Control apparatus and substrate processing apparatus including the same

Abstract

A control apparatus and a substrate processing apparatus including the same are provided. The substrate processing apparatus includes: a support unit including a rotating head and configured to support and rotate a substrate; a spraying unit configured to spray the processing liquid onto the substrate; a correction unit, in the swing arm, configured to move to a target point on the substrate and irradiate the light beam when the processing liquid is sprayed onto the substrate; and a control unit configured to calculate a target point, in which the control unit is configured to convert image coordinates associated with a first coordinate system and then calculate the target point by converting the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and the second coordinate system is based on rotation angles of the rotating head and the swing arm.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0110603 filed on August 23, 2023 in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a method of calculating coordinates on a substrate in a substrate processing apparatus including a swing table, a computer program for executing the method, and a substrate processing apparatus including a control device equipped with a processor for running the computer program. Background Art

[0004] In the photolithography process, a circuit pattern can be formed on a semiconductor device using a photomask. In order to produce semiconductor devices with high precision and uniformity, the pattern line width of the semiconductor device can be identified and the critical dimension (CD) of the photomask can be corrected.

[0005] Due to space issues and the risk of contamination within the chamber, equipment for calibrating the CD of a photomask may use a swing stage instead of a conventional X / Y stage. Therefore, it is difficult to precisely align the desired point on the photomask with the laser beam. Summary of the invention

[0006] Aspects of the present disclosure provide a control device that can accurately calculate coordinates of a desired point on a substrate in a swing stage, and a substrate processing apparatus including the control device.

[0007] However, the aspects of the present disclosure are not limited to those described herein. The above and other aspects of the present disclosure will become more apparent to those skilled in the art to which the present disclosure belongs by referring to the detailed description of the present disclosure given below.

[0008] According to one aspect of the present disclosure, a substrate processing device includes: a supporting unit, including a rotating head, and configured to support and rotate a substrate; a spraying unit, configured to spray a processing liquid onto the substrate; a correction unit, in a swing arm, configured to move to a target point on the substrate and irradiate a light beam when the processing liquid is sprayed onto the substrate; and a control unit, configured to calculate a target point, wherein the control unit is configured to convert image coordinates associated with a first coordinate system, and then calculate the target point by converting the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and the second coordinate system is based on the rotation angle of the rotating head and the swing arm.

[0009] According to another aspect of the present disclosure, a control device is used to calculate a target point on a substrate using a swing arm and a rotating head located in a substrate processing device. The control device is configured to: convert image coordinates associated with a first coordinate system, convert the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and calculate the target point by reflecting an offset associated with a moving direction of the rotating head in the image coordinates associated with the second coordinate system, and the second coordinate system is based on a rotation angle of the rotating head and the swing arm.

[0010] According to another aspect of the present disclosure, a substrate processing device includes: a supporting unit, including a rotating head, and configured to support and rotate a substrate; a spraying unit, configured to spray a processing liquid onto the substrate; a correction unit, in a swing arm, configured to move to a target point on the substrate and irradiate a light beam when the processing liquid is sprayed onto the substrate; and a control unit, configured to determine the target point, wherein the control unit is configured to: use affine transformation to convert image coordinates associated with a first coordinate system, convert the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and determine the target point by reflecting an offset associated with a moving direction of the rotating head and an offset associated with a moving direction of the swing arm in the image coordinates associated with the second coordinate system, the second coordinate system being based on a rotation angle of the rotating head and the swing arm, and the control unit is configured to: determine the target point using the coordinates of an alignment key by measuring first and second coordinates of an alignment key on the substrate at first and second points where the alignment key intersects the swing arm, and converting values ​​derived from the first and second coordinates, and thereby calculating the coordinates of the alignment key whose horizontality is corrected.

[0011] It should be noted that the effects of the present disclosure are not limited to those described above, and other effects of the present disclosure will be apparent from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and other aspects and features of the present disclosure will become more apparent by describing in detail example embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0013] Figure 1 is a block diagram showing the internal configuration of a substrate processing apparatus;

[0014] Figure 2 is a first exemplary schematic diagram for explaining the internal configuration of a substrate processing apparatus;

[0015] Figure 3 is a second exemplary schematic diagram for explaining the internal configuration of the substrate processing apparatus;

[0016] Figure 4is a schematic diagram for explaining an example of the internal configuration of a correction unit in a substrate processing apparatus;

[0017] Figure 5 is a flow chart for explaining a method of calculating coordinates of alignment keys on a mask using a substrate processing apparatus;

[0018] Figure 6 is an example schematic diagram for explaining alignment keys on a mask;

[0019] Figure 7 It is used to explain Figure 5 A first example schematic diagram of the conversion of reference coordinates performed in the method;

[0020] Figure 8 It is used to explain Figure 5 A second example schematic diagram of the conversion of reference coordinates performed in the method;

[0021] Fig. 9 It is used to explain Figure 5 A third exemplary schematic diagram of the conversion of reference coordinates performed in the method;

[0022] Fig.10 It is for Figure 5 A fourth example schematic diagram of the conversion of reference coordinates performed in the method;

[0023] Fig.11 is a first exemplary schematic diagram for explaining an intersection between an alignment key on a mask and a swing arm;

[0024] Fig.12 is a second exemplary schematic diagram for explaining an intersection between an alignment key on a mask and a swing arm;

[0025] Fig.13 is a first exemplary flow chart for explaining a method of measuring an alignment key using reference coordinates;

[0026] Fig.14 is a first example schematic diagram for explaining the conversion of alignment keys to equipment coordinates;

[0027] Fig.15 is a second exemplary flow chart for explaining a method of measuring an alignment key using reference coordinates;

[0028] Fig.16 is a second example schematic diagram for explaining the conversion of alignment keys to equipment coordinates;

[0029] Fig.17 It is used to explain Figure 5 An example schematic diagram of the correction of the coordinate transformation formula performed in the method; and

[0030] Fig.18is a flowchart for explaining a method of converting coordinates of a target point on a mask into coordinates in a substrate processing apparatus. DETAILED DESCRIPTION

[0031] Embodiments of the present disclosure will be described with reference to the accompanying drawings. In the accompanying drawings, the same reference numerals are used for the same components, and redundant descriptions thereof may be omitted for the sake of brevity.

[0032] Figure 1 is a block diagram showing the internal configuration of a substrate processing apparatus. Figure 1 , the substrate processing apparatus 100 may include a support member or a support unit 110 , a sprayer or a spray unit 120 , a correction unit 130 , and a controller or a control unit 140 .

[0033] The substrate processing apparatus 100 may perform a wet cleaning process on the substrate. Alternatively, the substrate processing apparatus 100 may perform a wet etching process on the substrate. The substrate processing apparatus 100 may be applicable to a photolithography process.

[0034] The substrate processing apparatus 100 may correct a critical dimension (CD) of a substrate using a light beam. For example, the substrate processing apparatus 100 may correct a CD using an extreme ultraviolet (EUV) light beam. For example, the substrate processing apparatus 100 may correct a CD of a photomask.

[0035] The supporting unit 110 may support the substrate when processing the substrate. The supporting unit 110 may support the substrate when spraying chemicals onto the substrate. The supporting unit 110 may support the substrate when correcting the CD of the substrate using a light beam.

[0036] The support unit 110 may be configured as a swing type workbench. The support unit 110 may include a rotary chuck. For example, the support unit 110 may be configured to include a rotary head 221, a rotary shaft or a rotary shaft 222, a rotary drive portion 223, a support pin 224, and a guide pin 225.

[0037] Figure 2 1 is a schematic diagram for explaining a first example of the internal configuration of a substrate processing apparatus. Figure 2 .

[0038] refer to Figure 2 , the first direction D1 and the second direction D2 form a plane. For example, the first direction D1 may be a front-to-back direction, and the second direction D2 may be a left-to-right direction. Alternatively, the first direction D1 may be a left-to-right direction, and the second direction D2 may be a front-to-back direction. The third direction D3 is a height direction, and is perpendicular to the plane formed by the first direction D1 and the second direction D2.

[0039] The support unit 110 may be disposed in the chamber housing 210. The spray unit 120 and the correction unit 130 may be disposed on the chamber housing 210. The chamber housing 210 may provide a space for processing the substrate S. However, the present disclosure is not limited thereto. Alternatively, the support unit 110, the spray unit 120, and the correction unit 130 may all be disposed in the chamber housing 210.

[0040] The rotating head 221 may be provided to accommodate a substrate S thereon. The rotating head 221 may rotate according to the operation of the rotating shaft 222. The substrate S may rotate together with the rotating head 221 while being placed on the rotating head 221. The rotating head 221 may rotate clockwise. Alternatively, the rotating head 221 may rotate counterclockwise.

[0041] The rotating head 221 may have a cross-sectional shape different from that of the substrate S. For example, the rotating head 221 may have a circular cross-sectional shape, while the substrate S may have a rectangular cross-sectional shape. However, the present disclosure is not limited to this example. Alternatively, the rotating head 221 may have the same cross-sectional shape as the substrate S.

[0042] The rotating shaft 222 may generate a rotating force using electric energy provided from the rotating driving part 223. The rotating shaft 222 may provide the rotating head 221 with a rotating force so that the rotating head 221 rotates.

[0043] The support pins 224 and the guide pins 225 can fix the substrate S on the rotating head 221. The support pins 224 can support the bottom surface of the substrate S on the rotating head 221. The support pins 224 can support the bottom surface of the substrate S so that the substrate S does not contact the top surface of the rotating head 221. The guide pins 225 can support the side or edge of the substrate S on the rotating head 221. The guide pins 225 can support the side of the substrate S to prevent the substrate S from detaching from the rotating head 221 when the rotating head 221 rotates. The guide pins 225 can be used as a latch. A plurality of support pins 224 and a plurality of guide pins 225 can be provided on the rotating head 221, but the present disclosure is not limited thereto. The support pins 224 and the guide pins 225 can be provided to have or define an annular shape.

[0044] Reference Figure 1 , the spray unit 120 sprays the processing liquid onto the substrate S. The spray unit 120 may include a plurality of nozzles, but the present disclosure is not limited thereto. Alternatively, the spray unit 120 may include a single nozzle. In the case where the spray unit 120 includes a plurality of nozzles, each nozzle may spray a different processing liquid. For example, the spray unit 120 may include a first nozzle 231, a second nozzle 232, and a third nozzle 233 (see, for example, Figure 3 ).

[0045] Figure 32 is a schematic diagram for explaining a second example of the internal configuration of the substrate processing apparatus. Figure 3 .

[0046] refer to Figure 3 , the first nozzle 231, the second nozzle 232, and the third nozzle 233 may move to a processing position or a main port HP. The processing position refers to an upper area of ​​the substrate S. After moving to the processing position, the first nozzle 231, the second nozzle 232, and the third nozzle 233 may spray a processing liquid onto the substrate S. The main port HP is disposed in an outer area outside the top of the substrate S. After spraying the processing liquid onto the substrate S, the first nozzle 231, the second nozzle 232, and the third nozzle 233 may move to the main port HP for waiting.

[0047] The first nozzle 231, the second nozzle 232, and the third nozzle 233 may rotate to move from the processing position to the main port HP. After the rotation, the first nozzle 231, the second nozzle 232, and the third nozzle 233 may rise at the main port HP. The first nozzle 231, the second nozzle 232, and the third nozzle 233 may rise at the processing position and then rotate.

[0048] The first nozzle 231, the second nozzle 232, and the third nozzle 233 may rotate to move from the main port HP to the processing position. After the rotation, the first nozzle 231, the second nozzle 232, and the third nozzle 233 may rise at the processing position. The first nozzle 231, the second nozzle 232, and the third nozzle 233 may rise at the main port HP and then rotate.

[0049] The first nozzle 231 can spray the first treatment liquid. The second nozzle 232 can spray the second treatment liquid. The third nozzle 233 can spray the third treatment liquid. The first treatment liquid, the second treatment liquid and the third treatment liquid can contain or include the same material. Alternatively, the first treatment liquid, the second treatment liquid and the third treatment liquid can contain or include different materials. Alternatively, some of the first treatment liquid, the second treatment liquid and the third treatment liquid can contain or include the same material, and the remaining treatment liquids can contain or include different materials.

[0050] The first treatment liquid may be an alkaline solution. For example, the first nozzle 231 may spray a standard cleaning solution 1 (SC-1). SC-1 may be a solution containing hydrogen peroxide (H 2 O 2 ) and ammonium hydroxide (NH 4 The second treatment liquid may be a hydrogen solution diluted with an alkaline chemical. For example, the second nozzle 232 may spray hydrogen water (H 2W). The first treatment liquid and the second treatment liquid may be provided on the substrate S at the same time, but the present disclosure is not limited thereto. Alternatively, the first treatment liquid and the second treatment liquid may be provided sequentially on the substrate S. The third treatment liquid may be a rinse liquid. For example, the third nozzle 233 may spray deionized water (DIW).

[0051] although Figure 1 Although not shown in the figure, the substrate processing apparatus 100 may further include a collecting unit 150 and a lifting unit 160. The following description refers to Figure 2 .

[0052] refer to Figure 2 , the collecting unit 150 may be disposed around the supporting unit 110. The collecting unit 150 may collect a processing liquid used when processing or disposing the substrate S. When the substrate S is fixed on the supporting unit 110 and the supporting unit 110 rotates, the spraying unit 120 may spray the processing liquid onto the substrate S. Due to the centrifugal force generated by the rotation of the supporting unit 110, the processing liquid discharged onto the substrate S may be thrown out toward the direction where the collecting unit 150 is located. The collecting unit 150 may collect the processing liquid scattered in various directions through the inlet.

[0053] The collecting unit 150 may be configured to include a plurality of collecting pipes. The collecting unit 150 may collect different types of treatment fluids into different collecting pipes, thereby achieving reuse of the treatment fluids. For example, the collecting unit 150 may include a first collecting pipe 241, a second collecting pipe 242, and a third collecting pipe 243. The first collecting pipe 241, the second collecting pipe 242, and the third collecting pipe 243 may have a bowl shape.

[0054] The first collection pipe 241, the second collection pipe 242, and the third collection pipe 243 can collect different types of treatment liquids. For example, the first collection pipe 241 can collect a rinse liquid, the second collection pipe 242 can collect a first treatment liquid, and the third collection pipe 243 can collect a second treatment liquid. The first collection pipe 241 can collect a rinse liquid through a first inlet 244. The second collection pipe 242 can collect a first treatment liquid through a second inlet 245. The third collection pipe 243 can collect a second treatment liquid through a third inlet 246.

[0055] although Figure 2 Although not shown in the figure, the first collecting pipe 241, the second collecting pipe 242 and the third collecting pipe 243 can be connected to their respective recovery lines. The treatment liquid collected by the first collecting pipe 241, the second collecting pipe 242 and the third collecting pipe 243 can be reused by the treatment liquid regeneration unit.

[0056] The first collecting duct 241, the second collecting duct 242, and the third collecting duct 243 may be provided in an annular shape. The first collecting duct 241 may be installed to surround the support unit 110. The second collecting duct 242 may be installed to surround the first collecting duct 241. The third collecting duct 243 may be installed to surround the second collecting duct 242.

[0057] Meanwhile, if the spray unit 120 includes a single nozzle, the collection unit 150 may include a single collection pipe. The collection unit 150 may be equipped with the same number of collection pipes as the number of nozzles in the spray unit 120.

[0058] The lifting unit 160 can lift the collecting unit 150. The lifting unit 160 can simultaneously lift the first collecting pipe 241, the second collecting pipe 242, and the third collecting pipe 243. According to the type of the treatment liquid, the lifting unit 160 can adjust the height of the collecting unit 150 so that the treatment liquid can be collected into the corresponding collecting pipes 241, 242, and 243 through the corresponding inlets 244, 245, and 246.

[0059] Reference Figure 1 , the correction unit 130 may use the light beam to correct information related to the pattern element formed on the substrate S. For example, the correction unit 130 may use the laser beam to correct the CD of the pattern element. Hereinafter, a mask will be described as an example of the substrate S, but the present disclosure is not limited thereto.

[0060] The correction unit 130 may be configured to include an image acquisition module 251 and a beam irradiation module 252 to correct the CD of the pattern elements formed on the mask. The image acquisition module 251 and the beam irradiation module 252 may be installed in the swing arm 250 (see, for example, Figure 4 ).

[0061] Figure 4 1 is a schematic diagram for explaining an example of the internal configuration of a correction unit in a substrate processing apparatus. Figure 4 .

[0062] The image acquisition module 251 may acquire a surface image of the mask. The surface image of the mask may include the shape of the pattern formed on the mask. Using the surface image of the mask, the line width of the pattern formed on the mask may be identified.

[0063] The image acquisition module 251 can be configured as a visual system including a visual camera. The image acquisition module 251 can include a camera sensor 251a and a lamp or light source 251b. The lamp 251b can illuminate the surface of the mask along the second optical path 254. The lamp 251b can be configured as a light emitting diode (LED) lamp, for example. The camera sensor 251a can acquire a surface image of the mask while the lamp 251b is operating. The camera sensor 251a can acquire a surface image of the mask based on a light signal that enters through the light inlet 256 and travels along the first optical path 253. Although Figure 4 Although not shown in the figure, the image acquisition module 251 may further include lenses, mirrors, etc. along the first optical path 253 and the second optical path 254.

[0064] The beam irradiation module 252 may irradiate a laser beam onto the surface of the mask. For example, the beam irradiation module 252 may irradiate an EUV beam. When a treatment liquid is provided on the mask, the beam irradiation module 252 may irradiate a laser beam onto the mask. The beam irradiation module 252 may irradiate a laser beam along a third optical path 255.

[0065] The beam irradiation module 252 can locally heat a designated location on the mask based on information provided by the surface image of the mask. The laser beam can activate the processing liquid on the mask, thereby potentially improving the efficiency of cleaning or etching the mask. The beam irradiation module 252 can adjust the line width of the micro pattern formed on the mask.

[0066] The beam irradiation module 252 may be configured as a laser optical module including a laser source. The beam irradiation module 252 may include a laser sensor 252a and a beam expander 252b. Figure 4 Although not shown in the figure, the light beam irradiation module 252 may further include a beam splitter, a reflector, etc. along the third light path 255.

[0067] Reference Figure 1 , the control unit 140 may control the overall operation of the supporting unit 110 , the spraying unit 120 , and the correcting unit 130 . In addition, the control unit 140 may also control the overall operation of the collecting unit 150 and the lifting unit 160 .

[0068] The control unit 140 may include a processor for performing control on each component of the substrate processing apparatus 100, a network for facilitating wired or wireless communication with each component of the substrate processing apparatus 100, and a storage module or memory for storing instructions related to functions or operations of each component for controlling the substrate processing apparatus 100, a processing recipe including instructions, various data, etc. Additionally, the control unit 140 may also include a user interface including input features or mechanisms for facilitating an operator to manage the substrate processing apparatus 100 through command input operations, and output features or mechanisms for visualizing and displaying the operating status of the substrate processing apparatus 100. The control unit 140 may be configured as a computing device for data processing and analysis, command transmission, etc.

[0069] The instruction may be set in the form of a computer program or application. A computer program may include one or more instructions and may be stored on a computer readable recording medium. The instruction may include a code generated by a compiler, an interpreter executable code, etc. The storage module may be set to be selected from a hard disk drive (HDD), a solid state drive (SSD), a card memory, a random access memory (RAM), a static RAM (SRAM), a read-only memory (ROM), an electrically erasable programmable ROM (EEPROM), a programmable ROM (PROM), a magnetic memory, a disk, and one or more storage media among an optical disk.

[0070] In order to enable the beam irradiation module 252 to accurately aim at a desired point on the mask, the camera sensor 251 a of the image acquisition module 251 may be used to measure the alignment keys on the mask.

[0071] However, since the substrate processing apparatus 100 uses a swing stage instead of a conventional X / Y stage, coordinate conversion is required. The X / Y coordinates of the mask can be determined based on the fixed length of the swing arm 250, the position of the rotation center of the rotating head 221, etc., and then can be converted to the X / Y coordinates of the equipment (i.e., the substrate processing apparatus 100). coordinate system and vice versa.

[0072] When switching to the substrate processing apparatus 100 When the same position is measured in two independent coordinate systems, the same position can be measured in two independent coordinate systems. The two independent coordinate systems can be symmetrical with respect to a straight line connecting the rotation center of the swing arm 250 and the rotation center of the rotating head 221. Ideally, when perfectly aligned, the substrate processing device 100 can accurately convert a desired position between the two coordinate systems.

[0073] However, in reality, various environmental factors such as misalignment when placing the mask, assembly tolerances of components of the substrate processing apparatus 100, and accuracy of the rotating motor may cause errors during coordinate conversion. Applying affine transformation after conversion to a single coordinate system like a conventional X / Y stage may not achieve the accuracy required for processing.

[0074] To solve this problem, the alignment key may be measured not only in the first quadrant coordinate system in which the swing arm 250 passes through the center of the rotating head 221, but also in the third quadrant coordinate system in which the swing arm 250 does not pass through the center of the rotating head 221. Thereafter, the alignment key may be converted to the X / Y coordinate system, averaged, and then affine transformed.

[0075] Due to equipment errors, the average value of the alignment key may be different from the values ​​of the alignment key in the first quadrant region and the third quadrant region of the coordinate plane. When the average value of the alignment key is converted to the coordinate system of the substrate processing apparatus 100, a direction error can be observed. In order to correct the direction error, a direction error for The offset value of the coordinate system. It can be used to convert the X / Y coordinates of the desired point on the mask into The coordinates are then added with the offset value. In this way, the coordinates of the desired point on the mask on the swing stage can be calculated accurately.

[0076] The method for calculating the coordinates of the desired point on the mask on the swing stage will be described below. The method can be performed by the control unit 140. The other components of the substrate processing device 100 can be operated according to the command from the control unit 140 or under the control of the control unit 140. The method can be set to a computer program executable by the control unit 140. The computer program can be stored and set on a computer readable recording medium. The computer readable recording medium can store program codes executable by the processor. For example, the computer readable recording medium can be set to a portable disk (e.g., HDD, SSD, CD-ROM or DVD) or a semiconductor memory (e.g., flash memory).

[0077] Figure 5 1 is a flowchart for explaining a method for calculating the coordinates of an alignment key on a mask using a substrate processing apparatus. The following description refers to Figure 5 .

[0078] refer to Figure 5 , the coordinates of the desired point on the mask can be calculated based on a plurality of alignment keys disposed on the side of the mask. Figure 6, the mask M may include four alignment keys, namely, a first alignment key 410a, a second alignment key 410b, a third alignment key 410c, and a fourth alignment key 410d, respectively disposed near four corners of the mask M. The coordinates of the desired point 420 on the mask M may be calculated based on the coordinates of at least one of the first alignment key 410a, the second alignment key 410b, the third alignment key 410c, and the fourth alignment key 410d. Figure 6 is an exemplary diagram for explaining alignment keys on a mask.

[0079] How to calculate the coordinates of the first alignment key 410a will be described below, and the following description may also be applicable to calculating the coordinates of each of the second alignment key 410b, the third alignment key 410c, and the fourth alignment key 410d.

[0080] First, the control unit 140 converts the X / Y coordinate system of the mask M into the X / Y coordinate system of the substrate processing apparatus 100. Coordinate system (S310).

[0081] The two-dimensional (2D) coordinates of each point on the mask M may be expressed based on an X / Y coordinate system. For example, the coordinates of the first alignment key 410a may be expressed as (X, Y) relative to the center of the mask M. The coordinates of the first alignment key 410a may be expressed as (X′, Y′) relative to the origin of the substrate processing apparatus 100. Figure 7 It is used to explain Figure 5 A first example schematic diagram of a reference coordinate transformation performed in the method.

[0082] The substrate processing apparatus 100 does not have a worktable based on an X / Y coordinate system. The substrate processing apparatus 100 includes two rotating elements, ie, a rotating head 221 and a swing arm 250 .

[0083] In the substrate processing apparatus 100, the rotation angle of the rotating head 221 can be calculated. and the rotation angle (θ) of the swing arm 250. Using these two degrees of freedom, the coordinates of the first alignment key 410a can be transformed into the coordinates of the substrate processing apparatus 100. For example, the rotation angle (θ) of the swing arm 250 and the rotation angle (θ) of the rotating head 221 may be used. The coordinates (X, Y) of the first alignment key 410a are mapped to the coordinates based on the origin of the substrate processing apparatus 100. The origin of the substrate processing apparatus 100 may be determined based on the rotation axis of the swing arm 250 . Figure 8 It is used to explain Figure 5 A second example schematic diagram of the conversion of reference coordinates performed in the method.

[0084] The first alignment key 410a may intersect the light inlet 256 of the swing arm 250 vertically (i.e., in the third direction D3) according to the rotation of the swing arm 250 and the rotating head 221. Here, the intersection of the first alignment key 410a and the light inlet 256 in the third direction D3 means that the first alignment key 410a and the light inlet 256 are placed on the same line in the third direction D3. For example, if the spatial coordinates of the first alignment key 410a are (X1, Y1, Z1), and the spatial coordinates of the light inlet 256 are (X2, Y2, Z2), the first alignment key 410a and the light inlet 256 may satisfy the following conditions: X1=X2, Y1=Y2, and Z1≠Z2.

[0085] However, reference Fig. 9 Due to various environmental factors such as assembly tolerances between components within the substrate processing apparatus 100, the mask M may not be horizontally located on the top surface S of the rotating head 221. In this case, the image acquisition module 251 may not be able to acquire a rectangular surface image of the mask M. The image acquisition module 251 may acquire a distorted surface image of the mask M. For example, referring to Fig.10 , the image acquisition module 251 may acquire the trapezoidal surface image of the mask M.

[0086] Affine transformation cannot correct the horizontality of the mask M. If the mask M exhibits both tilt and rotation simultaneously, the intersection point between the first alignment key 410 a and the light entrance 256 may not be accurately targeted. Fig. 9 It is used to explain Figure 5 A third example schematic diagram of the reference coordinate transformation performed in the method. Fig.10 It is for Figure 5 A fourth example schematic diagram of the reference coordinate transformation performed in the method.

[0087] The first alignment key 410 a may intersect the light entrance 256 of the swing arm 250 in the third direction D3 at two different points (ie, a first point and a second point) according to the rotation of the swing arm 250 and the rotating head 221 .

[0088] Specifically, the first alignment key 410a may intersect the light inlet 256 of the swing arm 250 in the third direction D3 at a first point. The first alignment key 410a may intersect the light inlet 256 in a first quadrant region where the swing arm 250 passes through the center of the rotating head 221. If the top surface S of the rotating head 221 is divided into four quadrant regions (i.e., first to fourth quadrant regions), the first point may be located in the first quadrant region. Fig.11 is a first example diagram for explaining the intersection between the alignment key on the mask and the swing arm.

[0089] The first alignment key 410a may also intersect the light entrance 256 of the swing arm 250 in the third direction D3 at a second point. The first alignment key 410a may intersect the light entrance 256 in a third quadrant plane in which the swing arm 250 does not pass through the center of the rotating head 221. If the top surface S of the rotating head 221 is divided into four quadrant areas (i.e., first to fourth quadrant areas), the second point may be located in the third quadrant area. Fig.12 is a second exemplary diagram for explaining the intersection between the alignment key on the mask and the swing arm.

[0090] Reference Figure 5 In step S310, the reference coordinates are converted from the X / Y coordinate system to After the coordinate system, the control unit 140 measures the coordinates of the first alignment key 410a at a first point in the first quadrant area (S320).

[0091] The measurement of the coordinates of the first alignment key 410a at the first point (ie, step S320) will be described below. Fig.13 is a first exemplary flow chart for explaining a method of measuring an alignment key using reference coordinates.

[0092] refer to Fig.13 , the rotating head 221 rotates. As the rotating head 221 rotates, the mask M located on the rotating head 221 can rotate, and the swing arm 250 can also rotate according to the rotation of the rotating head 221 (S510). The rotating head 221 and the swing arm 250 can rotate at the same time, but the present disclosure is not limited to this. Alternatively, one of the rotating head 221 and the swing arm 250 can rotate first, and after a predetermined amount of time, the other can rotate.

[0093] As previously referenced Fig.11 As explained, the first alignment key 410a may intersect the light entrance 256 of the swing arm 250 at a first point within the first quadrant region according to the rotation of both the turning head 221 and the swing arm 250 (S520).

[0094] When the first alignment key 410a reaches a first point where the first alignment key 410a intersects the light entrance 256 of the swing arm 250, the image acquisition module 251 acquires a surface image of the mask M including the first alignment key 410a based on the field of view (FOV) of the camera sensor 251a (S530).

[0095] Thereafter, the control unit 140 detects the position of the first alignment key 410a by processing the acquired surface image (S540).

[0096] The first alignment key 410a may be located at the center of the FOV of the camera sensor 251a in the acquired surface image (S550). However, if the first alignment key 410a is not located at the center of the FOV (S550), the control unit 140 calculates the distance between the position of the first alignment key 410a and the center of the FOV (S560).

[0097] Thereafter, the control unit 140 corrects the error based on the distance between the position of the first alignment key 410a and the center of the FOV to align the position of the first alignment key 410a with the center of the FOV (S570). The control unit 140 may repeat the process of correcting the error until the position of the first alignment key 410a is aligned with the center of the FOV.

[0098] Once the position of the first alignment key 410a is aligned with the center of the FOV, the control unit 140 The coordinate system calculates the coordinates of the first alignment key 410a at a first point within the first quadrant region (S580). When the first alignment key 410a is located at the center of the FOV, the control unit 140 may calculate the coordinates of the first alignment key 410a at the first point based on the acquired surface image of the mask M.

[0099] refer to Fig.14 The control unit 140 may convert the coordinates (X, Y) of the first alignment key 410a in the X / Y coordinate system into coordinates in the first quadrant coordinate system of the substrate processing apparatus 100, that is, the first Coordinates in the coordinate system Fig.14 is a first example diagram for explaining the conversion of alignment keys to equipment coordinates.

[0100] [Equation 1]

[0101] θ 1 =θ c +cos -1 (1-r m 2 / 2R 2 )

[0102] Referring to Equation 1, θ 1 represents the rotation angle of the swing arm 250, specifically, the rotation angle of the swing arm 250 when the first alignment key 410a intersects the light entrance 256 in the third direction D3 at the first point, θ c represents the base angle of the swing arm 250, specifically, the rotation angle of the swing arm 250 when the light inlet 256 intersects the center of the mask M in the third direction D3, r m∈ R represents the distance between the first alignment key 410a and the center of the mask M, and ∈ R represents the distance between the first alignment key 410a and the origin of the substrate processing device 100, specifically, the distance between the first alignment key 410a and the origin of the substrate processing device 100 when the first alignment key 410a intersects the light entrance 256 in the third direction D3 at a first point.

[0103] [Equation 2]

[0104]

[0105] Referring to Equation 2, represents the rotation angle of the rotating head 221, specifically, the rotation angle of the rotating head 221 that can be calculated based on the center of the mask M when the first alignment key 410a moves from the reference point to the first point, and φ denotes the base angle of the rotation head 221 that can be calculated based on the center of the mask M.

[0106] After measuring the coordinates of the first alignment key 410a at a first point in the first quadrant region (ie, step S320), the control unit 140 measures the coordinates of the first alignment key 410a at a second point in the third quadrant region (S330).

[0107] The following will refer to Fig.15 The measurement of the coordinates of the first alignment key 410a at the second point (ie, step S330) is described. Fig.15 is a second exemplary flow chart for explaining a method of measuring an alignment key using reference coordinates.

[0108] refer to Fig.15 , the rotating head 221 rotates. As the rotating head 221 rotates, the mask M located on the rotating head 221 can rotate, and the swing arm 250 can also rotate according to the rotation of the rotating head 221 (S610). The rotating head 221 and the swing arm 250 can rotate at the same time, but the present disclosure is not limited to this. Alternatively, one of the rotating head 221 and the swing arm 250 can rotate first, and after a predetermined amount of time, the other can rotate.

[0109] As previously referenced Fig.12 As mentioned, the first alignment key 410a may intersect the light entrance 256 of the swing arm 250 at a second point within the third quadrant region according to the rotation of both the turning head 221 and the swing arm 250 (S620).

[0110] When the first alignment key 410a reaches a second point where the first alignment key 410a intersects the light entrance 256 of the swing arm 250, the image acquisition module 251 acquires a surface image of the mask M including the first alignment key 410a based on the FOV of the camera sensor 251a (S630).

[0111] Thereafter, the control unit 140 detects the position of the first alignment key 410a by processing the acquired surface image (S640).

[0112] The first alignment key 410a may be located at the center of the FOV of the camera sensor 251a in the acquired surface image (S650). However, if the first alignment key 410a is not located at the center of the FOV (S650), the control unit 140 calculates the distance between the position of the first alignment key 410a and the center of the FOV (S660).

[0113] Thereafter, the control unit 140 corrects the error based on the distance between the position of the first alignment key 410a and the center of the FOV to align the position of the first alignment key 410a with the center of the FOV (S670). The control unit 140 may repeat the process of correcting the error until the position of the first alignment key 410a is aligned with the center of the FOV.

[0114] Once the position of the first alignment key 410a is aligned with the center of the FOV, the control unit 140 The coordinate system calculates the coordinates of the first alignment key 410a at the second point in the third quadrant region (S680). When the first alignment key 410a is located at the center of the FOV, the control unit 140 may calculate the coordinates of the first alignment key 410a at the second point based on the acquired surface image of the mask M.

[0115] refer to Fig.16 The control unit 140 may convert the coordinates (X, Y) of the first alignment key 410a in the X / Y coordinate system into coordinates in the third quadrant coordinate system of the substrate processing apparatus 100, that is, the second Coordinates in the coordinate system Fig.16 is a second example diagram for explaining the conversion of alignment keys to equipment coordinates.

[0116] [Equation 3]

[0117] θ 3 =θ c -cos -1 (1-r m 2 / 2R 2 )

[0118] Referring to Equation 3, θ 3 represents a rotation angle of the swing arm 250, specifically, a rotation angle of the swing arm 250 when the first alignment key 410a intersects the light entrance 256 perpendicularly (ie, in the third direction D3) at the second point.

[0119] [Equation 4]

[0120]

[0121] Referring to Equation 4, φ denotes a rotation angle of the rotation head 221, specifically, a rotation angle of the rotation head 221 that can be calculated based on the center of the mask M when the first alignment key 410a moves from the reference point to the second point.

[0122] The measurement of the coordinates of the first alignment key 410a at the first point (i.e., step S320) may be performed before the measurement of the coordinates of the first alignment key 410a at the second point (i.e., step S330), but the present disclosure is not limited thereto. Alternatively, step S320 may be performed after step S330. Alternatively, steps S320 and S330 may be performed simultaneously.

[0123] Reference Figure 5 In steps S320 and S330, the coordinates (X, Y) of the first alignment key 410a may be converted into the coordinates based on the origin of the substrate processing apparatus 100, taking into account the intersection between the rotating head 221 and the swing arm 250 being rotated. and coordinates In this way, even if the tilt and rotation of the mask M exist simultaneously, it is possible to and coordinates The intersection point between the mask M on the rotating head 221 and the swing arm 250 is accurately aimed.

[0124] Thereafter, the control unit 140 calculates the coordinates and coordinates The control unit 140 may calculate the average value of the coordinates and coordinates The average value between

[0125] Thereafter, the control unit 140 may change the reference coordinates from The coordinate system is converted back to the X / Y coordinate system. The control unit 140 can convert the coordinate system Convert to coordinates (X, Y) (S350). The following equation refers to Figure 8 .

[0126] [Equation 5]

[0127]

[0128]

[0129] Thereafter, the control unit 140 calculates an affine transformation matrix based on the coordinates (X, Y) of the first alignment key 410a (S360). Using the affine transformation matrix, the control unit 140 can geometrically transform the surface image of the mask M, thereby eliminating any image distortion caused by the tilt of the mask M.

[0130] refer to Fig.17 , if only the affine transformation matrix is ​​considered to transform the coordinates of the first alignment key 410 a , the actual position 440 of the first alignment key 410 a may deviate from the FOV center 430 . Fig.17 It is used to explain Figure 5 Specifically, the coordinate transformation formula can be corrected to reflect the characteristics of both the rotating head 221 and the swing arm 250, thereby ensuring that the actual position 440 of the first alignment key 410a is aligned with the FOV center 430.

[0131] The control unit 140 may adjust the coordinate transformation formula by reflecting the deviation of the moving direction of the rotating head 221 caused by the characteristics of the rotating head 221 and the deviation of the moving direction of the swing arm 250 caused by the characteristics of the swing arm 250. The control unit 140 may calculate the coordinates of the first alignment key 410a. and coordinates The difference between θ and Offset( Figure 5 Alternatively, the control unit 140 may also calculate the coordinates of the first alignment key 410a. and coordinates The difference between θ and Offset.

[0132] Hereinafter, it will be described how to convert the coordinates of the target point on the mask M into the coordinates in the substrate processing apparatus 100 when the alignment key is used. Fig.18 is a flowchart for explaining a method of converting the coordinates of a target point on a mask into coordinates in a substrate processing apparatus. The following description refers to Fig.18 .

[0133] refer to Fig.18 When a specific point on the mask M in the substrate processing apparatus 100 is locally heated to improve the etching or cleaning efficiency or the rinsing efficiency in the corresponding area, the coordinates of the target point on the mask M can be converted into coordinates in the substrate processing apparatus 100.

[0134] First, the control unit 140 calculates the coordinates (X', Y') by applying the coordinates (X, Y) of the target point to the affine transformation matrix (S710). The coordinates (X, Y) represent the coordinates of the target point in the original image, and the coordinates (X', Y') represent the coordinates of the target point in the geometrically transformed image.

[0135] Thereafter, the control unit 140 converts the coordinates (X′, Y′) in the X / Y coordinate system into Coordinates in the coordinate system (S720). The control unit 140 may determine the coordinates (X, Y) of the first alignment key 410a and the coordinates (X, Y). The relationship between the coordinates (X′, Y′) is converted into coordinates

[0136] Thereafter, the control unit 140 sets θ and The offset is reflected in the coordinates As a result, the control unit 140 may calculate the coordinates of the target point in the substrate processing apparatus 100 (S740).

[0137] The present disclosure relates to an apparatus and method for improving the coordinate accuracy of a target point in a mask M using an affine transformation. The present disclosure converts from an X / Y coordinate system to an affine transformation based on an equipment. A coordinate system is defined, and correction processing is performed based on an affine transformation reflecting the mechanical characteristics of the substrate processing apparatus 100 to achieve positional accuracy of the target point within the mask M.

[0138] The present disclosure can be applied to wet etching equipment, wet cleaning equipment, etc. Specifically, the present disclosure can be applied to accurately aiming at a target point on a mask M using a laser beam in such equipment. However, the present disclosure is not limited thereto, and can also be applied to any equipment equipped with a swing arm and a rotary chuck.

[0139] The exemplary embodiments of the present disclosure have been described above with reference to the accompanying drawings, but the present disclosure is not limited thereto, but can be implemented in other specific forms without changing the technical concept or gist of the present disclosure. Therefore, it should be understood that the embodiments set forth herein are illustrative in all aspects and not restrictive.

Claims

1. A substrate processing device, comprising: a support unit including a rotating head and configured to support and rotate a substrate; a spraying unit configured to spray a processing liquid onto the substrate; a correction unit, in the swing arm, the correction unit being configured to move to a target point on the substrate and irradiate a light beam when the processing liquid is sprayed onto the substrate; as well as a control unit configured to calculate the target point, wherein the control unit is configured to convert image coordinates associated with a first coordinate system and then calculate the target point by converting the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and The second coordinate system is based on the rotation angles of the rotating head and the swing arm.

2. The substrate processing apparatus according to claim 1, wherein: The control unit is configured to convert image coordinates associated with the first coordinate system using an affine transformation.

3. The substrate processing apparatus according to claim 1, wherein: The control unit is configured to calculate the target point by reflecting an offset associated with a moving direction of the rotating head in image coordinates associated with the second coordinate system.

4. The substrate processing apparatus according to claim 1, wherein: The control unit is configured to calculate the target point by reflecting an offset associated with a moving direction of the swing arm in image coordinates associated with the second coordinate system.

5. The substrate processing apparatus according to claim 1, wherein: The control unit is configured to calculate the target point using coordinates of an alignment key mounted on the substrate.

6. The substrate processing apparatus according to claim 5, wherein: The coordinates of the alignment key are coordinates of the alignment key whose horizontality is corrected with respect to the surface of the rotation head.

7. The substrate processing apparatus according to claim 5, wherein: The control unit is configured to measure first and second coordinates of the alignment key at first and second points where the alignment key intersects the swing arm, and calculate coordinates of the alignment key with horizontality corrected by converting values ​​derived from the first and second coordinates.

8. The substrate processing apparatus according to claim 7, wherein: The first point is the intersection between the swing arm and the alignment key after the swing arm passes the center of the rotating head.

9. The substrate processing apparatus according to claim 7, wherein: The second point is the intersection between the swing arm and the alignment key before the swing arm passes the center of the rotating head.

10. The substrate processing apparatus according to claim 7, wherein: The control unit is configured to measure the first coordinate and the second coordinate as coordinates associated with the second coordinate system.

11. The substrate processing apparatus according to claim 10, wherein: The control unit is configured to measure the first coordinate and the second coordinate based on the rotation angle of the swing arm relative to the rotation center of the rotating head, the distance between the alignment key and the center of the substrate, the distance between the alignment key and the rotation axis of the swing arm, and the rotation angle of the rotating head relative to the rotation center of the rotating head.

12. The substrate processing apparatus according to claim 7, wherein: The control unit is configured to calculate an average value of the first coordinate and the second coordinate.

13. The substrate processing apparatus according to claim 12, wherein: The control unit is configured to convert the calculated average value into coordinates associated with the first coordinate system.

14. The substrate processing apparatus according to claim 5, wherein The correction unit includes a camera sensor configured to acquire an image of the substrate, and The control unit uses the coordinates of the alignment key at the center of the field of view FOV of the camera sensor.

15. The substrate processing apparatus according to claim 14, wherein: The control unit is configured to correct an error associated with a rotation angle of the swing arm based on a distance between a position of the alignment key within the FOV and a center of the FOV.

16. A control device for calculating a target point on a substrate using a swing arm and a rotating head in a substrate processing device, in, The control device is configured to convert image coordinates associated with a first coordinate system, convert the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and calculate the target point by reflecting an offset associated with the moving direction of the rotating head in the image coordinates associated with the second coordinate system, and The second coordinate system is based on the rotation angles of the rotating head and the swing arm.

17. The control device according to claim 16, wherein: The control device is configured to calculate the target point by further reflecting an offset associated with the moving direction of the swing arm in image coordinates associated with the second coordinate system.

18. The control device according to claim 16, wherein: The control device is configured to convert image coordinates associated with the first coordinate system using an affine transformation.

19. The control device according to claim 16, wherein: The control device is installed in the substrate processing apparatus that processes the substrate using a processing liquid.

20. A substrate processing device, comprising: a support unit including a rotating head and configured to support and rotate a substrate; a spraying unit configured to spray a processing liquid onto the substrate; a correction unit, in the swing arm, the correction unit being configured to move to a target point on the substrate and irradiate a light beam when the processing liquid is sprayed onto the substrate; as well as a control unit configured to determine the target point, wherein the control unit is configured to convert the image coordinates associated with the first coordinate system using an affine transformation, convert the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and determine the target point by reflecting the offset associated with the moving direction of the rotating head and the offset associated with the moving direction of the swing arm in the image coordinates associated with the second coordinate system, The second coordinate system is based on the rotation angles of the rotating head and the swing arm, and The control unit is configured to determine the target point using the coordinates of the alignment key by measuring first and second coordinates of the alignment key on the substrate at first and second points where the alignment key intersects the swing arm, and converting values ​​derived from the first and second coordinates to calculate the coordinates of the alignment key whose horizontality is corrected.

Images