Load locking apparatus, semiconductor processing system, and method of processing substrate

Abstract

Load lock assemblies, semiconductor processing systems including the load lock assemblies, and related methods for regulating the temperature of a substrate within a load lock assembly are disclosed. The load locking assembly includes a temperature control assembly coupled to an elevator configured to provide vertical movement to the temperature control assembly within the load locking body.

Description

Technical Field

[0001] The present disclosure relates generally to the field of semiconductor processing systems and methods, and to the field of device and integrated circuit fabrication. More specifically, the present disclosure relates to a load lock, a semiconductor processing system including a load lock, and a method for regulating substrate temperature within a load lock. Background Art

[0002] Semiconductor processing systems, such as those employing cluster-type platforms, typically include a front end connected to a back end through a load lock. The front end typically connects the semiconductor processing system to the external environment and typically includes a front end substrate transfer robot to transfer substrates between the front end modules and the load lock. The back end typically includes one or more processing modules where substrate processing is performed, and a back end substrate transfer chamber that includes a back end substrate transfer robot for transferring substrates between the load lock and the processing modules. The load lock typically couples the back end of a semiconductor processing system to the front end of a semiconductor processing system and is typically arranged to isolate the environment maintained in the back end of a semiconductor processing system from the environment maintained in the front end of a semiconductor processing system.

[0003] Due to the various substrate processes performed within the process modules and the need to free up the process modules to process more substrates, substrates transferred from the process modules to the load lock are typically received and placed within the load lock at elevated temperatures. Such heated substrates may be cooled prior to transfer from the load lock to the front end of the semiconductor processing system. Alternatively, as a way to reduce the time to reach processing temperature in the process modules, substrates placed within the load lock to be processed in the process modules may be preheated prior to transfer to the process modules.

[0004] However, extended time periods for cooling / heating of substrates within a load lock can negatively impact the rate at which substrates are processed within a semiconductor processing system. Furthermore, because a load lock typically has a front side for interfacing with a front end of semiconductor processing equipment and a back side for interfacing with a back end of semiconductor processing equipment, additional interfacing of the load lock may be complex due to restricted access and / or limited space within and near the load lock. Therefore, there is a need for improved load locks and semiconductor processing systems including such load locks, as well as methods for regulating substrate temperature within a load lock.

[0005] Any discussion set forth in this section, including discussion of problems and solutions, has been included in the present disclosure merely to provide context for the present disclosure. Such discussion should not be considered as an admission that any or all of the present inventions are previously known or constitute prior art. Summary of the invention

[0006] This Summary may introduce some concepts in a simplified form that are further described below. This Summary is not intended to necessarily identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0007] Various embodiments of the present disclosure relate to load lock devices. As described in more detail below, the load lock devices described herein can be used in the manufacturing process of electronic devices. Such load lock devices can reduce the complexity and / or cost of manufacturing the devices.

[0008] According to an example of the present disclosure, a load lock device is provided. In such an example, the load lock device includes a load lock body, which includes a front side configured to be connected to a front-end module of an equipment, a back side configured to be connected to a back-end transfer module, and a side side including a side hole. In such an example, a substrate platform is disposed in the load lock body, and the substrate platform includes an upper platform surface and a lower platform surface. In such an example, the upper platform surface is configured to hold the substrate in a holding position in the load lock body. In such an example, a temperature control assembly is partially disposed in the load lock body, and a lifter is coupled to the temperature control assembly for providing vertical movement to the temperature control assembly. In such an example, a flexible sealing mechanism is connected between the side of the load lock body and the temperature control assembly, and the flexible sealing mechanism maintains the environment in the load lock body while moving the temperature control assembly.

[0009] According to an example of the present disclosure, the load lock device may further include, wherein the side hole has a first cross-sectional dimension greater than a maximum cross-sectional dimension of the temperature control component, such that the temperature control component is inserted and withdrawn through the side hole.

[0010] According to an example of the present disclosure, the locking device may further include, wherein the temperature control assembly includes a temperature regulating head having an upper temperature regulating surface.

[0011] According to an example of the present disclosure, the load lock may further include, wherein the elevator is configured to position the upper temperature conditioning surface at a distance greater than 10 mm from the lower platform surface when unloading / loading substrates from / into the load lock.

[0012] According to an example of the present disclosure, the locking device may further include, wherein the substrate platform includes a sub-platform for holding an additional substrate.

[0013] According to an example of the present disclosure, the load lock apparatus may further include, wherein the load lock body further includes an upper load lock chamber and a lower load lock chamber, and the temperature control assembly is partially disposed in the upper load lock chamber.

[0014] According to an example of the present disclosure, the load lock device may further include a sealing plate connected to a side of the load lock body, the sealing plate including a sealing hole aligned with the side hole, the sealing hole having a second cross-sectional dimension smaller than the first cross-sectional dimension.

[0015] According to an example of the present disclosure, the load lock device may further include, wherein the flexible sealing mechanism includes a bellows.

[0016] According to an example of the present disclosure, the load locking device may further include, wherein the first end of the bellows has a third cross-sectional dimension greater than the first cross-sectional dimension, so that the first end of the bellows contacts the sealing surface of the sealing plate and closes the sealing hole to form a first airtight seal.

[0017] According to an example of the present disclosure, the load lock device may further include, wherein the second end of the bellows contacts a sealing surface of the temperature control assembly to form a second airtight seal.

[0018] According to an example of the present disclosure, the load lock apparatus may further include, wherein the sealing surface of the temperature control component includes a surface of a flange of the temperature control component.

[0019] According to an example of the present disclosure, the locking device may further include, wherein the elevator provides a maximum vertical displacement of between 1 mm and 15 mm to the upper temperature regulating surface.

[0020] According to an example of the present disclosure, the locking device may further include, wherein the elevator is configured to position the upper temperature regulating surface at a distance less than 0.5 mm from the lower platform surface when regulating the temperature of a substrate placed on the upper platform surface.

[0021] According to an example of the present disclosure, the load lock apparatus may further include an additional temperature control assembly partially disposed within the lower load lock chamber and coupled to the lower elevator for providing vertical displacement to the additional temperature control assembly.

[0022] Various further embodiments of the present disclosure relate to semiconductor processing systems including load lock devices. As described in more detail below, the semiconductor processing systems described herein can be used in the manufacturing process of electronic devices. Such load lock devices can reduce the complexity and / or cost of manufacturing equipment.

[0023] In one aspect, a semiconductor processing system includes a load lock apparatus, the load lock apparatus including a load lock body, a substrate platform housed within the load lock body, and a temperature control assembly, the temperature control assembly including a temperature regulating head located within the load lock body at a proximal end, a coupler connected to an elevator at a distal end for raising and lowering the temperature regulating head, the distal end extending laterally through a side hole located in a side of the load lock body so that the distal end is located outside the load lock body. In such an example, the semiconductor processing system may also include a flexible sealing mechanism connected between the side of the load lock body and the temperature control assembly, the flexible sealing mechanism maintaining the environment within the load lock body during movement of the temperature regulating head. In such an example, the semiconductor processing system may also include a back end transfer module connected to a back side of the load lock body, the back end transfer module coupling a processing module to the load lock apparatus. In such an example, the semiconductor processing system may also include an equipment front end module connected to a front side of the load lock body, the equipment front end module housing a front end substrate transfer robot. In such an example, the elevator is configured to lower the temperature regulating head to allow a front-end substrate transfer robot to load / unload a substrate, and to raise the temperature regulating head to position the temperature regulating head near a substrate platform to provide at least one of heating and cooling to a substrate positioned on the substrate platform.

[0024] According to an example of the present disclosure, the semiconductor processing equipment may further include, wherein the load lock body further includes an upper load lock chamber and a lower load lock chamber, and the temperature control assembly is partially disposed in the upper load lock chamber. Other technical features will be apparent to those skilled in the art from the following drawings, descriptions, and claims.

[0025] According to an example of the present disclosure, the semiconductor processing equipment may further include an additional temperature control component that is partially disposed in the lower load lock chamber and is coupled to the lower lifter for providing vertical displacement to the additional temperature control component. Other technical features will be apparent to those skilled in the art from the following drawings, descriptions, and claims.

[0026] Various further embodiments of the present disclosure relate to methods for regulating substrate temperature within a load lock device. As described in more detail below, the methods described herein can be used during the manufacture of electronic devices. Such methods can reduce the complexity and / or cost of manufacturing the devices.

[0027] In one aspect, a method of regulating the temperature of a substrate within a load lock apparatus includes, at a load lock body housing a substrate platform, the substrate platform including an upper platform surface and a lower platform surface, the upper platform surface being configured to hold a substrate in a holding position within the load lock body. In such an example, the method may also include lowering a vertical position of a temperature control assembly disposed partially within the load lock body to a loading / unloading position, the unloading / loading position being distal to the lower platform surface. In such an example, the method may further include positioning a process substrate on the upper platform surface at the holding position, and raising the vertical position of the temperature control assembly to a substrate temperature regulating position proximate the lower platform surface to enable at least one of heating and cooling the substrate positioned at the holding position, wherein the lowering and raising of the temperature control assembly is accomplished by an elevator coupled to a distal portion of the temperature control assembly extending through an aperture in a side of the load lock body to an exterior of the load lock body.

[0028] According to an example of the present disclosure, the method may further include, wherein the temperature control assembly includes a temperature regulating head having an upper temperature regulating surface, wherein when in the loading / unloading position, the upper temperature regulating surface is located at a distance greater than 10 mm from the lower platform surface.

[0029] According to an example of the present disclosure, the method may further include, wherein when in the substrate temperature adjustment position, the upper temperature adjustment surface is located at a distance less than 0.5 mm from the lower platform surface. Other technical features will be apparent to those skilled in the art from the following drawings, descriptions and claims.

[0030] These and other embodiments will become apparent to those skilled in the art from the following detailed description of certain embodiments with reference to the accompanying figures.The present invention is not limited to any particular embodiment disclosed. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] To easily identify the discussion of any particular element or act, the most significant digit(s) in a reference number refers to the figure number in which the element is first introduced.

[0032] A more complete understanding of embodiments of the present disclosure may be obtained by referring to the detailed description and claims when considered in conjunction with the following illustrative drawings.

[0033] Figure 1 A semiconductor processing system according to one or more embodiments of the present disclosure is shown.

[0034] Figure 2 A load lock arrangement according to one or more embodiments of the present disclosure is shown.

[0035] Figure 3Another load lock apparatus according to one or more embodiments of the present disclosure is shown.

[0036] Figure 4 An additional load lock arrangement is shown in accordance with one or more embodiments of the present disclosure.

[0037] Figure 5 A temperature control assembly according to one or more embodiments of the present disclosure is shown.

[0038] Figure 6 An additional load lock arrangement is shown in accordance with one or more embodiments of the present disclosure.

[0039] Figure 7 Another load lock apparatus according to one or more embodiments of the present disclosure is shown.

[0040] Figure 8 An additional load lock apparatus including an upper load lock chamber and a lower load lock chamber according to one or more embodiments of the present disclosure is shown.

[0041] Fig. 9 A method of regulating the temperature of a substrate disposed within a load lock apparatus according to one or more embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0042] The descriptions of exemplary embodiments of devices, assemblies, and methods provided below are merely exemplary and are for illustrative purposes only. The following descriptions are not intended to limit the scope of the present disclosure or the claims. Furthermore, the recitation of multiple embodiments having the indicated features or steps is not intended to exclude other embodiments having additional features or steps, or other embodiments incorporating different combinations of the described features or steps.

[0043] As described in more detail below, various embodiments of the present disclosure relate to load locks, semiconductor processing systems including load locks, and related methods for regulating substrate temperatures within load locks. As described in more detail, the load locks described herein can be used in the manufacture of electronic devices. Such load locks can reduce the complexity and / or cost of manufacturing devices / integrated circuits and increase the yield of substrates processed within semiconductor processing equipment. In addition, the load locks and related semiconductor processing systems and methods disclosed herein can increase the accessibility and functionality of such devices, systems, and methods.

[0044] As used herein, the term "substrate" may refer to any one or more underlying materials that can be used to form or can be formed on a device, circuit or film by a method according to an embodiment of the present invention. The substrate may include a bulk material, such as silicon (e.g., single crystal silicon), other IV group materials, such as germanium, or other semiconductor materials, such as II-VI or III-V semiconductor materials, and may include one or more layers covering or located below the bulk material. In addition, the substrate may include various features, such as depressions, protrusions, etc. formed in or on at least a portion of the substrate layer. For example, the substrate may include a bulk semiconductor material and an insulating or dielectric material layer covering at least a portion of the bulk semiconductor material. In addition, the term "substrate" may refer to any one or more underlying materials that can be used or on which a device, circuit or film can be formed. "Substrate" may be continuous or discontinuous; rigid or flexible; solid or porous. "Substrate" may be in any form, such as a powder, a plate or a workpiece. Plate-shaped substrates may include wafers of various shapes and sizes. The substrate may be made of materials such as silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride and silicon carbide. The continuous substrate can extend beyond the boundaries of the processing chamber where the deposition process occurs, and can be moved through the processing chamber so that the process continues until the end of the substrate is reached. The continuous substrate can be provided by a continuous substrate feeding system that allows the continuous substrate to be manufactured and output in any suitable form. Non-limiting examples of continuous substrates may include sheets, nonwoven films, rolls, foils, nets, flexible materials, a bundle of continuous filaments or fibers (i.e., ceramic fibers or polymer fibers). The continuous substrate may also include a carrier or sheet on which a non-continuous substrate is mounted.

[0045] In addition, in the present disclosure, any two numbers of a variable may constitute a feasible range of the variable, and any range indicated may include or exclude endpoints. In addition, any values ​​of the variables indicated (regardless of whether they are expressed as "about") may refer to exact values ​​or approximate values, and include equivalents, and may refer to average values, median values, representative values, majority values, etc. In addition, in the present disclosure, the terms "including", "consisting of" and "having" independently refer to "usually or broadly including", "comprising", "essentially consisting of" or "consisting of" in some embodiments. In the present disclosure, the meaning of any definition does not necessarily exclude the common and customary meanings in some embodiments.

[0046] Turning now to the accompanying drawings, Figure 1A semiconductor processing system 100 is shown. The semiconductor processing system 100 includes a processing module 102, a back end transfer module 104, and a load lock apparatus 106 including a load lock body 108. The semiconductor processing system 100 also includes an equipment front end module (EFEM) 110, a controller 112, and an evacuation / exhaust source 114. In the example shown, the semiconductor processing system 100 includes a cluster platform 116 having four (4) processing modules, and the processing modules are configured to deposit material layers onto a substrate 118 using deposition techniques, such as atomic layer deposition (ALD), chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), and plasma enhanced atomic layer deposition (PEALD). This is for purposes of illustration and description only and is not limiting. In view of the present disclosure, those skilled in the art will understand that semiconductor processing systems configured for other material layer deposition operations and semiconductor processing systems configured for processing operations other than material layer deposition may also benefit from the present disclosure.

[0047] The process module 102 is coupled to the back end transfer module 104 via a process module gate valve 120. The process module 102 includes a process chamber 122, a heater 124, and a reactant source 126. The process chamber 122 is disposed within the process module 102, houses the heater 124, and is configured to flow precursors or reactants through the substrate 118 while disposed on the heater 124 during deposition of a material layer onto the substrate 118. The precursor / reactant source 126 is fluidly coupled to the process chamber 122 and is configured to provide precursors / reactants to the process chamber 122 to deposit one or more material layers onto the substrate 118. The process module gate valve 120 couples the process module 102 to the back end transfer module 104 and is configured to provide selective communication between the process chamber 122 and the back end transfer module 104. In this regard, it is contemplated that the process module gate valve 120 may be configured to allow transfer of the substrate 118 between the back end transfer module 104 and the process module 102 both before and after deposition of a material layer onto the substrate 118 .

[0048] According to examples of the present disclosure, the process chamber 122 may be a first process chamber, and the process module 102 may include one or more second process chambers. For example, the process module 102 may be a dual chamber module having two (2) process chambers or a quad chamber module having four (4) process chambers. According to certain examples, the process module gate valve 120 may be a first process module gate valve, and the process module 102 may include a second process module gate valve, which also couples the process module 102 to the back end transfer module 104. It is contemplated that in certain examples, the reactants may include reactants or precursors suitable for deposition of a material layer, for example using atomic layer deposition or chemical vapor deposition techniques. It is also contemplated that, according to certain examples, the process module 102 includes a plasma unit configured to provide the reactant 126 as a suitable plasma to the substrate 118. In this regard, the process module 102 may be configured to deposit a material layer onto the substrate 118 using, for example, plasma enhanced atomic layer deposition or plasma enhanced chemical vapor deposition techniques.

[0049] The back-end transfer module 104 is coupled to a back side 138 of the load lock body 108 and includes a back-end chamber body 128 and a back-end substrate transfer robot 130. The back-end chamber body 128 is arranged along a transfer axis 132. It is contemplated that the back-end substrate transfer robot 130 is arranged inside the back-end chamber body 128 and supported within the back-end chamber body 128 for movement relative to the back-end chamber body 128 to transfer substrates, such as substrates 118, between the load lock 106 and the processing module 102. In some examples, the back-end chamber body 128 can have a polygonal shape. In this regard, the back-end chamber body 128 can have five sides, less than five sides (e.g., a rectangle or a square), or more than five sides (e.g., a hexagon), and can have a regular polygonal shape or an irregular polygonal shape.

[0050] The equipment front end module (EFEM) 110 is coupled to the front face 140 of the load lock body 108 and includes a housing 144, a front end substrate transfer robot 146, and one or more load ports 148. The housing 144 houses the front end substrate transfer robot 146. The front end substrate transfer robot 146 is housed within the housing 144 for moving relative to the housing 144 or transferring a substrate, such as substrate 118, between one or more load ports 148 and the load lock 106. The one or more load ports 148 are connected to the housing 144 and are configured to house a cassette 150 therein for housing one or more substrates before and after depositing a material layer onto the substrate. In some examples, the cassette 150 may include a standard mechanical interface cassette. According to some examples, the cassette 150 may include a front opening unified cassette. Although shown and described herein as having three (3) load ports, it should be understood and appreciated that the equipment front end module 110 may include fewer or more load ports and still be within the scope of the present disclosure.

[0051] The controller 112 is operably connected to the semiconductor processing system 100 and includes a device interface 152, a processor 154, a user interface 156, and a memory 158. The device interface 152 couples the processor 154 to the semiconductor processing system 100, for example, by (or via) a wired or wireless link 160. The processor 154 is operably connected to the user interface 156 and is configured to communicate with the memory 158. The memory 158 includes a non-transitory machine-readable medium having a plurality of program modules 162 recorded thereon, the program modules 162 containing instructions that, when read by the processor 154, cause the processor 154 to perform certain operations. These operations include the method 900 (e.g., Fig. 9 The operation for adjusting the substrate temperature within the load lock device 106 as shown in FIG. 1 is as follows.

[0052] As already explained above, some semiconductor processing systems may include substrate heating and / or substrate cooling within the load lock 106, for example for throughput purposes. For example, in some semiconductor processing systems, substrate heating within the load lock may be implemented to limit processing time within a processing module, thereby shortening the time required for the substrate temperature to rise to a desired material layer deposition temperature. Alternatively or in addition, substrate cooling within the load lock 106 may be implemented to limit processing time within a processing module. In order to meet the requirements for substrate cooling and / or substrate heating, as well as to meet the need for a load lock with increased flexibility, accessibility, and configuration, a load lock 106 is provided.

[0053] like Figure 1As shown, the load lock device 106 includes a front face 140 configured (i.e., constructed and arranged) for coupling with the equipment front end module 110, a back face 138 configured (i.e., constructed and arranged) for coupling with the back end transfer module, and a side face 142 configured and arranged for inserting a temperature control component, as described below. In addition, the load lock device 106, and in particular the load lock body 108, can include an upper load lock chamber and a lower load lock chamber, which will be described in detail below.

[0054] Figure 2 , Figure 3 and Figure 4 Various views of an exemplary load lock 106 are shown according to examples of the present disclosure. Figure 2 is a cross-sectional top view of the internal configuration of a load lock element within a load lock device, Figure 3 It is along Figure 2 The cross-sectional view observed along line AA, Figure 3 The side 142 of the load lock body 108 and the configuration of the load lock elements are shown. The following detailed description includes Figure 2 , Figure 3 and Figure 4 References to the drawings and common elements are labeled together. Figure 2 and Figure 3 The exemplary illustration of the load lock device 106 in FIG. 1 is generally about the axis BB ( Figure 2 ) and axis CC( Figure 3 ) is symmetrical, so Figure 2 and Figure 3 The detailed description of the load lock apparatus 106 illustrated in FIG. 1 focuses on the load lock elements to the left of the axis BB and the axis CC, and assumes that those elements to the right of the axis BB and the axis CC are identical unless otherwise stated.

[0055] In more detail, the load lock device 106 of the present disclosure includes a load lock body 108. The load lock body 108 includes a front face 140 configured to couple with a front end module of an apparatus, such as Figure 2As shown. The front side 140 includes one or more front gate valves 202 for allowing a substrate to be controllably transferred to a front-end module through the front side 140 of the load lock body 108 while maintaining the environment within the load lock body 108. The load lock body 108 also includes a back side 138 configured to be coupled to a back-end transfer module. The back side 138 includes a back gate valve 204 for allowing a substrate to be controllably transferred to a back-end substrate transfer robot through the back side 138 of the load lock body 108. The load lock body 108 also includes a side surface, such as side surface 142. Side surface 142 includes a side hole 206 extending through the load lock body 108, and the side hole 206 has a first cross-sectional size so that a selected load lock element can be inserted into and withdrawn from the load lock body 108 (such as through the side hole 206). Figure 2-4 In some examples of the present disclosure, a sealing plate 208 can be attached to the side 142, the sealing plate 208 including a sealing surface 210 and a sealing hole 212 extending through the sealing plate 208. In such examples, the sealing hole 212 is aligned with the side hole 212. In such examples, the sealing hole 212 can have a second cross-sectional dimension that is smaller than the first cross-sectional dimension of the side hole 206 (e.g., Figure 2-4 shown).

[0056] According to an example of the present disclosure, the substrate platform 302 is disposed within the load lock body 108 (eg, Figure 3 ). The substrate platform 302 includes a support element 304 having an upper platform surface 306 and a lower platform surface 308. The upper platform surface 306 is configured to hold the substrate 118 in a holding position within the load lock body 108. In some aspects, the upper platform surface 306 can include a plurality of raised elements and / or one or more recessed features for holding the substrate 118 in a fixed position while being seated on the upper platform surface 306 of the substrate platform 302. Figure 3 As shown, the load lock body 108 can accommodate two substrate platforms 302, including a single stage for holding substrates. In further examples of the present disclosure, the substrate platform 302 can optionally include an upper substrate platform 312 (shown as a dashed line to indicate that the element is optional) for holding additional substrates in a holding position within the load lock body 108. In such an example, the optional upper substrate platform 312 can be directly located above the substrate platform 302 (i.e., the lower substrate platform). According to examples of the present disclosure, a single substrate platform can include the substrate platform 302 (i.e., the lower substrate platform) and the upper substrate platform 312.

[0057] The load lock of the present invention also includes one or more temperature control components. The temperature control components are used to heat and / or cool the substrate disposed within the load lock body. For example, substrate heating within the load lock of the present invention can be used to shorten processing time within a processing module by reducing the time required for the substrate temperature to rise to a desired processing temperature. Alternatively or in addition, substrate cooling within the load lock of the present disclosure can be used to limit processing time within a processing module by allowing cooling external to the processing module, thereby freeing up the processing module and allowing additional substrates to be processed, and increasing substrate throughput through a semiconductor processing system.

[0058] In more detail, Figure 5 A temperature control assembly 500 according to an example of the present disclosure is shown. The temperature control assembly 500 includes a proximal end 502, the proximal end 502 includes a temperature regulating head 504, and the temperature regulating head 504 includes an upper temperature regulating surface 505. In some embodiments, the temperature control assembly 500 and in particular the temperature regulating head 504 can have a maximum width W1. According to an example of the present disclosure, the temperature regulating head 504 can include a cooling and / or heating mechanism, as described below. The temperature control assembly 500 also includes a neck 506 connected to the temperature regulating head 504 and a flange 508 connected to the neck 506. The temperature control assembly 500 includes a distal end 510, the distal end 510 includes a coupler 512 for connecting the temperature control assembly 500 to an elevator, and the elevator provides vertical movement to the temperature control assembly 500 and in particular to the temperature regulating head 504. In some embodiments, the distal end 510 also includes ports 514a, 514b and 514c for providing cooling and / or heating to the temperature regulating head 504. According to an example of the present disclosure, the temperature regulating head 504 is configured to deliver heating and / or cooling (eg, Figure 3 shown).

[0059] According to an example of the present disclosure, the temperature regulating head 504 includes a cooling mechanism (such as Figure 5518a and 518b are provided with coolant from supply channels 518a and 518b via ports 514a and 514c. In such an example, supply channels 518a and 518b extend through the neck 506 and flange 508 of the temperature control assembly 500, forming a fluid conduit between the temperature regulating head 504 and the distal end 510 of the temperature control assembly 500. The cooling channel 516, supply channels 518a and 518b are shown by dotted lines to indicate that they are disposed within the temperature control assembly 500, but it is foreseeable that other configurations of cooling channels and supply channels can be incorporated into the temperature control mechanism 500. According to an example of the present disclosure, cooling fluid can be supplied to the cooling channel 516 via port 514a, and cooling fluid can be extracted from the cooling channel 516 via port 514c. In some embodiments, ports 514a and 514c may be fluidly connected to a chiller system to provide temperature controlled fluid to thermoregulating head 504 .

[0060] According to further examples of the present disclosure, the temperature regulating head 504 may alternatively or additionally include a heating mechanism. In such examples, the heating mechanism may include heating elements, such as elements 520a and 520b, disposed within and / or on the temperature regulating head 504. The heating elements may include resistive heating elements electrically connected via wires 522 extending through the neck 506, the flange 508, and to a port 514b at the distal end 510 of the temperature control assembly 500, where external electrical connections may be made for powering the heating elements within the temperature regulating head 504.

[0061] Figure 2-4 1 shows the configuration of the temperature control assembly 500 relative to the load lock apparatus 106 of the present invention. According to an example of the present disclosure, the load lock apparatus 106 of the present disclosure may include a temperature control assembly 500 partially disposed within the load lock body 108, such as Figure 2 and Figure 3 In some embodiments, the proximal end 502 of the temperature control assembly 500 includes a temperature regulating head 504. According to an example of the present disclosure, the temperature regulating head 504 is disposed within the load lock body 108. In such an example, the temperature regulating head 504 is located below the support element 304 so that the upper temperature regulating surface 505 of the temperature regulating head 504 is substantially parallel to the lower platform surface 308 of the substrate platform 302 (e.g., Figure 3 In addition, the center of the upper temperature regulating surface 505 of the temperature control assembly 500 is aligned with the holding position in which the substrate 118 is supported on the upper platform surface 306 of the substrate platform 302.

[0062] According to an example of the invention, the distal end 510 of the temperature control assembly 500 extends laterally through the side hole 206 located in the side 142 of the load lock body 108 such that the distal end 510 is located outside the load lock body 108. In some embodiments, the distal end 510 of the temperature control assembly 510 extends laterally through the sealing hole 212 of the sealing plate 208. In some embodiments, the side hole 206 and the sealing hole 212 are aligned such that the distal end 510 of the temperature control assembly extends laterally through the side hole 206 and the sealing hole 212.

[0063] According to an example of the present disclosure, the distal end 510 of the temperature control assembly 500 also includes a connector 512. The connector 512 is connected to the elevator 314 (see Figure 3 ), thereby coupling the elevator 314 to the temperature control assembly 500, the elevator 314 providing vertical movement to the temperature control assembly 500, and thus providing vertical movement to the thermostatic head 504. Thus, the elevator 314 allows the thermostatic head 504 to be raised and lowered within the load lock body 108. According to an example of the present disclosure, the elevator 314 may also include an elevator arm 316 that may be movable in a substantially vertical direction to provide vertical movement to the thermostatic head 504 of the temperature control assembly 500.

[0064] According to an example of the present disclosure, the load lock device of the present disclosure further includes a flexible sealing mechanism. Figure 2 and Figure 3 , a flexible sealing mechanism 218 can be connected between the side 142 of the load lock body 108 and the temperature control assembly 500, and the flexible sealing mechanism 218 maintains the environment within the load lock assembly 220 while moving (i.e., vertically displacing) the temperature control assembly 500, especially maintaining the environment within the load lock body while lowering and raising the temperature adjustment head 504 of the temperature control assembly 500 relative to the lower platform surface 308 of the substrate platform 304.

[0065] According to an example of the present disclosure, the flexible sealing mechanism 218 may include a bellows. In such an example, the bellows may include an edge-welded metal bellows including a plurality of diaphragm plates connected to form a bellows core, the bellows core being connected at either end by welded end fittings to complete the bellows assembly. In such an example, the bellows core is sealed at either end by end fittings, which in turn are sealed to the load lock assembly (e.g., at the side 142 and the temperature control assembly 500) to maintain the environment within the load lock body as the bellows moves, such as when the bellows compresses and expands during the up and down movement of the temperature regulating head 504 of the temperature control assembly 500.

[0066] In some embodiments of the present disclosure, the first end of the bellows 222 has a third cross-sectional dimension that is greater than the second cross-sectional dimension of the sealing hole 212 of the sealing plate 208, so that the first end of the bellows 222 contacts the sealing surface 210 of the sealing plate 208 and closes the sealing hole 212. An airtight seal is thereby formed between the first end of the bellows 222 and the sealing surface 210 of the sealing plate 208.

[0067] In some embodiments of the present disclosure, the second end of the bellows 224 is connected to the sealing surface of the temperature control assembly 500 and closes the temperature control assembly 500. In such an example, the sealing surface of the temperature control assembly 500 may include the surface of the flange 508 of the temperature control assembly. In such an example, the sealing surface of the temperature control assembly may include the surface of the flange 508 facing the sealing plate 208. An airtight seal is thereby formed between the second end of the bellows 224 and the sealing surface of the flange 508. In other examples, the sealing surface of the temperature control assembly 500 may include the surface of the neck 506, thereby forming an airtight seal between the second end of the bellows 224 and the sealing surface of the neck 506 of the temperature control assembly 500.

[0068] To further illustrate the flexible seal of the temperature control assembly to the load lock chamber body to enable vertical movement of the temperature control assembly while maintaining the internal atmosphere of the load lock chamber body, Figure 4 A side view of a load lock apparatus of the present disclosure is shown.

[0069] In more detail, the side view of the load lock apparatus 106 includes the side 142 of the load lock chamber 108. The side 142 of the load lock body 108 includes a side hole 206 that extends through the side 142 of the load lock body 108. The side hole 206 is shown as a dashed line because it is hidden by the sealing plate 208. According to an example of the present disclosure, the side hole 206 has a first cross-sectional dimension that is larger than the maximum cross-sectional dimension (W1) of the temperature control assembly 500, so that the temperature control assembly can be inserted and withdrawn through the side hole 206 before the sealing plate 208 is installed.

[0070] According to an example of the present disclosure, a sealing plate 208 is coupled to the side 142 of the load lock body 108, and the sealing plate 208 includes a sealing hole 212. The sealing hole 212 is again shown in phantom because it is hidden by the flange 508 of the temperature control assembly 500 that is inserted into the side 142 of the load lock device 106 through the side hole 206. In such an example, the sealing hole 212 is aligned with the side hole 206 disposed in the side 142 of the load lock body 108. According to an example of the present disclosure, the sealing hole 212 has a second cross-sectional dimension that is less than the first cross-sectional dimension of the side hole 206. As shown in FIG. Figure 4As shown, the distal end 510 of the temperature control assembly 500 extends outside of the load lock body 108 so that the elevator 314 can be coupled to the temperature control assembly 500 via the elevator arm 316 and the coupler 512. According to an example of the present disclosure, the bellows 218 (shown here as a dashed line 218 contacting the surface of the flange 508) forms an airtight seal with the flange 508 and closes the sealing hole 212. In such an example, the first end of the bellows contacts the flange 508 so that the third cross-sectional dimension of the bellows is greater than the second cross-sectional dimension of the sealing hole 212. In such an example, the first end of the bellows contacts the flange 508 so that the third cross-sectional dimension of the bellows is less than the first cross-sectional dimension of the side hole 206.

[0071] Therefore, according to an example of the present disclosure, the first end of the bellows has a third cross-sectional dimension that is greater than the second cross-sectional dimension of the sealing hole, so that the first end of the bellows contacts the sealing surface of the sealing plate and closes the sealing hole. In such an example, the second end of the bellows contacts the sealing surface of the temperature control assembly and closes the temperature control assembly. In some embodiments, the sealing surface of the temperature control assembly includes the surface of the flange 512 of the temperature control assembly 500.

[0072] According to an example of the present disclosure, an elevator provides vertical movement to the temperature control assembly. Figure 6 and Figure 7 Further illustrated is the vertical movement of the temperature control assembly within the load lock apparatus of the present invention.

[0073] According to an embodiment of the present disclosure, the elevator 314 is configured to lower the temperature regulating head 504 of the temperature control assembly 500 to a loading / unloading position (eg, Figure 6 ), the unloading / loading position positions the upper temperature regulating surface 505 of the temperature control assembly 500 away from the lower platform surface 308 of the substrate platform 302. Positioning the temperature control assembly 500 in the unloading / loading position allows sufficient clearance between the lower platform surface 308 of the substrate platform 302 and the upper temperature regulating surface 505 of the temperature regulating head 504 to allow the front end substrate transfer robot to load / unload the substrate 118 from / to the load lock body 108.

[0074] In particular, in some embodiments, the elevator 314 is configured to raise the temperature adjustment head 504 of the temperature control assembly 500 to a temperature adjustment position (eg, Figure 7306 of the substrate platform 302 and the upper temperature regulating surface 505 of the temperature regulating head 504, thereby effectively heating and / or cooling the substrate 118 disposed within the load lock body 108.

[0075] According to an example of the present disclosure, the elevator 314 provides a maximum vertical displacement (V1) between 0.5 mm and 20 mm, or between 1 mm and 15 mm, or between 2 mm and 10 mm, or between 3 mm and 8 mm to the thermostatic head 504. In some embodiments, the elevator 314 provides a maximum vertical displacement (V1) greater than 0.5 mm, or greater than 1 mm, or greater than 2 mm, or greater than 3 mm, or greater than 5 mm, or greater than 8 mm, or greater than 10 mm, or greater than 15 mm, or greater than 20 mm to the thermostatic head 504.

[0076] According to a further example of the present disclosure, the elevator 314 is configured to position the upper temperature regulating surface 505 of the temperature regulating head 504 at a distance of less than 5 mm, or less than 2 mm, or less than 1 mm, or less than 0.9 mm, or less than 0.8 mm, or less than 0.7 mm, or less than 0.6 mm, or less than 0.5 mm from the lower platform surface 308 of the substrate platform 302 when the temperature control assembly 500 is positioned in the temperature regulating position. According to a further example of the present disclosure, the elevator 314 is configured to position the upper temperature regulating surface 505 of the temperature regulating head 504 at a distance of between 0.5 mm and 5 mm, or between 0.6 mm and 2 mm, or between 0.7 mm and 1 mm from the lower platform surface 308 of the substrate platform 302 when the temperature control assembly 500 is positioned in the temperature regulating position.

[0077] According to a further example of the present disclosure, the elevator 314 is configured to position the upper temperature regulating surface 505 of the temperature regulating head 504 at a distance greater than 5 mm, or greater than 7 mm, or greater than 10 mm, or greater than 12 mm, or greater than 15 mm from the lower platform surface 308 of the substrate platform 302 when the temperature control assembly is positioned in the unloading / loading position. According to a further example of the present disclosure, the elevator 314 is configured to position the upper temperature regulating surface 505 of the temperature regulating head 504 at a distance between 5 mm and 15 mm, or between 7 mm and 12 mm, or between 8 mm and 10 mm from the lower platform surface 308 of the substrate platform 302 when the temperature control assembly is positioned in the unloading / loading position.

[0078] According to a further example of the present disclosure, the load lock device of the present disclosure may further include a load lock body, the load lock body including an upper load lock chamber and a lower load lock chamber. In more detail, Figure 8 A load lock apparatus 800 is shown in accordance with an embodiment of the present disclosure. The load lock apparatus 800 includes a load lock body 802 including an upper load lock chamber 804 and a lower load lock chamber 806. In such an example, a temperature control assembly 808 is partially disposed within the upper load lock chamber 804. In such an embodiment, the load lock apparatus 800 may also include an additional temperature control assembly 810 that is partially disposed within the lower load lock chamber 806 and is coupled to a lower elevator 812 for providing vertical displacement to the additional temperature control assembly 810.

[0079] According to a further embodiment of the present disclosure, Fig. 9 An exemplary method 900 for regulating the temperature of a substrate disposed within a load lock apparatus of the present disclosure is shown. In more detail, the method 900 includes, at a load lock body housing a substrate platform, the substrate platform including an upper platform surface and a lower platform surface, the upper platform surface being configured to hold a substrate in a holding position within the load lock body (step 902).

[0080] In some embodiments of the present disclosure, method 900 also includes lowering a vertical position of a temperature control assembly partially disposed within the load lock body to a load / unload position, the unload / load position positioning an upper temperature regulating surface of the temperature control assembly away from a lower platform surface of the substrate platform (step 904).

[0081] In some embodiments of the present disclosure, the method 900 further includes positioning the substrate on an upper platform surface of the substrate platform in a holding position (step 906 ).

[0082] In some embodiments of the present disclosure, method 900 also includes raising the vertical position of the temperature control assembly to a substrate temperature adjustment position, wherein the substrate temperature adjustment position positions an upper temperature adjustment surface of the temperature control assembly near a lower platform surface of the substrate platform to enable at least one of heating and cooling the substrate positioned in the holding position (step 908).

[0083] In some embodiments of the present disclosure, method 900 also includes where lowering and raising of the temperature control assembly is accomplished by an elevator coupled to a distal portion of the temperature control assembly extending to the exterior of the load lock body through a hole in a side of the load lock body.

[0084] In some embodiments of the present disclosure, method 900 further includes, wherein the temperature control assembly includes a temperature regulating head having an upper temperature regulating surface, and when in the loading / unloading position, the upper temperature regulating surface is located at a distance greater than 10 mm from the lower platform surface. In addition, in some embodiments, method 900 further includes, when in the substrate temperature regulating position, the upper temperature regulating surface is located at a distance less than 0.5 mm from the lower platform surface.

[0085] Although certain embodiments and examples have been discussed, it will be understood by those skilled in the art that the scope of the claims extends beyond the specifically disclosed embodiments to other alternative embodiments and / or uses and obvious modifications and equivalents thereof. Indeed, various modifications of the present disclosure, such as alternative useful combinations of the described elements, in addition to those shown and described herein, will become apparent to those skilled in the art from the description. Such modifications and embodiments are also intended to fall within the scope of the appended claims.

[0086] In the present disclosure, where conditions and / or structures are not specified, those skilled in the art can readily provide such conditions and / or structures as routine experimentation in view of the present disclosure.

Claims

1. A load lock device, comprising: a load lock body including a front face configured for coupling with a front end module of the device, a back face configured for coupling with a rear end transfer module, and a side face including a side hole; a substrate platform disposed within the load lock body, the substrate platform including an upper platform surface and a lower platform surface, the upper platform surface being configured to hold a process substrate in a holding position within the load lock body; a temperature control assembly disposed partially within the load lock body; an elevator coupled to the temperature control assembly for providing vertical movement to the temperature control assembly; as well as A flexible sealing mechanism is connected between the side of the load lock body and the temperature control assembly, the flexible sealing mechanism maintaining the internal environment within the load lock body while moving the temperature control assembly.

2. The load lock device according to claim 1, wherein: The side hole has a first cross-sectional dimension that is larger than a maximum cross-sectional dimension of the temperature control component, such that the temperature control component can be inserted and withdrawn through the side hole.

3. The load lock apparatus of claim 2, further comprising a sealing plate coupled to the side, the sealing plate comprising a sealing hole aligned with the side hole, the sealing hole having a second cross-sectional dimension that is smaller than the first cross-sectional dimension.

4. The load lock device according to claim 3, wherein: The flexible sealing mechanism includes a bellows.

5. The load lock device according to claim 4, wherein: The first end of the bellows has a third cross-sectional dimension greater than the first cross-sectional dimension, such that the first end of the bellows contacts the sealing surface of the sealing plate and closes the sealing hole, forming a first airtight seal.

6. The load lock device according to claim 5, wherein: The second end of the bellows contacts the sealing surface of the temperature control assembly to form a second airtight seal.

7. The load lock device of claim 6, wherein: The sealing surface of the temperature control assembly includes a surface of a flange of the temperature control assembly.

8. The locking device according to claim 1, wherein: The temperature control assembly includes a temperature regulating head.

9. The locking device according to claim 8, wherein: The elevator provides a maximum vertical displacement of between 1 mm and 15 mm to the upper temperature regulating surface of the temperature regulating head.

10. The locking device according to claim 9, wherein: The elevator is configured to position the upper temperature regulating surface at a distance less than 0.5 mm from the lower platform surface when regulating the temperature of a substrate disposed on the upper platform surface.

11. The locking device according to claim 10, wherein: The elevator is configured to position the upper temperature conditioning surface at a distance greater than 10 mm from the lower platform when loading / unloading a substrate from the load lock body.

12. The locking device according to claim 1, wherein: The substrate platform includes a sub-platform for holding an additional substrate.

13. The load lock device of claim 1, wherein: The load lock body also includes an upper load lock chamber and a lower load lock chamber, and the temperature control assembly is partially disposed in the upper load lock chamber.

14. The load lock apparatus of claim 13, further comprising an additional temperature control assembly disposed partially within the lower load lock chamber and coupled to the lower elevator for providing vertical displacement to the additional temperature control assembly.

15. A semiconductor processing system comprising: Load lock device, including: load lock body; a substrate platform received within the load lock body; a temperature control assembly including at a proximal end a thermostatic head positioned within the load lock body, at a distal end a coupler connected to an elevator for raising and lowering the thermostatic head, the distal end extending laterally through a side hole positioned in a side of the load lock body such that the distal end is positioned exterior to the load lock body; a flexible sealing mechanism connected between a side of the load lock body and the temperature control assembly, the flexible sealing mechanism maintaining an internal environment within the load lock body during movement of the temperature regulating head; a back end transfer module connected to the back side of the load lock body, the back end transfer module coupling the processing module to the load lock; a device front end module connected to the front face of the load lock body, the device front end module housing a front end substrate transfer robot; The elevator is configured to lower the temperature regulating head to allow a front-end substrate transfer robot to load / unload a substrate, and to raise the temperature regulating head to position the temperature regulating head near a substrate platform, thereby providing at least one of heating and cooling to a substrate placed on the substrate platform.

16. The semiconductor processing system of claim 15, wherein: The load lock body also includes an upper load lock chamber and a lower load lock chamber, and the temperature control assembly is partially disposed in the upper load lock chamber.

17. The semiconductor processing system of claim 16, further comprising an additional temperature control assembly disposed partially within the lower load lock chamber and coupled to the lower elevator for providing vertical displacement to the additional temperature control assembly.

18. A method for processing a substrate, comprising: at a load lock body housing a substrate platform, the substrate platform including an upper platform surface and a lower platform surface, the upper platform surface being configured to hold a substrate in a holding position within the load lock body; lowering a vertical position of a temperature control assembly disposed partially within the load lock body to a loading / unloading position, the unloading / loading position being away from the lower platform surface; positioning a process substrate on the upper platform surface in a holding position; as well as raising the vertical position of the temperature control assembly to a substrate temperature adjustment position proximate the lower platform surface to enable at least one of heating and cooling the substrate positioned in the holding position; Therein, lowering and raising of the temperature control assembly is accomplished by an elevator coupled to a portion of the temperature control assembly that extends to the exterior of the load lock body through an aperture in a side of the load lock body.

19. The method according to claim 18, wherein: The temperature control assembly includes a temperature regulating head having an upper temperature regulating surface, wherein the upper temperature regulating surface is located at a distance greater than 10 mm from the lower platform surface when in the loading / unloading position.

20. The method according to claim 19, wherein: When in the substrate temperature regulating position, the upper temperature regulating surface is located at a distance less than 0.5 mm from the lower platform surface.

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