structure, including a heat-conducting component and a heat dissipation structure. The heat-conducting component is used to contact the heat-generating component, and the heat dissipation structure is independent of the heat-conducting component. When it is necessary to replace the components in the heat-generating device, only the heat dissipation structure needs to be disassembled, and the heat-conducting component does not need to be disassembled, which can effectively avoid the impact on the heat-generating component during the disassembly of the heat dissipation device.

[0006] Furthermore, another object of the present invention is to provide a server including the above-described heat dissipation device.

[0007] To solve the above-mentioned technical problems, the present invention provides a heat dissipation device, comprising:

[0008] The heating device includes a heating element, a first fixing structure, and a second fixing structure.

[0009] A heat-conducting component is provided with a first heat-transferring contact surface for contacting the heat-generating component; the heat-conducting component is fixed to the first fixed structure;

[0010] The heat dissipation structure is a structure that is relatively independent of the heat-conducting component. The heat dissipation structure is provided with a second heat transfer contact surface. The heat dissipation structure is used to dissipate the heat transferred by the heat-conducting component. The heat dissipation structure is fixed to the second fixed structure.

[0011] When the heat-conducting component is fixed to the first fixed structure and the heat dissipation structure is fixed to the second fixed structure, the second heat transfer contact surface contacts the heat-conducting component.

[0012] On one hand, the heat-conducting component is provided with a third heat-conducting contact surface for contacting the second heat-conducting contact surface. The third heat-conducting contact surface is provided with a plurality of heat-conducting protrusions, and the second heat-conducting contact surface is provided with heat-conducting recesses for cooperating with the heat-conducting protrusions.

[0013] On the other hand, the heat transfer protrusion is a sawtooth protrusion, a wavy protrusion, or a rectangular protrusion.

[0014] On the other hand, the heat-conducting element includes:

[0015] Main body;

[0016] A boss protrudes from the main body, and the top end face of the boss is provided with the first heat transfer contact surface.

[0017] A fixing part is provided on the main body, and the fixing part is provided on at least one side of the boss. The fixing part is used to fix and install the heating device.

[0018] On the other hand, the boss includes a third fixing structure and a sliding structure connected to the main body; the sliding structure is movably disposed on the third fixing structure by a moving component, and the sliding structure is movably disposed in at least one direction;

[0019] The third heat transfer contact surface is provided on the side of the sliding structure that is away from the third fixed structure.

[0020] On the other hand, a pressure detection element is provided between the second heat transfer contact surface and the heat conductor, and the pressure detection element is used to detect the contact pressure between the second heat transfer contact surface and the heat conductor.

[0021] And / or, the first heat transfer contact surface is provided with a thermally conductive coating for improving thermal conductivity, the thermally conductive coating being used to contact the heat-generating element.

[0022] On the other hand, the heating device includes a main structure and a heating element, wherein the heating element is installed on the main structure;

[0023] The first fixing structure is disposed on the outer periphery of the position in the main body of the structure for mounting the heating element;

[0024] The second fixing structure is disposed on the outer peripheral edge of the main body of the structure.

[0025] On the other hand, one of the main structure and the heat dissipation structure is provided with a positioning protrusion, and the other of the main structure and the heat dissipation structure is provided with a positioning hole for cooperating with the positioning protrusion.

[0026] At least one snap-fit ​​component is provided on the side of the main structure facing the heat dissipation structure. The snap-fit ​​component includes a mounting base fixed to the main structure and an elastic buckle rotatably disposed on the mounting base between a first angular position and a second angular position. The portion of the positioning protrusion extending out of the heat dissipation structure is provided with a groove that engages with the elastic buckle. When the elastic buckle rotates to the first angular position, the elastic buckle is engaged in the groove. When the elastic buckle rotates to the second angular position, the elastic buckle is disengaged from the groove.

[0027] The heat dissipation device is equipped with a first temperature detection element for detecting its surface temperature and a heat dissipation fan. The heat dissipation structure is a heat dissipation fin, and the heat dissipation fin is equipped with a flow rate detection element for detecting the flow rate of gas flowing through the heat dissipation structure.

[0028] The main body of the structure is provided with a mounting groove for mounting the heating element. The thickness of the heating element is less than the depth of the mounting groove. When the first heat transfer contact surface of the heat-conducting element contacts the heating element, the heat-conducting element is at least partially located within the mounting groove.

[0029] The heat dissipation structure includes a heat dissipation body and an adjustment part. The adjustment part is disposed on the side of the heat dissipation body facing the heat conductor. The side of the adjustment part facing the heat conductor is provided with a second heat transfer contact surface. The adjustment part is adjustable in the installation position of the heat dissipation body to adapt to the heat-generating element in different installation positions.

[0030] On the other hand, the main body of the structure is provided with a display for displaying the temperature of the heating element, an alarm and a controller. The first temperature detection element is used to acquire the temperature information of the heating element and transmit the temperature information to the controller. When the temperature information is outside the preset temperature range, the controller controls the alarm to issue a warning message. The display is located on the outside of the main body of the structure.

[0031] A server comprising the heat dissipation device described in any of the preceding claims.

[0032] As can be seen from the above technical solution, the heat dissipation device provided by the present invention includes a heat-generating device, a heat-conducting component, and a heat dissipation structure. The heat-generating device is provided with a heat-generating component, a first fixing structure, and a second fixing structure. The heat-conducting component is provided with a first heat transfer contact surface for contacting the heat-generating component. The heat-conducting component is fixed to the first fixing structure. The heat dissipation structure is provided with a second heat transfer contact surface for contacting the heat-conducting component. The heat dissipation structure is used to dissipate the heat transferred by the heat-conducting component. The heat dissipation structure is fixed to the second fixing structure. When the heat-conducting component is fixed to the first fixing structure and the heat dissipation structure is fixed to the second fixing structure, the second heat transfer contact surface contacts the heat-conducting component.

[0033] When using the heat dissipation device provided by the present invention, firstly, the heat-conducting component needs to be installed at the position where the first heat transfer contact surface contacts the heat-generating component; then, the heat dissipation structure is installed so that the second heat transfer contact surface of the heat dissipation structure contacts the heat-conducting component; the heat generated by the heat-generating component transfers the heat to the heat dissipation structure, and the heat dissipation structure dissipates the heat.

[0034] The beneficial effects of this invention include:

[0035] 1. When it is necessary to replace or repair the components inside the heat-generating equipment, only the heat dissipation structure needs to be disassembled. Since the heat dissipation structure and the heat-conducting component are set independently, there is no need to disassemble the heat-conducting component, which can effectively avoid the impact on the heat-generating component during the disassembly of the heat dissipation device.

[0036] 2. Since the heat-conducting component and the heat dissipation structure are designed separately, in actual use, when the installation position of the heating component changes, the heat-conducting component only needs to adjust its installation position according to the change of the heating component. It can adapt to a variety of different heating devices with heating components installed, thus expanding the application range of the heat dissipation device.

[0037] In addition, the present invention also provides a server including the above-described heat dissipation device. Attached Figure Description

[0038] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 An exploded view of the heat-conducting component and heat dissipation structure in the heat dissipation device provided in an embodiment of the present invention;

[0040] Figure 2 A schematic diagram of a heating device with heat-conducting components installed;

[0041] Figure 3This is a schematic diagram of the heat-conducting component and heat dissipation structure in the heat dissipation device provided in an embodiment of the present invention;

[0042] Figure 4 This is a partial cross-sectional schematic diagram of the contact position between the third heat transfer contact surface and the second heat transfer contact surface.

[0043] Figure 5 A partial structural diagram of the main body of the heating device;

[0044] Figure 6 A partial structural diagram of the main body of the structure with the snap-fit ​​assembly installed;

[0045] Figure 7 This is a partial structural schematic diagram of the heat dissipation device provided by the present invention;

[0046] Figure 8 This is a schematic diagram showing the installation positions of components in the heat dissipation device provided by the present invention.

[0047] Figure 9 This is an exploded view of a heat dissipation device with a cold plate as the heat dissipation structure.

[0048] Figures 1 to 9 middle:

[0049] 1-Heat-conducting components;

[0050] 11-Main body, 111-Third heat transfer contact surface, 112-Serrated protrusion; 12-Boss, 121-First heat transfer contact surface; 13-Fixing part;

[0051] 2-Heat dissipation structure;

[0052] 21-Second heat transfer contact surface; 211-Heat transfer recess; 22-Cold plate;

[0053] 3-Heating equipment;

[0054] 31-Structural main body, 311-Positioning protrusion, 3111-Slot, 312-Mounting base, 313-Elastic buckle, 314-Mounting groove;

[0055] 32- Devices. Detailed Implementation

[0056] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0057] The core of this invention is to provide a heat dissipation device, including a heat-generating device 3, a heat-conducting component 1, and a heat dissipation structure 2. The heat-generating device 3 is provided with a heat-generating component, a first fixing structure, and a second fixing structure. The heat-conducting component 1 is provided with a first heat transfer contact surface 121 for contacting the heat-generating component of the heat-generating device 3. The heat-conducting component 1 is fixed to the first fixing structure. The heat dissipation structure 2 is a structure relatively independent of the heat-conducting component 1. The heat dissipation structure 2 is provided with a second heat transfer contact surface 21 for contacting the heat-conducting component 1, and is used to dissipate the heat transferred by the heat-conducting component 1. The heat dissipation structure 2 is fixed to the second fixing structure. When the heat-conducting component 1 is fixed to the first fixing structure and the heat dissipation structure 2 is fixed to the second fixing structure, the second heat transfer contact surface 21 contacts the heat-conducting component 1.

[0058] It should be noted that, in this specific embodiment, the heat dissipation structure 2 can be as follows: Figure 1 The heat dissipation fin structure shown can also be as follows: Figure 9 The cold plate 22 shown can contain a liquid cooling heat dissipation structure 2, which can be determined according to the actual situation. When the heat dissipation structure 2 is a cold plate 22, a second heat transfer contact surface 21 for contacting the heat conduction element 1 needs to be provided on the side of the cold plate 22 facing the heat conduction element 1, and the installation method of the cold plate 22 in the heat-generating device 3 is the same as the installation method of the heat dissipation fins.

[0059] When using the heat dissipation device provided in this specific embodiment, firstly, the heat-conducting component 1 needs to be installed at the position where the first heat transfer contact surface 121 contacts the heat-generating component; then, the heat dissipation structure 2 is installed so that the second heat transfer contact surface 21 of the heat dissipation structure 2 contacts the heat-conducting component 1; the heat generated by the heat-generating component transfers the heat-conducting component 1 to the heat dissipation structure 2, and the heat dissipation structure 2 dissipates the heat.

[0060] The beneficial effects of this specific embodiment include: when it is necessary to replace or repair the component 32 inside the heat-generating device 3, only the heat dissipation structure 2 needs to be disassembled. Since the heat dissipation structure 2 and the heat-conducting component 1 are independently set, it is not necessary to disassemble the heat-conducting component 1, which can effectively avoid the impact on the heat-generating component during the disassembly of the heat dissipation device. Since the heat-conducting component 1 and the heat dissipation structure 2 are designed separately, in actual use, when the installation position of the heat-generating component changes, the heat-conducting component 1 only needs to be adjusted according to the change in the position of the heat-generating component, which can adapt to a variety of different heat-generating devices 3 with heat-generating components installed, thus expanding the application range of the heat dissipation device.

[0061] Based on the above embodiments, the heat dissipation structure 2 can include a heat dissipation part for contact with the heat conduction element 1 and a mounting part for fixed installation on the heat-generating device 3, and the mounting part can be detachably installed on the heat dissipation part, and the heat dissipation part is provided with at least two different fixed mounting positions for fixing the mounting part.

[0062] Specifically, the fixed mounting positions can be set as different mounting positions within the mounting groove. The mounting groove is set in the heat dissipation part, and the mounting part can be slidably set in the mounting groove. The mounting part can be fixed to any position within the mounting groove. In actual use, the heat-conducting component 1 is first installed to the position that contacts the heat-generating component, and then the heat dissipation structure 2 is installed. During the installation of the heat dissipation structure 2, since the positions for fixing the heat dissipation structure 2 in different heat-generating devices 3 may change, it is necessary to first adjust the position of the mounting part in the heat dissipation part according to the position for fixing the heat dissipation structure 2 in the heat-generating device 3. After the adjustment is appropriate, the mounting part is fixed relative to the heat dissipation part, and then the heat dissipation structure 2 is installed to the heat-generating structure, and the mounting part is fixedly connected to the heat-generating structure.

[0063] In this specific embodiment, by setting the heat dissipation structure 2 as a separate heat dissipation part and mounting part, in actual use, when the fixed connection position of different heat-generating devices 3 changes, the heat dissipation device in this specific embodiment can be adapted to different heat-generating devices 3 by adjusting the position of the mounting part relative to the heat dissipation structure 2, thereby expanding the application range of the heat dissipation device.

[0064] Based on the above embodiments, a third heat transfer contact surface 111 can be provided on the heat-conducting component 1 for contacting the second heat transfer contact surface 21. The third heat transfer contact surface 111 is provided with a plurality of heat transfer protrusions, and the second heat transfer contact surface 21 is provided with heat transfer recesses 211 for cooperating with the heat transfer protrusions.

[0065] Specifically, the heat transfer protrusion can be configured as a sawtooth protrusion 112, a wavy protrusion, or a rectangular protrusion.

[0066] Combination Figure 3 , Figure 4 As shown, the heat transfer protrusion can be configured as a serrated protrusion 112, and the heat transfer recess 211 can be configured as a serrated recess for engaging with the serrated protrusion 112. When the second heat transfer contact surface 21 contacts the third heat transfer contact surface 111, as shown... Figure 4 As shown, this can effectively increase the contact area between the second heat transfer contact surface 21 and the third heat transfer contact surface 111, thereby increasing the heat conduction area, improving heat transfer efficiency, and thus improving heat dissipation efficiency.

[0067] It should be noted that when the same heating device 3 is equipped with multiple heating elements, the third heat transfer contact surface 111 of the heating elements corresponding to different heat conduction elements 1 can be set to different shapes, which are determined according to the actual situation and will not be elaborated here.

[0068] In one specific embodiment, the heat-conducting component 1 may include a main body 11, a boss 12, and a fixing part 13. The boss 12 protrudes from the main body 11 and has a first heat transfer contact surface 121 on its top end face. The fixing part 13 is disposed on the main body 11, and at least one side of the boss 12 is provided with the fixing part 13. The fixing part 13 is used to fix and install on the heating device 3.

[0069] like Figure 3 As shown, the boss 12 faces away from the heat dissipation structure 2. In actual installation, the heat dissipation structure 2 is generally provided with a mounting groove 314, and the heat-generating element is installed in the mounting groove 314. The boss 12 is at least partially located in the mounting groove 314 so that the first heat transfer contact surface 121 of the boss 12 contacts the heat-generating element. Specifically, the first heat transfer contact surface 121 can be set as a plane, or the first heat transfer contact surface 121 can be set as a surface that mates with the surface of the heat-generating element. The specific choice depends on the actual situation and will not be elaborated here.

[0070] Depending on the heat conduction requirements, thermally conductive adhesive or other thermally conductive media may be provided between the first heat transfer contact surface 121 and the heating element. The specific method will be determined based on the actual situation and will not be elaborated here.

[0071] In this specific embodiment, the fixing part 13 is as follows: Figure 3 As shown, the heat-conducting component 1 is provided on both sides of the boss 12 and the fixing part 13 is provided with through holes. The locking member passes through the through holes and locks to the heating device 3, thereby fixing the heat-conducting component 1.

[0072] In this specific embodiment, the protrusion 12 is provided to enable the heat-conducting component 1 to contact the heating component in the mounting groove 314, which is beneficial to achieve surface-to-surface contact between the heat-conducting component 1 and the heating component. In addition, the fixing part 13 is fixedly set to the heating device 3 by the locking part, which can realize the fixed installation of the heat-conducting component 1 and the installation process is convenient.

[0073] Based on the above embodiments, in actual use, when the third heat transfer contact surface 111 of the heat-conducting component 1 and the second heat transfer contact surface 21 of the heat dissipation structure 2 are in contact through the heat transfer protrusion and the heat transfer recess 211, the relative installation positions of the third heat transfer contact surface 111 and the second heat transfer contact surface 21 must meet the matching requirements of the heat transfer protrusion and the heat transfer recess 211. When the installation position of the heat-conducting component 1 changes or shifts, it will affect the matching of the heat transfer protrusion and the heat transfer recess 211. Therefore, in this specific embodiment, the protrusion 12 includes a third fixed structure connected to the main body 11 and a sliding structure; the sliding structure is movably disposed on the third fixed structure through a moving component, and the sliding structure is movably disposed in at least one direction; the third heat transfer contact surface 111 is provided on the side of the sliding structure facing away from the third fixed structure.

[0074] In actual use, when the installation position of the heat-conducting component 1 changes, since the sliding structure is movably set on the third fixed structure, when the heat dissipation structure 2 is installed, the heat transfer protrusion and the heat transfer recess 211 can be made to cooperate by moving the sliding structure, so as to avoid misalignment of the relative positions of the heat transfer protrusion and the heat transfer recess 211.

[0075] The moving component in this specific embodiment can be a module that can move in both the first and second directions, or it can be a slide rail structure. The specific choice depends on the actual situation and will not be elaborated here.

[0076] In this specific embodiment, a movable sliding structure is provided on the boss 12, and the third heat transfer contact surface 111 is provided on the sliding structure. In actual use, when the installation position of the heat-conducting component 1 changes or the installation position of the heat-conducting component 1 shifts, the sliding structure can be moved to make the heat transfer protrusion and the heat transfer recess 211 cooperate, so as to avoid the relative position of the heat transfer protrusion and the heat transfer recess 211 being misaligned, so as to adapt to the situation where the heat-generating component is installed in different positions, and further expand the applicability of the heat dissipation device.

[0077] Based on the above embodiments, a pressure detection element can be provided between the second heat transfer contact surface 21 and the heat conduction element 1. The pressure detection element is used to detect the contact pressure between the second heat transfer contact surface 21 and the heat conduction element 1.

[0078] During the actual assembly process, when installing the heat dissipation structure 2, the pressure between the second heat transfer contact surface 21 and the third heat transfer contact surface 111 of the heat conduction component 1 can be detected in real time through the pressure detection component. This avoids situations where there is a gap between the heat dissipation structure 2 and the heat conduction component 1 or the contact pressure between the heat dissipation structure 2 and the heat conduction component 1 is too high, thus maintaining a suitable contact pressure between the heat dissipation structure 2 and the heat conduction component 1.

[0079] On the other hand, pressure detection elements can be set at different positions on the second heat transfer contact surface 21. During the assembly process, the pressure information detected by the pressure detection elements at different positions can be used to determine whether the heat dissipation structure 2 is installed with an skew.

[0080] Based on the above embodiments, a thermally conductive coating for improving thermal conductivity can be provided on the first heat transfer contact surface 121. The thermally conductive coating is used to contact the heat-generating element. The specific material of the thermally conductive coating needs to be determined according to the actual situation.

[0081] Based on the above embodiments, the heating device 3 may include a structural body 31 and a heating element, with the heating element installed on the structural body 31; a first fixing structure is disposed on the outer periphery of the position in the structural body 31 for installing the heating element; and a second fixing structure is disposed on the outer periphery edge of the structural body 31.

[0082] It should be noted that the heat dissipation device mentioned in this specific embodiment can be a CPU heatsink, a GPU heatsink, or other heatsinks used to dissipate heat from heat-generating components, depending on the actual situation.

[0083] In this specific embodiment, during actual installation, the heat dissipation structure 2 needs to cover the heat-conducting component 1 and other components 32 that are in contact with the heat-generating component; combined with Figure 8 , Figure 9 As shown, a device 32 is provided on the side of the main body 31 where the heat-generating element is installed. When the device 32 needs to be repaired or replaced, the heat dissipation structure 2 needs to be disassembled. In this specific embodiment, the heat dissipation structure 2 and the heat-conducting element 1 are set independently. Therefore, the heat-generating element will not be affected during the disassembly of the heat dissipation structure 2.

[0084] Based on the above embodiments, a positioning protrusion 311 may be provided in one of the main body 31 and the heat dissipation structure 2, and a positioning hole for cooperating with the positioning protrusion 311 may be provided in the other of the main body 31 and the heat dissipation structure 2.

[0085] like Figure 5 As shown, the positioning protrusion 311 is located near the edge of the main body 31, such as... Figure 7 As shown, during the assembly process, the positioning protrusion 311 is inserted into the positioning hole of the heat dissipation structure 2 to fix the installation position of the heat dissipation structure 2.

[0086] In addition, at least one snap-fit ​​component can be provided on the side of the main body 31 facing the heat dissipation structure 2. The snap-fit ​​component includes a mounting base 312 fixed to the main body 31 and an elastic buckle 313 rotatably disposed on the mounting base 312 between a first angular position and a second angular position. The portion of the positioning protrusion 311 extending out of the heat dissipation structure 2 is provided with a groove 3111 that cooperates with the elastic buckle 313. When the elastic buckle 313 rotates to the first angular position, the elastic buckle 313 is engaged in the groove 3111. When the elastic buckle 313 rotates to the second angular position, the elastic buckle 313 is disengaged from the groove 3111.

[0087] Combination Figure 6 , Figure 7 As shown, the elastic buckle 313 is a bent steel wire. The main body 31 is provided with a mounting base 312. The two ends of the elastic buckle 313 are rotatably mounted on the main body 31. During actual assembly, the positioning protrusion 311 is inserted into the positioning hole of the heat dissipation structure 2, and the slot 3111 at the end of the positioning protrusion 311 extends out of the heat dissipation structure 2. By rotating the elastic buckle 313, the elastic buckle 313 is locked into the slot 3111, thus achieving the fixed installation of the heat dissipation structure 2 on the main body 31. Figure 7As shown, the heat dissipation structure 2 is provided with a relief groove, and the positioning hole is provided in the relief groove. Therefore, when the elastic buckle 313 and the slot 3111 are engaged, the elastic buckle 313 is located in the relief groove and will not protrude from the surface of the heat dissipation structure 2.

[0088] In this specific embodiment, the heat dissipation structure 2 and the heat-generating device 3 are fixed by the cooperation of the elastic buckle 313 and the slot 3111. The installation process is convenient and can avoid the use of tools, thus achieving tool-free assembly and disassembly.

[0089] Based on the above embodiments, a first temperature detection element for detecting the surface temperature of the heat dissipation device can be provided, and the heat dissipation structure 2 is a heat dissipation fin, wherein the heat dissipation fin is provided with a flow rate detection element for detecting the flow rate of the gas flowing through the heat dissipation structure 2.

[0090] In actual use, the heat dissipation device also includes a cooling fan. The temperature information of the heat-generating component can be detected in real time through the first temperature detection element. When the temperature information of the heat-generating component is within the preset temperature range, the cooling fan can be controlled to maintain the current speed. When the temperature information of the heat-generating component is higher than the maximum value of the preset temperature range, the speed of the cooling fan can be increased. When the temperature information of the heat-generating component is lower than the minimum value of the preset temperature range, the speed of the cooling fan can be decreased.

[0091] On the other hand, the flow rate information detected by the flow rate detection device can be used to determine whether there are foreign objects affecting the heat dissipation of the heat dissipation structure 2. Depending on the speed of the cooling fan, the flow rate of the gas flowing through the heat dissipation structure 2 will also change accordingly. When the flow rate information detected by the flow rate detection device is within the preset flow rate range corresponding to the current speed of the cooling fan, the current state is maintained. When the flow rate information detected by the flow rate detection device is lower than the minimum value of the preset flow rate range corresponding to the current speed of the cooling fan, it indicates that there are foreign objects blocking the normal flow of gas through the heat dissipation structure 2, and the heat dissipation structure 2 needs to be disassembled for inspection.

[0092] When the heat dissipation structure 2 is a cold plate 22, a liquid cooling pipeline is provided inside the heat dissipation structure 2. The liquid cooling pipeline is equipped with a control valve for controlling the flow rate of the internal coolant. The temperature information of the heat-generating component can be detected in real time by a first temperature detection element. When the temperature information of the heat-generating component is within the preset temperature range, the control valve can be controlled to maintain the current opening degree. When the temperature information of the heat-generating component is higher than the maximum value of the preset temperature range, the opening degree of the control valve can be increased. When the temperature information of the heat-generating component is lower than the minimum value of the preset temperature range, the opening degree of the switching valve can be decreased.

[0093] In this specific embodiment, by setting a first temperature detection device, the temperature information of the heat-generating component can be detected in real time. This allows for adjustment of the cooling fan speed based on the temperature information of the heat-generating component, thereby achieving real-time control of the heat-generating component temperature. This satisfies the heat dissipation requirements of the heat-generating component while saving energy as much as possible. In addition, the flow rate detection device can detect the gas flow rate through the heat dissipation structure 2, preventing foreign objects from affecting the gas flow rate through the heat dissipation structure 2 and facilitating timely detection of problems.

[0094] On the other hand, a display, an alarm, and a controller for displaying the temperature of the heating element can be provided on the main body 31. The first temperature detection element is used to obtain the temperature information of the heating element and transmit the temperature information to the controller. When the temperature information is outside the preset temperature range, the controller controls the alarm to issue a warning message. The display is located on the outside of the main body 31.

[0095] When using the heat dissipation device provided in this specific embodiment, the first temperature detection element sends the acquired temperature information to the controller, and the controller controls the display to display the temperature information. When the temperature information is outside the preset temperature range, the controller controls the alarm to issue a warning message, so that the staff can obtain the temperature status of the heat-generating element in a timely manner and take timely measures.

[0096] When it is necessary to install a heating element on the main body 31, a mounting groove 314 for installing the heating element can be provided on the main body 31. The thickness of the heating element is lower than the depth of the mounting groove 314. When the first heat transfer contact surface 121 of the heat conductor 1 contacts the heating element, the heat conductor 1 is at least partially located in the mounting groove 314.

[0097] Based on the above embodiments, when the third heat transfer contact surface 111 of the heat-conducting component 1 and the second heat transfer contact surface 21 of the heat dissipation structure 2 are in contact through the heat transfer protrusion and the heat transfer recess 211, the relative installation positions of the third heat transfer contact surface 111 and the second heat transfer contact surface 21 must meet the matching requirements of the heat transfer protrusion and the heat transfer recess 211. When the installation position of the heat-conducting component 1 changes or shifts, it will affect the matching of the heat transfer protrusion and the heat transfer recess 211. Therefore, in this specific embodiment, the heat dissipation structure 2 includes a heat dissipation body and an adjustment part. The adjustment part is disposed on the side of the heat dissipation body facing the heat-conducting component 1, and the second heat transfer contact surface 21 is disposed on the side of the adjustment part facing the heat-conducting component 1. The installation position of the adjustment part is adjustable in the heat dissipation body to adapt to heat-generating components in different installation positions.

[0098] In actual use, when the installation position of the heat-conducting component 1 changes, since the installation position of the adjustment part on the heat dissipation body is adjustable, when the heat dissipation structure 2 is installed, the heat transfer protrusion and the heat transfer recess 211 can be made to cooperate by moving the adjustment part, so as to avoid misalignment of the relative positions of the heat transfer protrusion and the heat transfer recess 211.

[0099] In this specific embodiment, the adjustment part can be installed on the heat dissipation body by a movable component. The movable component can be a module that can move in both the first and second directions, or it can be a slide rail structure. The specific choice depends on the actual situation and will not be elaborated here.

[0100] In this specific embodiment, a movable adjustment part is provided in the heat dissipation structure 2, and the second heat transfer contact surface 21 is provided in the adjustment part. In actual use, when the installation position of the heat conduction component 1 changes or the installation position of the heat conduction component 1 shifts, the heat transfer protrusion and the heat transfer concave part 211 can be matched by moving the adjustment part, so as to avoid the relative position of the heat transfer protrusion and the heat transfer concave part 211 being misaligned, so as to adapt to the situation where the heat-generating component is installed in different positions, and further expand the applicability of the heat dissipation device.

[0101] In addition to the heat dissipation device disclosed in the above embodiments, the present invention also provides a server including the above heat dissipation device. The heat dissipation structure 2 in the server for dissipating heat from the heat-generating components can be a heat dissipation fin, a cold plate 22, or other structures that meet the requirements. The specific structure is determined according to the actual situation and will not be elaborated here.

[0102] It should also be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0103] The heat dissipation device and server provided by the present invention have been described in detail above. The various embodiments in the specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the systems disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and relevant parts can be referred to the method section. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the invention, and these improvements and modifications also fall within the protection scope of the present invention.

Claims

1. A heat dissipating device, characterized by, The application relates to a heat-dissipating structure of a heat-generating device, which comprises a heat-generating device (3) provided with a heat-generating element, a first fixing structure and a second fixing structure; the heat-generating device (3) comprises a structure main body (31) and the heat-generating element, the heat-generating element is installed on the structure main body (31), and the first fixing structure is arranged on the structure main body (31); a heat-conducting element (1) is provided with a first heat-conducting contact surface (121) used for contacting the heat-generating element; the heat-conducting element (1) is fixed on the first fixing structure; a heat-dissipating structure (2) is a structure independent of the heat-conducting element (1), the heat-dissipating structure is provided with a second heat-conducting contact surface (21), the heat-dissipating structure (2) is used for dissipating the heat transferred by the heat-conducting element (1); and the heat-dissipating structure (2) is fixed on the second fixing structure; when the heat-conducting element (1) is fixed on the first fixing structure and the heat-dissipating structure (2) is fixed on the second fixing structure, the second heat-conducting contact surface (21) contacts the heat-conducting element (1); one of the structure main body (31) and the heat-dissipating structure (2) is provided with a positioning convex column (311), and the other of the structure main body (31) and the heat-dissipating structure (2) is provided with a positioning hole used for cooperating with the positioning convex column (311); at least one clamping assembly is arranged on one side of the structure main body (31) facing the heat-dissipating structure (2), the clamping assembly comprises a mounting seat (312) fixed on the structure main body (31), and an elastic buckle (313) arranged on the mounting seat (312) and rotatable between a first angle position and a second angle position; a part of the positioning convex column (311) extending out of the heat-dissipating structure (2) is provided with a clamping groove (3111) matched with the elastic buckle (313); when the elastic buckle (313) rotates to the first angle position, the elastic buckle (313) is clamped in the clamping groove (3111); when the elastic buckle (313) rotates to the second angle position, the elastic buckle (313) is disengaged from the clamping groove (3111); the heat-dissipating structure (2) is provided with an avoiding groove, the positioning hole is arranged in the avoiding groove, and the elastic buckle (313) is located in the avoiding groove in the matched clamping state of the elastic buckle (313) and the clamping groove (3111); the heat-dissipating structure (2) comprises a heat-dissipating main body and an adjusting part, the adjusting part is arranged on one side of the heat-dissipating main body facing the heat-conducting element (1), one side of the adjusting part facing the heat-conducting element (1) is provided with the second heat-conducting contact surface (21), and the adjusting part is adjustable at the mounting position of the heat-dissipating main body to adapt to the heat-generating element at different mounting positions. The heat-conducting element (1) is provided with a third heat-conducting contact surface (111) used for contacting the second heat-conducting contact surface (21), the third heat-conducting contact surface (111) is provided with a plurality of heat-conducting convex parts, and the second heat-conducting contact surface (21) is provided with heat-conducting concave parts (211) matched with the heat-conducting convex parts. ​ ​ ​ ​ ​ ​ 2. The heat dissipating device according to claim 1, wherein ​ 3. The heat dissipating device according to claim 2, wherein The heat transfer protrusions are sawtooth-shaped protrusions (112), or wave-shaped protrusions, or rectangular protrusions.

4. The heat dissipating device according to claim 2 or 3, characterized in that The heat conduction member (1) comprises: a main body (11); a boss (12) protruding from the main body (11), the top end surface of the boss (12) being provided with the first heat transfer contact surface (121); a fixing portion (13) provided on the main body (11), at least one side of the boss (12) being provided with the fixing portion (13), the fixing portion (13) being used for fixing the heat generating device (3).

5. The heat dissipating device according to claim 4, wherein The boss (12) comprises a third fixing structure connected with the main body (11) and a sliding structure, the sliding structure being movably arranged on the third fixing structure through a moving assembly and being movably arranged in at least one direction; The side of the sliding structure away from the third fixing structure is provided with the third heat transfer contact surface (111).

6. The heat dissipating device of claim 1, wherein The second heat transfer contact surface (21) and the heat conduction member (1) are provided with a pressure detection member for detecting the contact pressure between the second heat transfer contact surface (21) and the heat conduction member (1); And / or, the first heat transfer contact surface (121) is provided with a heat conduction coating for improving the heat conduction rate, the heat conduction coating being used for contacting the heat generating member.

7. The heat dissipating device of claim 1, wherein The first fixing structure is arranged at the outer periphery of the position of the structure main body (31) for mounting the heat generating member; The second fixing structure is arranged at the outer peripheral edge of the structure main body (31).

8. The heat dissipating device according to claim 7, wherein The heat dissipation device is provided with a first temperature detection member for detecting the surface temperature thereof and a heat dissipation fan, the heat dissipation structure (2) being a heat dissipation fin, the heat dissipation fin being provided with a flow rate detection member for detecting the flow rate of the gas flowing through the heat dissipation structure (2); The structure main body (31) is provided with a mounting groove (314) for mounting the heat generating member, the thickness of the heat generating member being lower than the depth of the mounting groove (314), when the first heat transfer contact surface (121) of the heat conduction member (1) contacts the heat generating member, the heat conduction member (1) is at least partially located in the mounting groove (314).

9. The heat dissipating device according to claim 8, wherein The structure main body (31) is provided with a display, an alarm and a controller for displaying the temperature of the heat generating member, the first temperature detection member being used for acquiring the temperature information of the heat generating member and transmitting the temperature information to the controller, when the temperature information is outside the preset temperature range, the controller controls the alarm to issue warning information, and the display is arranged on the outer side of the structure main body (31).

10. A server, characterized by The heat dissipation device comprises the heat dissipation device according to any one of claims 1-9.

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